Method for producing detection module and radiation source module for such method

Abstract

The invention relates to a method for producing a detection module and a radiation source module for such a method. The method comprises: a) first providing a stack of detection elements and a scattered beam grid, a radiation-curable adhesive being present at least partially on a surface of the detection elements facing the scattered beam grid, which radiation-curable adhesive is in contact with the scattered beam grid and the detection elements, b) second providing a radiation source module, which radiation-curable adhesive is in contact with the scattered beam grid and the detection elements, the radiation source module is provided with a planar radiation source and a collimation unit arranged parallel to the radiation source, and the collimation unit is divided into a plurality of sub-regions which respectively span a sub-surface region of the radiation source. And wherein each sub-region of the collimating unit is designed to collimate radiation emitted by a sub-surface region of the radiation source associated with the sub-region, c) positioning the radiation source module relative to the stack assembly on a side of the scattered beam grid facing away from the detection element; d) irradiating the stack by means of a radiation source module in order to harden the radiation-curable adhesive such that an adhesive-based connection is formed between the scattered beam grid and the detection element.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a detection module from a stacked assembly consisting of a detection element and a scattered beam grid, wherein a radiation source module is provided for irradiating the stacked assembly and thus curing a radiation-curing adhesive, the radiation source module having a planar radiation source and collimation units arranged parallel thereto. The invention also relates to a radiation source module for use in this method. Background Technology

[0002] X-ray imaging equipment (hereinafter referred to as X-ray equipment) typically consists of an X-ray source and an X-ray beam detector (hereinafter referred to as X-ray detector), which are arranged opposite each other. During the operation of an X-ray equipment, the X-ray detector detects the X-rays emitted by the X-ray source and, if necessary, attenuated by the object being examined, such as a patient and / or a phantom and / or part of a workpiece. Here, the X-ray detector is designed to output a (measured) signal corresponding to the intensity of the incident X-rays. In particular, the X-ray detector has multiple image points, especially pixels and / or voxels, which are used to detect the intensity distribution of the incident X-rays with planar resolution.

[0003] During the operation of an X-ray device, the X-rays emitted by the X-ray source are not only attenuated to varying degrees by the object being examined, but are also partially scattered at an angle relative to the original radiation direction (which typically extends radially relative to the X-ray source). These scattered beams (“scattered beams”) cause distortion in the image reconstructed from the intensity distribution when they reach the X-ray detector due to their superposition with the (main) X-rays occurring in the original radiation direction. In particular, these scattered beams lead to a reduction in the contrast of the reconstructed image.

[0004] To reduce the impact of scattered radiation, X-ray detectors are typically equipped with so-called scattered beam grids (also known as "anti-scattering grids" or scattered beam filters), which are positioned in front of the X-ray sensing element of the X-ray detector in the direction of radiation. These scattered beam grids usually have a grid-like structure, constructed by intersecting X-ray-absorbing walls and X-ray-transmitting channels. Each grid opening, i.e., each channel, forms a radiation channel that extends along the direction of the main X-ray beam. Conversely, scattered radiation is absorbed by the X-ray-absorbing walls. Here, each radiation channel is typically associated with a single pixel or a small number of pixels in the detector. The filtering effect of the scattered beam grid on scattered radiation increases with the height of the X-ray-absorbing walls along the beam incident direction and increases as the distance between the walls (equivalent to the aspect ratio of the channels in the scattered beam grid) decreases.

[0005] This X-ray detector can be constructed from one or more detection modules, each module comprising a stacked assembly consisting of a detection element configured for detecting X-rays and a scattered beam grid. When assembling the stacked assembly, it is essential to join the stacked assembly precisely and with sufficient stability. Furthermore, an adhesive connection is used between the scattered beam grid and the detection element, particularly when using radiation-cured adhesives.

[0006] However, the challenge lies in the fact that the radiation must reach the junction between the scattered beam grid and the probe element to harden this radiation-cured adhesive. Lateral accessibility is often limited or impossible, potentially requiring irradiation through the scattered beam grid. However, as mentioned above, the function of the scattered beam grid in the module is to absorb scattered radiation, i.e., non-parallel incident radiation. Light sources used for hardening the adhesive (such as mercury vapor lamps or LEDs) typically emit uncollimated light, which is maximally absorbed by the scattered beam grid and then consequently no longer usable for hardening the adhesive. This results in long irradiation times, which increase further with increasing aspect ratio of the scattered beam grid, thus leading to drawbacks in process time during production or the requirement for high output intensity. Both of these situations further result in high heat input to the scattered beam grid or stacked assembly, which can negatively impact the positioning accuracy of the scattered beam grid relative to the probe element, and may also negatively impact the scattered beam grid itself. In the case of particularly high aspect ratios of the scattered beam grid, it is often not even possible to harden the adhesive using uncollimated light. Using individual point radiators or laser-based light sources as alternative directional irradiation options is often accompanied by insufficient size of the irradiated area and long irradiation duration, which leads to uncertainty regarding adequate hardening and / or long process duration. Summary of the Invention

[0007] The objective of this invention is to describe a method for manufacturing a detection module (which allows for improvements in the irradiation of the radiation-cured adhesive used) and a radiation source module for this method.

[0008] According to the present invention, this task is solved by the subject matter of the invention. Advantageous embodiments with suitable improvements are the subject of this specification.

[0009] The present invention relates to a method for manufacturing a detection module, the method comprising first providing a stacked assembly consisting of a detection element and a scattering beam grid, wherein at least a portion of a radiation-curing adhesive is present on the surface of the detection element facing the scattering beam grid, the radiation-curing adhesive being in contact with the scattering beam grid and the detection element.

[0010] The method further includes providing a radiation source module having a planar radiation source and a collimation unit arranged parallel thereto, wherein the collimation unit is divided into a plurality of sub-regions, each sub-region spanning a sub-surface region of the radiation source, and wherein each sub-region of the collimation unit is configured to collimate radiation emitted by a sub-surface region of the radiation source corresponding to that sub-region.

[0011] Furthermore, the method according to the invention also includes positioning a radiation source module relative to the stack assembly on the side of the scattering beam grid facing away from the detector element, and irradiating the stack assembly with the radiation source module to harden the radiation-cured adhesive, thereby establishing an adhesive-based connection between the scattering beam grid and the detector element.

[0012] The detection module can be, in particular, an X-ray detection module and can be configured for use in an X-ray detector. For example, the X-ray detector can be a detector for a CT scanner, a C-arm, or other X-ray-based imaging device. The detection element is particularly configured to convert incoming X-rays into electrical signals. The detection element may include a conversion material for direct or indirect conversion. X-rays or X-ray photons can be converted into electrical signals in a direct conversion detection element by means of a suitable conversion material. For example, CdTe, CZT, CdZnTeSe, CdTeSe, CdMnTe, InP, TlBr2, HgI2, GaAs, or other materials can be used as conversion materials. In an indirect conversion detection element, X-rays or photons can be converted into light by means of a suitable conversion material and converted into electrical pulses by means of an optically coupled photodiode, especially a photodiode array. Scintillators, such as GOS (Gd2O2S), CsJ, YGO, or LuTAG, are often used as conversion materials. In particular, the detection element may have planar extension in two directions perpendicular to the stacking direction of the stacked assembly. Conversely, this means that the stacking direction of the stacked assembly, consisting of the detector element and the scattered beam grid arranged parallel thereto, extends substantially perpendicular to the plane of the detector element and the scattered beam grid. Here, the detector element can be constructed as a single piece or composed of multiple conversion elements positioned side-by-side along the plane. Indirectly converted detector elements are particularly advantageous in the method according to the invention because these are generally more mechanically robust than directly converted detector elements, and therefore the bonding between the detector element and the scattered beam grid present in the stacked assembly can be advantageously and more easily achieved.

[0013] Then, as previously described, a scattered beam grid is provided in the stacked assembly relative to the detector element to reduce the effect of scattered radiation when the detector module is used in the X-ray detector. This is done by absorbing the scattered radiation before it reaches the detector element. Therefore, essentially only the radiation intended for detection by the detector module can reach the detector element from the main incident direction through the scattered beam grid. For this purpose, the scattered beam grid can have an intersecting arrangement of X-ray absorbing walls and a channel thus constructed that allows X-rays to pass through. This advantageously allows filtering of scattered radiation in two directions. However, other arrangements are also possible; for example, X-ray absorbing walls arranged parallel to each other in only one direction are also possible. The X-ray absorbing walls can be arranged parallel to the stacking direction of the stacked assembly, or they can have an inclination. The inclination can include a maximum of 10 degrees, especially less than 5 degrees, for example, 3 degrees. Here, the inclination of the X-ray absorbing walls can vary within the scattered beam grid depending on their position. In particular, the wall that absorbs X-rays and the channel formed by the wall that allows X-rays to pass through can be tilted, such that the wall and the channel are oriented toward the focal point of the X-ray source arranged in the X-ray detector for irradiation of the detection module.

[0014] The X-ray absorbing walls of the scattered beam grid preferably have a material that absorbs X-rays, thereby ensuring sufficient suppression of scattered radiation occurring in imaging applications when irradiating and transmitting objects. The X-ray absorbing walls are particularly made of materials that strongly absorb X-rays, i.e., have a high absorption coefficient for X-rays, for example, a higher absorption coefficient than bone tissue. In particular, the X-ray absorbing walls of the scattered beam grid can be made of a metallic material. Preferably, the X-ray absorbing walls are made of tungsten. However, multiple X-ray absorbing walls may also be made of lead, molybdenum, zinc, or other materials or composite materials.

[0015] Radiation-curing adhesives, especially those cured by ultraviolet light, typically offer advantages such as rapid curing times, high strength, good media stability, and good measurability. The radiation-curing adhesive in the method according to the invention can be used to pre-fix a scattered beam grid relative to a detection element. This includes providing additional fixing possibilities for the arrangement of the scattered beam grid relative to the detection element, for example, by means of additional adhesive bonding between the detection element and the scattered beam grid, such as thermosetting adhesive, or other mechanical fixation of the scattered beam grid (e.g., by means of fixing devices, such as screws) relative to the carrier element. This additional fixing can, for example, be performed after pre-fixation. In the case of additional adhesive bonding, the additional adhesive may already be present between the scattered beam grid and the detection element during pre-fixation, whereby curing may then occur, which may take a long time or require other environmental conditions. Therefore, in this case, the contact between the radiation-curing adhesive and the detection element may also include: the detection element already having a layer of additional adhesive, for example, based on epoxy or acrylic resin. The additional fixing possibilities can ensure a mechanically more robust connection, which may be necessary for the safe use of the detection module in an X-ray detector. However, the radiation-curing adhesive present according to the invention can also be used as the sole or at least primary fixation between the scattering beam grid and the detection element.

[0016] Radiation-curing adhesive can only be present on one or more restricted and separated sites on the surface of the probe element, such as as adhesive points or linear adhesive tapes. This provides sufficient adhesion, especially during pre-fixation, where a small amount of adhesive material must advantageously be used. For example, 4, 6, 8, or 10 adhesive points can be present. For example, 2, 3, 4, or 5 adhesive tapes can be present. Other numbers are also possible. However, radiation-curing adhesive can also be applied planarly, i.e., covering the entire surface or at least most of the surface of the probe element. This advantageously ensures a more robust bond between the scattered beam grid and the probe element. The latter is particularly advantageous when the radiation-curing adhesive is used as the sole or at least primary fixation.

[0017] Radiation-curing adhesives are constructed to cure upon irradiation with radiation, particularly in the ultraviolet range. For example, radiation-curing adhesives can cure upon irradiation with wavelengths between 350 nm and 460 nm, particularly between 380 nm and 420 nm. Specifically, the adhesive is matched to the radiation emitted by the radiation source module used according to the invention. Conversely, this means that the radiation emitted by the radiation source module according to the invention is matched to the radiation-curing adhesive in terms of its wavelength, and in particular to the absorption range of the initiator used in the adhesive. For example, the radiation-curing adhesive can be based on acrylates, such as epoxy acrylates, polyester acrylates, polyether acrylates, or silicone acrylates, especially polyurethane acrylates, added to the photoinitiator. In addition to pure radiation-curing adhesives, dual-curing adhesives, i.e., adhesives with multiple curing mechanisms, such as adhesives whose curing is based on heat input in addition to radiation, can also be used. In a preferred variation, a radiation-curing adhesive is chosen such that its effect on the radiation used for irradiation when the detector module is used in the detector is minimal. In an advantageous variation, the selected radiation-curing adhesive is substantially X-ray transparent. In other words, in an advantageous design, the radiation-cured adhesive absorbs less than 5%, preferably less than 3%, of the radiation that, after passing through the scattered beam grid, is incident on the detection surface of the detection element or detected by the detection element without being bonded. By irradiating and thus curing the radiation-cured adhesive, the adhesive-based fixation of the scattered beam grid relative to the detection element is ensured. Further process steps can then be provided to the detection module.

[0018] The radiation source module provided according to the invention is used to irradiate radiation-curing adhesive in a stacked assembly of a detection module. For this purpose, according to the invention, the radiation source module is constructed planarly. This includes, in particular, a radiation source configuration for emitting radiation through a planar region. This advantageously allows for a large surface area of ​​the stacked assembly, and thus simultaneously irradiates and hardens all areas where the adhesive is applied. In an advantageous configuration, the planar region of the radiation source extends at least over the surface of the detection element where the radiation-curing adhesive is applied. In a particularly advantageous configuration, the planar region of the radiation source extends perpendicularly to the stacking direction over at least a large portion or the entire area of ​​the planar extension of the stacked assembly. Therefore, the positioning of the radiation source module relative to the stacked assembly can be achieved simply and without significant uncertainty. Furthermore, uncertainties in the position of the areas where the radiation-curing adhesive is applied can thus be compensated for. Especially when the entire surface or at least a large portion of the surface of the detection element is covered by the radiation-curing adhesive, the planar region of the radiation source advantageously extends over at least the entire area of ​​the planar extension of the stacked assembly.

[0019] A planar radiation source can consist of multiple single sources. For example, a planar radiation source can have multiple single sources arranged in a matrix in a plane, wherein each single source emits radiation through at least a sub-surface region of the planar radiation source. The planar region of the planar radiation source can be composed of the total number of sub-surface regions. The number and arrangement of the single sources are particularly matched to the desired surface area of ​​the planar region of the radiation source. In particular, a planar radiation source can be constructed from multiple LEDs arranged in a matrix. This corresponds to an advantageously simple and inexpensive construction. Furthermore, the use of LEDs allows for keeping the input heat to the stacked assembly very small. This construction is also referred to as an LED surface radiator or LED array. In other constructions according to the invention, the planar radiation source can also be constructed differently. In particular, as mentioned above, the planar radiation source is matched with the adhesive used and is preferably constructed for planar emission of ultraviolet radiation.

[0020] In the method according to the invention, a radiation source module (including a planar radiation source) is positioned relative to the stacked assembly on the side of the scattered beam grid facing away from the detection element, so as to enable irradiation and subsequent curing of the radiation-curing adhesive. That is, radiation emitted by the radiation source module irradiates the radiation-curing adhesive through the transmission radiation channel of the scattered beam grid. Now, to avoid the majority of the radiation emitted by the radiation source module being absorbed unused in the scattered beam grid, the radiation source module used according to the invention includes a collimation unit arranged parallel to the planar radiation source. The collimation unit is arranged on the side of the radiation source module facing the scattered beam grid when used in the manufacturing method according to the invention. The collimation unit according to the invention can be constructed as a single piece or in multiple pieces.

[0021] In particular, the collimation unit is generally planar in construction and can, in an advantageous configuration, completely or at least substantially cover the planar region of the radiation source. However, according to the invention, the collimation unit is divided into multiple sub-regions, each spanning a sub-surface region of the radiation source and configured to collimate the radiation emitted by the assigned sub-surface region. If the planar radiation source consists of multiple single sources, particularly LEDs, then each sub-region of the collimation unit can be assigned to one of the single sources, particularly LEDs. This specifically includes each sub-region of the collimation unit being assigned to a single source of the radiation source in a one-to-one relationship. Advantageously, each sub-region of the collimation unit and its collimating effect can be matched as well as possible to the single source or sub-surface region assigned to that sub-region.

[0022] Collimation here means that radiation emitted by a planar radiation source of the radiation source module, particularly / usually uncollimated and therefore dispersed, from a sub-surface area or a single source, is guided to a higher degree of parallelism relative to the state emitted by the radiation source after passing through the collimation unit. Thus, radiation from a planar radiation source can reach the junction point more effectively through the scattering beam grid without absorption. That is, the share of emitted radiation available for irradiating the radiation-curing adhesive in the stacked assembly is increased due to the collimation unit, and therefore, the optical power at the junction is advantageously increased relative to the use of no collimation unit. However, this does not necessarily mean that completely parallel guidance or complete avoidance of radiation absorbed in the scattering beam grid must be achieved. Enhanced parallel guidance of radiation along the direction of the probe element, i.e., along the stacking direction, can already advantageously be accompanied by an improvement in optical power at the radiation-curing adhesive. The degree of collimation leading to particularly advantageous results through the collimation unit can here depend on the scattering beam grid used, especially its aspect ratio. A higher aspect ratio results in a smaller receiving angle through which X-rays can pass, within which increased optical power can be advantageously achieved using a collimating unit. In other words, a higher aspect ratio and a smaller receiving angle lead to a higher degree of collimation, thus reducing radiation absorption in the scattered beam grid. Depending on the design of the scattered beam grid, the receiving angle can be, for example, between 2° and 10°. The average direction of radiation emitted from the subsurface region or a single source after passing through the collimating unit can then be referred to as the collimation direction. This collimation direction essentially corresponds to the propagation direction of an ideally collimated, i.e., ideally parallel-guided beam.

[0023] Advantageous designs for the collimating element can be determined in advance, for example, based on experience or through simulation. Using simulation, such as ray tracing, the optical power achievable after passing through the scattered beam grid and / or the expected heat input to the scattered beam grid can be estimated and optimized accordingly, based on the design of the collimating element and the specific design of the planar radiation source, especially its emission characteristics. The advantage of simulation estimation is that various collimating element designs and / or different scattered beam grids can be considered relatively simply and quickly. If the radiation source module is to be used with multiple scattered beam grids of different aspect ratios, it may be advantageous to optimize under the most demanding conditions to also achieve an improvement in optical power after passing through the scattered beam grid. The inclination of the X-ray absorbing wall (if located in the scattered beam grid) relative to the stacking direction can also be considered. Optimization can particularly involve iterative processes that take into account, on the one hand, the optical power achieved at the junction, and on the other hand, the absorption in the scattered beam grid, and therefore the heat input to the scattered beam grid or related dimensions.

[0024] The positioning of the radiation source module relative to the stacked assembly can be achieved using a holding device, in which the stacked assembly can be arranged, and the radiation source module can be positioned relative to the stacked assembly. Positioning may also include: the radiation source module being fixedly mounted, wherein the stacked assembly is positioned relative to the radiation source module. The positioning of the radiation source module and / or the stacked assembly can also be automated, for example, using a robot.

[0025] During irradiation, the stacked assembly is subjected to radiation from the radiation source module until the radiation-curing adhesive hardens. The irradiation time can be, for example, between 2 and 16 seconds, such as 8 or 10 seconds. However, advantageously, the irradiation time using the manufacturing method according to the invention and the radiation source module according to the invention can be shorter than that without the collimation unit according to the invention, for example, 2 to 8 times shorter. Here, the specific irradiation time can depend on the selected radiation-curing adhesive, the specific construction of the current adhesive, i.e., the thickness of the adhesive layer, or the current environmental conditions. Furthermore, the irradiation time depends on the specific implementation of the radiation source module and the specific stacked assembly, especially the diffused beam grid.

[0026] The method according to the invention, utilizing the radiation source module, advantageously allows for faster curing of radiation-curing adhesives at the joint, ensuring higher radiation intensity at the joint while maintaining the same initial strength at the radiation source. This advantageously allows for inexpensive and time-saving manufacturing. It also expands the range of possible adhesives (palettes) that can be used. Furthermore, it is advantageous to achieve, with the radiation source module according to the invention, reduced heating of the scattered beam grid, or at least not increased, even with increased optical power at the joint. For example, reduced heating can be achieved by selecting an initial radiation intensity and / or irradiation time of the radiation source that is smaller / shorter than without the collimation unit according to the invention. The heat entering the scattered beam grid through the scattered radiation can also be reduced. Less heat input can benefit the accuracy of assembly and positioning, as the thermal effect can play a smaller role. Furthermore, scattered beam grids constructed of more heat-sensitive materials can be conveniently used, which can be deformed or even destroyed by heat input. In addition, the method according to the invention also enables the convenient manufacture of stacked assemblies with scattered beam grids having a high aspect ratio. As the aspect ratio increases, irradiating the adhesive at the joint becomes increasingly challenging, thus significantly increasing the required irradiation time. From a certain aspect ratio onwards, process-safe curing may no longer be achievable. Therefore, the method according to the invention can advantageously avoid limitations in component design.

[0027] According to a favorable variant, the provided radiation source module includes:

[0028] Each subregion of the collimation unit is constructed similarly. That is, apart from production uncertainties, each subregion of the collimation unit is constructed substantially identically. This can also be referred to as a regular collimation unit. Therefore, position-independent collimation is produced within the subregions of the collimation unit. Advantageously, this corresponds to the simplest and cheapest possible implementation. Furthermore, this corresponds to a design that is as easy to optimize as possible, since the number of parameters remains small. Using such a regular collimation unit can be a good compromise between improved illumination and inexpensive and time-saving implementation. Although, for example, the possible position-dependent collimation within the radiation source module, especially the collimation direction (which, for example, takes into account the possible position-dependent tilt of the X-ray-absorbing walls of the scattered beam grid), is not implemented here, this still results in an advantageously improved manufacturing process for the detector module, even in inexpensive manufacturing. This is especially applicable when the same collimation unit should be used for multiple different scattered beam grids. In this case, the collimation unit of this regularity can be optimized in a favorable and simple implementation for the scattered beam grid with the highest aspect ratio, which also helps to improve the irradiation of the radiation-cured adhesive for the scattered beam grid with a lower aspect ratio.

[0029] In an alternative variation of the manufacturing method for the above design, an irregular collimation unit is used. If the scattered beam grid is constructed by an intersecting arrangement of X-ray-absorbing walls and the resulting X-ray-transmitting channel (which has a position-dependent inclination), then in this implementation variation, a collimation unit is provided, wherein the collimation direction of a sub-region among the plurality of sub-regions of the collimation unit takes into account the inclination of the X-ray-absorbing walls or the formed channel, depending on the position. In this case, the scattered beam grid is, for example, oriented toward the focal point of the X-ray source arranged in the X-ray detector for irradiation of the detection module. This results in the inclination of the X-ray-absorbing walls and the corresponding channel, which depends on the position in the scattered beam grid (possibly along the X and Y directions). In the advantageous variation described here, this inclination in the collimation unit is taken into account, such that the collimation effect of the sub-regions of the collimation unit, i.e., in particular the collimation direction, is coordinated with this position-dependent inclination according to the position. This results in, in particular, that the sub-regions among the plurality of sub-regions of the collimation unit are not constructed identically, but rather these sub-regions vary in their geometry according to their position. In particular, each of the multiple sub-regions can be designed differently from the others. Advantageously, this allows for further optimization of the alignment of the straight-line units with respect to the arrangement of the scattering beam grid.

[0030] Furthermore, in an advantageous variation of the method, the scattered beam grid comprises an intersecting arrangement of X-ray absorbing walls and X-ray-transmitting channels thus constructed, wherein each sub-region of the collimating unit spans exactly one or an integer multiple thereof of the X-ray-transmitting channels. The integer multiples are advantageously small integer multiples, such as 2, 4, or 6, and especially less than 10. This variation is particularly advantageous in combination with the previously described variation of irregular collimating units, because here, position-related coordination with the inclination of the individual channels of the scattered beam grid can be taken into particular advantage.

[0031] According to a favorable variation, the collimating unit is constructed as a refractive optical element, particularly as a matrix arrangement of optical lenses, wherein each sub-region of the collimating unit is constructed by a corresponding optical lens. This collimating unit can be implemented as a matrix arrangement of microlenses, i.e., a so-called microlens array. The aperture of the corresponding lens can be advantageously implemented for a planar cover having a rectangular aperture. A corresponding sub-surface region of the radiation source or a single source is correspondingly associated with a lens. The optical design of the lens can be based on the emission characteristics of the radiation source or the corresponding single source and the geometry at the scattered beam grid, for example, by means of simulation as described above. This collimating unit can, for example, be implemented as a monolithic body for advantageously simple operation, wherein a matrix arrangement of lenses is formed at least on the surface of the body.

[0032] Here, the collimating element, particularly the microlens array described above, can comprise plastic. The collimating element can be made of, for example, optical plastic with high transmittance at the wavelength of radiation emitted by a planar radiation source. Cycloolefin polymers and amorphous thermoplastic polymers can be used, for example. Plastics allow for advantageously inexpensive manufacturing, especially in high-volume applications, such as injection molding. Milling can also be used. In other designs, the collimating element can also be implemented based on glass. This may be an advantageous, more robust variant.

[0033] According to another advantageous variation of the method according to the invention, a collimating unit is used, wherein the collimating unit is configured as an adaptable collimating unit, wherein each sub-region of the collimating unit is configured as a non-rigid beam shaping element that can switch between at least two states. For example, reflective beam shaping achieved by a so-called "deformable mirror" or refractive beam shaping achieved by a controllable lens can be considered. Advantageously, after manufacturing the collimating unit, it is possible to adapt the collimating unit to different current stacked assemblies.

[0034] According to another advantageous variation of the method according to the invention, a collimation unit is used, wherein the collimation unit itself is constructed of a plurality of cross-arranged collimation walls and permeable collimation channels located between them, these collimation walls being constructed to absorb radiation from a planar radiation source, wherein each of the plurality of sub-regions of the collimation unit includes one of the permeable collimation channels. This collimation unit is similar to the scattering beam grid used in a stacked assembly of a detection module. This collimation unit achieves its collimation effect by absorbing radiation that has a different collimation direction than that passing through the collimation walls. Here, the arrangement of the collimation walls of the collimation unit is advantageously matched to the arrangement of the X-ray-absorbing walls of the scattering beam grid. Thus, the absorption of radiation in the scattering beam grid is minimized after passing through the collimation unit. Consistency in the distances between the corresponding walls is particularly advantageous; that is, the distances and arrangement of the collimation walls correspond to the distances and arrangement of the X-ray-absorbing walls of the scattering beam grid. Furthermore, the higher the collimation walls are implemented, the better the collimation effect. Such a collimating element particularly includes a material that effectively absorbs radiation emitted by a planar radiation source and is unaffected by the heat input resulting from the absorbed radiation. This material may particularly include a metal. Advantageously, the material has good thermal conductivity and poor reflectivity, or is accordingly coated to optimize its properties. For example, the collimating element may include aluminum, tungsten, or copper anodized black.

[0035] According to an advantageous variation of the method, the radiation-curing adhesive covers most of the detection element. This includes covering the entire surface with the radiation-curing adhesive. This design advantageously simplifies the use of the radiation-curing adhesive as the sole bonding connection between the scattered beam grid and the detection element, eliminating the need for additional fixation, such as thermosetting adhesives. Using the radiation source module according to the invention advantageously allows for process safety in this implementation, as efficient illumination and therefore safe curing can be achieved through a larger surface area. Advantageously, process steps involving additional fixation can be eliminated.

[0036] According to another variation of the method, the radiation-cured adhesive is a dual-curing adhesive, i.e., an adhesive with multiple curing mechanisms. In particular, such a dual-curing adhesive can achieve both radiation curing and thermo-curing. The dual-curing adhesive combines the advantages of radiation-curing adhesives with the advantages of a second curing mechanism. Especially in shielded areas, improved curing can be achieved, for example. A more robust bond overall can also be achieved if necessary. Curing with such a dual-curing adhesive typically requires a higher radiation dose than known from pure radiation-curing adhesives. Using the radiation source module according to the invention also advantageously enables this implementation safely. Therefore, the invention provides the possibility of using a dual-curing adhesive for this application. In this case, additional fixing, for example, by means of a separate thermo-curing adhesive, can be eliminated, and therefore additional process steps can also be eliminated. Such a dual-curing adhesive can be based on acrylates, epoxy resins, or other chemicals, such as those based on modified polycarboxylic acid derivatives.

[0037] The present invention also relates to a radiation source module having a planar radiation source and a collimation unit arranged parallel thereto, wherein the collimation unit is divided into a plurality of sub-regions, each sub-region spanning a sub-surface region of the radiation source, and wherein each sub-region of the collimation unit is configured to collimate radiation emitted by a sub-surface region of the radiation source corresponding to that sub-region, for use in the method and variations thereof as described above.

[0038] The advantages of the proposed radiation source module essentially correspond to the advantages of the proposed manufacturing method for the detection element when using the radiation source module and its variations as described above. The features, advantages, or alternative embodiments mentioned herein can also be transferred to the radiation source module. Attached Figure Description

[0039] Embodiments of the present invention are illustrated in the accompanying drawings, which are then described in detail. In the different drawings, the same features are represented by the same reference numerals. Wherein:

[0040] Figure 1 A schematic block diagram of a method flow for manufacturing a detection module according to the invention is shown.

[0041] Figure 2 A schematic diagram shows the arrangement of the radiation source module relative to a stacked assembly consisting of a scattering beam grid and detection elements.

[0042] Figure 3 Shown in top view Figure 2 A schematic diagram of stacked components.

[0043] Figure 4 A further schematic diagram shows the arrangement of the radiation source module relative to the stacked assembly consisting of a scattering beam grid and detection elements.

[0044] Figure 5 A schematic diagram of a stacked assembly consisting of a scattering beam grid and a detection element, according to a variant scheme, is shown.

[0045] Figure 6 A schematic diagram of a fragment of an exemplary implementation variant of the radiation source module is shown.

[0046] Figure 7 A schematic diagram of an exemplary implementation segment of a radiation source module according to another variant is shown, and

[0047] Figure 8 A schematic diagram is shown showing the arrangement of a radiation source module relative to a stacked assembly consisting of a scattering beam grid and a detection element, according to an alternative variant. Detailed Implementation

[0048] Figure 1 A schematic block diagram of a method flow for manufacturing a probe module according to the present invention is shown, including the following steps:

[0049] a) First, S1 is provided as a stacked assembly consisting of a detector element 1 and a scattering beam grid 3, wherein at least partially, a radiation-curing adhesive 5 is present on the surface of the detector element 1 facing the scattering beam grid 3, the radiation-curing adhesive being in contact with the scattering beam grid 3 and the detector element 1.

[0050] b) Next, an S2 radiation source module 7 is provided, which has a planar radiation source 9 and a collimation unit 11 arranged parallel to it, wherein the collimation unit 11 is divided into a plurality of sub-regions 12, which respectively span sub-surface regions of the radiation source 9, and wherein each sub-region 12 of the collimation unit 11 is configured to collimate the radiation 13 emitted by the sub-surface region of the radiation source 9 corresponding to that sub-region.

[0051] c) Position the radiation source module 7 relative to the stacked assembly S3 on the side of the scattered beam grid 3 opposite to the detector element 1; and

[0052] d) The radiation source module 7 is used to irradiate the S4 stack assembly to harden the radiation-cured adhesive 5, thereby establishing an adhesive-based connection between the scattered beam grid 3 and the detection element 1.

[0053] Here, Figure 2An exemplary schematic diagram illustrates the positioning of the radiation source module 7 according to the invention relative to a stacked assembly consisting of a scattered beam grid 3 and a detection element 1 according to a variant, wherein the stacked assembly is irradiated by radiation 13 collimated by collimation unit 11 from a planar radiation source 9, and thus hardens the current radiation-curing adhesive 5. Positioning S3 of the radiation source module 7 relative to the stacked assembly can be achieved by means of a holding device (not shown), in which the stacked assembly can be arranged, and the radiation source module 7 can be positioned relative to the stacked assembly. Positioning may also include: the radiation source module 7 being fixedly mounted, wherein the stacked assembly is positioned relative to the radiation source module. Positioning of the radiation source module 7 and / or the stacked assembly can also be performed automatically, for example by means of a robot.

[0054] The detector element 1 can be used as an indirect or direct conversion detector element 1, designed for X-rays, and includes, for example, GOS (Gd2O2S), CsJ, YGO or LuTAG or CdTe, CZT, CdZnTeSe, CdTeSe, CdMnTe, InP, TlBr2, HgI2, GaAs as conversion materials.

[0055] The scattered beam grid 3 (in the form of an arrangement of walls that absorb X-rays, including materials with high absorption coefficients for X-rays, such as metals like tungsten, lead, molybdenum, etc.) forms a channel 2 through which X-rays can pass. In particular, the scattered beam grid 3 exists as a cross-arrangement of walls that absorb X-rays. This also... Figure 3 It was explained in the middle, Figure 3 It shows Figure 2 The diagram shows a top view of the stacked assembly consisting of the scattered beam grid 3 and the detector element 1. However, other arrangements of the X-ray absorbing walls are also possible. Here, the X-ray absorbing walls of the scattered beam grid 3 are arranged, by way of example, parallel to the stacking direction of the stacked assembly consisting of the detector element 1 and the scattered beam grid 3. However, in other configurations, these walls may also have an inclination relative to the stacking direction. Furthermore, the inclination may also vary locally within the scattered beam grid 3. The inclination can result in the X-ray absorbing walls and, consequently, the X-ray-transmitting channels 2 formed through these walls of the scattered beam grid 3, oriented towards the focal point of the X-ray source arranged in the X-ray detector during use for irradiation of the detector module.

[0056] exist Figure 2 or Figure 3 In the exemplary case shown, the radiation-cured adhesive 5 exists in the form of adhesive dots. The presence of four adhesive dots 5 is chosen here purely as an example, but more or fewer adhesive dots may also be present. The linear application of one or more adhesive tapes or the planar presence of adhesive layers are also conceivable. For example, in Figure 5 The latter is explained in [the text]. Figure 5In this embodiment, the adhesive 5, which exists planarly, extends across the entire surface of the probe element 1. However, in other variations, the adhesive may only partially cover the surface. The presence of the adhesive 5, for example in the form of adhesive dots or linear adhesive strips, at one or more restricted and separated locations on the surface of the probe element 1 can be advantageously material-saving and, in particular, but not only, enables sufficient fixation during pre-fixation. Conversely, as in Figure 5 As illustrated in the example, a more planar arrangement can, if necessary, ensure a more robust connection between the detector element 1 and the scattered beam grid 3. If the radiation-curing adhesive 5 is only used for pre-fixation, then, depending on the arrangement of the scattered beam grid 3 relative to the detector element 1, additional fixing possibilities can be provided, such as by means of additional adhesive joints between the detector element 1 and the scattered beam grid 3, such as thermosetting adhesives, or other mechanical fixations of the scattered beam grid 3 (e.g., by fastening devices, such as screws) relative to the carrier element. In the case of additional adhesive joints, the additional adhesive may already be present between the scattered beam grid 3 and the detector element 1 during pre-fixation.

[0057] The radiation-curing adhesive 5 is configured to cure upon irradiation with radiation 13 from a radiation source module 7, particularly in the ultraviolet range. For example, the radiation-curing adhesive 5 can cure upon irradiation with wavelengths between 350 nm and 460 nm, particularly between 380 nm and 420 nm, such as 390 nm ± 10 nm or 405 nm ± 10 nm. Specifically, the adhesive is matched to, and vice versa, the radiation 13 emitted by the radiation source module 7 used according to the invention. The radiation-curing adhesive 5 can be based, for example, on acrylates, epoxy acrylates, polyester acrylates, polyether acrylates, or silicone acrylates, particularly polyurethane acrylates, added to a photoinitiator. In addition to pure radiation-curing adhesive 5, dual-curing adhesives, i.e., adhesives with multiple curing mechanisms, such as adhesives whose curing is based on heat input in addition to radiation, can also be used. Radiation-curing adhesives, especially those cured by ultraviolet radiation, generally have advantageously rapid curing times, high strength, good media stability, and good quantifiability. Dual-curing adhesives combine the advantages of radiation-curing adhesives with the advantages of a second curing mechanism. Furthermore, the adhesive 5 is advantageously chosen so that it has little effect on the radiation used for illumination when the detection module is used in the detector, i.e., the radiation is absorbed only to a very small extent.

[0058] The radiation source 9 of the radiation source module 7 is configured to emit radiation 13 through a planar region for irradiating the radiation-curing adhesive 5, and is accordingly planar. In the illustrative example shown here, the planar region extends perpendicular to the stacking direction over the entire plane of the stacked assembly. However, other configurations, such as those covering only a large portion of the surface, are also possible. In an advantageous configuration, the planar region extends at least on the surface of the radiation-curing adhesive 5 in the presence of the detection element 1, thereby enabling simultaneous and, consequently, time-saving irradiation.

[0059] The planar radiation source 9 can here be composed of multiple single sources 15, such as... Figure 4 , Figure 6 and Figure 7 As illustrated illustratively and schematically. Each single source 15 then emits radiation 13 through at least a sub-surface region of the planar radiation source 9. Therefore, the planar radiation source 9 can have multiple single sources 15 arranged in a matrix on a plane. The number and arrangement of the single sources 15 are particularly matched to the desired surface area of ​​the planar region of the radiation source 9. For example, 10x10, 12x12, 14x14, or 20x20 or other numbers of single sources can be provided. Thus, planar radiation sources with 3x30, 6x17, or 15x23 single sources can also exist. The planar radiation source 9 is particularly advantageously constructed as a so-called LED surface radiator or LED array.

[0060] According to the invention, the collimation unit 11 extends advantageously over the planar region of the radiation source 9, by which radiation 13 is emitted. Figure 2 The diagram illustrates that, according to the invention, a collimation unit 11 is divided into multiple sub-regions 12, each sub-region configured to collimate radiation 13 emitted by a separately assigned sub-surface region of a radiation source 9. If the planar radiation source 9 comprises multiple single sources 15, particularly LEDs, then each sub-region 12 of the collimation unit 11 can be assigned to one of the single sources 15, particularly LEDs. This specifically includes each sub-region 12 of the collimation unit 11 being assigned to a single source 15 of the radiation source 9 in a one-to-one ratio, for example in... Figure 4 , Figure 6 and Figure 7 As exemplarily illustrated, it is thus possible that the corresponding sub-region 12 of the collimation unit 11 and its collimation function are coordinated with the single source 15.

[0061] The collimation unit 11 enables the radiation 13 emitted by the planar radiation source 9 of the radiation source module 7, which is particularly / usually uncollimated and therefore dispersed, to be guided to a higher degree of parallelism relative to the state emitted by the radiation source 9 after passing through the collimation unit 11. Figure 4This schematically illustrates the uncollimated radiation 13 emitted by a planar radiation source 9, constructed from multiple single sources, particularly LEDs, without the collimation of the collimation unit 11. The uncollimated radiation 13 from the planar radiation source 9 is absorbed to the maximum extent in the scattering beam grid 3 and is consequently no longer usable for curing the radiation-curing adhesive 5. Advantageously achieved by the provided radiation source module 7, including the collimation unit 11, is that the radiation emitted by the radiation source 9 or the corresponding single source 15 is collimated in the corresponding associated sub-region of the collimation unit 11, i.e., guided increasingly parallel, so that the radiation 13 from the planar radiation source 9 can increasingly pass through the scattering beam grid 3 and reach the junction without absorption. That is, by means of the collimation unit 11, the proportion of emitted radiation 13 (which can be used to irradiate the radiation-curing adhesive 5 in the stacked assembly) and consequently the optical power at the junction is advantageously increased compared to the use without the collimation unit 11. However, this does not necessarily mean that completely parallel guidance or complete avoidance of radiation absorbed in the scattering beam grid 3 must be achieved. Although in Figure 2 Only parallel radiation 13 is shown, but after passing through collimation unit 11, there may also be a certain opening angle of collimated radiation 13 emanating from each sub-region on the exit surface of collimation unit 11. Advantageously, the enhanced parallel guidance of radiation 13 toward detector element 1 is accompanied by an improvement in optical power at the radiation-cured adhesive. The degree of collimation that leads to particularly advantageous results through collimation unit 11 can here depend on the scattered beam grid 3 used, especially its aspect ratio. The larger the aspect ratio, the smaller the receiving angle opened by the X-ray-transmitting channel 2, within which increased optical power can be advantageously achieved by means of collimation unit 11. Depending on the design of scattered beam grid 3, the receiving angle can be, for example, between 2° and 10°.

[0062] The collimating unit 11 can be designed differently, for example, as a refractive optical element, such as a so-called microlens array, as an adaptable collimating unit, wherein each of the plurality of sub-regions of the collimating unit is constructed as a non-rigid beam-shaping element, or also constructed by means of an arrangement of absorbing collimating walls. An advantageous design for the collimating unit 11 can be determined in advance, for example, empirically or through simulation. By means of simulation, for example by means of ray tracing, based on the design of the collimating unit 11 and the specific design of the planar radiation source 9, especially its emission characteristics, for example, the optical power achievable after passing through the disposed scattering beam grid 3 can be estimated and optimized accordingly, and / or the heat expected to be input into the scattering beam grid 3 can also be estimated and optimized accordingly. The tilt of the X-ray-absorbing walls relative to the stacking direction (if disposed in the scattering beam grid 3) can also be taken into account when designing the collimating unit 11. The optimization of the collimating unit 11 can in particular include iterative processing, which takes into account, on the one hand, the optical power achieved at the junction, and on the other hand, the absorption in the scattering beam grid 3, and therefore the heat input into the scattering beam grid 3 or related dimensions.

[0063] During irradiation, the stacked assembly is subjected to radiation 13 from the radiation source module 7 until the radiation-cured adhesive 5 is fully hardened. For example, the irradiation time can be between 2 s and 20 s, such as 8 s or 10 s. However, advantageously, the irradiation time using the manufacturing method according to the invention and the radiation source module according to the invention can be selected to be shorter, for example, 2 to 10 times shorter, than in irradiation without the collimation unit according to the invention.

[0064] The method according to the invention, utilizing the radiation source module 7, advantageously allows for faster curing of the radiation-curing adhesive 5 at the joint, ensuring a higher radiation intensity at the joint while maintaining the same output intensity at the radiation source 9. This also expands the range of possible adhesives 5 that can be used. Furthermore, it is advantageous to reduce, or at least not increase, the heating of the scattered beam grid with respect to increased optical power at the joint, using the radiation source module 7 according to the invention. Additionally, the method according to the invention also enables the convenient manufacture of stacked assemblies having scattered beam grids 3 with high aspect ratios.

[0065] Figure 6 and Figure 7 Two different design possibilities for the radiation source module 7 are shown schematically in cross-sectional views. In both variants, the planar radiation source 9 is constructed from multiple single sources 15, particularly LEDs, which are arranged side-by-side in a matrix in the planar region of the radiation source 9 and emit radiation 13 uncollimated through sub-surface regions.

[0066] exist Figure 6In this invention, the collimation unit 11 is constructed from a matrix arrangement of optical lenses, wherein each sub-region 12 of the plurality of sub-regions of the collimation unit 11 is constructed by a corresponding optical lens. Here, the collimation unit 11 is constructed as a refractive optical element, particularly as a monolithic so-called microlens array. The collimation unit 11 (e.g., comprising optical plastic or glass) here has a curved surface on a second surface in addition to a flat first surface facing the radiation source 9. However, the curved surface may also face the radiation source 9 or may be configured otherwise. Each sub-region 12 of the collimation unit 11 here functions as a lens, which collimates radiation 13 from a single source 15 associated with the lens to the lens. Optimization of this collimation unit 11 may include: adapting the distance d between the radiation source 9 and the collimation unit 11, the thickness m of the collimation unit 11, and the curvature of the collimation unit 11. For example, the distance d may be between 2 and 10 mm. The thickness m may be between 2 and 15 mm, for example. Optimization of this collimation unit 11 may include: a tradeoff between optimized light capture and high intensity following the collimation unit 11, which may be accompanied by lower collimation and consequently higher scattering and absorption in the scattering beam grating; and a tradeoff between higher collimation and consequently lower scattering, which may also be accompanied by lower intensity following the collimation unit 11. Here, iterative processing can be advantageously chosen, where the optical power in the bonding plane and the heat in the input scattering beam grating 3 can be taken into account. This also applies to collimation units with different configurations.

[0067] For example, the collimating unit 11 shown here is made of optical plastic and has high transmittance in the wavelengths of radiation emitted by a planar radiation source. For example, with a thickness of a few millimeters (e.g., 3 millimeters), a transmittance of greater than 80%, more advantageously greater than 90%, should be achieved. Cycloolefin polymers and amorphous thermoplastic polymers can be used, for example. Plastics enable advantageously inexpensive manufacturing, especially in high-volume applications, such as by injection molding. Manufacturing by milling can also be used.

[0068] Figure 7A schematic cross-sectional view of another possible design for the radiation source module 7 is shown. Here, the collimation unit 11 itself includes a plurality of cross-arranged collimation walls configured to absorb radiation 13 from the planar radiation source 9, and is configured with permeable collimation channels between the collimation walls, wherein each sub-region 12 of the plurality of sub-regions of the collimation unit 11 includes one of the permeable collimation channels. This collimation unit 11 is similar to the scattered beam grid 3 used in the stacked assembly of the detection module. This collimation unit 11 achieves its collimation function by absorbing radiation that has a different collimation direction than that predetermined by the collimation walls. This collimation unit 11 particularly includes a material that effectively absorbs radiation emitted by the planar radiation source and is unaffected by the heat input caused by the absorbed radiation. For example, the collimation unit 11 may include aluminum, tungsten, or copper anodized black. Here, the arrangement of the collimation walls of the collimation unit is advantageously matched with the arrangement of the X-ray absorbing walls of the scattered beam grid 3. Therefore, the absorption of radiation in the scattered beam grid 3 is minimized after passing through the collimation unit 11. This optimization takes into account not only the distance between the walls and the distance from the radiation source 9, but also, in particular, the height of the collimation walls. The higher the collimation wall, the stronger the collimation effect, but the lower the intensity produced after the collimation unit 11.

[0069] Other possible design options include: the collimating unit 11 is configured as an adaptable collimating unit, wherein each sub-region 12 of the plurality of sub-regions of the collimating unit 11 is configured as a non-rigid beam-forming element that can switch between at least two states. For example, reflective beamforming achieved through a so-called "deformable mirror" or refractive beamforming achieved through a controllable lens can be considered. Advantageously, after fabrication of the collimating unit, it is possible to adapt the collimating unit to different current stacked assemblies.

[0070] exist Figure 6 and Figure 7 In the example previously shown, each sub-region 12 of the collimation unit 11 is similarly constructed; that is, the collimation unit 11 is constructed as a regular collimation unit. Advantageously, this corresponds to the simplest and cheapest possible implementation. However, it is also possible to implement an irregular collimation unit 11. If as... Figure 8As shown, the scattered beam grid 3 is constructed by the intersecting arrangement of walls that absorb X-rays and the resulting X-ray-transmitting channels, which have position-dependent inclinations indicated by angles α, β, γ, and δ. This can lead to particularly advantageous results. In the variant shown here, a collimation unit 11 is now provided, wherein the collimation direction of a sub-region (shown by the direction of radiation 13) of a plurality of sub-regions of the collimation unit is determined by the inclination of the walls that absorb X-rays or the formed channels, depending on the position. In the advantageous variant described here, the collimation effect of the sub-regions 12 of the collimation unit 11 is coordinated, in particular, by the inclination of the X-ray-transmitting channels in the collimation unit 11, such that the collimation direction of the sub-regions 12 of the collimation unit 11 is coordinated with the position-dependent inclination, taking into account the inclination of the channels. This results in the sub-regions 12 of the plurality of sub-regions of the collimation unit 11 not being constructed identically, but rather the sub-regions 12 varying in their geometry according to their position. In the variant shown, the collimation unit 11 is also constructed as a microlens array. However, the collimation unit can also be constructed according to other variants.

[0071] In particular, but not only in combination with this variant, it is especially advantageous that, as schematically shown here, each sub-region 12 of the collimation unit 11 spans exactly one of the X-ray-transmitting channels of the scattered beam grid 3, because here the position-related coordination with the inclination of the respective channels of the scattered beam grid can be taken into particular advantage. However, it can also be a particularly small, for example, an integer multiple of less than 10, such as 2 or 4. In the region it spans, the variation in the inclination of the wall can only be very small, so that the position-related coordination of the collimation direction can also lead to advantageous results through multiple channels.

Claims

1. A method for manufacturing a detection module, comprising: a. First, a stacked assembly consisting of a detector element (1) and a scattering beam grid (3) is provided (S1), wherein at least a portion of a radiation-curing adhesive (5) is present on the surface of the detector element (1) facing the scattering beam grid (3), the radiation-curing adhesive being in contact with the scattering beam grid (3) and the detector element (1). b. Next, a radiation source module (7) is provided (S2), the radiation source module having a planar radiation source (9) and a collimation unit (11) arranged parallel thereto, wherein the collimation unit (11) is divided into a plurality of sub-regions (12), the sub-regions respectively spanning sub-surface regions of the radiation source (9), and wherein each sub-region (12) of the collimation unit (11) is configured to collimate radiation (13) emitted by a sub-surface region of the radiation source (9) belonging to the sub-region. c. Position the radiation source module (7) relative to the stacking assembly on the side of the scattering beam grid (11) opposite to the detection element (1); d. The stacked assembly is irradiated (S4) by means of the radiation source module (7) to harden the radiation-curing adhesive (5) so as to form an adhesive-based connection between the scattering beam grid (3) and the detection element (1).

2. The method according to claim 1, wherein, The radiation source (9) of the plane is constructed from multiple single sources arranged in a matrix, especially LEDs (15).

3. The method according to claim 2, wherein, Each of the plurality of sub-regions (12) of the collimation unit (11) is associated with one of the single sources (15).

4. The method according to any one of the preceding claims, wherein, Each of the plurality of subregions (12) is constructed similarly.

5. The method according to any one of claims 1 to 3, wherein, The scattering beam grid (3) is constructed by a matrix / cross arrangement of walls that absorb X-rays and a channel (2) through which X-rays can pass, the channel having a position-dependent inclination, and wherein the collimation direction of the sub-region (12) of the plurality of sub-regions (12) of the collimation unit (11) takes into account the inclination according to the position.

6. The method according to any one of the preceding claims, wherein, The scattering beam grid (3) is constructed by a matrix / cross arrangement of walls that absorb X-rays and the X-ray-transmitting channels (2) thereby constructed, wherein each of the plurality of sub-regions (12) of the collimating unit (11) spans exactly one or an integer multiple thereof of the X-ray-transmitting channels (2).

7. The method according to any one of the preceding claims, wherein, The collimation unit (11) is constructed by a matrix arrangement of optical lenses, wherein each sub-region (12) of the plurality of sub-regions of the collimation unit (11) is constructed by a corresponding optical lens among the optical lenses.

8. The method according to any one of the preceding claims, wherein, The collimation unit (11) may be made of plastic or glass.

9. The method according to any one of claims 1 to 6, wherein, The collimation unit (11) is configured as an adaptable collimation unit, wherein each sub-region (12) of the plurality of sub-regions of the collimation unit (11) is configured as a non-rigid beam shaping element, the beam shaping element being able to switch between at least two states.

10. The method according to any one of claims 1 to 6, wherein, The collimation unit (11) is constructed of a plurality of collimation walls arranged in a cross pattern and a permeable collimation channel located between them. The collimation walls are configured to absorb radiation (13) from the radiation source (9) of the plane. Each sub-region (12) of the plurality of sub-regions of the collimation unit (11) includes one of the permeable collimation channels.

11. The method according to any one of the preceding claims, wherein, The radiation-cured adhesive (5) covers most of the detection element (1).

12. A radiation source module (7) having a planar radiation source (9) and a collimation unit (11) arranged parallel thereto, wherein, The collimation unit (11) is divided into a plurality of sub-regions (12), each sub-region spanning a sub-surface region of the radiation source (9), and wherein each sub-region (12) of the collimation unit (11) is configured to collimate radiation (13) emitted by a sub-surface region of the radiation source (9) belonging to the sub-region, for use in the method according to any one of the preceding claims.

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