Automatic welding device for integrated circuit chip processing

Abstract

The invention discloses an automatic welding device for integrated circuit chip processing, and relates to the related technical field of chip welding, the automatic welding device comprises an operation table, the upper end of the operation table is slidably provided with a placing platform and a welding platform, the placing platform is used for placing a circuit board, and the moving direction of the placing platform is perpendicular to that of the welding platform; a welding machine is slidably mounted on the end face of the welding platform, an electric soldering iron and a smoke guide pipe are fixedly connected to the lower end of the welding machine, the electric soldering iron is sleeved with one end of the smoke guide pipe, a filter box is fixedly connected to the upper end of the operation table, and the other end of the smoke guide pipe is connected to the upper end of the filter box which is used for filtering smoke sucked by the smoke guide pipe. By arranging the smoke guide pipe which is fixed on the electric soldering iron and synchronously moves along with the electric soldering iron and the efficient filter box which is connected with the smoke guide pipe and fixed on the operation table, the problems that an existing automatic welding device for integrated circuit chip processing is low in trapping efficiency and lags in response and harmful smoke easily escapes in the dynamic welding process are solved.

Description

Technical Field

[0001] This invention relates to the field of chip welding technology, specifically to an automatic welding device for integrated circuit chip processing. Background Technology

[0002] Current integrated circuit chip processing generally employs fully automated soldering equipment, the core of which is to achieve high-precision, high-efficiency, and high-consistency chip packaging interconnection. The mainstream technology has shifted from traditional wave soldering to the more precise reflow soldering and eutectic bonding. Automated reflow soldering equipment uses a precisely controlled heating furnace to melt and cool pre-coated solder paste on the pads according to a preset temperature profile, thereby soldering the chip leads to the substrate. This is widely used in ball grid arrays (BGAs) and chip-scale packaging (CSPs). For applications requiring high thermal conductivity and reliability, such as power chips and optoelectronic devices, eutectic bonding equipment is often used. In a vacuum or inert gas environment, by precisely controlling pressure and temperature, the gold-tin eutectic solder between the chip and the substrate melts to form a strong metallurgical bond. These automated devices integrate high-precision vision alignment systems, precise motion control platforms, and real-time process monitoring systems, ensuring micron-level positioning accuracy and stable soldering quality, significantly improving production yield and automation levels. They are indispensable key equipment in the modern semiconductor back-end packaging process.

[0003] When soldering integrated circuit chips, flux is needed to remove oxide layers and promote wetting. However, during the soldering process, the flux generates a mixture containing particulate matter and harmful gases. Existing automated integrated circuit chip soldering equipment's fume extraction system typically has its fume extraction unit fixed in a certain position on the worktable during fume extraction, unable to move with the soldering torch. During soldering, the solder joints constantly change on the circuit board, resulting in the fixed suction nozzle being too far from the source of smoke and at an inappropriate angle, leading to low collection efficiency. A large amount of harmful smoke escapes during its upward diffusion, polluting the working environment. Furthermore, the fixed design prevents the suction nozzle from achieving "zero-delay" collection at the moment of soldering, resulting in a response lag. To solve the above-mentioned problems, an automated soldering device for integrated circuit chip processing is provided. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic welding device for integrated circuit chip processing, so as to solve the problems mentioned in the background art of low collection efficiency, slow response and easy escape of harmful fumes in the dynamic welding process of existing automatic welding devices for integrated circuit chip processing.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic welding device for integrated circuit chip processing, comprising an operating table, a placement platform and a welding platform slidably mounted on the upper end of the operating table, the placement platform being used to place circuit boards, the moving directions of the placement platform and the welding platform being perpendicular to each other, a welding machine slidably mounted on the end face of the welding platform, and a soldering iron fixedly connected to the lower end of the welding machine. The smoke guide tube has one end attached to the soldering iron, and a filter box is fixedly connected to the upper end of the workbench. The other end of the smoke guide tube is connected to the upper end of the filter box, which is used to filter the smoke drawn in by the smoke guide tube.

[0006] In a further embodiment, a movable platform is fixedly installed on the upper end of the operating table, and a placement platform is slidably installed on the upper end of the movable platform. A first lead screw for controlling the movement of the placement platform is installed inside the movable platform.

[0007] In a further embodiment, a movable frame is fixedly installed on the upper end of the operating table, and the welding platform is slidably installed above the end face of the movable frame. A second lead screw for controlling the movement of the welding platform is installed inside the upper end of the movable frame.

[0008] In a further embodiment, the outer wall of the soldering iron is fitted with a mounting bracket for fixing the smoke guide tube, and one end of the smoke guide tube is fixedly fitted onto the mounting bracket.

[0009] In a further embodiment, the mounting bracket includes two semicircular brackets, which are connected and clamped to the outer wall of the soldering iron by screws and nuts.

[0010] In a further embodiment, the smoke guide tube includes a mouthpiece, a clamping tube, and a conduit. One end of the smoke guide tube is clamped onto the mounting bracket, and one end of the clamping tube is rotatably connected to the smoke guide tube. The clamping tube and one end of the smoke guide tube are sealed together to form a hollow annular tube. The lower ends of the clamping tube and the smoke guide tube are provided with a smoke inlet. The two ends of the conduit tube are respectively connected to the smoke guide tube and the filter box.

[0011] In a further embodiment, the filter box includes a box body, filter plates and a sealing door, one end of a conduit is connected to the upper end of the box body, multiple filter plates are sequentially engaged inside the box body, and the sealing door is rotatably connected to the upper end of the box body.

[0012] In a further embodiment, an air pipe is fixedly connected to the lower end of the outer side wall of the box, the air pipe is connected to the interior of the box, and the other end of the air pipe is used to connect to an air pump.

[0013] In a further embodiment, a limiting frame for limiting the conduit is provided between the suction nozzle and the housing.

[0014] In a further embodiment, the limiting frame includes a first link, a second link, and a third link. The two ends of the second link are rotatably connected to the first link and the third link, respectively. The suction nozzle is fixedly inserted into one end of the first link, and one end of the third link is rotatably connected to the outer wall of the box. The upper ends of the first link, the second link, and the third link are all fixedly equipped with retaining rings for fixing the guide tube.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention is an automatic welding device for integrated circuit chip processing. By setting a smoke guide tube that is directly fixed to the soldering iron and moves synchronously with it, and a high-efficiency filter box that is connected to the smoke guide tube and fixed to the operating table, a purification system that starts and stops synchronously with the welding operation and captures the smoke at the source is constructed. This solves the core problems of existing fixed smoke extraction units, such as the collection delay caused by their fixed position and inability to move with the welding gun, the existence of smoke extraction dead zones, and the escape of a large amount of harmful smoke during the upward diffusion process, which pollutes the working environment. 2. By setting up a placement platform and a welding platform with mutually perpendicular directions of movement in the horizontal plane, a precise two-dimensional positioning system is formed together. In conjunction with a welding machine and soldering iron that can be slidably installed on the welding platform in the vertical direction, the welding gun can be accurately and flexibly positioned and reliably approached relative to the chip solder joints in three-dimensional space. This solves the problem that the soldering iron cannot fully cover all solder joints on the circuit board due to insufficient freedom of movement of the welding actuator, as well as the process stability problem of not being able to accurately control the welding pressure and contact posture. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 2 This invention proposes an automatic welding device for integrated circuit chip processing. Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram of the installation structure of the moving stage and placement platform of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 4 This is a schematic diagram of the welding machine and moving frame mounting structure of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 5 This is a schematic diagram of the welding platform and moving frame installation structure of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 6 This is a schematic diagram of the welding machine and welding platform installation structure of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 7This is an exploded view of the mounting bracket of an automatic welding device for integrated circuit chip processing proposed in this invention. Figure 8 This is a schematic diagram of the overall structure of the smoke guide tube of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 9 This is a schematic diagram of the overall structure of the limiting frame of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 10 This is a schematic diagram of the overall structure of the filter box of an automatic welding device for integrated circuit chip processing proposed in this invention; Figure 11 This is a cross-sectional view of the housing structure of an automatic welding device for integrated circuit chip processing proposed in this invention.

[0017] In the diagram: 1. Operating table; 11. Placement platform; 111. Moving table; 12. Welding platform; 121. Welding machine; 122. Soldering iron; 123. Moving frame; 2. Smoke guide pipe; 21. Suction nozzle; 22. Pipe clamp; 23. Guide tube; 3. Filter box; 31. Box body; 32. Filter plate; 33. Sealing door; 34. Air pipe; 4. Limiting frame; 41. Link 1; 42. Link 2; 43. Link 3; 44. Clamping ring; 5. Mounting frame; 51. Semicircular frame. Detailed Implementation

[0018] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figures 1-11 This embodiment provides an automatic welding apparatus for integrated circuit chip processing, including an operating table 1, which forms the base of the entire device. Its design fully considers stability and rigidity to ensure that no harmful vibrations occur during high-speed, precise movements. The upper surface of the operating table 1 is precision-machined to provide an accurate reference for the subsequent installation of moving parts. A placement platform 11 and a welding platform 12 are slidably mounted on this surface.

[0020] The upper part of the placement platform 11 is designed with standardized interfaces, which can flexibly install various fixing fixtures such as suction cups, pneumatic clamps, and mechanical clamps. The fixing fixtures are existing technologies and are not shown in the figure. The beneficial effect of this design is that it greatly enhances the versatility and adaptability of the equipment. Whether it is a thin and flexible circuit board or a thick copper-clad substrate, it can be firmly fixed in the predetermined position, providing a crucial prerequisite for high-precision welding and fundamentally avoiding welding defects caused by workpiece displacement. The moving directions of the soldering platform 12 and the placement platform 11 are perpendicular to each other in the horizontal plane. This arrangement together constitutes a two-dimensional motion system that can be precisely positioned in the horizontal plane. The core beneficial effect it brings is that, through the coordinated movement of the two platforms in mutually perpendicular directions, any point on the circuit board to be soldered can be moved precisely and efficiently to the working area below the soldering iron 122. This not only ensures that the soldering iron 122 can perform all-round, dead-angle soldering of integrated circuit chips through horizontal movement, eliminating blind spots, but more importantly, it provides a completely consistent motion reference and trajectory for the synchronous fume purification system fixed on the soldering iron 122, which will be described later. This allows the fume collection behavior to maintain a high degree of spatial consistency with the soldering operation, which is the structural basis for achieving efficient source purification.

[0021] In order to achieve precise movement of the placement platform 11, such as Figure 1 and Figure 3 As shown, a movable stage 111 is fixedly installed on the upper end of the operating table 1. The placement platform 11 is slidably mounted on the upper end of the movable stage 111 via a high-precision linear guide pair. The movable stage 111 internally encapsulates a first lead screw transmission mechanism for driving and controlling the movement of the placement platform 11. The first lead screw is driven by a servo motor and, in conjunction with a precision ball nut pair, provides the following significant benefits: it enables the placement platform 11 to move with micron-level precision and smoothness along the horizontal longitudinal direction, with minimal backlash and extremely high rigidity during transmission. This high standard of motion performance directly determines the accuracy of the welding point positioning, thus having a decisive impact on the final welding quality, such as the accuracy and consistency of the welding point position, effectively avoiding problems such as incomplete welding and misaligned welding caused by positioning errors.

[0022] Accordingly, in order to achieve precise movement of the welding platform 12, such as Figure 1 , Figure 4 and Figure 5As shown, a gantry-type movable frame 123 is fixedly installed on the upper end of the operating table 1. The welding platform 12 is slidably mounted above the vertical end face of the movable frame 123 via another set of linear guide rails. A second screw drive mechanism for driving and controlling the horizontal movement of the welding platform 12 is also installed inside the upper end of the movable frame 123. The beneficial effect of this structural layout is that it is spatially perpendicular to the first screw drive mechanism on the movable table 111, together forming a high-performance cross slide motion module. This allows the welding machine 121 and its soldering iron 122, ultimately mounted on the welding platform 12, to be quickly and accurately positioned at any coordinate point on the entire working plane, with smooth and interference-free motion trajectories, providing reliable mechanical assurance for the smooth execution of the automated welding process.

[0023] like Figure 4 and Figure 5 As shown, a welding machine 121 is slidably mounted on the end face of the welding platform 12 via a set of vertical linear guide rails. A gear is rotatably mounted on the end face of the welding platform 12, and the welding machine 121 has tooth grooves that match and mesh with the gear. The rotation of the gear drives the welding machine 121 to move vertically up and down. The key benefit of this vertical motion mechanism is that it enables controllable feeding and safe lifting of the soldering iron 122 in the vertical direction. During welding, it ensures that the soldering iron 122 reliably approaches and contacts the circuit board or chip pins placed on the platform 11 with constant pressure, forming a perfect solder joint. During welding intervals or when moving, it allows the soldering iron 122 to be safely lifted to a safe height, effectively avoiding accidental collisions with the workpiece, fixture, or platform. This function greatly improves the automation level and inherent safety of the equipment operation, reducing the risk of production interruptions and tool damage. The lower output shaft of the welding machine 121 is fixedly connected to a soldering iron 122 for performing welding operations. The temperature of the soldering iron 122 is precisely controlled in a closed loop by a temperature control system integrated inside the welding machine 121 to ensure the stability of welding quality.

[0024] When soldering integrated circuit chips, flux is used to remove the oxide layer and promote wetting. During the soldering process, the flux generates a mixture (fume) containing particulate matter and harmful gases. To accurately purify the fume, a highly efficient, reliable fume purification system without complex electrical control is installed on the upper part of the workbench 1. This system consists of three main modules: collection, conveying, and filtration. The core of the collection module is the fume guide tube 2. The intake end of the fume guide tube 2 is fixedly connected to the soldering iron 122 via a specially designed mounting bracket 5. The mounting bracket 5 is constructed as a metal tube frame structure, which firstly provides a robust mechanical fixation function. However, its deeper value lies in the fact that this metal structure mounting bracket 5 constructs an effective passive thermal isolation barrier between the flexible fume guide tube 2 and the soldering iron 122, which is continuously operating at high temperatures. The outstanding benefits of this thermal isolation design are that it can significantly block and dissipate the large amount of heat transferred from the soldering iron 122 to the smoke guide tube 2 through thermal radiation and thermal conduction. This reliably prevents the smoke guide tube 2 (usually made of polymer material) from softening, melting, deforming, or even releasing toxic gases due to long-term or instantaneous heating. This design greatly improves the reliability and durability of the entire smoke guide system in harsh thermal environments, essentially ensuring the long-term safe operation of the equipment and reducing maintenance costs and production stoppages caused by thermal damage to components.

[0025] Specifically, mounting bracket 5 is achieved through a clever clamping structure, such as... Figure 6 and Figure 7 As shown, it includes two symmetrical semicircular frames 51, which are fastened together by screws and nuts passing through the lugs, forming a complete ring structure that is firmly clamped to the outer wall of the soldering iron 122. The significant advantages of this split-type clamping structure are: its installation and disassembly are extremely convenient, allowing for quick addition or removal from the soldering iron 122, greatly facilitating equipment maintenance, replacement, and adaptive adjustments. Simultaneously, this structure provides a uniform and powerful radial clamping force, ensuring that no relative loosening or slippage occurs between the mounting bracket 5 and the soldering iron 122 during high-speed, high-acceleration movement of the equipment, guaranteeing the long-term stability of the relative position between the capture system and the soldering execution end.

[0026] The exhaust end of the smoke guide pipe 2 is connected to a filter box 3 fixed to the rear of the upper part of the operating table 1. The filter box 3 undertakes the crucial task of final purification of the harmful smoke drawn into the smoke guide pipe 2. The smoke guide pipe 2 itself is a composite piping system, such as... Figure 2 and Figure 8As shown, the smoke guide tube 2 specifically includes a suction nozzle 21, a clamping tube 22, and a guide tube 23. The suction end of the smoke guide tube 2 is engaged with the mounting bracket 5 via the clamping tube 22. The clamping tube 22 and the lower end of the smoke guide tube 2 have suction ports. One end of the clamping tube 22 is rotatably connected to the end of the smoke guide tube 2 via a bearing, and the clamping tube 22 and the end of the smoke guide tube 2 are sealed together by a sealing ring to form a hollow annular tube that can rotate relative to each other. The other side of the clamping tube 22 and the smoke guide tube 2 are connected by a screw and a nut. The suction nozzle 21 has a key functional Y-shaped structure (a combination of U and I structures), and its U-shaped end can form a hollow annular tube that tightly surrounds the soldering iron tip 122 together with the clamping tube 22. The revolutionary benefits of this annular suction nozzle design are that it can efficiently capture the fumes generated at the soldering point from all 360 degrees simultaneously using negative pressure. No matter what angle or direction the soldering iron 122 is facing, the fumes will be quickly captured and sucked in by this annular negative pressure field, which is always in the optimal position, the moment they are generated, before they have a chance to diffuse into the surrounding air. This achieves true source capture without dead angles or delays. Its capture efficiency is far higher than that of traditional side-suction, rear-suction, or fixed-position suction nozzles 21, reducing the possibility of harmful substances escaping into the working environment from the source.

[0027] The conduit 23 serves as a delivery module, with its two ends connected to the I-shaped end of the smoke guide pipe 2 and the upper inlet of the filter box 3 via quick connectors. Since the welding platform 12 and welding machine 121 are in continuous motion during automated production, the conduit 23 connected to them must also undergo frequent and complex oscillations. To prevent these oscillating conduits 23 from interfering with the normal chip welding operation's field of vision, or from becoming entangled, pulled, or even colliding with surrounding mechanical structures and cables, a limiting frame 4 is installed between the suction nozzle 21 and the box 31 for precise positioning and management of the conduit 23's movement trajectory.

[0028] The limit frame 4 is a precision mechanical guide mechanism, such as... Figure 2 and Figure 9As shown, the limiting frame 4 includes connecting rod 1 41, connecting rod 2 42, and connecting rod 3 43. The two ends of connecting rod 2 42 are rotatably connected to one end of connecting rod 1 41 and one end of connecting rod 3 43 via hinge shafts, thus forming a multi-joint robotic arm that can flexibly bend in a two-dimensional plane. The I-shaped end of the suction nozzle 21 is fixedly inserted into and locked to the end of connecting rod 1 41, while the base end of connecting rod 3 43 is rotatably connected to the outer wall of the housing 31 via a rotating shaft. The core beneficial effect of this multi-link hinge structure is that it provides a preset, controllable spatial motion path for the flexible and easily swaying conduit 23, completely conforming to the motion trajectory of the welding machine 121. It can perfectly follow the movement of the welding machine 121 in a two-dimensional plane and deform synchronously and smoothly, while strictly limiting the swing range of the conduit 23 within the safe area defined by the mechanical structure. This effectively and reliably prevents the conduit from interfering with the welding operation, scratching the workpiece, or becoming entangled with itself, greatly improving the stability, reliability, and safety of the entire automated system.

[0029] Furthermore, to address the potential bending of the conduit 23 at the joint of the limiting frame 4, this invention incorporates a meticulous design in the arrangement of the conduit 23: at each bend of the limiting frame 4, namely near the rotational connection points of connecting rod 1 41, connecting rod 2 42, and connecting rod 3 43, a specific length of excess length is reserved for the conduit 23. This seemingly simple yet crucial design provides the necessary buffer length and bending radius for the conduit 23 during the movement of the limiting frame 4, ensuring that the conduit 23 is not excessively stretched and generates internal stress under any extreme working posture, nor does it suffer sharp bends or dead ends due to excessively small bending radii. This maintains the smoothness and unobstructed flow of the internal channel, completely avoiding the problems of a sharp increase in flue gas flow resistance, a decrease in flow rate, or even complete blockage caused by localized bends in the pipeline, thus ensuring stable suction and continuous efficient operation of the purification system.

[0030] In addition, to ensure that catheter 23 can move neatly and stably with the limiting frame 4, such as Figure 2 and Figure 9 As shown, multiple retaining rings 44 for gripping and securing the conduit 23 are fixedly installed at intervals on the upper ends of connecting rods 41, 42, and 43. These retaining rings 44 typically employ a clamping structure with elastic padding. The beneficial effects of introducing retaining rings 44 are: to fix the flexible conduit 23 in an orderly and tight manner to the skeleton structure of the limiting frame 4, making its follow-up movement more regular and controllable, avoiding unnecessary shaking, swaying, or friction with the connecting rods due to the conduit's own weight, inertia, or internal airflow pulsation, thereby further improving the stability of the system's movement and extending the service life of the conduit 23.

[0031] like Figure 10 and Figure 11As shown, the filter box 3, serving as the purification terminal, includes a sealed housing 31, multiple filter plates 32, and an easily accessible sealing door 33. The end of the conduit 23 is connected to the air inlet at the top of the housing 31 via a sealing joint. Multiple filter plates 32 are sequentially and detachably secured inside the housing 31 via side guide rails. These filter plates 32 employ a gradient filtration principle, specifically filter discs with different mesh sizes or filtration accuracies; for example, from top to bottom, a pre-filter metal screen, a medium-efficiency glass fiber filter paper, and a high-efficiency filter cartridge can be sequentially arranged. The systematic benefits of this gradient filtration design are as follows: the upper primary filter plate 32 first intercepts and filters out larger particles of soot and welding slag spatter from the smoke, while the middle and lower high-efficiency filter plates 32 are responsible for capturing fine aerosols, metal oxide particles, and some oily substances. This graded filtration method, from coarse to fine, scientifically distributes the filtration load and maximizes the filtration efficiency of each filter plate 32. This not only significantly improves the overall filtration efficiency and the removal rate of ultrafine particles, but also avoids the rapid clogging of expensive high-efficiency filter media by large particles, thus significantly extending the service life of the entire filter plate 32 assembly and reducing the frequency of long-term consumable maintenance and overall operating costs. The sealing door 33 is connected to the front or top of the housing 31 by a hinge and is equipped with a reliable sealing strip and quick-lock mechanism. This design makes opening the housing 31 and replacing or cleaning the internal filter plates 32 extremely simple and quick, minimizing the time required for equipment maintenance.

[0032] To generate a stable negative pressure suction throughout the purification system, an air pipe 34 is fixedly connected to the lower end of the outer wall of the housing 31. The air pipe 34 is interconnected with the internal clean air chamber of the housing 31. The other end of the air pipe 34 is connected to an external air pump via a flange or hose. The air pump is existing technology and is not shown in the figure. The air pump is installed inside the operating table 1. The advantages of using the air pump as an external power source are: it can effectively isolate the vibration and noise generated by the air pump during operation, preventing them from being transmitted to the precision operating table 1 and affecting the welding accuracy and equipment life. At the same time, this modular design allows users to flexibly select the air pump according to the actual air volume and air pressure requirements, and facilitates independent maintenance and repair of the air pump, improving the maintainability of the system.

[0033] The working process of the device of this invention is as follows: At the start of automated soldering, the circuit board with the components mounted is first firmly fixed by the clamps on the placement platform 11. The control system, according to a preset program, drives the placement platform 11 and the soldering platform 12 to move in tandem, precisely moving the first soldering point directly below the soldering iron 122. Subsequently, the soldering machine 121 drives the soldering iron 122 downwards, contacting the solder pads and component leads for soldering. Almost simultaneously with the soldering iron 122 being energized or moving downwards, the external air pump starts. At the instant the soldering produces smoke, the annular suction port, tightly surrounding the soldering iron tip and consisting of a suction nozzle 21 and a clamping tube 22, immediately draws in the dense smoke under the stable negative pressure generated by the air pump. The harmful smoke is sequentially transported to the interior of the housing 31 through the smoke guide tube 2 and the conduit 23, where it undergoes gradient physical filtration through multiple layers of filter plates 32. Most of the harmful particles are trapped, and the finally purified clean air is discharged through the air pipe 34 and the air pump. Throughout the welding process, no matter how quickly the soldering iron 122 moves on the two-dimensional plane, the mounting bracket 5 ensures that the nozzle 21 remains absolutely synchronized with it, while the limiting bracket 4 ensures that the guide tube 23 always follows the movement in a safe and smooth trajectory. The entire purification process is seamlessly integrated with the welding operation, which is efficient and interference-free.

[0034] In summary, compared to existing independent, fixed, or complex welding fume purification devices that rely on sensors and electronic control systems for coordination, this invention employs a synchronous purification system based on purely physical principles and deeply mechanically coupled with the welding actuator. It achieves millisecond-level motion synchronization by directly fixing the annular suction nozzle 21 to the soldering iron 122 via an innovative mounting bracket 5. The multi-jointed limiting bracket 4 guides and constrains the movement trajectory of the conduit 23, fundamentally preventing mechanical interference. The annular suction nozzle 21 achieves 360-degree source capture without blind spots, and the gradient filtration design optimizes purification efficiency and filter lifespan. This invention successfully solves the common technical problems in existing technologies, such as delayed and blind spots in fume capture, the inability of the purification system to perfectly match the high-speed and precision movements of automated welding equipment, chaotic pipeline layout leading to interference, and poor system reliability and frequent maintenance due to high-temperature thermal damage and pipeline bending. It provides an efficient, reliable, durable, easy-to-maintain, and integrated solution that requires no additional intelligent control, making it particularly suitable for high-standard automated integrated circuit chip processing environments.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic welding device for integrated circuit chip processing, characterized in that, include: An operating table (1) is provided with a placement platform (11) and a welding platform (12) slidably mounted on its upper end. The placement platform (11) is used to place circuit boards. The moving directions of the placement platform (11) and the welding platform (12) are perpendicular to each other. A welding machine (121) is slidably mounted on the end face of the welding platform (12). An electric soldering iron (122) is fixedly connected to the lower end of the welding machine (121). A smoke guide tube (2) is attached to a soldering iron (122) at one end. A filter box (3) is fixedly connected to the upper end of the operating table (1). The other end of the smoke guide tube (2) is connected to the upper end of the filter box (3). The filter box (3) is used to filter the smoke drawn in by the smoke guide tube (2).

2. The automatic welding device for integrated circuit chip processing according to claim 1, characterized in that: A movable platform (111) is fixedly installed on the upper end of the operating table (1), and the placement platform (11) is slidably installed on the upper end of the movable platform (111). A first lead screw for controlling the movement of the placement platform (11) is installed inside the movable platform (111).

3. The automatic welding device for integrated circuit chip processing according to claim 2, characterized in that: The upper end of the operating table (1) is fixedly installed with a movable frame (123), and the welding platform (12) is slidably installed above the end face of the movable frame (123). A second lead screw for controlling the movement of the welding platform (12) is installed inside the upper end of the movable frame (123).

4. The automatic welding device for integrated circuit chip processing according to claim 3, characterized in that: The outer wall of the soldering iron (122) is fitted with a mounting bracket (5) for fixing the smoke guide tube (2), and one end of the smoke guide tube (2) is fixedly fitted onto the mounting bracket (5).

5. The automatic welding device for integrated circuit chip processing according to claim 4, characterized in that: The mounting bracket (5) includes two semicircular brackets (51), which are connected and clamped to the outer wall of the soldering iron (122) by screws and nuts.

6. The automatic welding device for integrated circuit chip processing according to claim 5, characterized in that: The smoke guide tube (2) includes a mouthpiece (21), a clamping tube (22) and a guide tube (23). One end of the smoke guide tube (2) is clamped on the mounting bracket (5). One end of the clamping tube (22) is rotatably connected to the smoke guide tube (2). The clamping tube (22) and one end of the smoke guide tube (2) are sealed together to form a hollow annular tube. The lower ends of the clamping tube (22) and the smoke guide tube (2) are provided with smoking ports. The two ends of the guide tube (23) are respectively connected to the smoke guide tube (2) and the filter box (3).

7. The automatic welding apparatus for integrated circuit chip processing according to claim 6, characterized in that: The filter box (3) includes a box body (31), filter plates (32) and a sealing door (33). One end of the conduit (23) is connected to the upper end of the box body (31). Multiple filter plates (32) are sequentially engaged inside the box body (31). The sealing door (33) is rotatably connected to the upper end of the box body (31).

8. The automatic welding apparatus for integrated circuit chip processing according to claim 7, characterized in that: An air pipe (34) is fixedly connected to the lower end of the outer wall of the box (31). The air pipe (34) is connected to the interior of the box (31), and the other end of the air pipe (34) is used to connect to an air pump.

9. An automatic welding apparatus for integrated circuit chip processing according to claim 8, characterized in that: A limiting frame (4) for limiting the conduit (23) is provided between the suction nozzle (21) and the housing (31).

10. An automatic welding apparatus for integrated circuit chip processing according to claim 9, characterized in that: The limiting frame (4) includes a first connecting rod (41), a second connecting rod (42), and a third connecting rod (43). The two ends of the second connecting rod (42) are rotatably connected to the first connecting rod (41) and the third connecting rod (43), respectively. The suction nozzle (21) is fixedly inserted into one end of the first connecting rod (41), and one end of the third connecting rod (43) is rotatably connected to the outer wall of the box (31). The upper ends of the first connecting rod (41), the second connecting rod (42), and the third connecting rod (43) are all fixedly equipped with retaining rings (44) for fixing the guide tube (23).

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