Wafer soaking and drying integrated equipment

Abstract

The application provides a wafer soaking and drying integrated device, which comprises a rack, a soaking tank assembled on the rack, a first supporting device for supporting a plurality of wafers in the soaking tank, the first supporting device driving the plurality of wafers to be lifted from the soaking tank and moved out from the tank opening of the soaking tank, a drying assembly assembled on the rack through a guide mechanism, the drying assembly being linearly displaced along the guide mechanism to cover the tank opening of the soaking tank, a second supporting device for supporting the wafers lifted from the tank opening of the soaking tank by the first supporting device, and a drying pipeline for spraying drying gas to the surfaces of the wafers supported by the second supporting device. The application is used to solve the problem that the opening of the cover causes turbulent flow of the chemical agent and affects the process effect of the wafers, and further has the effect of drying the wafers after the wet process to prevent water marks on the surfaces of the wafers due to the residual chemical agent.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment, and more particularly to an integrated wafer immersion and drying device. Background Technology

[0002] The wet process of wafer fabrication, including cleaning, etching, developing, and resist removal, requires the use of a large number of chemical agents, including but not limited to hydrofluoric acid, phosphoric acid, sulfuric acid, deionized water, and hydrochloric acid. Some of these chemical agents are corrosive or highly volatile. In the wet process of wafer fabrication, there is a problem that corrosion can cause irreversible damage to metal components in the corrosion space. At the same time, volatilization can also cause changes in the concentration of chemical solutions, leading to uncontrollable process results or other unpredictable risks.

[0003] To avoid potential problems caused by the volatilization of the aforementioned chemicals, existing wafer wet processing equipment is equipped with a cover plate. By controlling the closing of the cover plate, the exposure time of the chemicals during the wet processing is effectively reduced, thus preventing chemical volatilization. In the aforementioned prior art, the opening and closing of the cover plate is controlled by a cylinder stroke. During the cylinder's movement, the amplitude of its movement may cause significant turbulence in the chemicals within the tank when the cover opens, thereby affecting the wet processing effect on the wafer.

[0004] In view of this, it is necessary to improve the existing wet process equipment to solve the above problems. It should be noted that the above description of the background technology is only for the purpose of clearly and completely explaining the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because these solutions have been described in the background technology section of this application. Summary of the Invention

[0005] The purpose of this invention is to disclose an integrated wafer immersion and drying device to solve the problem in the prior art where opening the cover causes turbulence of chemical agents, which affects the wafer manufacturing process. Furthermore, it has the effect of drying wafers that have undergone wet processing to prevent watermarks from forming on the wafer surface due to chemical residues.

[0006] To achieve the above objectives, the present invention provides an integrated wafer immersion and drying equipment, comprising: a frame, wherein the frame is equipped with an immersion tank, and the immersion tank is provided with a first support device for batch supporting a plurality of wafers, the first support device driving the plurality of wafers to rise from the immersion tank and move out from the opening of the immersion tank;

[0007] The frame is equipped with a drying component via a guide mechanism. The drying component is linearly displaced along the guide mechanism to cover the opening of the soaking tank. The drying component includes a cover and a second support device and a drying pipeline disposed within the cover.

[0008] The cover is driven to move linearly by the guide mechanism to cover the opening of the soaking tank. The second support device receives the wafers that are lifted from the opening of the soaking tank by the first support device. The drying pipeline sprays drying gas onto the surfaces of several wafers received by the second support device.

[0009] As a further improvement of the present invention, the cover includes two first mounting plates arranged parallel to the length direction of the guide mechanism and two second mounting plates arranged perpendicular to the first mounting plates. The two first mounting plates and the two second mounting plates are connected end to end to form a receiving cavity, and the top cover is fixed to the top of the receiving cavity.

[0010] The frame includes a support base and a support plate arranged around the opening of the soaking tank. The support plate is connected end to end to the support base and its top surface is flush with the support base. The guide mechanism is arranged parallel to the length direction of the support plate and the soaking tank. The first mounting plate is connected to the drive end of the guide mechanism.

[0011] As a further improvement of the present invention, the second supporting device includes a clamping mechanism and a flipping mechanism. The clamping mechanism includes a first clamping member and a second clamping member, which are arranged parallel to the length direction of the two second mounting plates.

[0012] The first clamping member and the second clamping member are respectively distributed with a plurality of clamping grooves adapted to the periphery of the wafer on their relatively close sides. The flipping mechanism drives the first clamping member and the second clamping member to move closer or further away from each other so that the plurality of clamps simultaneously clamp or release the wafer.

[0013] As a further improvement of the present invention, the flipping mechanism includes two sets of driving devices, cams and driving shafts that drive the first clamping member and the second clamping member to flip respectively. The driving devices are fixed to the side of the first mounting plate away from the receiving cavity, and the two driving shafts are respectively connected to one end of the first clamping member and the second clamping member in the length direction.

[0014] The drive shaft passes through the first mounting plate and is rotatably connected to the side of the cam away from the drive device. It controls the extension and retraction of the drive end of the drive device, which is selected as a drive cylinder, so that the cam drives the drive end to clamp or release the wafer by the clamping groove of the first clamping member or the second clamping member.

[0015] The drive shaft passes through the first or second clamping member along its length and is rotatably connected to the first mounting plate away from the drive device.

[0016] As a further improvement of the present invention, the cam is eccentrically formed into a hollow portion, the drive end of the drive device is rotatably connected to the drive wheel, the drive wheel is located inside the hollow portion, and the drive end of the drive device extends and retracts to drive the drive wheel to contact different positions inside the hollow portion.

[0017] As a further improvement of the present invention, each of the two second mounting plates is provided with a positioning member on the upper and lower sides of the first clamping member and the second clamping member, and the positioning member is provided with a guide groove corresponding to the clamping groove of the first clamping member and the second clamping member;

[0018] The drying pipeline includes multiple pipes arranged parallel to the length direction of the first clamping member and the second clamping member. Several of the pipes are evenly distributed in the receiving cavity and the top cover, and the pipes have several vent holes.

[0019] As a further improvement of the present invention, the first supporting device includes a supporting basket and a lifting mechanism. The lifting mechanism drives the supporting basket to lift the wafer from the opening of the soaking tank. The supporting basket is connected to the driving end of the lifting mechanism through a connecting frame.

[0020] The supporting basket is evenly distributed along its length with several supporting slots for supporting a wafer, and each of the supporting slots corresponds to one of the clamping slots.

[0021] As a further improvement of the present invention, a guide rod is provided on the upper surface of the support plate and the support base on the side of the soaking tank away from the guide mechanism. The guide rod is arranged parallel to the length direction of the guide mechanism. A guide shaft is provided on the side of the first mounting plate away from the receiving cavity. The guide shaft overlaps the upper surface of the guide rod.

[0022] As a further improvement of the present invention, the top cover is configured as a semi-cylindrical shape with an internal hollow structure, a length equal to the length of the first mounting plate, and a width equal to the length of the second mounting plate, and the support plate is evenly distributed with a plurality of through holes.

[0023] As a further improvement of the present invention, an inlet pipe is provided in the soaking tank, and an outlet pipe is connected to the bottom of the soaking tank.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: A first supporting device installed in the immersion tank simultaneously supports several wafers. Specifically, a batch-gripping robotic arm places several wafers into the first supporting device from the opening of the immersion tank. The cover moves along the guide mechanism toward the immersion tank until it covers the opening of the immersion tank. Chemical reagents are introduced into the immersion tank to achieve the effect of immersing the wafers. Compared with the prior art where the cover is driven by a cylinder to flip and open, the turbulence caused by the movement of the cover to cover the opening of the immersion tank is effectively reduced. This not only avoids the volatilization of chemical reagents but also further ensures the effectiveness of the wet immersion process for the wafers. After soaking is complete, the chemicals in the soaking tank are drained. The first support device moves upwards and out of the opening of the soaking tank and into the cover. The second support device, located in the cover, supports each wafer. Drying gas is introduced into the cover through the drying pipeline to further dry the wafers and effectively avoid watermarks on the wafer surface caused by liquid chemical residue. Attached Figure Description

[0025] Figure 1 This is a schematic diagram illustrating the overall structure of the integrated soaking and drying equipment in this invention;

[0026] Figure 2 This is a schematic diagram illustrating the structure of the present invention, showing that the first supporting device is located inside the soaking tank and the cover does not cover the top of the soaking tank.

[0027] Figure 3 This is a schematic diagram illustrating the cooperative relationship between the drying assembly, the guiding mechanism, and the soaking tank in this invention.

[0028] Figure 4 for Figure 3 Enlarged view of section A in the middle;

[0029] Figure 5 for Figure 3 Enlarged view of section B in the middle;

[0030] Figure 6 This is a schematic diagram illustrating the structure of the present invention, showing the first support device rising from the immersion tank and the second support device correspondingly supporting the wafer.

[0031] Figure 7 This is a schematic diagram illustrating the fit between the guide rod and the guide shaft in this invention.

[0032] Figure 8 This is a schematic diagram illustrating the specific structure of the first supporting device in this invention;

[0033] Figure 9 for Figure 8 Schematic diagram of section C. Detailed implementation manners

[0034] The present invention will be described in detail below in conjunction with the various implementation manners shown in the drawings. However, it should be noted that these implementation manners do not limit the present invention, and any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art according to these implementation manners shall fall within the protection scope of the present invention.

[0035] Refer Figure 1 Figure 9 As shown, a wafer soaking and drying integrated device designed by the present invention, compared with the prior art, simultaneously supports a plurality of wafers 6 through the first supporting device 3 arranged in the soaking tank 2. Specifically, a manipulator (not shown) for batch clamping is used to place a plurality of wafers 6 into the first supporting device 3. The cover body 42 of the drying component 4 moves along the length direction of the guiding mechanism 11 towards the soaking tank 2 until it covers the tank opening 23 of the soaking tank 2. Chemical agents are introduced into the soaking tank 2 to soak the wafers 6 to achieve the wet process effect on the wafers 6. The cover body 42 that moves linearly along the guiding mechanism 11 to cover the tank opening 23 of the soaking tank 2, compared with the opening and closing action of flipping driven by a driving cylinder in the prior art, effectively reduces the degree of turbulence of the chemical agents caused by the movement amplitude of the cover body. While avoiding the volatilization of chemical agents, it further ensures the wet process effect of wafer soaking. After soaking, the chemical agents in the soaking tank 2 are discharged. The first supporting device 3 moves upward to move out of the tank opening 23 of the soaking tank 2 and into the cover body 42. The second supporting device 5 arranged in the cover body 42 correspondingly承接 each wafer 6. Drying gas is introduced into the cover body 42 through the drying pipeline 41 to further achieve the effect of drying the wafers, effectively avoiding the problem of water marks on the wafer surface caused by residual liquid agents.

[0036] Refer Figures 1 to 9 As shown, a wafer soaking and drying integrated device (hereinafter or simply referred to as a soaking and drying device) disclosed in this implementation manner includes: a frame 1, the frame 1 is equipped with a soaking tank 2, and a first supporting device 3 for batch supporting a plurality of wafers 6 is arranged in the soaking tank 2. The first supporting device 3 drives a plurality of wafers 6 to rise from the soaking tank 2 and move out of the tank opening 23 of the soaking tank 2; the frame 1 is equipped with a drying component 4 through a guiding mechanism 11. The drying component 4 linearly moves along the guiding mechanism 11 to cover the tank opening 23 of the soaking tank 2. The drying component 4 includes a cover body 42, a second supporting device 5 arranged in the cover body 42, and a drying pipeline 41; the cover body 42 is driven by the guiding mechanism 11 to linearly move to cover the tank opening 23 of the soaking tank 2. The second supporting device 5承接 the wafers 6 that rise from the tank opening 23 of the soaking tank 2 driven by the first supporting device 3, and the drying pipeline 41 sprays drying gas onto the surfaces of the plurality of wafers 6承接 by the second supporting device 5.

[0037] Reference Figure 1 、 Figure 3 and Figure 7 As shown, the cover body 42 includes two first mounting plates 421 arranged parallel to the length direction of the guiding mechanism 11, and two second mounting plates 422 arranged perpendicular to the first mounting plates 421. The two first mounting plates 421 and the two second mounting plates 422 are connected end to end to enclose a receiving cavity 423, and the top end of the receiving cavity 423 is fixedly connected to the top cover 43; the frame 1 includes a support base 12 arranged around the notch 23 of the soaking tank 2 and a support plate 13. The support plate 13 is connected to the support base 12 and their top surfaces are flush. The guiding mechanism 11 is arranged parallel to the length directions of the support plate 13 and the soaking tank 2. The first mounting plate 421 is connected to the driving end of the guiding mechanism 11. Specifically, a connecting frame 425 is fixedly connected around the bottom ends of the first mounting plate 421 and the second mounting plate 422. The connecting frame 425 extends to the outside beyond the edge of the support plate 13 and is connected to the driving end of the guiding mechanism 11. Guide rods 14 are arranged on the upper surfaces of the support plate 13 and the support base 12 on the side of the soaking tank 2 away from the guiding mechanism 11. The guide rods 14 are arranged parallel to the length direction of the guiding mechanism 11. A guide shaft 424 is arranged on the side of the first mounting plate 421 away from the receiving cavity 423. The guide shaft 424 is lapped on the upper surface of the guide rod 14.

[0038] Specifically, in this embodiment, wafers 6 are batch - placed into the first supporting device 3 by a manipulator (not shown). At this time, the first supporting device 3 is in a state of rising from the notch 23 of the soaking tank 2, and the first supporting device 3 that internally supports several wafers 6 descends into the soaking tank 2. The guiding mechanism 11 is started, and the driving end of the guiding mechanism 11 drives the connecting frame 425 connected thereto to drive the entire cover body 42 to displace along the length direction of the guiding mechanism 11. At the same time, the side of the cover body 42 away from the guiding mechanism 11 is supported by the guide rod 14 against the guide shaft 424 to maintain the stable displacement of the entire cover body 42 until the cover body 42 completely covers the notch 23 of the soaking tank 2. It should be noted that in this embodiment, the guiding mechanism 11 is selected as a linear motor, which has the effect of driving the cover body 42 to displace along the length directions of the support plate 13 and the support base 12. Compared with the prior art method of driving the cover body to flip by a cylinder to control the opening and closing of the notch of the soaking tank, it has a smaller movement amplitude and smaller vibration generated due to displacement. And further, compared with the linear driving methods such as the cooperation of a screw and a nut, the vibration amplitude generated is smaller, thereby further avoiding the problem that the chemical agent turbulence caused by the movement of the cover body affects the manufacturing process effect of the wafers 6. Therefore, in this embodiment, chemical agents can be introduced into the soaking tank 2 during the displacement of the cover body 42, or chemical agents can be introduced into the soaking tank 2 after the cover body 42 covers the soaking tank 2, and neither will have an obvious impact on the manufacturing process effect of the wafers 6.

[0039] Further, in this embodiment, the frame 1 further includes a casing (not shown). The casing can specifically be formed by enclosing six plate bodies. The soaking tank 2 and the drying component 4 are arranged inside the casing (not shown). Two brackets 15 are assembled on one plate body whose length direction is parallel to the guiding mechanism 11. Both ends of the guiding mechanism 11 are respectively connected to the two brackets 15. A guide rod 16 is further arranged above the guiding mechanism 11. The guide rod 16 passes through the connection part between the connecting frame 425 and the driving end of the guiding mechanism 11 to further improve the stability of the linear displacement of the cover body 42.

[0040] Refer Figures 2 to 6 As shown, the second supporting device 5 includes a clamping mechanism 51 and a flipping mechanism 52. The clamping mechanism 51 includes a first clamping member 511 and a second clamping member 512. The first clamping member 511 and the second clamping member 512 are arranged parallel to the length direction of the two second mounting plates 422. A plurality of clamping grooves 513 adapted to the peripheral edge of the wafer 6 are uniformly distributed on the relatively close sides of the first clamping member 511 and the second clamping member 512 respectively. The flipping mechanism 52 drives the first clamping member 511 and the second clamping member 512 respectively to make the clamping grooves 513 relatively close to or away from each other so as to synchronously clamp or release the wafer 6.

[0041] Refer Figures 2 to 6 As shown, the flipping mechanism 52 includes two groups of driving devices 521, cams 522 and driving shafts 523 that respectively drive the first clamping member 511 and the second clamping member 512 to flip. The driving device 521 is fixedly connected to the side of the first mounting plate 421 away from the accommodating cavity 423. The two driving shafts 523 are respectively connected to one end of the first clamping member 511 and the second clamping member 512 in the length direction. After passing through the first mounting plate 421, the driving shaft 523 is rotatably connected to the side of the cam 522 away from the driving device 521. Control the driving end of the driving device 521 selected as a driving cylinder to extend and retract so that the cam 522 drives the first clamping member 511 or the second clamping member 512 to clamp or release the wafer 6 through the driving shaft 523. The driving shaft 523 passes through the first clamping member 511 or the second clamping member 512 in the length direction and is then rotatably connected to the first mounting plate 421 arranged away from the driving device 521. The cam 522 is eccentrically formed with a hollow part 5221. The driving end of the driving device 521 is rotatably connected to a driving wheel 5211. The driving wheel 5211 is located inside the hollow part 5221. The driving end of the driving device 521 extends and retracts to drive the driving wheel 5211 to contact different positions inside the hollow part 5221. One positioning member 53 is provided on both the upper and lower sides of the two second mounting plates 422 where the first clamping member 511 and the second clamping member 512 are located. The positioning member 53 is provided with a guiding groove 531 corresponding to the clamping grooves 513 of the first clamping member 511 and the second clamping member 512.

[0042] Refer Figures 1 to 9 As shown, the first supporting device 3 includes a supporting basket 31 and a lifting mechanism 32. The lifting mechanism 32 drives the supporting basket 31 to lift the wafer 6 from the opening 23 of the soaking tank 2. The supporting basket 31 is connected to the driving end of the lifting mechanism 32 through a connecting frame 33. The supporting basket 31 has several supporting slots 311 evenly distributed along its length to support one wafer 6, and each of the several supporting slots 311 corresponds to one of the clamping slots 513. The drying pipeline 41 includes multiple pipes 411 arranged parallel to the length 512 of the first clamping member 511 and the second clamping member. Several pipes 411 are evenly distributed in the receiving cavity 423 and the top cover 43. The pipes 411 have several vent holes 412. The top cover 43 is set as a semi-cylindrical shape with a hollow interior and a length equal to the length of the first mounting plate 421 and a width equal to the length of the second mounting plate 422. The support plate 13 has several through holes 131 evenly distributed. An inlet pipe 22 is provided inside the soaking tank 2, and an outlet pipe 21 is connected to the bottom of the soaking tank 2.

[0043] Specifically, when the robotic arm (not shown) places several wafers 6 into the support basket 31 of the first support device 3, the support basket 31 is in a state of being raised from the opening 23 of the soaking tank 2. After the wafers 6 are supported, the lifting mechanism 32 drives the support basket 31 to descend as a whole through the connecting frame 33. Figure 2 The entire structure is submerged in the soaking tank 2. At this time, chemical reagents are introduced into the soaking tank 2 through the liquid inlet pipe 22, while simultaneously... Figure 2 The drying assembly 4, located away from the soaking tank 2, is moved along the length of the guide mechanism 11 to cover the opening 23 of the soaking tank 2. The specific process of the guide mechanism 11 driving the drying assembly 4, i.e., driving the cover 42 to move, is described above and will not be repeated here, until the entire drying assembly 4 is moved to the position shown. Figure 6 At the indicated position, the drive end of the guide mechanism 11 stops displacing. At this time, the cover 42 covers the opening 23 of the immersion tank 2. The aforementioned connecting frame 425 remains in contact with the upper surface of the support plate 13 and the support base 12 throughout the overall displacement of the cover 42, thereby providing good sealing performance to prevent the chemical agents from evaporating from the gaps during the wet process of wafer 6 in the immersion tank 2.

[0044] After the wet process of wafer 6 is completed in immersion tank 2, the chemicals in immersion tank 2 are first discharged through outlet pipe 21. (See details...) Figure 1 and Figure 2As shown, the bottom end of the outlet pipe 21 is connected to the collection tank 7 to collect the chemical reagents discharged from the immersion tank 2. After the chemical reagents are discharged from the immersion tank 2, some chemical reagent droplets remain on the surface of the wafer 6. If they are not dried in time, watermarks will form on the surface of the wafer 6, which will further affect the subsequent semiconductor performance. Therefore, in this embodiment, the anti-evaporation function and the drying function are integrated into the drying component 4. The cover 42 constituting the drying component 4 prevents the chemical reagents inside the immersion tank 2 from evaporating during the wet process. Furthermore, the second support device 5 and the drying pipe 41 formed in the cover 42 accelerate the removal and drying of the droplets formed by the residual chemical reagents on the surface of the wafer 6, thereby avoiding the formation of watermarks.

[0045] Specifically, after the chemicals in the soaking tank 2 are discharged, the lifting mechanism 32 again drives the connecting frame 33 to move the supporting basket 31 upwards and lift it from the opening 23 of the soaking tank 2 into the cover 42. During the process of the lifting mechanism 32 moving the supporting basket 31 into the cover 42, the guide groove 531 of the positioning member 53 formed on the second mounting plate 422 guides the wafer 6 so that each wafer 6 can be aligned with the clamping groove 513 of the first clamping member 511 and the second clamping member 512 and can be stably clamped by the first clamping member 511 and the second clamping member 512. After the lifting mechanism 32 raises the flower basket 31 to its highest point, the driving end of the drive device 521 constituting the flipping mechanism 52 retracts, causing the drive wheel 5211 connected to it to apply a lifting force to the upper edge of the hollow portion 5221 of the cam 522. This causes the force-bearing end of the cam 522 to rise, while the end connected to the drive shaft 523 descends, causing the first clamping member 511 and the second clamping member 512 to flip synchronously. This also causes the clamping grooves 513 of the first clamping member 511 and the second clamping member 512 to move closer together and synchronously clamp the edges of several wafers 6 (see details). Figure 6 (As shown).

[0046] After the first clamping member 511 and the second clamping member 512 stably clamp the wafer 6, the lifting mechanism 32 reverses and drives the supporting basket 31 to descend back into the soaking tank 2. The guiding mechanism 11 drives the drying assembly 4 to move away from the soaking tank 2 until it returns to the original position. Figure 2 The position is shown. Simultaneously, IPA vapor and nitrogen are introduced into several pipes 411 constituting the drying pipeline 41. The IPA vapor and hot nitrogen are introduced into the receiving cavity 423 through the vent holes 412 of the pipes 411 and come into contact with the surface of the wafer 6. The IPA vapor is used to accelerate the detachment of residual droplets from the surface of the wafer 6, and the hot nitrogen is used to rapidly dry the wafer 6. The droplets detached from the surface of the wafer 6 can be discharged through several through holes 131 of the support plate 13. After the wafer 6 is dried, the drying assembly 4 is again driven by the guide mechanism 11 to move to... Figure 5At the position shown, the lifting mechanism 32 once again drives the flower basket 31 to rise to the position indicated. Figure 5 At the indicated position, the drive end of the drive device 521 extends to apply force to the lower edge of the hollowed-out portion 5221 via the drive wheel 5211, causing the cam 522 connected to one end of the drive shaft 523 to rotate. This causes the clamping slots 513 of the first clamping member 511 and the second clamping member 512 to release the wafer 6. At this time, the wafer 6 is received by the support basket 31. Then, the lifting mechanism 32 drives the support basket 31 to descend a certain height until the wafer 6 is completely removed from the cover 42. Then, the drying assembly 4 is moved away from above the soaking tank 2, and the dried wafer 6 is removed from the support basket 31 by the robotic arm. It should be noted that in this embodiment, the lifting mechanism 32 is specifically selected as a lifting mechanism with a screw and nut (not shown) driven by a motor, wherein the nut is connected to the top of the connecting frame 33. In this embodiment, by setting the top cover 43 as a semi-cylindrical shape with a hollow interior, the top cover 43 is closer to the shape of the wafer 6, thereby allowing the gas introduced by the pipe 411 in the top cover 43 to have a more uniform contact with the wafer 6.

[0047] In this embodiment, the above-mentioned solution first changes the existing flip-type cover to a translational type, thereby effectively avoiding the problem that the vibration caused by the large amplitude of movement will cause significant turbulence of chemical agents, which will affect the wafer manufacturing process. Furthermore, the anti-volatile function and the drying function are combined into one, and the wafers that have undergone wet processing are dried, thereby effectively avoiding watermarks on the wafer surface due to chemical agent residue.

[0048] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0049] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0050] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer immersion and drying integrated equipment, characterized in that, include: The frame is equipped with an immersion tank, and the immersion tank is provided with a first support device that supports a number of wafers in batches. The first support device drives the wafers to rise from the immersion tank and move them out from the opening of the immersion tank. The frame is equipped with a drying component via a guide mechanism. The drying component is linearly displaced along the guide mechanism to cover the opening of the soaking tank. The drying component includes a cover and a second support device and a drying pipeline disposed within the cover. The cover is driven to move linearly by the guide mechanism to cover the opening of the soaking tank. The second support device receives the wafers that are lifted from the opening of the soaking tank by the first support device. The drying pipeline sprays drying gas onto the surfaces of several wafers received by the second support device.

2. The integrated wafer immersion and drying equipment according to claim 1, characterized in that, The cover includes two first mounting plates arranged parallel to the length direction of the guide mechanism and two second mounting plates arranged perpendicular to the first mounting plates. The two first mounting plates and the two second mounting plates are connected end to end to form a receiving cavity, and the top cover is fixed to the top of the receiving cavity. The frame includes a support base and a support plate arranged around the opening of the soaking tank. The support plate is connected end to end to the support base and its top surface is flush with the support base. The guide mechanism is arranged parallel to the length direction of the support plate and the soaking tank. The first mounting plate is connected to the drive end of the guide mechanism.

3. The integrated wafer immersion and drying equipment according to claim 2, characterized in that, The second supporting device includes a clamping mechanism and a flipping mechanism. The clamping mechanism includes a first clamping member and a second clamping member, which are arranged parallel to the length direction of the two second mounting plates. The first clamping member and the second clamping member are respectively distributed with a plurality of clamping grooves adapted to the periphery of the wafer on their relatively close sides. The flipping mechanism drives the first clamping member and the second clamping member to move closer or further away from each other so that the plurality of clamps simultaneously clamp or release the wafer.

4. The integrated wafer immersion and drying equipment according to claim 3, characterized in that, The flipping mechanism includes two sets of driving devices, cams, and driving shafts that drive the first clamping member and the second clamping member to flip respectively. The driving devices are fixed to the side of the first mounting plate away from the receiving cavity, and the two driving shafts are respectively connected to one end of the first clamping member and the second clamping member in the length direction. The drive shaft passes through the first mounting plate and is rotatably connected to the side of the cam away from the drive device. It controls the extension and retraction of the drive end of the drive device, which is selected as a drive cylinder, so that the cam drives the drive end to clamp or release the wafer by the clamping groove of the first clamping member or the second clamping member. The drive shaft passes through the first or second clamping member along its length and is rotatably connected to the first mounting plate away from the drive device.

5. The integrated wafer immersion and drying equipment according to claim 4, characterized in that, The cam is eccentrically positioned to form a hollow section. The drive end of the drive device is rotatably connected to a drive wheel, which is located inside the hollow section. The drive end of the drive device extends and retracts to drive the drive wheel to contact different positions inside the hollow section.

6. The integrated wafer immersion and drying equipment according to claim 4, characterized in that, Each of the two second mounting plates is provided with a positioning member on the upper and lower sides of the first clamping member and the second clamping member. The positioning member is provided with a guide groove corresponding to the clamping groove of the first clamping member and the second clamping member. The drying pipeline includes multiple pipes arranged parallel to the length direction of the first clamping member and the second clamping member. Several of the pipes are evenly distributed in the receiving cavity and the top cover, and the pipes have several vent holes.

7. The integrated wafer immersion and drying equipment according to claim 3, characterized in that, The first support device includes a support basket and a lifting mechanism. The lifting mechanism drives the support basket to lift the wafer from the opening of the soaking tank. The support basket is connected to the drive end of the lifting mechanism through a connecting frame. The supporting basket is evenly distributed along its length with several supporting slots for supporting a wafer, and each of the supporting slots corresponds to one of the clamping slots.

8. The integrated wafer immersion and drying equipment according to claim 3, characterized in that, A guide rod is provided on the upper surface of the support plate and support base on the side of the soaking tank away from the guide mechanism. The guide rod is arranged parallel to the length direction of the guide mechanism. A guide shaft is provided on the side of the first mounting plate away from the receiving cavity. The guide shaft overlaps the upper surface of the guide rod.

9. The integrated wafer immersion and drying equipment according to claim 2, characterized in that, The top cover is configured as a semi-cylindrical shape with an internal hollow structure, a length equal to that of the first mounting plate, and a width equal to that of the second mounting plate. The support plate has several through holes evenly distributed on it.

10. The integrated wafer immersion and drying equipment according to claim 7, characterized in that, An inlet pipe is provided inside the soaking tank, and an outlet pipe is connected to the bottom of the soaking tank.

Images