Semiconductor device maintenance apparatus

Abstract

The invention discloses a semiconductor equipment maintenance device which comprises a telescopic rod. And a liquid storage tank is fixedly arranged at the end part of the telescopic rod. And the front end of the liquid storage tank is provided with a nozzle replacement port. A liquid squeezing device is arranged at the tail end of the liquid storage tank and used for squeezing liquid in the liquid storage tank so that the liquid can flow out of the spray head replacement opening. A control switch of the liquid extrusion device is arranged at the tail of the telescopic rod and used for controlling the size of liquid flowing out of the nozzle replacement opening or stopping flowing out of the liquid. And the replacement heads are matched with the nozzle replacement ports, and each replacement head is provided with a joint fixedly arranged on the corresponding nozzle replacement port. The replacement head comprises a spray head for liquid to flow. According to the invention, the injury of maintenance personnel and the damage of precise parts of equipment can be avoided, and the maintenance of the interior of a deep cavity with a narrow space is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor integrated circuits, in particular to a semiconductor device maintenance device. BACKGROUND

[0002] In the existing wafer acceptance test (WAT) machine maintenance operation, during the cleaning and lubricating oil application process inside the cavity of the machine, personnel operate completely by hand. Due to the limited space after the equipment is opened, the height of the operator needs to be raised to obtain more range of entering the cavity. Not only is it difficult to cover all cavities, but there is also a risk of bumping into internal sharp and delicate components, which may cause damage to the person and the components. Figure 1 As shown in FIG. 1, a schematic diagram of a maintenance personnel maintaining a semiconductor device cavity; as can be seen, the maintenance personnel 102 needs to be elevated and inserted into the inside of the cavity 101 to maintain the inside of the cavity 101, such as oiling and wiping the guide rail. Due to the small space range of the cavity 101, the body is easy to be injured when inserted into the inside of the cavity 101. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a semiconductor device maintenance device that can avoid injury to maintenance personnel and damage to delicate equipment components, and is beneficial to the maintenance of the inside of a narrow and deep cavity.

[0004] To solve the above technical problems, the semiconductor device maintenance device provided by the present application comprises: a telescopic rod.

[0005] A liquid storage tank is fixedly arranged at the end of the telescopic rod.

[0006] A spray head replacement port is arranged at the front end of the liquid storage tank.

[0007] A liquid extrusion device is arranged at the tail end of the liquid storage tank, and the liquid extrusion device is used to extrude the liquid in the liquid storage tank and make the liquid flow out of the spray head replacement port.

[0008] The control switch of the liquid extrusion device is arranged at the tail of the telescopic rod, and the control switch is used to control the size of the liquid flowing out of the spray head replacement port or stop the liquid from flowing out.

[0009] One or more replacement heads matched with the spray head replacement port, the replacement head has a connector fixedly installed on the spray head replacement port.

[0010] The replacement head comprises a spray head for the liquid to flow.

[0011] Further improvement is that the plurality of the spray heads form a spray head group, and the inner diameter and length of each of the spray heads in the spray head group gradually increase.

[0012] Further improvement is that the replacement head further comprises a support for fixing the dust-free cloth.

[0013] Further improvement is that the liquid comprises lubricating oil.

[0014] Further improvement is that the maintenance device is used for maintaining the components inside the cavity of the semiconductor equipment.

[0015] The maintained components comprise guide rails, and each of the spray heads is used for applying the lubricating oil on the guide rails during the maintenance.

[0016] The dust-free cloth is used for wiping and cleaning the inside of the cavity during the maintenance.

[0017] Further improvement is that the maximum length of the telescopic rod is greater than the maximum distance from the maintenance position outside the cavity to each of the components inside the cavity.

[0018] Further improvement is that the control switch is an oil gun pressure switch.

[0019] Further improvement is that the tail end of the telescopic rod is provided with a handle for holding, and the control switch is arranged at the front end of the handle.

[0020] Further improvement is that the telescopic rod has a plurality of sleeve pipes, and the liquid storage tank is arranged inside the sleeve pipe at the front end.

[0021] Further improvement is that a telescopic switch is arranged on the telescopic rod for controlling the extension and shortening of the telescopic rod.

[0022] When the telescopic switch is pressed, each of the sleeve pipes can move and thereby adjust the length of the telescopic rod; and when the telescopic switch is reset, each of the sleeve pipes is switched to fixed connection.

[0023] Further improvement is that the semiconductor equipment comprises a WAT equipment.

[0024] Further improvement is that the inner diameter and length of the spray head are matched with the guide rail to be maintained, and the larger the size of the guide rail, the larger the inner diameter and length of the spray head.

[0025] The present application adopts the telescopic rod, sets the liquid storage tank at the end of the telescopic rod, sets the spray head replacement opening for fixing and installing various replacement heads at the front end of the liquid storage tank, and sets the liquid extrusion device at the tail end of the liquid storage tank, and the control switch of the liquid extrusion device is arranged at the tail of the telescopic rod, so that the maintenance operation of the replacement head at the front end can be controlled at the tail, and the maintenance personnel can be located outside the maintenance area such as the inside of the cavity, so that the maintenance personnel can be prevented from being injured and the precise parts of the equipment can be prevented from being damaged, and the maintenance and maintenance of the cavity with narrow and deep space can be facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0026] The present application will be further described in detail below in combination with the drawings and specific embodiments:

[0027] Figure 1 is a schematic diagram of the maintenance personnel maintaining the cavity of the semiconductor equipment at present;

[0028] Figure 2 is a structural schematic diagram of the main part of the semiconductor equipment maintenance device of the present application;

[0029] Figure 3 is a structural schematic diagram of each replacement head of the semiconductor equipment maintenance device of the present application;

[0030] Figure 4 is a schematic diagram of the maintenance and maintenance of the cavity of the semiconductor equipment by using the semiconductor equipment maintenance device of the present application. DETAILED DESCRIPTION

[0031] As shown in Figure 2 , it is a structural schematic diagram of the main part of the semiconductor equipment maintenance device of the present application; the semiconductor equipment maintenance device of the embodiment of the present application comprises a telescopic rod 201.

[0032] A liquid storage tank 202 is fixedly arranged at the end of the telescopic rod 201.

[0033] A spray head replacement opening 203 is arranged at the front end of the liquid storage tank 202.

[0034] The tail end of the liquid storage tank 202 is provided with a liquid extrusion device 204, and the liquid extrusion device 204 is used for extruding the liquid of the liquid storage tank 202 and making the liquid flow out of the spray head replacement opening 203.

[0035] The control switch 205 of the liquid extrusion device 204 is arranged at the tail of the telescopic rod 201, and the control switch 205 is used for controlling the size of the liquid flowing out of the spray head replacement opening 203 or stopping the liquid from flowing out.

[0036] In the embodiment of the present application, the control switch 205 adopts an oil gun pressure switch.

[0037] The tail end of the telescopic rod 201 is provided with a handle for holding, and the control switch 205 is arranged at the front end of the handle.

[0038] In the telescopic rod 201 having multiple sleeves, Figure 2 The sleeves 201a and 201b are shown, and the liquid storage tank 202 is arranged inside the sleeve 201a at the front end.

[0039] The telescopic rod 201 is provided with a telescopic switch 206 for controlling the extension and shortening of the telescopic rod 201.

[0040] When the telescopic switch 206 is pressed, each sleeve can be moved and thus adjust the length of the telescopic rod 201; when the telescopic switch 206 is reset, each sleeve is switched to fixed connection.

[0041] One or more replacement heads matched with the spray head replacement port 203, the replacement head has a connector fixedly installed on the spray head replacement port 203.

[0042] As Figure 3 The structure diagram of each replacement head of the semiconductor device maintenance device is shown, the replacement head includes a spray head 301 for the liquid flow.

[0043] In the embodiment of the application, a plurality of spray head groups 302 form a spray head group 302, and the inner diameter and length of each spray head 301 in the spray head group 302 gradually increase.

[0044] The replacement head further includes a support 303 for fixing a dust-free cloth 304.

[0045] In the embodiment of the application, the liquid includes lubricating oil.

[0046] The maintenance device is used for maintaining the components inside the cavity of the semiconductor device. In some embodiments, the semiconductor device includes a WAT device.

[0047] The components to be maintained include guide rails, and each spray head 301 is used for applying the lubricating oil on the guide rails during the maintenance process.

[0048] The dust-free cloth 304 is used for wiping and cleaning the inside of the cavity during the maintenance process.

[0049] The maximum length of the telescopic rod 201 is greater than the maximum distance from the maintenance position outside the cavity to each component inside the cavity.

[0050] The inner diameter and length of the spray head 301 are matched with the guide rail to be maintained, and the larger the size of the guide rail is, the larger the inner diameter and length of the spray head 301 are.

[0051] The embodiment of the present application adopts the telescopic rod 201, sets the liquid storage tank 202 at the end of the telescopic rod 201, sets the spray head replacement port 203 for fixing and mounting various replacement heads at the front end of the liquid storage tank 202, and sets the liquid extrusion device 204 at the tail end of the liquid storage tank 202. The control switch 205 of the liquid extrusion device 204 is arranged at the tail of the telescopic rod 201, so that the replacement head at the front end can be controlled at the tail to perform maintenance operation. Therefore, the maintenance personnel can be located outside the maintenance area such as the inside of the cavity, so that the maintenance personnel can be prevented from being injured and the precise parts in the cavity can be prevented from being damaged, and the inside of the cavity with narrow space and deep distance can be maintained.

[0052] The embodiment of the present application realizes the telescopic rod which can extrude lubricating oil at the top and can be bound with dust-free cloth for cleaning. The maintenance personnel can easily perform oiling and wiping cleaning work on each guide rail in each machine table without entering the inside of the cavity with narrow space and deep distance during normal maintenance work. Not only the possibility of injury of the operator is greatly avoided, but also the precise parts in the cavity are protected.

[0053] As shown in Figure 4 The maintenance personnel 102 can maintain the inside of the cavity 201 by holding the telescopic rod 201 of the embodiment of the present application. The maintenance personnel 102 does not need to use a heightening device and does not need to drill into the inside of the cavity 201, so that the risk of injury of the maintenance personnel 102 is zero during the maintenance and maintenance process.

[0054] The telescopic rod device of the embodiment of the present application is simple and convenient to operate. The operator can control the lubricating oil to be extruded from the head of the telescopic rod by using the tail device of the telescopic rod, and the lubricating oil is uniformly applied to the required position. Different sizes of replacement heads can be selected according to different spaces in the cavity, including a replacement head which can firmly bind dust-free cloth, so as to facilitate wiping and cleaning. Not only the injury of the operator during the maintenance operation can be completely avoided, but also the internal parts of the cavity are protected from damage due to accidental touch.

[0055] The present application has been described in detail by specific embodiments, but these do not constitute a limitation on the present application. Those skilled in the art can make many modifications and improvements without departing from the principle of the present application, and these should be considered as the protection scope of the present application.

Claims

1. A semiconductor equipment maintenance device, characterized in that, include: Telescopic pole; A liquid storage tank is fixedly installed at the end of the telescopic rod; A nozzle replacement port is provided at the front end of the liquid storage tank; The liquid storage tank is provided with a liquid squeezing device at its tail end. The liquid squeezing device is used to squeeze the liquid in the liquid storage tank and make the liquid flow out from the nozzle replacement port. The control switch of the liquid extrusion device is located at the tail of the telescopic rod. The control switch is used to control the amount of liquid flowing out of the nozzle replacement port or to stop the liquid from flowing out. One or more replacement heads that are compatible with the nozzle replacement port, wherein the replacement head has a connector that is fixedly installed on the nozzle replacement port; The replacement head includes a nozzle for the flow of the liquid.

2. The semiconductor equipment maintenance device as described in claim 1, characterized in that: Multiple nozzles form a nozzle group, wherein the inner diameter and length of each nozzle in the nozzle group gradually increase.

3. The semiconductor equipment maintenance device as described in claim 2, characterized in that: The replacement head also includes a bracket for securing the lint-free cloth.

4. The semiconductor equipment maintenance device as described in claim 3, characterized in that: The liquid includes lubricating oil.

5. The semiconductor equipment maintenance device as described in claim 4, characterized in that: Maintenance devices are used to maintain components inside the cavity of semiconductor equipment; The component being maintained includes a guide rail, and each of the nozzles is used to apply the lubricant to the guide rail during maintenance. The lint-free cloth is used to wipe and clean the inside of the cavity during maintenance.

6. The semiconductor equipment maintenance device as described in claim 5, characterized in that: The maximum length of the telescopic rod is greater than the maximum distance from the maintenance position outside the cavity to each component inside the cavity.

7. The semiconductor equipment maintenance device as described in claim 1, characterized in that: The control switch is a hydraulic pressure switch.

8. The semiconductor equipment maintenance apparatus as described in claim 7, characterized in that: The telescopic rod has a handle for gripping at its tail end, and the control switch is located at the front end of the handle.

9. The semiconductor equipment maintenance device as described in claim 1, characterized in that: The telescopic rod has multiple sleeves, and the liquid storage tank is located inside the foremost sleeve.

10. The semiconductor equipment maintenance apparatus as described in claim 9, characterized in that: A telescopic switch is provided on the telescopic rod to control the extension and retraction of the telescopic rod; When the telescopic switch is pressed down, each of the sleeves can move and thereby adjust the length of the telescopic rod; When the telescopic switch is reset, each of the sleeves switches to a fixed connection.

11. The semiconductor equipment maintenance apparatus as described in claim 5, characterized in that: The semiconductor device includes a WAT ​​device.

12. The semiconductor equipment maintenance apparatus as described in claim 5, characterized in that: The inner diameter and length of the nozzle are matched with the guide rail to be maintained. The larger the guide rail size, the larger the inner diameter and length of the nozzle.

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