Suspended thermal management architecture for high-speed optical transceiver and optical transceiver

Abstract

The invention discloses a suspended thermal management architecture for a high-speed optical transceiver and the optical transceiver, and belongs to the technical field of optical communication equipment. The framework comprises a shell, a PCB and a heat dissipation channel structure suspended between a main heat source assembly and the top of the shell. The heat dissipation channel structure is not directly and rigidly fixed, but forms a sandwich type stack through the first heat conduction interface layer and the second heat conduction interface layer, and heat of a point heat source is rapidly diffused in the horizontal direction and then is vertically transmitted to the shell. By optimizing a heat conduction path and adopting a functional gradient interface material, the diffusion thermal resistance and the interface thermal stress are effectively reduced, simulation shows that the total thermal resistance is reduced by 49%, the junction temperature of a key chip is reduced by about 20 DEG C, and the reliability of a 1.6 T high-speed optical module is remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of optical communication equipment technology, specifically to a floating thermal management architecture and optical transceiver for high-speed optical transceivers, and is used in high-speed optical transceiver modules with speeds of 800G, 1.6T and above. Background Technology

[0002] With the explosive growth in demand for large-scale artificial intelligence (AI) model training and high-performance computing (HPC), the optical interconnect speeds within data centers are rapidly evolving from 400Gbps to 800Gbps, 1.6Tbps, and even 3.2Tbps. As the core component of optical interconnects, the optical transceiver integrates high-process (e.g., 3nm, 5nm) digital signal processing (DSP) chips and high-power-density lasers (e.g., EML or silicon photonics engines).

[0003] In standard compact packages such as OSP-XD, the power consumption of a single module is expected to exceed 40 watts or even 60 watts, resulting in extremely high local heat flux density (>1000 W / cm²) on the surface of the core chip, creating a severe "hotspot" effect. Existing heat dissipation solutions typically use copper blocks or conventional thermal pads to directly conduct heat from the chip to the casing. However, due to the limited thermal conductivity of copper (approximately 400 W / m·K) and its high spreading resistance, the chip junction temperature (Tj) can easily exceed the safe operating limit (e.g., 90°C), leading to reliability issues such as wavelength drift, increased bit error rate, and a significant reduction in mean time between failures (MTBF).

[0004] Therefore, providing an innovative thermal management architecture that can overcome the bottleneck of traditional material thermal resistance, effectively reduce diffusion thermal resistance, and eliminate local hot spots is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, the present invention provides a floating thermal management architecture and an optical transceiver for high-speed optical transceivers, which can solve the problems that traditional heat dissipation architectures cannot effectively cope with the high heat flux density of 1.6T and above rate modules within the limited optical module packaging space, resulting in excessively high device junction temperature and decreased reliability.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A floating thermal management architecture for a high-speed optical transceiver includes an upper housing, a lower housing, a printed circuit board, and a heat dissipation channel structure. The upper and lower outer shells are detachably connected, and an internal cavity is formed between the upper and lower outer shells. The printed circuit board is disposed in the internal cavity and is detachably connected to the lower outer shell; at least one main heat source component is mounted on the printed circuit board and the main heat source component is disposed between the printed circuit board and the upper outer shell; The heat dissipation channel structure is suspended between the main heat source component and the upper outer shell; the surface of the heat dissipation channel structure is provided with a first thermally conductive interface layer and a second thermally conductive interface layer; the first thermally conductive interface layer is disposed between the top surface of the main heat source component and the heat dissipation channel structure, and is used to conduct the heat generated by the main heat source component to the heat dissipation channel structure; the second thermally conductive interface layer is disposed between the top surface of the heat dissipation channel structure and the upper outer shell.

[0007] The heat dissipation channel structure is configured to diffuse the heat received from the first thermal interface layer in the horizontal direction and transfer it vertically to the upper housing through the second thermal interface layer.

[0008] This invention introduces an independent heat dissipation channel structure. This structure is not directly and rigidly connected to the chip, but is coupled through a flexible or semi-flexible first thermally conductive interface layer to form a "floating" or "sandwich" sandwich structure.

[0009] Furthermore, the heat dissipation channel structure is at least one of the following materials or structures: chemical vapor deposition synthesized diamond plate, metal-based diamond composite material plate, and gas-liquid two-phase heat exchange plate.

[0010] Furthermore, when the heat dissipation channel structure is a chemical vapor deposition synthetic diamond plate, it consists of a high thermal conductivity layer adjacent to the first thermal interface layer and a support layer adjacent to the second thermal interface layer. The thermal conductivity of the high thermal conductivity layer is greater than 1800 W / (m·K), and the thermal conductivity of the support layer is less than 1200 W / (m·K).

[0011] The metal-based diamond composite material plate is preferably made of silver-diamond (Ag-Diamond), which can adjust the coefficient of thermal expansion (CTE) to match the chip while maintaining high thermal conductivity (>600 W / m·K).

[0012] Furthermore, the first thermal interface layer includes a functionally graded metallization (FGM) layer having a composition gradient that varies continuously along the thickness direction. This is used to mitigate the coefficient of thermal expansion (CTE) mismatch between the main heat source component and the heat dissipation channel structure.

[0013] In the first thermally conductive interface layer 121 of the present invention, functionally graded materials (FGM) or low-modulus high thermal conductivity gels are preferably used to absorb thermal stress between the heat dissipation channel structure (such as diamond, CTE~1ppm / K) and the chip (CTE~4-7ppm / K) and prevent delamination or cracking caused by temperature cycling.

[0014] Furthermore, the second thermal interface layer comprises a liquid metal-based thermal interface material or a high-performance thermal pad.

[0015] Furthermore, the main heat source component includes a digital signal processing chip and / or a laser component; The horizontal dimension of the heat dissipation channel structure is larger than the horizontal projection dimension of the main heat source component, so as to form a heat expansion area.

[0016] The present invention also provides an optical transceiver module comprising the above-described floating thermal management architecture for a high-speed optical transceiver.

[0017] Furthermore, the optical transceiver module conforms to the OSFP or OSFP-XD packaging standard and is configured to support transmission rates of 800Gbps or higher.

[0018] The beneficial effects of this invention are as follows: 1. Reduced total thermal resistance: Simulation data shows that, compared with traditional copper-based heat dissipation solutions, the architecture of this invention can reduce the total thermal resistance (Rth) of the module from 5.5℃ / W to 2.8℃ / W, a reduction of 49%.

[0019] 2. Reduce junction temperature: Under a typical power consumption load of 40W, theoretical model calculations show that the present invention can reduce the steady-state junction temperature of the key chip from 95℃ to 75℃, a temperature drop of up to 20℃.

[0020] 3. Extended lifespan: Based on the Arrhenius reliability model, a temperature drop of 20°C can extend the expected lifespan of devices by more than 3 times, significantly reducing maintenance costs after large-scale deployment in data centers. Attached Figure Description

[0021] Figure 1 This is an exploded structural diagram of the suspended thermal management architecture for high-speed optical transceivers of the present invention; Figure 2 This is a longitudinal cross-sectional schematic diagram of the suspended thermal management architecture for high-speed optical transceivers of the present invention (showing the heat flow path). Figure 3 This is a schematic diagram of the internal structure when the heat dissipation channel structure is a vapor chamber (VC). Figure 4 This is a simulation data graph comparing the total thermal resistance of the present invention with that of existing technical solutions; Figure 5 This is a comparison curve of the junction temperature transient response of the present invention and the prior art.

[0022] The structures indicated by the numbers in the attached diagram are as follows: 100 - Floating thermal management architecture for high-speed optical transceivers, 110 - Upper housing, 120 - Heat dissipation channel structure, 130 - Printed circuit board, 140 - Lower housing, 150 - ; 121 - First thermal interface layer, 122 - Second thermal interface layer, 131 - Digital signal processing chip (DSP chip), 132 - Laser assembly (optical assembly). Detailed Implementation

[0023] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention. In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances. In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature. Example 1 A suspended thermal management architecture 100 for a high-speed optical transceiver includes an upper housing 110, a heat dissipation channel structure 120, a printed circuit board 130, and a lower housing 140. The upper outer shell 110 and the lower outer shell 140 are detachably connected, and an internal cavity is formed between the upper outer shell 110 and the lower outer shell 140. The printed circuit board 130 is disposed in the internal cavity and is detachably connected to the lower housing 140; at least one main heat source component is mounted on the printed circuit board 130 and the main heat source component is disposed between the printed circuit board 130 and the upper housing 110. The heat dissipation channel structure 120 is suspended between the main heat source component and the upper outer shell 110; the surface of the heat dissipation channel structure 120 is provided with a first thermally conductive interface layer 121 and a second thermally conductive interface layer 122; the first thermally conductive interface layer 121 is disposed between the top surface of the main heat source component and the heat dissipation channel structure 120, and is used to conduct the heat generated by the main heat source component to the heat dissipation channel structure; the second thermally conductive interface layer 122 is disposed between the top surface of the heat dissipation channel structure 120 and the upper outer shell 110.

[0024] The heat dissipation channel structure 120 is configured to diffuse the heat received from the first thermal interface layer 121 in the horizontal direction and transfer it vertically to the upper housing through the second thermal interface layer 122.

[0025] In some embodiments, the heat dissipation channel structure 120 is at least one of the following materials or structures: chemical vapor deposition synthetic diamond plate, metal-based diamond composite plate, and gas-liquid two-phase heat exchange plate.

[0026] In other embodiments, when the heat dissipation channel structure 120 is a chemical vapor deposition synthetic diamond plate, it consists of a high thermal conductivity layer adjacent to the first thermal interface layer and a support layer adjacent to the second thermal interface layer. The thermal conductivity of the high thermal conductivity layer is greater than 1800 W / (m·K), and the thermal conductivity of the support layer is less than 1200 W / (m·K).

[0027] In some embodiments, the first thermal interface layer 121 includes a functionally graded metallization (FGM) layer having a composition gradient that varies continuously along the thickness direction. This is used to mitigate the coefficient of thermal expansion (CTE) mismatch between the main heat source component and the heat dissipation channel structure 120.

[0028] In other embodiments, the second thermal interface layer 122 comprises a liquid metal-based thermal interface material or a high-performance thermal pad.

[0029] In some embodiments, the main heat source component includes a digital signal processing chip 131 and / or a laser component 132; The horizontal dimension of the heat dissipation channel structure 120 is larger than the horizontal projection dimension of the main heat source component to form a heat expansion area.

[0030] Example 2 Performance Verification (Based on Simulation Model) A thermal simulation model for a 1.6T optical module was constructed, and the performance differences between the architecture of this invention and the traditional copper block heat dissipation architecture were compared. Thermal resistance data results are shown (see...). Figure 4 The total thermal resistance of the traditional solution is 5.5 ℃ / W. By introducing a high thermal conductivity diamond channel using this invention, the diffusion thermal resistance is significantly reduced, and the total thermal resistance drops to 2.8 ℃ / W.

[0031] in, Figure 4 The traditional scheme described herein was prepared with reference to the scheme in the following literature. Figure 4 References: Electronics Cooling, "Junction-to-Case Thermal Resistance: A One-Dimensional Underachiever in a Three-Dimensional Conjugate Heat Transfer World?", Spring 2018. This paper, based on the JEDEC JESD51 standard, measured the junction-to-case thermal resistance of a standard high-performance flip-chip package to be 5.5℃ / W.

[0032] Temperature data results are shown (see) Figure 5 In a step response simulation at an ambient temperature of 55℃ and a total module power consumption of 40W, the chip temperature of the traditional solution eventually stabilized at 95℃; while the temperature of the solution of this invention stabilized at 75℃. This 20℃ temperature difference is crucial for high-speed optical chips in critical operating conditions and can effectively prevent thermal failure.

[0033] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0034] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A suspended thermal management architecture for high speed optical transceivers, comprising: It comprises an upper shell, a lower shell, a printed circuit board, and a heat dissipation channel structure. The upper shell and the lower shell are detachably connected, and an internal cavity is formed between the upper shell and the lower shell. The printed circuit board is arranged in the internal cavity, and the printed circuit board is detachably connected with the lower shell. The printed circuit board carries at least one main heat source component, which is arranged between the printed circuit board and the upper shell.

2. The suspended thermal management architecture for high speed optical transceiver of claim 1, wherein, The heat dissipation channel structure is suspended between the main heat source component and the upper shell.

3. The suspended thermal management architecture for high speed optical transceiver of claim 2, wherein, The surface of the heat dissipation channel structure is provided with a first thermal interface layer and a second thermal interface layer. The first thermal interface layer is arranged between the top surface of the main heat source component and the heat dissipation channel structure, and the second thermal interface layer is arranged between the top surface of the heat dissipation channel structure and the upper shell.

4. The suspended thermal management architecture for high speed optical transceiver of claim 1, wherein, The heat dissipation channel structure is at least one of the following materials or structures: a chemical vapor deposition synthetic diamond plate, a metal-based diamond composite material plate, and a gas-liquid two-phase heating plate.

5. The suspended thermal management architecture for high speed optical transceiver of claim 1 or 4, wherein, When the heat dissipation channel structure is a chemical vapor deposition synthetic diamond plate, it is composed of a high thermal conductivity layer adjacent to the first thermal interface layer and a support layer adjacent to the second thermal interface layer.

6. The suspended thermal management architecture for high speed optical transceiver of claim 1, wherein, The thermal conductivity of the high thermal conductivity layer is greater than 1800 W / (m·K), and the thermal conductivity of the support layer is less than 1200 W / (m·K). The first thermal interface layer comprises a functional gradient metalized layer with a continuously changing composition gradient in the thickness direction.

7. An optical transceiver module, comprising: The second thermal interface layer comprises a liquid metal-based thermal interface material or a high-performance thermal conductive pad.

8. The optical transceiver module of claim 7, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. The main heat source component includes a digital signal processing chip and / or a laser component. The horizontal size of the heat dissipation channel structure is greater than the horizontal projection size of the main heat source component to form an expanded heat area. A suspension type thermal management architecture for a high-speed optical transceiver according to any one of claims 1-6. The optical transceiver module conforms to the OSFP or OSFP-XD packaging standard and is configured to support a transmission rate of 800 Gbps or higher. The optical transceiver module conforms to the OSFP or OSFP-XD packaging standard and is configured to support a transmission rate of 800 Gbps or higher.

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