Automobile precision part injection mold with efficient cooling forming function
By combining a semiconductor cooling chip and a fan to create a heat dissipation structure, and combining the mechanical linkage between the conductive components and the contacts, the problem of synchronizing the injection mold cooling system with the mold opening and closing process is solved, achieving efficient cooling and precise demolding, and improving the cooling and molding effect and economy of the mold.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-14
- Publication Date
- 2026-03-06
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Existing injection molds have difficulty in achieving precise mechanical linkage between the cooling system and the mold opening and closing process, resulting in mismatched cooling timing, high energy consumption, and insufficient synchronization between the ejector mechanism and the mold opening and closing action, which can easily lead to scratches on parts and insufficient dimensional accuracy.
The system employs a combined heat dissipation structure consisting of a semiconductor cooling chip, heat sink fins, and a fan. Combined with the mechanical linkage between the conductive components and contacts, it achieves precise synchronization between the cooling cycle and the mold opening and closing process. The ejector mechanism is mechanically linked to the upper mold base for mold opening and closing, eliminating the need for additional drive components. The ejector rod automatically resets when the mold is closed.
It enables rapid cooling and recycling of cooling water, reduces ineffective energy consumption, ensures the efficiency and economy of cooling molding, avoids part deformation and scratches, and guarantees the dimensional accuracy and appearance quality of precision parts.
Smart Images

Figure CN121608352A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of injection mold technology, specifically to an injection mold for precision automotive parts with efficient cooling and molding capabilities. Background Technology
[0002] Injection molding, also known as injection molding, is a method in which plastic material, which is completely melted by stirring with a screw at a certain temperature, is injected into a mold cavity under high pressure, and then cooled and solidified to obtain a molded part. It is a molding method that combines injection and molding and can be used for automotive parts.
[0003] Existing injection molds are not easy to achieve precise mechanical linkage between the cooling system and the mold opening and closing process during use, which can easily lead to problems such as mismatch in cooling timing and high ineffective energy consumption. They are also not easy to achieve synchronous linkage between the ejector mechanism and the mold opening and closing action. The ejector component has insufficient reset accuracy and is prone to protruding from the mold groove, affecting the injection molding effect. During demolding, uneven force can also cause scratches on the parts.
[0004] Based on this, an injection mold for precision automotive parts with efficient cooling and molding function is now provided, which can eliminate the drawbacks of existing devices. Summary of the Invention
[0005] The purpose of this invention is to provide an injection mold for precision automotive parts with efficient cooling and molding functions, so as to solve the problem in the prior art that it is not easy to achieve precise mechanical linkage between the cooling system and the mold opening and closing process.
[0006] To achieve the above objectives, the present invention provides the following technical solution: An injection mold for automotive precision parts with efficient cooling and molding function includes a base, a lower mold base is provided on the top of the base, guide pillars are provided at the four corners of the top of the lower mold base, an upper mold base is slidably installed on the outside of the four guide pillars, and the upper mold base and the lower mold base are adapted to each other. A cooling mechanism and a water pump are provided on one side of the top of the base. The cooling mechanism includes a water tank, which is located on top of the base. A top cover is provided on the top of the water tank, and a sealing ring is provided between the top cover and the water tank. A semiconductor cooling chip is located at the bottom of the top cover, and heat dissipation fins are provided on the top of the semiconductor cooling chip. The heat dissipation fins penetrate the top cover and extend to the outside. A condenser tube is located inside the lower mold base. One end of the condenser tube is connected to the cooling mechanism via a conduit, and the other end is connected to the output end of a water pump via a conduit. The input end of the water pump is connected to the water tank via a conduit. A conductive element is provided on one side of the upper mold base, and the conductive element is located directly above the water pump. A contact point is provided on the top of the water pump, and the contact point is compatible with the conductive element.
[0007] Preferably, a heat dissipation mechanism is provided on one side of the upper mold base.
[0008] Preferably, the heat dissipation mechanism includes a mounting plate, which is fixedly installed with the upper mold base. A first mounting groove is provided on the top of the mounting plate, and a fan is installed on the top of the mounting plate through the first mounting groove. A second mounting groove is provided on the top of the mounting plate and on both sides of the first mounting groove. A locking block is slidably installed on the top of the mounting plate through the second mounting groove.
[0009] Preferably, a first spring is provided inside the second mounting groove, one end of the first spring is fixedly connected to the locking block, and the other end is fixedly connected to the mounting plate.
[0010] Preferably, the top of the base and both sides of the lower mold base are provided with sliding grooves, and the top of the base is provided with a material ejection mechanism through the sliding grooves.
[0011] Preferably, the ejector mechanism includes two sliders, which are slidably mounted on the top of the base via two grooves. The top of each slider is provided with a first fixed seat and a guide block. A second fixed seat is fixedly mounted on both sides of the upper mold base. A connecting rod is rotatably mounted between the first fixed seat and the second fixed seat via a pin.
[0012] Preferably, the lower mold base has a third mounting groove inside, and a top plate is slidably mounted inside the third mounting groove. The two ends of the top plate pass through the lower mold base and are rotatably mounted with guide wheels, which are adapted to the guide blocks.
[0013] Preferably, the top of the lower mold base is provided with a ejector hole, and the top of the ejector plate is fixedly installed with an ejector rod. The top end of the ejector rod passes through the ejector hole, penetrates the lower mold base, and extends to the outside.
[0014] Preferably, a second spring is provided inside the third mounting groove and at the top of the top plate, with the bottom end of the second spring fixedly connected to the top plate and the top end fixedly connected to the lower mold base.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. This invention adopts a combined heat dissipation structure of semiconductor cooling chip, heat sink fins and fan, which can quickly reduce the temperature of cooling water in the water tank and ensure the stability of low temperature cooling water supply; at the same time, through the mechanical linkage of the conductive parts and contacts, the cooling cycle and the mold opening and closing process are precisely synchronized, the mold closing automatically turns on the water for cooling and the mold opening automatically stops the water, reducing ineffective energy consumption and further improving the efficiency and economy of cooling molding.
[0016] 2. The ejector mechanism of this invention is mechanically linked with the mold opening and closing action of the upper mold base, without the need for additional driving components. When the mold is closed, the ejector rod automatically resets to be flush with the bottom of the mold groove, without affecting the injection molding. When the mold is opened, the part is automatically and smoothly ejected, avoiding deformation and scratches of the parts due to uneven force, and ensuring the dimensional accuracy and appearance quality of precision parts. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention.
[0018] Figure 2 This is a schematic diagram of the water pump installation structure of the present invention.
[0019] Figure 3 This is a schematic diagram of the cooling mechanism of the present invention.
[0020] Figure 4 This is a schematic diagram of the heat dissipation mechanism of the present invention.
[0021] Figure 5 This is a schematic diagram of the top material mechanism of the present invention.
[0022] Figure 6 This is a schematic diagram of the second spring mounting structure of the present invention.
[0023] Figure reference numerals: 1. Base; 2. Lower mold base; 3. Guide pillar; 4. Upper mold base; 5. Cooling mechanism; 51. Water tank; 52. Top cover; 53. Semiconductor cooling chip; 54. Heat dissipation fins; 6. Heat dissipation mechanism; 61. Mounting plate; 62. First mounting slot; 63. Fan; 64. Second mounting slot; 65. Locking block; 66. First spring; 7. Slide groove; 8. Ejector mechanism; 81. Slider; 82. First fixed seat; 83. Second fixed seat; 84. Connecting rod; 85. Guide block; 86. Ejector plate; 87. Guide wheel; 88. Third mounting slot; 89. Second spring; 810. Ejector hole; 811. Ejector rod; 9. Water pump; 10. Contact point; 11. Conductor. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments.
[0025] In one embodiment, such as Figures 1-6 As shown, an injection mold for automotive precision parts with efficient cooling and molding function includes a base 1, a lower mold base 2 is provided on the top of the base 1, and guide pillars 3 are provided at the four corners of the top of the lower mold base 2. An upper mold base 4 is slidably installed on the outside of the four guide pillars 3, and the upper mold base 4 is adapted to the lower mold base 2. A cooling mechanism 5 and a water pump 9 are provided on one side of the top of the base 1. The cooling mechanism 5 includes a water tank 51, which is located on the top of the base 1. A top cover 52 is provided on the top of the water tank 51, and a sealing ring is provided between the top cover 52 and the water tank 51. A semiconductor cooling chip 53 is provided at the bottom of the top cover 52, and a heat dissipation fin 54 is provided on the top of the semiconductor cooling chip 53. The fins of the heat dissipation fin 54 penetrate the top cover 52 and extend to the outside. A condenser tube is provided inside the lower mold base 2. One end of the condenser tube is connected to the cooling mechanism 5 through a conduit, and the other end is connected to the output end of the water pump 9 through a conduit. The input end of the water pump 9 is connected to the water tank 51 through a conduit. A conductor 11 is provided on one side of the upper mold base 4, and the conductor 11 is located directly above the water pump 9. A contact 10 is provided on the top of the water pump 9, and the contact 10 is compatible with the conductor 11.
[0026] In this embodiment, the water tank 51 stores and circulates cooling water. The sealing ring between the top cover 52 and the water tank 51 effectively prevents cooling water leakage. The semiconductor cooling chip 53 can quickly reduce the temperature of the cooling water in the water tank 51. The heat dissipation fins 54 efficiently conduct the heat generated by the semiconductor cooling chip 53 during operation to the outside, avoiding overheating of the cooling element and resulting in a decrease in cooling efficiency. The condenser tube inside the lower mold base 2 fits the cavity distribution and forms a complete circulation loop with the cooling mechanism 5 and the water pump 9. The water pump 9 provides continuous power for the cooling water circulation, ensuring that the cooling water flows quickly through the condenser tube to absorb the heat of the cavity, realizing rapid and uniform cooling and molding of automotive precision parts. The conductor 11 on one side of the upper mold base 4 is adapted to the contact 10 on the top of the water pump 9. The water pump 9 is triggered to start by mechanical contact when the mold is closed and automatically disconnected to stop the water pump 9 when the mold is opened, realizing precise linkage between the cooling circulation and the mold opening and closing process, reducing ineffective energy consumption.
[0027] A heat dissipation mechanism 6 is provided on one side of the upper mold base 4. The heat dissipation mechanism 6 includes a mounting plate 61, which is fixedly installed with the upper mold base 4. A first mounting groove 62 is provided on the top of the mounting plate 61, and a fan 63 is mounted on the top of the mounting plate 61 through the first mounting groove 62. A second mounting groove 64 is provided on the top of the mounting plate 61 and on both sides of the first mounting groove 62. A locking block 65 is slidably mounted on the top of the mounting plate 61 through the second mounting groove 64. The interior of the second mounting groove 64 is provided with... A first spring 66 is provided, with one end of the first spring 66 fixedly connected to the locking block 65 and the other end fixedly connected to the mounting plate 61. During the daily use and maintenance of the heat dissipation mechanism 6, the locking block 65 is always in close contact with both sides of the fan 63 under the elastic action of the first spring 66, so as to realize the quick locking and fixing of the fan 63 and prevent the fan 63 from loosening during operation. If the fan 63 needs to be disassembled for maintenance, simply push the locking block 65 to both sides to compress the first spring 66, and the fan 63 can be taken out from the first mounting slot 62. The operation is convenient and efficient.
[0028] The base 1 has grooves 7 on its top and on both sides of the lower mold base 2. A material ejection mechanism 8 is mounted on the top of the base 1 via the grooves 7. The material ejection mechanism 8 includes two sliders 81, which are slidably mounted on the top of the base 1 via the two grooves 7. A first fixed seat 82 and a guide block 85 are respectively mounted on the top of each slider 81. Second fixed seats 83 are fixedly mounted on both outer sides of the upper mold base 4. The first fixed seats 82 and the second fixed seats 83 are rotatably mounted via pins. A connecting rod 84 is provided. A third mounting groove 88 is provided inside the lower mold base 2. A top plate 86 is slidably mounted inside the third mounting groove 88. Both ends of the top plate 86 penetrate the lower mold base 2 and are rotatably mounted with guide wheels 87. The guide wheels 87 are adapted to guide blocks 85. A top ejector hole 810 is provided at the top of the lower mold base 2. A top ejector rod 811 is fixedly mounted at the top of the top plate 86. The top end of the top ejector rod 811 penetrates the lower mold base 2 through the top ejector hole 810 and extends to the outside. The third mounting... A second spring 89 is installed inside the groove 88 and at the top of the top plate 86. The bottom end of the second spring 89 is fixedly connected to the top plate 86, and the top end is fixedly connected to the lower mold base 2. The sliding groove 7 on the base 1 allows the slider 81 to slide smoothly without jamming, ensuring the normal operation of the ejector mechanism 8. The second fixed seat 83 of the upper mold base 4 is connected to the first fixed seat 82 of the slider 81 through the connecting rod 84. When the upper mold base 4 opens and closes the mold, it can directly drive the slider 81 to move left and right without the need for additional drive components. The guide on the slider 81 The guide wheels 87 at both ends of the block 85 and the ejector plate 86 roll together, which can convert the left and right movement of the slider 81 into the up and down movement of the ejector plate 86; the third mounting slot 88 is used to install the ejector plate 86 and the second spring 89. The second spring 89 can reset the ejector plate 86. When the mold is closed, the top of the ejector rod 811 is just flush with the bottom of the mold groove of the lower mold base 2, and will not protrude and affect the molding of the part; the ejector rod 811 extends precisely through the ejector hole 810, which can smoothly eject the cooled automotive precision parts and avoid deformation or scratches when the parts are demolded.
[0029] The above embodiment discloses an injection mold for automotive precision parts with efficient cooling and molding function. When the cooling mechanism 5 is activated, the semiconductor cooling chip 53 in the water tank 51 is powered on and operates to cool the cooling water in the water tank 51. The heat generated during the cooling process is transferred to the outside through the heat dissipation fins 54 to ensure cooling efficiency. When the mold is closed, the upper mold base 4 moves downward along the guide post 3. During this process, the upper mold base 4 drives the second fixed seats 83 on both sides to move downward synchronously. Through the transmission cooperation of the connecting rod 84 between the second fixed seat 83 and the first fixed seat 82, the two sliders 81 are driven to move outward along the slide groove 7 of the base 1. The guide block 85 at the top of the slider 81 separates to both ends. At this time, the second spring 89 inside the third mounting groove 88 releases the elastic restoring force, pushing the ejector plate 86 downward, so that the top of the ejector rod 811 is flush with the bottom of the mold groove of the lower mold base 2, avoiding the ejector rod 811 from protruding and affecting the injection molding. When the upper mold base 4 and the lower mold base 2 are tightly fitted, the guide part 11 on one side of the upper mold base 4 contacts the contact point 10 at the top of the water pump 9, triggering the water pump 9 to start. At the same time, the fan 63 starts, accelerating the air circulation around the heat dissipation fins 54, further improving the cooling effect. After the water pump 9 is running, it draws out the cooled water from the water tank 51 and delivers it to the condenser tube inside the lower mold base 2 through the conduit. The cooling water circulates in the condenser tube, quickly absorbing the heat generated by the injection molding in the mold cavity. After the heat exchange is completed, the warm water flows back to the water tank 51 through the conduit, realizing the circulation and cooling of the cooling water, and ensuring that the precision automotive parts are cooled and formed quickly and evenly inside the cavity. After the injection molding process is completed and cooled, the mold opens, the upper mold base 4 moves upward along the guide post 3, the guide part 11 separates from the contact point 10, the water pump 9 stops running, and the cooling cycle terminates synchronously. At the same time, the upper mold base 4 drives the second fixed base 83 to move upward, and pulls the first fixed base 82 through the connecting rod 84, driving the two sliders 81 to slide along the slide groove 7 towards the inside of the mold. The two guide blocks 85 move closer to each other, and the guide blocks 85 roll in cooperation with the guide wheels 87 at both ends of the ejector plate 86, pushing the ejector plate 86 to move upward and compressing the second spring 89. The ejector rod 811 at the top of the ejector plate 86 then extends upward out of the ejector hole 810, ejecting the cooled and formed automotive precision parts from the cavity of the lower mold base 2, completing the demolding operation.
[0030] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An automobile precision part injection mold with high-efficiency cooling forming function, comprising a base (1), the top of the base (1) is provided with a lower mold base (2), the top of the lower mold base (2) is provided with a guide column (3) at each corner, the outside of the four guide columns (3) is slidably installed with an upper mold base (4), and the upper mold base (4) is matched with the lower mold base (2), one side of the top of the base (1) is provided with a cooling mechanism (5) and a water pump (9); characterized in that the cooling mechanism (5) comprises a water storage tank (51), the water storage tank (51) is arranged on the top of the base (1), the top of the water storage tank (51) is provided with a top cover (52), and a sealing ring is arranged between the top cover (52) and the water storage tank (51), the bottom of the top cover (52) is provided with a semiconductor refrigeration fin (53), the top of the semiconductor refrigeration fin (53) is provided with a heat dissipation fin (54), the fin of the heat dissipation fin (54) penetrates through the top cover (52) and extends to the outside, the inside of the lower mold base (2) is provided with a condenser pipe, one end of the condenser pipe is connected with the cooling mechanism (5) through a pipe, the other end is connected with the output end of the water pump (9) through a pipe, the input end of the water pump (9) is connected with the water storage tank (51) through a pipe, one side of the upper mold base (4) is provided with a lead-through part (11), and the lead-through part (11) is located directly above the water pump (9), the top of the water pump (9) is provided with a contact (10), and the contact (10) is matched with the lead-through part (11).
2. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 1, characterized in that, One side of the upper mold base (4) is provided with a heat dissipation mechanism (6).
3. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 2, characterized in that, The heat dissipation mechanism (6) comprises a mounting plate (61), the mounting plate (61) is fixedly installed with the upper mold base (4), the top of the mounting plate (61) is provided with a first mounting groove (62), the top of the mounting plate (61) is installed with a fan (63) through the first mounting groove (62), the top of the mounting plate (61) is provided with a second mounting groove (64) on both sides of the first mounting groove (62), and the top of the mounting plate (61) is slidably installed with a clamping block (65) through the second mounting groove (64).
4. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 3, characterized in that, The inside of the second mounting groove (64) is provided with a first spring (66), one end of the first spring (66) is fixedly connected with the clamping block (65), and the other end is fixedly connected with the mounting plate (61).
5. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 1, characterized in that, The top of the base (1) and the two sides of the lower mold base (2) are both provided with a sliding groove (7), and the top of the base (1) is provided with a ejection mechanism (8) through the sliding groove (7).
6. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 5, characterized in that, The ejection mechanism (8) comprises two sliding blocks (81), the two sliding blocks (81) are slidably installed on the top of the base (1) through two sliding grooves (7), the top of each sliding block (81) is provided with a first fixing seat (82) and a guide block (85), the outside of the upper mold base (4) is fixedly installed with a second fixing seat (83) on both sides, and the first fixing seat (82) and the second fixing seat (83) are rotatably installed with a connecting rod (84) through a pin shaft.
7. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 6, characterized in that, The inside of the lower die seat (2) is provided with a third installation groove (88), the inside of the third installation groove (88) is slidably provided with a material pushing plate (86), both ends of the material pushing plate (86) penetrates the lower die seat (2) and is rotatably provided with a guide wheel (87), the guide wheel (87) is matched with a guide block (85).
8. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 7, characterized in that, The top of the lower die seat (2) is provided with a material pushing hole (810), the top of the material pushing plate (86) is fixedly provided with a material pushing rod (811), the top end of the material pushing rod (811) penetrates the lower die seat (2) through the material pushing hole (810) and extends to the outside.
9. The injection mold for precision parts of an automobile with high-efficiency cooling forming function according to claim 8, characterized in that, The inside of the third installation groove (88) and the top of the material pushing plate (86) are provided with a second spring (89), the bottom end of the second spring (89) is fixedly connected with the material pushing plate (86), and the top end is fixedly connected with the lower die seat (2).