Projection ray machine

Abstract

A projection ray machine comprises a panel assembly which comprises a main circuit board and a plurality of display panels, and each display panel is electrically connected with the main circuit board through a branch circuit; the light combination component is suitable for carrying out color combination on light emitted by the plurality of display panels; and the light emitting surface of each display panel is attached and fixed to one light incident surface of the light combining component. The panel assembly integrates the main circuit board, the branch circuit and the display panel into a whole to form a modular structure. The control circuit is integrated on the main circuit board, electrical connection between the display panels is achieved through the branch circuits, electrical butt joint parts of plug connectors needed by a traditional separated display panel are omitted, and space occupied by connection is greatly reduced. In addition, each display panel is directly attached and fixed to the surface of the light combination component, and a mounting frame in a traditional structure is abandoned to compress the axial size. And the bonding mode not only eliminates the thickness of the mounting frame and the assembly clearance, but also enables the optical path coupling to be more compact.

Description

Technical Field

[0001] This invention relates to the field of display, and in particular to a projection optical engine. Background Technology

[0002] In recent years, Micro LED (Micro Light Emitting Diode Display) technology has developed rapidly, and its application in electronic devices has become increasingly widespread, greatly improving people's quality of life. Micro LED, or micro light-emitting diode display, is an advanced display technology with significant advantages such as high brightness, high contrast, and low power consumption, bringing a qualitative leap to the display effects of electronic devices.

[0003] In practical applications, Micro LED display panels are often assembled with optical components such as lenses to form an optomechanical or light engine structure. With the increasing trend towards miniaturization of electronic devices, the demand for miniaturization of optomechanical structures is becoming increasingly urgent. Especially in the field of wearable electronic devices, the miniaturization of projection optical engines has become a key challenge that urgently needs to be overcome. Chinese patent CN119225104A, "Micro LED Packaging Structure and Micro LED Optical Module," provides a technical solution that reduces the size of the circuit assembly by "dividing the circuit in the substrate into three sub-circuits, each of which is individually connected to the micro LED panel." However, when this solution is combined with a light-combining component, it has been found that there is still room for further improvement to further reduce the overall size of the optomechanical system.

[0004] Therefore, how to utilize the excellent performance of Micro LED optical engines while meeting the requirements for miniaturization is a key direction for current research and development of related technologies. Summary of the Invention

[0005] The technical problem solved by this invention is to provide a projection optical engine to meet the needs of modern electronic devices for miniaturization and portability.

[0006] To address the aforementioned problems, the present invention provides a projection optical engine and a panel assembly, comprising a main circuit board and a plurality of display panels, each of the display panels being electrically connected to the main circuit board via a branch line; a light combining component, adapted to combine the light emitted from the plurality of display panels; characterized in that the light emitting surface of each display panel is bonded and fixed to one light incident surface of the light combining component.

[0007] Optionally, the display panel and the surface of the light-combining component are bonded together with an adhesive.

[0008] Optionally, an external connector is provided on one side of the main circuit board. The external connector is adapted to be electrically connected to an external interface to input signals to each of the display panels through the main circuit board and the branch lines.

[0009] Optionally, the light-combining component is a polyhedron and includes multiple sides. The main circuit board, the branch lines, and the display panels are configured such that after each of the display panels is attached to the surface of the light-combining component, the main circuit board is located on one side of the light-combining component, and the external connector is located away from that side.

[0010] Optionally, it may also include: an extension line electrically connected to the main circuit board; each of the display panels being electrically connected to the main circuit board via the extension line, the extension line being adapted to be bent so that the main circuit board covers a specific side of the light-combining component.

[0011] Optionally, the extension line is a flexible circuit.

[0012] Optionally, the display panel includes: a substrate, the substrate including a first side and an opposite second side, the first side including a display area and a non-display area; the non-display area having a plurality of electrode pads for driving the display area; and a plurality of through-hole plugs located in the substrate, one end of the through-hole plugs being electrically connected to the electrode pads, and the other end of the through-hole plugs extending to the second side of the substrate.

[0013] Optionally, the display panel further includes: a plurality of first solder pads located on the substrate, some of the first solder pads being electrically connected to the other end of the through-hole plug, the first solder pads and the electrode pads being located on different sides opposite to each other on the substrate; the branch line includes: a flexible circuit section and a driving board, the flexible circuit section being electrically connected to the driving board; the driving board having a plurality of second solder pads, the driving board being electrically connected to the display panel based on the corresponding connection of the plurality of first solder pads and the plurality of second solder pads.

[0014] Optionally, the edge length of the driver board does not exceed the edge length of the display panel.

[0015] Optionally, the main circuit board is rectangular; the number of branch lines is 3; the branch lines are electrically connected to the main circuit board to form a cross shape or a T shape.

[0016] Optionally, the main circuit board has at least two layers, and the branch lines are sandwiched between the two layers of the main circuit board.

[0017] Optionally, the projection size of the display panel does not exceed 5mm*5mm.

[0018] Optionally, the surface of the light-combining component not covered by the display panel is provided with a light-shielding layer.

[0019] Optionally, it may also include: a lens assembly, the lens assembly being used to adjust the light emitted from the light combining component; the light emitting surface of the light combining component being fitted and fixed to the light incident side of the lens assembly.

[0020] Optionally, the display panel further includes a light-absorbing structure, the projection of which toward the substrate covers at least a plurality of the electrode pads.

[0021] Optionally, it also includes: a dam portion located in the non-display area; a cover plate layer located on the dam portion, the dam portion being used to combine the cover plate layer and the non-display area, the cover plate layer covering the display area and the dam portion.

[0022] Optionally, the light-absorbing structure includes: a light-absorbing layer, the projection of which faces the substrate at least covers a plurality of the electrode pads; the light-absorbing layer is located on the surface of the cover layer away from the substrate, the light-absorbing layer is located on the surface of the cover layer close to the substrate, or the light-absorbing layer is located on the surface of the non-display area close to the cover layer.

[0023] Optionally, the light-absorbing structure includes a light-absorbing layer and a dam portion, wherein the projection of the light-absorbing layer and the dam portion toward the substrate covers at least a plurality of the electrode pads.

[0024] Optionally, the light-absorbing layer and the dam portion are located on the surface of the non-display area near the cover plate layer; wherein the light-absorbing layer at least covers a portion of the non-display area, and the light-absorbing layer exposes a portion of the non-display area, so that the dam portion is in direct contact with the non-display area, and the dam portion includes a light-absorbing material.

[0025] Optionally, the dam portion contacts the surfaces of the non-display area and the light-absorbing layer, respectively.

[0026] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0027] In the projection optical engine of this invention, the panel assembly integrates the main circuit board, the branch lines, and the display panel into a modular structure. By integrating the control circuit into the main circuit board and achieving electrical connections between the display panels through the branch lines, the electrical connection components of the plug-in connectors required in traditional separate display panels are eliminated, significantly reducing the space occupied by the connections and thus reducing the system size and complexity. Furthermore, the surfaces of each display panel are directly bonded and fixed to the light-combining component, eliminating the mounting frame in traditional structures to compress axial dimensions. This bonding method not only eliminates the thickness and assembly gaps of the mounting frame itself, but also makes the optical path coupling more compact. The layout of the panel assembly surrounding the light-combining component achieves efficient utilization of three-dimensional space, making the overall structure more streamlined and providing structural support for ultra-miniaturized applications such as wearable devices.

[0028] Furthermore, an external connector is provided on one side of the main circuit board. This external connector is adapted to electrically connect to an external interface to input signals to each of the display panels through the main circuit board and the branch lines. By adding this external connector that is electrically connected to the main circuit board, a standardized external interface is provided for the projection optical engine, facilitating quick connection to external power supplies and signal sources, enhancing system integration and maintainability, and simultaneously avoiding the need for additional connection terminals inside the panel assembly, thus simplifying the internal structure.

[0029] Furthermore, the light-combining component is a polyhedron with multiple sides. The main circuit board, the branch lines, and the display panels are configured such that after each display panel is attached to the surface of the light-combining component, the main circuit board is located on one side of the light-combining component, and the external connector is located away from that side. By attaching the main circuit board and the external connector to the non-light-incident surface of the light-combining component, the unused surface of the light-combining component is cleverly utilized for space reuse, making the overall layout more compact to meet the space utilization requirements of wearable devices. In addition, this layout places the external connector away from the side where the main circuit board is attached to the light-combining component, naturally exposing the interface of the external connector, facilitating direct connection of the external connector to external power supplies, signal sources, and other devices.

[0030] Furthermore, it also includes: an extension line electrically connected to the main circuit board; each of the display panels is electrically connected to the main circuit board via the extension line, the extension line being adaptable to bend so that the main circuit board covers a specific side of the light-combining component. The bendability of the extension line allows for a highly flexible layout of the main circuit board, which can be detached from the compact space surrounding the display panels and positioned in an open area as needed by bending the extension line, thus optimizing the overall space utilization.

[0031] Furthermore, the display panel further includes: a plurality of first solder pads located on the substrate, some of which are electrically connected to the other end of the through-hole plug; the first solder pads and the electrode pads are located on different sides of the substrate; the branch circuit includes: a flexible circuit section and a driving board, the flexible circuit section being electrically connected to the driving board; the driving board has a plurality of second solder pads, and the driving board is electrically connected to the display panel based on the corresponding connection of the plurality of first solder pads and the plurality of second solder pads. The electrical connection between the display panel and the driving board is achieved through the first solder pads and the second solder pads. Compared to wire bonding circuit connections, the through-hole plug can save the area occupied by wire bonding in the direction parallel to the substrate surface, thereby reducing the overall size of the micro-display panel.

[0032] Furthermore, a light-shielding layer is provided on the surface of the light-combining component not covered by the display panel. By coating the light-shielding layer on the surface of the light-combining component not covered by the display panel, external stray light is effectively blocked from entering the light path, preventing unwanted light from interfering with the light-combining process, avoiding crosstalk between different color light channels, significantly improving the contrast and color purity of the projected image, and ensuring image quality.

[0033] Furthermore, the light-emitting surface of the light-combining component is in direct contact with the lens assembly. By directly contacting the light-combining component with the lens assembly, compared to the traditional structure where the light-combining component is fitted into a mounting frame and then connected to the lens assembly via the mounting frame, the gap of one edge of the mounting frame between the light-combining component and the lens assembly is eliminated, effectively reducing the overall length of the light-combining component and the lens assembly. Since the projection engine formed based on the light-combining component needs to be mounted perpendicular to the lens direction in the eyeglass frame, the reduction in length further facilitates the mounting of the projection engine in the eyeglass frame, meeting the miniaturization and portability requirements of modern electronic devices.

[0034] Furthermore, the display panel also includes a light-absorbing structure, the projection of which onto the substrate covers at least a plurality of the electrode pads. In AR near-eye display applications, the light-absorbing structure can effectively absorb stray light returning from components such as optical waveguides, preventing secondary specular reflection from the metal electrode pads located on the non-display area, thereby preventing ghosting and significantly improving image contrast and image purity. By integrating the light-absorbing structure into the display panel, without affecting the normal light emission of the display area and the electrical connection of the electrode pads, the stray light feedback path is physically cut off, thereby improving the optical performance of the micro-projection optical engine, ensuring the final display effect, and effectively solving the technical problem of image quality degradation caused by the high reflectivity of the non-display area. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the panel assembly in the projection optical engine according to an embodiment of the present invention;

[0036] Figure 2 This is a three-dimensional structural diagram of the projection optical engine according to an embodiment of the present invention;

[0037] Figure 3 yes Figure 2 Top view of the projection optical engine along direction A;

[0038] Figure 4 This is a schematic diagram of the panel assembly in a projection optical engine according to another embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the panel assembly in a projection optical engine according to another embodiment of the present invention;

[0040] Figure 6 This is a top view of a projection optical engine according to another embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of the panel assembly in the projection optical engine of the present invention, omitting the display panel;

[0042] Figure 8 This is a schematic diagram of the display panel structure in the projection optical engine according to an embodiment of the present invention;

[0043] Figure 9 This is a top view of the substrate of the display panel in the projection optical engine of this invention;

[0044] Figure 10 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention;

[0045] Figure 11 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention;

[0046] Figure 12 This is a schematic diagram of the display panel of a projection optical engine according to another embodiment of the present invention;

[0047] Figure 13 This is a schematic diagram of the display panel of a projection optical engine according to another embodiment of the present invention. Detailed Implementation

[0048] As described in the background section, the need for miniaturization of projection optical engines is becoming increasingly urgent and is one of the problems that urgently need to be solved.

[0049] Based on this, the present invention provides a projection optical engine in which the panel assembly integrates the main circuit board, the branch lines, and the display panel into a modular structure. By integrating the control circuit into the main circuit board and achieving electrical connections between the display panels through the branch lines, the electrical connection components of the plug-in connectors required in traditional separate display panels are eliminated, significantly reducing the space occupied by the connections and thus reducing the system size and complexity. Furthermore, the surfaces of each display panel are directly bonded and fixed to the light-combining component, eliminating the mounting frame in traditional structures to compress axial dimensions. This bonding method not only eliminates the thickness of the mounting frame itself and assembly gaps, but also makes the optical path coupling more compact. The layout of the panel assembly surrounding the light-combining component achieves efficient utilization of three-dimensional space, making the overall structure more streamlined and providing structural support for ultra-miniaturized applications such as wearable devices.

[0050] To make the above-mentioned objectives, features, and advantages of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] In the description of this invention, it should be understood that the terms "upper," "lower," "top surface," "bottom surface," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the indicated position or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of the invention. Furthermore, the terms "first" and "second" are used only to distinguish an entity or operation from another entity or operation, and do not require or imply any actual relationship, order, or relative importance between these entities or operations.

[0052] Figure 1 This is a schematic diagram of the panel assembly in the projection optical engine according to an embodiment of the present invention; Figure 2 This is a three-dimensional structural diagram of the projection optical engine according to an embodiment of the present invention; Figure 3 yes Figure 2 Top view of the projection optical engine along direction A; Figure 4 This is a schematic diagram of the panel assembly in a projection optical engine according to another embodiment of the present invention; Figure 5 This is a schematic diagram of the panel assembly in a projection optical engine according to another embodiment of the present invention; Figure 6 This is a top view of a projection optical engine according to another embodiment of the present invention; Figure 7 This is a schematic diagram of the panel assembly in the projection optical engine of the present invention, omitting the display panel; Figure 8This is a schematic diagram of the display panel structure in the projection optical engine according to an embodiment of the present invention; Figure 9 This is a top view of the substrate of the display panel in the projection optical engine of this invention.

[0053] Please refer to Figures 1 to 3 A projection optical engine includes: a panel assembly 10, including a main circuit board 101 and a plurality of display panels 102, wherein each of the display panels 102 is electrically connected to the main circuit board 101 via a branch line 103; a light combining component 20, adapted to combine the light emitted from the plurality of display panels 102; and a light emitting surface of each display panel 102 is attached and fixed to a light incident surface of the light combining component 20.

[0054] The panel assembly 10 integrates the main circuit board 101, the branch lines 103, and the display panel 102 into a modular structure. By integrating the control circuit into the main circuit board 101 and achieving electrical connections between the display panels 102 through the branch lines 103, the electrical connection components of the plug-in connectors required for traditional separate display panels 102 are eliminated, significantly reducing the space occupied by the connections and thus reducing the system size and complexity. Furthermore, each display panel 102 is directly bonded and fixed to the surface of the light-combining component 20, eliminating the need for the mounting frame in traditional structures to compress axial dimensions. This bonding method not only eliminates the thickness of the mounting frame itself and assembly gaps, but also makes the optical path coupling more compact. The layout of the panel assembly 10 surrounding the light-combining component 20 achieves efficient utilization of three-dimensional space, making the overall structure more streamlined and providing structural support for ultra-miniaturized applications such as wearable devices.

[0055] In this embodiment, the surfaces of the display panel 102 and the light-combining component 20 are bonded together using an adhesive (not shown). The coating method and material properties of the adhesive ensure that the optical performance of the projection optical engine is not affected. The adhesive is formed into an ultra-thin layer using precision dispensing or slit coating processes. The material is a photocurable resin or structural adhesive with a refractive index matching that of the optical element, exhibiting high transmittance in the visible light band. This effectively avoids interface reflection and light loss, thus not affecting the light extraction efficiency and color reproduction of the display panel 102, ensuring the final display effect. In terms of mechanical properties, the adhesive forms a high-strength chemical bond after curing, providing reliable mechanical fixation. Its shear strength is sufficient to support the firm bond between the display panel 102 and the light-combining component 20, and it can withstand thermal cycling and mechanical vibration, ensuring long-term stability. Because the adhesive simultaneously meets the requirements of optical transparency and mechanical strength, it achieves the integration of optical coupling and structural support. Therefore, it completely eliminates the need for traditional mounting frames and their assembly gaps, compresses axial dimensions, and makes the optical path coupling more compact, providing structural support for ultra-miniaturized applications such as wearable devices.

[0056] Please continue to refer to this. Figure 1In this embodiment, an external connector 104 is provided on one side of the main circuit board 101. The external connector 104 is adapted to be electrically connected to an external interface to input signals to each of the display panels 102 through the main circuit board 101 and the branch line 103.

[0057] By adding the external connector 104 that is electrically connected to the main circuit board 101, a standardized external interface is provided for the projection optical engine, which facilitates quick connection with external power sources and signal sources, enhances system integration and maintainability, and avoids the need to arrange additional connection terminals inside the panel assembly 10, thus simplifying the internal structure.

[0058] Please continue to refer to this. Figures 1 to 3 In this embodiment, the light combining component 20 is a polyhedron and includes multiple sides. The main circuit board 101, the branch line 103 and the display panel 102 are configured such that after each of the display panels 102 is attached to the surface of the light combining component 20, the main circuit board 101 is located on one side of the light combining component 20, and the external connector 104 is located away from that side.

[0059] By attaching the main circuit board 101 and the external connector 104 to the non-light-incident surface of the light-combining component 20, the unused surface of the light-combining component 20 is cleverly utilized for space reuse, making the overall layout more compact to meet the space utilization requirements of wearable devices. Furthermore, this layout positions the external connector 104 away from the side where it is attached to the main circuit board 101 and the light-combining component 20, naturally exposing the interface of the external connector 104 and facilitating direct connection between the external connector 104 and external power supplies, signal sources, and other devices.

[0060] Please refer to Figures 1 to 3 In this embodiment, the main circuit board 101 is rectangular; the number of branch lines 103 is 3.

[0061] In this embodiment, each of the display panels 102 is electrically connected to the main circuit board 101 via branch lines 103. That is, the main circuit board 101 is located between the display panels 102, and after the display panels 102 surround the light-combining component 20, the main circuit board 101 directly adheres to the non-light-incident surface of the light-combining component 20, forming a compact, modular structure with seamless coupling, significantly reducing the system volume. Figure 2 As shown, the main circuit board 101 is located in Figure 6 The bottom surface of the light-combining component 20 as shown in the view.

[0062] Please continue to refer to this. Figure 1In this embodiment, the edge of the main circuit board 101 is flush with the edge of the branch lines located on both sides thereon, and the branch lines 103 form a "T" shape after being electrically connected to the main circuit board 101.

[0063] Please continue to refer to this. Figure 4 In other embodiments, the edge of the main circuit board 101 may protrude beyond the edges of the branch lines located on both sides thereon, and the branch lines 103 form a cross shape after being electrically connected to the main circuit board 101.

[0064] Please refer to Figure 5 and Figure 6 , Figure 6 and Figure 2 In other embodiments, the view direction is consistent, and the extension line 105 is also included. Each of the branch lines 103 is first electrically connected to the extension line 105, and the extension line 105 is then electrically connected to the main circuit board 101. Each of the display panels 102 is electrically connected to the main circuit board 101 through the extension line 105. The extension line 105 is adapted to bend so that the main circuit board 101 covers a specific side of the light combining component 20. The extension line 105 is a flexible circuit. Correspondingly, the branch lines 103 also form a cross shape after being electrically connected to the main circuit board 101.

[0065] The bendable nature of the extension line 105 allows for highly flexible placement of the main circuit board 101. The main circuit board 101 can be detached from the compact space surrounding the display panel 102 and positioned in an open area as needed by bending the extension line 105, thus optimizing overall space utilization. Figure 6 As shown, the extension line 105 is adapted to be bent so that the main circuit board 101 covers a specific side of the light-combining component 20, which is the... Figure 6 The top surface of the light-combining component 20 as shown in the view below.

[0066] Please continue to refer to this. Figure 2 In this embodiment, the main circuit board 101 has at least two layers, and the branch line 103 is sandwiched between the two layers of the main circuit board 101.

[0067] In this embodiment, the projection size of each of the display panels 102 does not exceed 5mm*5mm.

[0068] Please continue to refer to this. Figure 3 In this embodiment, a light-shielding layer 30 is provided on the surface of the light-combining component 20 that is not covered by the display panel 102.

[0069] The light-shielding layer 30 is coated on the surface of the light-combining component 20 that is not covered by the display panel 102. The light-shielding layer 30 effectively blocks external stray light from entering the light path, prevents unexpected light from interfering with the light-combining process, avoids crosstalk between different color light channels, significantly improves the contrast and color purity of the projected image, and ensures image quality.

[0070] Please continue to refer to this. Figure 2 and Figure 3 In this embodiment, the system further includes a lens assembly 40, which is used to adjust the light emitted from the light combining component 20. The light-emitting surface of the light combining component 20 is fitted and fixed to the light-incident side of the lens assembly 40. By directly contacting the light combining component 20 with the lens assembly 40, compared to the traditional structure where the light combining component 20 is fitted into a mounting frame and then connected to the lens assembly 40 via the mounting frame, the gap of one edge of the mounting frame between the light combining component 20 and the lens assembly 40 is eliminated, effectively reducing the overall length of the light combining component 20 and the lens assembly 40. Since the projection optical engine formed based on the light combining component 20 needs to be mounted perpendicular to the lens direction in the outer frame of the glasses, the reduction in length makes it easier to mount the projection optical engine in the outer frame of the glasses, thus meeting the miniaturization and portability requirements of modern electronic devices.

[0071] Please refer to Figure 8 and Figure 9 In this embodiment, the display panel 102 includes: a substrate 1020, the substrate 1020 including a first side (not shown) and an opposite second side (not shown), the first side including a display area I and a non-display area II; a plurality of electrode pads 1022 located in the non-display area II, the plurality of electrode pads 1022 being used to drive the display area I; and a plurality of through-hole plugs 1023 located in the substrate 1020, one end of the through-hole plug 1023 being electrically connected to the electrode pads 1022, and the other end of the through-hole plug 1023 extending to the second side of the substrate 1020.

[0072] Please refer to Figure 7 And continue to combine with references Figure 8In this embodiment, the display panel 102 further includes a plurality of first solder pads 1027 located on the substrate 1020, some of the first solder pads 1027 being electrically connected to the other end of the through-hole plug 1023, and the first solder pads 1027 being located on a second side of the substrate 1020. The branch line 103 includes a flexible circuit section 1031 and a driving board 1032, the flexible circuit section 1031 being electrically connected to the driving board 1032; the driving board 1032 having a plurality of second solder pads 1033, and the driving board 1032 being electrically connected to the display panel 102 based on the corresponding connection of the plurality of first solder pads 1027 and the plurality of second solder pads 1033.

[0073] The electrical connection between the display panel 102 and the driver board 1032 is achieved through the first solder pad 1027 and the second solder pad 1033. Compared with the circuit connection by wire bonding, the through-hole plug 1023 can save the area occupied by the wire bonding in the direction parallel to the surface of the substrate 1020, thereby reducing the overall size of the micro display panel 102.

[0074] In this embodiment, the edge length of the driver board 1032 does not exceed the edge length of the display panel 102.

[0075] Please continue to refer to this. Figure 8 In this embodiment, the display panel 102 further includes a light-absorbing structure, the projection of which toward the substrate 1020 covers at least a plurality of the electrode pads 1022.

[0076] In AR near-eye display applications, the light-absorbing structure effectively absorbs stray light returning from components such as optical waveguides, preventing secondary specular reflection from the metal electrode pad 1022 located on the non-display area II, thereby preventing ghosting and significantly improving image contrast and image clarity. By integrating the light-absorbing structure into the display panel 102, without affecting the normal light emission of the display area I and the electrical connection of the electrode pad 1022, the stray light feedback path is physically cut off, thereby improving the optical performance of the micro-projection optical engine, ensuring the final display effect, and effectively solving the technical problem of image quality degradation caused by the high reflectivity of the non-display area II.

[0077] Please continue to refer to this. Figure 8In this embodiment, the display area I has a light-emitting part 1021; the display panel 102 further includes: a dam part 1024 located in the non-display area II; a cover layer 1025 located on the dam part 1024, the dam part 1024 being used to combine the cover layer 1025 and the non-display area II, the cover layer 1025 covering the display area I and the dam part 1024, specifically the dam part 1024 and the cover layer 1025 sealing the light-emitting part 1021.

[0078] The dam section 1024 and the cover plate layer 1025 form a sealed cavity, covering and protecting the light-emitting part 1021, thereby improving the environmental reliability of the light-emitting part 1021. This allows it to resist the erosion of external environments such as moisture, oxygen, dust, and chemical corrosion, preventing the performance of the light-emitting part 1021 from degrading or failing, thus ensuring that the device works stably under various operating conditions and extending its service life.

[0079] Please continue to refer to this. Figure 8 In this embodiment, the edge of the cover plate layer 1025 is flush with the edge of the first side of the substrate 1020. The flush alignment of the cover plate layer 1025 with the edge of the substrate 1020 results in a regular outline for the formed display panel 102, facilitating wafer-level cutting and array arrangement, and improving packaging density and integration. It also effectively avoids the risk of mechanical damage caused by edge protrusions, enhancing structural reliability.

[0080] In this embodiment, the cover layer 1025 is made of glass, which has high light transmittance, excellent mechanical strength, and chemical stability. The glass surface has high flatness, effectively protecting the light-emitting part 1021 from physical damage and corrosion by moisture and oxygen, and forming a reliable hermetically sealed package with the colloid of the dam part 1024, ensuring the long-term reliability of the device.

[0081] Please continue to refer to this. Figure 9 In this embodiment, the non-display area II surrounds the display area I.

[0082] In this embodiment, the projection area of ​​the light-absorbing structure toward the substrate 1020 coincides with the non-display area II. Since the non-display area II is a continuous and regular whole, the formation of the light-absorbing structure can employ a uniform surface-mount process, such as coating or depositing the entire surface and then removing the display area I portion using a simple mask, eliminating the need for complex photolithographic patterning to correspond with the several mutually separated electrode pads 1022. This simplifies the fabrication process, reduces process difficulty and manufacturing costs, and improves production efficiency and yield. Furthermore, it can absorb non-metallic reflected optics in the non-display area, cutting off stray light feedback paths, thereby improving the optical performance of the micro-projection optical engine and ensuring the final display effect.

[0083] Please continue to refer to this. Figure 8 In this embodiment, the light-absorbing structure includes a light-absorbing layer 1026, the projection of the light-absorbing layer 1026 toward the substrate 1020 covering at least a plurality of the electrode pads 1022. Specifically, the projection area of ​​the light-absorbing layer 1026 toward the substrate 1020 coincides with the non-display area II.

[0084] In this embodiment, the reflectivity of the light-absorbing structure is less than 1%. Specifically, the reflectivity of the light-absorbing layer 1026 is less than 1%. The reflectivity of the light-absorbing layer 1026 is less than 1% to achieve efficient light absorption, almost completely eliminating secondary specular reflection from the electrode pad 1022 and thoroughly blocking the ghosting path. This extremely low reflectivity maximally suppresses stray light feedback, significantly improving imaging contrast and image purity, ensuring high image quality and an immersive experience for AR near-eye displays.

[0085] Please continue to refer to this. Figure 8 In this embodiment, the light-absorbing layer 1026 is located on the surface of the cover layer 1025 away from the substrate 1020, and the corresponding dam portion 1024 is in direct contact with the non-display area II, and the dam portion 1024 is made of transparent material.

[0086] The light-absorbing layer 1026 absorbs stray light returning from components such as optical waveguides, while the dammed portion 1024 can directly contact the non-display area II, thereby improving the bonding between the two. Furthermore, the dammed portion 1024 is made of a transparent material, allowing for effective observation of its formation quality.

[0087] It should be noted that the interface between the colloidal material of the dam section 1024 and the light-absorbing layer 1026 (typically an organic / inorganic composite material containing carbon black / dye) is chemically inert, has low surface energy, lacks active functional groups, and is difficult to form a strong chemical bond. The mismatch in thermal expansion coefficients easily leads to stress concentration and delamination. In contrast, the silicon-based substrate 1020 has a surface rich in hydroxyl groups, which are enhanced by plasma treatment. It can form strong chemical bonds and mechanical interlocks with epoxy colloids, and has a high thermal expansion coefficient matching degree, resulting in strong interfacial adhesion and significantly improving encapsulation reliability, preventing moisture intrusion that could lead to device failure. The dam section 1024 uses a transparent material (such as epoxy resin or silicone) to facilitate visual inspection of its morphology, size, and curing quality. Real-time monitoring of the dispensing or printing process allows for timely detection of defects such as bubbles, adhesive breaks, and adhesive overflow, improving process controllability and encapsulation yield. This ensures a reliable bond between the dam section 1024 and the substrate 1020, guaranteeing the integrity of the sealed cavity structure.

[0088] In this embodiment, the light-absorbing layer 1026 is formed on the surface of the cover layer 1025 away from the substrate 1020 (i.e., the upper surface of the cover layer 1025). The patterning process of the light-absorbing layer 1026 can be performed independently after the cover layer 1025 is fabricated. Since the cover layer 1025 is typically made of transparent glass or resin, during the fabrication of the light-absorbing layer 1026, a high-precision optical alignment system can be used to perform real-time visual alignment between the cover layer 1025 and the substrate 1020, where the light-emitting part 1021 and the electrode pads 1022 have been fabricated. The actual distribution of the electrode pads 1022 is used as the reference, rather than relying on the theoretical coordinates of the designed pattern. This method enables secondary calibration of the positions of the light-absorbing layer 1026 and the electrode pads 1022, precisely controlling the patterning accuracy of the light-absorbing layer 1026 and ensuring complete coverage of the electrode pads 1022 while strictly avoiding the display area I.

[0089] It should be noted that, in this embodiment, the substrate 1020 includes a driving backplane with a circuit structure. The circuit structure is integrated inside and on the surface of the substrate 1020 and forms an electrical connection with the light-emitting part 1021 of the display area I. The light-emitting part 1021 includes a micro-LED pixel array. The driving backplane is configured to receive image data, clock signals, and control commands from the outside, and independently address and control the light-emitting state (light-emitting or non-light-emitting) of the corresponding micro-LEDs based on the received signals to form the desired image. The driving backplane can be a thin-film transistor (TFT) board or an integrated circuit (IC) board to realize active matrix driving or passive matrix driving to meet the requirements of high-resolution display. The first solder pad 1027 extends to the second side of the substrate 1020 through the through-hole plug 1023, so that the driving backplane can be flip-chip soldered to the driving board 1032 to achieve a compact vertical electrical interconnect.

[0090] Figure 10 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention.

[0091] This embodiment is based on the above embodiment ( Figure 8 The description of the display panel 102 will continue below. The rest is the same as in the previous embodiment, except that the light-absorbing layer 1026 is formed in a different position. Specific details will be provided in conjunction with the accompanying drawings.

[0092] Please refer to Figure 10 The light-absorbing layer 1026 is located on the surface of the cover layer 1025 near the substrate 1020, and the corresponding dam portion 1024 is in direct contact with the non-display area II, and the dam portion 1024 is made of transparent material.

[0093] The light-absorbing layer 1026 absorbs stray light returning from components such as optical waveguides, while the dammed portion 1024 can directly contact the non-display area II, thereby improving the bonding between the two. Furthermore, the dammed portion 1024 is made of a transparent material, allowing for effective observation of its formation quality.

[0094] It should be noted that the interface between the colloidal material of the dam section 1024 and the light-absorbing layer 1026 (typically an organic / inorganic composite material containing carbon black / dye) is chemically inert, has low surface energy, lacks active functional groups, and is difficult to form a strong chemical bond. The mismatch in thermal expansion coefficients easily leads to stress concentration and delamination. In contrast, the silicon-based substrate 1020 has a surface rich in hydroxyl groups, which are enhanced by plasma treatment. It can form strong chemical bonds and mechanical interlocks with epoxy colloids, and has a high thermal expansion coefficient matching degree, resulting in strong interfacial adhesion and significantly improving encapsulation reliability, preventing moisture intrusion that could lead to device failure. The dam section 1024 uses a transparent material (such as epoxy resin or silicone) to facilitate visual inspection of its morphology, size, and curing quality. Real-time monitoring of the dispensing or printing process allows for timely detection of defects such as bubbles, adhesive breaks, and adhesive overflow, improving process controllability and encapsulation yield. This ensures a reliable bond between the dam section 1024 and the substrate 1020, guaranteeing the integrity of the sealed cavity structure.

[0095] In this embodiment, forming the light-absorbing layer 1026 on the surface of the cover layer 1025 away from the substrate 1020 (i.e., the lower surface of the cover layer 1025) achieves process decoupling. This means the cover layer 1025 and the light-absorbing layer 1026 can be prepared and tested in advance on an independent production line, eliminating the need to wait for the cover portion and the dam portion 1024 to be bonded and fixed before preparing the light-absorbing layer 1026. This enables parallel production and significantly shortens the process cycle. This method optimizes the production process, avoids time losses due to sequential waiting between processes, and improves equipment utilization and production capacity.

[0096] Figure 11 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention.

[0097] This embodiment is based on the above embodiment ( Figure 8 The description of the display panel 102 will continue below. The rest is the same as in the previous embodiment, except that the light-absorbing layer 1026 is formed in a different position. Specific details will be provided in conjunction with the accompanying drawings.

[0098] Please refer to Figure 11 The light-absorbing layer 1026 is located in the non-display area II, and the corresponding dam portion 1024 is located on the light-absorbing layer 1026, and the dam portion 1024 is made of transparent material.

[0099] The light-absorbing layer 1026 absorbs stray light returning from components such as optical waveguides, and the transparent material of the dam section 1024 allows for effective observation of the formation quality of the dam section 1024.

[0100] It should be noted that the interface between the colloidal material of the dam section 1024 and the light-absorbing layer 1026 (typically an organic / inorganic composite material containing carbon black / dye) is chemically inert, has low surface energy, lacks active functional groups, and is difficult to form a strong chemical bond. The mismatch in thermal expansion coefficients easily leads to stress concentration and delamination. In contrast, the silicon-based substrate 1020 has a surface rich in hydroxyl groups, which are enhanced by plasma treatment. It can form strong chemical bonds and mechanical interlocks with epoxy colloids, and has a high thermal expansion coefficient matching degree, resulting in strong interfacial adhesion and significantly improving encapsulation reliability, preventing moisture intrusion that could lead to device failure. The dam section 1024 uses a transparent material (such as epoxy resin or silicone) to facilitate visual inspection of its morphology, size, and curing quality. Real-time monitoring of the dispensing or printing process allows for timely detection of defects such as bubbles, adhesive breaks, and adhesive overflow, improving process controllability and encapsulation yield. This ensures a reliable bond between the dam section 1024 and the substrate 1020, guaranteeing the integrity of the sealed cavity structure.

[0101] In this embodiment, the light-absorbing layer 1026 is directly formed on the surface of the substrate 1020. The surface of the silicon-based substrate 1020 is rich in hydroxyl groups and has undergone plasma treatment, forming a strong chemical bond with the light-absorbing layer 1026. The interfacial bonding force is far superior to the physical adsorption between the light-absorbing layer 1026 and the glass surface, significantly reducing the risk of delamination. In addition, forming the light-absorbing layer 1026 directly on the surface of the substrate 1020 allows for precise in-situ alignment, resulting in higher coverage accuracy of the light-absorbing layer 1026.

[0102] Furthermore, when there is a gap between the light-absorbing layer 1026 and the substrate 1020 (i.e., when the light-absorbing layer 1026 is formed on the upper or lower surface of the cover layer 1025), the incident stray light will enter the imaging optical path after being reflected by the electrode pad 1022, the non-display area II, and / or the cover layer 1025. Compared to when the light-absorbing layer 1026 is not added, although the ghosting phenomenon is reduced to some extent, the ghosting phenomenon is not completely eliminated, which will reduce the contrast and clarity of the image. However, by forming the light-absorbing layer 1026 directly on the surface of the substrate 1020, the light-absorbing layer 1026 can directly cover the electrode pad 1022, and the above-mentioned problem will not exist, resulting in better optical suppression.

[0103] Figure 12 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention.

[0104] This embodiment is based on the above embodiment ( Figure 8 The description of the display panel 102 will continue below. Everything else is the same as in the above embodiment, except that the light-absorbing structure has a different structural form. Specific details will be provided in conjunction with the accompanying drawings.

[0105] Please refer to Figure 12 The light-absorbing structure includes a light-absorbing layer 1026 and a dam portion 1024. The projection of the light-absorbing layer 1026 and the dam portion 1024 toward the substrate 1020 covers at least a plurality of the electrode pads 1022.

[0106] In this embodiment, the light-absorbing layer 1026 is located on the surface of the non-display area II near the cover layer 1025; the light-absorbing layer 1026 at least covers a portion of the non-display area II, and the light-absorbing layer 1026 exposes a portion of the non-display area II, so that the dam portion 1024 has direct contact with the non-display area II, and the dam portion 1024 includes a light-absorbing material.

[0107] It should be noted that, in this embodiment, the dam section 1024 includes a light-absorbing material, that is, the dam section 1024 is mixed with a light-absorbing pigment.

[0108] The overall structure formed by the light-absorbing layer 1026 and the dam portion 1024, which includes a light-absorbing material, absorbs stray light returning from components such as optical waveguides. Furthermore, the dam portion 1024 has a portion that directly contacts the non-display area II, thereby improving the bonding between the two.

[0109] It should be noted that the interface between the colloidal material of the dam section 1024 and the light-absorbing layer 1026 (typically an organic / inorganic composite material containing carbon black / dye) is chemically inert, has low surface energy, lacks active functional groups, and is difficult to form a strong chemical bond. The mismatch in thermal expansion coefficients easily leads to stress concentration and delamination. In contrast, the silicon-based substrate 1020 has a surface rich in hydroxyl groups, which are enhanced by plasma treatment. It can form strong chemical bonds and mechanical interlocks with epoxy colloids, and has a high thermal expansion coefficient matching degree, resulting in strong interfacial adhesion and significantly improving encapsulation reliability, preventing moisture intrusion that could lead to device failure. The dam section 1024 uses a transparent material (such as epoxy resin or silicone) to facilitate visual inspection of its morphology, size, and curing quality. Real-time monitoring of the dispensing or printing process allows for timely detection of defects such as bubbles, adhesive breaks, and adhesive overflow, improving process controllability and encapsulation yield. This ensures a reliable bond between the dam section 1024 and the substrate 1020, guaranteeing the integrity of the sealed cavity structure.

[0110] In this embodiment, both the light-absorbing layer 1026 and the damming layer are directly formed on the surface of the substrate 1020. The silicon-based substrate 1020 surface is rich in hydroxyl groups and undergoes plasma treatment, forming strong chemical bonds with the materials of the light-absorbing layer 1026 and the damming layer, significantly reducing the risk of delamination. Furthermore, forming the light-absorbing layer 1026 directly on the surface of the substrate 1020 allows for precise in-situ alignment, resulting in higher coverage accuracy. Moreover, the light-absorbing layer 1026 can directly cover the electrode pad 1022, providing better optical suppression.

[0111] Figure 13 This is a schematic diagram of the display panel in a projection optical engine according to another embodiment of the present invention.

[0112] This embodiment is based on the above embodiment ( Figure 12 The description of the display panel 102 will continue below. The rest is the same as in the above embodiment, except that the position of the dam section 1024 is different. Specific details will be provided in conjunction with the accompanying drawings.

[0113] Please refer to Figure 13 The dam portion 1024 is in contact with the surfaces of the non-display area II and the light-absorbing layer 1026, respectively.

[0114] The overall structure formed by the light-absorbing layer 1026 and the dam portion 1024, which includes a light-absorbing material, absorbs stray light returning from components such as optical waveguides. Furthermore, the dam portion 1024 has a portion that directly contacts the non-display area II, thereby improving the bonding between the two.

[0115] It should be noted that the interface between the colloidal material of the dam section 1024 and the light-absorbing layer 1026 (typically an organic / inorganic composite material containing carbon black / dye) is chemically inert, has low surface energy, lacks active functional groups, and is difficult to form a strong chemical bond. The mismatch in thermal expansion coefficients easily leads to stress concentration and delamination. In contrast, the silicon-based substrate 1020 has a surface rich in hydroxyl groups, which are enhanced by plasma treatment. It can form strong chemical bonds and mechanical interlocks with epoxy colloids, and has a high thermal expansion coefficient matching degree, resulting in strong interfacial adhesion and significantly improving encapsulation reliability, preventing moisture intrusion that could lead to device failure. The dam section 1024 uses a transparent material (such as epoxy resin or silicone) to facilitate visual inspection of its morphology, size, and curing quality. Real-time monitoring of the dispensing or printing process allows for timely detection of defects such as bubbles, adhesive breaks, and adhesive overflow, improving process controllability and encapsulation yield. This ensures a reliable bond between the dam section 1024 and the substrate 1020, guaranteeing the integrity of the sealed cavity structure.

[0116] In this embodiment, both the light-absorbing layer 1026 and the damming layer are directly formed on the surface of the substrate 1020. The surface of the silicon-based substrate 1020 is rich in hydroxyl groups and undergoes plasma treatment, forming strong chemical bonds with the materials of the light-absorbing layer 1026 and the damming layer, significantly reducing the risk of delamination. Furthermore, forming the light-absorbing layer 1026 directly on the surface of the substrate 1020 allows for precise in-situ alignment, resulting in higher coverage accuracy. Moreover, the light-absorbing layer 1026 can directly cover the electrode pad 1022, providing better optical suppression. Additionally, the damming portion 1024 directly contacts a portion of the surface of the light-absorbing layer 1026 to form an embedded structure, achieving a combination of mechanical interlocking and chemical bonding. This eliminates interface gaps, prevents secondary reflections at the boundary of the light-absorbing layer 1026, completely cuts off the ghosting path, and improves the optical reliability and imaging purity of the display panel 102.

[0117] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A projection optical engine, comprising: The panel assembly includes a main circuit board and a plurality of display panels, each of the display panels being electrically connected to the main circuit board via a branch line; A light combining component, adapted to combine the colors of light emitted from a plurality of the display panels; Its features are, The light-emitting surface of each display panel is attached and fixed to one light-incident surface of the light-combining component.

2. The projection optical engine as described in claim 1, characterized in that, The display panel and the surface of the light-combining component are bonded together with an adhesive.

3. The projection optical engine as described in claim 1, characterized in that, An external connector is provided on one side of the main circuit board. The external connector is adapted to be electrically connected to an external interface to input signals to each of the display panels through the main circuit board and the branch lines.

4. The projection optical engine as described in claim 3, characterized in that, The light-combining component is a polyhedron with multiple sides. The main circuit board, the branch lines, and the display panels are configured such that after each display panel is attached to the surface of the light-combining component, the main circuit board is located on one side of the light-combining component, and the external connector is located away from that side.

5. The projection optical engine as described in claim 3, characterized in that, Also includes: An extension line is electrically connected to the main circuit board; each of the display panels is electrically connected to the main circuit board via the extension line, the extension line being adapted to be bent so that the main circuit board covers a specific side of the light-combining component.

6. The projection optical engine as described in claim 5, characterized in that, The extension line is a flexible circuit.

7. The projection optical engine as described in claim 1, characterized in that, The display panel includes: a substrate, the substrate including a first side and an opposite second side, the first side including a display area and a non-display area; the non-display area having a plurality of electrode pads for driving the display area; and a plurality of through-hole plugs located in the substrate, one end of the through-hole plugs being electrically connected to the electrode pads, and the other end of the through-hole plugs extending to the second side of the substrate.

8. The projection optical engine as described in claim 7, characterized in that, The display panel further includes: a plurality of first solder pads located on the substrate, some of the first solder pads being electrically connected to the other end of the through-hole plug, the first solder pads and the electrode pads being located on different sides opposite to each other on the substrate; the branch line includes: a flexible circuit section and a driving board, the flexible circuit section being electrically connected to the driving board; the driving board having a plurality of second solder pads, the driving board being electrically connected to the display panel based on the corresponding connection of the plurality of first solder pads and the plurality of second solder pads.

9. The projection optical engine as described in claim 8, characterized in that, The edge length of the driver board does not exceed the edge length of the display panel.

10. The projection optical engine as described in claim 1, characterized in that, The main circuit board is rectangular; there are 3 branch lines; the branch lines are electrically connected to the main circuit board to form a cross or a T shape.

11. The projection optical engine as described in claim 1, characterized in that, The main circuit board has at least two layers, and the branch lines are sandwiched between the two layers of the main circuit board.

12. The projection optical engine as described in claim 1, characterized in that, The projection size of the display panel does not exceed 5mm*5mm.

13. The projection optical engine as described in claim 1, characterized in that, The surface of the light-combining component not covered by the display panel is provided with a light-shielding layer.

14. The projection optical engine as described in claim 1, characterized in that, Also includes: A lens assembly is used to adjust the light emitted from the light combining component; the light emitting surface of the light combining component is attached and fixed to the light incident side of the lens assembly.

15. The projection optical engine as described in claim 7, characterized in that, The display panel further includes a light-absorbing structure, the projection of which toward the substrate covers at least a plurality of the electrode pads.

16. The projection optical engine as described in claim 15, characterized in that, Also includes: A dam portion located in the non-display area; a cover plate layer located on the dam portion, the dam portion being used to combine the cover plate layer and the non-display area, the cover plate layer covering the display area and the dam portion.

17. The projection optical engine as described in claim 16, characterized in that, The light-absorbing structure includes: a light-absorbing layer, the projection of which faces the substrate covers at least a plurality of the electrode pads; the light-absorbing layer is located on the surface of the cover layer away from the substrate, the light-absorbing layer is located on the surface of the cover layer close to the substrate, or the light-absorbing layer is located on the surface of the non-display area close to the cover layer.

18. The projection optical engine as described in claim 16, characterized in that, The light-absorbing structure includes a light-absorbing layer and a dam portion, wherein the projection of the light-absorbing layer and the dam portion toward the substrate covers at least a plurality of the electrode pads.

19. The projection optical engine as described in claim 18, characterized in that, The light-absorbing layer and the dam portion are located on the surface of the non-display area near the cover plate layer; wherein the light-absorbing layer at least covers a portion of the non-display area, and the light-absorbing layer exposes a portion of the non-display area so that the dam portion is in direct contact with the non-display area, and the dam portion includes a light-absorbing material.

20. The projection optical engine as described in claim 18, characterized in that, The dam portion is in contact with the surfaces of the non-display area and the light-absorbing layer, respectively.

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