Overvoltage protection device and method and thin film deposition equipment

Abstract

The invention provides an overvoltage protection device and method and thin film deposition equipment. The overpressure protection device comprises a transmission part, the first end of the transmission part is connected with a process chamber, and the transmission part moves in the direction away from the process chamber along with the increase of the pressure of the process chamber and moves in the direction close to the process chamber along with the decrease of the pressure of the process chamber; the blocking piece is fixedly connected with the second end of the transmission part and moves synchronously along with the second end of the transmission part; and a plurality of normally-open switches, the first end of each normally-open switch is provided with two separated normally-open joints, the second end of each normally-open switch is connected with a controller, and the transmission part drives the separation blade to contact with the two separated normally-open joints at the first end of any normally-open switch so as to trigger corresponding overvoltage protection.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to an overvoltage protection device, an overvoltage protection method, and a thin film deposition apparatus. Background Technology

[0002] In the semiconductor manufacturing field, the pressure control of the process chambers in semiconductor thin film deposition equipment is one of the core factors determining thin film quality and production stability. Different thin film deposition processes and stages have significantly different requirements for chamber pressure. For example, some deposition processes require maintaining a medium to low vacuum environment, while high-precision surface treatment processes may require a high vacuum environment. Accurate monitoring and control of pressure directly affects the uniformity, adhesion, and process repeatability of the thin film, and is a key prerequisite for ensuring normal equipment operation and product yield.

[0003] In existing technologies, monitoring and safety interlocking of process chamber pressure in semiconductor thin-film deposition equipment mainly relies on mechanical pressure switches. The working principle of these pressure switches is as follows: the deformation of a single diaphragm under pressure causes an associated microswitch to close or open, thereby creating a circuit connection to provide pressure feedback and trigger a safety interlock. However, due to structural design limitations, traditional mechanical pressure switches can only monitor a single pressure range. Therefore, when different processes require different pressure ranges, multiple pressure switches with different ranges need to be configured on the machine, resulting in a significant loss of internal space. This not only increases the difficulty of arranging internal components but also increases the manufacturing cost of the equipment.

[0004] To overcome the aforementioned shortcomings of existing technologies, there is an urgent need in this field for an overpressure protection technology that can accurately monitor multiple pressure ranges using a single overpressure protection device. This would effectively save internal space in the machine and reduce the workload of debugging and replacing multiple switches. Furthermore, this would lower the manufacturing and maintenance costs of the equipment and further improve the operational stability of the process chamber. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in existing technologies, this invention provides an overpressure protection device, an overpressure protection method, and a thin-film deposition equipment. These devices enable precise monitoring of multiple pressure ranges using a single overpressure protection device, effectively saving internal space and reducing the workload of debugging and replacing multiple switches. Furthermore, this reduces manufacturing and maintenance costs while further improving the operational stability of the process chamber.

[0007] Specifically, the overvoltage protection device provided according to a first aspect of the present invention includes: a transmission part, the first end of which is connected to a process chamber, wherein the transmission part moves away from the process chamber as the pressure in the process chamber increases, and moves closer to the process chamber as the pressure in the process chamber decreases; a baffle plate, fixedly connected to the second end of the transmission part, and displaces synchronously with the second end of the transmission part; and a plurality of normally open switches, each normally open switch having two separate normally open connectors at its first end and a controller at its second end, wherein the transmission part drives the baffle plate to contact the two separate normally open connectors at the first end of any normally open switch to trigger corresponding overvoltage protection.

[0008] Furthermore, in some embodiments of the present invention, each normally open switch and the baffle are located on the same plane, and each normally open switch and the baffle are arranged parallel to each other. The connecting line of the two normally open terminals of the Nth normally open switch has an Nth perpendicular distance to the first end of the transmission part; the connecting line of the two normally open terminals of the N+1th normally open switch has an N+1th perpendicular distance to the first end of the transmission part; the connecting line of the two normally open terminals of the N-1th normally open switch has an N-1th perpendicular distance to the first end of the transmission part; the N+1th distance is greater than the Nth distance; and the Nth distance is greater than the N-1th distance.

[0009] Furthermore, in some embodiments of the present invention, the baffle is made of an elastic material. An increase in the process chamber pressure causes the transmission unit to provide a thrust to the center of the baffle, and the Nth normally open connector provides a first resistance to both ends of the baffle. The thrust is opposite in direction to the first resistance, and is used to bend the baffle towards the thrust side and spring it between the Nth normally open switch and the (N+1)th normally open switch. Alternatively, a decrease in the process chamber pressure causes the transmission unit to provide a pull force to the center of the baffle, and the Nth normally open connector provides a second resistance to both ends of the baffle. The pull force is opposite in direction to the second resistance, and is used to bend the baffle towards the pull side and spring it between the Nth normally open switch and the (N-1)th normally open switch.

[0010] Furthermore, in some embodiments of the present invention, the overvoltage protection device is disposed above the process chamber, wherein the lower surface of the normally open contact of each normally open switch has an upward slope, and / or the upper surface of each normally open contact has a downward slope, wherein the upper surface of the normally open contact of each normally open switch is provided with an insulating coating for erroneously triggering the overvoltage protection when the pressure in the process chamber decreases.

[0011] Furthermore, in some embodiments of the present invention, the overvoltage protection device is located above the process chamber, and the overvoltage protection device further includes: a normally closed switch located below the plurality of normally open switches, wherein the first end of the normally closed switch is provided with two normally closed connectors, and its second end is connected to the controller.

[0012] Furthermore, in some embodiments of the present invention, the transmission part is fixedly connected to a diaphragm, the lower surface of the diaphragm covering the process chamber, wherein the diaphragm bulges as the pressure in the process chamber increases, thereby driving the transmission part to move away from the process chamber, or the diaphragm recovers its deformation as the pressure in the process chamber decreases, thereby driving the transmission part to move closer to the process chamber.

[0013] Furthermore, in some embodiments of the present invention, the transmission part includes: a central top post, the first end of which is fixedly connected to the upper surface of the diaphragm, and the second end of which is connected to the baffle, wherein the outer periphery of the central top post is provided with a groove; and a disc spring, which is embedded in the groove and provides a preload force to the central top post in the opposite direction to the increase of the pressure in the process chamber.

[0014] Furthermore, in some embodiments of the present invention, the process chamber is used to execute multiple process flows, each process flow corresponding to a pressure threshold, and each normally open switch corresponding to control a pressure threshold. The controller is configured to: obtain the Nth pressure threshold corresponding to the process flow according to the process flow in the process chamber; determine the Nth normally open switch corresponding to the Nth pressure threshold; trigger overpressure protection in response to the baffle moving away from the process chamber and connecting to the two Nth normally open connectors of the Nth normally open switch; and turn on the vacuum pump connected to the outlet pipeline and release the overpressure protection to reduce the pressure in the process chamber to an initial value.

[0015] Furthermore, in some embodiments of the present invention, after determining the corresponding Nth normally open switch according to the Nth pressure threshold, and before activating overvoltage protection in response to the Nth normally open switch being connected, the controller further includes the following steps: triggering overvoltage protection in response to the baffle moving away from the process chamber and connecting with the two first normally open connectors of the first normally open switch; releasing the overvoltage protection and continuing to increase the pressure in the process chamber so that the baffle springs into the space between the first normally open switch and the second normally open switch; triggering overvoltage protection in response to the baffle continuing to move away from the process chamber and connecting with the two second normally open connectors of the second normally open switch; and releasing the overvoltage protection and continuing to increase the pressure in the process chamber until the baffle springs into the space between the (N-1)th normally open switch and the Nth normally open switch.

[0016] Furthermore, in some embodiments of the present invention, before activating overvoltage protection in response to the baffle moving away from the process chamber and connecting with the two first normally open connectors of the first normally open switch, the controller is further configured to: trigger overvoltage protection in response to the baffle moving away from the process chamber and disconnecting from the two normally closed connectors of the normally closed switch; and deactivate the overvoltage protection and continue to increase the pressure in the process chamber.

[0017] Furthermore, the thin film deposition apparatus provided according to a second aspect of the present invention includes: a process chamber for performing a thin film deposition process; an inlet pipe connected to an inlet of the process chamber for supplying process gas to the process chamber; an outlet pipe connected to an outlet of the process chamber for discharging the process gas from the process chamber; and an overpressure protection device as described in any one of the first aspects of the present invention, disposed in the inlet pipe and / or the outlet pipe, for providing overpressure protection to the inlet pipe and / or the outlet pipe.

[0018] Furthermore, the overpressure protection method provided by the third aspect of the present invention includes the following steps: obtaining an Nth pressure threshold corresponding to the process flow in the process chamber; determining an Nth normally open switch in the pressure protection device as described in any one of the first aspects of the present invention based on the Nth pressure threshold; triggering overpressure protection in response to the baffle moving away from the process chamber and communicating with the two Nth normally open connectors of the Nth normally open switch; and turning on the vacuum pump connected to the outlet pipeline and releasing the overpressure protection to reduce the pressure in the process chamber to an initial value.

[0019] Furthermore, according to the fourth aspect of the present invention, a computer-readable storage medium has computer instructions stored thereon. When the computer instructions are executed by a processor, the overvoltage protection method as described in the third aspect of the present invention is implemented. Attached Figure Description

[0020] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related properties or features may have the same or similar reference numerals.

[0021] Figure 1 A schematic diagram of an overvoltage protection device provided according to some embodiments of the present invention is shown.

[0022] Figure 2A A schematic diagram of an overpressure protection device for increased chamber pressure provided according to some embodiments of the present invention is shown.

[0023] Figure 2B A schematic diagram of an overvoltage protection device according to some embodiments of the present invention is shown, in which a baffle springs into an adjacent normally open switch.

[0024] Figure 3 A schematic flowchart of an overvoltage protection method according to some embodiments of the present invention is shown.

[0025] Figure label:

[0026] 10 Controllers

[0027] 21. Central top column

[0028] 22 Disc Springs

[0029] 30 baffles

[0030] 40 Normally open connector

[0031] 41 Normally closed joint

[0032] 50 membranes

[0033] 60 Connector

[0034] 70 Insulating Coating Detailed Implementation

[0035] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0036] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0037] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0038] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0039] As mentioned above, in the semiconductor manufacturing field, the pressure control of the process chamber in semiconductor thin film deposition equipment is one of the core factors determining thin film quality and production stability. Different thin film deposition processes and stages have significantly different requirements for chamber pressure. For example, some deposition processes require maintaining a medium to low vacuum environment, while high-precision surface treatment processes may require a high vacuum environment. Accurate monitoring and control of pressure directly affects the uniformity, adhesion, and process repeatability of the thin film, and is a key prerequisite for ensuring normal equipment operation and product yield.

[0040] In existing technologies, monitoring and safety interlocking of process chamber pressure in semiconductor thin-film deposition equipment mainly relies on mechanical pressure switches. The working principle of these pressure switches is as follows: the deformation of a single diaphragm under pressure causes an associated microswitch to close or open, thereby creating a circuit connection to provide pressure feedback and trigger a safety interlock. However, due to structural design limitations, traditional mechanical pressure switches can only monitor a single pressure range. Therefore, when different processes require different pressure ranges, multiple pressure switches with different ranges need to be configured on the machine, resulting in a significant loss of internal space. This not only increases the difficulty of arranging internal components but also increases the manufacturing cost of the equipment.

[0041] To overcome the aforementioned deficiencies in existing technologies, this invention provides an overpressure protection device, an overpressure protection method, and a thin-film deposition apparatus. These devices enable precise monitoring of multiple pressure ranges using a single pressure switch, effectively saving internal space and reducing the workload of debugging and replacing multiple switches. Furthermore, this reduces manufacturing and maintenance costs while further improving the operational stability of the process chamber.

[0042] In some non-limiting embodiments, the overvoltage protection device provided in the first aspect of the present invention can be configured in the thin film deposition apparatus provided in the second aspect of the present invention. The overvoltage protection method provided in the third aspect of the present invention can be implemented based on the overvoltage protection device provided in the first aspect of the present invention. Specifically, the overvoltage protection device is equipped with a memory and a controller. The memory includes, but is not limited to, the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the overvoltage protection method provided in the third aspect of the present invention.

[0043] Specifically, the thin film deposition equipment includes a process chamber, an inlet pipe, an outlet pipe, and an overpressure protection device. The process chamber is used to perform the thin film deposition process. The inlet pipe connects to the inlet of the process chamber and supplies process gas to the process chamber. The outlet pipe connects to the outlet of the process chamber and discharges the process gas from the process chamber.

[0044] The overpressure protection device is installed in the inlet and / or outlet pipelines to provide overpressure protection for the inlet and / or outlet pipelines, thereby shutting down the inlet and / or outlet pipelines when the pressure in the process chamber exceeds a preset pressure threshold.

[0045] Please refer to the details. Figure 1 , Figure 1 A schematic diagram of an overvoltage protection device provided according to some embodiments of the present invention is shown.

[0046] like Figure 1 As shown, the overvoltage protection device includes a transmission unit, a baffle plate 30, and multiple normally open switches. The first end of the transmission unit is connected to the process chamber. The transmission unit moves away from the process chamber as the pressure increases and moves closer to the process chamber as the pressure decreases. The baffle plate 30 is fixedly connected to the second end of the transmission unit and moves synchronously with the second end of the transmission unit. Each of the multiple normally open switches has two separate normally open connectors 40 at its first end, and its second end is connected to the controller 10. The transmission unit drives the baffle plate 30 to contact the two separate normally open connectors 40 at the first end of any normally open switch to trigger the corresponding overvoltage protection.

[0047] Here, the process chamber is used to execute multiple process flows, each corresponding to a pressure threshold, and each normally open switch controls a pressure threshold. This thin-film equipment can integrate multiple sets of normally open switches adapted to different pressure thresholds to achieve precise monitoring of multiple pressure ranges by a single overpressure protection device. This effectively saves internal space and reduces the workload of debugging and replacing multiple switches. Furthermore, it lowers the manufacturing and maintenance costs of the equipment and further improves the operational stability of the process chamber.

[0048] Please continue to refer to this. Figure 1 A diaphragm 50 is fixedly connected to the transmission unit, and the lower surface of the diaphragm 50 covers the process chamber. The diaphragm 50 bulges as the pressure in the process chamber increases, driving the transmission unit away from the process chamber; conversely, the diaphragm 50 returns to its original shape as the pressure in the process chamber decreases, driving the transmission unit closer to the process chamber. Here, the lower surface of the diaphragm 50 is connected to the chamber piping, allowing real-time sensing of chamber pressure changes and providing accurate pressure signals for multi-pressure-stage overpressure protection.

[0049] In some embodiments, a connector 60 may be provided between the diaphragm 50 and the process chamber to transmit the pressure change in the process chamber to the diaphragm 50 via the connector 60, so that the diaphragm 50 bulges as the pressure in the process chamber increases, or recovers its deformation as the pressure in the process chamber decreases.

[0050] Furthermore, the transmission unit includes a central top column 21 and a disc spring 22. The first end of the central top column 21 is fixedly connected to the upper surface of the diaphragm 50, while its second end is connected to the baffle 30. Here, when the pressure in the process chamber changes, the overpressure protection device can drive the central top column 21 via the diaphragm 50, thereby driving the baffle 30 to move up and down.

[0051] Furthermore, a groove is provided on the outer periphery of the central top post 21. The disc spring 22 is embedded in the groove and provides a preload force to the central top post 21 in the opposite direction to the increase in process chamber pressure. The baffle 30 separates from the normally open switch when the chamber pressure is less than the preload force of the disc spring 22. When the process chamber pressure is greater than the preload force of the disc spring 22, the baffle 30 moves away from the process chamber.

[0052] In some embodiments, each normally open switch and the baffle 30 are located on the same plane and are arranged parallel to each other. The connecting line of the two normally open terminals 40 of the Nth normally open switch has an Nth vertical distance from the first end of the transmission part. The connecting line of the two normally open terminals 40 of the N+1th normally open switch has an N+1th vertical distance from the first end of the transmission part. The connecting line of the two normally open terminals 40 of the N-1th normally open switch has an N-1th vertical distance from the first end of the transmission part. The N+1th distance is greater than the Nth distance, and the Nth distance is greater than the N-1th distance.

[0053] Please refer to Figures 2A-2B , Figure 2A A schematic diagram of an overpressure protection device for increased chamber pressure provided according to some embodiments of the present invention is shown. Figure 2B A schematic diagram of an overvoltage protection device according to some embodiments of the present invention is shown, in which a baffle springs into an adjacent normally open switch.

[0054] like Figures 2A-2B As shown, the baffle 30 is made of elastic material. When the pressure in the process chamber increases, it can drive the transmission unit to provide a thrust to the middle of the baffle 30. The Nth normally open connector 40 provides a first resistance to both ends of the baffle 30. The thrust and the first resistance are in opposite directions, which is used to bend the baffle 30 towards the thrust side and spring it between the Nth normally open switch and the N+1th normally open switch.

[0055] Correspondingly, the pressure in the process chamber decreases, which can drive the transmission unit to provide a pulling force to the middle of the baffle 30. The Nth normally open connector 40 provides a second resistance to both ends of the baffle 30. The pulling force and the second resistance are in opposite directions, which is used to bend the baffle 30 towards the pulling force side and spring it between the Nth normally open switch and the N-1th normally open switch.

[0056] Furthermore, the overvoltage protection device can be located above the process chamber. In some embodiments, the lower surface of the normally open connector 40 of each normally open switch has an upward slope, and / or the upper surface of each normally open connector 40 has a downward slope, to improve the stability of the baffle 30 after it springs into a new position.

[0057] In some embodiments, the upper surface of the normally open connector 40 of each normally open switch is provided with an insulating coating 70 for erroneously triggering overvoltage protection when the pressure in the process chamber decreases. Here, the insulating coating 70 can be made of glass fiber.

[0058] Please continue to refer to this. Figure 1 The overvoltage protection device can be located above the process chamber and includes a normally closed switch. This normally closed switch is located below multiple normally open switches. The first end of the normally closed switch has two normally closed contacts 41, while its second end is connected to the controller 10. Here, the equipment operates normally when the two normally closed contacts 41 of the normally closed switch are in contact with the baffle 30, and the overvoltage protection is triggered when the two normally closed contacts 41 of the normally closed switch are disconnected from the baffle 30.

[0059] Furthermore, since the baffle 30 can contact the normally closed switch when the cavity pressure is less than the preload of the disc spring 22, and separate from the normally closed switch when the cavity pressure is greater than the preload of the disc spring 22, the overpressure protection device can be configured by setting the value of the preload. This allows the pressure threshold that triggers the overpressure protection device to be preset as a safe pressure threshold, thereby ensuring that the normally closed switch closes at the preset safe pressure threshold and thus preventing overpressure protection from being triggered.

[0060] The working principle of the above-mentioned overvoltage protection device will be described below with reference to some embodiments of overvoltage protection methods. Those skilled in the art will understand that these embodiments of overvoltage protection methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating modes of the overvoltage protection device. Similarly, the overvoltage protection device is also merely a non-limiting implementation provided by the present invention and does not constitute a limitation on the executing entity or execution order of the steps in these overvoltage protection methods.

[0061] Please refer to Figure 3 , Figure 3 A schematic flowchart of an overvoltage protection method according to some embodiments of the present invention is shown.

[0062] like Figure 3 As shown, the controller 10 can first execute step S1: according to the process flow in the process chamber, obtain the Nth pressure threshold corresponding to the process flow.

[0063] Then, the controller 10 can execute step S2: determine the corresponding Nth normally open switch based on the Nth pressure threshold. Here, the Nth pressure threshold of the Nth normally open switch can be mapped in a pre-calibrated manner.

[0064] Then, the controller 10 can perform step S3: in response to the baffle 30 moving away from the process chamber and connecting with the two Nth normally open terminals 40 of the Nth normally open switch, triggering overvoltage protection.

[0065] Finally, the controller 10 can execute step S4: turn on the vacuum pump connected to the outlet line and release the overpressure protection to reduce the pressure in the process chamber to the initial value. Here, the initial value can be 550 ± 15 torr.

[0066] Further, after step S2 and before step S3, the controller 10 may also execute step S2.1: in response to the baffle 30 moving away from the process chamber and connecting with the two first normally open connectors 40 of the first normally open switch, triggering overpressure protection. Here, the first pressure threshold corresponding to the connection of the first normally open connectors 40 can be 600 ± 20 torr.

[0067] Afterwards, the controller 10 can also perform step S2.2: release the overvoltage protection and continue to increase the pressure in the process chamber so that the baffle 30 pops into the space between the first normally open switch and the second normally open switch.

[0068] Subsequently, the controller 10 can also execute step S2.3: in response to the baffle 30 continuing to move away from the process chamber and connecting with the two second normally open connectors 40 of the second normally open switch, triggering overpressure protection. Here, the second pressure threshold corresponding to the connection of the second normally open connector 40 can be 700±20 torr.

[0069] After that, the controller 10 can also perform step S2.4: release the overvoltage protection and continue to increase the pressure in the process chamber until the baffle 30 pops into the space between the (N-1)th normally open switch and the Nth normally open switch.

[0070] Therefore, the overpressure protection device can be pre-calibrated to set a range from the first pressure threshold to the Nth pressure threshold, thereby covering different pressure ranges and avoiding process abnormalities or equipment safety risks caused by pressure monitoring blind spots.

[0071] Furthermore, in some embodiments, prior to step S2.1, the controller 10 is also configured to trigger overpressure protection in response to the baffle 30 moving away from the process chamber and disconnecting from the two normally closed contacts 41 of the normally closed switch. Here, the pressure threshold corresponding to the disconnection of the normally closed switch can be preset according to the process flow and set to an initial value greater than or equal to the pressure of the overpressure protection device.

[0072] Afterward, the controller 10 can release the overpressure protection and continue to increase the pressure in the process chamber.

[0073] In addition, the overpressure protection device also includes an alarm. The alarm can be activated simultaneously with the overpressure protection device triggering overpressure protection to provide an alarm reminder, thereby further reducing the risk of overpressure in the process chamber.

[0074] In summary, the overvoltage protection device, overvoltage protection method, and thin film deposition equipment provided by this invention can accurately monitor multiple pressure ranges using a single overvoltage protection device, thereby effectively saving internal space and reducing the workload of debugging and replacing multiple switches. Furthermore, this reduces manufacturing and maintenance costs while further improving the operational stability of the process chamber.

[0075] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0076] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An overvoltage protection device, characterized in that, include: A transmission unit, the first end of which is connected to a process chamber, wherein the transmission unit moves away from the process chamber as the pressure in the process chamber increases, and moves closer to the process chamber as the pressure in the process chamber decreases; A baffle plate is fixedly connected to the second end of the transmission unit and moves synchronously with the second end of the transmission unit; and Multiple normally open switches are provided, each of which has two separate normally open connectors at its first end and a controller at its second end. The transmission unit drives the baffle to contact the two separate normally open connectors at the first end of any normally open switch to trigger the corresponding overvoltage protection.

2. The overvoltage protection device as described in claim 1, characterized in that, Each normally open switch and the baffle are located on the same plane, and each normally open switch and the baffle are arranged parallel to each other. The connecting line of the two normally open terminals of the Nth normally open switch has an Nth perpendicular distance to the first end of the transmission part. The connecting line of the two normally open terminals of the N+1th normally open switch has an N+1 perpendicular distance to the first end of the transmission part. The connecting line of the two normally open terminals of the N-1th normally open switch has an N-1 perpendicular distance to the first end of the transmission part. The N+1 distance is greater than the Nth distance, and the Nth distance is greater than the N-1 distance.

3. The overvoltage protection device as described in claim 2, characterized in that, The baffle is made of an elastic material, wherein, The increased pressure in the process chamber causes the transmission unit to provide a thrust to the middle of the baffle. The Nth normally open connector provides a first resistance to both ends of the baffle. The thrust is in the opposite direction to the first resistance, which is used to bend the baffle towards the thrust side and spring it between the Nth normally open switch and the (N+1)th normally open switch, or The decrease in pressure in the process chamber causes the transmission unit to provide a pulling force to the middle of the baffle. The Nth normally open connector provides a second resistance to both ends of the baffle. The pulling force is opposite to the direction of the second resistance, which is used to bend the baffle towards the pulling force side and spring it between the Nth normally open switch and the (N-1)th normally open switch.

4. The overvoltage protection device as described in claim 1, characterized in that, The overvoltage protection device is located above the process chamber, wherein, The lower surface of the normally open contact of each of the normally open switches has an upward slope, and / or Each of the normally open connectors has a downward slope on its upper surface, and each of the normally open switches has an insulating coating on its upper surface for erroneously triggering overvoltage protection when the pressure in the process chamber decreases.

5. The overvoltage protection device as described in claim 1, characterized in that, The overvoltage protection device is located above the process chamber, and the overvoltage protection device further includes: A normally closed switch is located below the plurality of normally open switches, wherein the first end of the normally closed switch has two normally closed connectors, and its second end is connected to the controller.

6. The overvoltage protection device as described in claim 1, characterized in that, The transmission unit is fixedly connected to a diaphragm, the lower surface of which covers the process chamber. The diaphragm bulges as the pressure in the process chamber increases, thereby driving the transmission unit to move away from the process chamber. The diaphragm recovers its deformation as the pressure in the process chamber decreases, thereby driving the transmission unit to move closer to the process chamber.

7. The overvoltage protection device as described in claim 6, characterized in that, The transmission unit includes: A central top post, with its first end fixedly connected to the upper surface of the diaphragm and its second end connected to the baffle, wherein the outer periphery of the central top post is provided with a groove; and A disc spring is embedded in the groove and provides a preload force to the central top post that is opposite to the direction of pressure increase in the process chamber.

8. The overvoltage protection device according to claim 2, characterized in that, The process chamber is used to execute multiple process flows, each process flow corresponds to a pressure threshold, and each normally open switch controls one of the pressure thresholds. The controller is configured to: Based on the process flow in the process chamber, obtain the Nth pressure threshold corresponding to the process flow; Based on the Nth pressure threshold, determine the corresponding Nth normally open switch; In response to the baffle moving away from the process chamber and connecting with the two normally open terminals of the Nth normally open switch, overvoltage protection is triggered. as well as Turn on the vacuum pump connected to the outlet line and release the overpressure protection to reduce the pressure in the process chamber to the initial value.

9. The overvoltage protection device as described in claim 8, characterized in that, After determining the corresponding Nth normally open switch based on the Nth pressure threshold, and before activating overvoltage protection in response to the connection of the Nth normally open switch, the controller further includes the following steps: In response to the baffle moving away from the process chamber and connecting with the two first normally open terminals of the first normally open switch, overvoltage protection is triggered. Release the overvoltage protection and continue to increase the pressure in the process chamber so that the baffle springs between the first normally open switch and the second normally open switch; In response to the baffle continuing to move away from the process chamber and connecting with the two second normally open terminals of the second normally open switch, overvoltage protection is triggered; and Release the overvoltage protection and continue to increase the pressure in the process chamber until the baffle springs between the (N-1)th normally open switch and the Nth normally open switch.

10. The overvoltage protection device as described in claim 9, characterized in that, In response to the baffle moving away from the process chamber and connecting to the two first normally open terminals of the first normally open switch, before activating overvoltage protection, the controller is further configured to: In response to the baffle moving away from the process chamber and disconnecting from the two normally closed terminals of the normally closed switch, overvoltage protection is triggered; and Release the overpressure protection and continue to increase the pressure in the process chamber.

11. A thin film deposition apparatus, characterized in that, include: Process chambers are used to perform thin film deposition processes; An air inlet pipe is connected to the air inlet of the process chamber and is used to supply process gas to the process chamber. An exhaust pipe is connected to the exhaust port of the process chamber and is used to discharge the process gas from the process chamber. as well as The overpressure protection device as described in any one of claims 1 to 10 is provided in the air inlet pipe and / or the air outlet pipe for overpressure protection of the air inlet pipe and / or the air outlet pipe.

12. An overvoltage protection method, characterized in that, Includes the following steps: Based on the process flow in the process chamber, obtain the Nth pressure threshold corresponding to the process flow; Based on the Nth pressure threshold, determine the corresponding Nth normally open switch in the pressure protection device as described in any one of claims 1 to 10; In response to the baffle moving away from the process chamber and connecting with the two normally open terminals of the Nth normally open switch, overvoltage protection is triggered; as well as Turn on the vacuum pump connected to the outlet line and release the overpressure protection to reduce the pressure in the process chamber to the initial value.

13. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the overvoltage protection method as described in claim 12 is implemented.

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