Method and system for inhibiting substrate warping

Abstract

The invention provides a method and a system for inhibiting warping of a substrate. The method comprises the following steps: arranging an airflow generating device at a preset position of a substrate transmission path; controllable airflow acting on the surface of the substrate is generated through the airflow generating device so as to restrain the substrate from warping; detecting the thickness of the substrate; adjusting the wind speed of the controllable airflow based on the thickness of the substrate; detecting the warping height of the substrate after the action of the airflow; and when the warping height exceeds a threshold value, the wind speed of the controllable airflow is further adjusted for compensation pressing. The warping of the substrate is pressed by adopting the air flow with controllable air speed, so that the physical contact with the surface of the substrate is completely avoided, the risk of scratching the substrate is eliminated, the substrates with different thicknesses and warping degrees can be effectively pressed, and the passing rate is obviously improved.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to a method and system for suppressing substrate warping. Background Technology

[0002] During the manufacturing process of printed circuit boards (PCBs), the rigidity of the substrate decreases significantly due to the reduction in total board thickness and changes in the laminate structure. This makes the substrate highly susceptible to deformation and warping during production, especially under heat and mechanical stress. When the warping height exceeds a certain range, the substrate may jam, collide, or even be damaged when passing through the drive rollers at the connection between the horizontal production line and the cleanroom, severely impacting production efficiency and product yield.

[0003] Existing technologies typically employ a set of upper and lower PP material pressing rollers installed in front of the drive rollers to address slight substrate warping. However, this contact pressing method has significant drawbacks: First, for substrates with large warping heights (e.g., exceeding 2cm), the pressing effect is limited and cannot effectively suppress warping; second, the pressing rollers cannot be adapted to all shapes (especially irregular shapes) of drive rollers for installation; and finally, contact pressing carries the risk of scratching the substrate surface. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art, the purpose of this application is to provide a method and system for suppressing substrate warping, which effectively suppresses substrate warping in a non-contact manner.

[0005] To achieve the above objectives, this application provides a method for suppressing substrate warping, comprising the following steps: An airflow generating device is installed at a predetermined position in the substrate transport path; The airflow generating device generates a controllable airflow that acts on the surface of the substrate to suppress substrate warping. The thickness of the substrate is detected; The wind speed of the controllable airflow is adjusted based on the thickness of the substrate. The warpage height of the substrate after the airflow is applied is detected; When the warping height exceeds the threshold, the wind speed of the controllable airflow is further adjusted for compensation and suppression.

[0006] Furthermore, the step of setting an airflow generating device at a predetermined position in the substrate transport path further includes: setting elongated air plates on the upper and lower sides of the substrate transport path, the air plates having air outlets; connecting the air plates to a cleanroom via a blower, so that the blower can draw air from the cleanroom, filter it, and then deliver it to the air plates to form the controllable airflow.

[0007] Furthermore, the step of setting elongated wind plates on the upper and lower sides of the substrate transmission path further includes: setting the wind plates on the upper and lower sides to be asymmetrically arranged, so that the airflow suppression area of ​​the upper wind plate and the airflow lifting area of ​​the lower wind plate are staggered in the substrate transmission direction, so as to act on the substrate in stages.

[0008] Furthermore, the upper air plate is provided with a long strip of continuous air outlets for applying uniform and continuous downward pressure to the substrate; the lower air plate is provided with intermittent air outlets offset from the position of the transmission rollers for providing multiple concentrated upward support forces below the substrate.

[0009] Furthermore, it also includes a step of monitoring the air source pressure of the airflow generating device and triggering an alarm when the air source pressure is lower than a preset value.

[0010] Furthermore, the step of detecting the warpage height of the substrate after the airflow action includes multiple detections: A first height detection is performed before the initial action of the airflow, and an initial wind speed adjustment is made based on the results of the first height detection; A second height detection is performed in the main area of ​​airflow action, and wind speed compensation adjustments are made based on the results of the second height detection. A third height detection is performed before the airflow area of ​​the substrate. If the warpage height detected in the third height detection exceeds the threshold, an alarm is triggered and the board feeding is stopped.

[0011] Furthermore, the wind speed of the controllable airflow is adjusted based on a pre-stored wind speed lookup table that associates the substrate thickness with the warp height.

[0012] On the other hand, this application also provides a system for suppressing substrate warping, for implementing the method for suppressing substrate warping as described above, comprising: An airflow generating device is disposed at a predetermined position in the substrate transport path and is used to generate a controllable airflow acting on the surface of the substrate. A thickness detection device for detecting the thickness of the substrate; A height detection device for detecting the warpage height of the substrate; The control unit, connected to the airflow generating device, the thickness detection device, and the height detection device respectively, is configured as follows: Based on the thickness signal detected by the thickness detection device, the airflow generating device is controlled to output a reference wind speed. Based on the height signal detected by the height detection device, when the warping height exceeds a threshold, the airflow generating device is controlled to adjust the output wind speed.

[0013] Furthermore, the airflow generating device includes: Blower; A filter device is connected to the air outlet of the blower; An elongated strip of air is arranged vertically opposite each other and connected to the filter device. The air is provided with an air outlet for forming a controllable airflow.

[0014] Furthermore, the air plates arranged opposite each other have different lengths in the transmission direction of the substrate, with the lower air plate being shorter than the upper air plate, and one end of the upper air plate and the lower air plate being staggered, so that the airflow of the upper air plate can act on the substrate before the airflow of the lower air plate.

[0015] The method for suppressing substrate warping provided in this application uses a controllable airflow to suppress substrate warping, completely avoiding physical contact with the substrate surface, eliminating the risk of scratching the substrate, and effectively pressing substrates of different thicknesses and degrees of warping, significantly improving the yield.

[0016] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing this application. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings: Figure 1 This is a flowchart of a method for suppressing substrate warping according to an embodiment of this application; Figure 2 This is a top view of a system structure for suppressing substrate warping according to an embodiment of this application; Figure 3 This is a side view of a system structure for suppressing substrate warping according to an embodiment of this application; Figure 4 This is a schematic diagram illustrating the application of wind speed to the upper and lower wind deflectors according to an embodiment of this application; Figure 5 This is a schematic diagram of the windshield structure according to an embodiment of this application; Figure 6 This is a schematic diagram of the downwind plate structure according to an embodiment of this application; Figure 7 This is a system block diagram for suppressing substrate warping according to an embodiment of this application. Detailed Implementation

[0018] The preferred embodiments of this application are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit this application.

[0019] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0020] The term "comprising" and its variations as used in this application are open-ended, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; and the term "some embodiments" means "at least some embodiments".

[0021] It should be noted that the terms "first" and "second" may be used in this application only to distinguish different devices, components or parts, and are not used to define the order of functions performed by these devices, components or parts or their interdependence.

[0022] It should be noted that the terms "one" and "more" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be understood as "one or more". "More" should be understood as two or more.

[0023] The positional relationships indicated by the terms "before" and "after" used in this application are all based on... Figure 3 The direction indicated by the middle arrow (i.e. the substrate running direction) is for reference; the direction towards the arrow is forward, and the opposite direction is backward.

[0024] HEPA (High-Efficiency Particulate Air Filter): High-efficiency particulate air filter. In this application, air from a cleanroom is drawn out by a blower, filtered through a HEPA filter, and then applied to the substrate to maintain product cleanliness. Definitions of other terms will be given in the following description.

[0025] Example 1 In embodiments of this application, a method for suppressing substrate warping is provided. The method includes the following steps: setting an airflow generating device at a predetermined position in the substrate transport path; generating a controllable airflow acting on the surface of the substrate through the airflow generating device to suppress substrate warping; detecting the thickness of the substrate; adjusting the wind speed of the controllable airflow based on the thickness of the substrate; detecting the warping height of the substrate after the airflow acts; and further adjusting the wind speed of the controllable airflow to compensate and suppress warping when the warping height exceeds a threshold.

[0026] Figure 1 This is a flowchart of a method for suppressing substrate warping according to an embodiment of this application. Figure 2 This is a top view of a system structure for suppressing substrate warping according to an embodiment of this application. Figure 3 This is a side view of a system structure for suppressing substrate warping according to an embodiment of this application. The following will be combined with... Figures 1 to 3 The method for suppressing substrate warping in this application will be described in further detail.

[0027] First, in step S1, an airflow generating device is installed at a predetermined position in the transport path of the substrate 110.

[0028] In the embodiments of this application, the airflow generating device is a component of the system for suppressing substrate warping (the hardware system used to perform the method steps in this embodiment). It mainly includes an elongated upper air plate 104 and a lower air plate 114 disposed on the upper and lower sides of the transmission path of the substrate 110. Both the upper air plate 104 and the lower air plate 114 have air outlets facing the transmission path of the substrate 110. The upper air plate 104 and the lower air plate 114 are respectively connected to the blower 101 and the HEPA filter device 102 via air ducts 117 and 119, thus forming a complete air path system.

[0029] The transmission path of the substrate 110 is precisely guided and driven by a series of transmission rollers 109. For example... Figure 3 As shown, between the ceiling 115 and the floor 116, the substrate 110 rests flat on parallel drive rollers 109. Friction is generated by the unidirectional rotation of the drive rollers 109, allowing it to move continuously forward on the horizontal production line. This transport path passes through the connection between the horizontal production line and the cleanroom, a region prone to warping. The airflow generating device of this application is installed here: the upper and lower air plates of the airflow generating device are located on the upper and lower sides of the array of drive rollers 109, respectively. An air source hole 105 is opened in the upper part of the cleanroom partition wall 106, allowing the blower 101 to draw air from the cleanroom and transmit it to the upper air plate 104 and the lower air plate 114, thereby acting on the substrate 110.

[0030] In a preferred embodiment, the upper air plate 104 and the lower air plate 114 are arranged asymmetrically on the upper and lower sides of the transmission path of the substrate 110, with their air outlets facing each other and their air outlet directions perpendicular to the substrate 110. This asymmetrical arrangement causes the airflow suppression area of ​​the upper air plate 104 and the airflow lifting area of ​​the lower air plate 114 to be in the same direction as the transmission path of the substrate 110 ( Figure 3 The components are staggered in the X direction to act on the substrate 110 in stages.

[0031] Specifically, the front ends of the upper air plate 104 and the lower air plate 114 are flush and extend above the pressing rollers 107 (including the upper pressing roller 1071 and the lower pressing roller 1072). The length of the lower air plate 114 is shorter than that of the upper air plate 104, so that the rear ends of the upper air plate 104 and the lower air plate 114 are staggered. Preferably, the lower air plate 114 is shorter than the upper air plate 104 by the length of one transmission roller 109, such as... Figure 3 As shown.

[0032] In a preferred embodiment, the air outlet of the upper air plate 104 is configured as an elongated continuous microporous air outlet 118, used to apply uniform and continuous downward pressure to the substrate 110, such as... Figure 4 As shown; the air outlet of the lower air plate 114 is configured as an intermittent micro-perforated air outlet 120, offset from the position of the transmission roller 109, to provide multiple concentrated upward support forces below the substrate 110, such as Figure 5 As shown. This air outlet design perfectly avoids the solid position of the transmission rollers 109, allowing the intermittent micro-perforated air outlets 120 of the lower air plate 114 to align with the gaps between the transmission rollers 109. This allows the upward airflow to act unimpeded on the lower surface of the substrate 110, such as... Figure 6 As shown, in conjunction with the downward airflow of the upper air plate 104, a non-contact, dynamic warping and pressing effect is achieved on the moving substrate 110, ensuring its smooth passage.

[0033] In step S2, a controllable airflow is generated by an airflow generating device to act on the surface of substrate 110 in order to suppress warping of substrate 110.

[0034] This step includes: drawing air from the cleanroom using a blower 101, filtering it through a HEPA filter 102, and then delivering it to the upper air plate 104 and the lower air plate 114 to form a controllable airflow. Specifically, the blower 101 draws air from the cleanroom, filters it through the HEPA filter 102 to form a clean air source, and delivers it to the upper air plate 104 and the lower air plate 114. The upper air plate 104 sprays a uniform airflow downwards through its continuous micro-perforated air outlet 118 at its bottom, applying a downward pressure to the substrate 110; the lower air plate 114 sprays airflow upwards through its intermittent micro-perforated air outlet 120 at its top, providing an upward support force to the substrate 110. The upper air plate 104 and the lower air plate 114 are asymmetrically arranged in the transmission direction of the substrate 110, so that the airflow acts on the substrate 110 in stages, avoiding simultaneous airflow pressure on both the top and bottom sides, and achieving a stable "pressure first, then lift" effect.

[0035] In step S3, the thickness of the substrate 110 is detected.

[0036] This step includes detecting the thickness of the substrate 110 using a thickness sensor 108 positioned at a predetermined distance from the upper wind plate 104. As the substrate 110 moves past the thickness sensor 108 with the transmission roller 109, the thickness sensor 108 can measure the thickness value of the substrate 110 in real time and transmit the thickness signal to the control module.

[0037] In a preferred embodiment, the thickness sensor 108 is a through-beam laser thickness gauge or a dual-sided laser displacement sensor. Its installation position corresponds to the gap in the transmission roller 109 and is located approximately 10 cm behind the air deflector 104, allowing the detection signal to directly act on the substrate 110 through the gap, thereby achieving non-contact real-time measurement of its thickness during the continuous movement of the substrate 110.

[0038] In step S4, the wind speed of the controllable airflow is adjusted based on the thickness of the substrate 110.

[0039] In the embodiments of this application, after receiving the thickness signal, the control module (such as a PLC) queries its internally stored wind speed lookup table, matches and outputs a reference wind speed setting value according to the current thickness of the substrate 110. This setting value is sent to the frequency converter controlling the blower 101, and the frequency converter stabilizes the airflow speed at the required reference value by adjusting the motor speed of the blower 101.

[0040] In step S5, the warpage height of the substrate 110 after the airflow is applied is detected.

[0041] In the embodiments of this application, the warpage height of the substrate 110 is detected by a height detection device arranged along the transport direction of the substrate 110.

[0042] In a preferred embodiment, the height detection device includes at least one set of height sensors configured to detect the warpage height of the substrate 110 in a non-contact manner.

[0043] Continue to refer to Figure 2 or Figure 3 The substrate 110 first passes through the first height sensor 111, which detects the initial warp height of the substrate 110 before the initial action of the airflow.

[0044] The substrate 110 then enters the main airflow action area and passes through the second height sensor 112, which detects the warping height after the initial airflow suppression.

[0045] Finally, behind the pressing roller 107, that is, before the airflow action area of ​​the substrate 110, the substrate 110 first passes through the third height sensor 113. The third height sensor 113 detects the final warping height after the airflow is pressed, which is used to verify the final pressing effect of the airflow.

[0046] In the embodiments of this application, the first height sensor 111 should be installed between the thickness sensor 108 and the upper air plate 104 to detect the initial warp height; the second height sensor 112 should be located in the middle rear position of the upper air plate 104 to detect the warp height after the initial airflow suppression; and the third height sensor 113 should be located 5-10 cm behind the pressing roller 107 to check the final pressing effect.

[0047] In a preferred embodiment, the height detection device is a laser displacement sensor, which emits a detection beam to the substrate surface and receives the reflected signal to obtain the height change of the substrate 110 relative to a reference plane in real time. It is understood that the height detection device may also employ other equivalent ranging elements, such as an ultrasonic sensor or a visual positioning sensor, as long as they can achieve the function of detecting the warpage height of the substrate 110 in this application.

[0048] In step S6, when the warp height exceeds the set threshold, the wind speed of the controllable airflow is further adjusted to compensate and suppress it.

[0049] This step is a dynamic adjustment and decision-making process, including: When the initial warp height detected by the first height sensor 111 exceeds the threshold (e.g., 2cm), the control module will immediately query the first wind speed lookup table based on the current thickness and the initial warp height, as shown in Table 1, to obtain a higher adjustment wind speed, and increase the speed of the blower 101 through the frequency converter to further suppress the severe warp.

[0050] Table 1 First Wind Speed ​​Query Table

[0051] When the second height sensor 112 detects that the warp height after the initial compression still exceeds the threshold, the control module will query the second wind speed lookup table based on the warp height value, as shown in Table 2, and adjust the wind speed again to perform compensatory compression.

[0052] Table 2 Second Wind Speed ​​Query Table

[0053] If the final warpage height detected by the third height sensor 113 still exceeds the threshold, the control module determines that the airflow suppression has failed, immediately triggers an alarm, and notifies the host equipment to stop feeding boards to prevent continuous board jamming and material scrap. If the final height is below the threshold, the substrate 110 can pass through normally.

[0054] In a preferred embodiment, the air pressure sensor 103 monitors the air source pressure in real time throughout the process. If the pressure is lower than the preset safety value, an alarm will be triggered and a shutdown operation will be performed to ensure the safe and stable operation of the system.

[0055] The method for suppressing substrate warping provided in this application has the following beneficial effects: (1) Non-contact pressing: High-speed airflow is used to suppress the warping of the substrate, completely avoiding physical contact with the substrate surface, eliminating the risk of scratching the substrate, and suitable for substrates of various shapes.

[0056] (2) Adaptive intelligent control: The thickness and warp height of the substrate are detected in real time. Combined with the pre-stored wind speed lookup table, the wind speed is automatically matched and dynamically compensated. The substrates with different thicknesses and warp degrees can be effectively pressed, which significantly improves the pass rate.

[0057] (3) High efficiency and stability: The clean air in the cleanroom is used as the air source, and the air is filtered by a HEPA filter to ensure the cleanliness of the airflow. Combined with air source pressure monitoring, stability and reliability are guaranteed. In practical applications, the jamming rate can be significantly reduced from an average of 74% to below 3%.

[0058] (4) Ingenious structural design: The upper and lower air panels adopt an asymmetrical design and different air outlet forms, realizing the step-by-step action of first pressing and then lifting, resulting in better pressing effect and effectively coping with larger warping.

[0059] Example 2 In an embodiment of this application, a system for suppressing substrate warping is also provided. This system implements the method steps for suppressing substrate warping described in Embodiment 1, comprising: an airflow generating device disposed at a predetermined position in the substrate transport path, for generating a controllable airflow acting on the substrate surface; a thickness detection device for detecting the thickness of the substrate; a height detection device for detecting the warping height of the substrate; and a control unit connected to the airflow generating device, the thickness detection device, and the height detection device, respectively, configured to: control the airflow generating device to output a reference wind speed based on the thickness signal detected by the thickness detection device; and control the airflow generating device to adjust the output wind speed based on the height signal detected by the height detection device when the warping height exceeds a threshold.

[0060] Figure 7 The following is a system block diagram for suppressing substrate warping according to an embodiment of this application, which will be described in conjunction with... Figure 7 The system for suppressing substrate warping of this application is described in further detail.

[0061] The system for suppressing substrate warping in this embodiment includes an airflow generating device 10, a frequency converter 20, a pressure detection device 30, a thickness detection device 40, a height detection device 50, and a control unit 60.

[0062] The airflow generating device 10 is an actuator responsible for generating a stable, clean, high-speed airflow, and is used at the connection between the PCB (printed circuit board) substrate 110 horizontal production line and the cleanroom.

[0063] In this embodiment, the airflow generating device 10 includes: Blower 101 is a high-pressure centrifugal blower. Its air inlet is connected to the inside of the cleanroom through an air duct. It is used to draw clean air from the cleanroom as an air source, which can maintain the positive pressure of the cleanroom and ensure the cleanliness of the airflow.

[0064] HEPA filter 102 is connected in series in the air outlet duct of blower 101 to perform secondary high-efficiency filtration on the air delivered by blower 101, remove any particles that may be present, ensure that the airflow blowing toward substrate 110 is dust-free, and avoid contaminating the product.

[0065] The upper air plate 104 and the lower air plate 114 are both long strip-shaped hollow cavity structures made of alloy, and are arranged parallel to each other on the upper and lower sides of the transmission path of the substrate 110.

[0066] The bottom of the upper air plate 104 is provided with a continuous micro-perforated air outlet 118 (see...). Figure 4 It is used to spray a uniform and continuous airflow downwards to apply a vertical downward pressing force to the warped portion of the substrate 110.

[0067] The top of the lower air plate 114 has multiple sets of intermittent micro-perforated air outlets 120 at the gap position of the transmission roller 109 (see...). Figure 5 The positions of these intermittent micro-perforated air outlets 120 correspond to the gaps between them and the drive rollers 109. These intermittent micro-perforated air outlets 120 spray air upwards, providing multiple concentrated upward support forces below the substrate 110, thus avoiding interference with the drive rollers 109.

[0068] The upper air plate 104 and the lower air plate 114 adopt an asymmetrical design in the transmission direction of the substrate 110: the length of the lower air plate 114 is shorter than that of the upper air plate 104, so that the airflow of the upper air plate 104 acts on the substrate 110 first, and the airflow of the lower air plate 114 acts on it later, forming a step-by-step pressing effect of "pressing first and then lifting", which can more effectively flatten complex warps.

[0069] In this embodiment, the thickness detection device 40 is responsible for collecting system status data in real time, providing data basis for the control unit 60.

[0070] Specifically, the thickness detection device 40 uses a laser rangefinder or a contact thickness gauge, and is installed about 10cm behind the upper air plate 104 to detect the thickness of the substrate 110 before it enters the airflow area.

[0071] In this embodiment, the height detection device 50 includes three sets of height sensors, arranged sequentially along the substrate transmission direction, wherein: The first height sensor 111 is located between the thickness detection device 40 and the upper air plate 104, and is used to detect the initial warpage height of the substrate 110.

[0072] The second height sensor 112 is located at the rear center of the upper wind plate 104 and is used to detect the warpage height of the substrate 110 after the initial airflow suppression.

[0073] The third height sensor 113 is located 5-10cm behind the pressing roller 107 and is used to detect the final warp height as a basis for judging whether the suppression is qualified.

[0074] The control unit 60 is the brain of the system, responsible for processing data and issuing control commands. In a preferred embodiment, the control unit 60 includes a programmable logic controller (PLC) and a data storage unit. The data storage unit is integrated internally into the PLC or connected externally, and contains a pre-stored wind speed lookup table. This lookup table establishes the correspondence between substrate thickness, warpage height, and the desired target wind speed. The programmable logic controller, as the main control unit, has its input ports connected to the pressure detection device 30, thickness detection device 40, and height detection device 50, respectively, and its output port connected to the airflow generating device 10 via a frequency converter 20. In actual operation, the programmable logic controller queries the wind speed lookup table in the data storage unit, derives a reference wind speed based on the substrate thickness, and adjusts the blower 101 to the corresponding speed via the frequency converter 20.

[0075] A pressure detection device 30 is used to monitor the operating air pressure of the system in real time. In a preferred embodiment, the pressure detection device 30 is a pressure sensor, which is installed on the pipe at the outlet of the blower 101 or the inlet of the air deflector and connected to the control unit 60. When the control unit 60 determines that the air pressure is lower than a preset threshold (e.g., 0.1 MPa), it triggers an alarm and controls the machine to stop operating. It can be understood that the pressure detection device 30 can also be a pressure switch or a differential pressure sensor, or other devices capable of realizing air pressure monitoring functions.

[0076] In a preferred embodiment, the system for suppressing substrate warping further includes an alarm and execution module, which provides an alarm function and notifies the host equipment to stop feeding boards when the system detects that the final warping height still exceeds a threshold, in order to prevent continuous board jamming and material scrap. Specifically, the alarm and execution module includes an alarm and a host communication interface. The alarm is connected to the output port of the PLC, and the host communication interface is connected to the main control system of the production line.

[0077] In this embodiment, the system's workflow is as follows: 1) When the substrate 110 enters the system working area, the thickness detection device 40 first transmits its thickness signal to the control unit 60.

[0078] 2) The control unit 60 queries the pre-stored first wind speed lookup table, obtains a reference wind speed based on the thickness of the substrate 110, and adjusts the blower 101 of the airflow generating device 10 to the corresponding speed through the frequency converter 20.

[0079] 3) The substrate 110 continues to advance, and the first height sensor 111 detects its initial warp height and reports it to the control unit 60. The control unit 60 queries the first wind speed lookup table again, calculates the required adjustment wind speed based on the two parameters "current thickness" and "initial warp height", and adjusts the speed of the blower 101 again through the frequency converter 20.

[0080] 4) After the substrate 110 is suppressed by airflow in the area where the upper and lower wind plates work, the second height sensor 112 detects its warping height. If it still exceeds the threshold, the control unit 60 activates the compensation logic, queries the second wind speed lookup table according to the current warping height, and further increases the wind speed.

[0081] 5) Before the substrate 110 finally enters the pressing roller 107, the effect is verified by the third height sensor 113. If the warpage height is successfully pressed to below the threshold (e.g., 2cm), the substrate 110 passes normally; otherwise, the control unit 60 determines that the pressing has failed, immediately alarms through the alarm and execution module, and sends a "stop board feeding" command to the main equipment of the production line.

[0082] Throughout the process, the pressure detection device 30 monitors the air pressure in real time. Once the air pressure is detected to be lower than the safety threshold (e.g., 0.1 MPa), the control unit 60 will immediately trigger an alarm and execute a shutdown procedure to prevent batch jamming due to insufficient air pressure.

[0083] The system for suppressing substrate warping provided in this embodiment constructs a closed-loop control system through the collaborative work of multiple modules. This system achieves precise suppression of substrate warping through non-contact, adaptive, and multi-level control, significantly improving the yield and productivity of thin and highly flexible substrates in production. By setting the upper air plate 104 to apply force to the substrate 110 before the lower air plate 114, and by utilizing the continuous air outlet of the upper air plate 104 in conjunction with the intermittent air outlet of the lower air plate, the airflow can form a straightening couple. This not only overcomes the surface warping of the substrate 110 but also effectively neutralizes its internal residual stress, achieving stable flattening from the root and obtaining technical effects far exceeding those of unidirectional air pressure suppression.

[0084] It will be understood by those skilled in the art that the above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for suppressing substrate warping, characterized in that, Includes the following steps: An airflow generating device is installed at a predetermined position in the substrate transport path; The airflow generating device generates a controllable airflow that acts on the surface of the substrate to suppress substrate warping. The thickness of the substrate is detected; The wind speed of the controllable airflow is adjusted based on the thickness of the substrate. The warpage height of the substrate after the airflow is applied is detected; When the warping height exceeds the threshold, the wind speed of the controllable airflow is further adjusted for compensation and suppression.

2. The method for suppressing substrate warping according to claim 1, characterized in that, The step of setting an airflow generating device at a predetermined position in the substrate transport path further includes: setting elongated air plates on the upper and lower sides of the substrate transport path, the air plates having air outlets; connecting the air plates to a cleanroom via a blower, so that the blower can draw air from the cleanroom, filter it, and then deliver it to the air plates to form the controllable airflow.

3. The method for suppressing substrate warping according to claim 2, characterized in that, The step of setting elongated wind plates on the upper and lower sides of the substrate transmission path further includes: setting the wind plates on the upper and lower sides to be asymmetrically arranged, so that the airflow suppression area of ​​the upper wind plate and the airflow lifting area of ​​the lower wind plate are staggered in the substrate transmission direction, so as to act on the substrate in stages.

4. The method for suppressing substrate warping according to claim 3, characterized in that, The upper air plate is provided with a long strip of continuous air outlets for applying uniform and continuous downward pressure to the substrate; the lower air plate is provided with intermittent air outlets offset from the position of the transmission rollers for providing multiple concentrated upward support forces below the substrate.

5. The method for suppressing substrate warping according to claim 1, characterized in that, It also includes the step of monitoring the air source pressure of the airflow generating device and triggering an alarm when the air source pressure is lower than a preset value.

6. The method for suppressing substrate warping according to claim 1, characterized in that, The step of detecting the warpage height of the substrate after airflow includes multiple detections: A first height detection is performed before the initial action of the airflow, and an initial wind speed adjustment is made based on the results of the first height detection; A second height detection is performed in the main area of ​​airflow action, and wind speed compensation adjustments are made based on the results of the second height detection. A third height detection is performed before the airflow area of ​​the substrate. If the warpage height detected in the third height detection exceeds the threshold, an alarm is triggered and the board feeding is stopped.

7. The method for suppressing substrate warping according to claim 1, characterized in that, The wind speed of the controllable airflow is adjusted based on a pre-stored wind speed lookup table that associates the substrate thickness with the warp height.

8. A system for suppressing substrate warping, used to implement the method for suppressing substrate warping according to any one of claims 1-7, characterized in that, include: An airflow generating device is disposed at a predetermined position in the substrate transport path and is used to generate a controllable airflow acting on the surface of the substrate. A thickness detection device for detecting the thickness of the substrate; A height detection device for detecting the warpage height of the substrate; The control unit, connected to the airflow generating device, the thickness detection device, and the height detection device respectively, is configured as follows: Based on the thickness signal detected by the thickness detection device, the airflow generating device is controlled to output a reference wind speed. Based on the height signal detected by the height detection device, when the warping height exceeds a threshold, the airflow generating device is controlled to adjust the output wind speed.

9. The system for suppressing substrate warping according to claim 8, characterized in that, The airflow generating device includes: Blower; A filter device is connected to the air outlet of the blower; An elongated strip of air is arranged vertically opposite each other and connected to the filter device. The air is provided with an air outlet for forming a controllable airflow.

10. The system for suppressing substrate warping according to claim 9, characterized in that, The air plates arranged opposite each other have different lengths in the transmission direction of the substrate. The lower air plate is shorter than the upper air plate, and one end of the upper air plate and the lower air plate are staggered, so that the airflow of the upper air plate can act on the substrate before the airflow of the lower air plate.

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