Method for manufacturing thermally protected polymer composite structure

Abstract

The present disclosure relates to a method for manufacturing a thermally protected polymer composite structure. A method for manufacturing a thermally protected polymer composite structure using a thermal barrier layer, the thermal barrier layer being porous and comprising a tool side surface and a non-tool side surface opposite the tool side surface, the method includes: curing an adhesive onto a non-tool-side surface of the thermal barrier layer to produce a coated thermal barrier layer including a coated surface; and co-bonding a polymer matrix composite to the coated surface of the coated thermal barrier layer.

Description

Technical Field

[0001] This disclosure relates to heat-protected polymer composite structures, and more specifically, to methods for manufacturing heat-protected polymer composite structures. Background Technology

[0002] Developing lightweight and cost-effective high-temperature resistant components (such as exhaust nozzles) is a significant challenge across industries including aerospace and automotive. Traditional metal components, while strong and heat-resistant, are not only heavy but also expensive to manufacture.

[0003] Polymer matrix composites (PMCs) offer a promising solution due to their ease of manufacture and low cost. However, their inherent limitations in high-temperature applications restrict their use in environments where thermal resistance is critical. To overcome this, incorporating thermal barrier layers can extend the operating temperature range of PMCs. Despite this potential, many existing thermal barriers are porous. While this porosity imparts thermal resistance to the barrier layer, it also complicates the manufacturing process. This complexity arises because the matrix of the PMC (e.g., epoxy resin) migrates into the pores of the thermal barrier layer during manufacturing, which reduces the heat resistance of the thermal barrier layer.

[0004] Therefore, those skilled in the art continue to conduct research and development in the field of thermally protected polymer composite structures. Summary of the Invention

[0005] A method for manufacturing heat-protected polymer composite structures is disclosed.

[0006] In one example, the disclosed method for manufacturing a thermally protected polymer composite structure utilizes a thermal barrier layer that is porous and includes a tool-side surface and a non-tool-side surface opposite to the tool-side surface, and the method includes: curing an adhesive to the non-tool-side surface of the thermal barrier layer to produce a coated thermal barrier layer having a coated surface; and co-bonding a polymer matrix composite to the coated surface of the coated thermal barrier layer.

[0007] In another example, a disclosed method for manufacturing a heat-protected polymer composite structure includes: positioning a thermal barrier material onto a working surface of a tool; curing the thermal barrier material on the tool to produce a thermal barrier layer, wherein the thermal barrier layer is porous and includes a tool-side surface and a non-tool-side surface opposite to the tool-side surface; curing an adhesive onto the non-tool-side surface of the thermal barrier layer to produce a coated thermal barrier layer, the coated thermal barrier layer including a tool-side surface and a coating surface opposite to the tool-side surface; and co-bonding a polymer matrix composite to the coating surface of the coated thermal barrier layer.

[0008] In yet another example, a disclosed method for manufacturing a heat-protected polymer composite structure includes: positioning a thermal barrier material onto a working surface of a tool, wherein the thermal barrier material comprises a thermal barrier reinforcing material and a thermal barrier matrix material, wherein the thermal barrier reinforcing material comprises at least one of glass, carbon, and quartz, and wherein the thermal barrier matrix material comprises a polyceramic resin; curing the thermal barrier material on the tool to produce a thermal barrier layer, wherein the thermal barrier layer is porous and comprises a tool-side surface and a non-tool-side surface opposite to the tool-side surface; curing an adhesive to the non-tool-side surface of the thermal barrier layer at a first curing holding temperature and then at a second curing holding temperature to produce a coated thermal barrier layer comprising a tool-side surface and a coating surface opposite to the tool-side surface, wherein the adhesive comprises at least one of polyimide and bismaleimide, wherein the second curing holding temperature is at least 20% higher than the first curing holding temperature; and co-bonding a polymer matrix composite to the coating surface of the coated thermal barrier layer, wherein the polymer matrix composite comprises a reinforcing material and a matrix material.

[0009] Other examples of the disclosed methods for manufacturing heat-protected polymer composite structures will become apparent from the following detailed description, accompanying drawings, and appended claims. Attached Figure Description

[0010] Figure 1A This is a flowchart illustrating an example of a disclosed method for manufacturing a heat-protected polymer composite structure;

[0011] Figure 1B This is a flowchart depicting another example of the disclosed method for manufacturing a heat-protected polymer composite structure;

[0012] Figure 2 It is a cross-sectional view of a heat-protected polymer composite material structure;

[0013] Figure 3 It is a cross-sectional view depicting the solidified thermal barrier material;

[0014] Figure 4A This is a cross-sectional view of a thermal barrier layer with reinforcing materials;

[0015] Figure 4B This is a cross-sectional view of the thermal barrier layer without reinforcement materials;

[0016] Figure 5A It is a cross-sectional view depicting the cured adhesive with a release layer;

[0017] Figure 5B This is a cross-sectional view of the coated thermal barrier layer;

[0018] Figure 6AIt is a cross-sectional view depicting a composite material of a thermal barrier layer and a polymer matrix co-bonded without the use of a second adhesive;

[0019] Figure 6B It is a cross-sectional view depicting a composite material of a thermal barrier layer and a polymer matrix co-bonded with a second adhesive;

[0020] Figure 7A This is a graph illustrating an example of a curing cycle with multiple curing holding temperatures and multiple curing holding pressures;

[0021] Figure 7B This is a graph illustrating an example of an adhesive curing cycle with multiple curing holding temperatures and multiple curing holding pressures;

[0022] Figure 7C This is a graph illustrating an example of co-bonding cycles with multiple co-bonding holding temperatures and multiple curing holding pressures;

[0023] Figure 8 This is a schematic diagram of an autoclave that encapsulates the various steps of the disclosed method;

[0024] Figure 9 It is a schematic diagram depicting possible migration directions;

[0025] Figure 10 It is a flowchart of aircraft production and maintenance methods; and

[0026] Figure 11 This is a schematic diagram of an airplane. Detailed Implementation

[0027] refer to Figure 1A , Figure 2 and Figure 3 An example of the disclosed method (generally designated as 1000) for manufacturing a heat-protected polymer composite structure includes: curing 1200 of an adhesive 2200 on a non-tool-side surface 4200 of a thermal barrier layer 2100 to produce a coated thermal barrier layer 5000 having a coated surface 5100 opposite to a coated surface 4200 of the thermal barrier layer 2100; and co-bonding 1300 of a polymer matrix composite 2300 to the coated surface 5100 of the coated thermal barrier layer 5000.

[0028] Another example of the disclosed method 1000 for manufacturing a heat-protected polymer composite structure 2000 (the method using a thermal barrier layer 2100, which is porous and has a tool-side surface 4100 and a non-tool-side surface 4200 opposite to the tool-side surface 4100) may include: sealing the non-tool-side surface 4200 of the thermal barrier layer 2100 with an adhesive 2200 to produce a coated thermal barrier layer 5000 having a coating surface 5100; and bonding a polymer matrix composite 2300 to the coating surface 5100 of the coated thermal barrier layer 5000.

[0029] like Figure 1B As shown, the disclosed method 1001 may further include a preparatory step, which includes, but is not limited to: positioning the thermal barrier material 3100 1050 onto the working surface 3400 of the tool 3050; and curing the thermal barrier material 3100 1100 to produce a thermal barrier layer.

[0030] Polymer matrix composites (PMCs) offer numerous advantages in the aerospace industry, including cost-effectiveness and ease of manufacture. However, their low tolerance to high-temperature environments limits their use in such conditions. One approach to overcome this limitation is to introduce a thermal barrier layer, which essentially mitigates heat transfer from the heat source to the PMC.

[0031] Those skilled in the art can select a suitable thermal diffusivity for the thermal barrier layer 2100. A suitable thermal diffusivity value can vary depending on the specific project. In one example, the thermal barrier layer 2100 may have a maximum thermal diffusivity of 0.0015 cm. 2 The thermal diffusivity is 0.0025 cm / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.0025 cm / sec. 2 The thermal diffusivity is 0.0035 cm / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.0035 cm / sec. 2 The thermal diffusivity is 0.0045 cm / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.0045 cm / sec. 2 The thermal diffusivity is 0.0075 cm / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.0075 cm / sec. 2 The thermal diffusivity is 0.0095 cm / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.0095 cm / sec. 2 The thermal diffusivity is 0.01 cm² / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.01 cm² / sec. In another example, the thermal barrier layer 2100 may have a thermal diffusivity of up to 0.02 cm² / sec. 2 Thermal diffusivity per second.

[0032] refer to Figure 2 and Figure 4AIn one example, the thermal barrier layer 2100 may include a thermal barrier reinforcing material 4300, a thermal barrier matrix material 4400, and pores 4500. Those skilled in the art can select a suitable thermal barrier reinforcing material 4300 and a suitable thermal barrier matrix material 4400 depending on the project. The thermal barrier reinforcing material 4300 can take various forms and can be made of various materials, including but not limited to carbon, quartz, glass, and aromatic polyamides. The thermal barrier matrix material 4400 can also vary and may include, but is not limited to, thermosetting resins, aerogels, etc. Thermosetting resins may include, but are not limited to, epoxy resins, polyceramic resins, etc. Aerogels may include, but are not limited to, carbon aerogels, alumina aerogels, etc. The combination of the thermal barrier reinforcing material 4300, the thermal barrier matrix material 4400, and the pores 4500 can provide the desired structural and mechanical properties of the thermal barrier layer 2100. Figure 4B In another example shown, thermal barrier layer 2100 may include thermal barrier matrix material 4400 and pores 4500, without any thermal barrier reinforcing material 4300. The combination of thermal barrier matrix material 4400 and pores 4500 can provide the desired structural and mechanical properties of thermal barrier layer 2100. Exemplary products available on the market may include, but are not limited to, the RM6001 “Firewalker” manufactured by Renegade Materials Corporation, located at 3363 South Technology Avenue, Miamisburg, Ohio (zip code 45342).

[0033] The porosity 4500 of the thermal barrier layer 2100 can be a key feature that enables the thermal barrier layer 2100 to provide heat resistance properties. In other words, it is desirable to maintain as many porosity 4500 as possible. The amount of porosity 4500 can be directly related to the thermal protection that the thermal barrier layer can provide.

[0034] Those skilled in the art can select an appropriate porosity value based on the thermal diffusivity required for a given project. In one example, thermal barrier layer 2100 may have a porosity of at least 1% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 5% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 10% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 20% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 30% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 40% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 50% by volume. In another example, thermal barrier layer 2100 may have a porosity of at least 60% by volume. In another example, the thermal barrier layer 2100 may have a porosity of at least 70% of its volume.

[0035] refer to Figure 1A , Figure 1B and Figure 3 The disclosed method 1001 can begin with an uncured thermal barrier material 3100, in which case additional steps may be required, including but not limited to: positioning 1050 on the working surface 3400 of the tool 3050 and curing 1100 prior to the curing 1200 and co-bonding 1300 steps of the disclosed method 1000. Figure 1B The method 1001 shown illustrates these additional steps, such as positioning 1050 and curing 1100, which are related to the disclosed method 1000. Figure 3 An example of a curing system 3000 for curing 1100 is shown.

[0036] refer to Figure 3 and Figure 4A Positioning 1050 and curing 1100 of the thermal barrier material 3100 can create a thermal barrier layer 2100. Those skilled in the art may choose to use a release layer 3500 between the thermal barrier material 3100 and the working surface 3400 of the tool 3050 before curing the thermal barrier material 3100 on the tool 3050. The release layer 3500 can be made of various materials, including but not limited to coatings based on fluoropolymers (e.g., polytetrafluoroethylene).

[0037] refer to Figure 3 and Figure 7A The curing of thermal barrier material 3100 can be performed at least partially in a vacuum environment. This vacuum environment can be achieved using a vacuum pump 3800 and a vacuum bag 3700, which encapsulates the release layer 3500 and the thermal barrier material 3100 assembly on the working surface 3400 of the tool 3050. In addition to the vacuum bag 3700, a release film 3600 can be positioned between the vacuum bag 3700 and the release layer 3500 and the thermal barrier material 3100 assembly on the working surface 3400 of the tool 3050. In one example, the vacuum environment can be maintained throughout the entire curing cycle 7010. In another example, the vacuum environment can be maintained only for a portion of the curing cycle 7010.

[0038] Still referencing Figure 3 and Figure 7A In one example, curing cycle 7010 may involve a curing holding temperature and a curing holding pressure. In another example, curing cycle 7010 may involve more than one curing holding temperature T. A1 T A2 and more than one curing holding pressure P A1 P A2 Those skilled in the art can select an appropriate number of curing holding temperatures and curing holding pressures, and a curing holding temperature T, based on a given project and its specifications.A1 T A2 and curing pressure P A1 P A2 The values ​​of curing holding temperature and curing holding pressure, and the curing holding time t A1 t A2 t A3 t A4 . refer to Figure 8 The temperature is controlled by autoclave 8100, which encapsulates at least a portion of the curing equipment 1100.

[0039] The initial curing stage parameters 7110 can be selected (which may include, but are not limited to, the first curing holding temperature T). A1 First curing holding time t A1 First curing holding pressure P A1 and the third curing holding time t A3 This process is used to achieve a certain degree of curing of the thermal barrier material 3100, followed by a second curing holding temperature T. A2 Second curing holding time t A2 Second curing holding pressure P A2 and the fourth curing holding time t A4 The subsequent curing stage 7120. In one example, the degree of curing at the end of the initial curing stage 7110 may be at least 1%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 5%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 10%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 20%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 30%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 40%. In another example, the degree of curing at the end of the initial curing stage 7110 may be at least 50%.

[0040] The parameters for the subsequent curing stage 7120 can be selected (which may include, but are not limited to, the second curing holding temperature T). A2 Second curing holding time t A2 Second curing holding pressure P A2 and the fourth curing holding time t A4The thermal barrier material 3100 is cured to a certain extent, followed by curing 1200 using the disclosed methods 1000 and 1001. At the end of curing cycle 7010, the required degree of curing for a given project can vary depending on the thermal barrier material 3100 used during curing 1100 to produce a processable and sealable thermal barrier layer 2100. To ensure that the thermal barrier layer 2100 is processable and sealable prior to curing 1200, it may require a degree of curing between approximately 20% and approximately 50%. If the provided thermal barrier material 3100 possesses the processable and sealable properties of the thermal barrier layer 2100, curing 1100 can be skipped entirely.

[0041] In one example, during curing cycle 7010 ( Figure 7A The degree of curing at the end of curing cycle 7010 can be at least 20%. In another example, the degree of curing at the end of curing cycle 7010 can be at least 30%. In another example, the degree of curing at the end of curing cycle 7010 can be at least 40%. In another example, the degree of curing at the end of curing cycle 7010 can be at least 50%. In another example, the degree of curing at the end of curing cycle 7010 can be at least 60%.

[0042] In one iteration of curing cycle 7010, which has multiple curing hold temperatures and multiple curing hold pressures, curing 1100 may involve two curing hold temperatures T. A1 T A2 Two curing holding pressures P A1 P A2 and curing holding time t A1 t A2 t A3 t A4 ,like Figure 7A As shown. In another iteration of curing cycle 7010 with multiple curing hold temperatures and multiple curing hold pressures, curing 1100 may involve two curing hold temperatures T. A1 T A2 A curing holding pressure P A1 and curing holding time t A1 t A2 t A3 In another iteration of curing cycle 7010, which has multiple curing hold temperatures and multiple curing hold pressures, curing 1100 may involve a single curing hold temperature T. A1 Two curing holding pressures P A1 P A2 and curing holding time t A1 t A3 t A4In another iteration of the curing cycle 7010, which has multiple curing hold temperatures and multiple curing hold pressures, more than two curing hold temperatures and more than two curing hold pressures may be further included.

[0043] refer to Figure 7A Second curing holding temperature T A2 It can be significantly higher than the first curing holding temperature T. A1 In one example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A 1. At least 10% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 20% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 30% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 40% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 50% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 60% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 80% higher. In another example, the second curing holding temperature T A2 Compared to the first curing holding temperature T A1 At least 100% higher.

[0044] Using multiple holding temperatures and multiple holding pressures during curing 1100 can be beneficial. Doing so can provide better retention of the pores 4500 after curing 1100. If the uncured thermal barrier material 3100 is exposed to high temperatures and high pressures from the outset without a lower temperature and lower pressure phase, it may cause the pores 4500 to collapse. This is undesirable because the pores 4500 provide the desired thermal protection properties of the thermal barrier layer 2100.

[0045] Still referencing Figure 7A By increasing to the second curing holding temperature T A2 Second curing holding pressure P A2 Previously, thermal barrier material 3100 was exposed to the first curing holding temperature T. A1 and the first curing pressure P A1The thermal barrier material 3100 has time to increase its viscosity and rigidity before being exposed to higher pressure, and without a certain amount of viscosity and rigidity, there is a possibility that the pores 4500 will collapse under higher pressure. The degree of curing before the second hold can be determined by someone skilled in the art based on the given project. Typically, the degree of curing is determined by several factors, including but not limited to temperature, pressure, the presence of vacuum, and the time of exposure to these conditions.

[0046] In one example, the first curing holding temperature T A1 It can be set to approximately 100°F. In another example, the first curing holding temperature T A1 It can be set to approximately 120°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 140°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 160°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 180°F. In another example, the first curing holding temperature T A1 It can be set to approximately 200°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 220°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 240°F. In another example, the first curing holding temperature T can be set to approximately 260°F. In another example, the first curing holding temperature T A1 It can be set to approximately 280°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 300°F. In another example, the first curing holding temperature T... A1 It can be set to approximately 350°F.

[0047] First curing and holding temperature T A1 The first curing holding time t can be maintained. A1 In one example, the first curing holding time t A1 It can be set to at least 10 minutes. In another example, the first curing hold time t A1 It can be set to at least 20 minutes. In another example, the first curing hold time t A1 It can be set to at least 30 minutes. In another example, the first curing hold time t A1 It can be set to at least 40 minutes. In another example, the first curing hold time t A1 It can be set to at least 50 minutes. In another example, the first curing hold time t A1 It can be set to at least 60 minutes. In another example, the first curing hold time t A1It can be set to at least 100 minutes. In another example, the first curing hold time t A1 It can be set to at least 150 minutes. In another example, the first curing hold time t A1 It can be set to at least 200 minutes.

[0048] In one example, the second curing holding temperature T A2 It can be set to approximately 200°F. In another example, the second curing holding temperature T A2 It can be set to at least 240°F. In another example, the second curing holding temperature T A2 It can be set to at least 260°F. In another example, the second curing holding temperature T A2 It can be set to at least 280°F. In another example, the second curing holding temperature T A2 It can be set to at least 300°F. In another example, the second curing holding temperature T A2 It can be set to at least 320°F. In another example, the second curing holding temperature T A2 It can be set to at least 340°F. In another example, the second curing holding temperature T A2 It can be set to at least 360°F. In another example, the second curing holding temperature T A2 It can be set to at least 380°F. In another example, the second curing holding temperature T A2 It can be set to at least 400°F. In another example, the second curing holding temperature T A2 It can be set to at least 420°F. In another example, the second curing holding temperature T A2 It can be set to at least 440°F. In another example, the second curing holding temperature T A2 It can be set to at least 460°F. In another example, the second curing holding temperature T A2 It can be set to at least 480°F. In another example, the second curing holding temperature T A2 It can be set to at least 500°F.

[0049] Second curing holding temperature T A2 The second curing holding time t can be maintained. A2 In one example, the second curing holding time t A2 It can be set to at least 30 minutes. In another example, the second curing hold time t A2 It can be set to at least 50 minutes. In another example, the second curing hold time t A2 It can be set to at least 70 minutes. In another example, the second curing hold time t A2It can be set to at least 90 minutes. In another example, the second curing hold time t A2 It can be set to at least 120 minutes. In another example, the second curing hold time t A2 It can be set to at least 150 minutes. In another example, the second curing hold time t A2 It can be set to at least 200 minutes. In another example, the second curing hold time t A2 It can be set to at least 240 minutes. When the holding time at the second curing temperature is t... A2 After the desired degree of curing is achieved, the second curing holding temperature t is maintained. A2 It can be reduced at a predetermined rate.

[0050] In one example, the first curing holding pressure P A1 It can remain relatively consistent throughout the entire curing cycle 7010 without increasing the second curing holding pressure P. A2 In another example, the first curing holding pressure P A1 It can be set to approximately 0 psig. In another example, the first curing holding pressure P A1 It can be set to at least 2 psig. In another example, the first cure holding pressure P A1 It can be set to at least 4 psig. In another example, the first cure holding pressure P A1 It can be set to at least 6 psig. In another example, the first cure holding pressure P A1 It can be set to at least 8 psig. In another example, the first cure holding pressure P A1 It can be set to at least 10 psig. In another example, the first cure holding pressure P A1 It can be set to at least 15 psig. In another example, the first cure holding pressure P A1 It can be set to at least 20 psig. In another example, the first curing holding pressure P A1 It can be set to at least 30 psig. In another example, the first cure holding pressure P A1 It can be set to at least 50 psig. First curing holding pressure P A1 The example can maintain the first curing pressure for a holding time t A3 First curing pressure holding time t A3 It can vary depending on the given project.

[0051] First curing pressure holding time t A3 After that, the first curing holding pressure P A1 The second curing holding pressure P can be increased at a predetermined rate. A2 In one example, the second curing holding pressure PA2 It can be set to at least 50 psig. In another example, the second curing holding pressure P A2 It can be set to at least 60 psig. In another example, the second curing holding pressure P A2 It can be set to at least 70 psig. In another example, the second curing holding pressure P A2 It can be set to at least 80 psig. In another example, the second curing holding pressure P A2 It can be set to at least 90 psig. In another example, the second curing holding pressure P A2 It can be set to at least 100 psig. In another example, the second curing holding pressure P A2 It can be set to at least 110 psig. In another example, the second curing holding pressure P A2 It can be set to at least 120 psig. In another example, the second curing holding pressure P A2 It can be set to at least 130 psig. In another example, the second curing holding pressure P A2 It can be set to at least 140 psig. In another example, the second curing holding pressure P A2 It can be set to at least 150 psig. Second curing holding pressure P A2 The example can maintain the second curing pressure holding time t A4 The second curing pressure holding time t A4 It can vary depending on the given project.

[0052] Still referencing Figure 7A Second curing pressure holding time t A4 It can begin at various points in curing cycle 7010. In one example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 20% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 30% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 40% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 50% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1It begins after at least approximately 60% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 70% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 80% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 It begins after at least approximately 90% has passed. In another example, the second curing pressure holding time t A4 The curing temperature can be maintained for a time t. A1 At least about 99% of it has passed since then.

[0053] Return to reference Figure 2 Introducing the thermal barrier layer 2100 onto the polymer matrix composite 2300 may pose challenges during co-bonding 1300. This is because the prepreg properties of the polymer matrix composite 2300 allow its matrix material 2310 to migrate from the polymer matrix composite 2300 during co-bonding 1300. Figure 9 To ensure proper bonding, co-bonding the thermal barrier layer 2100 to the polymer matrix composite 2300 may require significant high temperature and high pressure. These high temperature and high pressure conditions may lead to increased migration of the matrix material 9100.

[0054] The polymer matrix composite 2300 may include various combinations of matrix material 2310 and reinforcing material 2320. In one example, matrix material 2310 may be (or may include) various types of thermosetting resins, including but not limited to epoxy resins, cyanate esters, polyimides, and bismaleimides. Reinforcing material 2320 may be carbon fiber or any other material that can provide the desired properties to polymer matrix composite 2300. In the current example, co-bonding thermal barrier layer 2100 1300 to polymer matrix composite 2300 may cause bismaleimide resin to migrate 9100 from polymer matrix composite 2300 to thermal barrier layer 2100, such as... Figure 9 As shown. This migration 9100 can reduce the porosity 4500 of the thermal barrier layer 2100 by filling the pores 4500.

[0055] The migration 9100 that may occur during co-bonding 1300 is likely caused by the combination of the viscous properties of the prepreg matrix material 2310 with high temperature and high pressure. Therefore, those skilled in the art would desire incorporation conditions to minimize this migration 9100. Figure 2 , Figure 6A and Figure 6B As shown, one of the conditions for minimizing this migration is by implementing an adhesive 2200, which acts as a barrier between the thermal barrier layer 2100 and the polymer matrix composite 2300. In addition to acting as a barrier to minimize migration 9100, the adhesive 2200 can also act as an adhesive that provides substantial bonding between the thermal barrier layer 2100 and the polymer matrix composite 2300.

[0056] Adhesive 2200 can at least partially seal the non-tooling side surface 4200 of thermal barrier layer 2100. The introduction of adhesive 2200 can provide a significant reduction in the migration 9100 of the matrix material 2310 of the polymer matrix composite 2300 compared to co-bonding thermal barrier layer 2100 to polymer matrix composite 2300 without adhesive 2200. In one example, adhesive 2200 can reduce migration 9100 by at least 10%. In another example, adhesive 2200 can reduce migration 9100 by at least 20%. In another example, adhesive 2200 can reduce migration 9100 by at least 30%. In another example, adhesive 2200 can reduce migration 9100 by at least 40%. In another example, adhesive 2200 can reduce migration 9100 by at least 50%. In another example, adhesive 2200 can reduce migration 9100 by at least 60%. In another example, adhesive 2200 can reduce migration 9100 by at least 70%. In another example, adhesive 2200 can reduce migration 9100 by at least 80%. In another example, adhesive 2200 can reduce migration 9100 by at least 90%. In another example, adhesive 2200 can reduce migration 9100 by at least 95%. In another example, adhesive 2200 can reduce migration 9100 by approximately 99%.

[0057] In order to protect the thermal barrier layer 2100 from the effects of migration 9100, it is desirable to cure the adhesive 2200 onto the thermal barrier layer 2100 before co-bonding the polymer matrix composite 2300 onto the thermal barrier layer 2100. Figure 5A An example of curing 1200 is shown in the image. Figure 5A As shown and similar to curing 1100, those skilled in the art may choose to use a release layer 3500 between the thermal barrier material 3100 and the working surface 3400 of the tool 3050 to more easily peel off the coated thermal barrier layer 5000 after curing 1200. Figure 5B The release layer 3500 can be made of various materials, including but not limited to a fluoropolymer (e.g., polytetrafluoroethylene) coating. Any material that can be more easily peeled off after curing 1200 to provide a thermal barrier layer 5000 can be used as the release layer 3500.

[0058] refer to Figure 5A and Figure 7B The curing of adhesive 2200 onto thermal barrier layer 2100 can be performed, at least partially, in a vacuum environment. This vacuum environment can be achieved using a vacuum pump 3800 and a vacuum bag 3700, which encapsulates the components of release layer 3500, thermal barrier material 3100, and adhesive 2200 on the working surface 3400 of tool 3050. In addition to the vacuum bag 3700, a release film 3600 can be positioned between the vacuum bag 3700 and the components of release layer 3500, thermal barrier material 3100, and adhesive 2200. In one example, the vacuum environment can be maintained throughout the entire adhesive curing cycle 7020. In another example, the first adhesive curing pressure can be maintained for a time t. B3 The vacuum is released at the beginning. In another example, the first adhesive curing pressure can be maintained for a time t. B3 The vacuum is released after at least approximately 1% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 At least approximately 5% of the pressure has passed before the vacuum is released. In another example, the vacuum can be released after the first adhesive curing pressure has been maintained for a certain period of time. B3 The vacuum is released after at least approximately 10% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 At least approximately 20% of the pressure has passed before the vacuum is released. In another example, the vacuum can be released after the first adhesive curing pressure has been maintained for a certain period of time. B3 The vacuum is released after at least approximately 30% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 At least approximately 40% of the pressure has passed before the vacuum is released. In another example, the vacuum can be released after the first adhesive curing pressure has been maintained for a certain period of time. B3 The vacuum is released after at least approximately 50% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 The vacuum is released after at least approximately 60% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 The vacuum is released after at least approximately 80% has passed. In another example, the first adhesive curing pressure can be maintained for a duration of t. B3 At least about 99% of it passes through the vacuum after which it is discharged.

[0059] In another example, the vacuum environment may be maintained only for a portion of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 5% of the duration of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 10% of the duration of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 20% of the duration of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 30% of the duration of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 40% of the duration of the adhesive curing cycle 7020. In another example, the vacuum may be maintained for less than 50% of the duration of the adhesive curing cycle 7020.

[0060] In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 50%. In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 60%. In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 70%. In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 80%. In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 90%. In another example, the vacuum can maintain the duration of adhesive curing cycle 7020 for at least 95%.

[0061] Adhesive 2200 may be provided in various forms, including but not limited to film adhesives applied to thermal barrier layer 2100 prior to curing 1200. Adhesive 2200 may be made from various thermosetting resins, including but not limited to epoxy resins, cyanate esters, polyimides, and bismaleimides. An example of film adhesive 2200 used in the disclosed method is FM450-1, which is commercially available from Synesqo, headquartered at 98 Rue de Rocket, Brussels, Belgium (postcode 1130). The conditions for curing adhesive 2200 1200 onto thermal barrier layer 2100 to produce coated thermal barrier layer 5000 can vary depending on the thermosetting resin used as adhesive 2200. Those skilled in the art can select suitable materials and curing conditions according to a given project. Factors that can affect the curing conditions 1200 may include, but are not limited to, temperature, pressure, the presence of vacuum, and exposure time.

[0062] By subjecting adhesive 2200 to curing temperature T during adhesive curing cycle 7020. Figure 7B ) and curing pressure P ( Figure 7B Those skilled in the art can create barriers that minimize migration 9100. (See reference...) Figure 5A and Figure 7BIn one example, the adhesive curing cycle 7020 may involve an adhesive curing holding temperature and an adhesive curing holding pressure. In another example, the adhesive curing cycle 7020 may involve more than one adhesive curing holding temperature T. B1 T B2 And more than one adhesive cures to maintain pressure P B1 P B2 Those skilled in the art can select appropriate amounts of adhesive curing holding temperature and adhesive curing holding pressure, and adhesive curing holding temperature T, based on a given project and its specifications. B1 T B2 and adhesive curing maintain pressure P B1 P B2 The values ​​of adhesive curing holding temperature and adhesive curing holding pressure, and the adhesive curing holding time t B1 t B2 t B3 t B4 . refer to Figure 8 The temperature is controlled by autoclave 8100, which encapsulates at least a portion of the curing equipment 1200.

[0063] Still referencing Figure 7B The initial adhesive curing stage value 7210 can be selected (which may include, but is not limited to, the first adhesive curing holding temperature T). B1 First adhesive curing temperature holding time t B1 First adhesive curing and holding pressure P B1 First adhesive curing pressure holding time t B3 This process is used to achieve a certain degree of curing of the thermal barrier layer 2100 and the adhesive 2200, followed by a second adhesive curing holding temperature T. B2 Second adhesive curing temperature holding time t B2 Second adhesive curing and holding pressure P B2 Second adhesive curing pressure holding time t B4The subsequent adhesive curing stage 7220. In one example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 1%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 5%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 10%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 20%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 30%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 40%. In another example, the degree of curing at the end of the initial adhesive curing stage 7210 may be at least 50%.

[0064] In another example, the first adhesive cures at a holding temperature T. B1 and the first adhesive curing temperature holding time t B1 This is sufficient to achieve at least 10% curing. In another example, the first adhesive curing temperature is maintained at T. B1 and the first adhesive curing temperature holding time t B1 This is sufficient to achieve at least 20% curing. In another example, the first adhesive cures at a holding temperature T. B1 and the first adhesive curing temperature holding time t B1 This is sufficient to achieve at least 30% curing. In another example, the first adhesive curing temperature is maintained at T. B1 and the first adhesive curing temperature holding time t B1 This is sufficient to achieve at least 40% curing. In another example, the first adhesive curing temperature is maintained at T. B1 and the first adhesive curing temperature holding time t B1 This is sufficient to achieve at least 50% curing.

[0065] The 7220 value can be selected for the subsequent adhesive curing stage (which may include, but is not limited to, the second adhesive curing holding temperature T). B2 Second adhesive curing time t B2 Second adhesive curing and holding pressure P B2 and the fourth adhesive curing time t A4 The thermal barrier layer 2100 and adhesive 2200 are cured to a certain extent, followed by co-bonding 1300 of the disclosed methods 1000 and 1001. At the end of the adhesive curing cycle 7020, the required degree of curing for a given project can vary depending on many factors. At the end of the adhesive curing cycle 7020, the applied thermal barrier layer 5000 may need to be cured to a degree of curing between approximately 75% and approximately 99%.

[0066] In one example, at the end of the subsequent adhesive curing stage 7220, the thermal barrier layer 5000 may have at least 65% curing. In another example, at the end of the subsequent adhesive curing cycle, the thermal barrier layer 5000 may have at least 75% curing. In another example, at the end of the subsequent adhesive curing cycle, the thermal barrier layer 5000 may have at least 85% curing. In yet another example, at the end of the subsequent adhesive curing cycle, the thermal barrier layer 5000 may have at least 95% curing.

[0067] In another example, the second adhesive cures at a holding temperature T. B2 Second adhesive curing temperature holding time t B2 This is sufficient to achieve at least 50% curing. In another example, the second adhesive cures at a holding temperature T. B2 Second adhesive curing temperature holding time t B2 This is sufficient to achieve at least 60% curing. In another example, the second adhesive cures at a holding temperature T. B2 Second adhesive curing temperature holding time t B2 This is sufficient to achieve at least 70% curing. In another example, the second adhesive cures at a holding temperature T. B2 Second adhesive curing temperature holding time t B2 This is sufficient to achieve at least 80% curing. In another example, the second adhesive cures at a holding temperature T. B2 The second adhesive's curing temperature holding time tB2 is sufficient to achieve at least 90% curing. In another example, the second adhesive's curing temperature holding time T... B2 Second adhesive curing temperature holding time t B2 This is sufficient to achieve approximately 99% curing.

[0068] Adhesive curing cycles 7020 (with multiple adhesive curing holding temperatures and multiple adhesive curing holding pressures) Figure 7B In one iteration, curing 1200 can involve two adhesive curing holding temperatures T. B1 T B2 The two adhesives cure and maintain pressure P B1 P B2 and adhesive curing time t B1 t B2 t B3 t B4 ,like Figure 7B As shown. In another iteration of adhesive curing cycle 7020, curing 1200 can involve two adhesive curing holding temperatures T. B1 T B2 One adhesive cures and maintains pressure P B1and adhesive curing time t A1 t A2 t A3 In another iteration of the adhesive curing cycle 7020, curing 1200 can involve an adhesive curing holding temperature T. B1 The two adhesives cure and maintain pressure P B1 P B2 and adhesive curing time t B1 t B3 t B4 In another iteration of the adhesive curing cycle 7020, which has multiple curing hold temperatures and multiple curing hold pressures, more than two adhesive curing hold temperatures, more than two adhesive curing hold pressures, and a corresponding hold time for each hold temperature and hold pressure may be further included.

[0069] refer to Figure 7B Importantly, it should be noted that the second adhesive should be kept at a curing temperature of T. B2 It can be significantly higher than the first adhesive curing and holding temperature T. B1 In one example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 10% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 20% higher. In another example, the second adhesive cures at a temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 30% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 40% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 50% higher. In another example, the second adhesive cures at a temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 60% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 70% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 80% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive.B1 At least 90% higher. In another example, the second adhesive cures at a holding temperature T. B2 It can maintain a curing temperature T higher than the first adhesive. B1 At least 99%.

[0070] One advantage of using multiple holding temperatures and multiple holding pressures during curing at 1200°C is that it can provide better porosity retention after curing at 1200°C (4500°C). [Reference] Figure 5A If component 5050 is exposed to higher temperatures and higher pressures from the outset without a lower temperature and lower pressure phase, it may force adhesive 2200 to migrate to 9100. Figure 9 This could lead to the pores 4500 of the thermal barrier layer 2100 or cause the pores 4500 themselves to collapse. This is undesirable because the pores 4500 provide the desired thermal protection properties of the thermal barrier layer 2100.

[0071] Still referencing Figure 7B By increasing the curing temperature T of the second adhesive B2 Second adhesive curing pressure P B2 Previously, component 5050 was exposed to the first adhesive curing holding temperature T. B1 and the first adhesive cures under pressure P B1 The adhesive 2200 has time to increase its viscosity and stiffness before being exposed to higher pressure, wherein the increased viscosity and stiffness conditions can minimize migration 9100. The degree of curing of the adhesive 2200 before the second hold can be determined by a person skilled in the art based on a given project. Typically, the first adhesive curing hold temperature T B1 The degree of curing of the adhesive at the end is determined by several factors, including but not limited to temperature, pressure, the presence of vacuum, and the duration of exposure to these conditions.

[0072] In one example, the first adhesive cures at a holding temperature T. B1 It can be set to at least 100°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 150°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 200°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 220°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 240°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 260°F. In another example, the first adhesive curing holding temperature T B1It can be set to at least 280°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 300°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 320°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 340°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 360°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 380°F. In another example, the first adhesive curing holding temperature T B1 It can be set to at least 400°F.

[0073] First adhesive curing temperature T B1 The first adhesive can maintain its curing time t B1 In one example, the first adhesive curing temperature holding time t B1 It can be set to at least 10 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 20 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 40 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 60 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 80 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 100 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 120 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 140 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 160 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 180 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 200 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 250 minutes. In another example, the first adhesive curing temperature holding time t B1 It can be set to at least 300 minutes.

[0074] In one example, the second adhesive cures at a holding temperature T. B2 It can be set to at least 150°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 200°F. In another example, the second adhesive curing holding temperature T B2 It can be set to at least 250°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 300°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 320°F. In another example, the second adhesive curing holding temperature T B2 It can be set to at least 340°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 360°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 380°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 400°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 420°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 440°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 470°F. In another example, the second adhesive cure holding temperature T B2 It can be set to at least 500°F.

[0075] The second adhesive cures at a holding temperature T. B2 The second adhesive can maintain its curing time t B2 In one example, the second adhesive cure temperature holding time t B2 It can be set to at least 1 hour. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 2 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 3 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 4 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 5 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 6 hours. In another example, the second adhesive curing temperature holding time t B2It can be set to at least 7 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 8 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 9 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 10 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 11 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 12 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 13 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 14 hours. In another example, the second adhesive curing temperature holding time t B2 It can be set to at least 15 hours.

[0076] In one example, the first adhesive cure holding pressure P B1 It can remain relatively consistent throughout the entire adhesive curing cycle 7020 without increasing the second adhesive curing holding pressure P. B2 In another example, the first adhesive cures under a pressure P. B1 It can be set to approximately 0 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 5 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 10 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 20 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 25 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 30 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 35 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 40 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 45 psig. In another example, the first adhesive cure holding pressure P B1 It can be set to at least 50 psig. First adhesive cure holding pressure P B1 The example can maintain the first adhesive curing pressure for a holding time tB3 The first adhesive curing pressure holding time t B3 It can vary depending on the given project.

[0077] Still referencing Figure 7B During the first adhesive curing pressure holding time t B3 After that, the first adhesive cured and maintained pressure P. B1 The second adhesive curing holding pressure P can be increased at a predetermined rate. B2 In one example, the second adhesive cures under a pressure P. B2 It can be set to at least 20 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 40 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 60 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 80 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 100 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 120 psig. In another example, the second adhesive cure holding pressure P B2 It can be set to at least 150 psig. Second adhesive curing holding pressure P B2 The example can maintain the second adhesive curing pressure holding time t B4 The second adhesive cure pressure holding time t B4 This can vary depending on the given project. In other words, as long as the curing pressure P reaches the second adhesive curing retention pressure P... B2 The second adhesive curing pressure holding time t B4 Let's begin.

[0078] Still referencing Figure 7B The second adhesive curing pressure holding time t B4 This can begin at various points in the adhesive curing cycle 7020. In one example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 20% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 30% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1It begins after at least approximately 40% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 50% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 60% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 70% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 80% has passed. In another example, the adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 90% has passed. In another example, the second adhesive curing pressure holding time t B4 The first adhesive can be held at the curing temperature for a time t B1 It begins after at least approximately 99% has passed. In another example, the second adhesive curing pressure holding time t B4 It can begin at any point after the first adhesive curing temperature holding time tA1 has elapsed.

[0079] Return to reference Figure 6A and Figure 6B After curing at 1200 (which can produce) Figure 5B Following the application of the thermal barrier layer 5000 (as shown), the next step may involve co-bonding the polymer matrix composite 2300 1300 to the coating surface 5100 of the thermal barrier layer 5000. Similar to the previous steps (which may include: curing the thermal barrier material 3100 1100; and curing the adhesive 2200 1200 to the thermal barrier layer 2100), an autoclave 8100 can be used to control the temperature aspects of the co-bonding environment 1300. Figure 7C The second adhesive 6200 can be placed between the polymer matrix composite 2300 and the coating surface 5100.

[0080] Even though the application of the thermal barrier layer 5000 to the polymer matrix composite 2300 through co-bonding 1300 may already involve the adhesive 2200 as a migration barrier, it is still desirable to exercise caution and take appropriate measures to minimize migration 9100 during co-bonding 1300. In other words, as with the previous steps (which may include, but are not limited to, curing 1100 and curing 1200), co-bonding 1300 may involve more than one holding temperature, more than one holding pressure, and holding time, such as co-bonding cycle 7030 ( Figure 7C As shown in the figure.

[0081] refer to Figure 6A , Figure 6B and Figure 7C The co-bonding of the thermal barrier layer 5000 to the polymer matrix composite 2300 can be performed, at least partially, in a vacuum environment. This vacuum environment can be achieved using a vacuum pump 3800 and a vacuum bag 3700, which encapsulates the components of the release layer 3500, thermal barrier material 3100, and adhesive 2200 on the working surface 3400 of the tool 3050. In addition to the vacuum bag 3700, a release film 3600 can be positioned between the vacuum bag 3700 and the components of the release layer 3500, thermal barrier layer 5000, second adhesive 6200, and polymer matrix composite 2300. In one example, the vacuum environment can be maintained throughout the entire co-bonding cycle 7030. In another example, the first co-bonding pressure can be maintained for a time t. C3 The vacuum is released approximately at the beginning. In another example, the first co-bonding pressure can be maintained for a time t. C3 At least about 1% of the vacuum is released after the first co-bonding pressure has passed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 5% of the vacuum is released after the first co-bonding pressure has elapsed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 10% of the vacuum is released after the first co-bonding pressure has elapsed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 20% of the vacuum is released after the first co-bonding pressure has passed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 30% of the vacuum is released after the first co-bonding pressure has passed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 40% of the vacuum is released after the first co-bonding pressure has passed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least approximately 50% of the vacuum is released after the first co-bonding pressure has passed. In another example, the vacuum can be released after the first co-bonding pressure holding time t. C3 At least about 60% of it will be discharged from the vacuum after it passes through.

[0082] In another example, the first co-bonding pressure holding time t can be...C3 At least about 80% of it will be discharged from the vacuum after it passes through.

[0083] In another example, the first co-bonding pressure holding time t can be... C3 At least about 99% of it passes through the vacuum after which it is discharged.

[0084] In another example, the vacuum environment may be maintained only for a portion of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 5% of the duration of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 10% of the duration of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 20% of the duration of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 30% of the duration of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 40% of the duration of the co-bonding cycle 7030. In another example, the vacuum may be maintained for less than 50% of the duration of the co-bonding cycle 7030.

[0085] In another example, the vacuum can be maintained for at least 50% of the duration of the co-bonding cycle 7030. In another example, the vacuum can be maintained for at least 60% of the duration of the co-bonding cycle 7030. In another example, the vacuum can be maintained for at least 70% of the duration of the co-bonding cycle 7030. In another example, the vacuum can be maintained for at least 80% of the duration of the co-bonding cycle 7030. In another example, the vacuum can be maintained for at least 90% of the duration of the co-bonding cycle 7030. In another example, the vacuum can be maintained for at least 95% of the duration of the co-bonding cycle 7030.

[0086] Still referencing Figure 6B The second adhesive 6200 can be provided in various forms, including but not limited to a film adhesive applied prior to the coated thermal barrier layer 5000 by co-bonding 1300. The second adhesive 6200 can include various thermosetting resins, including but not limited to epoxy resins, cyanate esters, polyimides, and bismaleimides. An example of the second adhesive 6200 used in the disclosed method is FM 450-1 of Synesqo, headquartered at 98 Rocket Street, Brussels, Belgium (postcode 1130). Co-bonding the second adhesive 6200 1300 to the coated thermal barrier layer 5000 produces a heat-protected polymer composite structure 2000. Figure 2 The conditions for co-bonding 1300 can vary depending on the thermosetting resin used as the second adhesive 6200. Those skilled in the art can select suitable materials and co-bonding 1300 conditions for a given project. Factors that can affect the conditions of co-bonding 1300 may include, but are not limited to, temperature, pressure, the presence of vacuum, and exposure time.

[0087] refer to Figure 6A , Figure 6B and Figure 7C In one example, the co-bonding cycle 7030 may involve a co-bonding holding temperature and a co-bonding holding pressure. In another example, the co-bonding cycle 7030 may involve more than one co-bonding holding temperature T. C1 T C2 Co-bonding pressure P of more than one C1 P C2 Those skilled in the art can select an appropriate number of co-bonding holding temperatures and co-bonding holding pressures based on a given project and its specifications. The co-bonding holding temperature T... C1 T C2 Co-bonding and retaining pressure P C1 P C2 The values ​​of co-bonding holding temperature and co-bonding holding pressure, and the co-bonding holding time t C1 t C2 t C3 t C4 .

[0088] It can be like Figure 10 The aircraft manufacturing and maintenance method 1103 shown and as follows Figure 11 Examples of this disclosure are described in the context of the aircraft 1102 shown. During pre-production, aircraft manufacturing and maintenance methods 1103 may include the specification and design 1104 of the aircraft 1102 and material procurement 1106. During production, the manufacturing of components / sub-assemblies of the aircraft 1102 and system integration 1110 are carried out. Thereafter, the aircraft 1102 may undergo certification and delivery 1112 for entry into service 1114. When put into service by the customer, the aircraft 1102 is scheduled for routine maintenance and repair 1116, which may also include modifications, reconfigurations, refurbishments, etc.

[0089] Each process in method 1103 may be performed or executed by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and major system subcontractors; a third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, etc.

[0090] like Figure 11As shown, an aircraft 1102 produced by example method 1103 may include an airframe 1118 having multiple systems 1120 and an interior 1122. Examples of the multiple systems 1120 may include one or more of a propulsion system 1124, an electrical system 1126, a hydraulic system 1128, and an environmental system 1130. Any number of other systems may be included.

[0091] The disclosed methods for manufacturing heat-protected polymer composite structures can be employed during any or more stages of aircraft manufacturing and maintenance method 1103. As an example, components or sub-assemblies corresponding to component / sub-assembly manufacturing 1108, system integration 1110, and / or maintenance and repair 1116 can be assembled using the disclosed methods for manufacturing heat-protected polymer composite structures. As another example, airframe 1118 can be constructed using the disclosed methods for manufacturing heat-protected polymer composite structures. Furthermore, one or more method examples can be utilized during component / sub-assembly manufacturing 1108 and / or system integration 1110, for example, by substantially accelerating the assembly of aircraft 1102 (such as airframe 1118 and / or interior 1122) or reducing its cost. Similarly, one or more method examples can be utilized during the service of aircraft 1102, for example, but not limited to maintenance and repair 1116.

[0092] Different examples of the disclosed methods for manufacturing heat-protected polymer composite structures include a variety of components, features, and functions. It should be understood that the various examples of the disclosed methods for manufacturing heat-protected polymer composite structures disclosed herein may include any components, features, and functions of any other example of the disclosed methods for manufacturing heat-protected polymer composite structures, and all such possibilities are intended to be within the scope of this disclosure.

[0093] The disclosed method for manufacturing heat-protected polymer composite structures is described in the context of aerospace vehicles. However, those skilled in the art will readily recognize that the disclosed method for manufacturing heat-protected polymer composite structures is applicable to a wide range of applications, and this disclosure is not limited to aerospace applications. For example, the disclosed method for manufacturing heat-protected polymer composite structures can be implemented in various types of transportation vehicles, including, for example, helicopters, passenger ships, automobiles, marine products (boats, motors, etc.). Non-transportation applications are also considered.

[0094] Although the disclosed methods for manufacturing heat-protected polymer composite structures are implemented in an aerospace environment, it is anticipated that these methods can be implemented in any industry according to applicable industry standards. Specific methods for manufacturing heat-protected polymer composite structures can be selected and customized based on the specific application.

[0095] Although various examples of the disclosed methods for manufacturing heat-protected polymer composite structures have been shown and described, modifications will occur to those skilled in the art upon reading the specification. This application includes such modifications and is limited only by the scope of the claims.

[0096] Examples of this disclosure may be described according to one or more of the following clauses.

[0097] 1. A method (1000) for manufacturing a thermally protected polymer composite structure (2000) using a thermal barrier layer (2100), said thermal barrier layer (2100) being porous and comprising a tool-side surface (4100) and a non-tool-side surface (4200) opposite said tool-side surface (4100), said method (1000) comprising:

[0098] The adhesive (2200) is cured (1200) onto the non-tooling side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000) including a coated surface (5100); and

[0099] The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000).

[0100] 2. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) comprises a thermal barrier reinforcing material (4300) and a thermal barrier matrix material (4400).

[0101] 3. The method (1000) according to Clause 2, wherein the thermal barrier reinforcing material (4300) comprises at least one of glass, carbon and quartz.

[0102] 4. The method (1000) according to Clause 2, wherein the thermal barrier matrix material (4400) comprises a polyceramic resin.

[0103] 5. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a porosity (4500) of at least 1% by volume.

[0104] 6. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a porosity (4500) of at least 10% by volume.

[0105] 7. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a porosity (4500) of at least 30% by volume.

[0106] 8. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a thickness of at most 0.0015 cm. 2 Thermal diffusivity per second.

[0107] 9. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a thickness of at most 0.0025 cm. 2 Thermal diffusivity per second.

[0108] 10. The method (1000) according to Clause 1, wherein the thermal barrier layer (2100) has a thickness of at most 0.0035 cm. 2 Thermal diffusivity per second.

[0109] 11. The method (1000) according to Clause 1, wherein the adhesive (2200) comprises a film adhesive.

[0110] 12. The method (1000) according to Clause 1, wherein the adhesive (2200) comprises bismaleimide.

[0111] 13. The method (1000) according to Clause 1, wherein curing (1200) the adhesive (2200) comprises: bagging the assembly (5050) including the adhesive (2200) and the thermal barrier layer (2100) on the tool (3050) with a vacuum bag (3700); and evacuating with a vacuum pump (3800).

[0112] 14. The method (1000) according to Clause 1, wherein curing (1200) of the adhesive (2200) is carried out under conditions that minimize the migration of the adhesive (2200) into the thermal barrier layer (2100).

[0113] 15. The method (1000) according to Clause 1, wherein the adhesive (2200) at least partially seals the non-tool side surface (4200) of the thermal barrier layer (2100).

[0114] 16. The method (1000) according to Clause 1, wherein curing (1200) of the adhesive (2200) comprises: subjecting the adhesive (2200) to a curing temperature (T) during an adhesive curing cycle (7020), the curing temperature (T) comprising: a first adhesive curing holding temperature (T) B1 ), Calculate the curing temperature holding time of the first adhesive (t) B1 ); followed by the second adhesive curing holding temperature (T B2 ), and calculate the curing temperature holding time of the second adhesive (t). B2 ), wherein the second adhesive cures at a temperature (T) B2 The temperature is significantly higher than the curing and holding temperature of the first adhesive (T). B1 ).

[0115] 17. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) compared to the curing and holding temperature of the first adhesive (T) B1 (At least 20% higher)

[0116] 18. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) compared to the curing and holding temperature of the first adhesive (T) B1 (At least 30% higher)

[0117] 19. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) compared to the curing and holding temperature of the first adhesive (T) B1 (At least 40% higher)

[0118] 20. The method (1000) according to Clause 16, wherein the first adhesive cures at a holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1 This is sufficient to achieve at least 10% curing.

[0119] 21. The method (1000) according to Clause 16, wherein the first adhesive cures at a holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1 This is sufficient to achieve at least 20% curing.

[0120] 22. The method (1000) according to Clause 16, wherein the first adhesive cures at a holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1This is sufficient to achieve at least 30% curing.

[0121] 23. The method (1000) according to Clause 16, wherein the first adhesive cures at a holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1 This is sufficient to achieve at least 40% curing.

[0122] 24. The method (1000) according to Clause 16, wherein the first adhesive cures at a holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1 This is sufficient to achieve a curing degree between 0% and 50%.

[0123] 25. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve at least 70% curing.

[0124] 26. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve at least 80% curing.

[0125] 27. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve at least 90% curing.

[0126] 28. The method (1000) according to Clause 16, wherein the second adhesive cures at a temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve at least 95% curing.

[0127] 29. The method (1000) according to Clause 16, wherein the second adhesive cures at a holding temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve a curing degree between 70% and 99%.

[0128] 30. The method (1000) according to Clause 16, wherein curing (1200) of the adhesive (2200) further comprises subjecting the adhesive (2200) to a curing pressure (P) during the adhesive curing cycle (7020), the curing pressure (P) comprising: a first adhesive curing holding pressure (P B1 ), calculate the first adhesive curing pressure holding time (t) B3 ); followed by the second adhesive curing holding pressure (P) B2 ), calculate the second adhesive curing pressure holding time (t) B4 ), wherein the second adhesive cure holding pressure (P) B2 The pressure is significantly greater than the curing holding pressure of the first adhesive (P). B1) .

[0129] 31. The method (1000) according to Clause 30, wherein the second adhesive cures under a pressure (P) B2 The first adhesive curing holding pressure (P) is the first adhesive curing holding pressure. B1 It is at least 5 times larger than 1.

[0130] 32. The method (1000) according to clause 30, wherein the second adhesive cures under a pressure (P) B2 The first adhesive curing holding pressure (P) is the first adhesive curing holding pressure. B1 It is at least 10 times larger than ...

[0131] 33. The method (1000) according to clause 30, wherein the second adhesive cures under a pressure (P) B2 The first adhesive curing holding pressure (P) is the first adhesive curing holding pressure. B1 It is at least 15 times larger than 1.

[0132] 34. The method (1000) according to clause 30, wherein the first adhesive cures under a pressure (P) B1 The value is between approximately 0 psig and 15 psig.

[0133] 35. The method (1000) according to Clause 30, wherein the first adhesive curing pressure holding time (t) B3 (The maximum duration is 240 minutes.)

[0134] 36. The method (1000) according to Clause 30, wherein the first adhesive curing pressure holding time (t) B3 It takes between approximately 0 minutes and 240 minutes.

[0135] 37. The method (1000) according to Clause 30, wherein the second adhesive cures under a pressure (P) B2The value is between approximately 30 psig and 110 psig.

[0136] 38. The method (1000) according to Clause 37, wherein the second adhesive curing pressure holding time (t) B4 (The time limit is at least 1 hour.)

[0137] 39. The method (1000) according to Clause 37, wherein the second adhesive curing pressure holding time (t) B4 It takes between approximately 1 hour and 10 hours.

[0138] 40. The method (1000) according to clause 30, wherein the curing pressure reaches the second adhesive curing retention pressure (P). B2 The second adhesive curing pressure holding time (t) B4 ) and then it begins.

[0139] 41. The method (1000) according to clause 40, wherein the second adhesive curing pressure holding time (tB4) is within the first adhesive curing temperature holding time (tB4). B1 At least about 25% of it has passed since then.

[0140] 42. The method (1000) according to Clause 41, wherein the curing temperature holding time of the second adhesive (t) B2 During the second adhesive curing pressure holding time (t) B4 (Start after)

[0141] 43. The method (1000) according to Clause 40, wherein the second adhesive curing pressure holding time (t) B4 ) During the first adhesive curing temperature holding time (t B1 At least about 50% of it has passed since then.

[0142] 44. The method (1000) according to Clause 40, wherein the second adhesive curing pressure holding time (t) B4 ) During the first adhesive curing temperature holding time (t B1 (It begins after the past.)

[0143] 45. The method (1000) according to Clause 1, wherein the curing (1200) of the adhesive (2200) is carried out in an autoclave (8100).

[0144] 46. ​​The method (1000) according to Clause 1, wherein the polymer matrix composite material (2300) comprises a reinforcing material (2320) and a matrix material (2310).

[0145] 47. The method (1000) according to Clause 46, wherein the adhesive (2200) significantly minimizes the migration (9100) of the matrix material (2310) of the polymer matrix composite (2300) into the coated thermal barrier layer (5000).

[0146] 48. The method (1000) according to Clause 1, wherein co-bonding (1300) the polymer matrix composite material (2300) to the coating surface (5100) comprises: placing a second adhesive (6200) between the polymer matrix composite material (2300) and the coating surface (5100).

[0147] 49. The method (1000) according to Clause 48, wherein the second adhesive (6200) comprises a film adhesive.

[0148] 50. The method (1000) according to Clause 48, wherein the second adhesive (6200) comprises bismaleimide.

[0149] 51. The method (1000) according to Clause 1, wherein co-bonding (1300) the polymer matrix composite material (2300) to the coated surface (5100) comprises: bagging (3700) the assembly (5060) comprising the polymer matrix composite material (2300) and the coated thermal barrier layer (5000) on the tool (3050); and evacuating the vacuum using a vacuum pump (3800).

[0150] 52. The method (1000) according to Clause 1, wherein the co-bonding (1300) of the polymer matrix composite (2300) is carried out in an autoclave (8100).

[0151] 53. A method (1000) for manufacturing a heat-protected polymer composite structure (2000), the method (1000) comprising:

[0152] Position (1050) thermal barrier material (3100) onto the working surface (3400) of tool (3050);

[0153] The thermal barrier material (3100) on the tool (3050) is cured (1100) to produce a thermal barrier layer (2100), wherein the thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100);

[0154] An adhesive (2200) is cured (1200) onto the non-tool-side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000), the coated thermal barrier layer (5000) comprising the tool-side surface (4100) and a coating surface (5100) opposite to the tool-side surface (4100); and

[0155] The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000).

[0156] 54. The method (1000) according to Clause 53, the method (1000) further comprising: positioning a release layer (3500) between the thermal barrier material (3100) and the working surface (3400) before curing (1100) the thermal barrier material (3100) on the tool (3050).

[0157] 55. The method (1000) according to clause 54, wherein the release layer (3500) comprises a fluoropolymer.

[0158] 56. The method (1000) according to Clause 53, wherein curing (1100) the thermal barrier material (3100) comprises: curing the thermal barrier material (3100) to achieve a curing degree of at least 30%.

[0159] 57. The method (1000) according to Clause 53, wherein curing (1100) the thermal barrier material (3100) comprises: curing the thermal barrier material (3100) to achieve a curing degree of at least 50%.

[0160] 58. The method (1000) according to Clause 53, wherein curing (1100) the thermal barrier material (3100) comprises: curing the thermal barrier material (3100) to achieve a curing degree of at least 70%.

[0161] 59. A method (1000) for manufacturing a heat-protected polymer composite structure (2000), the method (1000) comprising:

[0162] A thermal barrier material (3100) is positioned (1050) on the working surface (3400) of a tool (3050), wherein the thermal barrier material (3100) includes a thermal barrier reinforcing material (4300) and a thermal barrier matrix material (4400), wherein the thermal barrier reinforcing material (4300) includes at least one of glass, carbon and quartz, and wherein the thermal barrier matrix material (4400) includes a polyceramic resin;

[0163] The thermal barrier material (3100) on the tool (3050) is cured (1100) to produce a thermal barrier layer (2100), wherein the thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100);

[0164] First adhesive curing holding temperature (T) B1 Next is the second adhesive curing and holding temperature (T). B2 The adhesive (2200) is cured (1200) onto the non-tool side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000), the coated thermal barrier layer (5000) comprising the tool side surface (4100) and a coating surface (5100) opposite to the tool side surface (4100), wherein the adhesive (2200) comprises at least one of polyimide and bismaleimide, wherein the second adhesive cures at a holding temperature (T). B2 ) compared to the curing and holding temperature of the first adhesive (T) B1 ) at least 20% higher; and

[0165] The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000), wherein the polymer matrix composite material (2300) includes a reinforcing material (2320) and a matrix material (2310).

[0166] 60. A heat-protected polymer composite structure (2000), said polymer composite structure (2000) comprising:

[0167] A thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100);

[0168] An adhesive (2200) disposed on the non-tooling side surface (4200) of the thermal barrier layer (2100) to create a coated thermal barrier layer (5000) including a coated surface (5100); and

[0169] A polymer matrix composite material (2300) is disposed on the coating surface (5100) of the coated thermal barrier layer (5000).

[0170] 61. The heat-protected polymer composite structure (2000) according to Clause 60, wherein the adhesive (2200) is cured onto the non-tool-side surface (4200) of the thermal barrier layer (2100).

[0171] 62. The thermally protected polymer composite structure (2000) according to Clause 60, wherein the polymer matrix composite (2300) is co-bonded to the coating surface (5100) of the coated thermal barrier layer (5000).

[0172] 63. A method (1000) for manufacturing a thermally protected polymer composite structure (2000) using a thermal barrier layer (2100), said thermal barrier layer (2100) being porous and comprising a tool-side surface (4100) and a non-tool-side surface (4200) opposite said tool-side surface (4100), said method (1000) comprising:

[0173] The non-tooling side surface (4200) of the thermal barrier layer (2100) is sealed with an adhesive (2200) to produce a coated thermal barrier layer (5000) including a coated surface (5100); and

[0174] The polymer matrix composite material (2300) is bonded to the coating surface (5100) of the coated thermal barrier layer (5000).

Claims

1. A method (1000) for manufacturing a thermally protected polymer composite structure (2000) using a thermal barrier layer (2100), said thermal barrier layer (2100) being porous and comprising a tool-side surface (4100) and a non-tool-side surface (4200) opposite said tool-side surface (4100), said method (1000) comprising: The adhesive (2200) is cured (1200) onto the non-tooling side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000) including a coated surface (5100); and The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000).

2. The method (1000) according to claim 1, wherein, Curing (1200) the adhesive (2200) includes subjecting the adhesive (2200) to a curing temperature (T) during an adhesive curing cycle (7020), the curing temperature (T) including a first adhesive curing holding temperature (T). B1 ), and calculate the curing temperature holding time of the first adhesive (t). B1 ); followed by the second adhesive curing holding temperature (T B2 ), and calculate the curing temperature holding time of the second adhesive (t). B2 ), wherein the second adhesive cures at a temperature (T) B2 The curing temperature of the first adhesive is significantly greater than the holding temperature of the first adhesive (T). B1 ).

3. The method (1000) according to claim 2, wherein, The first adhesive curing holding temperature (T) B1 ) and the curing temperature holding time of the first adhesive (t) B1 This is sufficient to achieve a curing degree between 0% and 50%.

4. The method (1000) according to claim 2, wherein, The second adhesive curing holding temperature (T) B2 ) and the curing temperature holding time of the second adhesive (t) B2 This is sufficient to achieve a curing degree between 70% and 99%.

5. The method (1000) according to claim 2, wherein, The curing (1200) of the adhesive (2200) further includes subjecting the adhesive (2200) to a curing pressure (P) during the adhesive curing cycle (7020), the curing pressure (P) including a first adhesive curing holding pressure (P). B1 ), calculate the first adhesive curing pressure holding time (t) B3 ); followed by the second adhesive curing holding pressure (P) B2 ), calculate the second adhesive curing pressure holding time (t) B4 ), wherein the second adhesive cure holding pressure (P) B2 The pressure is significantly greater than the curing holding pressure of the first adhesive (P). B1 ).

6. The method (1000) according to claim 1, wherein, Co-bonding (1300) the polymer matrix composite material (2300) to the coating surface (5100) includes placing a second adhesive (6200) between the polymer matrix composite material (2300) and the coating surface (5100).

7. A method (1000) for manufacturing a heat-protected polymer composite structure (2000), the method (1000) comprising: Position (1050) thermal barrier material (3100) onto the working surface (3400) of tool (3050); The thermal barrier material (3100) on the tool (3050) is cured (1100) to produce a thermal barrier layer (2100), wherein the thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100); An adhesive (2200) is cured (1200) onto the non-tool-side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000), the coated thermal barrier layer (5000) comprising the tool-side surface (4100) and a coating surface (5100) opposite to the tool-side surface (4100); and The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000).

8. A method (1000) for manufacturing a heat-protected polymer composite structure (2000), the method (1000) comprising: A thermal barrier material (3100) is positioned (1050) on the working surface (3400) of a tool (3050), wherein the thermal barrier material (3100) includes a thermal barrier reinforcing material (4300) and a thermal barrier matrix material (4400), wherein the thermal barrier reinforcing material (4300) includes at least one of glass, carbon and quartz, and wherein the thermal barrier matrix material (4400) includes a polyceramic resin; The thermal barrier material (3100) on the tool (3050) is cured (1100) to produce a thermal barrier layer (2100), wherein the thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100); First adhesive curing holding temperature (T) B1 Next is the second adhesive curing and holding temperature (T). B2 The adhesive (2200) is cured (1200) onto the non-tool side surface (4200) of the thermal barrier layer (2100) to produce a coated thermal barrier layer (5000), the coated thermal barrier layer (5000) comprising the tool side surface (4100) and a coating surface (5100) opposite to the tool side surface (4100), wherein the adhesive (2200) comprises at least one of polyimide and bismaleimide, wherein the second adhesive cures at a holding temperature (T). B2 ) compared to the curing and holding temperature of the first adhesive (T) B1 It is at least 20% higher; and The polymer matrix composite material (2300) is co-bonded (1300) to the coating surface (5100) of the coated thermal barrier layer (5000), wherein the polymer matrix composite material (2300) includes a reinforcing material (2320) and a matrix material (2310).

9. A heat-protected polymer composite structure (2000), said polymer composite structure (2000) comprising: A thermal barrier layer (2100) is porous and includes a tool-side surface (4100) and a non-tool-side surface (4200) opposite to the tool-side surface (4100); An adhesive (2200) disposed on the non-tooling side surface (4200) of the thermal barrier layer (2100) to create a coated thermal barrier layer (5000) including a coated surface (5100); and A polymer matrix composite material (2300) is disposed on the coating surface (5100) of the coated thermal barrier layer (5000).

10. A method (1000) for manufacturing a thermally protected polymer composite structure (2000) using a thermal barrier layer (2100), said thermal barrier layer (2100) being porous and comprising a tool-side surface (4100) and a non-tool-side surface (4200) opposite said tool-side surface (4100), said method (1000) comprising: The non-tooling side surface (4200) of the thermal barrier layer (2100) is sealed with an adhesive (2200) to produce a coated thermal barrier layer (5000) including a coated surface (5100); and The polymer matrix composite material (2300) is bonded to the coating surface (5100) of the coated thermal barrier layer (5000).

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