High-power combiner applied to radio frequency power supply

By combining a two-stage combining scheme with lumped and distributed parameter design, the number of combiner input ports is increased and the power capacity is improved, which solves the problem of insufficient power capacity of combiners in the low-frequency band in RF power supplies, and achieves higher current carrying capacity and greater power output.

CN121601997APending Publication Date: 2026-03-03江苏神州半导体科技股份有限公司
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Patent Information

Application Number
CN202511900112.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-16
Publication Date
2026-03-03

AI Technical Summary

Technical Problem

Existing RF power combiners have a limited number of combining ports and insufficient power capacity in the low-frequency band, which makes them prone to breakdown or burnout in high-power applications.

Method used

A two-stage combining scheme is adopted, combining lumped parameter components (capacitors, inductors) and distributed parameter structures (microstrip lines). The first stage of combining increases the number of input ports, and the second stage of combining improves the power capacity. The current carrying capacity is improved by increasing the cross-sectional area and the number of conductor layers through the conductor microstrip line structure.

Benefits of technology

It significantly improves the overall performance of the RF power combiner, enabling more combining ports and higher power capacity, while avoiding device damage.

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Abstract

The invention belongs to the technical field of radio frequency, and provides a high-power combiner applied to a radio frequency power supply, which comprises a first-stage combiner comprising a plurality of radio frequency input ports and a matching network, the radio frequency input ports are connected with the matching network, and inductors and capacitors in the matching network are electrically connected through conduction band microstrip line structures; the amplitudes and the phases of output signals between the first-stage combiners are consistent; and the second-stage combiner comprises a Wilkinson combiner, the input of the Wilkinson combiner is connected with the output of the first-stage combiner, the Wilkinson combiner comprises a quarter-wavelength conduction band microstrip line structure, and the Wilkinson combiner outputs a path of signal. The lumped parameter elements (such as capacitors and inductors) are combined with the distributed parameter structures (such as strip lines and microstrip lines), the first-stage combination aims at increasing the number of input ports, and the second-stage combination aims at improving the power capacity, so that the overall performance of the radio frequency power supply is remarkably improved.
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