Thermally protected polymer composites and related methods

Abstract

The present disclosure relates to thermally protected polymer composites and related methods. A polymer composite structure includes a polymer matrix composite and a thermal barrier layer coupled to the polymer matrix composite. The polymer composite structure is configured to resist transient temperature spikes in the polymer matrix composite.

Description

Technical Field

[0001] This disclosure generally relates to composite material structures, and more specifically to polymer matrix composite materials with an integral thermal barrier and related methods. Background Technology

[0002] In various aerospace applications, structures may be exposed to high temperatures during operation. Examples include the inner surface of turbine engine exhaust pipes, the outer surface of turbine engine bypass pipes, and the outer surface of turbine fan blades. Typically, such structures are made of metals or metal alloys capable of withstanding these high operating temperatures. However, metal structures are heavy and expensive to manufacture. High-temperature composite materials and ceramics have been developed as lighter alternatives. However, high-temperature resistant composite materials and ceramics are extremely expensive and may be difficult to process. Thermal insulation has been proposed as a cheaper solution. However, thermal insulation is parasitic and bulky. Active cooling has also been proposed as a solution. However, active cooling is expensive and complex. Therefore, those skilled in the art continue research and development work related to solving these problems. Summary of the Invention

[0003] Examples of polymer composite structures, methods for using thermally protective composite structures, and methods for manufacturing polymer composite structures resistant to transient temperature spikes are disclosed. The following is a non-exhaustive list of examples that may or may not be claimed under the subject matter of this disclosure.

[0004] In the example, the disclosed polymer composite structure includes a polymer matrix composite and a thermal barrier layer bonded to the polymer matrix composite. The polymer composite structure is configured to resist transient temperature spikes in the polymer matrix composite.

[0005] In the example, the disclosed thermal protection method includes the following steps: (1) providing a polymer matrix composite material; (2) forming a thermal barrier layer on at least a portion of the polymer matrix composite material; and (3) using the thermal barrier layer to resist transient temperature spikes in the polymer matrix composite material.

[0006] In the example, the disclosed manufacturing method includes the following steps: (1) forming a polymer matrix composite material; (2) forming a thermal barrier layer on at least a portion of the polymer matrix composite material; and (3) using the thermal barrier layer to provide resistance to transient temperature spikes in the polymer matrix composite material.

[0007] Other examples of polymer composite structures and methods will become apparent from the following detailed description, accompanying drawings, and appended claims. Attached Figure Description

[0008] Figure 1This is a schematic block diagram illustrating an example of a polymer composite material structure;

[0009] Figure 2 This is a flowchart illustrating an example of a method for thermally protecting polymer composite structures;

[0010] Figure 3 This is a flowchart illustrating an example of a method for fabricating polymer composite structures resistant to transient temperature spikes;

[0011] Figure 4 This is a schematic diagram of an example of a polymer composite material structure;

[0012] Figure 5 yes Figure 4 A schematic cross-sectional view of an example of a polymer composite material structure;

[0013] Figure 6 A flowchart illustrating examples of aircraft manufacturing and maintenance methods; and

[0014] Figure 7 This is a schematic block diagram of an example airplane. Detailed Implementation

[0015] Overall reference Figures 1 to 5 For example, this disclosure relates to a polymer composite structure 100, a method 1000 for thermally protecting the polymer composite structure 100, and a method 2000 for manufacturing a polymer composite structure 100 resistant to transient temperature spikes. Typically, examples of the polymer composite structure 100 can be used in various industries, such as aerospace, automotive, marine, civil engineering, and industrial processing machinery, due to its excellent mechanical and thermal properties, including a high strength-to-weight ratio, enhanced stiffness, improved durability, thermal stability, resistance to environmental degradation, and resistance to transient temperature spikes.

[0016] Examples of the disclosed polymer composite structure 100 include the application or inclusion of a thermal barrier on at least one side (e.g., the flow side) of a polymer matrix composite (PMC) structure (such as an exhaust duct or other structure that encounters high-temperature spikes during use). The thermal barrier is configured to limit the peak temperatures experienced by the PMC structure to an acceptable range. Therefore, the examples of the polymer composite structure 100 disclosed herein enable the application of PMCs beyond their typical useful environments.

[0017] refer to Figure 1In one or more examples, the polymer matrix composite (PMC) 102 includes any suitable material made of a polymer matrix (referred to herein as matrix material 116), which binds discontinuous (e.g., short or long) or continuous fibers (referred to herein as reinforcing material 118). The polymer matrix composite 102 may include or utilize matrix material 116 and reinforcing material 118 of any suitable type (e.g., component).

[0018] In one or more examples, the matrix material 116 is a carbon or graphite matrix (e.g., a carbon matrix composite). In one or more examples, the matrix material 116 is a bismaleimide (BMI) resin (e.g., a BMI fiber composite). In other examples, the matrix material 116 includes epoxy resins, polyether ketone ketone (PEKK), polyether ether ketone (PEEK), polyimide (PI), polyphenylene sulfide (PPS), and similar materials or combinations thereof. In various examples, the matrix material 116 is characterized by: low viscosity, enabling effective impregnation of the reinforcing material 118; and its high crosslinking density, which provides excellent heat and chemical resistance.

[0019] In one or more examples, reinforcing material 118 includes reinforcing fibers, such as any suitable PMC fibers, including but not limited to quartz, glass, aramid, carbon, etc. Reinforcing material 118 may include discontinuous (e.g., long and / or short) fibers, continuous fibers, or combinations thereof. The fibers of reinforcing material 118 may be arranged in a unidirectional, bidirectional, or multidirectional configuration and may optimize load-bearing capacity. The fiber architecture of reinforcing material 118 may include a braided pattern comprising a combination of warp and weft fibers, comprising unidirectional tape and / or wrinkle-free fabric, and / or the braided pattern enhances the in-plane and out-of-plane mechanical properties of the polymer composite structure 100. In various examples, the fiber architecture of reinforcing material 118 prevents delamination and improves impact resistance.

[0020] The polymer composite structure 100 is manufactured using any suitable composite manufacturing process, such as automated fiber placement (AFP), resin transfer molding (RTM), vacuum-assisted resin infusion (VARI), prepreg (“prepreg”) hand layup, etc. These processes ensure control over fiber arrangement, resin distribution, and curing parameters, resulting in a high-quality composite material with minimal defects. In various examples, the polymer composite structure 100 is manufactured by forming a composite laminate comprising multiple layers of reinforcing material 118 embedded in a matrix material 116.

[0021] Now for reference Figure 1 , Figure 4 and Figure 5The following is an example of a polymer composite structure 100 according to this disclosure. The polymer composite structure 100 includes a plurality of elements, features, and components. All elements, features, and / or components described or shown in one example are not required in that example. Some or all of the elements, features, and / or components described or shown in one example may be combined in various ways with other examples without needing to include other elements, features, and / or components described in those other examples, even if such combinations are not explicitly described or shown herein.

[0022] In one or more examples, the polymer composite structure 100 includes a polymer matrix composite 102 and a thermal barrier layer 104. The thermal barrier layer 104 is coupled to or otherwise disposed on at least a portion (e.g., at least one surface) of the polymer matrix composite 102. The thermal barrier layer 104 is configured to resist transient temperature spikes in the polymer matrix composite 102. In one or more examples, the thermal barrier layer 104 is configured to diffuse temporary high temperatures (e.g., a heat-diffusing layer).

[0023] For the purposes of this disclosure, a transient temperature spike refers to a rapid and / or temporary increase in temperature that occurs over a relatively short period of time. Example characteristics of a transient temperature spike include: rapid onset, where the temperature increase occurs rapidly, typically within seconds or minutes; short duration, where the elevated temperature does not persist for an extended period and typically returns to baseline levels relatively quickly; and / or high amplitude, where the spike can be significantly higher than the normal operating or ambient temperatures experienced by the structure or system. The effects of transient temperature spikes include thermal stress, where materials undergo thermal expansion and contraction, which can lead to mechanical stress and potential failure and / or reduced lifespan, where repeated exposure to transient temperature spikes can degrade materials and shorten their operational life.

[0024] In one or more examples, the polymer matrix composite 102 forms a first surface 106 of the polymer composite structure 100. A thermal barrier layer 104 forms a second surface 108 of the polymer composite structure 100 opposite to the first surface 106. In these examples, the thermal barrier layer 104 is located on one surface of the polymer matrix composite 102 and thus forms one surface of the polymer composite structure 100. However, in other examples, the thermal barrier layer 104 is located on more than one surface of the polymer matrix composite 102 and thus forms more than one surface of the polymer composite structure 100.

[0025] like Figure 4As shown, in one or more examples, the polymer composite structure 100 is an exhaust duct 110. In these examples, a polymer matrix composite 102 forms the outer surface 112 of the exhaust duct 110. A thermal barrier layer 104 forms the inner surface 114 of the exhaust duct 110. In these examples, the inner surface 114 of the exhaust duct 110 experiences a high-temperature internal flow environment. The outer surface 112 experiences a cooler external environment.

[0026] In other examples, the polymer composite structure 100 can be used in any application where the structure or component experiences a temperature gradient between two opposing surfaces (such as an inner surface and an outer surface), or in any application where the structure or component includes a flow surface that experiences a temperature gradient between two opposing surfaces (such as an inner surface and an outer surface). Examples include, but are not limited to, inlet pipes, bypass pipes, process flow pipes, rotor blades, high-speed airfoils, etc.

[0027] refer to Figure 1 Thermal barrier layer 104 comprises or is made of any suitable type of material 130. In one or more examples, thermal barrier layer 104 comprises polyimide material 132. In one or more examples, thermal barrier layer 104 comprises polyceramic material 133. In one or more examples, thermal barrier layer 104 comprises silicone material 134. In one or more examples, thermal barrier layer 104 comprises siloxane material 135. In one or more examples, thermal barrier layer 104 comprises aerogel material 136. In one or more examples, thermal barrier layer 104 comprises ceramic matrix composite material 137. In one or more examples, thermal barrier layer 104 comprises ceramic material 138. In one or more examples, thermal barrier layer 104 comprises at least one or a combination of polyimide material 132, polyceramic material 133, silicone material 134, siloxane material 135, aerogel material 136, ceramic matrix composite material 137, and ceramic material 138. Other suitable materials are also contemplated for use as thermal barrier layer 104.

[0028] In various examples, thermal barrier layer 104 is configured to resist transient temperature spikes experienced by the polymer matrix composite 102. This advantageous benefit can be achieved in a variety of ways. In one or more examples, thermal barrier layer 104 is configured to reduce the highest temperature received by the polymer matrix composite 102 through thermal barrier layer 104. In one or more examples, thermal barrier layer 104 is configured to reduce the rate of heat transfer through thermal barrier layer 104 to polymer matrix composite 102. In one or more examples, thermal barrier layer 104 is configured to distribute or diffuse heat received by polymer composite structure 100 in a direction at least substantially perpendicular to the normal of thermal barrier layer 104, for example, distributing heat received by second surface 108 in a direction at least substantially perpendicular to the normal of second surface 108.

[0029] refer to Figure 1 The thermal barrier layer 104 (e.g., material 130) has at least one example of property 140, which is selected to achieve desired resistance to transient temperature spikes. In one or more examples, property 140 is thermal diffusivity 142. In one or more examples, the thermal barrier layer 104 comprises less than about 0.0035 cm⁻¹ 2 The thermal diffusivity is 142 / s. In one or more examples, the thermal barrier layer 104 comprises less than about 0.0025 cm. 2 The thermal diffusivity is 142 / s. In one or more examples, the thermal barrier layer 104 comprises less than about 0.0015 cm. 2 Thermal diffusivity 142 / s.

[0030] In other examples, property 140 can be any of a variety of other material properties or characteristics that enhance the thermal barrier layer 104’s ability to resist instantaneous temperature spikes, including but not limited to reflectivity 144, emissivity 146, surface roughness 148, etc.

[0031] refer to Figure 1 The thermal barrier layer 104 includes a form 120, which is selected for application to or attachment to the surface of the polymer matrix composite 102. In one or more examples, the thermal barrier layer 104 includes a film 122 or takes the form of a film 122. In one or more examples, the thermal barrier layer 104 includes a coating 124 or takes the form of a coating 124. In one or more examples, the thermal barrier layer 104 includes a sheet 126 or takes the form of a sheet 126.

[0032] The thermal barrier layer 104 can be formed on, attached to, applied to, or otherwise integrated with the polymer matrix composite 102 using any suitable technique of various kinds. In one or more examples, the polymer matrix composite 102 and the thermal barrier layer 104 are co-cured. In one or more examples, the polymer matrix composite 102 and the thermal barrier layer 104 are co-bonded. In one or more examples, the polymer matrix composite 102 and the thermal barrier layer 104 are secondary bonded.

[0033] Now for reference Figure 1 and Figure 2 The following is an example of a method 1000 for a thermally protected polymer composite structure 100 according to this disclosure. Method 1000 includes multiple elements, steps, operations, or processes. All elements, steps, operations, or processes described or shown in one example are not required in that example. Some or all of the elements, steps, operations, or processes described or shown in one example may be combined in various ways with other examples without needing to include other elements, steps, operations, or processes described in those other examples, even if such combinations are not explicitly described or shown herein.

[0034] In one or more examples, method 1000 includes the following steps: providing a 1002 polymer matrix composite material 102. Method 1000 includes the following steps: forming a 1004 thermal barrier layer 104 on at least a portion of the polymer matrix composite material 102. Method 1000 includes the following steps: using the thermal barrier layer 104 to resist transient temperature spikes in the 1006 polymer matrix composite material 102.

[0035] In one or more examples, according to method 1000, the step of resisting the instantaneous temperature spike of 1006 includes the following steps: reducing the highest temperature received by the polymer matrix composite material 102 through the thermal barrier layer 104.

[0036] In one or more examples, according to method 1000, the step of resisting the instantaneous temperature spike of 1006 includes the step of reducing the rate of heat transfer through the thermal barrier layer 104 to the polymer matrix composite material 102.

[0037] In one or more examples, according to method 1000, the step of resisting the instantaneous temperature spike of 1006 includes the following steps: distributing the received heat in a direction at least substantially perpendicular to the normal of the thermal barrier layer 104, such as distributing the heat received by the second surface 108 in a direction at least substantially perpendicular to the normal of the second surface 108.

[0038] In one or more examples, according to method 1000, the step of forming thermal barrier layer 104 1004 includes the following steps: attaching thermal barrier layer 104 to polymer matrix composite material 102 such that polymer matrix composite material 102 forms a first surface 106 of polymer composite structure 100, and thermal barrier layer 104 forms a second surface 108 of polymer composite structure 100 opposite to the first surface 106. In other examples, the step of forming thermal barrier layer 104 1004 includes the following steps: attaching thermal barrier layer 104 to polymer matrix composite material 102 such that thermal barrier layer 104 forms the first surface 106 of polymer composite structure 100 and a second thermal barrier layer 154 forms the second surface 108, and polymer matrix composite material 102 is disposed between thermal barrier layer 104 and the second thermal barrier layer 154.

[0039] In one or more examples, according to method 1000, the step of forming thermal barrier layer 104 1004 includes the following steps: co-curing polymer matrix composite material 102 and thermal barrier layer 104.

[0040] In one or more examples, according to method 1000, the step of forming thermal barrier layer 104 1004 includes the step of co-bonding polymer matrix composite material 102 and thermal barrier layer 104.

[0041] In one or more examples, according to method 1000, the step of forming thermal barrier layer 104 1004 includes the following steps: secondary bonding of polymer matrix composite material 102 and thermal barrier layer 104.

[0042] In one or more examples, method 1000 includes the step of selecting thermal barrier layer 104 to include at least one of polyimide material 132, polyceramic material 133, silicone material 134, siloxane material 135, aerogel material 136, ceramic matrix composite material 137, and ceramic material 138.

[0043] In one or more examples, method 1000 includes the following steps: selecting a sample having a diameter less than approximately 0.0035 cm. 2 A thermal barrier layer 104 with a thermal diffusivity of 142 / s is included. In one or more examples, method 1000 includes the following step: selecting a thermal barrier layer 104 with a thermal diffusivity of less than about 0.0025 cm⁻¹. 2 A thermal barrier layer 104 with a thermal diffusivity of 142 / s is included. In one or more examples, method 1000 includes the following steps: selecting a thermal barrier layer 104 with a thermal diffusivity of less than about 0.0015 cm⁻¹. 2 Thermal diffusivity 142 / s, thermal barrier layer 104.

[0044] Now for reference Figure 1 and Figure 3The following is an example of a method 2000 for manufacturing a polymer composite structure 100 resistant to transient temperature spikes according to this disclosure. Method 2000 includes multiple elements, steps, operations, or processes. All elements, steps, operations, or processes described or shown in one example are not required in that example. Some or all of the elements, steps, operations, or processes described or shown in one example may be combined in various ways with other examples without needing to include other elements, steps, operations, or processes described in those other examples, even if such combinations are not explicitly described or shown herein.

[0045] In one or more examples, method 2000 includes the step of forming a 2002 polymer matrix composite material 102. Method 2000 includes the step of forming a 2004 thermal barrier layer 104 on at least a portion of the polymer matrix composite material 102. Method 1000 includes the step of using the thermal barrier layer 104 to provide 2006 resistance to transient temperature spikes in the polymer matrix composite material 102.

[0046] In one or more examples, according to method 2000, the step of providing resistance to transient temperature spikes includes the step of reducing the highest temperature received by the polymer matrix composite 102 through the thermal barrier layer 104.

[0047] In one or more examples, according to method 2000, the step of providing resistance to transient temperature spikes includes the step of reducing the rate of heat transfer through thermal barrier layer 104 to polymer matrix composite 102.

[0048] In one or more examples, according to method 2000, the step of providing 2006 resistance to instantaneous temperature spikes includes the following steps: distributing the received heat in a direction at least substantially perpendicular to the normal of the thermal barrier layer 104, such as distributing the heat received by the second surface 108 in a direction at least substantially perpendicular to the normal of the second surface 108.

[0049] In one or more examples, according to method 2000, the step of forming thermal barrier layer 104 104 includes the following steps: attaching thermal barrier layer 104 to polymer matrix composite material 102 such that polymer matrix composite material 102 forms a first surface 106 of polymer composite structure 100, and thermal barrier layer 104 forms a second surface 108 of polymer composite structure 100 opposite to the first surface 106. In other examples, the step of forming thermal barrier layer 104 104 includes the following steps: attaching thermal barrier layer 104 to polymer matrix composite material 102 such that thermal barrier layer 104 forms the first surface 106 of polymer composite structure 100 and a second thermal barrier layer 154 forms the second surface 108, and polymer matrix composite material 102 is disposed between thermal barrier layer 104 and the second thermal barrier layer 154.

[0050] In one or more examples, according to method 2000, the step of forming thermal barrier layer 104 2004 includes the following steps: co-curing polymer matrix composite material 102 and thermal barrier layer 104.

[0051] In one or more examples, according to method 2000, the step of forming thermal barrier layer 104 2004 includes the step of co-bonding polymer matrix composite material 102 and thermal barrier layer 104.

[0052] In one or more examples, according to method 2004, the step of forming thermal barrier layer 104 includes the following steps: secondary bonding of polymer matrix composite material 102 and thermal barrier layer 104.

[0053] In one or more examples, method 2000 includes the step of selecting thermal barrier layer 104 to include at least one of polyimide material 132, polyceramic material 133, silicone material 134, siloxane material 135, aerogel material 136, ceramic matrix composite material 137, and ceramic material 138.

[0054] In one or more examples, method 2000 includes the following steps: selecting a sample with a diameter less than approximately 0.0035 cm. 2 A thermal barrier layer 104 with a thermal diffusivity of 142 / s is included. In one or more examples, method 2000 includes the step of selecting a thermal barrier layer with a thermal diffusivity of less than about 0.0025 / s. 2 A thermal barrier layer 104 with a thermal diffusivity of 142 cm / s is included. In one or more examples, method 2000 includes the step of selecting a thermal barrier layer 104 with a thermal diffusivity of less than about 0.0015 cm / s. 2 Thermal diffusivity 142 / s, thermal barrier layer 104.

[0055] Now for reference Figure 6 and Figure 7The examples of polymer composite structure 100, method 1000, and / or method 2000 described herein can be compared with those of... Figure 6 The flowchart illustrates aerospace manufacturing and maintenance methods 1100 and such Figure 7 The aircraft 1200 is illustrated schematically and is used in relation to or in the context of the invention. As an example, the aircraft 1200 and / or the manufacturing and maintenance method 1100 may include examples of a polymer composite structure 100, a heat-protected polymer composite structure 100 according to method 1000, and / or a polymer composite structure 100 manufactured according to method 2000.

[0056] refer to Figure 7 The illustration shows an example of an aircraft 1200. Aircraft 1200 can be any aerospace vehicle or platform. In one or more examples, aircraft 1200 includes an airframe 1202 with an interior 1206. Aircraft 1200 includes multiple onboard systems 1204 (e.g., advanced systems). Examples of onboard systems 1204 of aircraft 1200 include a propulsion system 1208, a hydraulic system 1212, an electrical system 1210, and an environmental system 1214. In other examples, onboard systems 1204 also include one or more control systems coupled to the airframe 1202 of aircraft 1200. In other examples, onboard systems 1204 also include one or more other systems, such as, but not limited to, communication systems, avionics systems, software distribution systems, network communication systems, passenger information / entertainment systems, guidance systems, radar systems, weapon systems, etc. Aircraft 1200 may have any number of polymer composite structures (e.g., polymer composite structure 100) that are protected according to method 1000 and / or manufactured according to method 2000 and resistant to transient temperature spikes.

[0057] refer to Figure 6 During the pre-production phase of aircraft 1200, manufacturing and maintenance methods 1100 include the specification and design of aircraft 1200 1102 and material procurement 1104. During the production phase of aircraft 1200, the manufacturing of aircraft 1200 components and sub-assemblies 1106 and system integration 1108 are carried out. Subsequently, aircraft 1200 undergoes certification and delivery 1110 for service entry 1112. Routine maintenance and repair 1114 includes modification, reconfiguration, refurbishment, etc., of one or more systems of aircraft 1200.

[0058] Figure 6Each process of the manufacturing and maintenance method 1100 shown may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). For the purposes of this description, a system integrator may include, but is not limited to, any number of aircraft manufacturers and main system subcontractors; a third party may include, but is not limited to, any number of vendors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, etc.

[0059] Examples of the polymer composite material structure 100, method 1000, and / or method 2000 shown and described herein may be found in... Figure 6 This is employed during any or more stages of the manufacturing and maintenance method 1100 shown in the flowchart. In the example, during part of component and sub-assembly manufacturing 1106 and / or system integration 1108, one or more examples of the polymer composite structure 100 of the aircraft 1200 may be thermally protected according to method 1000 and / or manufactured according to method 2000. Furthermore, when the aircraft 1200 enters service 1112, one or more examples of the polymer composite structure 100 of the aircraft 1200 may be thermally protected according to method 1000 and / or manufactured according to method 2000. Additionally, during system integration 1108 and certification and delivery 1110, one or more of the polymer composite structure 100 of the aircraft 1200 may be thermally protected according to method 1000 and / or manufactured according to method 2000. Similarly, during the service of aircraft 1200 1112 and during maintenance and repair 1114, one or more examples of the polymer composite structure 100 of aircraft 1200 may be thermally protected according to method 1000 and / or manufactured according to method 2000.

[0060] The foregoing detailed description refers to the accompanying drawings, which illustrate specific examples described in this disclosure. Other examples with different structures and operations do not depart from the scope of this disclosure. In different drawings, the same reference numerals may refer to the same features, elements, or components. Throughout this disclosure, any one of a plurality of items may be referred to individually as an item, and a plurality of items may be referred to collectively as an item and may be referred to by the same reference numerals. Furthermore, as used herein, a feature, element, component, or step following the words “a” or “an” should be understood to not exclude multiple features, elements, components, or steps unless such exclusion is expressly stated.

[0061] The foregoing provides illustrative, non-exhaustive examples of the subject matter of this disclosure that may be claimed, but are not necessarily claimed. Reference to "example" herein means that one or more features, structures, elements, components, characteristics, and / or operating steps described in connection with the example are included in at least one aspect, embodiment, and / or implementation of the subject matter of this disclosure. Therefore, the phrases "example," "another example," "one or more examples," and similar language throughout this disclosure may, but do not necessarily, refer to the same example. Furthermore, the subject matter characterizing any example may, but does not necessarily include the subject matter characterizing any other example. Moreover, the subject matter characterizing any example may, but does not necessarily, combine with the subject matter characterizing any other example.

[0062] As used herein, a system, device, apparatus, structure, article, element, component, or hardware "configured" to perform a specified function is indeed capable of performing the specified function without any changes, and not merely has the potential to perform the specified function after further modification. In other words, a system, device, apparatus, structure, article, element, component, or hardware "configured" to perform a specified function is specifically selected, created, implemented, utilized, programmed, and / or designed for performing the specified function. As used herein, "configured" means an existing characteristic of the system, device, structure, article, element, component, or hardware that enables the system, device, structure, article, element, component, or hardware to perform the specified function without further modification. For the purposes of this disclosure, additionally or alternatively, a system, device, apparatus, structure, article, element, component, or hardware described as "configured" to perform a particular function may be described as "suitable" and / or "operated" to perform that function.

[0063] Unless otherwise stated, the terms “first,” “second,” “third,” etc., are used merely as labels in this document and are not intended to impose any order, position, or ranking requirements on the items referred to by these terms. Furthermore, references to an item such as “second” do not require or exclude the existence of an item such as “first” or a lower-numbered item and / or an item such as “third” or a higher-numbered item.

[0064] As used herein, when used with a list of items, the phrase “at least one of…” means that different combinations of one or more of the listed items may be used, and it may be necessary to use only one of each item in the list. For example, “at least one of Item A, Item B, and Item C” may include, but is not limited to: Item A; or Item A and Item B. This example may also include: Item A, Item B, and Item C; or Item B and Item C. In other examples, “at least one of…” may be, for example, but not limited to: two Item A's, one Item B and ten Item C's; four Item B's and seven Item C's; and other suitable combinations. As used herein, the terms “and / or” and the “ / ” symbol include any and all combinations of one or more of the associated listed items.

[0065] For the purposes of this disclosure, the term "connection" and similar terms refer to two or more elements that are joined, linked, fastened, attached, connected, communicated, or otherwise associated with each other (e.g., mechanically, electrically, fluidly, optically, electromagnetically). In various examples, the elements may be associated directly or indirectly. As an example, element A may be directly associated with element B. As another example, element A may be indirectly associated with element B, for example, via another element C. It should be understood that not all associations between the various disclosed elements are necessarily represented. Therefore, connections other than those depicted in the figures may also exist.

[0066] As used herein, the term "about" means or indicates a condition that is close to but not exactly close to the stated condition, which still performs the desired function or achieves the desired result. As an example, the term "about" refers to a condition within an acceptable predetermined tolerance or accuracy, such as a condition within 10% of the stated condition. However, the term "about" does not exclude a condition that is exactly the stated condition. As used herein, the term "substantially" means a condition that substantially performs the desired function or achieves the desired result.

[0067] The above-mentioned Figure 1 , Figure 4 , Figure 5 and Figure 7 It may represent its functional elements, features, or components, and does not necessarily imply any specific structure. Therefore, the illustrated structure may be modified, added to, and / or omitted. Furthermore, those skilled in the art will understand that it is not limited to the structures mentioned above. Figure 1 , Figure 4 , Figure 5 and Figure 7 All elements, features, and / or components described and illustrated herein need to be included in every example, and not all elements, features, and / or components described herein need to be depicted in every exemplary example. Therefore, in Figure 1 , Figure 4 , Figure 5 and Figure 7 Some of the elements, features, and / or components described and shown can be combined in various ways without needing to be included. Figure 1 , Figure 4 , Figure 5 and Figure 7 Other features described and illustrated in the accompanying drawings and / or disclosures, even if such combinations are not explicitly shown herein. Similarly, additional features, not limited to the examples presented, may be combined with some or all of the features shown and described herein. Unless otherwise expressly stated, the features mentioned above... Figure 1 , Figure 4 , Figure 5 and Figure 7 The schematic diagrams depicted are not intended to imply structural limitations regarding the exemplary examples. Rather, while an exemplary structure is shown, it should be understood that this structure can be modified as appropriate. Therefore, modifications, additions, and / or omissions can be made to the illustrated structure. Furthermore, elements, features, and / or components used for similar or at least substantially similar purposes may be omitted. Figure 1 , Figure 4 , Figure 5 and Figure 7 Each of the elements is labeled with the same number and may be disregarded in this document. Figure 1 , Figure 4 , Figure 5 and Figure 7 Each of these elements, features, and / or components is discussed in detail. Similarly, in Figure 1 , Figure 4 , Figure 5 and Figure 7 Each element, feature, and / or component may not be labeled, but for consistency, the associated reference numerals may be used herein.

[0068] The above-mentioned Figure 2 , Figure 3 and Figure 6 In this document, boxes may represent operations, steps, and / or parts thereof, and the lines connecting the various boxes do not imply any particular order or dependency between the operations or their parts. It should be understood that this does not necessarily represent all dependencies between the various operations disclosed. Figure 2 , Figure 3 and Figure 6 The accompanying disclosures describing the operations of the methods set forth herein should not be construed as requiring a predetermined order of operations. Rather, while an illustrative order is indicated, it should be understood that the order of operations can be modified where appropriate. Therefore, the operations shown can be modified, added to, and / or omitted, and some operations can be performed in a different order or simultaneously. Furthermore, those skilled in the art will understand that it is not necessary to perform all the operations described.

[0069] Furthermore, references to features, advantages, or similar language used throughout this specification do not imply that all features and advantages applicable to the exemplary implementations disclosed herein should be included in any single example or in any single example. Rather, references to features and advantages are understood to mean that a particular feature, advantage, or characteristic described in connection with an example is included in at least one example. Therefore, discussions of features, advantages, and similar language used throughout this disclosure may, but do not necessarily, refer to the same examples.

[0070] The features, advantages, and properties described in one example can be combined in any suitable manner in one or more other examples. Those skilled in the art will recognize that the examples described herein can be practiced without the presence of one or more specific features or advantages of a particular example. In other cases, additional features and advantages that may not be present in all examples may be recognized in some examples. Furthermore, although various examples of polymer composite structures 100, method 1000, and method 2000 have been shown and described, modifications will occur to those skilled in the art upon reading the specification. This application includes such modifications and is limited only by the scope of the claims.

[0071] Examples of this disclosure may be described according to one or more of the following clauses.

[0072] 1. A polymer composite material structure (100), the polymer composite material structure (100) comprising:

[0073] Polymer matrix composite (102); and

[0074] A thermal barrier layer (104) is attached to the polymer matrix composite material (102) and configured to resist transient temperature spikes in the polymer matrix composite material (102).

[0075] 2. The polymer composite material structure (100) according to Clause 1, wherein:

[0076] The polymer matrix composite material (102) forms the first surface (106) of the polymer composite material structure (100); and

[0077] The thermal barrier layer (104) forms a second surface (108) of the polymer composite structure (100) opposite to the first surface (106).

[0078] 3. The polymer composite material structure (100) according to Clause 1, wherein:

[0079] The polymer composite material structure (100) is an exhaust pipe (110);

[0080] The polymer matrix composite material (102) forms the outer surface (112) of the exhaust pipe (110); and

[0081] The thermal barrier layer (104) forms the inner surface (114) of the exhaust duct (110).

[0082] 4. The polymer composite material structure (100) according to Clause 1, wherein the thermal barrier layer (104) comprises at least one of the following: polyimide material (132), polyceramic material (133), silicone material (134), siloxane material (135), aerogel material (136), ceramic matrix composite material (137), and ceramic material (138).

[0083] 5. The polymer composite structure (100) according to Clause 1, wherein the thermal barrier layer (104) is configured to reduce the maximum temperature received by the polymer matrix composite material (102) through the thermal barrier layer (104).

[0084] 6. The polymer composite structure (100) according to Clause 1, wherein the thermal barrier layer (104) is configured to reduce the rate of heat transfer through the thermal barrier layer (104) to the polymer matrix composite (102).

[0085] 7. The polymer composite structure (100) according to Clause 1, wherein the thermal barrier layer (104) is configured to distribute the received heat in a direction at least substantially perpendicular to the normal of the thermal barrier layer (104).

[0086] 8. The polymer composite structure (100) according to Clause 1, wherein the thermal barrier layer (104) comprises less than about 0.0035 cm 2 Thermal diffusivity per second (142).

[0087] 9. The polymer composite structure (100) according to Clause 1, wherein the thermal barrier layer (104) comprises one of a film (122), a coating (124), and a sheet (126).

[0088] 10. The polymer composite structure (100) according to Clause 1, wherein the polymer matrix composite (102) and the thermal barrier layer (104) are co-cured.

[0089] 11. The polymer composite structure (100) according to Clause 1, wherein the polymer matrix composite (102) and the thermal barrier layer (104) are co-bonded.

[0090] 12. The polymer composite structure (100) according to Clause 1, wherein the polymer matrix composite (102) and the thermal barrier layer (104) are bonded in a secondary manner.

[0091] 13. A method (1000) for a thermally protected polymer composite structure (100), the method (1000) comprising:

[0092] Provides a polymer matrix composite material (102); and

[0093] A thermal barrier layer (104) is formed on at least a portion of the polymer matrix composite material (102).

[0094] 14. The method (1000) according to Clause 13, further comprising: using the thermal barrier layer (104) to resist transient temperature spikes in the polymer matrix composite material (102),

[0095] The formation of the thermal barrier layer (10:4) includes: attaching the thermal barrier layer (104) to the polymer matrix composite material (102), such that the polymer matrix composite material (102) forms a first surface (106) of the polymer composite material structure (100), and the thermal barrier layer (104) forms a second surface (108) of the polymer composite material structure (100) opposite to the first surface (106).

[0096] 15. The method (1000) according to Clause 14, wherein resisting the instantaneous temperature spike comprises: reducing the highest temperature received by the polymer matrix composite material (102) through the thermal barrier layer (104).

[0097] 16. The method (1000) according to Clause 14, wherein resisting the instantaneous temperature spike comprises: reducing the rate of heat transfer through the thermal barrier layer (104) to the polymer matrix composite material (102).

[0098] 17. The method (1000) according to Clause 14, wherein resisting the instantaneous temperature spike comprises: distributing the received heat in a direction at least substantially perpendicular to the normal of the thermal barrier layer (104).

[0099] 18. The method (1000) according to Clause 13, wherein the thermal barrier layer (104) comprises at least one of the following: a polyimide material (132), a polyceramic material (133), a silicone material (134), a siloxane material (135), an aerogel material (136), a ceramic matrix composite material (137), and a ceramic material (138).

[0100] 19. A method (2000) for manufacturing a polymer composite structure (100) resistant to transient temperature spikes, the method (2000) comprising:

[0101] A polymer matrix composite material (102) is formed; and

[0102] A thermal barrier layer (104) is formed on at least a portion of the polymer matrix composite material (102).

[0103] 20. The method (2000) according to Clause 19, further comprising: using the thermal barrier layer (104) to provide resistance to transient temperature spikes in the polymer matrix composite material,

[0104] The formation of the thermal barrier layer (104) includes: attaching the thermal barrier layer (104) to the polymer matrix composite material (102), such that the polymer matrix composite material (102) forms a first surface (106) of the polymer composite material structure (100), and the thermal barrier layer (104) forms a second surface (106) of the polymer composite material structure (100) opposite to the first surface (106).

Claims

1. A polymer composite material structure (100), the polymer composite material structure (100) comprising: Polymer matrix composite (102); as well as A thermal barrier layer (104) is attached to the polymer matrix composite material (102) and configured to resist transient temperature spikes in the polymer matrix composite material (102).

2. The polymer composite material structure (100) according to claim 1, wherein: The polymer matrix composite material (102) forms the first surface (106) of the polymer composite material structure (100); and The thermal barrier layer (104) forms a second surface (108) of the polymer composite structure (100) opposite to the first surface (106).

3. The polymer composite material structure (100) according to claim 1, wherein: The polymer composite material structure (100) is an exhaust pipe (110); The polymer matrix composite material (102) forms the outer surface (112) of the exhaust pipe (110); and The thermal barrier layer (104) forms the inner surface (114) of the exhaust duct (110).

4. The polymer composite material structure (100) according to claim 1, wherein, The thermal barrier layer (104) includes at least one of the following: polyimide material (132), polyceramic material (133), silicone material (134), siloxane material (135), aerogel material (136), ceramic matrix composite material (137), and ceramic material (138).

5. The polymer composite material structure (100) according to claim 1, wherein, The thermal barrier layer (104) is configured to reduce the maximum temperature received by the polymer matrix composite material (102) through the thermal barrier layer (104).

6. The polymer composite material structure (100) according to claim 1, wherein, The thermal barrier layer (104) is configured to reduce the rate of heat transfer through the thermal barrier layer (104) to the polymer matrix composite material (102).

7. The polymer composite material structure (100) according to claim 1, wherein, The thermal barrier layer (104) is configured to distribute the received heat in a direction that is at least substantially perpendicular to the normal of the thermal barrier layer (104).

8. The polymer composite material structure (100) according to claim 1, wherein, The thermal barrier layer (104) comprises less than about 0.0035 cm 2 Thermal diffusivity per second (142).

9. A method (1000) for a thermally protected polymer composite structure (100), the method (1000) comprising: Provides a polymer matrix composite material (102); and A thermal barrier layer (104) is formed on at least a portion of the polymer matrix composite material (102).

10. A method (2000) for manufacturing a polymer composite structure (100) resistant to transient temperature spikes, the method (2000) comprising: A polymer matrix composite material (102) is formed; and A thermal barrier layer (104) is formed on at least a portion of the polymer matrix composite material (102).

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