Substrate processing apparatus

Abstract

The present invention relates to a substrate processing apparatus for performing a high-pressure process, comprising: an inner tube (100) in which a processing space (S1) in which a plurality of substrates are stacked in the vertical direction and processed is formed; a heating unit (200) that surrounds at least a part of the inner tube (100), forms a heating space (S2) between the heating unit (200) and the inner tube (100), and generates heat by receiving power from the outside; an outer tube (300) in which the heating unit (200) is disposed, an inner space (S3) is formed between the outer tube (300) and the heating unit (200), and at least one opening (302) that can be opened and closed is formed in a side surface so as to be accessible from the outside to the inner space (S3); the heating unit (200) is electrically connected to a power supply unit (700), which transmits the electric power through the outer tube (300), at a position corresponding to the opening (302).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus for performing a high-voltage process. Background Technology

[0002] As a substrate processing apparatus for substrate processing processes such as wafers, a reactor utilizing a carrier can be used to perform processes such as deposition, etching, and heat treatment on multiple substrates.

[0003] The conventional substrate processing apparatus in the reactor form described above is a single or dual tube that can be used to perform substrate processing by inserting multiple substrates through a carrier, and is equipped with a heater on the outermost perimeter to supply heat to form a process temperature environment.

[0004] On the other hand, when performing various processes on the substrate, especially annealing, to remove residues on the substrate surface and inside, and to improve film quality through recrystallization of the substrate surface, it is necessary to perform substrate processing at high temperatures above 800°C and high pressures above 2ATM as required.

[0005] However, conventional substrate processing devices employ double tubes to protect the tube body from damage caused by high voltage conditions above 2ATM. However, in the case of quartz materials, there is a high risk of damage under high voltage conditions, which weakens durability and causes pollution problems due to gas leakage when damaged.

[0006] In addition, correspondingly, in the case of strengthening the double tube material, due to the material, the heat transfer rate is low, so there is a problem that it is difficult to receive heat from the heater located at the outermost edge to achieve high temperature conditions sufficient for substrate processing.

[0007] Therefore, in order to have sufficient rigidity to withstand high pressure while improving heating efficiency to achieve the process temperature, a heater is installed inside the tube. However, in this case, there is a problem that the heating part is difficult to repair and maintain.

[0008] In particular, the terminals and the connection parts with the power cord, which are configured to supply power to the heating unit from the outside, are prone to damage and poor contact, thus requiring repair and maintenance. However, since the heater is located inside the tube, it is difficult to access and maintain the heating unit. Summary of the Invention

[0009] The problem to be solved

[0010] The object of the present invention is to provide a substrate processing apparatus that facilitates maintenance of the internal heating element in order to solve the problems described above.

[0011] Problem-solving methods

[0012] This invention is proposed to achieve the objectives of the invention as described above. The invention discloses a substrate processing apparatus, comprising: an inner tube 100 forming a processing space S1 inside, wherein the processing space S1 is for processing multiple substrates stacked in a vertical direction; a heating unit 200 surrounding at least a portion of the inner tube 100, forming a heating space S2 between itself and the inner tube 100, and receiving power from the outside to generate heat; and an outer tube 300 housing the heating unit 200 inside, forming an internal space S3 between itself and the heating unit 200, and forming at least one switchable opening 302 on its side to allow external access to the internal space S3; wherein the heating unit 200 is electrically connected to a power supply unit 700 that transmits power through the outer tube 300 at a position corresponding to the opening 302.

[0013] The heating part 200 is such that when the opening 302 is opened, the connection portion with the power supply part 700 can be exposed.

[0014] The heating part 200 may include: a side heat insulation part 210 surrounding the inner tube 100; a heating part 220 disposed on the inner surface of the side heat insulation part 210 and heated by the applied electricity; and a terminal part 240 disposed on the outer surface of the side heat insulation part 210 and electrically connected to both ends of the heating part 220.

[0015] The terminal portion 240 is configurable at a height corresponding to the opening portion 302.

[0016] The terminal portion 240 may include: a connecting terminal 241 disposed outside the side heat insulation portion 210 for connection with the heating portion 220; and a connecting rod 242 extending from the connecting terminal 241 to the opening portion 302 for connection with the power supply portion 700.

[0017] The connecting rod 242 may extend from the connecting terminal 241 located beyond the opening 302, such that the end that engages with the power supply unit 700 is located at a position corresponding to the opening 302.

[0018] The connecting terminal 241 and the connecting rod 242 can be integrated.

[0019] The opening 302 may be formed at a height corresponding to the terminal portion 240.

[0020] The connecting terminal 241 is configured to have multiple connecting terminals 241 arranged in a vertical direction to overlap on a plane; the connecting rod 242 may include at least one of a horizontal rod 242a and a vertical rod 242b, wherein the horizontal rod 242a extends in a horizontal direction to prevent overlap with the remaining connecting terminals 241 other than the extended connecting terminal 241, and the vertical rod 242b extends in a vertical direction.

[0021] The terminal portion 240 has a plurality of terminal portions 240, and for a plurality of heating regions distinguished in the up and down direction, each heating region may be configured with at least one terminal portion 240.

[0022] For a single opening 304, multiple terminal portions 240 may be corresponding.

[0023] The opening 304 may be arranged in multiple ways in the vertical direction outside the outer tube 300.

[0024] The outer tube 300 may include: a container portion 310 forming the internal space S3 and forming the opening 302 on the side; a side flange 360 ​​disposed in the container portion 310 at a position corresponding to the opening 302; and a door portion 370 disposed on the side flange 360 ​​to open and close the opening 302.

[0025] The outer tube 300 may include at least one first connecting portion 350, which is connected to the power supply unit 700 on the side to transmit the power to the heating unit 200 from the outside.

[0026] The first connection part 350 is an external power supply line 710 and an internal power supply line 720 that can be electrically connected in the power supply part 700. The external power supply line 710 is connected to the outside of the outer tube 300, and the internal power supply line 720 is configured and connected in the internal space S3.

[0027] The outer tube 300 may include at least one second connection portion 390, which is configured to electrically connect a temperature sensor disposed on the side through the heating part 200 to the outside.

[0028] The substrate processing apparatus may further include a cooling section 600, which is disposed outside at least a portion of the outer tube 300 and in which a heat transfer medium flows.

[0029] The internal space S3 and the heating space S2 can be interconnected.

[0030] The inner tube 100 may contain quartz, and the outer tube 300 may contain SUS.

[0031] The internal space S3 is designed to maintain a higher pressure than the processing space S1.

[0032] The heating space S2 is designed to maintain a temperature above 800°C for at least a portion of the time during the process performed in the processing space S1.

[0033] The internal space S3 is designed to maintain a pressure of 2 ATM or higher during at least a portion of the time that the process is performed within the processing space S1.

[0034] The effects of the invention

[0035] The substrate processing apparatus according to the present invention is provided with a processing container that can be used under high pressure of 2 ATM or higher without damage in the outermost part, thereby improving the protection function, and has the advantage of improving heating efficiency through the inner tube close to the heating part.

[0036] Furthermore, according to the substrate processing apparatus of the present invention, the heating section disposed inside the outer tube can be easily accessed through an opening that is switchably disposed on the side of the processing container, thus having the advantage of being easy to repair and maintain the heating section.

[0037] In particular, in order to supply power to the heating unit, the terminal part connected to the power supply unit is connected to the power supply unit at a height corresponding to the opening, thus having the advantage of making it easy to repair and maintain the contact parts. Attached Figure Description

[0038] Figure 1 This is a perspective view showing the substrate processing apparatus according to the present invention.

[0039] Figure 2 It is shown Figure 1 A front view of the substrate processing device.

[0040] Figure 3 It is shown Figure 2 An enlarged view of the shape of the opening in the substrate processing apparatus.

[0041] Figure 4 It is shown Figure 1 A cross-sectional view of the substrate processing device.

[0042] (Explanation of reference numerals in the attached diagram)

[0043] 100: Inner tube; 200: Heating section

[0044] 300: External pipe; 400: Cooling gas supply section

[0045] 500: Damper Section Detailed Implementation

[0046] Referring to the accompanying drawings, the substrate processing apparatus according to the present invention will be described in detail below.

[0047] like Figure 1 and Figure 2 As shown, the substrate processing apparatus according to the present invention includes: an inner tube 100, which forms a processing space S1 inside, wherein the processing space S1 is for processing multiple substrates stacked in a vertical direction; a heating unit 200, which is configured to surround at least a portion of the inner tube 100 to form a heating space S2 between itself and the inner tube 100, and receives electricity from the outside to generate heat; and an outer tube 300, which arranges the heating unit 200 inside, forms an internal space S3 between itself and the heating unit 200, and forms at least one switchable opening 302 on its side to allow access to the internal space S3 from the outside.

[0048] In addition, the substrate processing apparatus according to the present invention includes a cooling gas supply unit 400 for supplying cooling gas to the heating space S2.

[0049] In addition, the substrate processing apparatus according to the present invention may also include a damper 500, which conveys the exhaust gas discharged from the heating space S2 to the outside.

[0050] In addition, the substrate processing apparatus according to the present invention may further include a cooling section 600, which is at least a portion disposed outside the outer tube 300 and in which a heat medium flows.

[0051] Here, the substrate being processed can be understood to include all substrates such as substrates used in display devices such as LED, LCD, and OLED, semiconductor substrates, solar cell substrates, and glass substrates.

[0052] Furthermore, for the process performed by the substrate processing apparatus according to the present invention, any process disclosed previously can be applied as long as it is a substrate processing process. For example, processes such as deposition, etching, and heat treatment can be performed.

[0053] For example, the substrate processing apparatus according to the present invention can perform annealing and the like to improve the quality of thin films on substrates such as wafers. In particular, it can effectively improve the quality of thin films by promoting recrystallization or migration of impurities that remain or form weak bonds on and inside the substrate or thin film.

[0054] At this time, the substrate processing apparatus according to the present invention is such that the processing space S1 for performing substrate processing can repeatedly perform high-pressure processes that form high pressures above atmospheric pressure, such as 2 ATM or more, and low-pressure processes in a vacuum state, and can perform heat treatment at high temperatures above 800°C as required.

[0055] The inner tube 100, which forms the processing space S1 inside, can have various structures.

[0056] At this time, the inner tube 100 is configured as a vertical cylinder with an arched top, forming a processing space S1 inside, and the lower part is open for the entry and exit of the carrier 40 for loading multiple substrates described later.

[0057] That is, the inner tube 100 has an open lower part, and a sealed processing space S1 is formed when a carrier 40 containing multiple substrates is inserted into the lower part, so that substrate processing can be performed. After the substrate processing is completed, the carrier 40 can be lowered to the lower side and exported.

[0058] At this time, the carrier box 40 may include: a support portion 43, which supports multiple substrates at intervals in the vertical direction; a heat insulation portion 42, which is disposed on the lower side of the support portion 43 to prevent the heat of the processing space S1 from being dissipated to the outside; and a cover flange 41, which supports the heat insulation portion 42 and the substrate support portion 43 at the lower part of the heat insulation portion 42.

[0059] Accordingly, when the carrier box 40 rises into the processing space S1 inside the inner tube 100, the cover flange 41 is in close contact with the lower end of the manifold 20. The clamps 30 that clamp the cover flange 41 and the lower edge of the manifold 20 are combined to form a closed processing space S1.

[0060] In particular, the clamp 30 clamps and fixes the manifold 20 and the cover flange 41, preventing the cover flange 41 from moving downward due to the internal high pressure when performing a high-pressure process of 2ATM or higher in the processing space S1, and maintaining the sealed state of the processing space S1.

[0061] On the other hand, the inner tube 100 is supported by the manifold 20 located on the open lower end side and can communicate with the manifold 20. At this time, process gas can be received from the external first gas supply unit 80 through the supply port formed in the manifold 20.

[0062] In addition, the inner pipe 100 discharges process gas to the external first exhaust section 70 through the exhaust port formed on the manifold 20, thereby allowing the processing space S1 to be ventilated.

[0063] The inner tube 100 is made of non-metallic material, such as quartz, and as described above, can be configured to have an arched top, but is not limited thereto. Of course, it can also be configured to have a cylindrical shape with a flat top.

[0064] The heating element 200 may be a structure that surrounds at least a portion of the inner tube 100 and forms a heating space S2 between itself and the inner tube 100.

[0065] That is, the heating unit 200 may be a structure in which an inner tube 100 is arranged inside and a heating space S2 is formed between the inner tube 100 and the heating unit to create a process temperature environment in the processing space S1.

[0066] Therefore, the heating part 200 may include: a side heat insulation part 210 configured to surround the inner tube 100; a heating part 220 configured on the inner surface of the side heat insulation part 210 and heated by an applied power source; and an upper heat insulation part 230 configured on the upper end of the side heat insulation part 210 and forming an exhaust channel 231 for discharging exhaust gas from the heating space S2, which is combined with the damper part 500.

[0067] Additionally, the heating part 200 may include a terminal part 240, which is disposed outside the side heat insulation part 210 and electrically connected to both ends of the heating part 220.

[0068] The side heat insulation portion 210, as a structure surrounding the inner tube 100, can be a structure that forms the side of the heating portion 200.

[0069] At this time, the side heat insulation part 210 may be a structure in which the side is formed by multiple heat insulation materials, or it may be a structure in which the heating part 220 is arranged on the inner surface to concentrate heat to the heating space S2 and the processing space S1 and minimize the heat loss to the outside of the side heat insulation part 210.

[0070] In addition, the side heat insulation part 210 may be formed by stacking multiple annular components. In this case, multiple gas supply ports (not shown) formed in a radial direction are arranged between the annular components or between the annular components. The internal space S3 is connected to the heating space S2, and the cooling gas supplied from the cooling gas supply part 400 can be guided to be transported into the heating space S2.

[0071] The heating element 220, which is disposed inside the side heat insulation element 210 and heated by an applied power source, can have various structures.

[0072] At this time, the heating element 220 is a structure that generates heat by resistive heat generated by applying current to a resistive body. By appropriately adjusting the applied current, the heat generation and temperature can be adjusted.

[0073] On the other hand, at this time, a plurality of heating elements 220 can be arranged in the vertical direction on the inner surface of the side heat insulation portion 210. The heating element 220 is a terminal portion 240 arranged outside the side heat insulation portion 210 through the end of the side heat insulation portion 210, which can receive power from the outside.

[0074] The upper heat insulation part 230 may be a structure disposed on the upper end of the side heat insulation part 210 and forming an exhaust channel 231 for discharging exhaust gas from the heated space S2.

[0075] That is, the upper heat insulation part 230, as the structure forming the upper top of the heating part 200, includes a plurality of heat insulation plates disposed on the upper end of the side heat insulation part 210, thereby preventing heat loss from the heating space S2 to the upper side.

[0076] On the other hand, the upper heat insulation part 230 may form a discharge channel 231 to discharge the cooling gas supplied to the heating space S2 to the outside; for example, the discharge channel 231 extends from the discharge port formed on the bottom surface of the upper heat insulation part 230 (i.e., the top surface of the heating part 200) to the side of the upper heat insulation part 230, thereby guiding the discharge gas, which is the cooling gas that completes the heat exchange, to the outside.

[0077] At this time, the upper heat insulation part 230 is provided with a damper part 500 (described later) on the side, which can be connected to the exhaust channel 231. This allows the exhaust gas, which is the cooling gas supplied to the heating space S2 for heat exchange, to be transported through the exhaust channel 231 to the damper part 500.

[0078] Additionally, the heating part 200 may include: a cover portion disposed on the outermost periphery of the side heat insulation part 210 and forming a through hole communicating with the cooling gas supply part 400 described later; and a connecting flange protruding from the through hole corresponding to the cover portion and engaging with the cooling gas supply part 400.

[0079] At this time, the cover portion, as the structure forming the outermost side of the heating portion 200, is made of heat-insulating material, the same as the side heat insulation portion 210, and can be configured on the outermost side. As another example, it can also be used as a cover surrounding the side heat insulation portion 210.

[0080] The cover can be configured to form a through hole to communicate with the cooling gas supply section 400. In particular, the through hole is formed at a position corresponding to the groove 201, which is formed by forming a boss inward on the outer side of the side heat insulation section 210 and communicating with the heating space S2, so that cooling gas can be supplied from the cooling gas supply section 400 to the groove 201 side.

[0081] Therefore, the cover portion can form a cooling gas supply flow path between itself and the groove portion 201 formed around the heating portion 200.

[0082] On the other hand, the connecting flange is configured to protrude outwards from the cover portion corresponding to the through hole, and can be combined with the cooling gas supply portion 400 described later.

[0083] At this time, a sealing component (not shown) may be arranged between the connecting flange and the cooling gas supply section 400.

[0084] On the other hand, the heating part 200 is electrically connected to the power supply part 700, which transmits power through the outer tube 300, at a position corresponding to the opening 302 described later.

[0085] That is, the heating part 200 can be electrically connected at a position corresponding to the opening 302 of the container part 310 of the outer tube 300 described later, thereby exposing the connection between the power supply part 700 and the heating part 200 when the opening 302 is open.

[0086] As a result, the connection between the power supply unit 700 and the heating unit 200 is exposed as the opening 302 is opened, and thus becomes easily accessible. Therefore, it has the advantage of being a contact part with the power supply, and the connection part is easy to repair and maintain.

[0087] Therefore, the terminal portion 240 can have various structures as it is disposed outside the side heat insulation portion 210 and electrically connected to both ends of the heating portion 220.

[0088] That is, the terminal portion 240 is a structure connected to the power supply portion 700 for applying power to the heating portion 220. As a side of the heating portion 200, it is electrically connected to the two ends of the heating portion 220 that penetrates the side heat insulation portion 210, or it is provided outside the side heat insulation portion 210 that penetrates the side heat insulation portion 210 and can be connected to the two ends of the heating portion 220.

[0089] On the other hand, the terminal portion 240 can be configured at a height corresponding to the opening 302 formed outside the container portion 310 described later.

[0090] Additionally, as another example, such as Figure 3 and Figure 4 As shown, the terminal portion 240 may include: a connecting terminal 241 disposed outside the side heat insulation portion 210 for connection with the heating portion 220; and a connecting rod 242 extending from the connecting terminal 241 to the opening portion 302 side for connection with the power supply portion 700.

[0091] That is, corresponding to the side heat insulation portion 210 and the heating portion 220 arranged in a stacked form in the vertical direction, a plurality of terminal portions 240 can be arranged at intervals in the vertical direction. Accordingly, the terminal portion 240 may also have a connecting rod 242 so that the connection point with the power supply portion 700 is located at the height corresponding to the opening portion 302 when it cannot be located at the height corresponding to the opening portion 302.

[0092] Therefore, the connecting terminal 241 can be arranged at intervals in the vertical direction outside the heating part 200 to be combined with the heating part 220 outside the side heat insulation part 210, and the connecting rod 242 can be extended from the connecting terminal 241 to the opening 302 side to be combined with the power supply part 700.

[0093] On the other hand, in this case, the connecting terminal 241 and the connecting rod 242 are integrated, which can prevent poor contact at points other than the connection portion between the power supply part 700 and the terminal part 240 that are difficult to access from the opening 302.

[0094] Alternatively, as another example, separate components where the connecting terminal 241 and the connecting rod 242 engage with each other can also be used.

[0095] On the other hand, having a plurality of terminal portions 240, for a plurality of heating regions distinguished in the up and down direction, at least one terminal portion 240 may be configured for each heating region.

[0096] At this time, some of the multiple terminal portions 240 may consist only of connecting terminals 241, depending on their position at a height corresponding to the opening portion 302, and the connecting rod 242 may be omitted; the terminal portion 240 located at a height not corresponding to the opening portion 302 has connecting terminals 241 and connecting rod 242, and the connecting part to the power supply unit 700 can be exposed when the opening portion 302 is open, through the connecting rod 242.

[0097] Therefore, depending on the distance between the position of the terminal portion 240 and the opening portion 302, the length and shape of the connecting rod 242 can be varied. In particular, considering the terminal portions 240 arranged in the vertical direction and overlapping on the plane, the connecting rod 242 can also be composed of a combination of a horizontal rod 242a and a vertical rod 242b.

[0098] That is, the connecting rod 242 may include: a horizontal rod 242a, which extends horizontally to prevent overlap with the remaining connecting terminals 241 other than the extended connecting terminals 241; and a vertical rod 242b, which extends vertically.

[0099] On the other hand, the opening 304 may have a predetermined area to correspond to the plurality of terminal portions 240; as another example, it is also possible to form a plurality of openings 304 at heights corresponding to the plurality of terminal portions 240 respectively.

[0100] Regarding the terminal portion 240 described above, it is explained that it is formed outside the side heat insulation portion 210, but it is not limited thereto. When the heating portion 200 is provided with the cover portion described above, it may also be provided outside the cover portion and pass through the cover portion and the side heat insulation portion 210 to be electrically connected to the heating portion 220.

[0101] The outer tube 300 can have various structures, which are internally configured with the inner tube 100 and the heating part 200 and form an internal space S3 between them.

[0102] That is, the outer tube 300 serves as a structure surrounding the heating part 200, and an internal space S3 can be formed between it and the heating part 200. It can be a vertical cylindrical structure with an arched top corresponding to the inner tube 100 described above.

[0103] On the other hand, the outer tube 300 is disposed outside the inner tube 100 and the heating part 200 surrounding the inner tube 100, which are used for substrate processing under high temperature and high pressure. As a protective space, an internal space S3 can be formed. Accordingly, it can be configured to prevent process gas from leaking to the outside due to damage to the inner tube 100 during high-pressure substrate processing and to have sufficient rigidity to withstand high pressure.

[0104] Therefore, the outer tube 300 can be made of a metallic material, for example, it can contain SUS.

[0105] On the other hand, the internal space S3 formed between the outer tube 300 and the heating unit 200 is, as described above, designed to serve as a protective space, maintaining a higher pressure than the processing space S1, and the heating unit 200 is configured to allow gas to pass through and is not sealed, thus allowing it to communicate with the heating space S2.

[0106] That is, the internal space S3 can maintain a pressure of 2 ATM or higher for at least a portion of the time during which the process is performed in the processing space S1, and can maintain a similar temperature as the heating space S2 is heated and the process is performed in the processing space S1, and the heating space S2 maintains a temperature of 800°C or higher for at least a portion of the time.

[0107] On the other hand, the outer pipe 300 has a separate supply port and exhaust port formed on the side, and is connected to the second gas supply unit 60 and the second gas exhaust unit 50 respectively, receiving gas supply from the outside to the internal space S3, and the internal space S3 can exhaust gas.

[0108] In addition, the heating part 200 and the outer tube 300 are respectively open at their lower ends, and the open lower ends are supported by the base part 10. At this time, the manifold 20 can be combined and set on the bottom surface of the base part 10.

[0109] On the other hand, the outer tube 300 includes: a container section 310, in which a heating section 200 is disposed, an internal space S3 is formed between the heating section 200 and the heating section 200, and an opening 301 is formed on the side so that the internal space S3 can be accessed from the outside; and a switch section disposed in the container section 310 to open and close the opening 301.

[0110] The container section 310 can have various structures, as it forms an internal space S3 and has an opening 301 on the side.

[0111] For example, the container portion 310 is made of SUS material and has an arched top, with a heating portion 200 and an inner tube 100 inserted inside, and is configured to be supported by the base portion 10 when the lower end is open.

[0112] At this time, the container part 310 may be a structure with an opening 301 formed on the side for access to maintain the damper part 500 provided in the internal space S3, wherein the damper part 500 is provided in the internal space S3 for discharging the cooling gas supplied to the heating space S2 to the outside.

[0113] The flange portion 320 may be configured to protrude in the container portion 310 at a position corresponding to the opening 301, and a door portion 330 may be provided to open and close the opening 301.

[0114] At this time, the switch door portion 330 may be a structure in which the flange portion 320 can be closed and opened through the first sealing member 332.

[0115] On the other hand, the opening and closing door portion 330 is fastened to the flange portion 320 by bolts with the first sealing member 332 in the middle, and a hinge portion is provided at one end, so that the opening 301 can be opened by rotating the hinge after the bolt is released.

[0116] In addition, the door opening 330 may also include a door opening 331, which is through-hole so that the damper 500 described later can communicate with the outside.

[0117] That is, the door opening 330 is formed by connecting the door opening 331 through the door opening, and the damper 500 is connected to the inner side of the flange 320 to cover the door opening 331, and an external pipe is connected to the outer side so that the pipe covers the door opening 331, thereby connecting the ventilation door 500 and the heat exchange module 90.

[0118] Furthermore, the switch door portion 330 and the flange portion 320 on which the switch door portion 330 is provided can be formed into a quadrilateral shape on the front side, corresponding to the damper portion 500 described later.

[0119] In addition, according to the invention, the outer tube 300, in addition to the opening 301 described above, also forms at least one opening 302 on the outer side of the container portion 310, and may also include a side flange 360 ​​and a door portion 370 corresponding to the opening 302, the door portion 370 being provided on the side flange 360 ​​to open and close the opening 302.

[0120] That is, the container portion 310 may also form at least one opening portion 302 on the lower side of the opening 301 formed on the side, thereby allowing access to the internal space S3, and may also have a side flange 360 ​​and a door portion 370 for opening and closing the opening portion 302.

[0121] At this time, the side flange 360 ​​and the door portion 370 serve as structures for repairing and maintaining the heating unit 200 by accessing the internal space S3. In particular, they can be configured to allow access for repairing and maintaining the terminal portion and power supply portion provided for supplying power to the heating unit 200.

[0122] That is, the outer tube 300 includes a side flange 360 ​​disposed in the container section 310 at a position corresponding to the opening 302 and a door section 370 provided on the side flange 360 ​​to open and close the opening 302, and the connection portion between the terminal section 240 and the power supply section 700 is located at a position corresponding to the opening 302, so that maintenance of the heating section 200 including the terminal section 240 can be easily performed by opening the door section 370.

[0123] At this time, the side flange 360 ​​and the door portion 370 are circular structures formed on the front side, and at least one, for example two, of the side flanges 360 and the door portion 370 can be arranged at intervals on the lower side of the flange portion 320 corresponding to the opening portion 302.

[0124] At this point, the side flange 360 ​​and the door portion 370 are subject to the same description as the flange portion 320 and the door opening and closing portion 330 described above, so repeated descriptions are omitted.

[0125] Additionally, the outer tube 300 may include: at least one first connecting portion 350, which is connected to the power supply portion 700 on the side to transmit power to the heating portion 200 from the outside; and at least one second connecting portion 390, which is configured to electrically connect a temperature sensor (not shown) disposed on the side of the heating portion 200 through the outside to the outside.

[0126] At this time, the first connecting part 350 and the second connecting part 390 are configured as feeders that can achieve electrical connection between the inside and outside while keeping the internal space S3 sealed. Multiple first connecting parts 350 and second connecting parts 390 can be respectively configured in the container part 310.

[0127] The first connection part 350 may be a structure that electrically connects the external power supply line 710 and the internal power supply line 720 in the power supply part 700. The external power supply line 710 is connected to the outside of the outer tube 300, and the internal power supply line 720 is configured and connected in the internal space S3. At this time, the internal power supply line 720 is connected to the external power supply line 710 to receive power, and then it can be supplied to the terminal part 240.

[0128] The second connection portion 390 is configured to provide an electrical connection between the temperature sensor provided on the side of the heating portion 200 and the outside. At least one second connection portion 390 can be configured, and multiple temperature sensors can be arranged in the vertical direction corresponding to the side of the heating portion 200.

[0129] At this time, the second connection part 390 is provided with a power supply line for supplying power to the temperature sensor and a signal line for transmitting and receiving signals for the temperature sensor value, thereby realizing an electrical connection between the external part and the temperature sensor.

[0130] The damper portion 500 can have various structures, with one end connected to the upper heat insulation portion 230 and the other end connected to the opening and closing door portion 330.

[0131] The damper section 500, which is disposed between the heating section 200 and the external heat exchange module to connect the heating space S2 and the heat exchange module, can have various structures.

[0132] For example, at least a portion of the damper portion 500 is disposed within the flange portion 320, which can cover the door opening 331, so that one end is connected to the heating portion 200 and the other end is connected to the external heat exchange module, and can be connected to the door opening portion 330.

[0133] At this time, the damper 500 may include: a damper body, which forms a flow path for the flow of discharged gas inside; and a flow regulating part, which is disposed in the damper body to regulate the opening degree of the flow path.

[0134] More specifically, the damper portion 500 is a damper body that forms an internal flow path for the exhaust gas to flow through the exhaust channel 231. It can be configured such that one end is connected to the exhaust flow path flange 232, and the other end is connected to and disposed in the opening and closing portion 330, wherein the exhaust flow path flange 232 is formed in communication with the exhaust channel 231 on the side wall of the upper heat insulation portion 230.

[0135] At this time, the damper section 500 serves as a flow regulation section, and internally includes a drive section and blades. The drive section generates power to drive the blades (such as a motor or actuator). The blades control the flow of exhaust gas in the flow path through the drive section, thereby appropriately regulating the flow rate of the exhaust gas discharged through the damper section 500.

[0136] On the other hand, the damper 500 can be a structure that can be both open and closed, but not completely closed. Instead, it can be in constant communication with the discharge channel 231 and the heat exchange module 90 described later. Accordingly, it is in constant communication with the heating space S2 and the internal space S3 connected to the heating space S2 to form a high pressure inside and to transport high-temperature exhaust gas.

[0137] The cooling gas supply unit 400 can have various structures, as it is provided with a switch unit to supply cooling gas to the inside of the outer pipe 300.

[0138] At this time, the cooling gas supply unit 400 can supply cooling gas to the heating space S2 to cool the heating space S2.

[0139] At this time, the cooling gas supply unit 400 can supply cooling gas to the heating space S2 through the switch unit. More specifically, it can be configured to connect to the heating unit 200 by having a through flange 320 on the lower side.

[0140] For example, the cooling gas supply unit 400 may include: an external supply pipe 410, which is connected to and disposed on the lower side of the flange 320 to deliver cooling gas from the outside; and an internal supply pipe 420, which is connected to the external supply pipe 410 and disposed inside the flange 320, with one end connected to the side of the heating unit 200 and the other end connected to the inner surface of the flange 320.

[0141] The external supply pipe 410, as a structure that is combined with and provided on the lower side of the flange 320 to transport cooling gas from the outside, can have various structures.

[0142] At this time, the cooling gas supplied through the external supply pipe 410 is external gas, and the valve 430 at the end of the external supply pipe 410 is switched to receive the external gas, which can be delivered to the internal supply pipe 420.

[0143] Alternatively, as another example, the external supply pipe 410 is connected via valve 430 to a separately configured cooling gas supply source (not shown) to receive cooling gas that can be supplied to the internal supply pipe 420 at a flow rate regulated by valve 430.

[0144] At this time, the external supply pipe 410 can be configured to be attached to the bottom surface of the quadrilateral flange 320, or more specifically, it can be configured to extend to the side of the flange 320 so that it does not protrude to the opposite side of the container portion 310 on the plane with reference to the flange 320.

[0145] That is, the external supply pipe 410 can be formed into an "L" shape on the front of the opening and closing door 330, thereby the external supply pipe 410 has the advantages of improving space efficiency and being suitable for a compact device structure.

[0146] The internal supply pipe 420 is provided inside the flange portion 320 in communication with the external supply pipe 410, and one end is attached to the side of the heating part 200 while the other end is attached to the inner surface of the flange portion 320. Various structures are possible.

[0147] That is, such as Figure 2 As shown, the internal supply pipe 420 is a structure that communicates with the external supply pipe 410 to supply cooling gas to the heating section 200 side, and at least a portion of it may be disposed within the flange portion 320.

[0148] For example, the internal supply pipe 420 may include: a first internal supply pipe that forms a cooling gas delivery path inside and is connected to the connecting flange described above; and a second internal supply pipe, one end of which is connected to the first internal supply pipe and the other end of which is connected to and disposed on the inner surface of the flange portion 320 corresponding to the external supply pipe 410.

[0149] At this time, the second internal supply pipe is disposed between the bottom surface of the first internal supply pipe of the hexahedron and the inner surface of the flange portion 320, and the cooling gas supplied from the bottom surface of the flange portion 320 is transported to the first internal supply pipe, and the cooling gas can be guided to move horizontally through the first internal supply pipe to be transported to the heating part 200 side.

[0150] On the other hand, the internal supply pipe 420, by combining with the connecting flange mentioned above, can transport cooling gas through the groove 201 and the side heat insulation part 210 to the heating space S2. At this time, in order to ensure that the cooling gas is evenly transported to the heating space S2 side in the vertical direction of the side heat insulation part 210, a separate flow path can also be formed in the vertical direction of the side heat insulation part 210.

[0151] On the other hand, the internal supply pipe 420 is connected to the heating space S2 at a height corresponding to the boundary between the side heat insulation part 210 and the upper heat insulation part 230. Moreover, as described above, it can also be connected at a position corresponding to the groove 201, which is formed to have a boss on the outer side of the side heat insulation part 210 and communicate with the heating space S2.

[0152] Additionally, the internal supply pipe 420 can be configured inside the flange portion 320 and below the damper portion 500.

[0153] On the other hand, the cooling gas supply section 400, which includes the external supply pipe 410 and the internal supply pipe 420, can be configured as a pair on both sides with respect to the flange 320 in the front direction center. In this case, the external supply pipes 410 can extend in opposite directions to each other.

[0154] At this time, the external supply pipe 410 and the internal supply pipe 420 can be formed as a symmetrical pair on the front with the center of the damper portion 500 and the door opening portion 330 as reference.

[0155] The cooling section 600, as at least a part disposed outside the outer tube 300 and in which the heat medium flows, can have various structures.

[0156] For example, the cooling section 600 may be configured to contact the outer surface of the container section 310 and have a heat medium flowing inside it, thereby reducing the temperature of the container section 310 through heat exchange between the heat medium and the container section 310.

[0157] Furthermore, the cooling section 600 may be configured to extend around the side of the flange 320 to cool the flange 320, and may also be extended and provided on the side flange 360 ​​as needed.

[0158] For example, the cooling section 600 may include a first cooling pipe 610 and a second cooling pipe 620. The first cooling pipe 610 is disposed outside the outer tube 300 and a heat medium flows inside it. The second cooling pipe 620 extends from the first cooling pipe 610 to surround at least a portion of the flange portion 320 and a heat medium flows inside it. Accordingly, the first cooling pipe 610 and the second cooling pipe 620 may form a single heat medium flow path.

[0159] In this case, the heat medium is supplied to the second cooling pipe 620 side of the high-temperature flange 320 through the damper 500, flows along the second cooling pipe 620, and then flows through the first cooling pipe 610 to the external heat exchanger, thereby improving the cooling efficiency.

[0160] The above description is only a part of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention should not be limited to the above embodiments. The technical ideas and fundamental technical ideas of the present invention described above are all included within the scope of the present invention.

Claims

1. A substrate processing apparatus characterized by comprising: Comprising: an inner tube (100) forming a processing space (S1) inside, which processes a plurality of substrates stacked in a vertical direction; a heating section (200) surrounding at least a portion of the inner tube (100), forming a heating space (S2) between the inner tube (100), and receiving power from the outside to generate heat; an outer tube (300) in which the heating section (200) is disposed, forming an inner space (S3) between the heating section (200), and forming at least one openable opening section (302) on a side surface to make the inner space (S3) accessible from the outside; the heating section (200) is electrically connected to a power supply section (700) that transmits power through the outer tube (300) at a position corresponding to the opening section (302).

2. The substrate processing apparatus according to claim 1, wherein the heating section (200) exposes a connection portion to the power supply section (700) when the opening section (302) is opened.

3. The substrate processing apparatus according to claim 1, wherein the heating section (200) includes: a side surface heat insulating section (210) surrounding the inner tube (100); a heat generating section (220) disposed on an inner surface of the side surface heat insulating section (210) to generate heat by the applied power; and a terminal section (240) disposed on an outer surface of the side surface heat insulating section (210) and electrically connected to both ends of the heat generating section (220).

4. The substrate processing apparatus according to claim 3, wherein the terminal section (240) is disposed at a height corresponding to the opening section (302).

5. The substrate processing apparatus according to claim 3, wherein the terminal section (240) includes: a connection terminal (241) disposed on the outer surface of the side surface heat insulating section (210) to be combined with the heat generating section (220); and a connection rod (242) extending from the connection terminal (241) to the side of the opening section (302) to be combined with the power supply section (700).

6. The substrate processing apparatus according to claim 5, wherein the connection rod (242) extends from the connection terminal (241) disposed at a position beyond the opening section (302) so that a distal end combined with the power supply section (700) is positioned at a position corresponding to the opening section (302).

7. The substrate processing apparatus according to claim 5, wherein the connection terminal (241) and the connection rod (242) are integrated.

8. The substrate processing apparatus according to claim 3, wherein the opening section (302) is formed at a height corresponding to the terminal section (240).

9. The substrate processing apparatus according to claim 5, wherein the connection terminal (241) is disposed in a vertical direction so as to overlap in a planar direction. The connection rod (242) includes at least one of a horizontal rod (242a) extending in a horizontal direction to prevent overlap with remaining connection terminals (241) except for the extended connection terminal (241), and a vertical rod (242b) extending in a vertical direction.

10. The substrate processing apparatus according to any one of claims 3 to 8, wherein The terminal portion (240) is provided with a plurality of terminal portions (240) for each of a plurality of heating regions distinguished in a vertical direction, and at least one terminal portion (240) is provided for each of the heating regions.

11. The substrate processing apparatus according to claim 10, wherein A plurality of terminal portions (240) are provided for a single opening portion (304).

12. The substrate processing apparatus according to claim 10, wherein The opening portion (304) is provided with a plurality of opening portions (304) in a vertical direction outside the outer tube (300).

13. The substrate processing apparatus according to claim 1, wherein The outer tube (300) includes: a container portion (310) forming the inner space (S3) and forming the opening portion (302) on a side surface, a side surface flange (360) provided in the container portion (310) at a position corresponding to the opening portion (302), and a door portion (370) provided in the side surface flange (360) to open and close the opening portion (302).

14. The substrate processing apparatus according to claim 1, wherein The outer tube (300) includes at least one first connection portion (350), The first connection portion (350) is connected to the power supply portion (700) on a side surface to transmit power from the outside to the heating portion (200).

15. The substrate processing apparatus according to claim 14, wherein The first connection portion (350) is electrically connected to an external power supply line (710) and an internal power supply line (720) in the power supply portion (700), The external power supply line (710) is connected outside the outer tube (300), and the internal power supply line (720) is provided inside the inner space (S3).

16. The substrate processing apparatus according to claim 1, wherein The outer tube (300) includes at least one second connection portion (390), The second connection portion (390) is provided to electrically connect a temperature sensor provided through the heating portion (200) on a side surface and the outside.

17. The substrate processing apparatus of claim 1, wherein Further comprising: a cooling portion (600) provided at least partially outside the outer tube (300) and flowing a heat medium inside.

18. The substrate processing apparatus according to claim 1, wherein The inner space (S3) and the heating space (S2) are in communication with each other.

19. The substrate processing apparatus according to claim 1, wherein The inner tube (100) includes quartz; The outer tube (300) includes SUS.

20. The substrate processing apparatus according to claim 1, wherein the inner space (S3) is maintained at a higher pressure than the processing space (SI).

21. The substrate processing apparatus according to claim 1, wherein the heating space (S2) is maintained at a temperature of 800°C or higher during at least a part of the time during which the process is performed in the processing space (SI).

22. The substrate processing apparatus according to claim 1, wherein the inner space (S3) is maintained at a pressure of 2 ATM or higher during at least a part of the time during which the process is performed in the processing space (SI).

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