High-voltage-withstanding symmetric groove etching process equipment adaptive to IGBT (Insulated Gate Bipolar Translator) device

Abstract

The invention relates to the technical field of IGBT (insulated gate bipolar transistor) device etching equipment, and discloses high-voltage-withstanding symmetric groove etching process equipment adaptive to an IGBT device, which comprises a machine body, a gas circuit box, an electric appliance control box, a plasma emitter and a shade, the gas circuit box is fixedly connected with the surface of the machine body, the electric appliance control box is fixedly connected with the upper surface of the machine body, and the plasma emitter is fixedly connected with the surface of the machine body. The plasma emitter is installed on the inner wall of the machine body, the shade is fixedly connected with the inner wall of the machine body, the plasma emitter is located in the shade, and a station conversion device is arranged on the inner wall of the machine body and comprises a conversion mechanism. According to the multi-station machining equipment, the station conversion device is arranged, so that the equipment can adopt multiple stations for machining, the problems of waiting for feeding and discharging in the machining process and limitation on the machining efficiency of the equipment due to single-station machining of the equipment are reduced, and the machining efficiency of the equipment is further improved.

Description

Technical Field

[0001] This invention relates to the field of IGBT device etching equipment technology, specifically to a high-voltage symmetrical trench etching process equipment adapted to IGBT devices. Background Technology

[0002] The IGBT device symmetric trench etching equipment is a core semiconductor manufacturing equipment for processing high-precision symmetric trench structures on silicon or silicon carbide (SiC) wafers. Its performance directly determines the key electrical characteristics of IGBT devices, such as on-resistance and breakdown voltage, and it is widely used in the production of high-end power devices such as new energy vehicles and industrial motors.

[0003] The equipment is based on dry etching technology (mostly using inductively coupled plasma ICP process) and consists of a vacuum chamber, plasma source, high-precision electrode system, gas delivery and temperature control components and intelligent control system. The vacuum chamber is coated with a corrosion-resistant coating (such as Y2O3) to ensure a clean and stable reaction environment. The plasma source uses radio frequency power to excite etching gases such as Cl2 and HBr to form high-density plasma. The symmetrically designed electrode system, together with electrostatic chuck (ESC), achieves uniform wafer clamping and directional ion bombardment, and precisely controls the steepness and symmetry of the trench sidewalls.

[0004] To address the stringent requirements of IGBT trenches regarding aspect ratio and dimensional accuracy (error must be less than 5nm, depth can reach hundreds of micrometers), the equipment is equipped with a mass flow controller (MFC) to precisely regulate the gas ratio and uses a closed-loop system to monitor temperature, pressure, and power parameters in real time. This ensures consistent trench width and depth, and smooth, defect-free sidewalls, preventing a decrease in device withstand voltage performance due to electric field concentration. For high-hardness SiC materials, the equipment also optimizes etching energy and process parameters, achieving efficient processing while avoiding material damage. It is a key piece of equipment supporting the high-precision, high-reliability manufacturing of trench IGBT devices.

[0005] In the field of IGBT device etching, the intermittent production mode of existing single-station etching equipment presents a significant efficiency bottleneck. This type of equipment uses a single processing chamber design, and after each batch etching (typically taking 5-10 minutes), manual or robotic arm loading and unloading operations are required (each operation taking 20-30 seconds), resulting in non-processing time accounting for 12%-18% of the equipment's total time. Actual test data shows that the average daily capacity of single-station equipment is only 60%-70% of that of multi-station equipment. When processing IGBT chips, the production cycle per batch is 15%-25% longer than that of dual-station equipment. This lack of processing continuity caused by loading and unloading interruptions is essentially a structural contradiction between the "single-station architecture" and the "demand for efficient mass production of semiconductors." This not only reduces equipment utilization to 75%-80% (compared to over 90% for multi-station equipment) but also increases the energy cost per unit by 10%-15%, severely restricting the efficiency of large-scale manufacturing of IGBT devices. Therefore, we propose a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. Summary of the Invention

[0006] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. It solves the problem that existing IGBT device etching equipment uses a single processing chamber design, requiring manual or robotic arm loading and unloading operations after each batch of etching, resulting in non-processing time accounting for 12%-18%. Actual test data shows that the daily output of single-station equipment is only 60%-70% of that of multi-station equipment, and when processing 6-inch IGBT wafers, the single-batch production cycle is 15%-25% longer than that of dual-station equipment.

[0007] (II) Technical Solution To achieve the above objectives, the present invention provides the following technical solution: a high-voltage symmetrical trench etching process equipment adapted to IGBT devices, comprising a body, a gas path box, an electrical control box, a plasma emitter, and a shield. The gas path box is fixedly connected to the surface of the body, the electrical control box is fixedly connected to the upper surface of the body, the plasma emitter is installed on the inner wall of the body, the shield is fixedly connected to the inner wall of the body, the plasma emitter is located inside the shield, and a station conversion device is provided on the inner wall of the body. The workstation conversion device includes a conversion mechanism, which includes a right-angle support leg. The right-angle support leg is fixedly connected to the inner wall of the machine body. An assembly frame is fixedly connected to the lower surface of the right-angle support leg. A servo motor is fixedly connected to the lower surface of the assembly frame. A gear is fixedly connected to the drive shaft of the servo motor. A gear ring adapted to the gear is rotatably connected to the inner wall of the machine body. A placement platform is fixedly connected to the upper surface of the gear ring. A fixing sleeve is fixedly connected to the lower surface of the assembly frame. A rotary joint is installed on the inner wall of the fixing sleeve. An air distribution manifold is threaded to the upper interface of the rotary joint. A solenoid valve is threaded to the interface of the air distribution manifold. A connecting pipe is threaded to the interface of the solenoid valve. An isolator is fixedly connected to the inner wall of the placement platform. The workstation conversion device also includes a control mechanism consisting of a bracket, a laser rangefinder, an assembly rack, a T-block, an extension rack, a reflector, a protrusion, and a positioning bolt.

[0008] Preferably, the control mechanism includes a bracket, which is fixedly connected to the upper surface of an assembly frame. A laser ranging sensor is fixedly connected to the surface of the assembly frame. An assembly frame is fixedly connected to the surface of the solenoid valve. A T-shaped block is slidably connected to the inner wall of the assembly frame. An extension frame is fixedly connected to the surface of the T-shaped block. A reflector adapted to the laser ranging sensor is fixedly connected to the inner wall of the extension frame. The number of reflectors is six, and the six reflectors are arranged in a circular array with reference to the rotation axis of the gear ring. The six reflectors are respectively labeled A1, A2, A3, A4, A5, and A6. A protrusion is fixedly connected to the surface of the assembly frame. A threaded hole is formed on the surface of the extension frame. The extension frame is located at the screw... The inner wall of the perforated hole is threaded with a positioning bolt. Using a laser rangefinder, when the laser signal emitted by the laser rangefinder is reflected back by the reflector, the distance between the sensor and the reflector can be accurately calculated by measuring the time difference of the laser's round trip. According to the preset distance threshold, when the laser rangefinder detects that the distance to the reflector of a specific mark (such as A1, A2, etc.) reaches the corresponding value, it will send a signal to the control system. After receiving the signal, the control system will quickly control the solenoid valve corresponding to the reflector to perform the action, realize the closing or opening operation of the solenoid valve, thereby accurately controlling the switching of the workstation and the execution of related processes, ensuring that the entire high-pressure symmetrical trench etching process equipment can operate stably and efficiently.

[0009] Preferably, the surface of the fixing sleeve is provided with a circular hole, and a locking bolt is threadedly connected to the inner wall of the fixing sleeve in the circular hole. The locking bolt abuts against the surface of the rotary joint. By using the cooperation of the fixing sleeve and the locking bolt, the position of the rotary joint can be fixed, which improves the stability and firmness of the rotary joint during use, prevents it from being displaced or loosened under rotation or air pressure impact, and ensures the sealing and continuity of the gas transmission channel.

[0010] Preferably, the drive shaft of the first servo motor passes through the upper surface of the assembly frame, the first servo motor is electrically connected to the electrical control box, the gear is movably abutting against the upper surface of the assembly frame, the gear meshes with the tooth groove of the gear ring, the gear ring is movably abutting against the upper surface of the assembly frame, the placement table is located in the processing cavity of the machine body, and the placement table is movably abutting against the lower surface of the cover. By utilizing the cooperation of the gear and the gear ring, the placement table can be synchronously rotated under the drive of the servo motor, so that the work station cavity on the placement table can rotate accordingly, thereby adjusting the work station, realizing the automatic switching function of multiple work stations, and improving the continuous processing capacity and production efficiency of the equipment.

[0011] Preferably, the rotary joint penetrates the upper surface of the assembly frame, the air distribution outlet is movably abutted against the upper surface of the assembly frame, the connecting pipe is inserted into the inner wall of the placement platform, and the surface of the isolator is provided with vent holes with a diameter of 0.5-1mm. The isolator can separate the connecting pipe from the workpiece, and at the same time, the isolator can ensure that the adsorption force of the connecting pipe on the workpiece is balanced, avoiding damage to the workpiece surface due to excessive local pressure. At the same time, the vent hole design can balance the air pressure on both sides of the isolator, preventing airflow turbulence during negative pressure adsorption from affecting the positioning accuracy.

[0012] Preferably, the surfaces of the extension frame and the assembly frame are in movable contact. The number of protrusions is six, and the six protrusions are arranged in a linear array with reference to the horizontal axis of the extension frame. The positioning bolt has a groove that matches the protrusion on the side near the extension frame. The positioning bolt is sleeved on the surface of the protrusion through the groove. By using the cooperation between the protrusion and the positioning bolt, the unfolding distance of the extension frame at different positions can be adjusted under the operation of the user. After the adjustment is completed, the position of the extension frame can be stably locked to prevent the extension frame from shifting due to vibration or airflow during equipment operation. This ensures the relative positional accuracy of the reflector and the laser rangefinder, thereby improving the accuracy of station positioning and the stability of the etching process.

[0013] Preferably, a material handling device is provided inside the processing cavity of the machine body. The material handling device includes a guide sleeve, which is fixedly connected to the inner wall of the processing cavity of the machine body. A cover plate is fixedly connected to the upper surface of the guide sleeve. A telescopic column is installed on the inner wall of the guide sleeve. A top shaft is fixedly connected to the inner wall of the telescopic column. A guide frame is fixedly connected to the surface of the telescopic column. The guide frame is slidably connected to the inner wall of the guide sleeve. A spring is fixedly connected to the upper surface of the guide frame. The spring movably abuts against the lower surface of the cover plate. An adsorption component is provided on the upper surface of the top shaft. A drive shaft is slidably connected to the inner wall of the telescopic column. A coupler positive terminal is fixedly connected to the lower surface of the drive shaft. A protective cover is fixedly connected to the lower surface of the assembly frame. A servo motor II is fixedly connected to the lower surface of the protective cover. A coupler negative terminal is fixedly connected to the drive shaft of the servo motor II. A fastening sleeve is threaded onto the interface on the surface of the protective cover. A power transmission line is inserted into the interface of the protective cover. By utilizing the cooperation between the guide sleeve and the guide frame, the telescopic column can move along the reciprocating groove on the inner wall of the guide sleeve during rotation, ensuring that the telescopic column can perform reciprocating motion in the up and down direction during rotation, thereby driving the adsorption component to complete the material picking and discharging actions.

[0014] Preferably, the adsorption assembly includes a tripod, which is fixedly connected to the upper surface of the top shaft. An air pump is fixedly connected to the inner wall of the tripod, and the power transmission line is fixedly connected to the connection port of the air pump. A suction cup is fixedly connected to the interface of the air pump, and a rubber ring is fixedly connected to the lower surface of the suction cup. By utilizing the cooperation of the air pump and the suction cup, the workpiece can be adsorbed in the working state. At the same time, the rubber ring can enhance the sealing between the suction cup and the workpiece surface, prevent air leakage during the adsorption process, and ensure the stability and reliability of the material picking action.

[0015] Preferably, the cover plate is sleeved on the surface of the top shaft, the outer diameter of the telescopic column is equal to the maximum outer diameter of the top shaft, and a damping rubber strip is fixedly connected to the surface of the guide frame. The damping rubber strip is slidably connected to the inner wall of the guide sleeve. The damping rubber strip can increase the friction coefficient between the guide frame and the guide sleeve, absorb excess energy when the spring is reset, reduce the shaking generated when the guide frame is pushed to reset by the spring, and improve the reset accuracy of the guide frame and other structures.

[0016] Preferably, the surface of the drive shaft is provided with a guide groove, and the inner wall of the telescopic column is provided with a guide strip adapted to the guide groove. The positive and negative poles of the coupler are magnetically connected. The power transmission line is inserted into the inner wall of the drive shaft and the inner wall of the top shaft. By using the positive and negative poles of the coupler, the motor can drive the drive shaft to rotate when it is working. At the same time, the use of the positive and negative poles of the coupler allows the power transmission line to be installed in the center position of the drive shaft, which not only ensures the stable transmission of the power transmission line, but also avoids the problem of the power transmission line getting tangled due to rotation during operation. This further optimizes the spatial layout of the equipment and makes the equipment structure more compact.

[0017] In summary, the technical effects and advantages of this invention are as follows: 1. In this invention, by setting up a workstation conversion device, the equipment can be processed using multiple workstations, reducing the problem of waiting for loading and unloading materials during the processing process, which limits the processing efficiency of the equipment, and further improving the processing efficiency of the equipment.

[0018] 2. In this invention, by setting up a material handling device, the equipment can utilize an automated structure in conjunction with a workstation conversion device to process workpieces during the processing process, thereby further increasing the processing efficiency of the equipment and improving its automation level and production stability. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 2 This is a side view of a high-voltage symmetrical trench etching process apparatus adapted to IGBT devices according to the present invention. Figure 3 This is a front view of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 4 This is a partial structural schematic diagram of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 5 This invention relates to a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. Figure 4 A front view structural diagram; Figure 6 This is a schematic diagram of the station conversion device structure of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 7 This invention relates to a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. Figure 6 A schematic diagram of the structure viewed from below; Figure 8 This is a schematic diagram of a station conversion device in a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 9 This invention relates to a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. Figure 8 Schematic diagram of the structure at point A in the middle; Figure 10 This is a partial structural diagram of the station conversion device of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 11 This is a schematic diagram of the control mechanism structure of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 12 This is a schematic diagram of the control mechanism of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 13This invention relates to a high-voltage symmetrical trench etching process equipment adapted for IGBT devices. Figure 12 Schematic diagram of the structure at point B; Figure 14 This is a schematic diagram of the material handling device structure of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 15 This is a schematic diagram of the material handling device of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 16 This is a schematic diagram of the guide component structure of the material handling device for a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention. Figure 17 This is a partial structural cross-sectional view of the material handling device of a high-voltage symmetrical trench etching process equipment adapted to IGBT devices according to the present invention.

[0020] In the diagram: 1. Body; 2. Gas circuit box; 3. Electrical control box; 4. Plasma emitter; 5. Shield; 6. Workstation conversion device; 61. Conversion mechanism; 611. Right-angle support leg; 612. Assembly frame; 613. Servo motor 1; 614. Gear; 615. Gear ring; 616. Placement platform; 617. Fixing sleeve; 618. Rotary joint; 619. Locking bolt; 6110. Air distribution manifold; 6111. Solenoid valve; 6112. Connecting pipe; 6113. Isolator; 62. Control mechanism; 621. Bracket; 622. Laser rangefinder sensor; 623. Assembly frame; 624. T-block; 625. Extension frame; 626. Reflector; 627. Protrusion; 628. Positioning bolt; 7. Material handling device; 71. Guide sleeve; 72. Cover plate; 73. Telescopic column; 74. Top shaft; 75. Guide frame; 76. Damping rubber strip; 77. Spring; 78. Adsorption assembly; 781. Tripod; 782. Air pump; 783. Suction cup; 784. Rubber ring; 79. Drive shaft; 710. Coupler positive terminal; 711. Servo motor II; 712. Coupler negative terminal; 713. Protective cover; 714. Fastening sleeve; 715. Power transmission line. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] refer to Figures 1-17 The high-voltage symmetrical trench etching process equipment adapted to IGBT devices includes a body 1, a gas path box 2, an electrical control box 3, a plasma emitter 4, and a shield 5. The gas path box 2 is fixedly connected to the surface of the body 1, the electrical control box 3 is fixedly connected to the upper surface of the body 1, the plasma emitter 4 is installed on the inner wall of the body 1, the shield 5 is fixedly connected to the inner wall of the body 1, the plasma emitter 4 is located inside the shield 5, and a station conversion device 6 is provided on the inner wall of the body 1. The workstation conversion device 6 includes a conversion mechanism 61, which includes a right-angle support leg 611. The right-angle support leg 611 is fixedly connected to the inner wall of the machine body 1. An assembly frame 612 is fixedly connected to the lower surface of the right-angle support leg 611. A servo motor 613 is fixedly connected to the lower surface of the assembly frame 612. A gear 614 is fixedly connected to the drive shaft of the servo motor 613. A gear ring 615 adapted to the gear 614 is rotatably connected to the inner wall of the machine body 1. The upper surface of the assembly frame 612 is fixedly connected to a placement platform 616, the lower surface of the assembly frame 612 is fixedly connected to a fixing sleeve 617, the inner wall of the fixing sleeve 617 is equipped with a rotary joint 618, the upper interface of the rotary joint 618 is threadedly connected to a gas distributor 6110, the interface of the gas distributor 6110 is threadedly connected to a solenoid valve 6111, the interface of the solenoid valve 6111 is threadedly connected to a connecting pipe 6112, and the inner wall of the placement platform 616 is fixedly connected to an isolator 6113. The workstation conversion device 6 also includes a control mechanism 62 consisting of a bracket 621, a laser rangefinder 622, an assembly frame 623, a T-block 624, an extension frame 625, a reflector 626, a protrusion 627, and a positioning bolt 628.

[0023] The control mechanism 62 includes a bracket 621, which is fixedly connected to the upper surface of the assembly frame 612. A laser rangefinder sensor 622 is fixedly connected to the surface of the assembly frame 612. An assembly frame 623 is fixedly connected to the surface of the solenoid valve 6111. A T-block 624 is slidably connected to the inner wall of the assembly frame 623. An extension frame 625 is fixedly connected to the surface of the T-block 624. A reflector 626 adapted to the laser rangefinder sensor 622 is fixedly connected to the inner wall of the extension frame 625. There are six reflectors 626 arranged in a circular array with reference to the rotation axis of the toothed ring 615. The six reflectors 626 are labeled A1, A2, A3, A4, A5, and A6, respectively. A protrusion 627 is fixedly connected to the surface of the assembly frame 612. Threaded holes are opened on the surface of the extension frame 625. The frame 625 is threaded with a positioning bolt 628 on the inner wall of the threaded hole. Using a laser rangefinder 622, when the laser signal emitted by the laser rangefinder 622 is reflected back by the reflector 626, the distance between the sensor and the reflector 626 can be accurately calculated by measuring the time difference of the laser's round trip. According to a preset distance threshold, when the laser rangefinder 622 detects that the distance to the reflector 626 with specific marks such as A1, A2, etc., reaches the corresponding value, it will send a signal to the control system. After receiving the signal, the control system will quickly control the solenoid valve 6111 corresponding to the reflector 626 to perform the operation, realizing the closing or opening operation of the solenoid valve 6111, thereby accurately controlling the switching of the workstation and the execution of related processes, ensuring that the entire high-pressure symmetrical trench etching process equipment can operate stably and efficiently.

[0024] The fixed sleeve 617 has a circular hole on its surface. A locking bolt 619 is threaded onto the inner wall of the circular hole. The locking bolt 619 abuts against the surface of the rotary joint 618. By using the cooperation of the fixed sleeve 617 and the locking bolt 619, the position of the rotary joint 618 can be fixed, which improves the stability and firmness of the rotary joint 618 during use, prevents it from being displaced or loosened under rotation or air pressure impact, and ensures the sealing and continuity of the gas transmission channel.

[0025] The drive shaft of servo motor 613 passes through the upper surface of assembly frame 612. Servo motor 613 is electrically connected to electrical control box 3. Gear 614 is in contact with the upper surface of assembly frame 612. Gear 614 meshes with the tooth groove of gear ring 615. Gear ring 615 is in contact with the upper surface of assembly frame 612. Placement table 616 is located in the processing cavity of machine body 1. Placement table 616 is in contact with the lower surface of shield 5. With the cooperation of gear 614 and gear ring 615, the placement table 616 can be rotated synchronously under the drive of servo motor, so that the work station cavity on placement table 616 can rotate accordingly, thereby adjusting the work station and realizing the automatic switching function of multiple work stations, improving the continuous processing capacity and production efficiency of equipment.

[0026] The rotary joint 618 penetrates the upper surface of the assembly frame 612, the air outlet 6110 is in contact with the upper surface of the assembly frame 612, the connecting pipe 6112 is inserted into the inner wall of the placement platform 616, and the isolator 6113 has vent holes with a diameter of 0.5-1mm on its surface. The isolator 6113 can separate the connecting pipe 6112 from the workpiece. At the same time, the isolator 6113 can ensure that the adsorption force of the connecting pipe 6112 on the workpiece is balanced, avoiding damage to the workpiece surface due to excessive local pressure. In addition, the vent hole design can balance the air pressure on both sides of the isolator 6113, preventing airflow turbulence from affecting the positioning accuracy during negative pressure adsorption.

[0027] The extension frame 625 and the assembly frame 623 have movable contact. There are six protrusions 627, which are arranged in a linear array with reference to the horizontal axis of the extension frame 625. The positioning pin 628 has a groove on the side near the extension frame 625 that matches the protrusion 627. The positioning pin 628 is fitted onto the surface of the protrusion 627 through the groove. With the cooperation of the protrusion 627 and the positioning pin 628, the unfolding distance of the extension frame 625 at different positions can be adjusted under the operation of the user. After the adjustment is completed, the position of the extension frame 625 can be locked stably to prevent the extension frame 625 from being displaced due to vibration or airflow during equipment operation. This ensures the relative positional accuracy of the reflector 626 and the laser range sensor 622, thereby improving the accuracy of station positioning and the stability of the etching process.

[0028] The machine body 1 is equipped with a material handling device 7 in its processing cavity. The material handling device 7 includes a guide sleeve 71, which is fixedly connected to the inner wall of the processing cavity of the machine body 1. A cover plate 72 is fixedly connected to the upper surface of the guide sleeve 71. A telescopic column 73 is installed on the inner wall of the guide sleeve 71. A top shaft 74 is fixedly connected to the inner wall of the telescopic column 73. A guide frame 75 is fixedly connected to the surface of the telescopic column 73. The guide frame 75 is slidably connected to the inner wall of the guide sleeve 71. A spring 77 is fixedly connected to the upper surface of the guide frame 75. The spring 77 is in movable contact with the lower surface of the cover plate 72. An adsorption component 78 is provided on the upper surface of the top shaft 74. A drive shaft 79 is slidably connected to the inner wall of the telescopic column 73. A coupler positive electrode 710 is fixedly connected to the lower surface of the drive shaft 79. A protective cover 713 is fixedly connected to the lower surface of the assembly frame 612. A servo motor 711 is fixedly connected to the lower surface of the protective cover 713. A coupler negative electrode 712 is fixedly connected to the drive shaft of the servo motor 711. A fastening sleeve 714 is threadedly connected to the interface on the surface of the protective cover 713. A power transmission wire 715 is inserted into the interface of the protective cover 713. By utilizing the cooperation between the guide sleeve 71 and the guide frame 75, the telescopic column 73 can move along the reciprocating groove on the inner wall of the guide sleeve 71 during rotation, so as to ensure that the telescopic column 73 can perform reciprocating motion in the up and down direction during rotation, thereby driving the adsorption component 78 to complete the material picking and discharging actions.

[0029] The adsorption assembly 78 includes a tripod 781, which is fixedly connected to the upper surface of the top shaft 74. An air pump 782 is fixedly connected to the inner wall of the tripod 781. A power transmission line 715 is fixedly connected to the wiring port of the air pump 782. A suction cup 783 is fixedly connected to the interface of the air pump 782. A rubber ring 784 is fixedly connected to the lower surface of the suction cup 783. By using the cooperation of the air pump 782 and the suction cup 783, the workpiece can be adsorbed in the working state. At the same time, the rubber ring 784 can enhance the sealing between the suction cup 783 and the surface of the workpiece, prevent air leakage during the adsorption process, and ensure the stability and reliability of the material picking action.

[0030] The cover plate 72 is fitted onto the surface of the top shaft 74. The outer diameter of the telescopic column 73 is equal to the maximum outer diameter of the top shaft 74. A damping rubber strip 76 is fixedly connected to the surface of the guide frame 75. The damping rubber strip 76 is slidably connected to the inner wall of the guide sleeve 71. The damping rubber strip 76 can increase the friction coefficient between the guide frame 75 and the guide sleeve 71, absorb the excess energy when the spring 77 is reset, reduce the shaking of the guide frame 75 when it is pushed to reset by the spring 77, and improve the reset accuracy of the guide frame 75 and other structures.

[0031] The drive shaft 79 has a guide groove on its surface, and the inner wall of the telescopic column 73 has a guide strip that matches the guide groove. The positive pole 710 and the negative pole 712 of the coupler are magnetically connected. The power transmission line 715 is inserted into the inner wall of the drive shaft 79 and the inner wall of the top shaft 74. By using the positive pole 710 and the negative pole 712 of the coupler, the motor can drive the drive shaft 79 to rotate when it is working. At the same time, the use of the positive pole 710 and the negative pole 712 of the coupler allows the power transmission line 715 to be installed in the center of the drive shaft 79, which not only ensures the stable transmission of the power transmission line 715, but also avoids the problem of the power transmission line 715 getting tangled due to rotation during operation. This further optimizes the spatial layout of the equipment and makes the equipment structure more compact.

[0032] The working principle of this invention is as follows: When assembling the equipment, the pipes inside the machine body 1 are connected to the rotary joint 618, and the servo motor 1 613, servo motor 2 711 and power transmission line 715 are connected to the power supply system of the machine body 1 in sequence. After completing the above operations and the installation of the entire equipment, the equipment is moved to the designated position and the power is turned on, and the equipment can then start working. During operation, the workpiece is placed in the designated area of ​​the workstation conversion device 6. Under the drive of the workstation conversion device 6, the workpiece is sent into the shield 5. When the workpiece enters the shield 5, the plasma emitter 4 works and etches the workpiece with plasma gas. After the workpiece is etched, the workstation conversion device 6 will send out the processed workpiece. During normal operation, servo motor 613 drives gear 614 under the control of machine body 1. Gear 614 meshes with gear ring 615, which rotates the placement platform 616. At this time, the placement platform 616 rotates in a specified direction. When servo motor 613 is working, the air compressor mechanism inside machine body 1 works in conjunction with the pipeline, and with the assistance of rotary joint 618 and air distributor 6110, works with solenoid valve 6111 and connecting pipe 6112 to draw air from the isolator 6113, causing the position of the isolator 6113, where the workpiece is placed, to change. Negative pressure is applied to adsorb the workpiece placed in the placement table 616. When the toothed ring 615 drives the placement table 616, the placement table 616, in conjunction with the connecting pipe 6112, rotates the solenoid valve 6111. The solenoid valve 6111 rotates the air distributor 6110, which in turn drives the upper rotating part of the rotary joint 618. During the rotation of the solenoid valve 6111, the solenoid valve 6111, in conjunction with the assembly frame 623 and the extension frame 625, moves the reflector 626. The reflector 626 follows the movement and approaches the laser rangefinder 622. After receiving the reflected light from the reflector 626, the device 622 identifies the reflector 626 based on the reflected light. When the identified reflector 626 is A1, the laser rangefinder 622, in conjunction with the electrical control box 3, controls the solenoid valve 6111 at the corresponding position A1 to close, thus stopping the adsorption in the placement area at the feeding position. When the placement table 616 rotates again, causing the reflector 626 at position A1 to move away from the laser rangefinder 622, the laser rangefinder 622 determines that the reflector 626 at position A1 has moved away and, in conjunction with the electrical control box... 3. The solenoid valve 6111 at position A1 is opened, so that the connecting pipe 6112 and the air distribution outlet 6110 are reconnected, thereby allowing the workpiece at position A1 to be attracted onto the placement table 616, ensuring that the workpiece at position A1 can be sent into the processing area under the action of the placement table 616; by setting up the station conversion device 6, the equipment can be processed in multiple stations, reducing the problem of waiting for loading and unloading during the processing process caused by the use of single station processing, which limits the processing efficiency of the equipment, and further improving the processing efficiency of the equipment.

[0033] Additionally, when the equipment is in operation, connect it to the production line, ensuring that the feeding and unloading conveyors are located on the left and right sides of the equipment, respectively, and that they are aligned with their corresponding adsorption positions. Once preparation for processing is complete, the machine body 1 controls the second servo motor 711 to operate. The second servo motor 711, in conjunction with the negative terminal 712 and positive terminal 710 of the coupler, rotates the drive shaft 79. The drive shaft 79 rotates the telescopic column 73, which in turn rotates the top shaft 74 and the guide frame 75. The top shaft 74 drives the adsorption assembly 78 to rotate, and the guide frame 75, in conjunction with the guide sleeve 71, pushes the telescopic assembly upwards during rotation. The telescopic column 73 is pushed and the spring 77 is squeezed at the same time. The telescopic column 73 simultaneously lifts the top shaft 74. The top shaft 74 simultaneously lifts the adsorption component 78 during rotation. When the adsorption component 78 rotates 120°, the servo motor 711 stops driving. At this time, the guide frame 75 stops lifting the telescopic column 73 under the guidance of the guide sleeve 71 and stops applying pressure to the spring 77. The spring 77 loses pressure and rebounds, pushing the guide frame 75 to reset. Under the guidance of the guide sleeve 71, the guide frame 75 pushes the telescopic column 73 downward in the vertical direction. The telescopic column 73 pulls the top shaft 74, and the top shaft 74 pulls the adsorption component 78 to reset. When the adsorption component 78 is in the reset state and the suction cup 783 above the placement table 616 has a workpiece adsorbed, the workpiece follows the aforementioned motion trajectory into the placement table 616. When the workpiece enters the placement table 616, the electrical control box 3 controls the air pump 782 to stop working. At this time, the suction cup 783 loses its adsorption force and stops adsorbing the workpiece. The workpiece falls into the placement table 616, and the placement table 616 rotates, moving the newly placed workpiece out of the adsorption area of ​​the suction cup 783 above it. At the same time, the workpiece that has been processed is moved to below the suction cup 783. When the processed workpiece is moved to the suction cup 78... When the workpiece is at position 3, the placement table 616 stops rotating. At this time, the air pump 782 restarts and adsorbs the finished workpiece. Meanwhile, the suction cup 783 on the left side works synchronously and adsorbs the new workpiece. After adsorption is completed, the servo motor 711 restarts. At this time, the adsorption component 78 moves along the motion trajectory in the above steps. After the movement is completed, the finished workpiece falls to the unloading conveyor mechanism, and the new workpiece is moved to the top of the placement table 616. When the new workpiece falls into the placement table 616, the finished workpiece falls onto the unloading conveyor mechanism and is sent to the next processing stage by the unloading conveyor mechanism. Then, the material handling device 7 can operate normally according to the above steps and cooperate with the station conversion device 6 to realize the loading and unloading of workpieces. By setting up the material handling device 7, the equipment can use the automated structure to cooperate with the station conversion device 6 to process workpieces during the processing process, so as to further increase the processing efficiency of the equipment and improve the automation level and production stability of the equipment.

[0034] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer for control.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-voltage symmetric trench etching process device for adapting IGBT devices, comprising a machine body (1), a gas path box (2), an electrical control box (3), a plasma emitter (4) and a mask (5), characterized in that: The gas path box (2) is fixedly connected with the surface of the machine body (1), the electric appliance control box (3) is fixedly connected with the upper surface of the machine body (1), the plasma emitter (4) is installed on the inner wall of the machine body (1), the shield (5) is fixedly connected with the inner wall of the machine body (1), the plasma emitter (4) is located in the inside of the shield (5), and the inner wall of the machine body (1) is provided with a station conversion device (6). The station conversion device (6) comprises a conversion mechanism (61), the conversion mechanism (61) comprises a right-angle support leg (611), the right-angle support leg (611) is fixedly connected with the inner wall of the machine body (1), the lower surface of the right-angle support leg (611) is fixedly connected with an assembling frame (612), the lower surface of the assembling frame (612) is fixedly connected with a servo motor I (613), the driving shaft of the servo motor I (613) is fixedly connected with a gear (614), the inner wall of the machine body (1) is rotatably connected with a gear ring (615) matched with the gear (614), the upper surface of the gear ring (615) is fixedly connected with a placing table (616), the lower surface of the assembling frame (612) is fixedly connected with a fixing sleeve (617), the inner wall of the fixing sleeve (617) is installed with a rotary joint (618), the upper interface of the rotary joint (618) is screw-connected with a gas distribution row (6110), the interface of the gas distribution row (6110) is screw-connected with a solenoid valve (6111), the interface of the solenoid valve (6111) is screw-connected with a connecting pipe (6112), and the inner wall of the placing table (616) is fixedly connected with an isolator (6113). The station conversion device (6) further comprises a control mechanism (62) composed of a support (621), a laser distance measuring sensor (622), an assembling frame (623), a T-shaped block (624), an extension frame (625), a reflecting plate (626), a convex block (627) and a positioning bolt (628).

2. The high voltage symmetric trench etching process equipment for adapting IGBT devices according to claim 1, characterized in that: The control mechanism (62) comprises a support (621), the support (621) is fixedly connected with the upper surface of the assembling frame (612), the surface of the assembling frame (612) is fixedly connected with a laser distance measuring sensor (622), the surface of the solenoid valve (6111) is fixedly connected with an assembling frame (623), the inner wall of the assembling frame (623) is slidably connected with a T-shaped block (624), the surface of the T-shaped block (624) is fixedly connected with an extension frame (625), the inner wall of the extension frame (625) is fixedly connected with a reflecting plate (626) matched with the laser distance measuring sensor (622), the surface of the assembling frame (612) is fixedly connected with a convex block (627), the surface of the extension frame (625) is provided with a threaded hole, and the inner wall of the threaded hole is screw-connected with a positioning bolt (628).

3. The high voltage symmetric trench etching process equipment for adapting IGBT devices of claim 1, wherein: The surface of the fixing sleeve (617) is provided with a circular hole, the inner wall of the circular hole is screw-connected with a locking bolt (619), and the locking bolt (619) abuts against the surface of the rotary joint (618).

4. The high voltage symmetric trench etching process equipment for adapting IGBT devices of claim 1, wherein: The drive shaft of the servo motor one (613) penetrates the upper surface of the assembly frame (612), the servo motor one (613) is electrically connected with the electric control box (3), the gear (614) is in movable abutment with the upper surface of the assembly frame (612), the gear (614) is in mesh with the tooth groove of the gear ring (615), the gear ring (615) is in movable abutment with the upper surface of the assembly frame (612), the placement table (616) is located in the machining cavity of the machine body (1), and the placement table (616) is in movable abutment with the lower surface of the cover (5).

5. The high voltage symmetric trench etching process equipment for adapting IGBT devices of claim 1, wherein: The rotary joint (618) penetrates the upper surface of the assembly frame (612), the gas distribution row (6110) is in movable abutment with the upper surface of the assembly frame (612), the connecting pipe (6112) is inserted with the inner wall of the placement table (616), and the surface of the isolator (6113) is provided with a gas permeable hole.

6. The high voltage symmetric trench etching process equipment for adapting IGBT devices of claim 2, wherein: The extension frame (625) is in movable abutment with the surface of the assembly frame (623), the number of the protrusions (627) is six, the six protrusions (627) are arranged in a linear array with the horizontal axis of the extension frame (625) as a reference, the positioning pin (628) is provided with a groove matched with the protrusion (627) on the side close to the extension frame (625), and the positioning pin (628) is sleeved on the surface of the protrusion (627) through the groove.

7. The high voltage symmetric trench etching process device for adapting IGBT devices of claim 1, wherein: The machining cavity of the machine body (1) is provided with a taking device (7), the taking device (7) comprises a guide sleeve (71), the guide sleeve (71) is fixedly connected with the inner wall of the machining cavity of the machine body (1), the upper surface of the guide sleeve (71) is fixedly connected with a cover plate (72), the inner wall of the guide sleeve (71) is provided with a telescopic column (73), the inner wall of the telescopic column (73) is fixedly connected with a top shaft (74), the surface of the telescopic column (73) is fixedly connected with a guide frame (75), the guide frame (75) is in sliding connection with the inner wall of the guide sleeve (71), the upper surface of the guide frame (75) is fixedly connected with a spring (77), the spring (77) is in movable abutment with the lower surface of the cover plate (72), and the upper surface of the top shaft (74) is provided with an adsorption assembly (78). The inner wall of the telescopic column (73) is slidably connected with a transmission shaft (79), the lower surface of the transmission shaft (79) is fixedly connected with a coupler positive electrode (710), the lower surface of the assembly frame (612) is fixedly connected with a protective cover (713), the lower surface of the protective cover (713) is fixedly connected with a servo motor two (711), the drive shaft of the servo motor two (711) is fixedly connected with a coupler negative electrode (712), the interface of the surface of the protective cover (713) is threadedly connected with a fastening sleeve (714), and the interface of the protective cover (713) is inserted with a power transmission line (715).

8. The high voltage symmetric trench etching process device for adapting IGBT devices of claim 7, wherein: Said adsorption component (78) includes a tripod (781), the upper surface of the top shaft (74) is fixedly connected with the tripod (781), the inner wall of the tripod (781) is fixedly connected with the air pump (782), the wiring port of the air pump (782) is fixedly connected with the power transmission line (715), the interface of the air pump (782) is fixedly connected with the suction disc (783), the lower surface of the suction disc (783) is fixedly connected with the rubber ring (784).

9. The high voltage symmetric trench etching process device for adapting IGBT devices of claim 7, wherein: The surface of the top shaft (74) is sleeved with the cover plate (72), the outer diameter of the telescopic column (73) is equal to the maximum outer diameter of the top shaft (74), the surface of the guide frame (75) is fixedly connected with the damping rubber strip (76), and the damping rubber strip (76) is in sliding connection with the inner wall of the guide sleeve (71).

10. The high voltage symmetric trench etching process equipment for adapting IGBT devices of claim 7, wherein: The surface of the transmission shaft (79) is provided with a guide groove, the inner wall of the telescopic column (73) is provided with a guide strip matched with the guide groove, the coupler positive electrode (710) and the coupler negative electrode (712) are in magnetic attraction connection, the power transmission line (715) is inserted into the inner wall of the transmission shaft (79), and the power transmission line (715) is inserted into the inner wall of the top shaft (74).

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