Circuit board fault rapid positioning device and method based on multi-channel thermal imaging

Abstract

The invention discloses a circuit board fault rapid positioning device and method based on multichannel thermal imaging, and relates to the technical field of circuit board fault detection, in particular to the circuit board fault rapid positioning device and method based on multichannel thermal imaging. The device comprises a shell, an upper cover plate which is arranged at the upper end of the shell and is provided with an infrared transmission window, and a placing plate for placing a circuit board to be tested. And a multi-channel infrared sensor array and a signal processing and main control circuit board are arranged in the infrared sensor. The method comprises the following steps: synchronously acquiring heat distribution data of the circuit board through the sensor array, and comparing the heat distribution data with pre-stored reference data by the processing circuit. And when the difference value between the temperature data of a certain area and the reference value exceeds a preset threshold value, the alarm indicating lamp is driven to give an alarm, so that rapid and non-contact positioning of the fault area of the circuit board is realized. The device is compact in structure and high in detection efficiency.

Description

Technical Field

[0001] This invention relates to the field of circuit board fault detection technology, specifically to a device and method for rapid fault location on circuit boards based on multi-channel thermal imaging. Background Technology

[0002] As electronic devices rapidly evolve towards higher integration, higher power density, and miniaturization, the complexity of circuit boards is increasing daily, making their reliability and stability crucial to overall system performance. Under normal operating conditions, the components on a circuit board generate specific heat distributions due to power consumption. Once faults such as short circuits, overloads, component aging, or poor soldering occur, the temperature rise characteristics of localized areas often change significantly, manifesting as abnormal hot spots or an unbalanced overall temperature distribution. Therefore, temperature monitoring and thermal distribution analysis of circuit boards are an efficient and direct non-contact method for fault prediction, rapid location, and failure analysis.

[0003] Existing technologies for temperature detection and fault location on circuit boards have several limitations. Traditional methods, such as manual visual inspection or observation with a magnifying glass, are inefficient, heavily reliant on operator experience, and unable to detect potential, pre-existing heat-generating faults that have not yet caused physical deformation. Contact-type temperature measurement tools, such as thermocouples or resistance temperature detectors (RTDs), require the sensor probe to physically contact the measured point. This can introduce measurement errors due to improper contact pressure or the use of thermal grease, and the limited space on densely packed circuit boards makes it difficult to arrange multiple measurement points, resulting in an incomplete reflection of the overall heat distribution. More importantly, the contact process itself carries a short-circuit risk, potentially causing secondary damage to delicate circuits. Furthermore, these methods struggle to achieve dynamic, real-time temperature field monitoring.

[0004] In recent years, single-point or scanning infrared thermometers and infrared thermal imagers have been applied. Single-point infrared thermometers can only acquire the temperature of a tiny area at a time. To scan the entire circuit board, manual or complex motion mechanisms are required for point-by-point measurement, a time-consuming process that cannot capture transient thermal changes and is unsuitable for scenarios requiring rapid troubleshooting or online monitoring. While high-performance infrared thermal imagers can acquire thermal distribution images of the entire field of view at once, they are usually very expensive, have complex data processing systems, and often require the lens to be close to the circuit board to achieve high spatial resolution. This is not suitable for situations where testing space is limited or multiple circuit boards need to be tested in parallel. At the same time, general-purpose thermal imagers are not specifically designed for circuit board fault location. Their software usually lacks the function of quickly comparing and alarming typical circuit board fault thermal characteristics, requiring operators to have strong experience in infrared image interpretation, resulting in limited automation.

[0005] Therefore, the industry urgently needs a circuit board fault detection solution that can be fast, comprehensive, non-contact, automated, and relatively cost-effective. An ideal device should be able to simultaneously capture thermal distribution information of the entire circuit board or key areas, automatically identify abnormal temperature zones and provide intuitive alerts through rapid comparison with standard templates. This would free technicians from tedious point-by-point measurements and complex image analysis, greatly improving the efficiency of production testing, repair diagnosis, and quality control. Summary of the Invention

[0006] The purpose of this invention is to provide a device and method for rapid fault location of circuit boards based on multi-channel thermal imaging. The device synchronously collects thermal distribution data of the circuit board through a multi-channel infrared sensor array, and automatically compares the data with the reference data after signal processing and main control circuit board. Once an abnormal temperature area is detected, an alarm is triggered, thereby achieving efficient, accurate and non-contact location of faulty components on the circuit board.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a device and method for rapid fault location of circuit boards based on multi-channel thermal imaging. The core structure of the device includes a housing. A top cover is mounted on the upper end of the housing, and the surface of the top cover has an infrared transmission window that allows infrared light to pass through. At the lower end of the housing, a support column is provided, and the bottom end of the support column is connected to a placement plate for supporting the circuit board to be inspected.

[0008] Furthermore, an alarm indicator light for providing visual alarm signals is installed on the front panel of the device housing. At the rear of the device housing, a cooling fan for active heat dissipation and a power interface for connecting to an external power source to obtain electrical power are provided.

[0009] Furthermore, within the internal space of the device housing, a sensor mounting plate is provided for fixing and installing the sensors. Below this sensor mounting plate, a multi-channel infrared sensor array for simultaneously detecting the temperature at multiple points is installed. Simultaneously, a signal processing and main control circuit board for signal analysis, calculation, and overall control is also located inside the device housing.

[0010] Furthermore, the multi-channel infrared sensor array is fixedly mounted on the sensor mounting plate in a regular M-row by N-column matrix. Also, the photosensitive surface of each individual sensor unit in the array faces vertically toward the infrared transmission window positioned above.

[0011] Furthermore, the signal processing and main control circuit board is electrically connected to the multi-channel infrared sensor array, alarm indicator lights, cooling fan, and power interface via physical cables. This main control circuit board is responsible for distributing the necessary power to all connected functional components and for transmitting control and data signals between itself and the sensor array and alarm indicator lights.

[0012] Furthermore, the sensor fixing plate is arranged in parallel on the inner side of the upper cover plate, and the two are fixedly connected by the inner wall structure of the device housing. Throughout the entire structure, the sensor fixing plate and the upper cover plate always maintain a pre-designed fixed distance.

[0013] Furthermore, a cooling fan is mounted on the rear side panel of the device housing, with its air outlet or inlet directly connected to the external environment. Its main function is to drive airflow and facilitate air exchange between the internal space of the device and the external environment.

[0014] Furthermore, the electrical signal input terminal of the alarm indicator light is connected via a line to a control port on the signal processing and main control circuit board, which is designated for outputting control signals. The operating status of the alarm indicator light, such as being on, flashing, or off, is directly driven and controlled by the electrical signal output by the main control circuit board based on the internal logic analysis results.

[0015] Furthermore, the method includes a core step: First, using a multi-channel infrared sensor array within the device, the infrared radiation emitted by the circuit board under test, placed on the lower mounting plate, is synchronously acquired to obtain thermal data representing its operating temperature distribution. Subsequently, this real-time acquired thermal distribution data is transmitted to the signal processing and main control circuit board within the device. This circuit board compares and analyzes the received real-time data with pre-stored reference temperature data measured under normal conditions.

[0016] Furthermore, the method includes a judgment and response step: during the signal processing and comparison of real-time temperature data with reference temperature data by the main control circuit board, if it is found that the difference between the currently acquired real-time temperature data of the circuit board area monitored by a specific sensor channel and the pre-stored reference temperature data of that area exceeds a pre-set safety threshold, then the main control circuit board will immediately generate a corresponding electrical drive signal. This drive signal is sent to the alarm indicator light, thereby controlling the alarm indicator light to emit a specific light signal to indicate the fault location or abnormal status.

[0017] This invention provides a device and method for rapid fault location on circuit boards based on multi-channel thermal imaging, which has the following beneficial effects: The device features an integrated housing design, resulting in a compact structure with clearly defined functional zones. The housing provides overall mechanical support and protection, with a top cover featuring an infrared transmission window. This window allows unobstructed infrared radiation to pass through while effectively preventing external dust from contaminating the internal precision sensors. The supporting columns at the bottom of the housing and the board placement plate for the circuit board under test (DUT) form a stable testing station, ensuring that the DUT can be quickly and accurately placed in a fixed testing position below the sensor array. This standardization and speed of the testing process improves repeatability and ease of operation.

[0018] The core of the device is a multi-channel infrared sensor array, fixed to a sensor mounting plate in an M x N matrix configuration. This array layout is key to simultaneously acquiring temperature data from dozens or even hundreds of discrete points on the circuit board plane without moving the sensors or the circuit board under test. All sensor units have their photosensitive surfaces perpendicular to the infrared transmission window, ensuring optimal signal reception. Compared to traditional single-point scanning or expensive area array thermal imagers, this multi-channel array design effectively balances cost and performance while achieving rapid and comprehensive temperature sampling (the core of "rapid positioning"), making it particularly suitable for applications involving targeted, batch testing of circuit boards of specific sizes.

[0019] The signal processing and main control circuit board, acting as the "brain" of the device, integrates and manages all electrical components via cables. It not only powers the multi-channel infrared sensor array, alarm indicators, and cooling fans and collects sensor data, but also runs the core fault diagnosis algorithm. The sensor mounting plate is parallel to the top cover and maintains a predetermined distance. This design ensures the installation accuracy and flatness of the sensor array while also providing space for airflow and cable routing, which is beneficial for internal thermal management and electromagnetic compatibility.

[0020] The integrated cooling fan and alarm indicator lights embody practicality and intelligence. The cooling fan, mounted at the rear of the casing, effectively dissipates heat generated by the internal electronic components (especially the signal processing circuit board and the multi-channel sensor array itself) through convection, maintaining a stable internal operating temperature and ensuring sensor measurement accuracy and long-term system reliability. The alarm indicator lights serve as an intuitive human-machine interface, their status entirely driven by the signal processing and main control circuit board. When a fault is detected, the indicator lights provide immediate and clear visual alarms through different methods such as lighting and flashing, allowing operators to obtain detection results without having to consult complex data or screens, greatly simplifying operation.

[0021] The fault rapid location method contained in this invention transforms the aforementioned hardware advantages into an efficient detection process. Its core lies in the synchronous and instantaneous acquisition of thermal distribution data of the entire area of ​​the circuit board under test through a multi-channel infrared sensor array, and its immediate transmission to the main control circuit board. At the software level, the main control circuit board rapidly compares and analyzes the real-time multi-point temperature data with a pre-stored baseline temperature distribution model established under normal conditions. This comparison is not a simple single-point threshold judgment, but rather an analysis based on differences in spatial distribution patterns.

[0022] The method's advancement is further reflected in its automated decision-making and alarm mechanisms. The system presets a reasonable temperature deviation threshold. Once comparative analysis reveals that the difference between the real-time temperature data of one or more sensor channels and the baseline data exceeds the preset safety threshold, the signal processing and main control circuit board immediately determines that abnormal heating exists in that area. Subsequently, the circuit board automatically generates corresponding drive signals to precisely control the alarm indicator light to change its state and issue an alarm indication. This process, from data acquisition and analysis to alarm output, is completed automatically in a very short time, achieving a fully automated closed loop from "thermal imaging detection" to "fault location indication," truly achieving the goal of "rapid location." This significantly reduces reliance on operator skills and greatly improves the efficiency and consistency of circuit board fault detection, making it particularly suitable for high-efficiency, high-paced application environments such as final inspection on production lines and troubleshooting at maintenance stations. Attached Figure Description

[0023] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the overall structure of the present invention. Figure 3 ; Figure 4 This is a schematic diagram of the internal structure of the overall structure of the present invention.

[0025] Part Name: Device housing 1; top cover 2; infrared transmission window 3; support column 4; test circuit board placement board 5; alarm indicator light 6; cooling fan 7; power interface 8; sensor mounting plate 9; multi-channel infrared sensor array 10; signal processing and main control circuit board 11. Detailed Implementation

[0026] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses consistent with some aspects of this disclosure as detailed in the appended claims.

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] How to use: I. Equipment Preparation and Initialization 1. Place the device on a stable, vibration-free workbench, ensuring that the device housing 1 is stably supported by the support column 4 and that the test circuit board placement plate 5 is kept horizontal to avoid tilting or displacement of the circuit board during placement.

[0029] Inspect the infrared transmission window 3 on the surface of the top cover 2, and clean the window with a soft cloth to ensure that it is free of dust, oil or other obstructions, so as to ensure efficient transmission of infrared radiation and avoid distortion of thermal imaging data.

[0030] Connect the external power cord to the power interface 8 at the rear of the device casing 1 to supply power to the device. At this time, the signal processing and main control circuit board 11 begins automatic initialization, and the internal circuitry enters standby mode. The user can observe the alarm indicator light 6; if it briefly illuminates and then goes out, it indicates that the power supply is normal.

[0031] Ensure that the cooling fan 7 is installed on the rear side wall of the device housing 1, with its air outlet or inlet unobstructed from the external environment, to ensure effective air exchange during device operation and prevent overheating of internal components. The cooling fan 7 is typically controlled by the signal processing and main control circuit board 11 and starts automatically after the device starts operating.

[0032] II. Reference Temperature Data Acquisition and Storage 1. Select a known, functional circuit board of the same model and place it stably on the test board 5. Adjust the position of the circuit board so that it completely covers the sensing area directly below the multi-channel infrared sensor array 10, ensuring that all key components of the circuit board are within the monitoring range of the sensor array.

[0033] The data acquisition function of the activation device is initiated. A multi-channel infrared sensor array 10 is fixedly mounted on the sensor mounting plate 9 in an M x N matrix configuration. The photosensitive surface of each sensor unit faces perpendicularly towards the infrared transmission window 3, thereby synchronously acquiring the thermal distribution data of the circuit board under normal operating conditions. The data is transmitted in real-time to the signal processing and main control circuit board 11 via cables.

[0034] The signal processing and main control circuit board 11 processes the received thermal distribution data, including temperature calibration, noise filtering, and spatial mapping, to generate reference temperature data for each sensor unit channel. This reference data represents the thermal characteristics of the circuit board under normal conditions and is stored in the circuit board's non-volatile memory as a reference standard for subsequent fault comparison.

[0035] After the baseline data acquisition is completed, the normal circuit board is removed, and the device can enter the test mode. Note that the sensor fixing plate 9 is set parallel to the inside of the upper cover plate 2. The two are fixedly connected through the inner wall of the device housing 1 and maintain a predetermined distance. This structure ensures the stability of the optical path between the multi-channel infrared sensor array 10 and the infrared transmission window 3, and improves data consistency.

[0036] III. Fault Detection Operation of the Circuit Board Under Test 1. Place the circuit board under test (TBD) on the TBD placement plate 5, ensuring its position is consistent with that used during baseline data acquisition. Alignment can be aided by positioning markers or fixtures to minimize the impact of placement errors on the test results.

[0037] The fault detection process is initiated. The multi-channel infrared sensor array 10 synchronously acquires the thermal distribution data of the circuit board under test under the same operating conditions (such as power-on operation) again, and transmits the real-time temperature data to the signal processing and main control circuit board 11. During the transmission, the signal processing and main control circuit board 11 distributes power and signal channels to the multi-channel infrared sensor array 10 through cables to ensure data synchronization.

[0038] The signal processing and main control circuit board 11 calls the pre-stored reference temperature data and compares the real-time temperature data with the reference data channel by channel. The comparison is based on the region corresponding to each sensor unit, and the difference between the real-time temperature and the reference temperature is calculated.

[0039] IV. Fault Location and Alarm Indication 1. When the difference between the real-time temperature data of a certain channel area and the reference temperature data in the comparison results exceeds a preset threshold, the signal processing and main control circuit board 11 determines that there is a temperature anomaly in that area and immediately generates a drive signal. The threshold is preset according to the thermal design specifications of the circuit board, usually taking into account the normal temperature rise range of the components.

[0040] The drive signal is transmitted to the alarm indicator light 6. The signal input terminal of the alarm indicator light 6 is connected to the designated control port of the signal processing and main control circuit board 11, and its on, flashing, or off state is directly driven by the electrical signal output by the circuit board. At this time, the alarm indicator light 6 issues an alarm indication in a preset mode (such as continuous on or flashing) to prompt the user that a fault has been detected.

[0041] Based on the status of the alarm indicator light 6 and the matrix layout of the multi-channel infrared sensor array 10, users can quickly map the physical location of abnormal temperature areas on the circuit board. For example, if an alarm is triggered, the circuit board area covered by the sensor units in a specific row and column of the matrix is ​​the suspected fault point, and users can perform further electrical testing or visual inspection on that area.

[0042] If the temperature difference in all channel areas does not exceed the threshold, the alarm indicator 6 remains off, indicating that the thermal distribution of the circuit board under test is normal and there is no significant fault.

[0043] V. Post-use processing and maintenance 1. After the test is completed, first disconnect the power supply to the circuit board under test, and then remove it from the circuit board under test placement board 5.

[0044] Disconnect the external power cord from the device's power interface 8. The cooling fan 7 may continue to run briefly after power failure to dissipate residual heat; this is normal.

[0045] Regularly clean the infrared transmission window 3 and the surface of the circuit board under test 5 to prevent dust accumulation from affecting the accuracy of thermal imaging. Check the integrity of the device housing 1 to ensure that the upper cover 2, support column 4, and other structures are not loose.

[0046] If the device is not used for an extended period, it is recommended to cover it with a dust cover and store it in a dry environment. Abnormalities in components such as alarm indicator light 6 and cooling fan 7 can be diagnosed using the signal processing and self-test functions of the main control circuit board 11.

[0047] Example: Example 1: Overall Structure and Basic Working Process of the Device This embodiment describes the standard operating procedure of a circuit board fault rapid location device based on multi-channel thermal imaging. The core of the device includes a device housing 1, with an upper cover 2 at its top. An infrared transmission window 3 is opened on the end face of the upper cover 2. The lower end of the device housing 1 is connected to a test circuit board placement plate 5 via a support column 4, providing a stable placement surface for the test circuit board. An alarm indicator light 6 is installed at the front end of the device housing 1, and a cooling fan 7 and a power interface 8 are provided at the rear end.

[0048] During fault location, a known good circuit board of the same model is first placed on the test circuit board placement plate 5, and the device power is turned on. Inside the device housing 1, a multi-channel infrared sensor array 10 is fixed in a matrix on the sensor mounting plate 9, with its photosensitive surface perpendicular to the infrared transmission window 3. Through this window, the heat distribution of the normal circuit board is synchronously collected, generating reference temperature data and storing it in the signal processing and main control circuit board 11. Subsequently, the good circuit board is removed and replaced with the test circuit board. The multi-channel infrared sensor array 10 again synchronously collects its heat distribution data and transmits it to the signal processing and main control circuit board 11 for real-time comparison. When the comparison finds that the temperature data of a certain area exceeds the reference value, the signal processing and main control circuit board 11 drives the alarm indicator 6 to issue an alarm, thereby quickly locating the fault area. Throughout the process, the cooling fan 7 continues to work to ensure air exchange inside the device and maintain the stable operation of the signal processing and main control circuit board 11.

[0049] Example 2: Multi-channel synchronous acquisition and internal structure example This embodiment focuses on how the internal structure of the device achieves multi-channel synchronous thermal imaging acquisition. The core detection component of the device is a multi-channel infrared sensor array 10, which is fixedly mounted on the sensor mounting plate 9 in a specific row and column matrix. The sensor mounting plate 9 is arranged parallel to the inner side of the upper cover plate 2, and the two are fixedly connected through the inner wall of the device housing 1, maintaining a predetermined distance. This ensures that each sensor unit of the multi-channel infrared sensor array 10 can observe the circuit board on the test circuit board placement plate 5 below without obstruction through the infrared transmission window 3.

[0050] When the device is operating, the signal processing and main control circuit board 11 distributes power and transmits signals to the multi-channel infrared sensor array 10 via cables. Instead of performing single-point scanning, the array acquires data synchronously from all units, capturing a snapshot of the thermal distribution across the entire circuit board area at once. The acquired multi-channel data is transmitted in real-time to the signal processing and main control circuit board 11 for processing. This structural design avoids the delays caused by mechanical scanning, achieving truly rapid temperature field capture. Simultaneously, the fixed installation method of the sensor mounting plate 9 ensures the consistency of the optical paths of each sensor unit, resulting in a stable spatial correspondence between the acquired multi-channel temperature data and laying a solid foundation for subsequent accurate comparison with reference data.

[0051] Example 3: Fault Diagnosis and Alarm Driving Example This embodiment details the complete judgment and driving process from temperature data comparison to fault alarm. This process is entirely controlled by the signal processing and main control circuit board 11. After the reference temperature data is stored, the device enters the detection state. The real-time temperature data of the circuit board under test collected by the multi-channel infrared sensor array 10 is continuously sent to the signal processing and main control circuit board 11. The circuit board has built-in comparison logic that compares the real-time data with the pre-stored reference temperature data channel by channel and region by region.

[0052] The core of the comparison is to determine whether the difference between the real-time temperature and the reference temperature of each channel area exceeds a preset threshold. This threshold is a logical boundary set based on the normal thermal characteristics of the circuit board. Once the signal processing and main control circuit board 11 detects that the temperature difference of a certain channel or several adjacent channel areas exceeds this threshold, it immediately determines that there is a thermal anomaly in the corresponding physical area, which may be due to a short circuit, overload, or component failure. Subsequently, the signal processing and main control circuit board 11 outputs a specific drive electrical signal from its designated control port. This signal is directly transmitted to the signal input terminal of the alarm indicator 6 via a cable. Upon receiving the drive signal, the alarm indicator 6 immediately changes its state, lighting up or flashing according to a preset pattern, thereby providing the operator with a clear and intuitive visual alarm indication, completing a rapid response chain from data judgment to physical alarm.

[0053] Example 4: Device Preparation and Initialization Scenario Example This embodiment describes a specific scenario where an operator prepares and initializes the device before use at the quality inspection station on the production line. The operator first checks the overall condition of the device, confirming that the device housing 1 is securely placed by the support column 4, and that the surface of the circuit board placement plate 5 is clean and flat. Then, the operator carefully cleans the infrared transmission window 3 on the upper cover plate 2 to ensure its optical transparency. Next, the power cord is reliably connected to the power interface 8 at the rear of the device housing 1.

[0054] After power-on, the device begins self-testing and initialization. The operator can observe that the alarm indicator 6 located at the front of the device housing 1 may briefly indicate that the signal processing and main control circuit board 11 has started operating. Simultaneously, the cooling fan 7 installed at the rear of the device housing 1 starts, its air outlet or inlet connecting to the external environment to begin air exchange within the device, cooling the air for the upcoming long-term testing. After initialization, the operator places a standard good circuit board in the designated area of ​​the test circuit board placement plate 5. At this time, all sensor units of the multi-channel infrared sensor array 10 located on the lower surface of the sensor fixing plate 9 inside the device housing 1 are ready, vertically aligned with the infrared transmission window 3. The operator initiates the benchmark learning process via external command, and the signal processing and main control circuit board 11 begins recording and storing the standard thermal image acquired at this moment as a benchmark. This process ensures the accuracy of the reference standard for subsequent fault comparison and is an important prerequisite for the rapid location function.

[0055] Example 5: Comprehensive Application Example of Rapid Fault Location This embodiment demonstrates the comprehensive application process of this device in a repair workshop, showing how technicians can quickly locate a suspected faulty power control board. The technician places the power control board under test flat on the test board placement plate 5. Inside the device, a multi-channel infrared sensor array 10 simultaneously acquires a full-area thermal distribution image of the board when it is powered on, through the infrared transmission window 3. The data is transmitted in real time via cable to the signal processing and main control circuit board 11.

[0056] The signal processing and main control circuit board 11 retrieves pre-stored reference temperature data from the power control board of this model and performs a high-speed comparison with the real-time multi-channel data. The entire process requires no manual intervention or point-by-point measurement. During the comparison, a significant difference was found between the real-time temperature data of a voltage regulator chip area on the circuit board and the reference data, exceeding a preset threshold. The signal processing and main control circuit board 11 immediately generates a drive signal. This signal is output through a designated control port on the circuit board and directly controls the alarm indicator 6 at the front of the device housing 1 via a cable. The alarm indicator 6 is activated, emitting a continuous red light. Upon seeing the alarm indication, technicians immediately use the matrix layout mapping relationship of the multi-channel infrared sensor array 10 to map the alarm channel to the actual physical location on the circuit board, quickly pinpointing the abnormally hot voltage regulator chip area. Throughout the detection process, the cooling fan 7 at the rear of the device housing 1 continuously operates, ensuring heat dissipation for internal electrical components, especially the signal processing and main control circuit board 11, and ensuring stability during long-term testing. This method significantly reduces troubleshooting time.

[0057] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device and method for rapid location of a fault on a circuit board based on multi-channel thermography, comprising a device housing (1), characterized in that: The upper end of the device shell (1) is provided with an upper cover plate (2), the end face of the upper cover plate (2) is provided with an infrared transmission window (3), the lower end of the device shell (1) is provided with a support column (4), and the lower end of the support column (4) is provided with a to-be-tested circuit board placing plate (5).

2. The device and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 1, characterized in that: The front end of the device shell (1) is provided with an alarm indicator light (6), the rear end of the device shell (1) is provided with a heat dissipation fan (7), and the rear end of the device shell (1) is provided with a power supply interface (8).

3. The device and method of claim 1, wherein: The inner end of the device shell (1) is provided with a sensor fixing plate (9), the lower end of the sensor fixing plate (9) is provided with a multi-channel infrared sensor array (10), and the inner end of the device shell (1) is provided with a signal processing and main control circuit board (11).

4. The device and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 3, characterized in that: The multi-channel infrared sensor array (10) is fixedly installed on the sensor fixing plate (9) in the form of an M-row-by-N-column matrix, and the photosensitive surface of each sensor unit thereof is vertically directed to the infrared transmission window (3).

5. The apparatus and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 3, characterized in that: The signal processing and main control circuit board (11) is electrically connected with the multi-channel infrared sensor array (10), the alarm indicator light (6), the heat dissipation fan (7) and the power supply interface (8) through a cable, and allocates electric energy and transmission signals for each component.

6. The apparatus and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 3, characterized in that: The sensor fixing plate (9) is arranged in parallel on the inner side of the upper cover plate (2), and is fixedly connected through the inner wall of the device shell (1) and maintains a predetermined spacing.

7. The apparatus and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 2, characterized in that: The heat dissipation fan (7) is installed on the rear side wall of the device shell (1), and the air outlet or air inlet thereof is in communication with the external environment of the device shell (1), so as to realize air exchange inside the device.

8. The apparatus and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 2, characterized in that: The signal input end of the alarm indicator light (6) is connected to the designated control port of the signal processing and main control circuit board (11), and the lighting, flashing or extinguishing state thereof is directly driven by the electric signal output by the circuit board.

9. The device and method of claim 1-8, wherein: The fault rapid positioning method comprises the following steps: synchronously collecting heat distribution data of a to-be-tested circuit board by the multi-channel infrared sensor array (10), and transmitting the data to the signal processing and main control circuit board (11) to compare with the pre-stored reference temperature data.

10. The apparatus and method for fast locating the fault of circuit board based on multi-channel thermal imaging according to claim 9, characterized in that: The method further comprises the following steps: when the difference between the real-time temperature data and the reference temperature data of a channel region in the comparison result exceeds a preset threshold value, the signal processing and main control circuit board (11) generates a driving signal to control the alarm indicator light (6) to issue an alarm indication.

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