Electronic equipment and protective shell thereof

Abstract

The invention discloses electronic equipment and a protective shell thereof, and relates to the technical field of electronic equipment cooling. The protective shell comprises a shell body, an air cooling mechanism and a control mainboard, a mounting cavity is formed in the front side of the shell body, the electronic equipment can be mounted in the mounting cavity, an air inlet and an air outlet are formed in the two opposite ends of the shell body respectively and communicate with the mounting cavity, and the air inlet, the mounting cavity and the air outlet form a heat dissipation air channel passing through the electronic equipment; the air cooling mechanism is arranged at the first end of the shell body and located in the mounting cavity, and the air cooling mechanism is used for sucking external air into the heat dissipation air duct from the air inlet and blowing the external air out of the air outlet after flowing through the heat dissipation air duct; the control mainboard is installed in the installation cavity and electrically connected with the air cooling mechanism, and airflow in the heat dissipation air channel flows through the control mainboard. The protection shell does not occupy the internal space of the electronic equipment, the light and thin design of the electronic equipment can be achieved, a circulating and continuous air cooling heat dissipation process is achieved for the electronic equipment, the heat dissipation efficiency is improved, and the heat dissipation effect is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic device cooling technology, and in particular to an electronic device and its protective casing. Background Technology

[0002] With the development of society and the economy, handheld mobile communication devices, handheld gaming devices, and other electronic devices have become indispensable tools for people's work and daily life, and the requirements for their performance, battery life, signal quality, and ergonomics are becoming increasingly higher. Therefore, some electronic devices that require thinness and lightness, such as mobile phones, are equipped with high-end chips and large-capacity batteries to meet user needs. However, the problem of mobile phones overheating is becoming more and more serious, and in certain situations, they have even overheated and crashed, resulting in a poor user experience.

[0003] While some phones now incorporate cooling structures to address overheating, these structures are typically located inside the phone, taking up internal space and hindering the design of thinner and lighter phones. Some cooling structures, though located externally, have limited cooling effectiveness and low efficiency. Summary of the Invention

[0004] The main objective of this invention is to propose an electronic device and its protective casing, which aims to solve the technical problems of existing heat dissipation structures occupying internal space and having poor heat dissipation effects.

[0005] To achieve the above objectives, the present invention provides a protective case for an electronic device, the protective case being used to cover the back side of the electronic device, the protective case comprising: The shell body has a mounting cavity on its front side, in which the electronic device can be mounted. Air inlets and air outlets are formed at opposite ends of the shell body, and both air inlets and air outlets are connected to the mounting cavity. The air inlets, the mounting cavity, and the air outlets form a heat dissipation duct for the electronic device. An air-cooling mechanism is disposed at the first end of the shell body and located in the mounting cavity. The air-cooling mechanism is used to draw outside air into the heat dissipation duct from the air inlet, and blow it out from the air outlet after flowing through the heat dissipation duct. A control motherboard is installed in the mounting cavity and electrically connected to the air-cooling mechanism, and the airflow in the heat dissipation duct flows through the control motherboard.

[0006] In one embodiment, the air-cooling mechanism includes a fan, which is electrically connected to the control motherboard via a ribbon cable; The control motherboard is equipped with a power storage module, a temperature detection module, and a speed regulation module. The power storage module is used to supply power to the control motherboard and the fan. The temperature detection module is used to detect the temperature information of the electronic device. The control motherboard is used to control the speed regulation module to adjust the speed of the fan according to the temperature information.

[0007] In one embodiment, a charging interface for cooperating with a charging connector is provided at the second end of the shell body, and the first end and the second end are respectively the two opposite ends of the shell body. When the charging interface is cooperating with the charging connector, it can charge the energy storage module. The air outlet is provided at the second end of the shell body and is offset from the charging interface. And / or, the control motherboard is further provided with a thermoelectric conversion module that can charge the energy storage module, the hot end of the thermoelectric conversion module is in contact with the control motherboard, and the airflow in the heat dissipation duct flows through the cold end of the thermoelectric conversion module.

[0008] In one embodiment, a first mounting groove is formed on the back wall of the mounting cavity, the first mounting groove is correspondingly disposed to the air outlet and communicates with it, and the fan is installed in the first mounting groove; The back wall of the mounting cavity is also formed with a second mounting groove, which is correspondingly arranged with and connected to the air inlet. The control motherboard is installed in the second mounting groove.

[0009] In one embodiment, an air duct groove is formed inside the mounting cavity. The air duct groove is formed by a recess from the back side groove wall of the mounting cavity toward the back side. The opposite ends of the air duct groove are respectively connected to the first mounting groove and the second mounting groove. The air inlet, the second mounting groove, the air duct groove, the first mounting groove and the air outlet form the heat dissipation air duct.

[0010] In one embodiment, the opening of the air duct is arranged facing the front side, and a guide groove is also provided on the back side cavity wall of the air duct. The extension direction of the guide groove is consistent with the direction from the air inlet to the air outlet. And / or, the back wall of the mounting cavity is further formed with a groove for accommodating the cable guide wire, the cable guide wire being wound around the outside of the air duct groove, and the two ends of the cable guide wire being connected to the first mounting groove and the second mounting groove, respectively.

[0011] In one embodiment, the opening of the first mounting groove faces the front side. The air-cooling mechanism further includes a bottom shell and a cover plate. The bottom shell is embedded in the first mounting groove, and a receiving cavity is formed inside the bottom shell. The fan is installed in the receiving cavity. An installation opening is formed on the side of the receiving cavity facing the opening of the first mounting groove. The cover plate is detachably covered at the installation opening, and the cover plate has a ventilation opening communicating with the receiving cavity. The air outlet penetrates the top wall of the first mounting groove to communicate with the receiving cavity.

[0012] In one embodiment, the end wall of the first end of the shell body forms the top wall of the first mounting groove, and the top of the bottom shell has a ventilation grille that connects the air outlet to the receiving cavity. And / or, the bottom shell is integrally formed with the shell body.

[0013] In one embodiment, the end wall of the second end of the shell body forms the bottom wall of the second mounting groove, and the air inlet penetrates the bottom wall of the second mounting groove to communicate with the second mounting groove.

[0014] The present invention also proposes an electronic device having a protective case as described above, the protective case being disposed on the back side of the electronic device.

[0015] In one embodiment, the first end of the housing body is the top, and the electronic device has a noise-canceling microphone, which is disposed close to the air-cooling mechanism.

[0016] The present invention also proposes an electronic device that uses the sound-generating unit as described above.

[0017] This invention provides a protective shell that is mounted on the back of an electronic device, without occupying internal space, thus facilitating a slimmer and lighter design. Airflow through the cooling duct within the protective shell cools the electronic device. Specifically, the air-cooling mechanism draws outside air into the cooling duct through the air inlet. As the airflow passes through the duct, it absorbs heat generated by the electronic device and is then blown out of the protective shell through the air outlet, achieving air cooling. Understandably, with continuous operation, the air-cooling mechanism continuously draws outside air into the cooling duct through the air inlet, and after passing through the duct, it is blown out through the air outlet, carrying heat to the outside. This heat is then drawn back into the cooling duct, creating a continuous and cyclical air-cooling process, improving cooling efficiency and effectiveness. Furthermore, the air-cooling mechanism is electrically connected to a control motherboard, allowing control over its operation, such as starting, stopping, and operating speed, achieving automated, intelligent, and controllable cooling. Moreover, the airflow in the heat dissipation duct can flow through the control motherboard to perform air cooling on the control motherboard, achieving dual active cooling for both electronic devices and the control motherboard, further improving the heat dissipation effect. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the assembly of the protective shell according to an embodiment of the present invention; Figure 2 This is an exploded view of the protective shell according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the control motherboard module structure in a protective shell according to an embodiment of the present invention.

[0020] Explanation of icon numbers: 100. Protective shell; 10. Shell body; 11. Mounting cavity; 111. First mounting slot; 112. Second mounting slot; 113. Air duct slot; 114. Air guide slot; 115. Wire slot; 12. Air inlet; 13. Air outlet; 14. Heat dissipation air duct; 15. Charging interface; 20. Air cooling mechanism; 21. Fan; 22. Bottom shell; 221. Receiving cavity; 222. Mounting port; 223. Ventilation grille; 23. Cover plate; 231. Ventilation opening; 30. Control main board; 31. Energy storage module; 32. Temperature detection module; 33. Speed ​​regulation module; 34. Thermoelectric conversion module.

[0021] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] This invention proposes an electronic device and its protective casing, such as... Figure 1 and Figure 2As shown, this embodiment proposes a protective case 100 for an electronic device. The protective case 100 is used to dissipate heat from the electronic device. Specifically, the protective case 100 is used to cover the back of the electronic device to protect it from impacts or drops. The protective shell 100 includes a shell body 10, a cooling mechanism 20, and a control board 30. The shell body 10 has a mounting cavity 11 on its front side, in which electronic equipment can be installed. Air inlets 12 and air outlets 13 are formed at opposite ends of the shell body 10, respectively. Both air inlets 12 and air outlets 13 are connected to the mounting cavity 11, and the air inlets 12, mounting cavity 11, and air outlets 13 form a heat dissipation duct 14 for the electronic equipment. The cooling mechanism 20 is disposed at the first end of the shell body 10 and located in the mounting cavity 11. The cooling mechanism 20 is used to draw outside air into the heat dissipation duct 14 from the air inlet 12, and blow it out from the air outlet 13 after flowing through the heat dissipation duct 14. The control board 30 is installed in the mounting cavity 11 and is electrically connected to the cooling mechanism 20, and the airflow in the heat dissipation duct 14 flows through the control board 30.

[0026] The electronic device of this invention can be a handheld mobile communication device, a handheld gaming device, or any other device that requires heat dissipation. This invention uses a handheld mobile communication device, such as a mobile phone, as an example for illustration; the protective case 100 is a phone case 100 that is attached to the back of the phone. However, the protective case 100 of this invention is not a traditional protective case 100, but rather a protective case 100 that provides both protection and active heat dissipation for the phone.

[0027] Specifically, the protective case 100 has a mounting cavity 11 on the front side of the shell body 10. The mounting cavity 11 is adapted to the shape of the electronic device so that the electronic device can be installed in the mounting cavity 11, thereby covering the protective case 100 on the outer back side of the electronic device. The protective case 100 is located outside the electronic device and does not occupy the internal space of the electronic device, which is conducive to the realization of a thin and light design of the electronic device. In the protective case 100, the two opposite ends of the shell body 10 form an air inlet 12 and an air outlet 13, respectively. It should be noted that the end of the shell body 10 where the air outlet 13 is located is the first end. The air cooling mechanism 20 is set at the first end of the shell body 10 and is located in the mounting cavity 11. The setting is reasonable and the structure is compact. In order to ensure the normal operation and heat dissipation effect of the air cooling mechanism 20, the first end is not the end that the user holds or covers. For example, if the user usually holds the bottom of the phone, then the first end is the top of the phone to avoid the user's holding area.

[0028] Both the air inlet 12 and the air outlet 13 are connected to the mounting cavity 11, and the air inlet 12, the mounting cavity 11, and the air outlet 13 form a heat dissipation duct 14 through the electronic device, allowing the airflow in the heat dissipation duct 14 to pass through the electronic device and dissipate heat. Specifically, the air-cooling mechanism 20 draws outside air from outside the protective shell 100 into the heat dissipation duct 14 through the air inlet 12. As the airflow passes through the heat dissipation duct 14, it absorbs the heat generated by the electronic device and is then blown out of the protective shell 100 through the air outlet 13, thus achieving the air-cooling process for the electronic device. Understandably, as the air-cooling mechanism 20 continues to operate, outside air can be continuously drawn into the heat dissipation duct 14 through the air inlet 12, and after passing through the heat dissipation duct 14, it is blown out through the air outlet 13, carrying heat to the outside. It can then be drawn back into the heat dissipation duct 14, achieving a cyclical and continuous air-cooling process, improving heat dissipation efficiency and enhancing the heat dissipation effect.

[0029] Furthermore, the air-cooling mechanism 20 is electrically connected to the control motherboard 30, allowing control over the operating status of the air-cooling mechanism 20, such as its start / stop and operating speed, thus achieving automated, intelligent, and controllable heat dissipation. Moreover, the airflow in the heat dissipation duct 14 can flow through the control motherboard 30 to provide air-cooling for the control motherboard 30, achieving dual active cooling for both the electronic equipment and the control motherboard 30, further improving the heat dissipation effect.

[0030] In one embodiment, the air-cooling mechanism 20 includes a fan 21, which is electrically connected to the control motherboard 30 via a ribbon cable; as Figure 3 As shown, the control motherboard 30 is equipped with a power storage module 31, a temperature detection module 32, and a speed adjustment module 33. The power storage module 31 is used to supply power to the control motherboard 30 and the fan 21. The temperature detection module 32 is used to detect the temperature information of the electronic equipment. The control motherboard 30 is used to control the speed adjustment module 33 to adjust the speed of the fan 21 according to the temperature information.

[0031] It should be noted that the energy storage module 31, temperature detection module 32, and speed regulation module 33 of the present invention can all adopt existing technologies. The energy storage module 31 can be a storage battery or a lithium battery, the temperature detection module 32 can be a temperature sensor, and the speed regulation module 33 can be a PWM (pulse width modulation) controller.

[0032] The energy storage module 31 supplies power to the control motherboard 30 and fan 21, ensuring their normal and continuous operation. The temperature detection module 32 monitors the temperature of the electronic device in real time and sends the detected temperature information to the control motherboard 30. The control motherboard 30 then calculates the required fan speed 21 based on the temperature information and controls the speed adjustment module 33 to adjust the fan speed 21 to the required level, adapting to temperature changes and ensuring the device operates within its normal temperature range. In essence, when the electronic device temperature is high, the fan speed 21 can be increased to enhance airflow and accelerate heat dissipation, preventing overheating and system crashes. Conversely, when the electronic device temperature is low, the fan speed 21 can be reduced to decrease airflow and thus lower power consumption, achieving energy savings.

[0033] In one embodiment, the second end of the shell body 10 is provided with a charging interface 15 for cooperating with the charging connector. The first end and the second end are the opposite ends of the shell body 10. When the charging interface 15 is cooperating with the charging connector, it can charge the energy storage module 31. The air outlet 13 is disposed at the second end of the shell body 10 and is staggered from the charging interface 15.

[0034] like Figure 1 and Figure 2 As shown, in this embodiment, the second end of the shell body 10 is the bottom end of the shell body 10. It can be understood that the first end and the second end of the shell body 10 are respectively the opposite ends of the shell body 10. When the electronic device is a handheld device, such as a mobile phone or game console, in order to ensure that the air-cooling mechanism 20 located at the first end avoids the user's handheld area, the first end and the second end of the shell body 10 are respectively the top and bottom ends of the shell body 10, thereby placing the air-cooling mechanism 20 at the top of the shell body 10.

[0035] A charging interface 15, such as a Type-C port, is provided at the second end, i.e., the bottom end, of the housing body 10. This interface can be used with a charging connector to charge the energy storage module 31, ensuring that the energy storage module 31 has sufficient power, thereby ensuring the normal and continuous operation of the control motherboard 30 and the fan 21. The air inlet 12 and the air outlet 13 are respectively located at the first and second ends of the housing body 10, respectively, resulting in a greater distance between them. This extends the path of the heat dissipation duct 14, thereby expanding the airflow path and range within the heat dissipation duct 14, further improving heat dissipation efficiency and performance. Furthermore, the air outlet 13 and the charging interface 15 are staggered to avoid mutual interference, demonstrating a reasonable structural design.

[0036] like Figure 3As shown, in one embodiment, the control motherboard 30 is further provided with a thermoelectric conversion module 34 that can charge the energy storage module 31. The hot end of the thermoelectric conversion module 34 is in contact with the control motherboard 30, and the airflow in the heat dissipation duct 14 flows through the cold end of the thermoelectric conversion module 34.

[0037] It should be noted that the thermoelectric conversion module 34 can adopt flexible thermoelectric thin films or micro thermoelectric chips in the prior art. When the charging interface 15 is located in the charging connector to charge the energy storage module 31, the thermoelectric conversion module 34 can charge the energy storage module 31 to ensure that the energy storage module 31 has sufficient power, thereby ensuring the normal and continuous operation of the control motherboard 30 and the fan 21.

[0038] The hot end of the thermoelectric conversion module 34 contacts the control motherboard 30 to quickly absorb the heat of the control motherboard 30, while the airflow in the heat dissipation duct 14 flows through the cold end of the thermoelectric conversion module 34, thereby using the airflow in the heat dissipation duct 14 to force heat dissipation of the cold end, forming an efficient temperature difference, which not only improves the thermoelectric conversion efficiency, but also further dissipates heat from the control motherboard 30.

[0039] like Figure 2 As shown, in one embodiment, a first mounting groove 111 is formed on the back side wall of the mounting cavity 11. The first mounting groove 111 is correspondingly disposed and interconnected with the air outlet 13, and the fan 21 is installed in the first mounting groove 111. A second mounting groove 112 is also formed on the back side wall of the mounting cavity 11. The second mounting groove 112 is correspondingly disposed and interconnected with the air inlet 12, and the control motherboard 30 is installed in the second mounting groove 112.

[0040] The first mounting slot 111 is located at the top of the mounting cavity 11. The fan 21 is installed in the first mounting slot 111 and is positioned corresponding to the air outlet 13. The first mounting slot 111 and the air outlet 13 are interconnected, which facilitates rapid airflow. The second mounting slot 112 is located at the bottom of the mounting cavity 11. The control motherboard 30 is installed in the second mounting slot 112 and is positioned corresponding to the air inlet 12. The second mounting slot 112 and the air inlet 12 are interconnected, which facilitates the airflow from the air inlet 12 into the heat dissipation duct 14 to be direct and pass through the control motherboard 30 first, thereby improving the heat dissipation efficiency of the control motherboard 30.

[0041] In one embodiment, an air duct groove 113 is formed in the mounting cavity 11. The air duct groove 113 is formed by recessing from the back side cavity wall of the mounting cavity 11 towards the back side. The two opposite ends of the air duct groove 113 are respectively connected to the first mounting groove 111 and the second mounting groove 112. The air inlet 12, the second mounting groove 112, the air duct groove 113, the first mounting groove 111 and the air outlet 13 form a heat dissipation air duct 14.

[0042] like Figure 1 and Figure 2As shown, the air duct groove 113 is recessed from the back wall of the mounting cavity 11 towards the back side, so that when the electronic device is installed in the mounting cavity 11, the back wall of the air duct groove 113 always has a gap with the back surface of the electronic device, so as to avoid the air duct groove 113 being blocked by the electronic device. The air inlet 12, the second mounting groove 112, the air duct groove 113, the first mounting groove 111 and the air outlet 13 are connected sequentially from bottom to top to form the heat dissipation air duct 14, which extends the path of the heat dissipation air duct 14.

[0043] It should be noted that when the electronic device is installed in the mounting cavity 11, and the fan 21 is installed in the first mounting slot 111 and the control motherboard 30 is installed in the second mounting slot 112, there is always a gap between the front side surface of the fan 21 and the front side surface of the control motherboard 30 and the back side surface of the electronic device. This is to avoid the heat dissipation air duct 14 being blocked by the electronic device at the fan 21 mounting location and the control motherboard 30 mounting location, so as to ensure the effectiveness and continuity of the heat dissipation air duct 14 and thus ensure the smooth flow of air.

[0044] In one embodiment, the opening of the air duct 113 is arranged facing the front side, and the back side wall of the air duct 113 is also provided with a guide groove 114. The extension direction of the guide groove 114 is consistent with the direction from the air inlet 12 to the air outlet 13.

[0045] like Figure 1 and Figure 2 As shown, multiple guide channels 114 are also provided on the back wall of the air duct 113. The extension direction of each guide channel 114 is consistent with the direction from the air inlet 12 to the air outlet 13, that is, consistent with the flow direction of the airflow in the heat dissipation air duct 14, so as to guide the airflow and facilitate the airflow from the air inlet 12 to the air outlet 13 quickly and accurately, thereby improving the heat dissipation efficiency and enhancing the heat dissipation effect. Moreover, there are multiple guide channels 114, which can be arranged at intervals in a direction perpendicular to their extension direction. Specifically, the guide channels 114 extend in the vertical direction, and the multiple guide channels 114 are arranged at intervals in the horizontal direction. The structural design is reasonable, and the arrangement of multiple guide channels 114 further improves the heat dissipation efficiency and enhances the heat dissipation effect.

[0046] In one embodiment, the back wall of the mounting cavity 11 is further formed with a wire groove 115 for accommodating the ribbon cable. The wire groove 115 guides the distribution of the ribbon cable, facilitating its installation. Furthermore, the wire groove 115 has a certain depth, ensuring that even when the ribbon cable is placed within it, it will not protrude outside the guide groove, thus preventing interference with the installation of electronic equipment within the mounting cavity 11. The wire groove 115 is routed around the air duct 113, meaning the guide groove avoids the air duct 113 to prevent interference. Both ends of the wire groove 115 are connected to the first mounting groove 111 and the second mounting groove 112, respectively, so that the ribbon cable housed within the guide groove can electrically connect the fan 21 to the control motherboard 30.

[0047] In one embodiment, the opening of the first mounting groove 111 is arranged facing the front side. The air-cooling mechanism 20 also includes a bottom shell 22 and a cover plate 23. The bottom shell 22 is embedded in the first mounting groove 111, and a receiving cavity 221 is formed inside the bottom shell 22. The fan 21 is installed in the receiving cavity 221. An installation opening 222 is formed on the side of the receiving cavity 221 facing the opening of the first mounting groove 111. The cover plate 23 is detachably covered at the installation opening 222, and the cover plate 23 has a ventilation opening 231 communicating with the receiving cavity 221. The air outlet 13 penetrates the top wall of the first mounting groove 111 to communicate with the receiving cavity 221.

[0048] During assembly, the fan blades of the fan 21 can be first installed in the receiving cavity 221 of the bottom shell 22 via their bearings. Then, the cover plate 23 is placed over the mounting opening 222, and the cover plate 23 is detachably connected to the bottom shell 22, thus completing the assembly of the air-cooling mechanism 20. The assembled air-cooling mechanism 20 is then embedded in the first mounting groove 111 with the bottom shell 22 facing backwards, completing the assembly of the air-cooling mechanism 20 and the shell body 10, which is simple and convenient. Moreover, embedding the bottom shell 22 in the first mounting groove 111 and the detachable connection between the cover plate 23 and the bottom shell 22 facilitates disassembly, assembly, and maintenance. The cover plate 23 has a ventilation opening 231 that communicates with the receiving cavity 221, so that the fan 21 in the receiving cavity 221 can draw the airflow from the air duct groove 113 into the receiving cavity 221 through the ventilation opening 231 and then blow it out through the air outlet 13, ensuring smooth airflow.

[0049] In one embodiment, the end wall of the first end of the shell body 10 forms the top wall of the first mounting groove 111, and the top of the bottom shell 22 forms a ventilation grille 223 that connects the air outlet 13 to the receiving cavity 221. As shown in Figure X, the end wall of the first end of the shell body 10, i.e., the top end wall of the shell body 10, forms the top wall of the first mounting groove 111, and the top of the bottom shell 22 forms a ventilation grille 223. The air outlet 13 penetrates the top wall of the first mounting groove 111 and connects to the receiving cavity 221 through the ventilation grille 223, so that when the fan 21 is running, the airflow drawn into the receiving cavity 221 can be blown directly out of the air outlet 13 after passing through the ventilation grille 223. The structural design is reasonable and ensures smooth airflow.

[0050] In one embodiment, the bottom shell 22 and the shell body 10 are integrally formed, thereby eliminating the assembly steps and assembly gaps between the bottom shell 22 and the shell body 10, making it easier to manufacture and reducing costs.

[0051] In one embodiment, the end wall of the second end of the housing body 10 forms the bottom wall of the second mounting groove 112, and the air inlet 12 penetrates the bottom wall of the second mounting groove 112 to communicate with the second mounting groove 112. As shown in Figure X, the end wall of the second end of the housing body 10, that is, the bottom end wall of the housing body 10, forms the bottom wall of the second mounting groove 112, and the air inlet 12 penetrates the bottom wall of the second mounting groove 112, that is, penetrates the bottom end wall of the housing body 10 and communicates with the second mounting groove 112, so that external air can pass through the air inlet 12 directly through the control motherboard 30 installed in the second mounting groove 112 and flow into the air duct groove 113, thereby improving the heat dissipation efficiency of the control motherboard 30.

[0052] The present invention also proposes an electronic device, which uses a protective case 100 as described above, which is disposed on the back side of the electronic device.

[0053] The electronic device of this invention can be a handheld mobile communication device, a handheld gaming device, or any other device requiring heat dissipation. This invention uses a handheld mobile communication device, such as a mobile phone, as an example for illustration; the protective case 100 is the mobile phone protective case 100 that is attached to the back of the mobile phone. The protective case 100 of this invention provides protection for the mobile phone while also actively dissipating heat.

[0054] The specific structure and usage of the protective case 100 used in this electronic device are as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0055] In one embodiment, the first end of the housing body 10 is the top, and the electronic device has a noise-canceling microphone, which is positioned close to the air-cooling mechanism 20.

[0056] Understandably, the end of the housing body 10 where the air outlet 13 is located is the first end, and the first end of the housing body 10 is the top end. The air-cooling mechanism 20 is located at the first end of the housing body 10, that is, the air-cooling mechanism 20 is located at the top end of the housing body 10. Understandably, when a user holds an electronic device, such as a mobile phone, they usually hold it at the bottom, covering the bottom and the middle area of ​​the phone. In this invention, the air-cooling mechanism 20 is located at the top end of the housing body 10 so that the air-cooling mechanism 20 can avoid the user's holding area, thereby ensuring the normal operation and heat dissipation effect of the air-cooling mechanism 20.

[0057] Furthermore, the electronic device has a noise-canceling microphone, which can be positioned on the top of the electronic device so that when the electronic device is installed in the mounting cavity 11 of the protective case 100, the noise-canceling microphone is positioned close to the air-cooling mechanism 20. The noise-canceling microphone can eliminate ambient noise, and when positioned close to the air-cooling mechanism 20, it can also reduce the noise of the air-cooling mechanism 20, specifically, reduce the noise of the fan 21 during operation, thus improving the user experience.

[0058] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any equivalent structural transformations made based on the inventive concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A protective case for an electronic device, characterized in that, The protective shell is used to cover the back side of the electronic device, and the protective shell includes: The shell body has a mounting cavity on its front side, in which the electronic device can be mounted. Air inlets and air outlets are formed at opposite ends of the shell body, and both air inlets and air outlets are connected to the mounting cavity. The air inlets, the mounting cavity, and the air outlets form a heat dissipation duct for the electronic device. An air-cooling mechanism is disposed at the first end of the shell body and located in the mounting cavity. The air-cooling mechanism is used to draw outside air into the heat dissipation duct from the air inlet, and blow it out from the air outlet after flowing through the heat dissipation duct. A control motherboard is installed in the mounting cavity and electrically connected to the air-cooling mechanism, and the airflow in the heat dissipation duct flows through the control motherboard.

2. The protective case for an electronic device as described in claim 1, characterized in that, The air-cooling mechanism includes a fan, which is electrically connected to the control motherboard via a ribbon cable. The control motherboard is equipped with a power storage module, a temperature detection module, and a speed regulation module. The power storage module is used to supply power to the control motherboard and the fan. The temperature detection module is used to detect the temperature information of the electronic device. The control motherboard is used to control the speed regulation module to adjust the speed of the fan according to the temperature information.

3. The protective case for an electronic device as described in claim 2, characterized in that, The second end of the shell body is provided with a charging interface for cooperating with the charging connector. The first end and the second end are the opposite ends of the shell body. When the charging interface is cooperating with the charging connector, it can charge the energy storage module. The air outlet is provided at the second end of the shell body and is offset from the charging interface. And / or, the control motherboard is further provided with a thermoelectric conversion module that can charge the energy storage module, the hot end of the thermoelectric conversion module is in contact with the control motherboard, and the airflow in the heat dissipation duct flows through the cold end of the thermoelectric conversion module.

4. The protective case for an electronic device as described in claim 2, characterized in that, The back wall of the mounting cavity is formed with a first mounting groove, which is correspondingly provided with and communicates with the air outlet. The fan is installed in the first mounting groove. The back wall of the mounting cavity is also formed with a second mounting groove, which is correspondingly arranged with and connected to the air inlet. The control motherboard is installed in the second mounting groove.

5. The protective case for an electronic device as described in claim 4, characterized in that, An air duct groove is formed inside the mounting cavity. The air duct groove is formed by a recess from the back side wall of the mounting cavity toward the back side. The two opposite ends of the air duct groove are respectively connected to the first mounting groove and the second mounting groove. The air inlet, the second mounting groove, the air duct groove, the first mounting groove and the air outlet form the heat dissipation air duct.

6. The protective case for an electronic device as described in claim 5, characterized in that, The opening of the air duct is oriented to the front side, and a guide groove is also provided on the back side cavity wall of the air duct. The extension direction of the guide groove is consistent with the direction from the air inlet to the air outlet. And / or, the back wall of the mounting cavity is further formed with a groove for accommodating the cable guide wire, the cable guide wire being wound around the outside of the air duct groove, and the two ends of the cable guide wire being connected to the first mounting groove and the second mounting groove, respectively.

7. The protective case for an electronic device as described in claim 4, characterized in that, The opening of the first mounting slot faces the front side. The air-cooling mechanism also includes a bottom shell and a cover plate. The bottom shell is embedded in the first mounting slot, and a receiving cavity is formed inside the bottom shell. The fan is installed in the receiving cavity. An installation opening is formed on the side of the receiving cavity facing the opening of the first mounting slot. The cover plate is detachably covered at the installation opening, and the cover plate has a ventilation opening communicating with the receiving cavity. The air outlet penetrates the top wall of the first mounting slot to communicate with the receiving cavity.

8. The protective case for an electronic device as described in claim 7, characterized in that, The end wall of the first end of the shell body forms the top wall of the first mounting groove, and the top of the bottom shell has a ventilation grille that connects the air outlet and the receiving cavity. And / or, the bottom shell is integrally formed with the shell body.

9. The protective case for an electronic device as described in claim 4, characterized in that, The end wall of the second end of the shell body forms the bottom wall of the second mounting groove, and the air inlet penetrates the bottom wall of the second mounting groove to communicate with the second mounting groove.

10. An electronic device, characterized in that, The electronic device is equipped with a protective case as described in any one of claims 1 to 9, the protective case being disposed on the back side of the electronic device.

11. The electronic device as claimed in claim 10, characterized in that, The first end of the shell body is the top, and the electronic device has a noise-canceling microphone, which is located close to the air-cooling mechanism.

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