Display module, preparation method thereof and display device

Abstract

The invention discloses a display module, a preparation method thereof and a display device. The display module comprises a display panel, the display panel comprises a display area, a binding area and a bending area located between the display area and the binding area, and the binding area is bent to the side, away from the light emitting face of the display panel, of the display panel through the bending area; one end of the flexible circuit board is bound to the binding area; the driving chip is bound to the binding area or the flexible circuit board; the packaging structure covers the edge of the display panel and covers at least part of the area of the flexible circuit board, the packaging structure comprises a concave part, the projection of the concave part at least partially surrounds the driving chip in the thickness direction of the display module, and the side wall of the concave part is configured to protect the driving chip. Through the arrangement of the packaging structure and the sunken part, the driving chip can be protected, the heat dissipation capability of the driving chip is improved, steam is effectively prevented from invading the flexible circuit board, and the performance of the display module is ensured.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display module, its manufacturing method, and a display device. Background Technology

[0002] With the continuous development of science and technology, the application of display devices has been gradually promoted, and with the continuous improvement of user needs, flexible displays have gradually entered people's lives.

[0003] The mainstream packaging method in the flexible display field is currently COP packaging, where the driver chip and flexible circuit board are bonded together and then folded back onto the flexible screen. When the display device is operating, the driver chip is one of the sources of heat, especially at high resolutions where the driver chip requires stronger driving capabilities, resulting in higher power consumption and more severe heat generation. If heat cannot be dissipated quickly, the flexible screen can be burned, causing some pixels to fail. The flexible circuit board is usually exposed, making it susceptible to corrosion from water and oxygen, affecting its reliability and consequently severely impacting the display effect of the device. Summary of the Invention

[0004] This invention provides a display module and its manufacturing method, as well as a display device, to improve the heat dissipation capacity of the driver chip and effectively prevent moisture from entering the flexible circuit board, thereby ensuring the performance of the display module.

[0005] In a first aspect, the present invention provides a display module, comprising:

[0006] The display panel includes a display area, a bonding area, and a bending area located between the display area and the bonding area. The bonding area is bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel.

[0007] A flexible circuit board, one end of which is bound to the binding area;

[0008] The driver chip is bonded to the bonding area or to the flexible circuit board;

[0009] An encapsulation structure covering the edge of the display panel and at least a portion of the flexible circuit board, the encapsulation structure including a recess along the thickness direction of the display module, the projection of the recess at least partially surrounding the driver chip, and the sidewalls of the recess being configured to protect the driver chip.

[0010] In a second aspect, the present invention provides a method for manufacturing a display module, used to manufacture the display module described in any one of the first aspects, the method comprising:

[0011] A display panel is provided, the display panel including a display area, a bonding area and a bending area located between the display area and the bonding area, the bonding area being bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel;

[0012] A flexible circuit board is bonded to the bonding area, and a driver chip is bonded to the bonding area or the flexible circuit board.

[0013] An encapsulation structure covers the edge of the display panel and at least a portion of the flexible circuit board, wherein the encapsulation structure includes a recess that, along the thickness direction of the display module, projects a projection that at least partially surrounds the driver chip, and the sidewalls of the recess are configured to protect the driver chip.

[0014] Thirdly, the present invention provides a display device comprising a display module as described in any one of the first aspects, and a mid-frame, wherein the display module is mounted on the mid-frame.

[0015] The technical solution of this invention provides a display module comprising: a display panel including a display area, a bonding area, and a bending area located between the display area and the bonding area, wherein the bonding area is bent through the bending area to the side of the display panel opposite to the light-emitting surface of the display panel; a flexible circuit board, one end of which is bonded to the bonding area; a driver chip, bonded to the bonding area or to the flexible circuit board; and a packaging structure covering the edge of the display panel and at least a portion of the flexible circuit board. The packaging structure, located at the edge of the display panel, increases the structural strength of the display module and effectively prevents the blockage of external water and oxygen, improving the reliability and durability of the display module. The packaging structure also covers at least a portion of the flexible circuit board, preventing direct exposure and susceptibility to external water and oxygen intrusion, thus ensuring the performance of the flexible circuit board. The packaging structure includes a recessed portion, and along the thickness direction of the display module, the projection of the recessed portion at least partially surrounds the driver chip, and the sidewalls of the recessed portion are configured to protect the driver chip. The recessed portion penetrates the packaging structure, exposing the driver chip or covering the driver chip, preventing the driver chip from being damaged by bumps during transportation, protecting the driver chip, improving the heat dissipation performance of the driver chip, and ensuring the performance of the display module.

[0016] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0019] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along section line AA'.

[0020] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure along the central section line BB';

[0021] Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0023] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along section line AA'.

[0024] Figure 7 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0025] Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure along the central section line DD';

[0026] Figure 9 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0027] Figure 10 for Figure 9 A schematic diagram of the cross-sectional structure along the central section line EE';

[0028] Figure 11 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0029] Figure 12 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0030] Figure 13 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0031] Figure 14 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0032] Figure 15 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0033] Figure 16 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0034] Figure 17 A schematic flowchart illustrating a method for manufacturing a display module according to an embodiment of the present invention;

[0035] Figure 18 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0036] Figure 19 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0037] Figure 20 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0038] Figure 21 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0039] Figure 22 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0040] Figure 23 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0041] Figure 24 A schematic flowchart illustrating another method for manufacturing a display module according to an embodiment of the present invention;

[0042] Figure 25 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention;

[0043] Figure 26 This is a schematic diagram of another display device provided in an embodiment of the present invention. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0045] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0046] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure along section line AA'. Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure along section line BB', as shown below. Figure 1 , Figure 2 and Figure 3 As shown, the display module 100 includes: a display panel 101, including a display area 11, a bonding area 12, and a bending area 13 located between the display area 11 and the bonding area 12, wherein the bonding area 12 is bent through the bending area 13 to the side of the display panel 101 away from the light-emitting surface of the display panel 101; a flexible circuit board 102, one end of which is bonded to the bonding area 12; a driver chip 103, which is bonded to the bonding area 12 or to the flexible circuit board 102; and a packaging structure 104, which covers the edge of the display panel 101 and at least a portion of the flexible circuit board 102, wherein the packaging structure 104 includes a recess 14, and the projection of the recess 14 at least partially surrounds the driver chip 103 along the thickness direction X of the display module 100, and the sidewall 141 of the recess 14 is configured to protect the driver chip 103.

[0047] The display panel 101 includes a display area 11, a bending area 13, and a bonding area 12, with the bending area 13 positioned between the display area 11 and the bonding area 12. The light-emitting surface of the display area 11 faces the user and is used to display images. The display panel 101 located in the bending area 13 is made of a flexible material, allowing the bonding area 12 to be flipped away from the light-emitting surface of the display panel 101 by bending, effectively compressing the bezel of the display module 100 and increasing the screen-to-body ratio. The bonding area 12 enables electrical connection between the flexible circuit board 102 and the display panel 101, or it can also enable electrical connection between the driver chip 103 and the display panel 101, ensuring reliable connection. For example, as shown... Figure 1 As shown, one end of the flexible circuit board 102 is bonded to the bonding area 12, and the driver chip 103 is bonded to the bonding area 12; or Figure 4 This is a schematic diagram of another display module provided in an embodiment of the present invention, as shown below. Figure 4 As shown, one end of the flexible circuit board 102 is bonded to the bonding area 12, and the driver chip 103 is bonded to the flexible circuit board 102. Both of the above-mentioned bonding methods for the driver chip 103 can effectively reduce the bezel size. The display module 100 is also provided with a packaging structure 104, which covers the edge of the display panel 101. The packaging structure 104 can surround the edge of the display panel 101, which can prevent external water and oxygen from corroding the display module 100, and can also increase the structural strength of the display module 100, improve its drop resistance, and enhance its reliability and durability. The packaging structure 104 also covers at least a portion of the flexible circuit board 102. The coverage area of ​​the packaging structure 104 can be adjusted according to the setting position of the driver chip 103 to ensure packaging accuracy. The encapsulation structure 104 includes a recess 14, which may penetrate the encapsulation structure 104 or not, such that along the thickness direction X of the display module 100, the projection of the recess 14 at least partially surrounds the driver chip 103. The sidewall 141 of the recess 14 is configured to protect the driver chip 103. The encapsulation structure 104 does not contact the driver chip 103, ensuring the heat dissipation effect of the driver chip 103. The existence of the sidewall 141 of the recess 14 can protect the driver chip 103, preventing the driver chip 103 from being bumped during transportation, ensuring the performance of the driver chip 103, and thus ensuring the display effect of the display module 100.

[0048] This invention, through an encapsulation structure covering the edge of the display panel and at least a portion of the flexible circuit board, increases the structural strength of the display module, improves its reliability and durability, and prevents external water and oxygen intrusion into the flexible circuit board. The encapsulation structure includes recessed portions that expose or cover the driver chip, preventing damage during transportation and improving its heat dissipation, thus ensuring the performance of the display module 100.

[0049] Optional, continue to refer to Figure 1 and Figure 4 The recessed part 14 is a hollow structure, which penetrates the encapsulation structure 104.

[0050] The recessed portion 14 can be a hollow structure. Along the thickness direction X of the display module 100, the hollow structure does not overlap with the driver chip 103. The projection of the hollow structure surrounds the driver chip 103, exposing the driver chip 103 and ensuring heat dissipation. This prevents the driver chip 103 from overheating when the display panel 101 is lit, thus avoiding performance issues. The non-hollow area of ​​the encapsulation structure 104 surrounds the driver chip 103. The thickness of the encapsulation structure 104 is much greater than the thickness of the driver chip 103, allowing the sidewalls 141 of the hollow structure to protect the driver chip 103. This protection prevents damage to the driver chip 103 during transportation, ensuring its safety.

[0051] Optional, Figure 5 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along section line AA', as shown below. Figure 5 and Figure 6 As shown, the recess 14 is located on the surface of the package structure 104 near the driver chip 103, and there is a gap between the bottom of the recess 14 and the surface of the bonding area 12 near the recess 14.

[0052] The recess 14 is formed on the surface of the package structure 104 near the driver chip 103. The recess 14 does not penetrate the package structure 104. The recess 14 can cover the chip. Along the thickness direction X of the display module 100, the projection edge of the recess 14 surrounds the driver chip 103, and the projection of the driver chip 103 falls within the projection range of the recess 14. There is a gap between the bottom of the recess 14 and the surface of the bonding area 12 near the recess 14, so that the recess 14 does not contact the driver chip 103. This can ensure the heat dissipation of the driver chip 103, protect the driver chip 103, and ensure the performance of the driver chip 103.

[0053] Optional, continue to refer to Figure 6 Along the thickness direction X of the display module 100, the thickness H1 of the recess 14 is greater than the thickness H2 of the driver chip 103. This is to prevent contact between the recess 14 and the driver chip 103, ensuring sufficient heat dissipation space for the driver chip 103 and thus guaranteeing its performance.

[0054] Optional, continue to refer to Figure 2 The flexible circuit board 102 includes a first flexible circuit board portion 121 bonded to the bonding region 12, and the encapsulation structure 104 covers the first flexible circuit board portion 121. For example, such as... Figure 2 As shown, the driver chip 103 is disposed in the bonding area 12, and the package structure 104 can cover the first flexible circuit board portion 121 area where the flexible circuit board 102 is bonded to the bonding area 12, which can prevent the flexible circuit board 102 from being exposed to external water and oxygen corrosion, and effectively improve the bonding reliability between the flexible circuit board 102 and the bonding area 12.

[0055] In addition, such as Figure 4 As shown, when the driver chip 103 is placed on the flexible circuit board 102, the encapsulation structure 104 can cover the non-driver chip 103 placement area in the flexible circuit board 102. The recessed part 14 of the encapsulation structure 104 can ensure the heat dissipation effect of the driver chip 103, and can also cover a large area of ​​the flexible circuit board 102 with the help of the encapsulation structure 104, effectively avoiding the corrosion of the flexible circuit board 102 by external water and oxygen.

[0056] Optional, Figure 7 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure along section line DD', as shown below. Figure 7 and Figure 8 As shown, the display module 100 also includes a heat-conducting structure 105, and the projection of the heat-conducting structure 105 overlaps with the projection of the driver chip 103 along the thickness direction X of the display module 100.

[0057] Because the driver chip 103 may experience localized overheating during use, to ensure its performance and lifespan, the projection of the heat-conducting structure 105 overlaps with the projection of the driver chip 103 along the thickness direction X of the display module 100. The heat-conducting structure 105 can either be in contact with the driver chip 103 or have a small gap between them. Utilizing the excellent thermal conductivity of the heat-conducting structure 105, the heat generated by the driver chip 103 can be dissipated. The heat-conducting structure 105 also provides some protection, preventing the driver chip 103 from being exposed and damaged during transportation, thus ensuring its safety.

[0058] Optional, continue to refer to Figure 8 The heat-conducting structure 105 covers the driver chip 103. The heat-conducting structure 105 can directly contact the driver chip 103, and the heat generated by the driver chip 103 is directly conducted away by the heat-conducting structure 105, realizing direct heat dissipation of the driver chip 103.

[0059] Optional, Figure 9 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 10 for Figure 9 A schematic diagram of the cross-sectional structure along section line EE', as shown below. Figure 9 and Figure 10 As shown, the display module 100 also includes a protective structure 106, which is located between the driver chip 103 and the heat-conducting structure 105, and covers the driver chip 103. After the driver chip 103 is bonded to the bonding area 12, the protective structure 106 can be provided on the surface of the driver chip 103 away from the bonding area 12. A driver chip sealant can be provided around the side of the driver chip 106 to ensure the adhesion between the protective structure 106 and the driver chip 106. The protective structure 106 can be a protective tape, which can prevent the driver chip 103 from being damaged by impacts during transportation of the display module 100. The protective structure 106 also plays a certain role in heat dissipation. Furthermore, to ensure the heat dissipation performance of the driver chip 103, a heat-conducting structure 105 can be provided on the side of the protective structure 106 away from the bonding area 12. The heat-conducting structure 105 covers the protective structure 106 and the driver chip 103, further improving heat dissipation capacity and ensuring the performance and lifespan of the driver chip 103.

[0060] Optional, Figure 11 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 12 This is a schematic diagram of another display module provided in an embodiment of the present invention, as shown below. Figure 8 , Figure 11 and Figure 12As shown, along the thickness direction X of the display module 100, the maximum thickness H3 of the heat-conducting structure 105 is less than or equal to the thickness H1 of the recess 14. Specifically, based on the heat-conducting structure 105 covering the driving chip 103, as... Figure 8 As shown, the maximum thickness H3 of the heat-conducting structure 105 can be set to be less than the thickness H1 of the recess 14. In this case, the heat-conducting structure 105 does not need to completely fill the recess 14. The specific thickness of the heat-conducting structure 105 can be selected according to design requirements, and this embodiment of the invention does not impose specific limitations. Or as... Figure 11 As shown, when the thickness of the recessed portion 14 is the same at all points, the maximum thickness H3 of the heat-conducting structure 105 can also be set to be equal to the thickness H1 of the recessed portion 14; for example... Figure 12 As shown, when the recessed portion 14 has different thicknesses, the maximum thickness H3 of the heat-conducting structure 105 is equal to the maximum thickness H1 of the recessed portion 14. At this time, the heat-conducting structure 105 can fill the recessed portion 14, ensuring that the surface of the heat-conducting structure 105 away from the driving chip 103 is flush with the surface of the packaging structure 104 away from the driving chip 103, thus ensuring the flatness of the display module 100 structure.

[0061] Optional, Figure 13 This is a schematic diagram of another display module provided in an embodiment of the present invention. Figure 14 This is a schematic diagram of another display module provided in an embodiment of the present invention, as shown below. Figure 11 , Figure 13 and Figure 14 As shown, the sidewall 141 of the recess 14 is at least one of the following: slope-shaped, step-shaped, or arc-shaped.

[0062] The surface of the driver chip 103 is covered with a thermally conductive structure 105, and the thermally conductive structure 105 is in contact with the sidewall 141 of the recess 14 in the package structure 104. The sidewall 141 of the recess 14 can be as follows: Figure 11 The slope-shaped, as shown Figure 13 The stepped or similar shape shown Figure 14 The arc shape shown ensures the contact area between the encapsulation structure 104 and the heat-conducting structure 105, ensures the adhesive strength between the encapsulation structure 104 and the heat-conducting structure 105, and ensures the structural stability of the display panel 101.

[0063] Optional, Figure 15 This is a schematic diagram of another display module provided in an embodiment of the present invention, as shown below. Figure 15As shown, the encapsulation structure 104 includes an encapsulating matrix 24 and a thermally conductive filler 25 dispersed in the encapsulating matrix 24. The thermally conductive filler 25 can be dispersed in the encapsulating matrix 24 constituting the encapsulation structure 104 to improve the thermal conductivity of the encapsulation structure 104, dispersing the heat generated during the use of the display module 100, thereby improving the performance and lifespan of the display module 100. For example, the encapsulating matrix 24 can be epoxy resin.

[0064] Optional, Figure 16 This is a schematic diagram of another display module provided in an embodiment of the present invention, as shown below. Figure 16 As shown, the thermally conductive structure 105 includes a thermally conductive matrix 26 and thermally conductive filler 25 dispersed in the thermally conductive matrix 26. The thermally conductive matrix 26 comprising the thermally conductive structure 105 may also contain thermally conductive filler 25, enhancing the thermal conductivity of the thermally conductive structure 105. The thermally conductive structure 105 is in contact with the driver chip 103, and can dissipate heat from the driver chip 103, ensuring the performance and lifespan of the driver chip 103. For example, the thermally conductive matrix 26 may include silicone oil, dispersant, thickener, and antioxidant, etc., to ensure the insulation, flowability, viscosity, and lifespan of the thermally conductive structure 105.

[0065] Optional, continue to refer to Figure 15 and Figure 16 The thermally conductive filler 25 includes at least one of alumina, boron nitride, and aluminum nitride. The same thermally conductive filler 25 or different conductive fillers can be added to the encapsulation structure 104 and the thermally conductive structure 105. The thermally conductive filler 25 is typically an insulating material with a high thermal conductivity, such as at least one of alumina, boron nitride, and aluminum nitride. That is, the thermally conductive material can be a single material or a mixture of materials. The specific material and quantity of the thermally conductive filler 25 can be selected according to actual design requirements, and this embodiment of the invention does not impose specific limitations.

[0066] Based on the same inventive concept, this invention also provides a method for manufacturing a display module. Figure 17 This is a schematic flowchart of a method for manufacturing a display module according to an embodiment of the present invention. Figure 18 A schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention is shown below. Figure 17 and Figure 18 As shown, the method for preparing the display module described in any of the above embodiments includes:

[0067] S101 provides a display panel, the display panel including a display area, a bonding area and a bending area located between the display area and the bonding area, the bonding area being bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel.

[0068] S102, a flexible circuit board is bonded in the bonding area, and the driver chip is bonded to the bonding area or the flexible circuit board.

[0069] In this embodiment, the bonding area 12 of the display panel 101 is bonded to one end of the flexible circuit board 102. The driver chip 103 can be bonded to the bonding area 12 or the flexible circuit board 102. The specific choice can be made according to the actual design requirements. In this embodiment, the driver chip 103 is bonded to the bonding area 12 as an example.

[0070] S103, an encapsulation structure is covered on the edge of the display panel and at least a portion of the flexible circuit board, wherein the encapsulation structure includes a recess, and the projection of the recess at least partially surrounds the driver chip along the thickness direction of the display module, and the sidewalls of the recess are configured to protect the driver chip.

[0071] The encapsulation structure 104 covers at least a portion of the edge of the display panel 101 and the flexible circuit board 102 to prevent external water and oxygen from corroding the display module 100. The encapsulation structure 104 includes a recess 14, which may penetrate the encapsulation structure 104 or not, such that the projection of the recess 14 along the thickness direction X of the display module 100 at least partially surrounds the driver chip 103. The sidewall 141 of the recess 14 is configured to protect the driver chip 103. The recess in the encapsulation structure 104 also ensures good heat dissipation for the driver chip 103, and the sidewall 141 of the recess 14 protects the driver chip 103 from impacts during transportation, thus ensuring the performance of the driver chip 103 and consequently the display effect of the display module 100.

[0072] This invention provides a display panel including a display area bonding area and a bending area located between the display area and the bonding area. The bonding area is bent through the bending area to the side of the display panel opposite to the light-emitting surface. A flexible circuit board is bonded to the bonding area, and a driver chip 103 is bonded to the bonding area or the flexible circuit board. An encapsulation structure covers the edge of the display panel and at least a portion of the flexible circuit board. The encapsulation structure includes a recess, and along the thickness direction of the display module, the projection of the recess at least partially surrounds the driver chip. The sidewalls of the recess are configured to protect the driver chip. The encapsulation structure and the recess ensure effective heat dissipation of the driver chip and effectively prevent external water and oxygen from intruding into the display module, thus ensuring the reliability of the display panel.

[0073] Figure 19 This is a schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention. Figure 20A schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention is shown below. Figure 19 and Figure 20 As shown, the preparation method includes:

[0074] S201 provides a display panel, the display panel including a display area, a bonding area and a bending area located between the display area and the bonding area, the bonding area being bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel.

[0075] S202, a flexible circuit board is bonded in the bonding area, and the driver chip is bonded to the bonding area or the flexible circuit board.

[0076] S203, an encapsulation structure is covered on the edge of the display panel and at least a portion of the flexible circuit board, wherein the encapsulation structure includes a recess, and the projection of the recess at least partially surrounds the driver chip along the thickness direction of the display module, and the sidewalls of the recess are configured to protect the driver chip.

[0077] S204, by setting a protective structure on the surface of the driver chip away from the display panel, the protective structure covers the driver chip.

[0078] In this design, the driver chip 103 is bonded to the bonding area 12. After the packaging structure 104 is set, a protective structure 106 can be set on the surface of the driver chip 103 away from the display panel 101. The protective structure 106 protects the driver chip 103 and prevents it from being damaged by bumps during transportation. The protective structure 106 also provides heat conduction for the driver chip 103.

[0079] S205, a heat-conducting structure is provided on the surface of the protective structure away from the display panel, the heat-conducting structure covers the protective structure and fills at least part of the recess.

[0080] Among them, a heat-conducting structure 105 is covered on the side of the protective structure 106 away from the display panel 101, and the heat-conducting structure 105 at least partially fills the recess 14, so as to dissipate the heat generated by the driver chip 103 by means of the heat-conducting structure 105, and ensure the performance and life of the driver chip 103.

[0081] This invention provides a protective structure covering the driver chip on the surface away from the display panel. A heat-conducting structure is also provided on the protective structure on the same surface away from the display panel, covering and filling at least a portion of the recessed area. These protective and heat-conducting structures protect the driver chip and dissipate heat, ensuring its performance and lifespan.

[0082] Figure 21This is a schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention. Figure 22 A schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention is shown below. Figure 21 and Figure 22 As shown, the preparation method includes:

[0083] S301 provides a display panel, the display panel including a display area, a bonding area and a bending area located between the display area and the bonding area, the bonding area being bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel.

[0084] S302, a flexible circuit board is bonded in the bonding area, and the driver chip is bonded to the bonding area or the flexible circuit board.

[0085] S303, a heat-conducting structure is provided on the surface and sidewall of the driver chip away from the display panel, and the heat-conducting structure covers the driver chip.

[0086] After the driver chip 103 is bonded to the bonding area 12 of the display panel 101, a heat-conducting structure 105 can be directly prepared on the surface of the driver chip 103. The heat-conducting structure 105 covers the driver chip 103, which can dissipate the heat generated by the driver chip 103, reduce the temperature of the driver chip 103, and ensure the performance and lifespan of the driver chip 103.

[0087] S304, an encapsulation structure is covered on the edge of the display panel and at least a portion of the flexible circuit board, wherein the encapsulation structure includes a recess, the projection of the recess along the thickness direction of the display module at least partially surrounds the driver chip, the recess is a cutout structure that penetrates the encapsulation structure, a thermally conductive structure fills at least a portion of the recess, and the sidewalls of the recess are configured to protect the driver chip.

[0088] After the heat-conducting structure 105 is set up, the encapsulation structure 104 covers the edge of the display panel 101 and at least a portion of the flexible circuit board 102. The encapsulation structure 104 does not cover the area where the heat-conducting structure 105 is located, but only contacts the sidewall 141 of the heat-conducting structure 105, resulting in a recessed portion 14 in the encapsulation structure 104. The recessed portion 14 is a hollow structure. The encapsulation structure 104 protects the driver chip 103 and the heat-conducting structure 105, preventing damage to the driver chip 103 during transportation. Furthermore, the encapsulation structure 104 prevents the display module 100 from being corroded by external water and oxygen, ensuring the reliability and durability of the display module 100.

[0089] This invention provides a thermally conductive structure covering the driver chip on its surface and sidewalls away from the display panel. An encapsulation structure covers the edge of the display panel and at least a portion of the flexible circuit board. The encapsulation structure includes a recessed portion that, along the thickness direction of the display module, projects a projection that at least partially surrounds the driver chip. The recessed portion is a perforated structure that penetrates the encapsulation structure. The thermally conductive structure fills at least a portion of the recessed portion, and the sidewalls of the recessed portion are configured to protect the driver chip. The thermally conductive structure dissipates heat from the driver chip. The perforated recessed portion in the encapsulation structure protects both the driver chip and the thermally conductive structure, while also ensuring the performance of the display module.

[0090] Figure 23 This is a schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention. Figure 24 A schematic flowchart of another method for manufacturing a display module provided in an embodiment of the present invention is shown below. Figure 23 and Figure 24 As shown, the preparation method includes:

[0091] S401 provides a display panel, the display panel including a display area, a bonding area and a bending area located between the display area and the bonding area, the bonding area being bent through the bending area to the side of the display panel away from the light-emitting surface of the display panel.

[0092] S402, a flexible circuit board is bonded in the bonding area, and the driver chip is bonded to the bonding area or the flexible circuit board.

[0093] S403, a heat-conducting structure is provided on the surface and sidewall of the driver chip away from the display panel, and the heat-conducting structure covers the driver chip.

[0094] S404, an encapsulation structure is covered on the edge of the display panel and at least a portion of the flexible circuit board, wherein the encapsulation structure includes a recess along the thickness direction of the display module, the projection of the recess at least partially surrounds the driver chip, the recess is located on the surface of the encapsulation structure near the driver chip, a thermally conductive structure fills at least a portion of the recess, and the sidewalls of the recess are configured to protect the driver chip.

[0095] After the heat-conducting structure 105 is set up, an encapsulation structure 104 covers the edge of the display panel 101 and at least a portion of the flexible circuit board 102. The encapsulation structure 104 has a recess 14, which does not penetrate through the encapsulation structure 104. This allows the recess 14 to cover the driver chip 103 and the heat-conducting structure 105, preventing damage to the driver chip 103 during transportation. The heat-conducting structure 105 also dissipates heat from the driver chip 103, ensuring its performance. The encapsulation structure 104 also effectively improves the reliability and durability of the display module 100, ensuring its performance.

[0096] This invention provides a thermally conductive structure covering the driver chip on its surface and sidewalls away from the display panel. An encapsulation structure covers the edge of the display panel and at least a portion of the flexible circuit board. The encapsulation structure includes a recessed portion. Along the thickness direction of the display module, the projection of the recessed portion at least partially surrounds the driver chip. The recessed portion is located on the surface of the encapsulation structure closest to the driver chip. The thermally conductive structure fills at least a portion of the recessed portion, and the sidewalls of the recessed portion are configured to protect the driver chip. The thermally conductive structure dissipates heat from the driver chip. The encapsulation structure includes a recessed portion that does not penetrate the encapsulation structure, thus protecting both the driver chip and the thermally conductive structure and ensuring the performance of the display module.

[0097] Figure 25 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Figure 26 This is a schematic diagram of another display device provided in an embodiment of the present invention, such as... Figure 25 and Figure 26 As shown, the display device 200 includes the display module 100 described in the above embodiment, and a mid-frame 201 on which the display module 100 is mounted.

[0098] It should be noted that since the display device provided in this embodiment has the same or corresponding beneficial effects as the display panel 101 in the above embodiments, it will not be described in detail here. The display device 200 provided in this embodiment of the invention can be Figure 25 The mobile phone shown can also be any electronic product with display function, including but not limited to the following categories: television, laptop, desktop monitor, tablet computer, digital camera, smart bracelet, smart glasses, in-vehicle display, medical equipment, industrial control equipment, touch interactive terminal, etc. The embodiments of the present invention do not make any special limitations on this.

[0099] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized by The display module comprises: a display panel comprising a display area, a binding area and a bending area between the display area and the binding area, the binding area being bent to a side of the display panel away from a light-out surface of the display panel through the bending area; a flexible circuit board having one end bound to the binding area; a driving chip bound to the binding area or the flexible circuit board; a packaging structure covering an edge of the display panel and at least a partial area of the flexible circuit board, the packaging structure comprising a recess, a projection of the recess at least partially surrounding the driving chip in a thickness direction of the display module, and a side wall of the recess configured to protect the driving chip.

2. The display module of claim 1, wherein, The recess is a hollow structure penetrating through the packaging structure.

3. The display module of claim 1, wherein, The recess is located on a surface of the packaging structure close to the driving chip, and a bottom of the recess is spaced apart from a surface of the binding area close to the recess.

4. The display module of claim 3, wherein, In the thickness direction of the display module, a thickness of the recess is greater than a thickness of the driving chip.

5. The display module of claim 1, wherein, The flexible circuit board comprises a first flexible circuit board part bound to the binding area, and the packaging structure covers the first flexible circuit board part.

6. The display module of claim 1, wherein, The display module further comprises a heat-conducting structure, a projection of the heat-conducting structure overlapping a projection of the driving chip in the thickness direction of the display module.

7. The display module of claim 6, wherein, The heat-conducting structure covers the driving chip.

8. The display module of claim 6, wherein, The display module further comprises a protection structure between the driving chip and the heat-conducting structure, and the protection structure covers the driving chip.

9. The display module of claim 6, wherein, In the thickness direction of the display module, a maximum thickness of the heat-conducting structure is less than or equal to the thickness of the recess.

10. The display module of claim 1, wherein, The side wall of the recess is at least one of a slope, a step or an arc.

11. The display module of claim 1, wherein, The packaging structure comprises an encapsulation matrix and a heat-conducting filler dispersed in the encapsulation matrix.

12. The display module of claim 6, wherein, The heat-conducting structure comprises a heat-conducting matrix and a heat-conducting filler dispersed in the heat-conducting matrix.

13. The display module of claim 11 or 12, wherein, The heat-conducting filler comprises at least one of aluminum oxide, boron nitride and aluminum nitride.

14. A method for manufacturing a display module, characterized by: A method for manufacturing the display module of any one of claims 1-13, the method comprising: providing a display panel comprising a display area, a binding area and a bending area between the display area and the binding area, the binding area being bent to a side of the display panel away from a light-out surface of the display panel through the bending area; binding a flexible circuit board at the binding area and binding a driving chip at the binding area or the flexible circuit board; covering a packaging structure at an edge of the display panel and at least a partial area of the flexible circuit board, wherein the packaging structure comprises a recess, a projection of the recess at least partially surrounding the driving chip in a thickness direction of the display module, and a side wall of the recess configured to protect the driving chip.

15. The method for preparing a display module according to claim 14, characterized in that, After covering the packaging structure at the edge of the display panel and at least a partial area of the flexible circuit board, the method further comprises: providing a protection structure at a surface of the driving chip away from the display panel, the protection structure covering the driving chip; A heat-conducting structure is arranged on the surface of the protective structure away from the display panel, covering the protective structure and filling at least part of the recess.

16. The method of claim 14, wherein the display module is prepared by the steps of: Before covering the edge of the display panel and at least part of the area of the flexible circuit board with the packaging structure, further comprising: A heat-conducting structure is arranged on the surface and sidewall of the driving chip away from the display panel, covering the driving chip; Covering the edge of the display panel and at least part of the area of the flexible circuit board with the packaging structure, wherein the packaging structure comprises a recess, the projection of the recess at least partially surrounds the driving chip in the thickness direction of the display module, and the sidewall of the recess is configured to protect the driving chip, comprising: Covering the edge of the display panel and at least part of the area of the flexible circuit board with the packaging structure, wherein the packaging structure comprises a recess, the projection of the recess at least partially surrounds the driving chip in the thickness direction of the display module, and the recess is a hollow structure, the hollow structure penetrates through the packaging structure, the heat-conducting structure fills at least part of the recess, and the sidewall of the recess is configured to protect the driving chip. Or, covering the edge of the display panel and at least part of the area of the flexible circuit board with the packaging structure, wherein the packaging structure comprises a recess, the projection of the recess at least partially surrounds the driving chip in the thickness direction of the display module, and the recess is located on the surface of the packaging structure close to the driving chip, the heat-conducting structure fills at least part of the recess, and the sidewall of the recess is configured to protect the driving chip.

17. A display device comprising: The display module of any one of claims 1-13, and a middle frame, wherein the display module is mounted on the middle frame.

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