Simulation modeling method, device and equipment for shot forming area determination

Abstract

The application discloses a simulation modeling method, device and equipment for shot forming area determination. The method comprises the following steps: based on part geometric parameters, an initial finite element simulation model containing a part deformable body, an upper plane and a lower plane is built; the planes are set as constant temperature, and the contact thermal resistance is set as zero; the lower plane is set as a full degree of freedom fixed constraint, the upper plane is set as a non-full degree of freedom fixed constraint, and the upper plane is defined as a constant contact load; a first temperature threshold and a second temperature threshold are defined, local temperature greater than the first temperature threshold is set as starting heat conduction, and local temperature greater than the second temperature threshold is set as thermal shrinkage, thereby obtaining a finite element simulation model; the finite element simulation model is executed, and the shot forming area of the part to be formed corresponding to the time when the interval distance between the upper plane and the lower plane reaches the minimum value is found. The embodiment replaces the traditional method, and realizes accurate, efficient, low-cost and easy engineering determination of the shot forming area.

Description

Technical Field

[0001] This invention relates to the field of aerospace manufacturing technology, and in particular to a simulation modeling method, apparatus, and equipment for determining the shot peening forming area. Background Technology

[0002] Shot peening is a key process widely used in sheet metal forming of aerospace panels, primarily achieved through mechanical shot peening or laser shot peening. In the development of shot peening processes for parts with specific shapes, the accurate determination of the peening area is one of the core process parameters, directly affecting the quality and effect of shot peening. Therefore, exploring efficient and reliable methods for determining the peening area has become a critical requirement in the research and development of shot peening processes.

[0003] Currently, the technical solutions for determining the shot peening area in the industry are mainly divided into two categories: empirical methods and analytical methods. Both methods have some application in actual engineering practice. However, the empirical method relies entirely on the practical experience of process engineers and adopts a trial-and-error approach to process exploration. It requires multiple iterations of experiments to gradually discover the shot peening area for a specific part and determine the forming scheme. This not only consumes a lot of human and material resources but also has a long process development cycle and extremely low overall efficiency. Although the analytical method attempts to establish a mathematical equation model based on the inherent strain law of shot peening forming and obtain the optimal shot peening area through analytical solutions, it faces two major challenges in practical applications: First, the shape of the part is often complex and diverse, making it difficult to accurately describe the part's shape through a mathematical model, thus making it impossible to establish an effective mathematical equation model; second, when solving the established mathematical equations, multiple solutions are likely to occur, some of which are invalid or incorrect solutions, making it difficult to accurately select effective solutions. Ultimately, this makes it difficult for the analytical method to be implemented in engineering. Summary of the Invention

[0004] Based on this, the present invention provides a simulation modeling method, apparatus and equipment for determining the shot peening forming area, so as to solve the problems of low efficiency of existing empirical methods for determining the shot peening area, and the difficulty of analytical methods in accurately describing the shape of complex parts and the difficulty in engineering applications.

[0005] In a first aspect, embodiments of the present invention provide a simulation modeling method for determining the shot peening forming region, comprising:

[0006] Based on the geometric parameters of the part to be formed, an initial finite element simulation model is built, which includes the deformable body of the part, an upper rigid plane, and a lower rigid plane; wherein, the deformable body of the part is located between the upper rigid plane and the lower rigid plane;

[0007] The temperatures of the upper and lower rigid planes are set to the same constant temperature, and the contact thermal resistance between the upper and lower rigid planes and the deformable body of the part is set to zero.

[0008] The lower rigid plane is set as a fixed constraint with all degrees of freedom, the upper rigid plane is set as a fixed constraint with only the normal translational degree of freedom retained, and a constant contact load along the normal is defined for the upper rigid plane.

[0009] A first temperature threshold and a second temperature threshold are defined for the deformable part. Heat conduction is activated when the local temperature of the deformable part is greater than the first temperature threshold. A temperature dependence rule is set so that thermal contraction occurs when the local temperature is greater than the second temperature threshold. A fully parameterized finite element simulation model is then obtained. The second temperature threshold is greater than the first temperature threshold.

[0010] Configure and execute the fully parameterized finite element simulation model in the simulation platform, find the target local area corresponding to the moment when the distance between the upper rigid plane and the lower rigid plane reaches the minimum value during the simulation process, and use it as the shot peening forming area of ​​the part to be formed.

[0011] Secondly, embodiments of the present invention also provide a simulation modeling apparatus for determining the shot peening forming area, comprising:

[0012] The initial finite element simulation model building module is used to build an initial finite element simulation model based on the geometric parameters of the part to be formed, including the deformable body of the part, the upper rigid plane and the lower rigid plane; wherein, the deformable body of the part is located between the upper rigid plane and the lower rigid plane;

[0013] The temperature parameter definition module is used to set the temperature of the upper rigid plane and the lower rigid plane to the same constant temperature, and to set the contact thermal resistance between the upper rigid plane, the lower rigid plane and the deformable body of the part to zero.

[0014] The degree-of-freedom parameter definition module is used to set the lower rigid plane as a fixed constraint with all degrees of freedom, set the upper rigid plane as a fixed constraint with only the normal translational degree of freedom, and define a constant contact load along the normal direction for the upper rigid plane;

[0015] The thermodynamic parameter definition module is used to define a first temperature threshold and a second temperature threshold for the deformable part, and to set the local temperature of the deformable part to be greater than the first temperature threshold to activate heat conduction. After setting the temperature dependence rule that thermal contraction occurs when the local temperature is greater than the second temperature threshold, a fully parameterized finite element simulation model is obtained; wherein, the second temperature threshold is greater than the first temperature threshold.

[0016] The simulation execution module is used to configure and execute the fully parameterized finite element simulation model in the simulation platform, and to find the target local area corresponding to the moment when the distance between the upper rigid plane and the lower rigid plane reaches the minimum value during the simulation process, which is used as the shot peening forming area of ​​the part to be formed.

[0017] Thirdly, embodiments of the present invention also provide an electronic device, the electronic device comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores a computer program executable by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to execute a simulation modeling method for determining shot peening forming areas as described in any embodiment of the present invention.

[0018] Fourthly, embodiments of the present invention also provide a computer-readable storage medium storing computer instructions, which are used to cause a processor to execute and implement a simulation modeling method for determining a shot peening forming region as described in any embodiment of the present invention.

[0019] The embodiments of the present invention replace the inefficient trial-and-error method and the analytical method which is difficult to apply in engineering. It can accurately locate the shot peening forming area without multiple physical tests, which not only reduces the manpower and material resources consumed in process development and improves development efficiency, but also ensures the physical reality of the simulation process and the accuracy of the area determination through the collaborative design of fully parametric modeling and temperature-dependent rules. Moreover, the entire process can be directly executed through the simulation platform, which has strong engineering applicability.

[0020] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a flowchart of a simulation modeling method for determining the shot peening forming area according to Embodiment 1 of the present invention;

[0023] Figure 2 This is a schematic diagram of the structure of an initial finite element simulation model applicable to an embodiment of the present invention;

[0024] Figure 3 This is a flowchart of another simulation modeling method for determining the shot peening forming area according to Embodiment 2 of the present invention;

[0025] Figure 4 This is a schematic diagram of a distance versus time curve provided in Embodiment 2 of the present invention;

[0026] Figure 5 This is a schematic diagram of a simulation modeling device for determining the shot peening forming area according to Embodiment 3 of the present invention;

[0027] Figure 6 This is a schematic diagram of the structure of an electronic device that implements a simulation modeling method for determining the shot peening forming area according to an embodiment of the present invention. Detailed Implementation

[0028] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0029] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0030] Example 1

[0031] Figure 1 This is a flowchart of a simulation modeling method for determining the shot peening forming area according to Embodiment 1 of the present invention. This embodiment is applicable to the determination of the shot peening area for sheet metal parts in the aerospace field. The method can be executed by a simulation modeling device for determining the shot peening forming area. This device can be implemented in hardware and / or software and can be configured in a finite element simulation platform. Figure 1 As shown, the method includes:

[0032] S110. Based on the geometric parameters of the part to be formed, an initial finite element simulation model is built, which includes the deformable body of the part, the upper rigid plane and the lower rigid plane; wherein, the deformable body of the part is located between the upper rigid plane and the lower rigid plane.

[0033] The geometric parameters of the part to be formed refer to the inherent geometric parameters of the target part in this embodiment, which are used to determine the shot peening forming area. Specifically, these include the part's external dimensions, contour shape, and other core geometric information, serving as the foundational data for building the simulation model. The deformable body of the part refers to the equivalent simulation carrier of the part to be formed in the initial finite element simulation model. Its geometric characteristics are consistent with the part to be formed, and it possesses the physical property of thermal shrinkage deformation, used to realistically replicate the deformation behavior of the part to be formed under thermal action. The initial finite element simulation model refers to the basic simulation model where only the core structure has been built, and parameters such as temperature, constraints, loads, and temperature dependence rules have not yet been configured. It forms the basic framework for subsequent parameter configuration. The upper rigid plane and the lower rigid plane are fixed-attribute simulation planes set in the simulation model. They do not deform themselves but are used only to provide a heat transfer carrier and a constraint / load application carrier for the deformable body of the part; their spatial positions are relatively fixed, forming an area that accommodates the deformable body of the part.

[0034] like Figure 2 As shown, the upper and lower rigid planes serve as non-deformable carriers, and their core function is to provide a uniform heat input interface and a stable constraint bearing surface. The spatial arrangement of the two (with the deformable part located in the middle) is to ensure the uniformity of heat transfer in the vertical direction, avoid deformation deviation caused by heating on one side, and at the same time provide a clear and stable measurement object for subsequent spacing measurements, ensuring that the spacing data can accurately reflect the shrinkage degree of the deformable part.

[0035] S120. Set the temperature of the upper rigid plane and the lower rigid plane to the same constant temperature, and set the contact thermal resistance between the upper rigid plane, the lower rigid plane and the deformable body of the part to zero.

[0036] Constant temperature refers to a fixed temperature value that remains unchanged throughout the entire simulation process for both the upper and lower rigid planes. This temperature value is determined by those skilled in the art based on the material properties and thermal shrinkage characteristics of the part to be formed. Contact thermal resistance, in this embodiment, is a parameter used to characterize the degree of heat transfer obstruction at the interface between the upper and lower rigid planes and the deformable part. Setting the contact thermal resistance to zero indicates that there is no heat transfer loss at the contact interface, and heat can be directly conducted between the rigid plane and the deformable part.

[0037] S130. Set the lower rigid plane as a fixed constraint with all degrees of freedom, set the upper rigid plane as a fixed constraint with only the normal translational degree of freedom retained, and define a constant contact load along the normal direction for the upper rigid plane.

[0038] Fully fixed-degree-of-freedom constraints refer to constraints that restrict the displacement of the lower rigid plane in all spatial degrees of freedom in the initial finite element simulation model, keeping the lower rigid plane in a fixed spatial position throughout the simulation. Non-fully fixed-degree-of-freedom constraints refer to constraints that restrict only some spatial degrees of freedom, retaining specific degrees of freedom; in this embodiment, specifically, only the normal translational degree of freedom is retained, that is, restricting all degrees of freedom of the upper rigid plane except for translation along its own normal (the direction perpendicular to the plane), ensuring that the upper rigid plane can only move along the normal. A constant contact load refers to a load applied along the normal direction to the upper rigid plane that remains constant in magnitude. Its function is to keep the upper rigid plane in contact with the deformable body of the part, ensuring tight contact at the heat transfer interface. Applying a constant contact load along the normal direction to the upper rigid plane has the core function of eliminating gaps at the heat transfer interface: if gaps exist, heat transfer will be interrupted or unstable, and interface separation may occur when the part contracts, making the gap change unable to truly reflect deformation. Therefore, a constant contact load can ensure that the upper and lower interfaces are always in tight contact, balancing heat transfer stability and the effectiveness of gap measurement.

[0039] S140. Define a first temperature threshold and a second temperature threshold for the deformable part, and set the local temperature of the deformable part to be greater than the first temperature threshold to enable heat conduction. After setting the temperature dependence rule that thermal contraction occurs when the local temperature is greater than the second temperature threshold, a fully parameterized finite element simulation model is obtained; wherein, the second temperature threshold is greater than the first temperature threshold.

[0040] Both the first and second temperature thresholds are fixed temperature critical values ​​set for the deformable part, with the second temperature threshold being greater than the first temperature threshold. Together, they constitute the thermal behavior triggering conditions for the deformable part, the specific values ​​of which are determined by the thermophysical properties of the material to be formed. The temperature dependence rule, as defined in this embodiment, refers to the triggering rule that associates the thermal behavior of the deformable part with its local temperature; that is, the occurrence of thermal behavior depends on whether the local temperature reaches the corresponding temperature threshold. The fully parameterized finite element simulation model refers to a simulation model that has completed the configuration of all necessary parameters, including structural construction, temperature parameters, constraint parameters, load parameters, and temperature dependence rules. Full parameterization means that all core attributes of the model have been defined through parameters and can be directly executed in the simulation platform.

[0041] S150. Configure and execute the fully parameterized finite element simulation model in the simulation platform, find the target local area corresponding to the moment when the distance between the upper rigid plane and the lower rigid plane reaches the minimum value during the simulation process, and use it as the shot peening forming area of ​​the part to be formed.

[0042] The simulation platform refers to a professional software platform (such as ANSYS, ABAQUS, etc.) with finite element simulation execution, data monitoring, and result analysis functions. It is the carrier for executing fully parametric finite element simulation models. The interval distance refers to the parameter used in this embodiment to characterize the spatial distance between the upper and lower rigid planes. Its value changes with the thermal contraction deformation of the deformable part. The moment of minimum value refers to the simulation time node corresponding to the point where the interval distance between the upper and lower rigid planes decreases from large to small throughout the simulation process, eventually reaching its minimum value. The target local region refers to the local region on the deformable part that undergoes thermal contraction deformation at the moment the interval distance reaches its minimum value, and which contributes the most to the reduction of the interval (i.e., the thermal contraction of this region is the core reason for the minimum interval). The shot peening forming region refers to the target region finally output in this embodiment, used to guide the actual shot peening process of the part to be formed; that is, the target local region determined through simulation.

[0043] The embodiments of the present invention replace the inefficient trial-and-error method and the analytical method which is difficult to apply in engineering. It can accurately locate the shot peening forming area without multiple physical tests, which not only reduces the manpower and material resources consumed in process development and improves development efficiency, but also ensures the physical reality of the simulation process and the accuracy of the area determination through the collaborative design of fully parametric modeling and temperature-dependent rules. Moreover, the entire process can be directly executed through the simulation platform, which has strong engineering applicability.

[0044] Optionally, the constant contact load applied to the upper rigid plane is configured to maintain contact only between the upper rigid plane, the deformable part, and the lower rigid plane, and is insufficient to cause plastic deformation of the deformable part.

[0045] The magnitude of the constant contact load refers to the specific value of the load applied along the normal direction to the upper rigid plane. This value is determined by factors such as the material properties of the part to be formed and the thickness of the deformable part. Maintaining contact means that through the action of a constant contact load, the upper rigid plane and the deformable part, and the deformable part and the lower rigid plane, remain in close contact without gaps, ensuring the continuity of the heat transfer interface and deformation transmission path. Plastic deformation refers to the permanent deformation that occurs in the deformable part under the action of external force, which cannot return to its original shape after unloading. It is a different type of deformation mechanism from the core-dependent thermal contraction deformation.

[0046] In this embodiment, the purpose of the constant contact load is to ensure the tightness of the heat transfer interface, rather than to apply forming force to the deformable part. Configuring the constant contact load to "only maintain contact and not cause plastic deformation" essentially isolates the interference of external force deformation by limiting the load threshold. This ensures that the deformation of the deformable part during simulation is dominated only by preset thermal shrinkage deformation, allowing the spacing change data to accurately reflect the degree of thermal shrinkage, ultimately guaranteeing the accuracy of the shot peening forming area determination.

[0047] Furthermore, after constructing the initial finite element simulation model, which includes the deformable part, the upper rigid plane, and the lower rigid plane, it may also include:

[0048] Inside the deformable part, a heat-insulating surface is defined parallel to the upper and lower rigid planes, and the thermal conductivity of the heat-insulating surface is set to zero; wherein, the heat-insulating surface is configured to restrict heat conduction along the thickness direction of the deformable part during simulation, thereby concentrating heat on the surface of the part.

[0049] A heat-insulating surface refers to a virtual plane with heat-insulating function set inside the deformable body of a part. Its orientation is parallel to the upper and lower rigid planes, and its core function is to restrict the direction of heat conduction. Thermal conductivity is a parameter characterizing a material's ability to conduct heat. Setting the thermal conductivity of the heat-insulating surface to zero means that the surface has no heat conduction capacity at all, blocking heat from passing through it. The thickness direction of the deformable body refers to the direction perpendicular to the upper (or lower) rigid plane, that is, the direction in which the deformable body extends between the upper and lower rigid planes, and is also the direction in which heat is easily transferred when no heat-insulating surface is provided. The surface layer of the part refers to the area near the surface of the deformable body, specifically the area between the heat-insulating surface and the upper rigid plane, or between the heat-insulating surface and the lower rigid plane. This is the core area of ​​action in the shot peening process.

[0050] By setting a heat insulation surface parallel to the upper and lower rigid planes inside the deformable body of the part and setting its thermal conductivity to zero, the essence is to achieve heat concentration by blocking heat conduction in the thickness direction: after the heat is transferred from the upper and lower rigid planes to the deformable body of the part, it cannot diffuse inward through the heat insulation surface and can only accumulate in the surface area of ​​the part, so that the temperature of the surface area first reaches the first temperature threshold and the second temperature threshold, and finally achieves concentrated thermal shrinkage deformation of the surface.

[0051] Example 2

[0052] Figure 3 This is a flowchart of another simulation modeling method for determining the shot peening forming area provided in Embodiment 2 of the present invention. This embodiment is a refinement based on Embodiment 1. Specifically, as follows... Figure 3 As shown, the method includes:

[0053] S310. Based on the geometric parameters of the part to be formed, build an initial finite element simulation model including the deformable body of the part, the upper rigid plane and the lower rigid plane; wherein, the deformable body of the part is located between the upper rigid plane and the lower rigid plane.

[0054] S320. Set the temperature of the upper rigid plane and the lower rigid plane to the same constant temperature, and set the contact thermal resistance between the upper rigid plane, the lower rigid plane and the deformable body of the part to zero.

[0055] S330. Set the lower rigid plane as a fixed constraint with all degrees of freedom, set the upper rigid plane as a fixed constraint with only the normal translational degree of freedom retained, and define a constant contact load along the normal direction for the upper rigid plane.

[0056] S340. Define a first temperature threshold and a second temperature threshold for the deformable part, and set the local temperature of the deformable part to be greater than the first temperature threshold to enable heat conduction. After setting the temperature dependence rule that thermal contraction occurs when the local temperature is greater than the second temperature threshold, a fully parameterized finite element simulation model is obtained; wherein, the second temperature threshold is greater than the first temperature threshold.

[0057] Optionally, enabling heat conduction in the temperature-dependent rule is achieved by defining a temperature-dependent thermal conductivity function for the deformable part. This is used to calculate the rate of heat transfer in simulations, and is specifically defined as:

[0058] ;

[0059] in, The first temperature threshold, These are predefined thermal conductivity parameters used to characterize the inherent thermal conductivity of the material corresponding to the part to be molded.

[0060] Thermal conductivity function related to temperature This is a function defined for the deformable part in this embodiment, representing the change in thermal conductivity with temperature. Its core function is to quantitatively control the heat transfer rate of the deformable part. First temperature threshold. It is a function of thermal conductivity The critical temperature parameter is used to define the on / off state of heat conduction. Typically, heat conduction parameters... It can be flexibly set as a fixed constant or a temperature-related function according to the material properties and the simulation temperature range. For example, when the target simulation temperature range of the part to be formed is narrow, or the thermal conductivity of the material used in the part is minimally affected by temperature, It can be set as a fixed constant; however, when the target simulation temperature range of the part to be formed is wide, or the thermal conductivity of the material used in the part changes significantly with temperature, It needs to be set as a temperature-dependent function (such as a linear function). (T) = aT + b or a polynomial function, etc. When the local temperature of the deformable part does not exceed the first temperature threshold... This means that the thermal conductivity is 0, and heat cannot be transferred within the current local area; while the local temperature... hour, This means that the local thermal conductivity is at this point the intrinsic thermal conductivity of the material. Heat is transferred according to the inherent properties of the material.

[0061] S350. Start the simulation platform to solve the finite element simulation model. Based on the initial finite element simulation model, obtain the initial contact surfaces of the upper rigid plane, the lower rigid plane and the deformable body of the part.

[0062] The initial contact surface refers to the surface area in the initial finite element simulation model where the upper rigid plane and the deformable body of the part, and the lower rigid plane and the deformable body of the part, are in direct contact. During the simulation, heat needs to be transferred through the contact interface between the rigid plane and the part. If the initial contact surface is not determined beforehand, the starting range of heat transfer will be ambiguous, leading to a lack of accurate reference areas for subsequent temperature distribution and deformation calculations.

[0063] S360. Based on the constant temperature and zero contact thermal resistance, heat is transferred to the deformable part through the initial contact surface, causing the temperature of the deformable part to rise; wherein, the rate of heat transfer is determined by a thermal conductivity function.

[0064] Zero-contact thermal resistance refers to the thermal resistance parameter of the contact interface between the upper rigid plane and the deformable part, and between the lower rigid plane and the deformable part, as set in this embodiment. Its value is zero, which means that there is no heat transfer loss at the contact interface.

[0065] S370. When the temperature of any local area in the initial contact surface exceeds the first temperature threshold, heat conduction is initiated in the current local area according to a predefined thermal conductivity function.

[0066] Localized heat transfer is achieved, avoiding synchronous heating of the entire component and ensuring that only local temperature differences are formed subsequently, thus providing a basis for locating the target local area.

[0067] S380. If the temperature of any target local area in the current local area exceeds the second temperature threshold, calculate the thermal shrinkage strain of the target local area caused by temperature based on the predefined thermal shrinkage coefficient function.

[0068] The thermal shrinkage coefficient function is a predefined function that characterizes the relationship between the degree of thermal shrinkage of a deformable part and temperature. It is used to quantitatively calculate the thermal shrinkage strain caused by temperature rise in a target local area. Thermal shrinkage strain refers to the quantified value of the degree of deformation related to thermal shrinkage in a target local area when the temperature exceeds a second temperature threshold. The core is to complete the "thermal-to-mechanical" transformation, converting abstract temperature changes into a mechanical deformation that can be calculated in a simulation, providing a direct driving basis for the movement of the rigid plane.

[0069] Furthermore, the thermal shrinkage occurs by defining a temperature-dependent thermal shrinkage coefficient function for the deformable part. This is used to calculate the material shrinkage strain caused by temperature in simulations, and is specifically defined as:

[0070] ;

[0071] in, The second temperature threshold, These are predefined material constants used to characterize the thermal shrinkage properties of materials.

[0072] Temperature-dependent thermal shrinkage coefficient function This is a function defined for the coefficient of thermal shrinkage as a function of temperature, representing the deformable part. Second temperature threshold. It is a function of thermal shrinkage coefficient. The critical temperature parameter is used to define the on / off state of thermal shrinkage. When the local temperature of the deformable part... hour, This corresponds to the state where no thermal shrinkage has occurred; when hour, Depend on Calculations yielded the precise temperature-dependent rules for determining the state of thermal contraction. The degree of thermal contraction was quantified through... With temperature The correlation calculation allows the coefficient of thermal shrinkage to change dynamically with temperature, reflecting both the inherent properties of the material and ensuring a strong correlation between the degree of thermal shrinkage and temperature, thus avoiding simulation distortion caused by a disconnect between thermal shrinkage and temperature. The material shrinkage strain is a quantified value of the degree of shrinkage deformation of the deformable part caused by temperature changes.

[0073] S390. After thermal shrinkage strain occurs, under the action of the constant contact load, the upper rigid plane is pushed to move along the normal direction, and the interval distance between the upper rigid plane and the lower rigid plane changes with time, dynamically generating a distance-time curve.

[0074] The distance-time curve refers to a continuous curve generated with simulation time as the horizontal axis and the interval distance between the upper and lower rigid planes as the vertical axis. It is used to visually reflect the changing trend of the interval distance as the simulation process progresses. Figure 4 The diagram shows a schematic representation of the distance versus time curve. A constant contact load ensures the rigid plane adheres to the part, allowing deformation to directly drive changes in the distance; the generated curve transforms invisible deformation into visual data, providing a basis for determining the moment of minimum distance.

[0075] S3100. When the rate of change of the interval distance in the distance-time curve changes from a negative value to a positive value, stop the simulation and determine the current simulation time as the characteristic moment.

[0076] The rate of change of the interval distance refers to the rate at which the interval distance changes with the simulation time. Its positive and negative values ​​correspond to the trend of the interval "decreasing" (negative value) or "increasing" (positive value), and it is the core judgment indicator for locking the minimum value of the interval.

[0077] Optionally, identifying the rate of change of the interval distance in the distance-time curve from a negative value to a positive value may include:

[0078] The first derivative of the distance versus time curve is calculated in real time. When the value of the first derivative changes from less than 0 to greater than or equal to 0, it is determined that the rate of change of the interval distance under the current simulation time changes from negative to positive.

[0079] The first derivative refers to the first derivative of the distance versus time curve, and its value directly corresponds to the rate of change of the interval distance over simulation time (i.e., the rate of change of the interval distance). During simulation, manually observing the distance versus time curve to judge the trend is prone to deviations due to curve fluctuations and observation angles. However, by calculating the first derivative in real time, the rate of change of the interval distance can be transformed into a clear numerical indicator, achieving objective quantification of the trend. When the first derivative changes from "less than 0" (corresponding to "interval distance decreasing") to "greater than or equal to 0" (corresponding to "interval distance stopping decreasing / starting to increase"), it is the mathematical criterion for determining when the interval distance has reached its minimum value.

[0080] S3110. Extract the temperature data of the initial contact surface at the characteristic moment, and filter the target local area with a temperature value higher than the second temperature threshold from the temperature data to determine the shot peening forming area of ​​the part to be formed.

[0081] The characteristic moment refers to the simulation time point when the rate of change of the interval distance changes from a negative value to a positive value, corresponding to the lowest point of the distance-time curve. The characteristic moment corresponds to the state where the deformable body of the part shrinks the most. At this time, the target local area with a temperature higher than the second temperature threshold in the initial contact surface is the core deformation area that drives the reduction of the interval distance. This area is highly matched with the surface deformation area that needs to be acted upon in actual shot peening. By temperature screening, the simulation results are directly converted into the shot peening area.

[0082] This embodiment focuses on a detailed explanation of the methods for achieving heat conduction, thermal contraction, and determining the shot peening forming area. Specifically, by defining a temperature-related thermal conductivity function, the abstract heat conduction logic is transformed into quantifiable parameters that can be calculated in the simulation. Furthermore, by utilizing a temperature-related thermal contraction coefficient function, the thermal contraction logic is transformed into a quantifiable basis for deformation calculation. By calculating the first derivative of the distance-time curve, the trend of distance change is transformed into an objective numerical indicator, eliminating the subjective error of manually observing the curve and further improving the reliability of the simulation results.

[0083] Example 3

[0084] Figure 5 This is a schematic diagram of a simulation modeling device for determining the shot peening forming area, provided in Embodiment 3 of the present invention. Figure 5 As shown, the device includes:

[0085] The initial finite element simulation model building module 510 is used to build an initial finite element simulation model containing a deformable part, an upper rigid plane, and a lower rigid plane based on the geometric parameters of the part to be formed; wherein, the deformable part is located between the upper rigid plane and the lower rigid plane.

[0086] Temperature parameter definition module 520 is used to set the temperature of the upper rigid plane and the lower rigid plane to the same constant temperature, and to set the contact thermal resistance between the upper rigid plane, the lower rigid plane and the deformable body of the part to zero.

[0087] The degree-of-freedom parameter definition module 530 is used to set the lower rigid plane as a fixed constraint with all degrees of freedom, set the upper rigid plane as a fixed constraint with only the normal translational degree of freedom, and define a constant contact load along the normal direction for the upper rigid plane.

[0088] The thermodynamic parameter definition module 540 is used to define a first temperature threshold and a second temperature threshold for the deformable part, and to set the local temperature of the deformable part to be greater than the first temperature threshold to enable heat conduction. After setting the temperature dependence rule that thermal contraction occurs when the local temperature is greater than the second temperature threshold, a fully parameterized finite element simulation model is obtained; wherein, the second temperature threshold is greater than the first temperature threshold.

[0089] The simulation running module 550 is used to configure and execute the fully parameterized finite element simulation model in the simulation platform, and to find the target local area corresponding to the moment when the distance between the upper rigid plane and the lower rigid plane reaches the minimum value during the simulation process, which is used as the shot peening forming area of ​​the part to be formed.

[0090] The embodiments of the present invention replace the inefficient trial-and-error method and the analytical method which is difficult to apply in engineering. It can accurately locate the shot peening forming area without multiple physical tests, which not only reduces the manpower and material resources consumed in process development and improves development efficiency, but also ensures the physical reality of the simulation process and the accuracy of the area determination through the collaborative design of fully parametric modeling and temperature-dependent rules. Moreover, the entire process can be directly executed through the simulation platform, which has strong engineering applicability.

[0091] Optionally, based on the above embodiments, enabling heat conduction in the temperature-dependent rule is achieved by defining a temperature-dependent thermal conductivity function for the deformable part. This is used to calculate the rate of heat transfer in simulations, and is specifically defined as:

[0092] ;

[0093] in, The first temperature threshold, These are predefined thermal conductivity parameters that characterize the inherent thermal conductivity of the material corresponding to the part to be molded.

[0094] Optionally, based on the above embodiments, the thermal shrinkage is achieved by defining a temperature-dependent thermal shrinkage coefficient function for the deformable part. This is used to calculate the material shrinkage strain caused by temperature in simulations, and is specifically defined as:

[0095] ;

[0096] in, The second temperature threshold, These are predefined material constants used to characterize the thermal shrinkage properties of materials.

[0097] Optionally, based on the above embodiments, the simulation execution module 550 may include:

[0098] The initial contact surface determination unit is used to start the simulation platform to solve the finite element simulation model and obtain the initial contact surfaces of the upper rigid plane, the lower rigid plane and the deformable body of the part based on the initial finite element simulation model.

[0099] A heat transfer unit is used to transfer heat to the deformable part through the initial contact surface based on the constant temperature and zero contact thermal resistance, causing the temperature of the deformable part to rise; wherein the rate of heat transfer is determined by a function of thermal conductivity.

[0100] A heat conduction unit is used to activate heat conduction in any local area of ​​the initial contact surface when the temperature exceeds the first temperature threshold, according to a predefined heat conduction function.

[0101] The thermal shrinkage strain unit is used to calculate the thermal shrinkage strain caused by temperature in any target local area if the temperature of any target local area in the current local area exceeds a second temperature threshold, based on a predefined thermal shrinkage coefficient function.

[0102] The dynamic and time curve generation unit is used to push the upper rigid plane to move along the normal direction under the action of the constant contact load after thermal shrinkage strain occurs, and continuously record the interval distance between the upper rigid plane and the lower rigid plane as it changes over time, and dynamically generate a distance and time curve.

[0103] The feature time determination unit is used to stop the simulation and determine the current simulation time as the feature time when the rate of change of the interval distance in the distance-time curve changes from a negative value to a positive value.

[0104] The shot peening forming area determination unit is used to extract the temperature data of the initial contact surface at the characteristic moment, and filter the target local area with a temperature value higher than the second temperature threshold from the temperature data to determine the shot peening forming area of ​​the part to be formed.

[0105] Optionally, based on the above embodiments, the constant contact load applied to the upper rigid plane is configured to be used only to maintain the contact between the upper rigid plane, the deformable part, and the lower rigid plane, and is insufficient to cause plastic deformation of the deformable part.

[0106] Optionally, based on the above embodiments, the feature time determination unit is specifically used to calculate the first derivative of the distance-time curve in real time. When the value of the first derivative changes from less than 0 to greater than or equal to 0, it is determined that the rate of change of the interval distance under the current simulation time changes from negative to positive.

[0107] Optionally, based on the above embodiments, it may further include: a heat insulation surface setting unit, used to define a heat insulation surface parallel to the upper and lower rigid planes inside the deformable part after building an initial finite element simulation model including the deformable part, the upper rigid plane and the lower rigid plane, and setting the thermal conductivity of the heat insulation surface to zero; wherein, the heat insulation surface is configured to restrict the conduction of heat along the thickness direction of the deformable part during the simulation process, so that the heat is concentrated on the surface of the part.

[0108] The simulation modeling device for determining the shot peening forming area provided in the embodiments of the present invention can execute the simulation modeling method for determining the shot peening forming area provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0109] Example 4

[0110] Figure 6 A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0111] like Figure 6 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 can also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0112] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0113] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, central processing unit (CPU), graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, digital signal processors (DSPs), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as a simulation modeling method for determining shot peening formation areas.

[0114] That is, based on the geometric parameters of the part to be formed, an initial finite element simulation model is built, which includes the deformable body of the part, the upper rigid plane and the lower rigid plane; wherein, the deformable body of the part is located between the upper rigid plane and the lower rigid plane;

[0115] The temperatures of the upper and lower rigid planes are set to the same constant temperature, and the contact thermal resistance between the upper and lower rigid planes and the deformable body of the part is set to zero.

[0116] The lower rigid plane is set as a fixed constraint with all degrees of freedom, the upper rigid plane is set as a fixed constraint with only the normal translational degree of freedom retained, and a constant contact load along the normal is defined for the upper rigid plane.

[0117] A first temperature threshold and a second temperature threshold are defined for the deformable part. Heat conduction is activated when the local temperature of the deformable part is greater than the first temperature threshold. A temperature dependence rule is set so that thermal contraction occurs when the local temperature is greater than the second temperature threshold. A fully parameterized finite element simulation model is then obtained. The second temperature threshold is greater than the first temperature threshold.

[0118] Configure and execute the fully parameterized finite element simulation model in the simulation platform, find the target local area corresponding to the moment when the distance between the upper rigid plane and the lower rigid plane reaches the minimum value during the simulation process, and use it as the shot peening forming area of ​​the part to be formed.

[0119] In some embodiments, a simulation modeling method for determining shot peening formation areas can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the simulation modeling method for determining shot peening formation areas described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform a simulation modeling method for determining shot peening formation areas by any other suitable means (e.g., by means of firmware).

[0120] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0121] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0122] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0123] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0124] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0125] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0126] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and no limitation is imposed herein.

[0127] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A simulation modeling method for shot forming area determination, characterized in that, The method comprises the following steps: Based on the geometric parameters of the part to be formed, an initial finite element simulation model is built, which includes a part deformable body, an upper rigid plane and a lower rigid plane. The part deformable body is located between the upper rigid plane and the lower rigid plane. The temperature of the upper rigid plane and the lower rigid plane is set to the same constant temperature, and the contact thermal resistance between the upper rigid plane, the lower rigid plane and the part deformable body is set to zero. The lower rigid plane is set as a full degree of freedom fixed constraint, and the upper rigid plane is set as a non-full degree of freedom fixed constraint which only retains the normal translation degree of freedom. A constant contact load along the normal direction is defined for the upper rigid plane. First and second temperature thresholds are defined for the part deformable body. When the local temperature of the part deformable body is greater than the first temperature threshold, heat conduction is started. When the local temperature is greater than the second temperature threshold, the temperature-dependent rule of thermal shrinkage occurs, and a fully parameterized finite element simulation model is obtained. The second temperature threshold is greater than the first temperature threshold. The fully parameterized finite element simulation model is configured and executed in a simulation platform. The target local area corresponding to the moment when the interval distance between the upper rigid plane and the lower rigid plane reaches the minimum value in the simulation process is determined as the shot forming area of the part to be formed.

2. The method of claim 1, wherein, The temperature-dependent rule in which the heat conduction is turned on is implemented by defining a temperature-dependent thermal conductivity function for the part deformable body for calculating the rate of heat transfer in a simulation, specifically defined as: ； wherein, is a first temperature threshold, is a predefined heat transfer parameter for characterizing the inherent heat conduction capability of the material of the part to be formed.

3. The method of claim 1, wherein, Said thermal contraction is implemented by defining a temperature-dependent thermal contraction coefficient function for said part deformable body for calculating in simulation the material contraction strain induced by temperature, defined as: ； wherein is a second temperature threshold, is a predefined material constant for characterizing the thermal shrinkage behavior of a material.

4. The method according to claim 2 or 3, characterized in that, The fully parameterized finite element simulation model is configured and executed in a simulation platform. The target local area corresponding to the moment when the interval distance between the upper rigid plane and the lower rigid plane reaches the minimum value in the simulation process is determined as the shot forming area of the part to be formed, which comprises: Start the simulation platform to solve the finite element simulation model. Based on the initial finite element simulation model, the initial contact surface of the upper rigid plane, the lower rigid plane and the part deformable body is obtained. Heat is transferred to the part deformable body through the initial contact surface based on the constant temperature and zero contact thermal resistance, causing the temperature of the part deformable body to rise. The rate of heat transfer is determined by the thermal conductivity function. When the temperature of any local area in the initial contact surface exceeds the first temperature threshold, heat conduction is started in the current local area according to the predefined thermal conductivity function. If the temperature of any target local area in the current local area exceeds the second temperature threshold, the thermal shrinkage strain of the target local area caused by temperature is calculated based on the predefined thermal shrinkage coefficient function. After the thermal shrinkage strain occurs, the upper rigid plane is pushed to move along the normal direction under the action of the constant contact load, and the interval distance between the upper rigid plane and the lower rigid plane is continuously recorded over time, and a distance-time curve is dynamically generated. When the change rate of the interval distance in the distance-time curve changes from negative to positive, the simulation is stopped, and the current simulation time is determined as the characteristic time. The temperature data of the initial contact surface at the characteristic time is extracted, and the target local area with a temperature value higher than the second temperature threshold is selected from the temperature data, which is determined as the shot forming area of the part to be formed.

5. The method of claim 1, wherein, The constant contact load applied to the upper rigid plane is configured to only maintain contact between the upper rigid plane, the part deformable body, and the lower rigid plane, and is insufficient to cause plastic deformation of the part deformable body.

6. The method of claim 4, wherein, The rate of change of the interval distance in the distance-time curve is identified to change from a negative value to a positive value, including: The first derivative of the distance-time curve is calculated in real time, and when the value of the first derivative changes from less than 0 to greater than or equal to 0, it is determined that the rate of change of the interval distance at the current simulation time changes from a negative value to a positive value.

7. The method of claim 1, wherein, After building an initial finite element simulation model including a part deformable body, an upper rigid plane and a lower rigid plane, further comprising: In the interior of the part deformable body, a heat insulation surface parallel to the upper rigid plane and the lower rigid plane is defined, and the thermal conductivity of the heat insulation surface is set to zero; wherein the heat insulation surface is configured to limit heat conduction along the thickness direction of the part deformable body during simulation, thereby concentrating heat on the surface layer of the part.

8. A simulation modeling device for shot forming area determination, characterized by Comprising: An initial finite element simulation model building module for building an initial finite element simulation model including a part deformable body, an upper rigid plane and a lower rigid plane based on the geometric parameters of the part to be formed; wherein the part deformable body is located between the upper rigid plane and the lower rigid plane; A temperature parameter definition module for setting the temperature of the upper rigid plane and the lower rigid plane to the same constant temperature, and setting the contact thermal resistance between the upper rigid plane, the lower rigid plane and the part deformable body to zero; A degree of freedom parameter definition module for setting the lower rigid plane as a full degree of freedom fixed constraint, setting the upper rigid plane as a non-full degree of freedom fixed constraint retaining only the normal translation degree of freedom, and defining a constant contact load along the normal direction for the upper rigid plane; A thermodynamic parameter definition module for defining a first temperature threshold and a second temperature threshold for the part deformable body, and setting the local temperature of the part deformable body to be greater than the first temperature threshold to enable heat conduction, and when the local temperature is greater than the second temperature threshold, a temperature-dependent rule of thermal contraction occurs, to obtain a fully parameterized finite element simulation model; wherein the second temperature threshold is greater than the first temperature threshold; A simulation running module for configuring and executing the fully parameterized finite element simulation model in a simulation platform, and finding the target local area corresponding to the moment when the interval distance between the upper rigid plane and the lower rigid plane reaches a minimum value in the simulation process as the shot forming area of the part to be formed.

9. An electronic device, comprising: The electronic device comprises: At least one processor; and a memory connected in communication with the at least one processor; wherein the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the simulation modeling method for determining the shot forming area according to any one of claims 1-7. The electronic device comprises: At least one processor; and a memory connected in communication with the at least one processor; wherein the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the simulation modeling method for determining the shot forming area according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for causing the processor to implement the simulation modeling method for shot forming region determination according to any one of claims 1-7 when executed.

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