Non-contact linear displacement measurement PCB system for electrical protection device

Abstract

The inductive sensor is integrated on a printed circuit board assembly (PCBA) of the electrical protection device such that the inductive sensor is configured to contactlessly measure linear motion of a conductive target mounted on the PCBA corresponding to a component of the electrical protection device. The inductive sensor includes an integrated circuit, a transmitter coil, and a receiver coil vertically spaced from the conductive target. The integrated circuit is electrically coupled to the transmitter coil such that the integrated circuit is configured to transmit the high frequency time-varying signal into the transmitter coil. The high-frequency time-varying signal excites a transmitter coil, thereby inducing a magnetic field. The magnetic field induces one or more output signals on the receiver coil and induces eddy currents in the conductive target. The eddy current generates a counter magnetic field that varies the output signal in response to linear displacement of the conductive target.

Description

Technical Field

[0001] This disclosure generally relates to inductive sensors for measuring the linear motion of components of electrical protection devices. Background Technology

[0002] Control sensors, such as position, temperature, and even speed sensors, are an essential part of industrial automation because they allow automated and connected industrial systems to make decisions and control industrial environments. Optical control sensors often provide suboptimal results because they typically involve sophisticated designs unsuitable for use in industrial environments. For example, optical control sensors exposed to dust, moisture, water, lubricants, and strong vibrations are often inoperable and provide at least one of the following: inaccurate results. A common type of sensor used to monitor parameters of industrial automation equipment is the capacitive sensor. In particular, planar capacitive sensors exist that utilize two printed circuit boards (PCBs) to fabricate stator and rotor electrodes. However, similar to optical sensors, the output of capacitive sensors remains sensitive to foreign substances such as moisture, water, and lubricants. Another common type of sensor used with industrial automation equipment includes mechanical sensors (e.g., mechanical switches). However, the information provided by current mechanical sensors is limited. For example, current mechanical sensors are limited to providing discrete outputs (e.g., on or off) regarding the specific position of a target, such as a switch. Summary of the Invention

[0003] This disclosure provides an improved inductive sensor configured to measure the linear motion of an electrical protection device.

[0004] In one aspect, an inductive sensor is configured to measure linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices. The inductive sensor includes a transmitter coil on a sensor portion of the PCBA. The transmitter coil is configured to generate a magnetic field when energized. Multiple receiver coils are located on the sensor portion of the PCBA. Each receiver coil is electrically connected to the transmitter coil via the magnetic field generated by the transmitter coil when energized. An integrated circuit on the PCBA is electrically connected to the transmitter coil. The integrated circuit is configured to transmit a high-frequency time-varying signal to excite the transmitter coil to generate a magnetic field on the sensor portion. The magnetic field induces one or more output signals in each of the receiver coils. The magnetic field induces eddy currents in the conductive target. The eddy currents generate a reverse magnetic field, which is configured to change one or more output signals of the receiver coils in response to linear displacement of the conductive target.

[0005] On the other hand, an electrical protection device for an industrial automation system includes a printed circuit board assembly (PCBA) comprising a sensor portion and a target portion vertically spaced apart along a vertical axis of the PCBA at predetermined intervals. A conductive target is mounted on the target portion of the PCBA. A sensing sensor is located on the sensor portion of the PCBA. The sensing sensor is configured to generate a magnetic field on the sensor portion. The magnetic field induces one or more output signals of the sensing sensor. The magnetic field induces multiple eddy currents in the conductive target. The eddy currents generate a counter-magnetic field configured to change one or more output signals of the sensing sensor in response to a linear displacement of the conductive target.

[0006] On the other hand, a redundant sensing sensor system is configured to measure the linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices. The redundant sensing sensor system includes multiple sensing sensors. Each sensing sensor is located on one of multiple sensor sections of the PCBA. Each of the multiple sensing sensors includes a transmitter coil configured to generate a magnetic field when energized. Each sensing sensor includes multiple receiver coils connected to a corresponding transmitter coil of each sensing sensor via the magnetic field generated by each corresponding transmitter coil when energized. Multiple integrated circuits are located on one or more sensor sections of the PCBA. Each integrated circuit is electrically connected to at least one of the transmitter coils of the sensing sensors. The integrated circuit is configured to transmit a high-frequency time-varying signal to excite each of the transmitter coils to generate a magnetic field on the sensor section. Each magnetic field induces one or more output signals on a corresponding receiver coil of each of the sensing sensors. Each magnetic field induces eddy currents in the conductive target. The eddy currents generate a counter-magnetic field configured to change one or more output signals of at least one sensing sensor in response to the linear displacement of the conductive target.

[0007] On the other hand, a method for measuring the linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices includes: transmitting a high-frequency time-varying signal via an integrated circuit on the PCBA to excite a transmitter coil on a sensor portion of the PCBA, causing the transmitter coil to generate a magnetic field. One or more output signals on a receiver coil are induced by the magnetic field on the sensor portion of the PCBA. The magnetic field induces eddy currents in the conductive target. The eddy currents generate a counter-magnetic field to change one or more output signals of the receiver coil in response to the linear displacement of the conductive target.

[0008] Other purposes and features will be partly obvious and partly noted below. Attached Figure Description

[0009] Figure 1 This is a schematic block diagram of an existing electrical protection device with mechanical sensors.

[0010] Figure 2 This is a schematic block diagram of an electrical protection device including a sensing sensor according to an embodiment.

[0011] Figure 3 This is a schematic block diagram of an electrical protection device for a mechanical sensor with existing technology.

[0012] Figure 4 This is a schematic block diagram of an electrical protection device including a sensing sensor according to an embodiment.

[0013] Figure 5 This is an illustration of an electrical protection device with a sensing sensor according to an embodiment.

[0014] Figure 6 According to the embodiments Figure 5 A schematic diagram of the sensing sensor.

[0015] Figure 7 According to the embodiments Figure 5 Another schematic diagram of the sensing sensor.

[0016] Figure 8 According to the embodiments Figure 5-7 The side view of the sensing sensor shown.

[0017] Figure 9A This is a schematic diagram of the sinusoidal receiver coil of the sensing sensor according to an embodiment.

[0018] Figure 9B This is a schematic diagram of the rhomboid receiver coil of the sensing sensor according to an embodiment.

[0019] Figure 10 This is a schematic diagram of a redundant sensing sensor system including two sensing sensors according to an embodiment.

[0020] Figure 11 This is a schematic diagram showing the position of a moving part of an electrical protection device including a sensing sensor according to an embodiment.

[0021] Figure 12A This is a schematic diagram of the input and output signals of the integrated circuit and sensing sensor according to an embodiment.

[0022] Figure 12B According to the embodiments Figure 12A The diagram shows the decoding of the output signal.

[0023] Throughout the accompanying drawings, corresponding reference numerals denote corresponding parts. Detailed Implementation

[0024] This disclosure provides a sensing sensor configured for non-contact, real-time linear motion sensing of components in industrial automation devices, particularly electrical protection devices. The sensing sensor of this disclosure provides increased robustness against harsh environmental conditions within industrial environments. Furthermore, the output from the sensing sensor provides insights into the status and health of components of the electrical protection device, enabling information monitoring of the asset. Therefore, this insight can also be used to predict factors such as the status and health of other components of the electrical protection device, as well as the overall health of the electrical protection device itself. As will be described in more detail below, the systems and methods according to this disclosure provide a highly accurate and environmentally robust solution for measuring the linear motion of components of electrical protection devices.

[0025] Now for reference Figure 1-4 Examples of industrial automation devices, and more specifically, examples of electrical protection devices, are generally indicated by reference numeral 100. Broadly, electrical protection device 100 includes intelligent current-flowing devices configured to protect industrial processes and their components from excessive current conditions. Exemplary intelligent current-flowing devices include residential and industrial circuit breakers, electrical protective sockets, and safety switches. In one embodiment, electrical protection device 100 includes a miniature circuit breaker (MCB). For example, Figure 1 and Figure 2 This demonstrates a smart 1-pole dual-function MCB, while Figure 3 and Figure 4 A smart 2-pole dual-function MCB is shown. For this purpose, the electrical protection device 100 includes multiple functional components or modules, some of which are represented herein as blocks. It should be understood, of course, that within the scope of this disclosure, each block shown herein (and in the following figures) may be divided into several constituent blocks, or two or more blocks may be combined into a single block.

[0026] As can be seen, the electrical protection device 100 has a common power line and a common neutral line connected to the line side 101 of the electrical protection device 100. Current from the common power line is transmitted through the main conductor 102 to various loads connected to the load side 109 of the electrical protection device 100. The neutral conductor 108 connects the load neutral line to the utility neutral line. The electrical protection device 100 in this example includes a ground fault sensing circuit 105 connected to a ground fault sensor 110. The main conductor 102 passes through the ground fault sensor 110 and also through a current sensor 125. An integrator or other signal processing front end 119, which may include a signal conditioner 120, receives a signal from the current sensor 125 and provides the signal to an energy measurement and arc fault detection circuit 130. Power for the energy measurement circuit 130, CPU 111, and other components in the circuit breaker 100 is provided by a power supply circuit 104, as shown.

[0027] An example of the general operation of the electrical protection device 100 will now be described. Typically, a CPU 111 (which may be a microcontroller) monitors current measurements obtained from a ground fault sensor 110 to detect the occurrence of a fault condition in a known manner. Upon detection of a fault condition, the CPU 111 outputs a trip signal to a trip circuit 106, which actuates a trip coil 115, which in turn disconnects a trip mechanism 114 (e.g., a switch, relay) to interrupt the current flowing through the circuit breaker 100. A reset mechanism allows the user to set / reset the trip mechanism 114 later after a trip event. Energy and power are measured using a power measurement circuit 130 with line voltage 132, neutral voltage 131, and a current signal provided by a signal processing front end 119. A wireless communication circuit 140 can be used to transmit travel data, current measurements, energy measurements, linear motion data, and other information to an external monitoring system (such as a power usage monitoring system) for analysis.

[0028] Figure 1 and Figure 3 An example of an electrical protection device 100 using a current-mechanical sensor 10 is provided. One difficulty recognized by the current-mechanical sensors 10 is that they are limited in the information they provide. In one example, the mechanical sensor 10 includes a mechanical switch that only provides a discrete output about whether the switch is on or off. Figure 2 and Figure 4 An electrical protection device 100 using the sensing sensor 300 of this disclosure is depicted. As will be explained in more detail below, this disclosure overcomes the disadvantages of the electromechanical sensor 10 by providing the sensing sensor 300, which is configured to measure the linear movement of the components of the electrical protection device in a non-contact manner.

[0029] Figure 2 ,4 Examples of an electrical protection device 100 including a sensing sensor 300 are provided in sections 5-8. Broadly speaking, the electrical protection device 100 includes a printed circuit board assembly (PCBA) comprising at least one sensor portion 702 and a target portion 704, a conductive target 510 mounted on the target portion 704 of the PCBA, and a sensing sensor 300 mounted on the sensor portion 702 of the PCBA. In one embodiment, portions 702, 704 comprise layers of the PCBA. The sensing sensor 300 is configured to measure real-time linear motion of moving parts of the electrical protection device 100. For example, in… Figure 5 In the illustrated embodiment, the conductive target 510 is operatively connected to the remote control mechanism 118 of the electrical protection device, and as will be explained in more detail below, the sensing sensor 300 is configured to non-contactly measure the linear motion of the conductive target 510, which corresponds to the linear motion of the remote control mechanism.

[0030] Exemplary embodiments of the various components of the electrical protection device 100 and the sensing sensor 300 will now be described before an exemplary method for measuring the linear movement of the moving parts of the electrical protection device 100.

[0031] Remote control mechanism 118 is mounted on the PCBA on target section 704. In general, remote control mechanism 118 includes a slider 1181 and a spring 1182. In one embodiment, remote control mechanism 118 interacts with other components of electrical protection device 100 (e.g., energy measurement and arc fault detection circuit 130) to determine whether the MCB is open or closed. Remote control mechanism 118 is configured to move slider 1181 (e.g., by compression or extension of spring 1182) based at least on interaction with other components of electrical protection device. For example, actuation mechanism 114 mechanically engages slider 1181 of remote control mechanism to blade contact 20 of MCB, such that movement of slider causes movement of blade contact. In one embodiment, indicator 107 is operatively coupled to remote control mechanism to indicate the state of MCB. Indicator 107 includes at least one of a non-interactive indicator such as a sign or light and an interactive indicator such as a handle. The interactive indicator is configured to be actuated to control the state of MCB.

[0032] In one embodiment, the conductive target 510 (e.g., a metallic target) is integrally formed as a moving part (e.g., a slider 1181) of the electrical protection device 100. In another embodiment, the conductive target 510 is operatively coupled to the moving part (e.g., the slider 1181) such that the conductive target is configured to replicate the linear movement of the moving part. In the illustrated embodiment, the conductive target 510 is operatively coupled to the slider 1181 of the remote control mechanism 118 to replicate the linear movement of the slider. Figure 8As shown, the conductive target 510 is spaced apart from the sensing sensor 300 along the vertical axis VA of the PCBA by a predetermined gap 706. Furthermore, in the illustrated embodiment, the conductive target 510 is spaced apart from the sensing sensor 300 by a spacer 710; however, it will be apparent to those skilled in the art that the conductive target can be spaced apart from the sensing sensor without using a spacer. The spacer 710 is formed of a non-conductive material such as plastic or ceramic.

[0033] The sensing sensor 300 includes a transmitter coil TX and a plurality of receiver coils RX1, RX2. In the illustrated embodiment, the transmitter coil TX includes a rectangular planar coil with the receiver coils RX1, RX2 therebetween. The transmitter coil TX and the receiver coils RX1, RX2 are typically designed as traces on the sensor portion 702 of the PCBA. For example, the transmitter coil TX includes conductive traces integrated on the sensor portion 702 of the PCBA, and each of the receiver coils RX1, RX2 also includes conductive traces integrated on the sensor portion of the PCBA. Figure 9A The sinusoidal trace configuration of the receiver coils RX1 and RX2 is shown, while Figure 9B The diagram illustrates a diamond-shaped trace configuration for the receiver coil. From a manufacturing perspective, diamond-shaped coils are easier to implement and reduce manufacturing costs. However, sinusoidal coils can reduce electromagnetic interference and crosstalk in high-frequency circuits, thus improving electromagnetic compatibility. Furthermore, for high-speed signal lines and protocol-specific signal lines, sinusoidal coils can reduce signal waveform distortion and delay distortion, thereby enhancing signal integrity. Sinusoidal coils also avoid the "sharp corners" introduced by right-angle traces, thus reducing PCB layout complexity and the size and weight of the board.

[0034] In one example, receiver coils RX1 and RX2 include a first receiver coil and a second receiver coil physically shifted 90° relative to each other on the PCBA, thereby defining a 90° phase shift between the first receiver coil and the second receiver coil. This results in one or more output signals from the first receiver coil and the second receiver coil also including a 90° phase shift relative to a linear displacement of the conductive target 510, as will be explained in more detail below. The 90° phase shift in the output signals enables the generation of ratio sine and cosine signals (e.g., sine-RX2, cosine-RX1, sine+RX2, cosine+RX2), which can be converted into absolute positions to indicate the position of the conductive target 510.

[0035] The transmitter coil TX is electrically connected to the integrated circuit 506 of the PCBA, such that the transmitter coil is configured to receive high-frequency time-varying signals from the integrated circuit. Therefore, the transmitter coil TX is configured to generate a magnetic field when excited by the integrated circuit 506. Receiver coils RX1 and RX2 are each electrically connected to the transmitter coil TX via the magnetic field generated by the transmitter coil when energized. Furthermore, the magnetic field induces one or more output signals in the receiver coils RX1 and RX2. For example, the magnetic field induces a voltage in the receiver coils RX1 and RX2. In the absence of the conductive target 510, the voltage is compensated to achieve zero output due to the balanced anti-series connection of their segments. Using the conductive target 510, the magnetic field induces eddy currents in the conductive target, thereby generating a counter-magnetic field. The counter-magnetic field alters the output signals of the receiver coils RX1 and RX2. For example, the counter-magnetic field reduces the voltage induced in the receiver coils RX1 and RX2, thereby creating an imbalance in the voltage of the anti-series coil segments. Therefore, the counter-magnetic field changes the characteristics of the voltage, such as amplitude and polarity, depending on the position of the conductive target 510.

[0036] In the illustrated embodiment, integrated circuit 506 is integrated on sensor portion 702 of the PCBA. It is contemplated that sensor portion 702, target portion 704, and their components can be connected to other components of electrical protection device 100 via connectors 511 such as flexible connectors, flexible wire jumpers, or block terminals. Specifically, in the illustrated embodiment, sensor portion 702 includes input and output ports 507 configured to connect components on the sensor portion to other components of electrical protection device 100. For example, integrated circuit 506 is configured to receive power from power supply circuit 104 as input to transmit a high-frequency time-varying signal to transmitter coil TX to excite the transmitter coil to generate a magnetic field on sensor portion 702. Furthermore, integrated circuit 506 is configured to receive one or more output signals induced by the magnetic field and to send the output signals (e.g., to other components of electrical protection device 100, such as an industrial automation device processor) for external signal processing. In an exemplary embodiment, integrated circuit 506 is also configured to amplify and filter the output signal at least once before outputting the output signal for external signal processing. For example, integrated circuit 506 is configured to perform synchronous demodulation of the received signal, then filter and output the signal for external signal processing.

[0037] In an exemplary embodiment, the industrial automation device processor of the electrical protection device 100 includes a microprocessor (MPU) or a microcontroller (MCU). In either case, the industrial automation device processor is configured to receive output signals and convert them into information that can characterize the instantaneous position, velocity, acceleration, and other measures of the conductive target 510 coupled to the remote control mechanism 118. In one example, the industrial automation device processor includes embedded firmware that includes an initialization component and a runtime component. The initialization component configures the hardware peripherals on the MPU / MCU, while the runtime component actively receives output signals and converts them into usable information.

[0038] Now for reference Figure 10 The redundant sensor system is generally indicated by reference numeral 1000. Similar to the above, the redundant sensor system 1000 is configured to measure the linear motion of the conductive target 510. However, this embodiment includes multiple sensors 300A, 300B. In one example, the sensors 300A, 300B each use different operating frequencies to capture the same range of linear motion of the conductive target 510. Typically, the multiple sensors 300A, 300B operate at different frequencies to provide redundancy in the event of a failure of one sensor. Furthermore, the sensors 300A, 300B are configured to operate at different frequencies to avoid undesirable interactions between the sensors. For example, the redundant sensor system 1000 configures multiple sensors 300A, 300B for the electrical protection device 100 to ensure that all linear motion of the conductive target 510 is captured.

[0039] In the illustrated embodiment, the redundant sensing sensor system 1000 includes a plurality of sensing sensors 300A, 300B, each sensing sensor 300A, 300B configured to detect a unique linear displacement range of the conductive target 510. Furthermore, the PCBA includes multiple portions. For example, the PCBA includes multiple sensor portions 1002A, 1002B. Moreover, each of the sensor portions 1002A, 1002B is spaced apart from the conductive target 510 along the vertical axis of the PCBA by a predetermined interval 706. Each of the sensing sensors 300A, 300B is disposed on one of the plurality of sensor portions 1002A, 1002B of the PCBA.

[0040] Each of the multiple sensing sensors 300A, 300B includes a transmitter coil TX configured to generate a magnetic field when energized. Each transmitter coil TX includes conductive traces integrated into a corresponding sensor portion 1002A, 1002B of the PCBA. Furthermore, each of the sensing sensors 300A, 300B includes multiple receiver coils RX1, RX2 connected to the corresponding transmitter coil TX of each of the sensing sensors via the magnetic field generated by each corresponding transmitter coil when energized. Each of the receiver coils RX1, RX2 includes conductive traces (e.g., in a sinusoidal or diamond configuration) integrated into the corresponding sensor portion 1002A, 1002B of the PCBA. Furthermore, in one embodiment, the receiver coils RX1 and RX2 of the sensing sensors 300A and 300B each include a first receiver coil and a second receiver coil that are physically shifted 90° relative to each other on the PCBA, thereby defining a 90° phase shift between the first receiver coil and the second receiver coil of each of the sensing sensors, such that one or more output signals of the first receiver coil and the second receiver coil also include a 90° phase shift relative to the linear displacement of the conductive target 510.

[0041] As shown in the figure, the redundant sensing sensor system 1000 also includes a plurality of integrated circuits 506A, 506B integrated on one or more of the sensor portions 1002A, 1002B of the PCBA. Each of the integrated circuits 506A, 506B is electrically connected to at least one of the transmitter coils TX of the sensing sensors 300A, 300B. Therefore, each of the integrated circuits 506A, 506B is configured to transmit a high-frequency time-varying signal to excite each of the transmitter coils TX to generate a magnetic field on the sensor portions 1002A, 1002B. Each magnetic field induces one or more output signals on a corresponding receiver coil RX1, RX2 of each of the sensing sensors 300A, 300B. In addition, each magnetic field induces eddy currents in the conductive target 510, such that the eddy currents generate a counter-magnetic field, which is configured to change one or more output signals of at least one sensing sensor in response to a linear displacement of the conductive target. In addition, integrated circuits 506A and 506B are configured to receive one or more altered output signals from at least one of the sensing sensors 300A and 300B, and to amplify, filter, and output (e.g., to other components of the electrical protection device 100, such as an industrial automation device processor) at least one of the altered one or more output signals for external signal processing.

[0042] Now for reference Figure 11An exemplary embodiment of a sensing sensor 300 integrated with an electrical protection device 100 is shown. In the illustrated embodiment, the electrical protection device 100 includes a smart 2-pole dual-function MCB. The electrical protection device 100 includes a slider 1181, wherein a conductive target 510 is operatively connected to the slider 1181 to replicate movement of the slider. The sensing sensor 300 is used to measure the linear movement of the slider 1181 to determine the state of the MCB. For example, the sensing sensor 300 measures the linear movement of the conductive target 510 corresponding to the linear movement of the slider 1181, thereby corresponding to the position of the blade contact 20 indicating the state of the MCB. Still referring to Figure 11 The diagram shows the MCB's on state 102A, off state 102B, and tripped state 102C. 102D indicates the MCB's off state caused by the interactive indicator 107 instead of the remote control mechanism 118.

[0043] An example of the signal flow of this disclosure will now be described. Initially, integrated circuit 506 drives a high-frequency time-varying signal into the transmitter coil TX and generates a magnetic field at a specific frequency. The magnetic field induces voltages in the receiver coils RX1, RX2, thereby generating eddy currents (Foucault currents). In the absence of the conductive target 510, the voltages are compensated to achieve zero output at each pair of terminals of the receiver coils due to the balanced anti-series connection of their segments (cosine +RX1 and cosine -RX1, sine +RX1 and sine -RX2). If the conductive target 510 is placed above the receiver coils RX1, RX2, the magnetic field induces eddy currents on the surface of the conductive target. The eddy currents generate a counter-magnetic field, thereby reducing the total flux density below. The voltage induced in the receiver coils RX1, RX2 region below the conductive target 510 decreases, thus creating an imbalance in the voltage of the anti-series coil segments. The output voltage appears at the terminals, with its amplitude and polarity changing with the target position. Integrated circuit 506 performs synchronous demodulation of the received signals, then filters and outputs them for external signal processing, such as... Figure 12A As shown.

[0044] Due to the 90° phase shift of the two receiver coils RX1 and RX2, the output signal also has a 90° phase shift relative to the target position, thus generating ratio sine and cosine signals. The signal can be converted to an absolute position, for example, by applying mathematical sequences (such as arctangent operations or the two arctangents of Vsin and Vcos), as... Figure 12B As shown:

[0045] 1. Position = (Vsin / Vcos)

[0046] Figure 11This is a schematic diagram of an intelligent current flow monitoring device including a sensing sensor 300 illustrating linear motion. The example shows the sensing sensor 300, which includes a transmitter coil TX and two receiver coils RX1 and RX2 in a sinusoidal trace configuration.

[0047] For this example, the following equation explains how the concept of sensing sensor 300 works:

[0048] 2. Cosine Cyclic 1 = Cosine + RX1

[0049] 3. Cosine Cyclic 2 = Cosine - RX1

[0050] 4. Sine Cycle 1 = Sine + Rx²

[0051] 5. Cosine Cyclic 2 = Sine - Rx²

[0052] 6. Sine cycle = Sine cycle 1 + Sine cycle 2

[0053] 7. Cosine Cyclic = Cosine Cyclic 1 + Cosine Cyclic 2

[0054] Due to the alternating clockwise and counterclockwise winding directions of each segment in the circuit (e.g., cosine RX1 = clockwise cosine cycle 1 + counterclockwise cosine cycle 2), the induced voltage in each segment has alternating opposite polarities.

[0055] 8. Vsine loop 1 = Vsine loop 2

[0056] 9. Vcosine cycle 1 = Vcosine cycle 2

[0057] If no target exists, the secondary voltages cancel each other out:

[0058] 10. VSin = Vsine loop 1 + Vsine loop 2 = 0V

[0059] 11. Vcos = Vcosine cycle 1 + Vcosine cycle 2 = 0V

[0060] When a target is placed above the coil, the secondary voltage induced in the covered area is lower than the secondary voltage when there is no target above it:

[0061] 12. Vsine loop ≠ -Vsine loop 2

[0062] 13. Vcosine cycle 1 ≠ -Vcosine cycle 2

[0063] This creates an imbalance in the secondary voltage range, and therefore produces a secondary voltage that differs from 0V, depending on the location of the target:

[0064] 14. Vsin = Vsine cycle 1 + Vsine cycle 2 ≠ 0V

[0065] 15. Vcos = Vcosine cycle 1 + Vcosine cycle 2 ≠ 0V

[0066] A method for measuring the linear motion of a conductive target 510 mounted on a PCBA of an electrical protection device 100 will now be described.

[0067] refer to Figure 12A Integrated circuit 506 sends a high-frequency time-varying signal to transmitter TX, causing transmitter TX to be excited and energized, thereby generating a magnetic field. The magnetic field then induces one or more output signals (e.g., Cos RX1, Sin RX2) in receiver coils RX1 and RX2 on the sensor section of the PCBA. Furthermore, the magnetic field induces eddy currents in conductive target 510. Therefore, the eddy currents generate a counter-magnetic field that changes one or more output signals of receiver coils RX1 and RX2 in response to linear displacement of conductive target 510. Integrated circuit 506 then receives the changed one or more output signals and, before outputting one or more output signals for external processing, amplifies and filters at least one of the changed one or more output signals. For example, integrated circuit 506 performs synchronous demodulation of the received signal, then filters and outputs the signal for external processing. In an exemplary embodiment, external processing includes converting the changed one or more output signals into digital data characterizing at least one of the position, velocity, and acceleration of conductive target 510. For example, external processing includes applying a 90° phase shift to the changed one or more output signals to generate one or more ratio sine and cosine signals. Applying mathematical sequences to ratio sine and cosine signals, for example Figure 12B The arctangent operation shown is used to convert the altered output signal into an absolute position.

[0068] The invention has been described in detail, and it will be apparent that modifications and variations are possible without departing from the scope of the invention as defined in the appended claims.

[0069] Embodiments of this disclosure include dedicated computers that include various computer hardware as described in more detail herein and can operate with other dedicated computing system environments or configurations, even when described in conjunction with the example computing system environment. The computing system environment is not intended to impose any limitation on the scope or functionality of any aspect of the invention. Furthermore, the computing system environment should not be construed as having any dependency or requirement associated with any one or combination of the components shown in the example operating environment. Examples of computing systems, environments, and / or configurations applicable to various aspects of this disclosure include, but are not limited to, personal computers, server computers, handheld or laptop devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, mobile phones, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the foregoing systems or devices, etc.

[0070] The aspects of this disclosure can be described in the general context of data and / or processor-executable instructions (such as program modules) stored in one or more tangible, non-transitory storage media and executed by one or more processors or other devices. Typically, program modules include, but are not limited to, routines, programs, objects, components, and data structures that perform a particular task or implement a particular abstract data type. The aspects of this disclosure can also be practiced in a distributed computing environment, where tasks are performed by remote processing devices linked via a communication network. In a distributed computing environment, program modules can reside in both local and remote storage media, including memory storage devices. For illustrative purposes, programs and other executable program components can be shown as discrete blocks. However, it should be recognized that such programs and components reside in different storage components of the computing device at different times and are executed by one or more data processors of the device.

[0071] In operation, a processor, computer, and / or server can execute processor-executable instructions (e.g., software, firmware, and / or hardware), such as those shown herein, to implement aspects of the present invention. Processor-executable instructions can be organized into one or more processor-executable components or modules on a tangible processor-readable storage medium. Moreover, embodiments can be implemented with any number and organization of such components or modules. For example, aspects of this disclosure are not limited to the specific processor-executable instructions or specific components or modules shown in the accompanying drawings and described herein. Other embodiments may include different processor-executable instructions or components having more or fewer functions than those shown and described herein.

[0072] Unless otherwise stated, the order of execution or performance of the operations shown and described herein according to various aspects of this disclosure is not essential. That is, unless otherwise stated, operations may be performed in any order, and embodiments may include more or fewer operations than those disclosed herein. For example, certain operations are contemplated to be performed before, simultaneously with, or after another operation, or to be performed within the scope of this disclosure.

[0073] Not all components depicted in the illustrations or descriptions are essential. Furthermore, some implementations and embodiments may include additional components. Variations in the arrangement and type of components may be made without departing from the spirit or scope of the claims set forth herein. Additional, different, or fewer components may be provided, and components may be combined. Alternatively or additionally, a component may be implemented from several components.

[0074] When describing elements of the invention or preferred embodiments thereof, the articles “a,” “an,” “the,” and “the” are intended to indicate the presence of one or more elements. The terms “comprising,” “including,” and “having” are intended to be inclusive and mean that additional elements may be present in addition to those listed.

[0075] In view of the above, it can be seen that several objectives of the present invention have been achieved and other advantageous results have been obtained.

[0076] Since various changes can be made to the above-described products without departing from the scope of the invention, all content contained in the above description and shown in the accompanying drawings is intended to be illustrative rather than restrictive.

[0077] The abstract and summary are provided to help the reader quickly determine the nature of the technical disclosure. They are provided so that they will not be used to interpret or limit the scope or meaning of the claims. The summary is provided to introduce some concepts in a simplified form, which will be further described in the detailed embodiments. The summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help identify the claimed subject matter.

Claims

1. A sensing sensor configured to measure linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices, the sensing sensor comprising: A transmitter coil located on the sensor section of the PCBA, the transmitter coil being configured to generate a magnetic field when energized; Multiple receiver coils are located on the sensor section of the PCBA, each receiver coil being electrically connected to the transmitter coil via a magnetic field generated by the transmitter coil when energized; and An integrated circuit located on the PCBA, electrically connected to the transmitter coil, is configured to transmit a high-frequency time-varying signal to excite the transmitter coil to generate the magnetic field on the sensor section, the magnetic field inducing one or more output signals on each of the receiver coils; The magnetic field induces eddy currents in the conductive target, the eddy currents generate a counter-magnetic field, the counter-magnetic field being configured to change one or more output signals of the receiver coil in response to a linear displacement of the conductive target.

2. The sensing sensor of claim 1, wherein each of the transmitter coil and the receiver coil comprises a conductive trace integrated on the sensor portion of the PCBA.

3. The sensing sensor of claim 2, wherein the receiver coil comprises a first receiver coil and a second receiver coil, the first receiver coil and the second receiver coil being physically shifted 90° relative to each other on the PCBA, thereby defining a 90° phase shift between the first receiver coil and the second receiver coil, such that one or more output signals of the first receiver coil and the second receiver coil also include a 90° phase shift relative to the linear displacement of the conductive target.

4. The sensing sensor according to claim 1, wherein, The conductive target is spaced apart from the sensor portion along the vertical axis of the PCBA at a predetermined interval.

5. The sensing sensor of claim 1, further comprising a spacer for separating the conductive target from the sensor portion.

6. The sensing sensor of claim 1, wherein the integrated circuit is configured to receive one or more altered output signals from the receiver coil, and to amplify, filter, and output at least one of the altered one or more output signals for external signal processing.

7. An electrical protection device for an industrial automation system, the electrical protection device comprising: A printed circuit board assembly (PCBA) including a sensor portion and a target portion, the sensor portion and the target portion being vertically spaced apart along the vertical axis of the PCBA by a predetermined interval; A conductive target, which is mounted on the target portion of the PCBA; and A sensing sensor is located on the sensor portion of the PCBA, the sensing sensor being configured to generate a magnetic field on the sensor portion, the magnetic field inducing one or more output signals of the sensing sensor; The magnetic field induces multiple eddy currents in the conductive target, the eddy currents generate a counter-magnetic field, and the counter-magnetic field is configured to change one or more output signals of the sensing sensor in response to a linear displacement of the conductive target.

8. The electrical protection device according to claim 7, wherein the sensing sensor is configured to amplify, filter, and output at least one of the changed one or more output signals for external signal processing.

9. The electrical protection device of claim 8 further includes an industrial automation device processor configured to communicate with the sensing sensor to receive and process one or more altered output signals.

10. The electrical protection device of claim 7, further comprising a remote control mechanism mounted on a target portion of the PCBA, the remote control mechanism including a moving part configured to control the state of the electrical protection device, wherein the conductive target is operatively connected to the remote control mechanism to replicate linear movement of the moving part, such that linear displacement of the conductive target corresponds to linear displacement of the moving part.

11. A redundant sensing sensor system configured to measure linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices, the redundant sensing sensor system comprising: A plurality of sensing sensors, wherein each of the sensing sensors is located on one of a plurality of sensor sections of the PCBA, each of the plurality of sensing sensors includes a transmitter coil configured to generate a magnetic field when energized, and each of the sensing sensors includes a plurality of receiver coils connected to a respective transmitter coil of each of the sensing sensors via a magnetic field generated by each respective transmitter coil when energized. and Multiple integrated circuits on one or more of the sensor sections of the PCBA, each of the integrated circuits being electrically connected to at least one of the transmitter coils of the sensing sensor, the integrated circuits being configured to transmit high-frequency time-varying signals to excite each of the transmitter coils to generate the magnetic field on the sensor section, the magnetic field respectively inducing one or more output signals on the corresponding receiver coil of each of the sensing sensors; Each magnetic field induces eddy currents in the conductive target, the eddy currents generating a counter-magnetic field configured to alter one or more output signals of at least one sensing sensor in response to a linear displacement of the conductive target.

12. The redundant sensing sensor system according to claim 11, wherein, Each of the sensing sensors is configured to detect a unique linear displacement range of the conductive target.

13. The sensing sensor of claim 11, wherein each of the transmitter coil and the receiver coil includes a conductive trace integrated into a respective sensor portion of the PCBA, and wherein each of the receiver coils of the sensing sensor includes a first receiver coil and a second receiver coil physically shifted 90° relative to each other on the PCBA, thereby defining a 90° phase shift between the first receiver coil and the second receiver coil of each of the sensing sensors, such that one or more output signals of the first receiver coil and the second receiver coil also include a 90° phase shift relative to a linear displacement of the conductive target.

14. The sensing sensor of claim 11, wherein each of the sensor portions is spaced apart from the target along the vertical axis of the PCBA at a predetermined interval.

15. The sensing sensor according to claim 11, wherein, The integrated circuit is configured to receive one or more altered output signals from at least one of the sensing sensors, and to amplify, filter, and output at least one of the altered one or more output signals for use in external signal processing.

16. A method for measuring the linear motion of a conductive target mounted on a printed circuit board assembly (PCBA) for electrical protection devices, the method comprising: A high-frequency time-varying signal is emitted by the integrated circuit on the PCBA. The high-frequency time-varying signal is used to excite the transmitter coil on the sensor part of the PCBA, so that the transmitter coil generates a magnetic field. One or more output signals are induced on the receiver coil of the sensor section of the PCBA by the magnetic field; Eddy currents are induced in the conductive target by the magnetic field; The eddy currents generate a counter-magnetic field to change one or more output signals of the receiver coil in response to the linear displacement of the conductive target.

17. The method of claim 16, further comprising physically shifting the receiver coils on the PCBA by 90° relative to each other to apply a 90° phase shift to one or more altered output signals, thereby generating one or more ratio sine and cosine signals.

18. The method of claim 17, further comprising applying a mathematical sequence to the one or more ratio sine and cosine signals to convert the altered output signal into an absolute position.

19. The method of claim 16, further comprising: The integrated circuit receives one or more altered output signals from the sensing sensor, and amplifies, filters, and outputs at least one of the altered one or more output signals for external signal processing.

20. The method of claim 19, wherein the external signal processing includes converting one or more altered output signals into digital data for characterizing at least one of the position, velocity, and acceleration of the conductive target.

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