Dielectric window cooling device and plasma etching equipment

Abstract

The invention discloses a dielectric window cooling device and plasma etching equipment. The dielectric window cooling device is used for cooling a dielectric window, a coil is arranged above the dielectric window, and the dielectric window cooling device comprises a heat conduction piece; the coil is provided with a cooling cavity, the cooling cavity is communicated with a cooling medium source, the upper surface of the heat conduction piece is used for making contact with the lower surface of the coil, and the lower surface of the heat conduction piece is used for making contact with the upper surface of the medium window. When the dielectric window cooling device is applied, the cooling effect of the dielectric window can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, specifically to a dielectric window cooling device and a plasma etching apparatus. Background Technology

[0002] In the manufacturing process of semiconductor integrated circuits, etching is the most crucial step. It typically uses a coil above the chamber, driven by radio frequency (RF) to generate a magnetic field. This magnetic field excites gas to produce plasma, thus etching the wafer. Since etching requires a vacuum environment, the chamber must be sealed to ensure adequate vacuum. Specifically, a dielectric coupling window (hereinafter referred to as "dielectric window") is usually placed on top of the chamber cover to seal it. The coil is fixed above the dielectric window. The dielectric window has high resistance and also prevents the coil from conducting to the chamber cover. It must possess high strength, insulation, high temperature resistance, and resistance to various acid and alkali corrosion, and is usually made of materials such as ceramics. During etching, the plasma generated by the magnetic field has high energy, and the higher the RF power, the greater the plasma density. The closer the dielectric window is to the center, the stronger the magnetic field, resulting in a higher plasma density and greater heat release from ion collisions. Consequently, the temperature is higher closer to the center and lower closer to the edge, creating a temperature difference between the center and edge of the dielectric window. Since the medium window is mostly made of ceramic material, there is a risk of it cracking when the overall temperature difference of the ceramic is too large. Therefore, the medium window needs to be cooled to balance the temperature difference between its center and the edge.

[0003] In related technologies, cooling fans are typically placed above the dielectric window, using the atmosphere as the heat transfer medium to cool the dielectric window. However, this cooling method mainly uses air cooling, which has poor cooling effect and is only suitable for cooling the dielectric window under conditions of low RF power. It is insufficient to cope with the temperature generated by high RF power.

[0004] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a dielectric window cooling device to improve the cooling effect of the dielectric window. Another purpose of this application is to provide a plasma etching apparatus.

[0006] To solve the above-mentioned technical problems, this application provides a medium window cooling device for cooling a medium window, wherein a coil is provided above the medium window, and the medium window cooling device includes a heat-conducting component;

[0007] The coil has a cooling cavity connected to a cooling medium source. The upper surface of the heat-conducting element is used to contact the lower surface of the coil, and the lower surface of the heat-conducting element is used to contact the upper surface of the medium window.

[0008] Optionally, the heat-conducting component includes several heat-conducting areas, which are arranged sequentially from the inside to the outside, and the contact area between each heat-conducting area and the medium window decreases sequentially from the inside to the outside.

[0009] Optionally, the heat-conducting component has at least one first hollow portion, which extends through the heat-conducting component from top to bottom. The cross-sectional area of ​​the first hollow portion is defined as the hollow area, and the total hollow area of ​​each heat-conducting region increases sequentially from the inside to the outside.

[0010] Optionally, the heat-conducting element is made of a soft material, and the coil is able to abut against the heat-conducting element so that the upper surface of the heat-conducting element and the portion abutting against the coil are recessed downwards and cover at least a portion of the lower surface of the coil.

[0011] Optionally, the medium window cooling device further includes a limiting member;

[0012] The limiting member is disposed on the upper surface of the heat-conducting member. The limiting member has a groove channel that extends from top to bottom through the limiting member. The groove channel is used to install the coil, and the side wall of the groove channel is used to abut against at least a portion of the outer surface of the coil.

[0013] Optionally, the interior of the groove channel is provided with a step, the step surface of which is arranged facing upwards, and the step is used to abut against at least a portion of the lower surface of the coil.

[0014] Optionally, the limiting member includes several limiting areas;

[0015] Several limiting regions are arranged to surround the limiting member from the inside out. The limiting member has at least one second hollow portion, which penetrates the limiting member from top to bottom. The cross-sectional area of ​​the second hollow portion is defined as the heat dissipation area. The total heat dissipation area of ​​each limiting region decreases sequentially from the inside out.

[0016] Optionally, the medium window cooling device further includes at least one clamping element;

[0017] The clamping member is disposed on the upper surface of the limiting member, and the lower surface of the clamping member is used to abut against at least a portion of the upper surface of the coil to press the coil against the heat-conducting member.

[0018] Optionally, the clamping member extends from the center of the limiting member toward the edge of the limiting member.

[0019] This application also provides a plasma etching apparatus, including a cavity cover, the dielectric window and the coil, wherein the dielectric window is disposed on the cavity cover, and the plasma etching apparatus further includes a dielectric window cooling device;

[0020] The heat-conducting element is disposed on the upper surface of the medium window, and the coil is disposed on the upper surface of the heat-conducting element.

[0021] The medium window cooling device provided in this application configures the coil to have a cooling cavity, which is connected to a cooling medium source. A heat-conducting element is placed between the medium window and the coil. The upper surface of the heat-conducting element is used to contact the lower surface of the coil, and the lower surface of the heat-conducting element is used to contact the upper surface of the medium window. In use, the cooling medium can exchange heat through the coil and the medium window to cool the medium window. Moreover, the heat-conducting element can increase the heat exchange area between the coil and the medium window to improve the cooling effect of the medium window. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of the medium window cooling device provided in the embodiments of this application;

[0023] Figure 2 for Figure 1 A partial longitudinal sectional view of the coil shown;

[0024] Figure 3 for Figure 1 The diagram shows the structure of the heat-conducting component.

[0025] Figure 4 for Figure 3 A schematic diagram showing the division of heat-conducting areas in the heat-conducting component;

[0026] Figure 5 for Figure 1 The diagram shows the structure of the limiting component.

[0027] Figure 6 for Figure 1 Top view;

[0028] Figure 7 for Figure 6 Sectional view along axis AA;

[0029] Figure 8 for Figure 7 A magnified view of a section at point B.

[0030] The reference numerals in the above figures are explained as follows:

[0031] 1-Media window, 1a-First mounting hole;

[0032] 2-Coil, 2a-Cooling chamber;

[0033] 3-Heat-conducting component, 3a-First hollowed-out part, 3b-Second mounting hole, 31-Heat-conducting area;

[0034] 4-Limiting component, 4a-Groove channel, 4a1-Side wall surface, 4a2-Step, 4a3-Step surface, 4b-Second hollow part, 4c-Third mounting hole, 41-Limiting area;

[0035] 5-Clamping parts;

[0036] 6-Cooling fan;

[0037] 7-Cavity cover;

[0038] 8-Shielding cover. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0040] It should be noted that: in this application, "lateral" refers to the horizontal direction, "longitudinal" refers to the vertical direction, and the cross section refers to the cross section in the horizontal direction; the "from inside to outside" direction specifically refers to the direction from the center to the edge of the corresponding component. For example, the direction from inside to outside of the heat-conducting component 3 is specifically the direction from the center to the edge of the heat-conducting component 3, and the direction from inside to outside of the limiting component 4 is specifically the direction from the center to the edge of the limiting component 4.

[0041] The terms "first" and "second" used in this application are merely for the convenience of describing two or more structures or components that are identical or similar in structure and / or function, and do not imply any special limitation on their order and / or importance.

[0042] The term "several" as used in this application refers to a number of uncertain quantities, usually two or more; and when "several" is used to indicate the quantity of certain components, it does not indicate the relationship between these components in terms of quantity.

[0043] In this application, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] Please refer to Figures 1 to 2 , Figure 1 This is a schematic diagram of the structure of the medium window cooling device provided in the embodiments of this application. Figure 2 for Figure 1 A partial longitudinal sectional view of the coil shown.

[0045] In the embodiments provided in this application, please refer to Figure 1Understanding: The medium window cooling device is used to cool the medium window 1. A coil 2 is provided above the medium window 1. The medium window cooling device includes a heat-conducting component 3; for example... Figure 2 As shown, the coil 2 has a cooling cavity 2a, which is connected to a cooling medium source; the upper surface of the heat-conducting element 3 is used to contact the lower surface of the coil 2, and the lower surface of the heat-conducting element 3 is used to contact the upper surface of the medium window 1.

[0046] It is easy to understand that coil 2 is used to generate a magnetic field under the drive of radio frequency. The magnetic field is then used to excite the gas in the etching chamber below the dielectric window 1 to generate plasma, thereby achieving the etching of the wafer. Since plasma has high energy, it releases a lot of heat during the impact process, thereby raising the temperature of the dielectric window 1.

[0047] While some existing etching processes can achieve deep silicon etching, they utilize relatively low radio frequency (RF) power, resulting in lower plasma density and etching rates, insufficient to meet the growing semiconductor industry's demands for high etching rates. Currently, through-silicon via (TSV) etching and other high aspect ratio etching techniques have emerged. These techniques typically use higher RF power to excite higher plasma densities. For example, TSV etching has developed rapidly and is gaining widespread industry acceptance due to its advantages such as low power consumption, small form factor, high performance, and high stacking density. These plasma etching techniques using higher RF power place greater demands on the cooling of the dielectric window.

[0048] Compared to related technologies that primarily use cooling fans for air cooling, which has poor cooling performance and is difficult to handle the high-power RF etching processes, the dielectric window cooling device provided in the above embodiments of this application has a cooling cavity 2a inside the coil 2, which is connected to a cooling medium source. This allows the cooling medium circulating inside the coil 2 to cool the dielectric window 1. The heat-conducting element 3 also improves the cooling effect, enabling it to handle the high-power RF etching processes. Specifically, the coil 2 is in indirect contact with the dielectric window 1 through the heat-conducting element 3. The heat-conducting element 3 and the coil 2 can exchange heat, thus achieving indirect heat exchange between the coil 2 and the dielectric window 1 for cooling. Furthermore, if the coil 2 and the dielectric window 1 were in direct contact, it would generally be a line contact with a small heat exchange area. The heat-conducting element 3 transforms the contact between the coil 2 and the dielectric window 1 into an indirect surface contact with a larger heat exchange area, significantly improving the cooling effect of the dielectric window 1 and addressing the temperature rise caused by high-power RF etching processes such as through-silicon via (TSV) etching.

[0049] It is worth noting that the cooling medium used by coil 2 for cooling medium window 1 can be either a cooling liquid or a cooling gas, and there are no specific restrictions.

[0050] Please refer to this as well. Figures 3 to 4 , Figure 3 for Figure 1 The diagram shows the structure of the heat-conducting component. Figure 4 for Figure 3 The diagram shows the division of the heat-conducting area into the heat-conducting components.

[0051] In actual setup, the specific structural form of the heat-conducting component 3 is not limited.

[0052] In the embodiments provided in this application, such as Figure 3 and Figure 4 As shown, the heat-conducting component 3 includes several heat-conducting regions 31, which are arranged sequentially from the inside to the outside, and the contact area between each heat-conducting region 31 and the medium window 1 decreases sequentially from the inside to the outside.

[0053] It is easy to understand that the closer the dielectric window 1 is to the center, the stronger the magnetic field, which in turn generates a higher plasma density, resulting in a higher temperature of the dielectric window 1 and a temperature difference between the center and the edge.

[0054] Compared to the cooling fan method in related technologies, which has a poor effect on balancing the temperature difference between the center and edge of the medium window, the heat-conducting component 3 is divided into several heat-conducting areas 31, and the medium window 1 can also be divided into coupling areas corresponding to each heat-conducting area 31. Each coupling area can be arranged to surround the medium window 1 from the inside out, so that the contact area between each heat-conducting area 31 and the medium window 1 decreases from the inside out. This makes the heat exchange area between each coupling area of ​​the medium window 1 and the coil 2 decrease from the inside out. As a result, the heat exchange area of ​​the coupling area closer to the center of the medium window 1 is larger, and the heat exchange area of ​​the coupling area closer to the edge of the medium window 1 is smaller. This makes the cooling effect of the coupling area closer to the center of the medium window 1 better, which can greatly improve the balance of the temperature difference between the center and edge of the medium window 1.

[0055] In specific configurations, the structure of the heat-conducting component 3, which makes the contact area between each heat-conducting region 31 and the medium window 1 gradually decrease from the inside to the outside, is not limited.

[0056] In the embodiments provided in this application, please refer to Figure 3 and Figure 4 It is understood that the heat-conducting component 3 has at least one first hollow portion 3a, which extends through the heat-conducting component 3 from top to bottom. The cross-sectional area of ​​the first hollow portion 3a is defined as the hollow area. The total hollow area of ​​each heat-conducting region 31 increases sequentially from the inside to the outside. Thus, by setting the first hollow portion 3a, the contact area between each heat-conducting region 31 and the medium window 1 decreases sequentially from the inside to the outside. The structure of the heat-conducting component 3 is relatively simple, easy to manufacture, and relatively low in cost.

[0057] Specifically, the center of the heat-conducting component 3 can coincide with the center of the medium window 1. A first mounting hole 1a can be opened in the middle of the medium window 1 for installing the gas inlet nozzle of the reaction gas. A second mounting hole 3b can be opened in the middle of the heat-conducting component 3 accordingly. The gas inlet nozzle passes through the second mounting hole 3b and the first mounting hole 1a from top to bottom. Among the heat-conducting regions 31 of the heat-conducting component 3, the heat-conducting region 31 closest to the center is defined as the central heat-conducting region, and the heat-conducting regions 31 located outside the central heat-conducting region are defined as the outer heat-conducting regions. The distance from the edge of the central heat-conducting region to the edge of the second mounting hole 3b can be equal to the size of each outer heat-conducting region in the direction from the center to the edge of the heat-conducting component 3. Of course, the two can also be different, and no specific restriction is imposed.

[0058] In this embodiment, the medium window 1 can be circular, and its upper surface can be flat. The heat-conducting element 3 can be a circular flat pad. The heat-conducting element 3 can be laid on the upper surface of the medium window 1, and the lower surface of the heat-conducting element 3 can be attached to the upper surface of the medium window 1 to improve the heat exchange effect.

[0059] In an embodiment not shown in this application, the heat-conducting component 3 may be provided with a heat-conducting block at the bottom, which contacts the upper surface of the heat-conducting block and the medium window 1. The contact area between the heat-conducting block and the medium window 1 of each heat-conducting region 31 may decrease from the inside to the outside, thereby realizing that the contact area between each heat-conducting region 31 and the medium window 1 decreases from the inside to the outside.

[0060] In specific settings, the shape of each heat-conducting region 31 is not limited; for example, it can be a rectangular ring, a triangular ring, or something else. Figure 4 The circular ring shape is shown; the number of heat-conducting regions 31 is unlimited, and there can be two, or as shown in the figure. Figure 4 The three shown can also be four or more. Of course, the more heat-conducting areas 31 there are, the better the effect of balancing the temperature difference between the center and the edge of the medium window 1. Each heat-conducting area 31 from the inside to the outside can be provided with a first hollow part 3a, or the first hollow part 3a can be provided only in each outer heat-conducting area. There is no specific limitation.

[0061] like Figure 3 and Figure 4 As shown in the embodiment of this application, each outer heat-conducting region is provided with a plurality of the aforementioned first hollow portions 3a, so that the total hollow area of ​​each outer heat-conducting region increases sequentially from the inside to the outside. Since the central heat-conducting region is not provided with the first hollow portion 3a, its total hollow area is 0. Thus, the total hollow area of ​​each heat-conducting region 31 increases sequentially from the inside to the outside, so that the contact area between each heat-conducting region 31 and the medium window 1 decreases sequentially from the inside to the outside.

[0062] In specific settings, the shape and arrangement of the first hollow part 3a are not limited.

[0063] In the embodiments provided in this application, please refer to Figure 3 and Figure 4 It is understood that the first hollow portion 3a can be nearly V-shaped. Multiple first hollow portions 3a can be provided in each outer heat conduction area. In each outer heat conduction area, each first hollow portion 3a can be equidistantly arranged along the circumference of the corresponding outer heat conduction area. The first hollow portions 3a of each outer heat conduction area are arranged one-to-one, and the corresponding first hollow portions 3a are interconnected to form a nearly V-shaped opening. The opening is away from the center of the heat conduction element 3 and gradually increases in size from the inside to the outside, so that the contact area between each heat conduction area 31 and the medium window 1 gradually decreases from the inside to the outside.

[0064] In one embodiment not shown in this application, the first hollow portion 3a can be an arc-shaped annular through hole, each arc-shaped annular through hole can be concentric with the heat-conducting element 3, each outer heat-conducting area can be provided with at least one arc-shaped annular through hole, the central angle of the arc-shaped annular through hole in each outer heat-conducting area can gradually increase from the inside to the outside, and the number of arc-shaped annular through holes in each outer heat-conducting area can also gradually increase from the inside to the outside. There is no specific limitation, as long as the contact area between each heat-conducting area 31 and the medium window 1 gradually decreases from the inside to the outside.

[0065] In another embodiment not shown in this application, the first hollow portion 3a can be a circular through hole, and each outer heat-conducting area can be provided with multiple circular through holes. The diameter of the circular through holes in each outer heat-conducting area can increase from the inside to the outside, and the number of circular through holes in each outer heat-conducting area can also increase from the inside to the outside. There is no specific limitation, as long as the contact area between each heat-conducting area 31 and the medium window 1 decreases from the inside to the outside.

[0066] In specific settings, the material of the heat-conducting component 3 is not limited, as long as it has thermal conductivity and insulation properties.

[0067] In this embodiment, the heat-conducting element 3 can be made of a soft material, and the coil 2 can abut against the heat-conducting element 3 so that the upper surface of the heat-conducting element 3 and the portion abutting against the coil 2 are recessed downwards and cover at least part of the lower surface of the coil 2, thereby increasing the contact area between the coil 2 and the heat-conducting element 3, further increasing the contact area between the coil 2 and the medium window 1, and further improving the cooling effect of the medium window 1.

[0068] Specifically, the aforementioned soft material can be an elastic material, which is a type of material with the ability to recover its deformation. It can undergo elastic deformation under the action of external force, but can return to its original shape after the external force is removed. For example, it can be silicone material or thermoplastic elastomer material. This application does not limit it in this regard.

[0069] Of course, the heat-conducting component 3 can also be made of materials other than soft materials. For example, it can be a material with phase change properties, that is, its thermal conductivity changes with the increase of temperature. When the temperature exceeds a certain limit, the material will absorb heat. By setting the corresponding phase change temperature, the temperature difference between the center and the edge of the medium window 1 can be adjusted.

[0070] Please refer to this as well. Figure 5 , Figure 5 for Figure 1 The diagram shows the structure of the limiting component.

[0071] In the embodiments provided in this application, the medium window cooling device further includes a limiting member 4; the limiting member 4 is disposed on the upper surface of the heat-conducting member 3, the limiting member 4 has a groove channel 4a, the groove channel 4a extends through the limiting member 4 from top to bottom, the groove channel 4a is used to install the coil 2, and the side wall surface 4a1 of the groove channel 4a is used to abut against at least a portion of the outer surface of the coil 2.

[0072] It is easy to understand that the coil 2 can be installed in the groove channel 4a, and the lower surface of the coil 2 is in contact with the upper surface of the heat-conducting component 3. The side wall surface 4a1 of the groove channel 4a can be used to limit the coil 2 from the side, making the installation of the coil 2 more stable and facilitating the smooth cooling effect of the coil 2 on the medium window 1.

[0073] In actual installation, the structural form of the groove channel 4a in the limiting member 4 is not limited, and can be specifically set according to the structure of the coil 2. For example, the coil 2 can be in a spiral ring shape, such as... Figure 5 As shown, the groove channel 4a can be arranged in a spiral ring shape to match the shape of the coil 2.

[0074] Please refer to this as well. Figures 6 to 8 , Figure 6 for Figure 1 Top view, Figure 7 for Figure 6 Sectional view along line AA, Figure 8 for Figure 7 A magnified view of a section at point B.

[0075] Please combine Figure 8 In this embodiment, the groove channel 4a has a step 4a2 inside, with the step surface 4a3 of the step 4a2 facing upwards. The step 4a2 is used to abut against at least a portion of the lower surface of the coil 2. Thus, the step surface 4a3 of the step 4a2 can be used to limit the coil 2 from below, improving the limiting effect of the limiting member 4 on the coil 2 and further ensuring the smooth operation of the coil 2's cooling function.

[0076] Each groove channel 4a may have two steps 4a2. Specifically, two steps 4a2 may be formed by extending inward from its two side walls 4a1.

[0077] Please combine Figure 5 It is understood that the limiting member 4 may include several limiting regions 41; the several limiting regions 41 may be arranged sequentially from the inside to the outside, and the limiting member 4 may have at least one second hollow portion 4b, which may penetrate the limiting member 4 from top to bottom. The cross-sectional area of ​​the second hollow portion 4b is defined as the heat dissipation area, and the total heat dissipation area of ​​each limiting region 41 from the inside to the outside may decrease sequentially. In this way, the total heat dissipation area of ​​the limiting region 41 closer to the center of the limiting member 4 is larger, and the total heat dissipation area of ​​the limiting region 41 closer to the edge is smaller, thereby making the heat dissipation effect of the heat conductor 3 below the limiting member 4 better in the area closer to the center, which can further improve the balance effect of the temperature difference between the center and the edge of the medium window 1.

[0078] It is worth noting that, although both the groove channel 4a and the second hollow part 4b penetrate the limiting member 4 from top to bottom, they are different. The groove channel 4a is used to install the coil 2, while the second hollow part 4b is used to dissipate heat for the heat-conducting member 3.

[0079] In specific configuration, the center of the limiting member 4 can coincide with the center of the heat-conducting member 3. A third mounting hole 4c can be opened in the middle of the limiting member 4. The air intake nozzle can pass through the third mounting hole 4c of the limiting member 4, the second mounting hole 3b of the heat-conducting member 3, and the first mounting hole 1a of the medium window 1 from top to bottom. Among the limiting regions 41 of the limiting member 4, the limiting region 41 closest to the center of the limiting member 4 is defined as the central limiting region, and the limiting regions 41 located outside the central limiting region are defined as the outer limiting regions. The distance from the edge of the central limiting region to the edge of the third mounting hole 4c can be equal to the size of each outer limiting region in the direction from the center to the edge of the limiting member 4. Of course, the two can also be different, and no specific restrictions are imposed.

[0080] In actual setup, the shape and structure of the limiting component 4 are not limited.

[0081] In the embodiments of this application, such as Figure 5 As shown, the limiting member 4 can be a circular flat pad to fit against the upper surface of the heat-conducting member 3, thereby enabling the coil 2 to be installed more securely and to fit more securely against the upper surface of the heat-conducting member 3. It can also improve the heat dissipation effect of the second hollow part 4b of the limiting member 4, so as to further improve the cooling effect of the coil 2 on the dielectric window 1.

[0082] In specific settings, the shape of each limiting area 41 is not limited; for example, it can be a rectangular ring, a triangular ring, or something else. Figure 5The circular ring shape shown; the number of limiting regions 41 is unlimited, and can be as follows: Figure 5 The two shown can also be three or more; each limiting area 41 from the inside to the outside can be provided with the aforementioned second hollow part 4b, or as shown in the figure. Figure 5 The second hollow section 4b is shown only in the central limiting area, and there are no specific restrictions.

[0083] like Figure 5 As shown in the embodiment of this application, the central limiting region is provided with a second hollow part 4b, while the outer limiting region is not provided with a second hollow part 4b, so that the total heat dissipation area of ​​the outer limiting region is 0, and the total heat dissipation area of ​​each limiting region 41 from the inside to the outside decreases sequentially.

[0084] In specific settings, the shape and arrangement of the second hollow part 4b are not limited.

[0085] In the embodiments provided in this application, such as Figure 5 As shown, the second hollow part 4b can be an arc ring. Two second hollow parts 4b can be set in the gap between the groove channels 4a in the central limiting area. The two second hollow parts 4b can be symmetrically arranged about the center of the limiting member 4 to improve the heat dissipation effect of the heat conductor 3 near the center, thereby improving the balance effect of the temperature difference between the center and the edge of the medium window 1. At the same time, it can also make the structure of the limiting member 4 more compact.

[0086] In embodiments not shown in this application, the second hollow portion 4b can be a circular through hole. Both the central limiting region and the outer limiting region can be provided with a plurality of second hollow portions 4b. The diameter of the circular through hole in each limiting region 41 can decrease from the inside to the outside, and the number of circular through holes in each limiting region 41 can also decrease from the inside to the outside. There are no specific restrictions, as long as the total heat dissipation area of ​​each limiting region 41 can decrease from the inside to the outside.

[0087] Please combine Figure 1 , Figures 6 to 8 In the embodiments provided in this application, the medium window cooling device further includes at least one clamping member 5. The clamping member 5 is disposed on the upper surface of the limiting member 4, and the lower surface of the clamping member 5 is used to abut against at least a portion of the upper surface of the coil 2 to press the coil 2 against the heat-conducting member 3. Thus, the clamping member 5 can be used to limit the coil 2 from above. The clamping member 5, the side wall surface 4a1 of the groove channel 4a, and the step 4a2 cooperate with each other to limit the coil 2, which can greatly improve the stability of the coil 2 installation and is more conducive to the smooth cooling effect of the coil 2 on the medium window 1. At the same time, the clamping member 5 applies a downward clamping force to the coil 2, pressing the coil 2 against the heat-conducting member 3. The coil 2 can transmit a downward force to the heat-conducting member 3, causing the heat-conducting member 3 to deform and indent downwards at the part abutting against the coil 2, thereby achieving the desired cooling effect. Figure 8The coil 2 is covered with at least a portion of its lower surface, thereby increasing the contact area between the coil 2 and the heat-conducting element 3 and improving the cooling effect of the coil 2 on the heat-conducting element 3.

[0088] In actual setup, the connection method between the clamping component 5 and the limiting component 4 is not limited; for example, they can be snap-fitted together, or... Figure 6 The connection shown is made by bolts to facilitate the disassembly of the clamping element 5, thereby facilitating the maintenance and replacement of the coil 2.

[0089] In actual setup, the number and arrangement of clamping components 5 are not limited.

[0090] like Figure 1 and Figure 6 As shown in the embodiment of this application, the clamping member 5 can be elongated and can extend from the center of the limiting member 4 to the edge of the limiting member 4. Four clamping members 5 can be provided. Figure 6 To demonstrate the structure of other parts, only one clamping member 5 is shown. The four clamping members 5 can be evenly spaced along the circumference of the limiting member 4, so as to achieve uniform limiting of the top of the coil 2 and improve the limiting effect.

[0091] In the embodiments provided in this application, such as Figure 1 As shown, the medium window cooling device also includes a cooling fan 6; the cooling fan 6 is located above the coil 2.

[0092] With this configuration, the cooling fan 6 can generate a downward cooling airflow. As the heat absorbed by the heat-conducting component 3 and the medium window 1 is dissipated upward through the limiting component 4 and its second hollow part 4b, the heat in the vertical direction can generate convection, which can improve the cooling effect of the medium window 1. The total heat dissipation area of ​​each limiting area 41 of the limiting component 4 decreases from the inside to the outside, so that the heat convection is greater in the area closer to the center of the limiting component 4 and less in the area closer to the edge, thereby enhancing the balance effect of the temperature difference between the center and the edge of the medium window 1.

[0093] This application also provides a plasma etching apparatus, including a cavity cover 7, a dielectric window 1, a coil 2, and a dielectric window cooling device. The dielectric window 1 is disposed on the cavity cover 7, a heat-conducting element 3 is disposed on the upper surface of the dielectric window 1, and the coil 2 is disposed on the upper surface of the heat-conducting element 3. The dielectric window cooling device is the dielectric window cooling device in all the above embodiments. Therefore, the plasma etching apparatus including the dielectric window cooling device has the beneficial effects of all the above embodiments, which will not be repeated here.

[0094] like Figure 1 As shown, the cavity cover 7 can be located at the top of the plasma etching chamber. A shield 8 can be installed on the top of the cavity cover 7. The coil 2, heat-conducting component 3, limiting component 4 and clamping component 5 can all be located inside the shield 8. The cooling fan 6 can be located at the middle of the top of the shield 8.

[0095] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the apparatus and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A medium window cooling device for cooling a medium window (1), wherein a coil (2) is disposed above the medium window (1), characterized in that, The medium window cooling device includes a heat-conducting component (3); The coil (2) has a cooling cavity (2a) connected to a cooling medium source. The upper surface of the heat-conducting element (3) is used to contact the lower surface of the coil (2), and the lower surface of the heat-conducting element (3) is used to contact the upper surface of the medium window (1).

2. The medium window cooling device according to claim 1, characterized in that, The heat-conducting component (3) includes several heat-conducting regions (31), which are arranged sequentially from the inside to the outside. The contact area between each heat-conducting region (31) and the medium window (1) decreases sequentially from the inside to the outside.

3. The medium window cooling device according to claim 2, characterized in that, The heat-conducting component (3) has at least one first hollow portion (3a), which extends through the heat-conducting component (3) from top to bottom. The cross-sectional area of ​​the first hollow portion (3a) is defined as the hollow area. The total hollow area of ​​each heat-conducting region (31) increases sequentially from the inside to the outside.

4. The medium window cooling device according to any one of claims 1 to 3, characterized in that, The heat-conducting element (3) is made of a soft material, and the coil (2) is able to abut against the heat-conducting element (3) so that the upper surface of the heat-conducting element (3) and the portion of the coil (2) that abuts against each other are recessed downwards and cover at least part of the lower surface of the coil (2).

5. The medium window cooling device according to any one of claims 1 to 3, characterized in that, The medium window cooling device also includes a limiting element (4). The limiting member (4) is disposed on the upper surface of the heat-conducting member (3). The limiting member (4) has a groove channel (4a) that runs through the limiting member (4) from top to bottom. The groove channel (4a) is used to install the coil (2). The side wall surface (4a1) of the groove channel (4a) is used to abut against at least a portion of the outer surface of the coil (2).

6. The medium window cooling device according to claim 5, characterized in that, The groove channel (4a) has a step (4a2) inside, with the step surface (4a3) of the step (4a2) facing upward, and the step (4a2) is used to abut against at least part of the lower surface of the coil (2).

7. The medium window cooling device according to claim 5, characterized in that, The limiting component (4) includes several limiting areas (41); Several limiting regions (41) are arranged to surround each other from the inside to the outside. The limiting member (4) has at least one second hollow part (4b). The second hollow part (4b) penetrates the limiting member (4) from top to bottom. The cross-sectional area of ​​the second hollow part (4b) is defined as the heat dissipation area. The total heat dissipation area of ​​each limiting region (41) decreases from the inside to the outside.

8. The medium window cooling device according to claim 5, characterized in that, The medium window cooling device also includes at least one clamping element (5); The clamping member (5) is disposed on the upper surface of the limiting member (4), and the lower surface of the clamping member (5) is used to abut against at least a portion of the upper surface of the coil (2) to press the coil (2) against the heat-conducting member (3).

9. The medium window cooling device according to claim 8, characterized in that, The clamping member (5) extends from the center of the limiting member (4) toward the edge of the limiting member (4).

10. A plasma etching apparatus, comprising a cavity cover (7), a dielectric window (1), and a coil (2), wherein the dielectric window (1) is disposed on the cavity cover (7), characterized in that, The plasma etching apparatus further includes a dielectric window cooling device as described in any one of claims 1 to 9; The heat-conducting element (3) is disposed on the upper surface of the medium window (1), and the coil (2) is disposed on the upper surface of the heat-conducting element (3).

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