Chip taking and mounting device and die bonding equipment

Abstract

The invention relates to a chip taking and mounting device and die bonding equipment. The chip taking and mounting device comprises a y-axis moving module, an x-axis moving module and a z-axis moving module which are mounted in sequence; the y-axis moving module drives the x-axis moving module and the z-axis moving module to move along a y axis; the x-axis moving module comprises a left x-axis transmission assembly and a right x-axis transmission assembly which are adjacently arranged, a left x-axis guide rail is installed on a left x-axis transmission seat in the x-axis direction, and a left x-axis transmission block is slidably arranged on the left x-axis guide rail; the right x-axis guide rail is installed on the right x-axis transmission seat in the x-axis direction, and the right x-axis transmission block is arranged on the right x-axis guide rail in a sliding mode. The adjacent ends of the left x-axis transmission seat and the right x-axis transmission seat are arranged in a staggered mode, at least part of the left x-axis transmission seat and the right x-axis transmission seat are overlapped in the z-axis direction, and the left x-axis transmission seat and the right x-axis transmission seat can relatively slide in the y-axis direction. The adjacent ends of the left x-axis guide rail and the right x-axis guide rail are arranged in a staggered mode and at least partially overlapped in the z-axis direction.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip taking and mounting, and particularly relates to a chip taking and mounting device and a die bonding equipment. BACKGROUND

[0002] The die bonding process refers to a process of bonding a chip to a specified area of a substrate through a colloid to form a via or a point via, thereby providing a condition for subsequent wire connection. The die bonding equipment usually uses a chip taking and mounting device to realize the process. A suction nozzle of a first binding head on the device can take and place a chip from a wafer to a transfer table, and a suction nozzle of a second binding head can take the chip stored on the transfer table and mount it to the substrate.

[0003] However, the first binding head and the second binding head involve frequent acceleration and deceleration movements in the moving, taking and mounting process. The constant change of acceleration will cause vibration of the device, mutual interference in the taking and mounting process, poor mounting efficiency and difficulty in meeting the high-precision requirements of chip mounting. SUMMARY

[0004] To solve the technical problem that the taking and mounting processes of the existing chip taking and mounting device interfere with each other and affect the mounting efficiency and mounting precision, the present application provides a chip taking and mounting device and a die bonding equipment.

[0005] The technical problem of the present application is solved by providing a chip taking and mounting device, which comprises y-axis moving modules, x-axis moving modules and z-axis moving modules installed in sequence, the y-axis moving modules drive the x-axis moving modules and the z-axis moving modules to move along the y-axis; the x-axis moving modules comprise left x-axis transmission assemblies and right x-axis transmission assemblies arranged adjacent to each other, the left x-axis transmission assemblies comprise left x-axis transmission seats, left x-axis guide rails and left x-axis transmission blocks, the left x-axis guide rails are installed on the left x-axis transmission seats along the x-axis direction, and the left x-axis transmission blocks are slidably arranged on the left x-axis guide rails; the right x-axis transmission assemblies comprise right x-axis transmission seats, right x-axis guide rails and right x-axis transmission blocks, the right x-axis guide rails are installed on the right x-axis transmission seats along the x-axis direction, and the right x-axis transmission blocks are slidably arranged on the right x-axis guide rails; the left x-axis transmission seats and the right x-axis transmission seats are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction, and the left x-axis transmission seats and the right x-axis transmission seats can slide relative to each other in the y-axis direction; the left x-axis guide rails and the right x-axis guide rails are staggered at one end adjacent to each other and at least partially overlap in the z-axis direction.

[0006] Preferably, the x-axis movement module further comprises an x-axis driving assembly, which is spaced apart from and parallel to the left x-axis transmission assembly and the right x-axis transmission assembly; the x-axis driving assembly comprises an x-axis motor and a motor base, the x-axis motor is arranged on the motor base, and the motor base is connected with the y-axis movement module; the x-axis motor comprises an x-axis stator, a left x-axis mover and a right x-axis mover, the transmission end of the left x-axis mover and the transmission end of the right x-axis mover are connected with the x-axis stator, and the working end of the left x-axis mover and the working end of the right x-axis mover are connected with the z-axis movement module.

[0007] Preferably, the z-axis movement module comprises a left z-axis transmission assembly, a left z-axis driving assembly, a right z-axis transmission assembly and a right z-axis driving assembly; the left z-axis transmission assembly comprises a left z-axis transmission seat and a first magnetic spring structure, one side of the left z-axis transmission seat is connected with the left x-axis transmission block, the other side is connected with the left z-axis driving assembly, and the first magnetic spring structure is arranged on the side of the left z-axis transmission seat away from the left x-axis transmission block; the right z-axis transmission assembly comprises a right z-axis transmission seat and a second magnetic spring structure, one side of the right z-axis transmission seat is connected with the right x-axis transmission block, the other side is connected with the right z-axis driving assembly, and the second magnetic spring structure is arranged on the side of the right z-axis transmission seat away from the right x-axis transmission block.

[0008] Preferably, the left z-axis driving assembly comprises a left z-axis guide rail and a left z-axis transmission block, the left z-axis guide rail is installed on the left z-axis transmission seat along the z-axis direction, and the left z-axis transmission block is slidably arranged in the left z-axis guide rail; the working end of the left x-axis mover is connected with the top end surface of the left z-axis transmission seat, and the left z-axis guide rail and the left z-axis transmission block are arranged away from the first magnetic spring structure; the right z-axis driving assembly comprises a right z-axis guide rail and a right z-axis transmission block, the right z-axis guide rail is installed on the right z-axis transmission seat along the z-axis direction, and the right z-axis transmission block is slidably arranged in the right z-axis guide rail; the working end of the right x-axis mover is connected with the top end surface of the right z-axis transmission seat, and the right z-axis guide rail and the right z-axis transmission block are arranged away from the second magnetic spring structure.

[0009] Preferably, the chip taking and mounting device further comprises a left binding head mechanism and a right binding head mechanism; the left binding head mechanism is connected with the left z-axis transmission block and the working end of the first magnetic spring structure respectively, and the left binding head mechanism moves synchronously when the left z-axis transmission block slides relative to the left z-axis guide rail; the first magnetic spring structure is used for balancing the load of the left z-axis transmission seat, the left z-axis driving assembly and the left binding head mechanism; the right binding head mechanism is connected with the right z-axis transmission block and the working end of the second magnetic spring structure respectively, and the right binding head mechanism moves synchronously when the right z-axis transmission block slides relative to the right z-axis guide rail; the second magnetic spring structure is used for balancing the load of the right z-axis transmission seat, the right z-axis driving assembly and the right binding head mechanism.

[0010] Preferably, the left z-axis driving assembly further comprises a left z-axis motor, the left z-axis motor is installed in the middle part of the left z-axis transmission seat, and the left z-axis motor is used for driving the left z-axis transmission block to slide in the z-axis direction relative to the left z-axis guide rail; the number of the left z-axis guide rails is two, and the left z-axis guide rails are respectively arranged on the two sides of the left z-axis motor; the number of the left z-axis transmission blocks is at least two; the right z-axis driving assembly further comprises a right z-axis motor, the right z-axis motor is installed in the middle part of the right z-axis transmission seat, and the right z-axis motor is used for driving the right z-axis transmission block to slide in the z-axis direction relative to the right z-axis guide rail; the number of the right z-axis guide rails is two, and the right z-axis guide rails are respectively arranged on the two sides of the right z-axis motor; the number of the right z-axis transmission blocks is at least two.

[0011] Preferably, the z-axis movement module further comprises a z-axis movement assembly, the z-axis movement assembly comprises a z-axis motor and a motor housing, the z-axis motor comprises a z-axis stator, a left z-axis mover and a right z-axis mover, and the left z-axis mover and the right z-axis mover can slide relative to the z-axis stator in the z-axis direction; the z-axis stator is installed inside the motor housing, the transmission end of the left z-axis mover and the transmission end of the right z-axis mover are connected with the z-axis stator respectively, the working end of the left z-axis mover and the working end of the right z-axis mover are exposed outside the motor housing, and the working end of the left z-axis mover is connected with the top end surface of the left binding head mechanism, and the working end of the right z-axis mover is connected with the top end surface of the right binding head mechanism; the motor housing is connected with the y-axis movement module to limit the relative sliding of the left x-axis transmission seat and the right x-axis transmission seat in the y-axis direction.

[0012] Preferably, the y-axis moving module comprises a left y-axis driving assembly, a right y-axis driving assembly, a device base, and a left fixed block and a right fixed block mounted on two sides of the device base, the left y-axis driving assembly and the right y-axis driving assembly are arranged on the device base between the left fixed block and the right fixed block, and the left fixed block and the right fixed block are connected with the motor base on the side away from the device base; the left y-axis driving assembly comprises a left y-axis guide rail and a left y-axis motor, the left x-axis transmission seat is slidably arranged on the left y-axis guide rail, and the left y-axis motor can drive the left x-axis transmission seat to slide along the y-axis; the right y-axis driving assembly comprises a right y-axis guide rail and a right y-axis motor, the right x-axis transmission seat is slidably arranged on the right y-axis guide rail, and the right y-axis motor can drive the right x-axis transmission seat to slide along the y-axis.

[0013] Preferably, the x-axis moving module further comprises an x-axis grating assembly arranged on the left x-axis transmission seat and the right x-axis transmission seat, the x-axis grating assembly can be used to determine the relative positions between the left x-axis guide rail and the left x-axis transmission block, between the right x-axis guide rail and the right x-axis transmission block, and / or between the left x-axis transmission block and the right x-axis transmission block; the z-axis moving module further comprises a z-axis grating assembly arranged on the left z-axis transmission seat and the right z-axis transmission seat, the z-axis grating assembly can be used to determine the relative positions between the left z-axis guide rail and the left z-axis transmission block, between the right z-axis guide rail and the right z-axis transmission block, and / or between the left z-axis transmission block and the right z-axis transmission block; the y-axis moving module further comprises a y-axis grating assembly arranged on the device base, the y-axis grating assembly can be used to determine the relative positions between the left y-axis guide rail and the left x-axis transmission seat, between the right y-axis guide rail and the right x-axis transmission seat, and / or between the left x-axis transmission seat and the right x-axis transmission seat.

[0014] The application further provides a die bonding apparatus, which comprises the chip taking and mounting device.

[0015] Compared with the prior art, the chip taking and mounting device and the die bonding apparatus have the following advantages: 1. This invention provides a chip picking and mounting device for picking up chips and mounting them onto a substrate. The chip picking and mounting device includes a Y-axis moving module, an X-axis moving module, and a Z-axis moving module installed sequentially. The Y-axis moving module can drive the X-axis moving module and the Z-axis moving module to move along the Y-axis. The X-axis moving module includes a left X-axis transmission assembly and a right X-axis transmission assembly. The adjacent left and right X-axis transmission assemblies can make the chip picking process and the mounting process independent of each other. The left X-axis guide rail is installed on the left X-axis transmission seat along the X-axis direction, and the left X-axis transmission block is slidably disposed on the left X-axis guide rail. The right X-axis guide rail is installed on the right X-axis transmission seat along the X-axis direction, and the right X-axis transmission block is slidably disposed on the right X-axis guide rail. The left X-axis guide rail and the right X-axis transmission seat are connected to the left X-axis guide rail. The staggered arrangement of adjacent ends of the right x-axis guide rails avoids mutual interference between the chip picking and placement processes, ensuring transmission stability and accuracy. The staggered arrangement of adjacent ends of the left and right x-axis drive seats, along with their relative sliding in the y-axis direction, enhances the movement flexibility of the chip picking and placement device in the xy-plane and expands its coverage area for chip picking and placement. The at least partial overlap in the z-axis direction between adjacent ends of the left and right x-axis drive seats and between adjacent ends of the left and right x-axis guide rails effectively reduces the overall space occupied by the chip picking and placement device in the x-axis direction while ensuring the x-axis transmission stroke, achieving a compact structure and miniaturized design.

[0016] 2. In the chip pick-and-place device provided in this embodiment of the invention, the x-axis drive component and the left x-axis transmission component are spaced apart and arranged in parallel, which can avoid interference between the x-axis drive component and the left x-axis transmission component. The x-axis drive component and the right x-axis transmission component are spaced apart and arranged in parallel, which can also avoid interference between the x-axis drive component and the right x-axis transmission component. The x-axis motor drives the z-axis moving module through the working ends of the left x-axis mover and the right x-axis mover, which improves the transmission stability in the x-axis direction and further ensures the placement accuracy.

[0017] 3. In the chip taking and mounting device provided by the embodiment of the present application, the z-axis moving module is divided into left and right independent transmission and driving assemblies, which are left z-axis transmission assembly and left z-axis driving assembly, right z-axis transmission assembly and right z-axis driving assembly, and can be operated simultaneously or separately, thereby improving the efficiency of the taking and mounting processes; the working ends of the left and right x-axis movers are connected with the z-axis moving module, wherein one side of the left z-axis transmission seat is connected with the left x-axis transmission block, and the other side is connected with the left z-axis driving assembly; one side of the right z-axis transmission seat is connected with the right x-axis transmission block, and the other side is connected with the right z-axis driving assembly, so that the x-axis moving module can drive the z-axis moving module to move along the x-axis; the first and second magnetic spring structures can balance the load in the z-axis direction, reduce the driving load in the z-axis direction, and improve the motion stability of the z-axis moving module.

[0018] 4. In the chip taking and mounting device provided by the embodiment of the present application, the left z-axis transmission seat, left z-axis guide rail and left z-axis transmission block are sequentially installed, and the right z-axis transmission seat, right z-axis guide rail and right z-axis transmission block are sequentially arranged, which can ensure the smoothness of linear sliding in the z-axis direction; the working end of the left x-axis mover is connected with the top end surface of the left z-axis transmission seat, and the working end of the right x-axis mover is connected with the top end surface of the right z-axis transmission seat, so that the top ends of the left and right z-axis transmission seats can be driven by the x-axis motor, the transmission stress is more uniform, and the linear precision of the z-axis moving module moving in the x-axis direction is improved; the left z-axis guide rail and left z-axis transmission block are located in the first magnetic spring structure, and the right z-axis guide rail and right z-axis transmission block are located in the second magnetic spring structure, which can avoid mutual interference between the transmission elements and ensure the rationality of the assembly of the z-axis moving module.

[0019] 5. In the chip taking and mounting device provided by the embodiment of the present application, the left binding head mechanism is connected with the working end of the first magnetic spring structure, and the right binding head mechanism is connected with the working end of the second magnetic spring structure; the first and second magnetic spring structures can provide certain buffer for the movement of the left and right binding head mechanisms in the z-axis direction, thereby avoiding the damage of the chip caused by overpressure during taking and the poor bonding caused by underpressure during mounting, limiting the z-axis movement stroke of the left and right binding head mechanisms, and further playing a precise guiding role in the chip taking and mounting process in the z-axis direction, so as to protect the chip and the substrate from being damaged by excessive sliding of the left and right binding head mechanisms in the z-axis direction.

[0020] Further, the left binding head mechanism is connected with the working end of the first magnetic spring structure and the working end of the left z-axis transmission block, and the left binding head mechanism moves synchronously when the left z-axis transmission block slides relative to the left z-axis guide rail, and the first magnetic spring structure and the left z-axis transmission block can provide the left binding head mechanism with a guide in the z-axis direction, the right binding head mechanism is connected with the working end of the second magnetic spring structure and the working end of the right z-axis transmission block, and the right binding head mechanism moves synchronously when the right z-axis transmission block slides relative to the right z-axis guide rail, and the second magnetic spring structure and the right z-axis transmission block can provide the right binding head mechanism with a guide in the z-axis direction, and through the design, the left binding head mechanism and the right binding head mechanism can be prevented from deviating in the horizontal direction during movement in the z-axis direction, and the left binding head mechanism and the right binding head mechanism can be prevented from shaking during movement, and the mounting efficiency and the mounting precision of the chip taking and mounting device are improved.

[0021] It should be noted that the first magnetic spring structure can drive the left binding head mechanism to be elastically reset in the z-axis direction, balance the load of the left z-axis transmission seat, the left z-axis driving assembly and the left binding head mechanism, the second magnetic spring structure can drive the right binding head mechanism to be elastically reset in the z-axis direction, balance the load of the right z-axis transmission seat, the right z-axis driving assembly and the right binding head mechanism, and through the first magnetic spring structure and the second magnetic spring structure, the influence of the self-gravity of the elements of the chip taking and mounting device on the taking and mounting pressing force can be reduced, and the high-precision requirement of the chip mounting force is ensured.

[0022] 6、In the chip taking and mounting device provided by the embodiment of the application, as an implementation manner, the left z-axis motor is arranged in the middle part of the left z-axis transmission seat, the two left z-axis guide rails are arranged on the two sides of the left z-axis motor, the right z-axis motor is arranged in the middle part of the right z-axis transmission seat, and the two right z-axis guide rails are arranged on the two sides of the right z-axis motor, through the design, the transmission stress of the left binding head mechanism and the right binding head mechanism in the z-axis direction is symmetrical, and the influence of the eccentric load is reduced; one left z-axis guide rail is arranged on each side of the left z-axis motor, and one right z-axis guide rail is arranged on each side of the right z-axis motor, the guiding precision of the left binding head mechanism and the right binding head mechanism moving in the z-axis direction is improved; the number of the left z-axis transmission blocks and the right z-axis transmission blocks is at least two, and through the arrangement of multiple transmission blocks, the bearing capacity of the z-axis moving module is enhanced, and the operation stability of the left binding head mechanism and the right binding head mechanism is ensured.

[0023] 7. In another embodiment of the chip pick-and-place device provided by this invention, the Z-axis motion assembly includes a Z-axis motor and a motor housing. The Z-axis motor includes a Z-axis stator, a left Z-axis mover, and a right Z-axis mover. The Z-axis stator is located inside the motor housing. The working end of the left Z-axis mover is connected to the top surface of the left binding head mechanism, and the working end of the right Z-axis mover is connected to the top surface of the right binding head mechanism. The left and right Z-axis movers can slide relative to the Z-axis stator in the Z-axis direction, allowing the left and right binding head mechanisms to slide. It can move independently in the z-axis direction; the z-axis stator is installed inside the motor housing, and the top surfaces of the z-axis stator, the left z-axis mover, and the left binding head mechanism are connected in sequence, as are the top surfaces of the z-axis stator, the right z-axis mover, and the right binding head mechanism. Therefore, when the motor housing is connected and fixed to the y-axis moving module, the sliding of the left x-axis drive seat and the right x-axis drive seat in the y-axis direction will be restricted. This design can improve the speed at which the chip picking and mounting device completes the picking and mounting steps, thereby improving the working efficiency of the device.

[0024] 8. In the chip pick-and-place apparatus provided in the embodiments of the present invention, on the one hand, when the left x-axis drive seat and the right x-axis drive seat are restricted to slide relative to each other in the y-axis direction by the z-axis motion component on the z-axis moving module, the left y-axis drive component or the right y-axis drive component can drive the left x-axis drive seat and the right x-axis drive seat individually or jointly; on the other hand, when the left x-axis drive seat and the right x-axis drive seat are driven independently by the left z-axis drive component and the right z-axis drive component respectively, the left x-axis drive seat and the right x-axis drive seat can move independently in the y-axis direction. Through this design, it can adapt to the placement requirements in various application scenarios.

[0025] It should be noted that the left and right y-axis drive components are mounted on the device base and the left and right fixing blocks on both sides, which makes the structure stable and can significantly improve the load-bearing capacity and stability of the y-axis moving module driving the x-axis moving module and z-axis moving module to move along the y-axis.

[0026] 9. In the chip pick-and-place device provided in the embodiments of the present invention, by setting the x-axis grating assembly on the left x-axis transmission seat and the right x-axis transmission seat, setting the y-axis grating assembly on the device base, and setting the z-axis grating assembly on the left z-axis transmission seat and the right z-axis transmission seat, the relative position of each axis transmission component can be detected in real time, achieving high-precision positioning feedback, significantly improving the positioning accuracy of the independent movement of the x, y, and z axes, and ensuring the accuracy of the chip pick-and-place process.

[0027] It can be understood that, since the left x-axis guide rail is mounted along the x-axis direction on the left x-axis transmission seat, the left x-axis transmission block is slidably arranged on the left x-axis guide rail, the right x-axis guide rail is mounted along the x-axis direction on the right x-axis transmission seat, the right x-axis transmission block is slidably arranged on the right x-axis guide rail, the left x-axis guide rail is stationary relative to the left x-axis transmission block, and the right x-axis guide rail is stationary relative to the right x-axis transmission block, therefore, the x-axis grating assembly can be used to determine the position of the left x-axis transmission block, the position of the right x-axis transmission block and / or the relative position between the left x-axis transmission block and the right x-axis transmission block; similarly, since the left y-axis guide rail is stationary relative to the left x-axis transmission seat and the right y-axis guide rail is stationary relative to the right x-axis transmission seat, the y-axis grating assembly can be used to determine the position of the left x-axis transmission seat, the position of the right x-axis transmission seat and / or the relative position between the left x-axis transmission seat and the right x-axis transmission seat; since the left z-axis guide rail is stationary relative to the left z-axis transmission block and the right z-axis guide rail is stationary relative to the right z-axis transmission block, therefore, the z-axis grating assembly can be used to determine the position of the left z-axis transmission block, the position of the right z-axis transmission block and / or the relative position between the left z-axis transmission block and the right z-axis transmission block.

[0028] 10. The embodiment of the present application further provides a die bonding apparatus, which comprises the chip taking and mounting device. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0030] Figure 1 It is a schematic diagram of the overall structure of the chip taking and mounting device according to the embodiment of the present application.

[0031] Figure 2 It is an exploded view of the overall structure of the chip taking and mounting device according to the embodiment of the present application. Figure 1 .

[0032] Figure 3 It is a schematic diagram of the structure of the left x-axis transmission seat and the right x-axis transmission seat of the chip taking and mounting device according to the embodiment of the present application.

[0033] Figure 4 It is an exploded view of the overall structure of the chip taking and mounting device according to the embodiment of the present application. Figure 2 .

[0034] Figure 5 It is a sectional view of the chip taking and mounting device according to the embodiment of the present application. Figure 1 .

[0035] Figure 6 is the cross section of the chip taking and mounting device of the embodiment of the present application Figure 2 .

[0036] Figure 7 is the overall frame schematic diagram of the die bonding equipment of the embodiment of the present application.

[0037] Explanation of the drawing mark: 10, chip taking and mounting device; 20, die bonding equipment; 1, x-axis moving module; 11, left x-axis transmission assembly; 111, left x-axis transmission seat; 112, left x-axis guide rail; 113, left x-axis transmission block; 12, right x-axis transmission assembly; 121, right x-axis transmission seat; 122, right x-axis guide rail; 123, right x-axis transmission block; 13, x-axis drive assembly; 131, x-axis motor; 1311, x-axis stator; 1312, left x-axis mover; 1313, right x-axis mover; 132, motor base; 14, x-axis grating assembly; 2, y-axis moving module; 21, left y-axis drive assembly; 211, left y-axis guide rail; 212, left y-axis motor; 22, right y-axis drive assembly; 221, right y-axis guide rail; 222, right y-axis motor; 23, device base; 24, left fixed block; 25, right fixed block; 26, y-axis grating assembly; 3, z-axis moving module; 31, left z-axis transmission assembly; 311, left z-axis transmission seat; 312, first magnetic spring structure; 3121, first magnetic shaft; 3122, first magnetic sleeve; 32, left z-axis drive assembly; 321, left z-axis guide rail; 322, left z-axis transmission block; 323, left z-axis motor; 33, right z-axis transmission assembly; 331, right z-axis transmission seat; 332, second magnetic spring structure; 3321, second magnetic shaft; 3322, second magnetic sleeve; 34, right z-axis drive assembly; 341, right z-axis guide rail; 342, right z-axis transmission block; 343, right z-axis motor; 35, z-axis movement assembly; 351, z-axis motor; 3511, z-axis stator; 3512, left z-axis mover; 3513, right z-axis mover; 352, motor housing; 36, z-axis grating assembly; 4, left binding head mechanism; 5, right binding head mechanism. DETAILED DESCRIPTION

[0038] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely intended to explain the present application and should not be used to limit the present application. In the embodiments provided by the present application, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that the determination of B according to A does not mean that B is determined only according to A, but B can also be determined according to A and / or other information. It should be understood that "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application. In various embodiments of the present application, it should be understood that the size of the serial number of the above processes does not mean the inevitable sequence of execution, and the execution sequence of the processes should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. In the flowcharts and block diagrams of the drawings of the present application, the possible implementation architecture, function and operation of the system, method and computer program product according to various embodiments of the present application are illustrated. In this regard, each block in the flowchart or block diagram can represent a module, a program segment or a part of code, which includes one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks can also occur in a different order from that indicated in the drawings. For example, two blocks indicated in succession can actually be executed in parallel, and sometimes they can be executed in reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of special-purpose hardware and computer instructions.

[0039] Please refer to Figure 1 , Figure 2 and Figure 3This invention provides a chip pick-and-place device 10 for picking up chips and placing them onto a substrate. The chip pick-and-place device 10 includes a y-axis moving module 2, an x-axis moving module 1, and a z-axis moving module 3 installed sequentially. The y-axis moving module 2 drives the x-axis moving module 1 and the z-axis moving module 3 to move along the y-axis. The x-axis moving module 1 includes a left x-axis transmission assembly 11 and a right x-axis transmission assembly 12 arranged adjacent to each other. The left x-axis transmission assembly 11 includes a left x-axis transmission seat 111, a left x-axis guide rail 112, and a left x-axis transmission block 113. The left x-axis guide rail 112 is installed on the left x-axis transmission seat 111 along the x-axis direction, and the left x-axis transmission block 113 is slidable. The left x-axis drive assembly 12 is mounted on the left x-axis guide rail 112. The right x-axis drive assembly 12 includes a right x-axis drive seat 121, a right x-axis guide rail 122, and a right x-axis drive block 123. The right x-axis guide rail 122 is mounted on the right x-axis drive seat 121 along the x-axis direction, and the right x-axis drive block 123 is slidably mounted on the right x-axis guide rail 122. The left x-axis drive seat 111 and the right x-axis drive seat 121 are staggered at their adjacent ends and at least partially overlap in the z-axis direction. The left x-axis drive seat 111 and the right x-axis drive seat 121 can slide relative to each other in the y-axis direction. The left x-axis guide rail 112 and the right x-axis guide rail 122 are staggered at their adjacent ends and at least partially overlap in the z-axis direction.

[0040] The chip pick-and-place apparatus 10 provided by this invention can be used for picking up, transferring, and placing chips in the automated placement process of the semiconductor industry. The chip pick-and-place apparatus 10 has a left binding head mechanism 4 and a right binding head mechanism 5. The nozzle of the right binding head mechanism 5 can pick up and place chips from the wafer onto the transfer station, while the nozzle of the left binding head mechanism 4 can remove chips stored on the transfer station and place them onto the substrate. The chip pick-and-place apparatus 10 is applied in applications requiring high-precision chip placement. When picking up and adsorbing chips, it can expose the features that need to be identified. During chip placement, it enables real-time alignment and placement of the chip's upper surface and the identification points at the placement position.

[0041] Specifically, the device comprises a y-axis moving module 2, an x-axis moving module 1, and a z-axis moving module 3. The y-axis moving module 2 serves as the support base for the chip pick-and-place device 10 and can drive the x-axis moving module 1 and the z-axis moving module 3 to move as a whole along the y-axis. The x-axis moving module 1 is mounted above the y-axis moving module 2 and can drive the z-axis moving module 3 to move along the x-axis. The z-axis moving module 3 is mounted on the side of the x-axis moving module 1 and can drive the left binding head mechanism 4 and the right binding head mechanism 5 on the chip pick-and-place device 10 to move independently along the z-axis. The working ends of the left binding head mechanism 4 and the right binding head mechanism 5 have interchangeable vacuum nozzles of the same specifications, which are used to pick up different types of chips. The vacuum nozzles are responsible for picking up and adsorbing chips and completing chip placement.

[0042] It can be understood that the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12 are arranged adjacent to each other, and the chip taking process and the mounting process can be independent of each other; the left x-axis transmission assembly 11 comprises a left x-axis transmission seat 111, a left x-axis guide rail 112 and a left x-axis transmission block 113 connected in sequence, the left x-axis guide rail 112 is installed on the left x-axis transmission seat 111 along the x-axis direction, and the left x-axis transmission block 113 is slidably arranged on the left x-axis guide rail 112; the left x-axis guide rail 112 is installed on the side of the left x-axis transmission seat 111, and the left x-axis transmission block 113 slides on the left x-axis guide rail 112 to drive the z-axis moving module 3 to move along the x-axis.

[0043] Similarly, the right x-axis transmission assembly 12 comprises a right x-axis transmission seat 121, a right x-axis guide rail 122 and a right x-axis transmission block 123 connected in sequence, the right x-axis guide rail 122 is installed on the right x-axis transmission seat 121 along the x-axis direction, and the right x-axis transmission block 123 is slidably arranged on the right x-axis guide rail 122; the right x-axis guide rail 122 is installed on the side of the right x-axis transmission seat 121, and the right x-axis transmission block 123 slides on the right x-axis guide rail 122 to drive the z-axis moving module 3 to move along the x-axis; the left x-axis guide rail 112 and the right x-axis guide rail 122 are staggered at one end adjacent to each other, that is, the sliding of the left x-axis transmission block 113 and the right x-axis transmission block 123 is independent of each other, which can avoid the influence of the chip taking process on the mounting process, improve the precision of the taking and mounting processes, and ensure the transmission stability of the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12 in driving the double binding head, thereby meeting the high-precision requirement of chip mounting.

[0044] It should be noted that one end of the left x-axis transmission seat 111 and the right x-axis transmission seat 121 adjacent to each other is staggered, and the left x-axis transmission seat 111 and the right x-axis transmission seat 121 can slide relative to each other in the y-axis direction; through this design, the movement flexibility of the chip taking and mounting device 10 in the x-y plane can be improved, and the coverage range of the chip taking and mounting device 10 for taking and mounting chips can be expanded; at least part of one end of the left x-axis transmission seat 111 and the right x-axis transmission seat 121 adjacent to each other and one end of the left x-axis guide rail 112 and the right x-axis guide rail 122 adjacent to each other overlap in the z-axis direction, so that the left binding head mechanism 4 and the right binding head mechanism 5 overlap in the x-axis direction, which can effectively reduce the overall space occupied by the chip taking and mounting device 10 in the x-axis direction under the premise of ensuring the x-axis transmission stroke, and realize compact structure design and device miniaturization design.

[0045] In some embodiments, the number of left x-axis guide rails 112 is at least two, and the number of right x-axis guide rails 122 is at least two, to ensure stable operation of the left binding head mechanism 4 and the right binding head mechanism 5; in the embodiments of the present application, the number of left x-axis guide rails 112 is two, and the number of right x-axis guide rails 122 is two, wherein the left x-axis guide rails 112 and the right x-axis guide rails 122 are arranged in a cross manner, one right x-axis guide rail 122 is arranged between the two left x-axis guide rails 112, and one left x-axis guide rail 112 is arranged between the two right x-axis guide rails 122.

[0046] Further, the x-axis movement module 1 further comprises an x-axis driving assembly 13, which is spaced apart from and arranged in parallel with the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12; the x-axis driving assembly 13 comprises an x-axis motor 131 and a motor base 132, the x-axis motor 131 is arranged on the motor base 132, and the motor base 132 is connected with the y-axis movement module 2; the x-axis motor 131 comprises an x-axis stator 1311, a left x-axis mover 1312 and a right x-axis mover 1313, the transmission ends of the left x-axis mover 1312 and the right x-axis mover 1313 are connected with the x-axis stator 1311, and the working ends of the left x-axis mover 1312 and the right x-axis mover 1313 are connected with the z-axis movement module 3.

[0047] In the chip taking and mounting device 10 provided by the embodiments of the present application, the x-axis driving assembly 13 can provide driving force for the z-axis movement module 3 to move in the x-axis direction, and the left x-axis transmission assembly 11 and the right x-axis transmission assembly 12 can provide guidance for the z-axis movement module 3 to move in the x-axis direction; the x-axis driving assembly 13 is spaced apart from and arranged in parallel with the left x-axis transmission assembly 11, and the x-axis driving assembly 13 is spaced apart from and arranged in parallel with the right x-axis transmission assembly 12, so that interference between the x-axis driving assembly 13 and the left x-axis transmission assembly 11 and interference between the x-axis driving assembly 13 and the right x-axis transmission assembly 12 can be avoided.

[0048] It can be understood that the motor base 132 is used to fix the x-axis motor 131, so that resonance of the x-axis motor 131 during operation can be avoided, and mounting precision can be ensured; the x-axis motor 131 drives the z-axis movement module 3 through the working ends of the left x-axis mover 1312 and the right x-axis mover 1313, so that transmission stability in the x-axis direction can be improved, and mounting precision can be further ensured; the x-axis motor 131 in the embodiments of the present application is a carbon fiber linear motor, which has the advantages of light load, high acceleration and high precision.

[0049] Please refer to Figure 1 and Figure 2The z-axis moving module 3 comprises a left z-axis transmission assembly 31, a left z-axis driving assembly 32, a right z-axis transmission assembly 33 and a right z-axis driving assembly 34; the left z-axis transmission assembly 31 comprises a left z-axis transmission seat 311 and a first magnetic spring structure 312, one side of the left z-axis transmission seat 311 is connected with the left x-axis transmission block 113, and the other side is connected with the left z-axis driving assembly 32, and the first magnetic spring structure 312 is arranged on the side of the left z-axis transmission seat 311 away from the left x-axis transmission block 113.

[0050] Similarly, the right z-axis transmission assembly 33 comprises a right z-axis transmission seat 331 and a second magnetic spring structure 332, one side of the right z-axis transmission seat 331 is connected with the right x-axis transmission block 123, and the other side is connected with the right z-axis driving assembly 34, and the second magnetic spring structure 332 is arranged on the side of the right z-axis transmission seat 331 away from the right x-axis transmission block 123.

[0051] In the chip taking and mounting device 10 provided by the embodiment of the application, the z-axis moving module 3 is divided into left and right independent transmission assemblies and driving assemblies, that is, the left z-axis transmission assembly 31 and the left z-axis driving assembly 32, and the right z-axis transmission assembly 33 and the right z-axis driving assembly 34, which can realize simultaneous or separate operation, thereby improving the efficiency of the taking process and the mounting process.

[0052] It can be understood that the working ends of the left x-axis mover 1312 and the right x-axis mover 1313 are connected with the z-axis moving module 3, wherein one side of the left z-axis transmission seat 311 is connected with the left x-axis transmission block 113, and the other side is connected with the left z-axis driving assembly 32, one side of the right z-axis transmission seat 331 is connected with the right x-axis transmission block 123, and the other side is connected with the right z-axis driving assembly 34, so that the x-axis moving module 1 can drive the z-axis moving module 3 to move along the x-axis. In the embodiment of the application, the left x-axis transmission block 113 can slide relative to the left x-axis guide rail 112, the right x-axis transmission block 123 can slide relative to the right x-axis guide rail 122, the left x-axis mover 1312 can drive the left z-axis transmission seat 311 to move along the x-axis, and the right x-axis mover 1313 can drive the right z-axis transmission seat 331 to move along the x-axis.

[0053] It should be noted that the first magnetic spring structure 312 is arranged on the side of the left z-axis transmission seat 311 away from the left x-axis transmission block 113, the second magnetic spring structure 332 is arranged on the side of the right z-axis transmission seat 331 away from the right x-axis transmission block 123, and the first magnetic spring structure 312 and the second magnetic spring structure 332 can balance the load in the z-axis direction, reduce the driving load in the z-axis direction, and improve the motion stability of the z-axis moving module 3.

[0054] Please continue to refer to Figure 1 and Figure 2The left z-axis driving assembly 32 comprises a left z-axis guide rail 321 and a left z-axis transmission block 322, the left z-axis guide rail 321 is installed on the left z-axis transmission seat 311 along the z-axis direction, and the left z-axis transmission block 322 is slidably arranged on the left z-axis guide rail 321; the working end of the left x-axis mover 1312 is connected with the top end surface of the left z-axis transmission seat 311, and the left z-axis guide rail 321 and the left z-axis transmission block 322 are arranged in the first magnetic spring structure 312.

[0055] Similarly, the right z-axis driving assembly 34 comprises a right z-axis guide rail 341 and a right z-axis transmission block 342, the right z-axis guide rail 341 is installed on the right z-axis transmission seat 331 along the z-axis direction, and the right z-axis transmission block 342 is slidably arranged on the right z-axis guide rail 341; the working end of the right x-axis mover 1313 is connected with the top end surface of the right z-axis transmission seat 331, and the right z-axis guide rail 341 and the right z-axis transmission block 342 are arranged in the second magnetic spring structure 332.

[0056] In the chip taking and mounting device 10 provided by the embodiment of the application, the left z-axis transmission seat 311, the left z-axis guide rail 321 and the left z-axis transmission block 322 are sequentially installed, and the right z-axis transmission seat 331, the right z-axis guide rail 341 and the right z-axis transmission block 342 are sequentially arranged, so that the straight-line sliding smoothness in the z-axis direction can be ensured; and the left z-axis guide rail 321 and the right z-axis guide rail 341 adopt high-rigidity guide rails, so that the overall rigidity and stability of the chip taking and mounting device 10 can be improved.

[0057] It can be understood that the working end of the left x-axis mover 1312 is connected with the top end surface of the left z-axis transmission seat 311, and the working end of the right x-axis mover 1313 is connected with the top end surface of the right z-axis transmission seat 331, so that the top ends of the left z-axis transmission seat 311 and the right z-axis transmission seat 331 can be driven by the x-axis motor 131, the transmission stress can be more uniform, and the straight-line precision of the z-axis moving module 3 in the x-axis direction can be improved.

[0058] It should be noted that the left z-axis guide rail 321 and the left z-axis transmission block 322 are arranged in the first magnetic spring structure 312, and the right z-axis guide rail 341 and the right z-axis transmission block 342 are arranged in the second magnetic spring structure 332, so that the mutual interference between the transmission elements can be avoided, and the rationality of the assembly between the elements of the z-axis moving module 3 can be ensured.

[0059] Please continue to refer to Figure 1 and Figure 2The chip taking and mounting device 10 further comprises a left binding head mechanism 4 and a right binding head mechanism 5; the left binding head mechanism 4 is connected with a working end of a first magnetic spring structure 312 and a left z-axis transmission block 322 respectively, and the left binding head mechanism 4 moves synchronously when the left z-axis transmission block 322 slides relative to a left z-axis guide rail 321; the first magnetic spring structure 312 is used for balancing the load of the left z-axis transmission seat 311, the left z-axis driving assembly 32 and the left binding head mechanism 4.

[0060] Similarly, the right binding head mechanism 5 is connected with a working end of a second magnetic spring structure 332 and a right z-axis transmission block 342 respectively, and the right binding head mechanism 5 moves synchronously when the right z-axis transmission block 342 slides relative to a right z-axis guide rail 341; the second magnetic spring structure 332 is used for balancing the load of the right z-axis transmission seat 331, the right z-axis driving assembly 34 and the right binding head mechanism 5.

[0061] In the chip taking and mounting device 10 provided by the embodiment of the application, the left binding head mechanism 4 is connected with a working end of the first magnetic spring structure 312, and the right binding head mechanism 5 is connected with a working end of the second magnetic spring structure 332; by arranging the first magnetic spring structure 312 and the second magnetic spring structure 332, the left binding head mechanism 4 and the right binding head mechanism 5 can be provided with certain buffering in the z-axis direction, so that the left binding head mechanism 4 and the right binding head mechanism 5 can avoid over-pressing to damage the chip when taking the chip and under-pressing to cause poor mounting when mounting.

[0062] It can be understood that, by arranging the first magnetic spring structure 312 and limiting the left z-axis transmission block 322 to slide on the left z-axis guide rail 321, the z-axis movement stroke of the left binding head mechanism 4 can be limited, by arranging the second magnetic spring structure 332 and limiting the right z-axis transmission block 342 to slide on the right z-axis guide rail 341, the z-axis movement stroke of the right binding head mechanism 5 can be limited, and by this design, the chip taking and mounting process in the z-axis direction can be further precisely guided, so that the left binding head mechanism 4 and the right binding head mechanism 5 can avoid excessive sliding in the z-axis direction, and the chip and the substrate can be protected.

[0063] It should be noted that the left binding head mechanism 4 is connected with the working end of the first magnetic spring structure 312 at the same time, and is connected with the working end of the left z-axis transmission block 322, the left z-axis transmission block 322 is synchronous with the left binding head mechanism 4 when the left z-axis transmission block 322 slides relative to the left z-axis guide rail 321, and the first magnetic spring structure 312 and the left z-axis transmission block 322 can provide the left binding head mechanism 4 with the z-axis direction guide; the right binding head mechanism 5 is connected with the working end of the second magnetic spring structure 332 at the same time, and is connected with the working end of the right z-axis transmission block 342, the right z-axis transmission block 342 is synchronous with the right binding head mechanism 5 when the right z-axis transmission block 342 slides relative to the right z-axis guide rail 341, and the second magnetic spring structure 332 and the right z-axis transmission block 342 can provide the right binding head mechanism 5 with the z-axis direction guide. Through the above design, the left binding head mechanism 4 and the right binding head mechanism 5 can be prevented from deviating in the horizontal direction during the movement in the z-axis direction, and the left binding head mechanism 4 and the right binding head mechanism 5 can be prevented from shaking during the movement, thereby improving the mounting efficiency and the mounting precision of the chip taking and mounting device 10.

[0064] The first magnetic spring structure 312 and the second magnetic spring structure 332 of the embodiment of the application are constant force springs, which are completely passive devices, and can realize energy output without any external energy supply, including power supply, gas pressure, hydraulic pressure and thermal energy. The first magnetic spring structure 312 includes a first magnetic shaft 3121 and a first magnetic sleeve 3122 connected with each other, the first magnetic shaft 3121 is arranged in the z-axis direction of the left z-axis transmission seat 311, and both ends of the first magnetic shaft 3121 are fixedly installed on the left z-axis transmission seat 311, one end of the first magnetic sleeve 3122 is slidably sleeved on the first magnetic shaft 3121, and the other end is connected with the left binding head mechanism 4; the second magnetic spring structure 332 includes a second magnetic shaft 3321 and a second magnetic sleeve 3322 connected with each other, the second magnetic shaft 3321 is arranged in the z-axis direction of the right z-axis transmission seat 331, and both ends of the second magnetic shaft 3321 are fixedly installed on the right z-axis transmission seat 331, one end of the second magnetic sleeve 3322 is slidably sleeved on the second magnetic shaft 3321, and the other end is connected with the right binding head mechanism 5. By arranging the first magnetic spring structure 312 and the second magnetic spring structure 332, the left binding head mechanism 4 and / or the right binding head mechanism 5 can be prevented from rapidly falling under the action of its own gravity when the chip taking and mounting device 10 is suddenly powered off, and the equipment and workpieces can be prevented from being damaged.

[0065] Further, the first magnetic spring structure 312 of the embodiment of the present application can drive the left binding head mechanism 4 to elastically reset in the z-axis direction, balance the load of the left z-axis transmission seat 311, the left z-axis drive assembly 32 and the left binding head mechanism 4; similarly, the second magnetic spring structure 332 can drive the right binding head mechanism 5 to elastically reset in the z-axis direction, balance the load of the right z-axis transmission seat 331, the right z-axis drive assembly 34 and the right binding head mechanism 5, by setting the first magnetic spring structure 312 and the second magnetic spring structure 332, the influence of the self-gravity of each element of the chip picking and mounting device 10 on the picking and mounting down pressure can be reduced, and the high precision requirement of the chip mounting force can be ensured.

[0066] Please continue to refer to Figure 1 and Figure 2 As an optional embodiment, the left z-axis drive assembly 32 further comprises a left z-axis motor 323, the left z-axis motor 323 is installed in the middle part of the left z-axis transmission seat 311, and the left z-axis motor 323 is used to drive the left z-axis transmission block 322 to slide in the z-axis direction relative to the left z-axis guide rail 321; the number of the left z-axis guide rail 321 is two, and the left z-axis guide rail 321 is arranged on both sides of the left z-axis motor 323 respectively; the number of the left z-axis transmission block 322 is at least two.

[0067] Similarly, the right z-axis drive assembly 34 further comprises a right z-axis motor 343, the right z-axis motor 343 is installed in the middle part of the right z-axis transmission seat 331, and the right z-axis motor 343 is used to drive the right z-axis transmission block 342 to slide in the z-axis direction relative to the right z-axis guide rail 341; the number of the right z-axis guide rail 341 is two, and the right z-axis guide rail 341 is arranged on both sides of the right z-axis motor 343 respectively; the number of the right z-axis transmission block 342 is at least two.

[0068] In the chip picking and mounting device 10 provided by the embodiment of the present application, the left z-axis motor 323 is arranged in the middle part of the left z-axis transmission seat 311, the two left z-axis guide rails 321 are arranged on both sides of the left z-axis motor 323 respectively, the right z-axis motor 343 is arranged in the middle part of the right z-axis transmission seat 331, and the two right z-axis guide rails 341 are arranged on both sides of the right z-axis motor 343 respectively, by this design, the transmission stress of the left binding head mechanism 4 and the right binding head mechanism 5 in the z-axis direction can be symmetrical, and the influence of the eccentric load can be reduced.

[0069] It can be understood that one left z-axis guide rail 321 is arranged on each side of the left z-axis motor 323, and one right z-axis guide rail 341 is arranged on each side of the right z-axis motor 343, which can improve the guiding accuracy of the left binding head mechanism 4 and the right binding head mechanism 5 moving in the z-axis direction; the number of the left z-axis transmission block 322 and the right z-axis transmission block 342 is at least two, by setting multiple transmission blocks, the carrying capacity of the z-axis moving module 3 can be enhanced, and the operation stability of the left binding head mechanism 4 and the right binding head mechanism 5 can be ensured.

[0070] In the embodiment of the present application, the left z-axis motor 323 and the left z-axis guide rail 321 are arranged on the left z-axis transmission seat 311 on the side away from the left x-axis transmission block 113, and the first magnetic spring structure 312, the left z-axis motor 323 and the left z-axis guide rail 321 are arranged on the same side; the right z-axis motor 343 and the right z-axis guide rail 341 are arranged on the right z-axis transmission seat 331 on the side away from the right x-axis transmission block 123, and the second magnetic spring structure 332, the right z-axis motor 343 and the right z-axis guide rail 341 are arranged on the same side; the left z-axis motor 323 and the right z-axis motor 343 are both linear motors.

[0071] Please refer to Figure 4 , Figure 5 and Figure 6 , as another alternative embodiment, the z-axis movement module 3 further comprises a z-axis movement assembly 35, the z-axis movement assembly 35 comprises a z-axis motor 351 and a motor housing 352, the z-axis motor 351 comprises a z-axis stator 3511, a left z-axis mover 3512 and a right z-axis mover 3513, the left z-axis mover 3512 and the right z-axis mover 3513 can slide relative to the z-axis stator 3511 in the z-axis direction.

[0072] Further, the z-axis stator 3511 is installed inside the motor housing 352, the transmission end of the left z-axis mover 3512 and the transmission end of the right z-axis mover 3513 are connected with the z-axis stator 3511 respectively, the working end of the left z-axis mover 3512 and the working end of the right z-axis mover 3513 are exposed to the motor housing 352, and the working end of the left z-axis mover 3512 is connected with the top end surface of the left binding head mechanism 4, and the working end of the right z-axis mover 3513 is connected with the top end surface of the right binding head mechanism 5; the motor housing 352 is connected with the y-axis movement module 2 to limit the relative sliding of the left x-axis transmission seat 111 and the right x-axis transmission seat 121 in the y-axis direction.

[0073] In the chip taking and mounting device 10 provided by the embodiment of the present application, the z-axis movement assembly 35 comprises a z-axis motor 351 and a motor housing 352, the z-axis motor 351 comprises a z-axis stator 3511, a left z-axis mover 3512 and a right z-axis mover 3513, the z-axis stator 3511 is arranged inside the motor housing 352, the working end of the left z-axis mover 3512 is connected with the top end surface of the left binding head mechanism 4, and the working end of the right z-axis mover 3513 is connected with the top end surface of the right binding head mechanism 5, and the left z-axis mover 3512 and the right z-axis mover 3513 can slide relative to the z-axis stator 3511 in the z-axis direction, so that the left binding head mechanism 4 and the right binding head mechanism 5 can independently move in the z-axis direction.

[0074] Understandably, the z-axis stator 3511 is installed inside the motor housing 352, and the top surfaces of the z-axis stator 3511, the left z-axis mover 3512, and the left binding mechanism 4 are sequentially connected. Therefore, when the motor housing 352 is connected and fixed to the y-axis moving module 2, the independent sliding of the left x-axis drive seat 111 in the y-axis direction is restricted. Similarly, the top surfaces of the z-axis stator 3511, the right z-axis mover 3513, and the right binding mechanism 5 are sequentially connected, and when the motor housing 352 is connected and fixed to the y-axis moving module 2, the independent sliding of the right x-axis drive seat 121 in the y-axis direction is restricted. Through the above design, restricting the sliding of the left x-axis drive seat 111 and the right x-axis drive seat 121 in the y-axis direction can improve the speed and accuracy of the chip picking and mounting device 10 in completing the picking and mounting steps, thereby improving the working efficiency of the device.

[0075] Please see Figure 1 , Figure 2 and Figure 4 The y-axis moving module 2 includes a left y-axis drive assembly 21, a right y-axis drive assembly 22, a device base 23, and a left fixing block 24 and a right fixing block 25 installed on both sides of the device base 23. The left y-axis drive assembly 21 and the right y-axis drive assembly 22 are disposed adjacently on the device base 23 between the left fixing block 24 and the right fixing block 25. The side of the left fixing block 24 and the right fixing block 25 away from the device base 23 is connected to the motor base 132.

[0076] Furthermore, the left y-axis drive assembly 21 includes a left y-axis guide rail 211 and a left y-axis motor 212, and the left x-axis transmission seat 111 is slidably disposed on the left y-axis guide rail 211. The left y-axis motor 212 can drive the left x-axis transmission seat 111 to slide along the y-axis. The right y-axis drive assembly 22 includes a right y-axis guide rail 221 and a right y-axis motor 222, and the right x-axis transmission seat 121 is slidably disposed on the right y-axis guide rail 221. The right y-axis motor 222 can drive the right x-axis transmission seat 121 to slide along the y-axis.

[0077] In the chip pick-and-place apparatus 10 provided in this embodiment of the invention, on the one hand, when the left x-axis drive seat 111 and the right x-axis drive seat 121 are restricted to slide relative to each other in the y-axis direction by the z-axis motion component 35 on the z-axis moving module 3, the left y-axis drive component 21 or the right y-axis drive component 22 can drive the left x-axis drive seat 111 and the right x-axis drive seat 121 individually or jointly; on the other hand, when the left x-axis drive seat 111 and the right x-axis drive seat 121 are driven independently by the left z-axis drive component 32 and the right z-axis drive component 34 respectively, the left x-axis drive seat 111 and the right x-axis drive seat 121 can move independently in the y-axis direction. Through this design, it can adapt to the placement requirements in various application scenarios.

[0078] It should be noted that the left y-axis drive assembly 21 and the right y-axis drive assembly 22 are installed based on the device base 23 and the left fixed block 24 and the right fixed block 25 on the two sides thereof, the structure is stable, and the load bearing capacity and motion stability of the y-axis movement module 2 for driving the x-axis movement module 1 and the z-axis movement module 3 to move along the y-axis can be significantly improved.

[0079] In the embodiment of the application, the left y-axis motor 212 and the right y-axis motor 222 are both voice coil motors; the left y-axis guide rail 211 and the right y-axis guide rail 221 are arranged in the y-axis direction, the left x-axis transmission seat 111 can slide relative to the left y-axis guide rail 211 under the driving of the left y-axis motor 212, and the right x-axis transmission seat 121 can slide relative to the right y-axis guide rail 221 under the driving of the right y-axis motor 222.

[0080] In some embodiments, the left y-axis guide rail 211 and the right y-axis guide rail 221 are parallel to each other. The number of the left y-axis guide rail 211 is four, two of which are arranged on one side of the left y-axis motor 212, and the other two are arranged on the other side of the left y-axis motor 212; the number of the right y-axis guide rail 221 is two, one of which is arranged on one side of the right y-axis motor 222 and adjacent to the left y-axis guide rail 211, and the other is arranged on the other side of the right y-axis motor 222. The number of guide rails on the two sides of the left y-axis motor 212 and the right y-axis motor 222 is the same, which can further improve the stability of y-axis transmission. It can be understood that the left y-axis guide rail 211 can be used for y-axis movement of the left binding head mechanism 4, and the right y-axis guide rail 221 can be used for y-axis movement of the right binding head mechanism 5. The right binding head mechanism 5 of the embodiment of the application is used for picking and placing the chips from the wafer to the transfer table to complete the picking process, and the left binding head mechanism 4 is used for picking the chips stored in the transfer table and mounting them on the substrate to complete the mounting process. The left binding head mechanism 4 has higher requirements for precision, so the number of the left y-axis guide rail 211 is more than that of the right y-axis guide rail 221, which can save the use cost and appropriately reduce the subsequent maintenance cost of the chip picking and mounting device 10.

[0081] In some embodiments, the left x-axis transmission seat 111 is provided with a first opening for avoiding the left y-axis motor 212, and the first opening is arranged on the side away from the left x-axis guide rail 112 and the left x-axis transmission block 113. The right x-axis transmission seat 121 is also provided with a second opening for avoiding the right y-axis motor 222, and the second opening is arranged on the side away from the right x-axis guide rail 122 and the right x-axis transmission block 123. Through this design, the overall occupied space of the chip picking and mounting device 10 in the y-axis and z-axis directions can be effectively reduced under the premise of ensuring the y-axis transmission, and the compact design and small size design of the device can be realized.

[0082] Please continue to refer to Figure 1 , Figure 2 and Figure 4The x-axis movement module 1 further comprises an x-axis grating assembly 14 arranged on the left x-axis transmission seat 111 and the right x-axis transmission seat 121, and the x-axis grating assembly 14 can be used to determine the relative positions between the left x-axis guide rail 112 and the left x-axis transmission block 113, between the right x-axis guide rail 122 and the right x-axis transmission block 123, and / or between the left x-axis transmission block 113 and the right x-axis transmission block 123; the z-axis movement module 3 further comprises a z-axis grating assembly 36 arranged on the left z-axis transmission seat 311 and the right z-axis transmission seat 331, and the z-axis grating assembly 36 can be used to determine the relative positions between the left z-axis guide rail 321 and the left z-axis transmission block 322, between the right z-axis guide rail 341 and the right z-axis transmission block 342, and / or between the left z-axis transmission block 322 and the right z-axis transmission block 342; and the y-axis movement module 2 further comprises a y-axis grating assembly 26 arranged on the device base 23, and the y-axis grating assembly 26 can be used to determine the relative positions between the left y-axis guide rail 211 and the left x-axis transmission seat 111, between the right y-axis guide rail 221 and the right x-axis transmission seat 121, and / or between the left x-axis transmission seat 111 and the right x-axis transmission seat 121.

[0083] In the chip taking and mounting device 10 provided by the embodiment of the present application, the x-axis grating assembly 14 is arranged on the left x-axis transmission seat 111 and the right x-axis transmission seat 121, the y-axis grating assembly 26 is arranged on the device base 23, and the z-axis grating assembly 36 is arranged on the left z-axis transmission seat 311 and the right z-axis transmission seat 331, so that the relative positions of the transmission components of each axis can be detected in real time, high-precision positioning feedback can be realized, the positioning precision of the independent movement of the x, y and z axes can be significantly improved, and the accuracy of the chip taking and mounting process can be ensured.

[0084] It can be understood that, since the left x-axis guide rail 112 is mounted on the left x-axis transmission seat 111 along the x-axis direction, the left x-axis transmission block 113 is slidably arranged on the left x-axis guide rail 112, the right x-axis guide rail 122 is mounted on the right x-axis transmission seat 121 along the x-axis direction, the right x-axis transmission block 123 is slidably arranged on the right x-axis guide rail 122, the left x-axis guide rail 112 is stationary relative to the left x-axis transmission block 113, and the right x-axis guide rail 122 is stationary relative to the right x-axis transmission block 123, therefore, the x-axis grating assembly 14 can be used to determine the position of the left x-axis transmission block 113, the position of the right x-axis transmission block 123, and / or the relative position between the left x-axis transmission block 113 and the right x-axis transmission block 123.

[0085] Similarly, it can be known that the left y-axis guide rail 211 is stationary relative to the left x-axis transmission seat 111, the right y-axis guide rail 221 is stationary relative to the right x-axis transmission seat 121, the y-axis grating assembly 26 can be used to determine the position of the left x-axis transmission seat 111, the position of the right x-axis transmission seat 121 and / or the relative position between the left x-axis transmission seat 111 and the right x-axis transmission seat 121; the left z-axis guide rail 321 is stationary relative to the left z-axis transmission block 322, the right z-axis guide rail 341 is stationary relative to the right z-axis transmission block 342, therefore, the z-axis grating assembly 36 can be used to determine the position of the left z-axis transmission block 322, the position of the right z-axis transmission block 342 and / or the relative position between the left z-axis transmission block 322 and the right z-axis transmission block 342.

[0086] In some embodiments, the number of gratings of the x-axis grating assembly 14, the y-axis grating assembly 26 and the z-axis grating assembly 36 are both two, wherein the gratings of the x-axis grating assembly 14 are located between the left x-axis transmission block 113 and the left x-axis transmission seat 111, and between the right x-axis transmission block 123 and the right x-axis transmission seat 121 respectively, the gratings of the y-axis grating assembly 26 are located between the left y-axis guide rail 211 and the left y-axis motor 212, and between the right y-axis guide rail 221 and the right y-axis motor 222 respectively, the gratings of the z-axis grating assembly 36 are located at the top of the left z-axis guide rail 321 and the top of the right z-axis guide rail 341 respectively.

[0087] Please refer to Figure 1 and Figure 7 The embodiment of the present application further provides a die bonding apparatus 20, which comprises the chip taking and mounting device 10 described above. It should be noted that the die bonding apparatus 20 has the same beneficial effects as the chip taking and mounting device 10 described above, and will not be described here.

[0088] The chip taking and mounting device and the die bonding apparatus disclosed in the embodiment of the present application are described in detail above, and the principles and implementation manners of the present application are described by using specific examples in this paper, and the above embodiment description is only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range will be changed, and according to the above, the content of the present description should not be understood as the limitation of the present application, any modification, equivalent replacement and improvement within the principles of the present application should be included in the protection scope of the present application.

Claims

1. A chip pick-and-place device, characterized in that, It includes a y-axis moving module, an x-axis moving module and a z-axis moving module installed in sequence, wherein the y-axis moving module drives the x-axis moving module and the z-axis moving module to move along the y-axis; The x-axis moving module includes a left x-axis transmission assembly and a right x-axis transmission assembly arranged adjacent to each other. The left x-axis transmission assembly includes a left x-axis transmission seat, a left x-axis guide rail, and a left x-axis transmission block. The left x-axis guide rail is mounted on the left x-axis transmission seat along the x-axis direction, and the left x-axis transmission block is slidably disposed on the left x-axis guide rail. The right x-axis transmission assembly includes a right x-axis transmission seat, a right x-axis guide rail, and a right x-axis transmission block. The right x-axis guide rail is mounted on the right x-axis transmission seat along the x-axis direction, and the right x-axis transmission block is slidably disposed on the right x-axis guide rail. The left x-axis drive seat and the right x-axis drive seat are staggered at their adjacent ends and overlap at least partially in the z-axis direction. The left x-axis drive seat and the right x-axis drive seat can slide relative to each other in the y-axis direction. The left x-axis guide rail and the right x-axis guide rail are staggered at their adjacent ends and overlap at least partially in the z-axis direction.

2. The chip pick-and-place apparatus as described in claim 1, characterized in that: The x-axis moving module also includes an x-axis driving component, which is spaced apart from and parallel to the left x-axis transmission component and the right x-axis transmission component; The x-axis drive assembly includes an x-axis motor and a motor base. The x-axis motor is mounted on the motor base, and the motor base is connected to the y-axis moving module. The x-axis motor includes an x-axis stator, a left x-axis mover, and a right x-axis mover. The transmission ends of the left x-axis mover and the right x-axis mover are both connected to the x-axis stator, and the working ends of the left x-axis mover and the right x-axis mover are both connected to the z-axis moving module.

3. The chip pick-and-place apparatus as described in claim 2, characterized in that: The z-axis movement module includes a left z-axis transmission assembly, a left z-axis drive assembly, a right z-axis transmission assembly, and a right z-axis drive assembly. The left Z-axis transmission assembly includes a left Z-axis transmission seat and a first magnetic spring structure. One side of the left Z-axis transmission seat is connected to the left X-axis transmission block, and the other side is connected to the left Z-axis drive assembly. The first magnetic spring structure is disposed on the left Z-axis transmission seat on the side away from the left X-axis transmission block. The right Z-axis transmission assembly includes a right Z-axis transmission seat and a second magnetic spring structure. One side of the right Z-axis transmission seat is connected to the right X-axis transmission block, and the other side is connected to the right Z-axis drive assembly. The second magnetic spring structure is disposed on the side of the right Z-axis transmission seat away from the right X-axis transmission block.

4. The chip pick-and-place apparatus as described in claim 3, characterized in that: The left Z-axis drive assembly includes a left Z-axis guide rail and a left Z-axis transmission block. The left Z-axis guide rail is mounted on the left Z-axis transmission seat along the Z-axis direction, and the left Z-axis transmission block is slidably disposed on the left Z-axis guide rail. The working end of the left X-axis mover is connected to the top surface of the left Z-axis transmission seat. Both the left Z-axis guide rail and the left Z-axis transmission block are disposed away from the first magnetic spring structure. The right Z-axis drive assembly includes a right Z-axis guide rail and a right Z-axis transmission block. The right Z-axis guide rail is mounted on the right Z-axis transmission seat along the Z-axis direction, and the right Z-axis transmission block is slidably disposed on the right Z-axis guide rail. The working end of the right X-axis mover is connected to the top surface of the right Z-axis transmission seat. Both the right Z-axis guide rail and the right Z-axis transmission block are disposed away from the second magnetic spring structure.

5. The chip pick-and-place apparatus as described in claim 4, characterized in that: The chip picking and mounting device also includes a left binding head mechanism and a right binding head mechanism; The left binding head mechanism is connected to the working end of the left Z-axis transmission block and the first magnetic spring structure respectively. When the left Z-axis transmission block slides relative to the left Z-axis guide rail, the left binding head mechanism moves synchronously. The first magnetic spring structure is used to balance the load of the left Z-axis transmission seat, the left Z-axis drive assembly and the left binding head mechanism. The right binding head mechanism is connected to the working end of the right Z-axis transmission block and the second magnetic spring structure respectively. When the right Z-axis transmission block slides relative to the right Z-axis guide rail, the right binding head mechanism moves synchronously. The second magnetic spring structure is used to balance the load of the right Z-axis transmission seat, the right Z-axis drive assembly and the right binding head mechanism.

6. The chip pick-and-place apparatus as described in claim 5, characterized in that: The left Z-axis drive assembly also includes a left Z-axis motor, which is mounted in the middle of the left Z-axis transmission seat. The left Z-axis motor is used to drive the left Z-axis transmission block to slide relative to the left Z-axis guide rail in the Z-axis direction. There are two left Z-axis guide rails, which are respectively located on both sides of the left Z-axis motor. There are at least two left Z-axis transmission blocks. The right Z-axis drive assembly also includes a right Z-axis motor, which is installed in the middle of the right Z-axis transmission seat. The right Z-axis motor is used to drive the right Z-axis transmission block to slide relative to the right Z-axis guide rail in the Z-axis direction. There are two right Z-axis guide rails, which are respectively located on both sides of the right Z-axis motor. There are at least two right Z-axis transmission blocks.

7. The chip pick-and-place apparatus as described in claim 5, characterized in that: The z-axis moving module further includes a z-axis motion component, which includes a z-axis motor and a motor housing. The z-axis motor includes a z-axis stator, a left z-axis mover, and a right z-axis mover. The left z-axis mover and the right z-axis mover can slide relative to the z-axis stator in the z-axis direction. The Z-axis stator is installed inside the motor housing. The transmission ends of the left Z-axis mover and the right Z-axis mover are respectively connected to the Z-axis stator. The working ends of the left Z-axis mover and the right Z-axis mover are exposed outside the motor housing. The working end of the left Z-axis mover is connected to the top surface of the left binding head mechanism, and the working end of the right Z-axis mover is connected to the top surface of the right binding head mechanism. The motor housing is connected to the y-axis moving module to restrict the left x-axis drive seat and the right x-axis drive seat from sliding relative to each other in the y-axis direction.

8. The chip pick-and-place apparatus as described in claim 6 or 7, characterized in that: The y-axis moving module includes a left y-axis drive assembly, a right y-axis drive assembly, a device base, and a left fixing block and a right fixing block installed on both sides of the device base. The left y-axis drive assembly and the right y-axis drive assembly are disposed adjacent to each other on the device base between the left fixing block and the right fixing block. The side of the left fixing block and the right fixing block away from the device base is connected to the motor base. The left y-axis drive assembly includes a left y-axis guide rail and a left y-axis motor. The left x-axis transmission seat is slidably disposed on the left y-axis guide rail, and the left y-axis motor can drive the left x-axis transmission seat to slide along the y-axis. The right y-axis drive assembly includes a right y-axis guide rail and a right y-axis motor. The right x-axis transmission seat is slidably disposed on the right y-axis guide rail, and the right y-axis motor can drive the right x-axis transmission seat to slide along the y-axis.

9. The chip pick-and-place apparatus as described in claim 8, characterized in that: The x-axis moving module also includes an x-axis grating assembly disposed on the left x-axis drive seat and the right x-axis drive seat. The x-axis grating assembly can be used to determine the relative positions between the left x-axis guide rail and the left x-axis drive block, between the right x-axis guide rail and the right x-axis drive block, and / or between the left x-axis drive block and the right x-axis drive block. The z-axis moving module also includes a z-axis grating assembly disposed on the left z-axis drive seat and the right z-axis drive seat. The z-axis grating assembly can be used to determine the relative positions between the left z-axis guide rail and the left z-axis drive block, between the right z-axis guide rail and the right z-axis drive block, and / or between the left z-axis drive block and the right z-axis drive block. The y-axis moving module also includes a y-axis grating assembly disposed on the base of the device. The y-axis grating assembly can be used to determine the relative positions between the left y-axis guide rail and the left x-axis drive seat, between the right y-axis guide rail and the right x-axis drive seat, and / or between the left x-axis drive seat and the right x-axis drive seat.

10. A die bonding apparatus, characterized in that, The die bonding equipment includes the chip pick-and-place device according to any one of claims 1-9.

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