Dynamic measurement system for high-temperature infrared emissivity of complex curved surface part

Abstract

The invention discloses a dynamic measurement system for high-temperature infrared emissivity of a part with a complex curved surface. The dynamic measurement system comprises a rotating platform for rotatably placing a part to be measured; the heating assembly is used for heating the part to be measured; the infrared detector is used for detecting infrared radiation emitted by the part to be measured; the infrared emission receiver is used for emitting and receiving infrared rays to the surface of the to-be-measured part; the pitching regulator is used for regulating the pitching angle of the infrared detector; the lifting adjuster is used for adjusting the vertical positions of the pitching adjuster, the infrared detector and the infrared emission receiver; the translation adjuster is used for adjusting the horizontal position of the lifting adjuster; the controller is used for unified control; and the upper computer is used for generating an infrared emissivity distribution diagram of the to-be-measured part. According to the invention, the visual angle of the infrared detector can be automatically adjusted, and normal detection on the surface of the to-be-measured part is always maintained, so that the method can be used for detecting the high-temperature infrared emissivity of the complex curved-surface part.

Description

Technical Field

[0001] This invention relates to the field of infrared radiation detection technology, and in particular to a dynamic measurement system for the high-temperature infrared emissivity of complex curved surface parts, which can be used to dynamically measure the infrared emissivity of parts with complex curved surfaces under high-temperature conditions. Background Technology

[0002] Currently, complex curved surface parts (such as conical thin-walled parts, curved plates, etc.) are widely used in aerospace, infrared stealth, thermal protection and other fields. Their surface infrared emissivity under high temperature conditions is a key parameter affecting their thermal management and infrared recognition performance.

[0003] Traditional infrared measurements often rely on furnace heating. However, in high-temperature environments, interference from infrared reflections from the furnace walls and normal deviations between the part surface and the infrared detector lead to generally higher measured radiation temperatures, affecting the accuracy of surface infrared emissivity inversion. Furthermore, due to the high curvature variations of complex curved surfaces, it is difficult for infrared detectors in fixed positions to perform equidistant, normal-direction measurements across the entire part surface, resulting in thermal image distortion and attitude deviations, further reducing the repeatability and reliability of the measurements.

[0004] Two types of physical effects cause distortion in thermal images: First, an improper observation angle causes attenuation of infrared radiation reception intensity, resulting in a systematically lower temperature reading. Second, the large curvature of the observation area of ​​the part under test forms a mirror-like reflection, mixing the high-temperature radiation from the furnace wall and heating elements into the true signal, leading to artificially high or even completely distorted local temperature readings. The combination of these two physical effects will cause the thermal image to completely lose its accuracy in terms of radiation temperature.

[0005] Attitude deviation refers to the phenomenon in static measurement mode where, due to the fixed installation of the infrared detector, only a limited narrow band on the surface of the part can be observed vertically. The normal of the other areas of the complex curved surface is affected by its own curvature, and the surface normal continuously deviates from the line of sight of the infrared detector. This normal deviation will directly induce thermal image distortion.

[0006] Therefore, in order to address the above problems, there is an urgent need for a dynamic measurement system for the high-temperature infrared emissivity of complex curved surface parts, which can not only adapt the parts to high-temperature environments, but also have the function of automatically adjusting the viewing angle to maintain the normal detection function. Summary of the Invention

[0007] This invention provides a dynamic measurement system for the high-temperature infrared emissivity of complex curved surface parts, which aims to achieve dynamic measurement of the surface infrared emissivity of complex curved surface parts under high-temperature conditions by means of heating with a rotating platform and automatically adjusting the viewing angle.

[0008] To achieve the above objectives, this invention discloses a dynamic measurement system for the high-temperature infrared emissivity of complex curved surface parts, comprising: a rotating platform for rotatably placing the part to be measured; a heating assembly for heating the part to be measured, the heating assembly being disposed on the rotating platform; an infrared detector for detecting the infrared radiation emitted by the part to be measured; an infrared transmitter and receiver for determining the normal direction detection of the surface of the part to be measured by the infrared detector by emitting infrared light onto the surface of the part to be measured and receiving the reflected infrared light, the infrared transmitter and receiver being fixedly connected to the infrared detector; and a pitch adjuster for adjusting the pitch based on the reception of the infrared transmitter and receiver. The system includes: an adjustment mechanism for the pitch angle of the infrared detector to enable normal detection of the part to be measured; a lifting adjuster for adjusting the vertical position of the pitch adjuster, the infrared detector, and the infrared transmitter / receiver; a translation adjuster for adjusting the horizontal position of the lifting adjuster; a controller for uniformly controlling the heating assembly to heat the part to be measured, and for controlling the rotating platform, the infrared detector, the infrared transmitter / receiver, the pitch adjuster, the lifting adjuster, and the translation adjuster; and a host computer for receiving angle data from the rotating platform and infrared data acquired by the infrared detector, and generating an infrared emissivity distribution map of the part to be measured.

[0009] In some embodiments, the pitch adjuster includes a pitch adjustment motor for adjusting the pitch angle of the infrared detector and the infrared transmitter / receiver.

[0010] In some embodiments, the lifting adjuster includes: a Y-axis lead screw assembly for lifting and mounting the pitch adjustment motor, the infrared detector, and the infrared transmitter and receiver; and a Y-axis servo motor for driving the Y-axis lead screw assembly to rotate to adjust the pitch adjustment motor, the infrared detector, and the infrared transmitter and receiver to lift and lower.

[0011] In some embodiments, the translation adjuster includes: a Z-axis lead screw assembly for translating the Y-axis lead screw assembly; and a Z-axis servo motor for driving the Y-axis lead screw assembly to translate.

[0012] In some embodiments, the heating assembly uses a resistance heating wire for heating.

[0013] In some embodiments, the resistance heating wire is in a spiral-rising shape.

[0014] In summary, the present invention has at least the following beneficial effects: by cooperating with the infrared transmitter and receiver, the pitch adjuster, the height adjuster, and the translation adjuster, the pitch angle, vertical position, and horizontal position of the infrared detector can be adjusted so that the infrared detector can automatically adjust the viewing angle and always maintain normal detection of the surface of the part to be measured. Therefore, it can be used to detect the high-temperature infrared emissivity of the part to be measured with a complex curved surface. Attached Figure Description

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a dynamic measurement system 100 for high-temperature infrared emissivity of complex curved surface parts according to some embodiments of this specification.

[0017] Figure 2 This is a schematic diagram showing a heat insulation plate installed on the upper part of the opening of the part to be measured in some embodiments of this specification.

[0018] Figure 3 This is a control principle diagram of system 100 according to some embodiments of this specification.

[0019] Reference numerals in the attached drawings: 1. Rotary platform; 2. Fixture; 3. Heating assembly; 4. Part to be measured; 5. Z-axis lead screw assembly; 6. Z-axis servo motor; 7. Y-axis lead screw assembly; 8. Y-axis servo motor; 9. Infrared transmitter and receiver; 10. Infrared detector; 11. Pitch adjustment motor; 12. Controller; 13. Host computer; 14. Heat insulation plate. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are presented briefly. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the embodiments of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0021] The following disclosure provides many different implementations or examples for carrying out different structures of the embodiments of the present invention. To simplify the disclosure of the embodiments of the present invention, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. Furthermore, reference numerals and / or reference letters may be repeated in different examples of the embodiments of the present invention; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0022] Figure 1 This is a schematic diagram of a dynamic measurement system 100 for high-temperature infrared emissivity of complex curved surface parts according to some embodiments of this specification.

[0023] like Figure 1 As shown, in some embodiments, system 100 may include a rotating platform 1, a heating assembly 3, an infrared detector 10, an infrared transmitter and receiver 9, a pitch adjuster, a height adjuster, a translation adjuster, a controller 12, and a host computer 13.

[0024] The rotating platform 1 can be used to rotate the part 4 to be measured.

[0025] In some embodiments, the part 4 to be measured can be a conical thin-walled part, a curved plate, etc. In some embodiments, the part 4 to be measured can be a cylindrical thin-walled part, a frustum-shaped thin-walled part, and other various rotating thin-walled parts, etc.

[0026] In some embodiments, the rotating platform 1 can be fixed by the clamp 2 to the part 4 to be measured.

[0027] In some embodiments, a rotation angle encoder is installed on the rotating platform 1, which is used to acquire the rotation angle signal of the rotating platform 1.

[0028] Heating component 3 can be used to heat the part 4 to be measured, and heating component 3 is set on the rotating platform 1.

[0029] In some embodiments, the heating component 3 may be heated using a resistance heating wire.

[0030] In some embodiments, the resistance heating wire may be a contour heating rod that matches the geometry of the inner wall of the part 4 to be measured. For example, the contour heating rod may be... Figure 1 The cone-shaped heating rod with a spiral upward shape is shown in Figure 3. For example, the simulated heating rod can be a cone, frustum, cylinder, or other complex rotating body.

[0031] In some embodiments, the upper part of the part 4 to be measured is open; therefore, a high-temperature resistant heat insulation plate 14 needs to be placed at the opening, such as... Figure 2As shown, this effectively blocks heat loss during the heating process and avoids external environmental interference during the measurement process.

[0032] The shaped heating rod in some of the foregoing embodiments can match the geometry of the inner wall of the part 4 to be measured, thus enabling uniform radiative heating of the inner wall of the part 4 to be measured during the heating process.

[0033] The aforementioned embodiments, by combining the rotating platform 1 with the heating component 3, can effectively avoid reflection interference caused by traditional furnace heating methods, thereby improving measurement stability.

[0034] Infrared detector 10 can be used to detect the infrared radiation emitted by the part 4 to be measured.

[0035] In some embodiments, the infrared detector 10 may be a thermal detector based on the thermal effect of infrared radiation.

[0036] In some embodiments, the infrared detector 10 operates in the 8-14 μm band.

[0037] When the infrared radiation emitted by the part 4 to be measured shines on the infrared detector 10, the sensing material of the detector 10 absorbs the radiation energy, and its resistance or voltage changes according to the intensity of the absorbed infrared radiation. This change is directly related to the radiation intensity of the object's surface. The detector converts the infrared radiation intensity into an electrical signal through the signal generated by these physical changes, and the signal is processed by the host computer 13, thereby realizing the measurement of the infrared radiation intensity of the part 4 to be measured.

[0038] In some embodiments, the infrared transmitter receiver 9 is used to determine the normal detection of the surface of the part 4 to be measured by the infrared detector 10 by emitting infrared light from the surface of the part 4 to be measured and receiving the reflected infrared light. The infrared transmitter receiver 9 is fixedly connected to the infrared detector 10.

[0039] The pitch adjuster is used to adjust the pitch angle of the infrared detector 10 based on the reception of the infrared transmitter receiver 9 so that the infrared detector 10 can perform normal detection on the part 4 to be measured.

[0040] In some embodiments, the pitch adjuster may include a pitch adjustment motor 11. The pitch adjustment motor 11 can be used to adjust the pitch angle of the infrared detector 10 and the infrared transmitter / receiver 9.

[0041] In some embodiments, the output terminal of the pitch adjustment motor 11 is fixedly connected to the infrared detector 10 and the infrared transmitter / receiver 9. When the output terminal of the pitch adjustment motor 11 rotates, it can drive the infrared detector 10 and the infrared transmitter / receiver 9 to rotate, thereby adjusting the pitch angle of the infrared detector 10 and the infrared transmitter / receiver 9.

[0042] The elevation adjuster is used to adjust the vertical position of the pitch adjuster, infrared detector 10, and infrared transmitter / receiver 9.

[0043] In some embodiments, the lifting adjuster may include: a Y-axis lead screw assembly 7 and a Y-axis servo motor 8.

[0044] The Y-axis lead screw assembly 7 is used for lifting and mounting the pitch adjustment motor 11, the infrared detector 10, and the infrared transmitter and receiver 9. The Y-axis lead screw assembly 7 includes a Y-axis lead screw and a Y-axis slider, and the pitch adjustment motor 11, the infrared detector 10, and the infrared transmitter and receiver 9 can all be mounted on the Y-axis slider.

[0045] The Y-axis servo motor 8 drives the Y-axis lead screw assembly 7 to rotate, thereby adjusting the pitch adjustment motor 11, infrared detector 10, and infrared transmitter / receiver 9 for vertical movement. When the output end of the Y-axis servo motor 9 rotates, the Y-axis lead screw rotates and drives the Y-axis slider to rise and fall, thereby driving the pitch adjustment motor 11, infrared detector 10, and infrared transmitter / receiver 9 to rise and fall.

[0046] The translation adjuster is used to adjust the horizontal position of the lifting adjuster.

[0047] In some embodiments, the translation adjuster may include: a Z-axis lead screw assembly 5 and a Z-axis servo motor 6.

[0048] Z-axis lead screw assembly 5 is used for translational mounting of Y-axis lead screw assembly 7. Z-axis lead screw assembly 5 includes Z-axis lead screw and Z-axis slider, and Y-axis lead screw assembly 7 is translated onto Z-axis lead screw via Z-axis slider.

[0049] Z-axis servo motor 6 is used to drive Y-axis lead screw assembly 7 to translate. When the output end of Z-axis servo motor 6 rotates, Z-axis lead screw rotates and drives Z-axis slider to move horizontally, thereby driving Y-axis lead screw assembly 7 to move horizontally, realizing the adjustment of the horizontal position of the lifting adjuster.

[0050] Some of the aforementioned embodiments employ a dual-axis linear guide system (including a lifting adjuster and a translation adjuster) to adjust the distance and height, which can flexibly adapt to parts of different sizes to be measured.

[0051] The aforementioned embodiments, by setting up a pitch adjuster and a hybrid infrared transmitter and receiver 9, can achieve automated normal alignment under the control of the controller 12, thereby enabling normal measurement to be performed on the surface of the part to be measured at all times, improving angular consistency and measurement accuracy.

[0052] The controller 12 is used to uniformly control the heating assembly 3 to heat the part 4 to be measured, and to control the rotating platform 1, infrared detector 10, infrared transmitter and receiver 9, pitch adjuster, height adjuster and translation adjuster.

[0053] The host computer 13 is used to receive the angle data of the rotating platform 1 and the infrared data acquired by the infrared detector 10, and generate the radiation temperature distribution map of the part 4 to be measured, and then generate the infrared emissivity distribution map of the part 4 to be measured through calculation and processing.

[0054] The host computer 13 can be equipped with an image processing and emissivity calculation module to visualize the output results, which is applicable to the infrared emissivity measurement of complex curved surface parts.

[0055] The system 100 of some of the aforementioned embodiments can be applied to non-contact infrared performance testing of irregular curved surface parts under high temperature conditions, and can be widely used in fields such as infrared stealth materials, thermal protection structures, and aero engines.

[0056] The control principles of system 100 in some embodiments of this specification are as follows: Figure 3 As shown, the details are as follows.

[0057] The part to be measured, 4, is placed in the center of the rotating platform 1 and clamped by a fixture.

[0058] The heating component 3 is installed on the rotating platform 1, or it can be installed inside or below the rotating platform 1 to heat the inner wall or back of the part 4 to be measured.

[0059] The rotating platform 1 is driven by a motor to rotate and drive the part to be measured 4 to rotate at a set speed.

[0060] Infrared detector 10 is mounted on a lift adjuster via a pitch adjuster, which in turn is mounted on a pan adjuster. Infrared transmitter / receiver 9 is mounted above infrared detector 10. The emission optical axis of infrared transmitter / receiver 9 is precisely calibrated to be parallel to the central axis of the field of view of infrared detector 10. The distance between the infrared detector and the central axis of rotating platform 1 is the observation distance. In some embodiments, the distance between the lift adjuster and the central axis of rotating platform 1 can also be recorded as the observation distance.

[0061] The pitch adjuster is used to adjust the pitch angle of the infrared detector 10 and the infrared transmitter and receiver 9. The adjustment range is ±45 degrees, ensuring that the emission optical axis of the infrared transmitter and receiver 9 is parallel to the surface normal of the part 4 to be measured.

[0062] When the infrared transmitter receiver 9 emits a collimated infrared beam toward the surface of the part to be measured 4, the controller 12 compares the reflected light signal received by the infrared transmitter receiver 9 with the emitted light signal. Then, based on the comparison result, the controller controls the pitch adjuster, height adjuster, and translation adjuster to adjust the position of the infrared transmitter receiver 9 until the signal difference between the emitted light signal and the reflected light signal approaches zero. At this point, the controller 12 determines that the emitted light from the infrared transmitter receiver 9 is aligned normally with the surface of the part to be measured 4. Then, the controller 12 locks the pitch adjuster, height adjuster, and translation adjuster to complete the initial calibration.

[0063] The signal difference approaching zero means that as the system 100 automatically adjusts the position and angle of the infrared detector 10, the absolute difference between the emitted and reflected light signals of the infrared transmitter and receiver 9 gradually decreases until the ratio of this absolute difference to the emitted light signal is less than a preset threshold (e.g., 1%). After the signal difference approaches zero, it can be determined that the viewing angle of the infrared detector 10 is accurately aligned with the surface of the part to be measured, enabling normal detection and ensuring high-precision infrared emissivity measurement.

[0064] In some embodiments, the part to be measured 4 is a non-rotating part. During the process of the rotating platform 1 driving the part to be measured 4 to rotate slowly, the lifting adjuster, translation adjuster and pitch adjuster can be linked together under the control of the controller 12, so that the emission optical axis of the infrared transmitter receiver 9 can always be aligned with the surface normal of the part to be measured 4.

[0065] Regarding the technology of controller 12 controlling the various regulators to generate linkage, reference can be made to the multi-degree-of-freedom linkage control and real-time feedback adjustment technologies involved in existing technologies such as six-degree-of-freedom robots, automatic optical inspection systems, and dynamic laser scanning systems. These technologies can be applied to system 100 in this specification so that the emission optical axis of infrared transmitter receiver 9 is automatically aligned with the surface normal of the part 4 to be measured with high precision.

[0066] The controller 12 will only instruct the host computer 13 to receive the infrared thermal image collected by the infrared detector 10 and the rotation angle signal collected by the rotation angle encoder after determining that the emitted light of the infrared transmitter receiver 9 is aligned normally with the surface of the part 4 to be measured.

[0067] The host computer 13 receives infrared thermal images and rotation angle signals through a high-speed data interface.

[0068] In some embodiments, the part to be measured 4 is a rotating part with a complex curved surface. After the initial calibration is completed, the rotating platform 1 rotates at a constant speed, and the infrared detector 8 can continuously acquire thermal images at a fixed pitch angle. Every time the rotating platform 1 rotates by a fixed angle (e.g., 1° or 0.1°), the host computer 13 receives and stores the data once.

[0069] After scanning 360°, the host computer 13 can automatically perform image stitching, including multi-frame image spatial registration, temperature field reconstruction and emissivity inversion calculation, and finally generate a pseudo-color emissivity distribution map.

[0070] The process of image stitching performed by the host computer 13 is as follows.

[0071] Step 1: Acquire thermal images and record parameters.

[0072] When the rotating platform 1 rotates at a constant speed, the infrared detector 10 is positioned fixed and continuously acquires thermal images, while the host computer 13 synchronously records the parameters corresponding to each frame of thermal image. The parameters corresponding to each frame of thermal image may include any one or more combinations of parameters such as the elevation angle of the infrared detector 10, the observation distance of the infrared detector 10 from the central axis of the rotating platform 1, and the rotation angle signal acquired by the rotation angle encoder.

[0073] Step 2: Determine the surface point cloud of each thermal image frame.

[0074] Based on the parameters corresponding to each frame of the thermal image, the host computer 13 can calculate the three-dimensional coordinates of the surface points of the part 4 to be measured in real time, thereby obtaining the surface point cloud corresponding to each frame of the thermal image.

[0075] Step 3: Construct a seamless 3D mesh model.

[0076] The host computer 13 automatically aligns the surface point clouds corresponding to adjacent frames of images using an intelligent stitching algorithm to construct a seamless 3D mesh model.

[0077] The acquired infrared thermal images are then arranged in order of rotation angle. By identifying common feature points between adjacent infrared thermal images, precise inter-frame docking is achieved. The overlapping areas between adjacent infrared thermal images are then smoothly fused to generate a complete pseudo-color radiation temperature distribution map, which is then mapped to the corresponding three-dimensional grid area.

[0078] The host computer 13 has a built-in emissivity calculation module. Based on the radiation temperature and actual heating temperature at each point on the pseudo-color radiation temperature distribution map, the emissivity calculation module calculates the emissivity at each point using the Stefan-Boltzmann law, and finally generates an emissivity distribution map and outputs it in a visual form.

[0079] The embodiments described above are for illustrative purposes only and are not intended to limit the invention. Therefore, any changes in numerical values ​​or substitutions of equivalent elements should still fall within the scope of this invention.

[0080] The above detailed description will enable those skilled in the art to understand that the present invention can indeed achieve the aforementioned objectives and has complied with the provisions of the Patent Law.

[0081] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the invention. The above descriptions are merely preferred embodiments of the invention and are not intended to limit the invention. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

[0082] The basic concepts have been described above. Obviously, for those skilled in the art who have read this application, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore, such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of this application.

[0083] Furthermore, this application uses specific terms to describe its embodiments. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different positions in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0084] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although some currently considered useful embodiments of the invention have been discussed in the foregoing disclosure by way of various examples, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments; rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, although the implementation of the various components described above can be embodied in a hardware device, it can also be implemented as a purely software solution, such as an installation on an existing server or mobile device.

[0085] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this approach of the present application should not be construed as reflecting an intention that the claimed subject matter requires more features than expressly recited in each claim. Rather, the subject of the invention should possess fewer features than in any single embodiment described above.

Claims

1. A dynamic measurement system for the high-temperature infrared emissivity of complex curved surface parts, characterized in that, include: A rotating platform, used for rotating the part to be measured; A heating assembly for heating the part to be measured, the heating assembly being disposed on the rotating platform; An infrared detector is used to detect the infrared radiation emitted by the part to be measured. An infrared transmitter and receiver are used to determine the normal detection of the surface of the part to be measured by the infrared detector by emitting infrared light onto the surface of the part to be measured and receiving the reflected infrared light. The infrared transmitter and receiver are fixedly connected to the infrared detector. A pitch adjuster is used to adjust the pitch angle of the infrared detector based on the reception of the infrared transmitter and receiver so as to enable the infrared detector to perform normal detection on the part to be measured. A height adjustment mechanism is used to adjust the vertical position of the pitch adjuster, the infrared detector, and the infrared transmitter and receiver. A translation adjuster, wherein the translation adjuster is used to adjust the horizontal position of the lifting adjuster; The controller is used to uniformly control the heating assembly to heat the part to be measured, and to control the rotating platform, the infrared detector, the infrared transmitter and receiver, the pitch adjuster, the height adjuster, and the translation adjuster. as well as The host computer is used to receive the angle data of the rotating platform and the infrared data acquired by the infrared detector, and generate an infrared emissivity distribution map of the part to be measured.

2. The dynamic measurement system for high-temperature infrared emissivity of complex curved surface parts according to claim 1, characterized in that, The pitch adjuster includes: A pitch adjustment motor is used to adjust the pitch angle of the infrared detector and the infrared transmitter / receiver.

3. The dynamic measurement system for high-temperature infrared emissivity of complex curved surface parts according to claim 1, characterized in that, The lifting adjuster includes: The Y-axis lead screw assembly is used for lifting and lowering the pitch adjustment motor, the infrared detector, and the infrared transmitter and receiver; and The Y-axis servo motor is used to drive the Y-axis lead screw assembly to rotate in order to adjust the pitch adjustment motor, the infrared detector and the infrared transmitter and receiver for lifting and lowering.

4. The high-temperature infrared emissivity dynamic measurement system for complex curved surface parts according to claim 1, characterized in that, The translation adjuster includes: Z-axis lead screw assembly, the Z-axis lead screw assembly being used for translational mounting of the Y-axis lead screw assembly; and The Z-axis servo motor is used to drive the Y-axis lead screw assembly to translate.

5. The dynamic measurement system for high-temperature infrared emissivity of complex curved surface parts according to claim 1, characterized in that, The heating component uses a resistance heating wire for heating.

6. The high-temperature infrared emissivity dynamic measurement system for complex curved surface parts according to claim 5, characterized in that, The resistance heating wire is in a spiral upward shape.

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