Blind pixel compensation device and infrared imaging device

By compensating for the resistance difference of the blind element in the uncooled infrared focal plane detector, the problem of inaccurate imaging caused by the resistance difference of the pixels is solved, and higher precision thermal radiation image generation is achieved.

CN121595038APending Publication Date: 2026-03-03SHANGHAI DIECHENG PHOTOELECTRIC TECH CO LTD
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Patent Information

Application Number
CN202411164003.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-08-22
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

In uncooled infrared focal plane detectors, the resistance difference of pixels in the blind element leads to inaccurate sensing of thermal radiation intensity, which in turn affects the imaging accuracy.

Method used

The voltage reading module selects the voltage values ​​of the pixel unit and the blind unit, the comparison module compares the voltage differences, the compensation module generates a compensation signal, the processor generates grayscale values, and the adjustable resistor control circuit adjusts the resistance value to eliminate resistance differences and ensure that the resistance of the blind unit is consistent.

Benefits of technology

It improves the accuracy of thermal radiation images, reduces grayscale errors, and enhances image quality.

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Abstract

The invention discloses a blind pixel compensation device and an infrared imaging device, and relates to the field of infrared imaging, and the device comprises a voltage reading module which is used for selecting a voltage value of a pixel unit and a voltage value of a corresponding blind pixel unit, and outputting the voltage value of the pixel unit and the voltage value of the corresponding blind pixel unit to a comparison module; the comparison module is used for comparing the voltage value of the pixel unit with the voltage value of the corresponding blind pixel unit and outputting an imaging signal to the processor; the compensation module is used for generating a compensation signal of each pixel point according to the resistance difference of each pixel point in the blind pixel unit; the processor is connected with the output end of the comparison module and the output end of the compensation module, and is used for generating the gray value of each pixel point in the thermal radiation image based on the imaging signal and the compensation signal. According to the embodiment of the invention, the differences among the pixel points in the blind pixel units are compensated to ensure that the resistance values in the blind pixel units are consistent, so that the thermal radiation image formed based on the differences between the blind pixel units and the pixel units is more accurate.
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Description

Technical Field

[0001] This invention relates to the field of infrared imaging, and in particular to a device for blind pixel compensation and an infrared imaging device. Background Technology

[0002] Uncooled infrared focal plane array detectors are primarily based on thermal sensors fabricated using microelectromechanical systems (MEMS). They sense the thermal radiation from external objects and convert it into a recognizable digital quantity based on the difference between pixels that receive thermal radiation and blind pixels that do not. This digital quantity is then used to obtain grayscale values, generating a thermal radiation image. During this conversion, the equivalent resistance of each pixel in a blind pixel should be the same. However, due to the resistance differences between pixels within a blind pixel, the calculation of the difference between pixel units and blind pixels leads to inaccurate sensing of thermal radiation intensity. Consequently, the differences between pixels during imaging are not obvious, and the inaccurate grayscale values ​​reduce the accuracy of the final thermal radiation image. Summary of the Invention

[0003] The purpose of this invention is to provide a device for blind pixel compensation and an infrared imaging device. By compensating for the differences between individual pixels in the blind unit, the resistance values ​​in the blind unit are made consistent, thereby making the thermal radiation image formed based on the differences between the blind unit and the pixel unit more accurate.

[0004] To solve the above-mentioned technical problems, the present invention provides a device for blind pixel compensation, comprising:

[0005] A voltage reading module is connected to a pixel unit and a dead pixel unit respectively. It is used to select the voltage value of the pixel unit and the voltage value of the corresponding dead pixel unit, and output the voltage value of the pixel unit and the voltage value of the corresponding dead pixel unit to the comparison module.

[0006] Wherein, the pixel unit is the pixel point of the infrared sensor that receives thermal infrared signals, and the blind pixel unit is the pixel point of the infrared sensor that does not receive thermal infrared signals;

[0007] The comparison module has its first and second input terminals connected to the output terminal of the voltage reading module. It is used to compare the voltage value of the pixel unit with the voltage value of the corresponding blind pixel unit and output the imaging signal to the processor.

[0008] A compensation module, the input of which is connected to the blind pixel unit, is used to generate a compensation signal for each pixel based on the resistance difference between each pixel in the blind pixel unit.

[0009] The processor is connected to the output of the comparison module and the output of the compensation module, respectively, and is used to generate grayscale values ​​of each pixel in the thermal radiation image based on the imaging signal and the compensation signal.

[0010] On the other hand, the pixel unit includes M columns × N rows of pixels, and the blind pixel unit includes M columns × 1 row of pixels, where M and N are both integers not less than 1;

[0011] The N pixels in the Mth column of the pixel unit correspond to the pixels in the Mth column of the blind pixel unit.

[0012] On the other hand, the comparison module includes a comparator;

[0013] The non-inverting input of the comparator is connected to the first output of the voltage reading module, and the inverting input of the comparator is connected to the second output of the voltage reading module.

[0014] The comparator is used to compare the voltage output by the pixel unit input at the positive input terminal with the voltage output by the blind pixel unit input at the negative input terminal, and generate the imaging signal output.

[0015] On the other hand, it also includes unit signal processing circuits;

[0016] The input terminal of the unit signal processing circuit is connected to the output terminal of the comparator, and the output terminal of the unit signal processing circuit is connected to the first input terminal of the processor.

[0017] The unit signal processing circuit is used to convert the imaging signal from an analog signal to a digital signal and output it to the processor.

[0018] On the other hand, the compensation module includes a selection module and a resistance detection module;

[0019] The input terminal of the selection module is connected to the blind cell unit, the output terminal of the selection module is connected to the input terminal of the resistance detection module, and the output terminal of the resistance detection module is connected to the second input terminal of the processor.

[0020] The selection module is used to select pixels in the blind cell, and the resistance detection module is used to detect the resistance value of pixels in the blind cell.

[0021] On the other hand, the resistance detection module includes a first resistor, a second resistor, a third resistor, and an analog-to-digital conversion circuit;

[0022] The first end of the first resistor is connected to the output end of the selection module, the first end of the third resistor, and the first input end of the analog-to-digital converter circuit, respectively. The second end of the first resistor is connected to the first end of the second resistor and the second input end of the analog-to-digital converter circuit, respectively. The second end of the second resistor is connected to the second end of the third resistor, and the output end of the analog-to-digital converter circuit is connected to the processor.

[0023] The analog-to-digital converter is used to perform analog-to-digital conversion, and the processor is used to determine the resistance value of the pixel in the blind cell based on the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor.

[0024] On the other hand, the first resistor, the second resistor, and the third resistor are all controllable resistors, and the blind pixel compensation device also includes an adjustable resistor control circuit.

[0025] The input terminal of the adjustable resistor control circuit is connected to the control signal output terminal of the processor, and the output terminal of the adjustable resistor control circuit is connected to the control terminal of the first resistor, the control terminal of the second resistor, and the control terminal of the third resistor, respectively.

[0026] The adjustable resistor control circuit is used to adjust the resistance values ​​of the first resistor, the second resistor, and the third resistor based on the control signal received at the input terminal.

[0027] On the other hand, the process of determining the resistance value of a pixel in the blind cell based on the analog-to-digital converter, the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor includes:

[0028] The processor sends the control signal to the adjustable resistor control circuit to adjust the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor.

[0029] When the voltage values ​​input to the first and second input terminals of the analog-to-digital converter are 0 and the output voltage is 0, the resistance value of the pixel in the blind cell is determined based on the resistance values ​​of the first resistor, the second resistor, and the third resistor.

[0030] On the other hand, generating the grayscale value of each pixel in the thermal radiation image based on the imaging signal and the compensation signal includes:

[0031] Determine the resistance value of each pixel in the blind cell;

[0032] Identify the resistance values ​​of abnormal pixels whose resistance values ​​differ from other pixels, and determine the difference in resistance values;

[0033] The infrared sensor was tested using a blackbody to obtain the grayscale value of each pixel in the thermal radiation image.

[0034] Determine the difference between the gray value corresponding to the abnormal pixel and the gray value corresponding to other pixels, and the compensation signal is the difference in gray values;

[0035] The correspondence between the resistance value and the gray value is determined based on the difference between the gray values ​​and the difference between the resistance values;

[0036] The gray value corresponding to the imaging signal is added to the gray value corresponding to the compensation signal to obtain the gray value of each pixel in the thermal radiation image.

[0037] To address the aforementioned technical problems, the present invention also provides an infrared imaging device, including the aforementioned device for blind pixel compensation.

[0038] This application provides a device for blind pixel compensation and an infrared imaging device, relating to the field of infrared imaging. It includes a voltage reading module for selecting the voltage value of a pixel unit and the corresponding voltage value of a blind pixel unit, and outputting the voltage values ​​of the pixel unit and the corresponding blind pixel unit to a comparison module; the comparison module for comparing the voltage values ​​of the pixel unit and the corresponding blind pixel unit, and outputting an imaging signal to a processor; and a compensation module for generating a compensation signal for each pixel based on the resistance difference between each pixel in the blind pixel unit. The processor is connected to the output terminals of both the comparison module and the compensation module, and is used to generate grayscale values ​​for each pixel in a thermal radiation image based on the imaging signal and the compensation signal. By compensating for the differences between pixels in the blind pixel unit, the resistance values ​​in the blind pixel unit are ensured to be consistent, thus making the thermal radiation image formed based on the differences between the blind pixel unit and the pixel unit more accurate. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the prior art and embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 A schematic diagram of the structure of a device for blind pixel compensation provided by the present invention;

[0041] Figure 2 This is a schematic diagram of another device for blind pixel compensation provided by the present invention. Detailed Implementation

[0042] The core of this invention is to provide a device for blind pixel compensation and an infrared imaging device. By compensating for the differences between individual pixels in the blind unit, the resistance values ​​in the blind unit are kept consistent, thereby making the thermal radiation image formed based on the differences between the blind unit and the pixel unit more accurate.

[0043] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] Figure 1 This is a schematic diagram of a blind pixel compensation device provided by the present invention. The blind pixel compensation device includes:

[0045] Voltage reading module 1 is connected to the pixel unit and the blind unit respectively. It is used to select the voltage value of the pixel unit and the voltage value of the corresponding blind unit, and output the voltage value of the pixel unit and the voltage value of the corresponding blind unit to the comparison module 2.

[0046] Among them, the pixel unit is the pixel point of the infrared sensor that receives thermal infrared signal, and the blind pixel unit is the pixel point of the infrared sensor that does not receive thermal infrared signal.

[0047] Comparison module 2, the first input terminal and the second input terminal of comparison module 2 are both connected to the output terminal of voltage reading module 1, used to compare the voltage value of pixel unit and the voltage value of corresponding blind pixel unit, and output imaging signal to processor 4;

[0048] Compensation module 3, the input of compensation module 3 is connected to the blind pixel unit, and is used to generate compensation signals for each pixel based on the resistance difference between each pixel in the blind pixel unit.

[0049] Processor 4 is connected to the output of comparison module 2 and the output of compensation module 3, respectively, and is used to generate gray values ​​of each pixel in the thermal radiation image based on the imaging signal and the compensation signal.

[0050] The principle of thermal imaging is that the resistance value of each pixel in a pixel unit changes after receiving thermal radiation. Because the thermal radiation received by each pixel is different, the resistance changes differently. The dead pixel unit does not collect thermal infrared signals and is directly sealed. Since the resistance value of the pixels in the pixel unit changes, while the resistance value of the pixels in the dead pixel unit does not change, by comparing the difference between the two, the thermal radiation received by the pixel unit can be determined. This thermal radiation is then converted into a grayscale value, achieving thermal radiation imaging.

[0051] However, a problem with existing technologies is that the resistance values ​​of individual pixels within a blind pixel unit differ, leading to errors when analyzing the resistance differences between pixels in blind pixels and pixels in pixel units. The existence of resistance differences within blind pixels causes deviations in the sensing of thermal radiation, resulting in reduced differences between grayscale values ​​and ultimately lower accuracy in the generated thermal radiation image.

[0052] Voltage reading module 1 reads the voltage values ​​of the pixels in the pixel unit and the voltage values ​​of the pixels in the corresponding blind pixel unit, respectively. After comparison by comparison module 2, an imaging signal is generated. This application provides a compensation module 3, which generates a compensation signal based on the resistance difference between the pixels in each blind pixel unit. Processor 4 receives the imaging signal output by comparison module 2 and the compensation signal output by compensation module 3, and simultaneously determines the grayscale value of each pixel in the thermal radiation image based on the imaging signal and the compensation signal.

[0053] It should also be noted that the dashed boxes surrounding the pixel unit, blind pixel unit, voltage readout module 1, comparison module 2, unit signal processing circuit, and selection module represent the internal components of the chip.

[0054] This application provides a device for blind pixel compensation and an infrared imaging device, relating to the field of infrared imaging. It includes a voltage reading module 1 for selecting the voltage value of a pixel unit and the corresponding voltage value of a blind pixel unit, and outputting the voltage values ​​of the pixel unit and the corresponding blind pixel unit to a comparison module 2. The comparison module 2 compares the voltage values ​​of the pixel unit and the corresponding blind pixel unit, and outputs an imaging signal to a processor 4. A compensation module 3 generates a compensation signal for each pixel based on the resistance difference between each pixel in the blind pixel unit. The processor 4 is connected to the output terminals of both the comparison module 2 and the compensation module 3, and is used to generate grayscale values ​​for each pixel in a thermal radiation image based on the imaging signal and the compensation signal. By compensating for the differences between pixels in the blind pixel unit, the resistance values ​​in the blind pixel unit are ensured to be consistent, thus making the thermal radiation image formed based on the differences between the blind pixel unit and the pixel unit more accurate.

[0055] Based on the above embodiments:

[0056] In some embodiments, a pixel unit includes M columns × N rows of pixels, and a blind pixel unit includes M columns × 1 row of pixels, where M and N are both integers not less than 1;

[0057] The Nth pixel in the Mth column of the pixel unit corresponds to the pixel in the Mth column of the blind cell unit.

[0058] For example, in this application, a pixel unit comprises 640 columns × 480 rows of pixels, so M is 640 and N is 480, and a blind pixel unit comprises 640 columns × 1 row of pixels. This application does not need to increase the number of pixels in the blind pixel unit to increase imaging accuracy. Pixels in each column of pixel units correspond to pixels in the same blind pixel unit. For example, pixels in the 2nd column, 1st row of a pixel unit to pixels in the 2nd column, 480th row all correspond to pixels in the 2nd column, 1st row of a blind pixel unit.

[0059] Reducing the number of pixels in a blind cell not only saves costs but also prevents the entire device from becoming unusable due to the failure of a single pixel.

[0060] In some embodiments, the comparison module 2 includes a comparator;

[0061] The non-inverting input of the comparator is connected to the first output of the voltage reading module 1, and the inverting input of the comparator is connected to the second output of the voltage reading module 1.

[0062] The comparator is used to compare the voltage output of the pixel unit input at the positive input terminal with the voltage output of the blind pixel unit input at the negative input terminal, and generate an imaging signal output.

[0063] The comparator's inverting input is connected to the voltage output from the pixel unit, and its inverting input is connected to the voltage output from the dead pixel unit. Both voltages are read by voltage reading module 1 and input to the comparator's inverting and non-inverting inputs. The comparator obtains the imaging signal by comparing the difference between the two voltages.

[0064] In some embodiments, a unit signal processing circuit 5 is also included;

[0065] The input terminal of the unit signal processing circuit 5 is connected to the output terminal of the comparator, and the output terminal of the unit signal processing circuit 5 is connected to the first input terminal of the processor 4.

[0066] The unit signal processing circuit 5 is used to convert the imaging signal from an analog signal to a digital signal and output it to the processor 4.

[0067] Considering that processor 4 can only process digital signals, a unit signal processing circuit 5 is provided to convert the analog value output by the comparator into a digital value and output it to processor 4. At the same time, the unit signal processing circuit 5 can also perform voltage signal stabilization processing.

[0068] In some embodiments, the compensation module 3 includes a selection module 31 and a resistance detection module;

[0069] The input terminal of the selection module 31 is connected to the blind cell unit, the output terminal of the selection module 31 is connected to the input terminal of the resistance detection module, and the output terminal of the resistance detection module is connected to the second input terminal of the processor 4.

[0070] The selection module 31 is used to select pixels in the blind cell, and the resistance detection module is used to detect the resistance value of pixels in the blind cell.

[0071] Considering the differences between pixels in a blind cell, this application uses a resistance detection module to detect each pixel in the blind cell one by one. The selection module 31 selects the corresponding pixel in the blind cell, connects the pixel to the resistance detection module, and then collects the resistance value of the pixel.

[0072] In some embodiments, the resistance detection module includes a first resistor R1, a second resistor R2, a third resistor R3, and an analog-to-digital conversion circuit 32;

[0073] The first end of the first resistor R1 is connected to the output end of the selection module 31, the first end of the third resistor R3 and the first input end of the analog-to-digital converter circuit 32 respectively. The second end of the first resistor R1 is connected to the first end of the second resistor R2 and the second input end of the analog-to-digital converter circuit 32 respectively. The second end of the second resistor R2 is connected to the second end of the third resistor R3. The output end of the analog-to-digital converter circuit 32 is connected to the processor 4.

[0074] The analog-to-digital converter is used to perform analog-to-digital conversion, and the processor 4 is used to determine the resistance value of the pixel in the blind cell based on the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3.

[0075] This application uses a Wheatstone bridge method for measurement. A Wheatstone bridge consists of four resistors forming a bridge; the resistance is determined by measuring the current across the bridge. The resistances of three resistors are known, and the fourth is the resistor being measured. If the current is zero, the resistance of the fourth resistor can be calculated using a formula from the three known resistors. In this application, resistors R1, R2, and R3 are selected and assigned appropriate values. The range of resistance values ​​for R1, R2, and R3 should be close to the equivalent resistance of the pixels inside the infrared sensor IC. If the resistance values ​​differ too much, testing is impossible.

[0076] In some embodiments, the first resistor R1, the second resistor R2, and the third resistor R3 are all controllable resistors, and the blind pixel compensation device further includes an adjustable resistor control circuit 6.

[0077] The input terminal of the adjustable resistor control circuit 6 is connected to the control signal output terminal of the processor 4, and the output terminal of the adjustable resistor control circuit 6 is connected to the control terminal of the first resistor R1, the control terminal of the second resistor R2 and the control terminal of the third resistor R3 respectively.

[0078] The adjustable resistor control circuit 6 is used to adjust the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3 based on the control signal received at the input terminal.

[0079] The analog-to-digital converter circuit 32 reads the voltage value of the Wheatstone bridge composed of resistors R1, R2, R3, and the corresponding blind resistors. By adjusting R1, R2, and R3, the value of ADC1 is reduced to 0. In reality, due to the influence of resistor accuracy, this voltage value cannot be exactly 0, but the closer it is to 0, the more accurate the blind resistor value. At this point, the Rblind value corresponding to the blind resistor is obtained, and this resistance value is recorded inside the FPGA. As long as the voltages V+ and V- are 0, the resistance value of R4 is determined by R1, R2, and R3.

[0080] In some embodiments, the process of determining the resistance value of a pixel in a blind cell based on the analog-to-digital converter, the resistance value of the first resistor R1, the resistance value of the second resistor R2, and the resistance value of the third resistor R3 includes:

[0081] The processor 4 sends control signals to the adjustable resistor control circuit 6 to adjust the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3.

[0082] When the voltage values ​​input to the first and second input terminals of the analog-to-digital converter are 0 and the output voltage is 0, the resistance value of the pixel in the blind cell is determined based on the resistance values ​​of the first resistor R1, the second resistor R2, and the third resistor R3.

[0083] In some embodiments, generating the grayscale value of each pixel in the thermal radiation image based on the imaging signal and the compensation signal includes:

[0084] Determine the resistance value of each pixel in the blind cell;

[0085] Identify the resistance values ​​of abnormal pixels whose resistance values ​​differ from other pixels, and determine the difference in resistance values;

[0086] The infrared sensor was tested using a blackbody to obtain the grayscale value of each pixel in the thermal radiation image.

[0087] Determine the difference between the gray value of the abnormal pixel and the gray value of the other pixel, and use the difference in gray values ​​as the compensation signal.

[0088] The correspondence between resistance value and gray value is determined based on the difference between gray values ​​and the difference between resistance values;

[0089] The gray values ​​of the imaging signal and the compensation signal are added together to obtain the gray values ​​of each pixel in the thermal radiation image.

[0090] Test the resistance values ​​of the 640 MEMS resistors in the 640 x 1 rows. Except for the first MEMS resistor which has a resistance of 90 ohms, the rest are all 100 ohms. Then write the compensation resistance value of 10 ohms for the first resistor into the blind pixel compensation list of processor 4.

[0091] Using a blackbody, each pixel should have the same resistance. Read the ADC data of the first MEMS and the second MEMS (i.e., the value read by the unit signal processing unit). For example, one of these two values ​​is MEMS[1] = 900 and MEMS[2] = 1000. This means that 10 ohms corresponds to the unit 100. When testing actual objects, if the test value of MEMS[1] is 1900, add 100 to it, i.e., MEMS[1] = 2000.

[0092] This application also provides an infrared imaging device, including the above-described device for blind pixel compensation.

[0093] Please refer to the above embodiments for a description of the infrared imaging device provided in this application, and it will not be repeated here.

[0094] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0095] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0096] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A device for blind pixel compensation, characterized in that, include: A voltage reading module is connected to a pixel unit and a dead pixel unit respectively. It is used to select the voltage value of the pixel unit and the voltage value of the corresponding dead pixel unit, and output the voltage value of the pixel unit and the voltage value of the corresponding dead pixel unit to the comparison module. Wherein, the pixel unit is the pixel point of the infrared sensor that receives thermal infrared signals, and the blind pixel unit is the pixel point of the infrared sensor that does not receive thermal infrared signals; The comparison module has its first and second input terminals connected to the output terminal of the voltage reading module. It is used to compare the voltage value of the pixel unit with the voltage value of the corresponding blind pixel unit and output the imaging signal to the processor. A compensation module, the input of which is connected to the blind pixel unit, is used to generate a compensation signal for each pixel based on the resistance difference between each pixel in the blind pixel unit. The processor is connected to the output of the comparison module and the output of the compensation module, respectively, and is used to generate grayscale values ​​of each pixel in the thermal radiation image based on the imaging signal and the compensation signal.

2. The apparatus for blind pixel compensation as described in claim 1, characterized in that, The pixel unit comprises M columns × N rows of pixels, and the blind pixel unit comprises M columns × 1 row of pixels, where M and N are both integers not less than 1; The N pixels in the Mth column of the pixel unit correspond to the pixels in the Mth column of the blind pixel unit.

3. The apparatus for blind pixel compensation as described in claim 1, characterized in that, The comparison module includes a comparator; The non-inverting input of the comparator is connected to the first output of the voltage reading module, and the inverting input of the comparator is connected to the second output of the voltage reading module. The comparator is used to compare the voltage output by the pixel unit input at the positive input terminal with the voltage output by the blind pixel unit input at the negative input terminal, and generate the imaging signal output.

4. The apparatus for blind pixel compensation as described in claim 3, characterized in that, It also includes unit signal processing circuitry; The input terminal of the unit signal processing circuit is connected to the output terminal of the comparator, and the output terminal of the unit signal processing circuit is connected to the first input terminal of the processor. The unit signal processing circuit is used to convert the imaging signal from an analog signal to a digital signal and output it to the processor.

5. The apparatus for blind pixel compensation as described in any one of claims 1 to 4, characterized in that, The compensation module includes a selection module and a resistance detection module; The input terminal of the selection module is connected to the blind cell unit, the output terminal of the selection module is connected to the input terminal of the resistance detection module, and the output terminal of the resistance detection module is connected to the second input terminal of the processor. The selection module is used to select pixels in the blind cell, and the resistance detection module is used to detect the resistance value of pixels in the blind cell.

6. The apparatus for blind pixel compensation as described in claim 5, characterized in that, The resistance detection module includes a first resistor, a second resistor, a third resistor, and an analog-to-digital conversion circuit; The first end of the first resistor is connected to the output end of the selection module, the first end of the third resistor, and the first input end of the analog-to-digital converter circuit, respectively. The second end of the first resistor is connected to the first end of the second resistor and the second input end of the analog-to-digital converter circuit, respectively. The second end of the second resistor is connected to the second end of the third resistor, and the output end of the analog-to-digital converter circuit is connected to the processor. The analog-to-digital converter is used to perform analog-to-digital conversion, and the processor is used to determine the resistance value of the pixel in the blind cell based on the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor.

7. The apparatus for blind pixel compensation as described in claim 6, characterized in that, The first resistor, the second resistor, and the third resistor are all controllable resistors, and the device for blind pixel compensation also includes an adjustable resistor control circuit; The input terminal of the adjustable resistor control circuit is connected to the control signal output terminal of the processor, and the output terminal of the adjustable resistor control circuit is connected to the control terminal of the first resistor, the control terminal of the second resistor, and the control terminal of the third resistor, respectively. The adjustable resistor control circuit is used to adjust the resistance values ​​of the first resistor, the second resistor, and the third resistor based on the control signal received at the input terminal.

8. The apparatus for blind pixel compensation as described in claim 7, characterized in that, The process of determining the resistance value of a pixel in the blind cell based on the analog-to-digital converter, the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor includes: The processor sends the control signal to the adjustable resistor control circuit to adjust the resistance value of the first resistor, the resistance value of the second resistor, and the resistance value of the third resistor. When the voltage values ​​input to the first and second input terminals of the analog-to-digital converter are 0 and the output voltage is 0, the resistance value of the pixel in the blind cell is determined based on the resistance values ​​of the first resistor, the second resistor, and the third resistor.

9. The apparatus for blind pixel compensation as described in claim 1, characterized in that, Generating the grayscale value of each pixel in the thermal radiation image based on the imaging signal and compensation signal includes: Determine the resistance value of each pixel in the blind cell; Identify the resistance values ​​of abnormal pixels whose resistance values ​​differ from other pixels, and determine the difference in resistance values; The infrared sensor was tested using a blackbody to obtain the grayscale value of each pixel in the thermal radiation image. Determine the difference between the gray value corresponding to the abnormal pixel and the gray value corresponding to other pixels, and the compensation signal is the difference in gray values; The correspondence between the resistance value and the gray value is determined based on the difference between the gray values ​​and the difference between the resistance values; The gray value corresponding to the imaging signal is added to the gray value corresponding to the compensation signal to obtain the gray value of each pixel in the thermal radiation image.

10. An infrared imaging device, characterized in that, The apparatus includes the blind pixel compensation as described in any one of claims 1 to 9.