Inkjet head unit and substrate processing apparatus

Abstract

A substrate processing apparatus, which can simplify work and equipment for head alignment, includes: an inkjet head unit configured to eject a substrate processing liquid; and a rack unit configured to support the inkjet head unit, where the inkjet head unit includes: a plurality of heads each provided with a plurality of nozzles; and a plurality of groups in each of which the heads are mounted such that the nozzles are exposed, and in each of which the plurality of heads are disposed in a first direction and a second direction in which the nozzles are arranged.

Description

Cross-reference to related applications

[0001] This application claims priority to Korean Patent Application No. 10-2024-0116885, filed on August 29, 2024, with the Korean Intellectual Property Office, and all benefits derived under 35 U.S.C., section 119, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to inkjet head units and substrate processing apparatus. Background Technology

[0003] The manufacture of a display may include multiple processes for forming light-emitting elements on a substrate (e.g., transparent glass), and as one of these processes, there is an inkjet printing process for forming a film or pattern by spraying ink droplets, which are used as a substrate processing liquid, onto the substrate.

[0004] In order to spray ink onto the substrate, an inkjet printing device is installed in the display manufacturing plant as a substrate processing device, and the inkjet printing process is performed on the substrate by the inkjet printing device.

[0005] Furthermore, in the manufacture of large displays, dozens to hundreds of heads are provided in a single substrate processing unit to reduce processing time. Additionally, when using an inkjet printing system to print color filters with red (R), green (G), and blue (B) colors, dozens of heads must be used for each color to reduce processing time.

[0006] When using an inkjet printing apparatus as a substrate processing device, to ensure that the ink ejected from the head is accurately applied to each desired location, the nozzle of each head must be positioned at the corresponding design location during inkjet printing. If the nozzle position deviates from the design location, the ink will be ejected to the incorrect location. Therefore, when using multiple heads, head alignment becomes a critical factor in quality and productivity. Summary of the Invention

[0007] One object of this disclosure is to provide an inkjet head unit and substrate processing apparatus that can simplify head alignment work and equipment.

[0008] The purpose of this disclosure is not limited to the above-described purposes, and other purposes not explicitly stated will be clearly understood by those skilled in the art based on the following description.

[0009] According to one aspect of this disclosure, a substrate processing apparatus includes: an inkjet head unit configured to jet a substrate processing liquid; and a frame unit configured to support the inkjet head unit, wherein the inkjet head unit includes: a plurality of heads, each head having a plurality of nozzles; a plurality of groups, each group having heads mounted such that the nozzles are exposed; and in each group, a plurality of heads are arranged along a first direction and a second direction for arranging the nozzles.

[0010] According to another aspect of this disclosure, a substrate processing apparatus includes: an inkjet head unit configured to jet a substrate processing liquid provided as ink; and a frame unit configured to support the inkjet head unit and configured as a single frame, wherein the inkjet head unit includes: a plurality of heads, each head having a plurality of nozzles; a plurality of groups, each group having heads mounted such that the nozzles are exposed; a bracket plate having the groups disposed thereon and the bracket plate being mounted on the frame unit; a head holder configured to secure the groups to the bracket plate; and a head alignment unit configured to rotate a first end of the group relative to a second end of the group to adjust the placement of the group along a first rotation direction, the groups being arranged in three columns on the bracket plate and offset from each other in a second direction of the nozzle arrangement based on the centerline of the heads, and including: a first group disposed in the first column; a second group disposed in the second column; and a third group disposed in the third column, wherein within each group, the heads are arranged in two rows, three columns, or more columns, and a plurality of heads located in the same row within each group are aligned in a first direction. The head alignment unit comprises: a first motor unit including a first motor, the length of which is adjustable in a first direction and configured to push or pull the first group from a first end of the first group to rotate the first group; a second motor unit including a second motor whose length is adjustable in a first direction and a third motor whose length is adjustable in a second direction and configured to push or pull the second group from a first end of the second group to rotate the second group; and a third motor unit including a fourth motor whose length is adjustable in a first direction and a fifth motor whose length is adjustable in a second direction and configured to push or pull the third group from a first end of the third group to rotate the third group; and a third motor unit including a fourth motor whose length is adjustable in a first direction and a fifth motor whose length is adjustable in a second direction and configured to push or pull the third group from a first end of the third group to rotate the third group.

[0011] According to another aspect of this disclosure, an inkjet head unit disposed in a substrate processing apparatus includes a plurality of heads, each head being provided with a plurality of nozzles; and a plurality of groups, each group having heads mounted in such that the nozzles are exposed, wherein a plurality of heads are disposed in each group along a first direction and a second direction of nozzle arrangement.

[0012] The inkjet head unit and substrate processing apparatus according to this disclosure simplify head alignment by allowing heads to be aligned in groups instead of individual heads. Furthermore, since the number of head holders can be reduced, the load on the inkjet head unit supported by the rack unit can be reduced, thereby simplifying the substrate processing apparatus (equipment), reducing, for example, the traditional requirement of using a dual-rack setup, and facilitating the installation of the substrate processing apparatus.

[0013] It should be noted that the effects of this disclosure are not limited to those described above, and other effects of this disclosure will be apparent from the following description. Attached Figure Description

[0014] The above and other aspects and features of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings, in which:

[0015] Figure 1 This is a plan view illustrating a substrate processing apparatus according to some embodiments of the present disclosure;

[0016] Figure 2 This is a perspective view showing the state in which a head alignment unit is provided in the inkjet head unit of the substrate processing apparatus according to the first embodiment of the present disclosure.

[0017] Figure 3 This is a plan view showing the state in which a head alignment unit is provided in the inkjet head unit of the substrate processing apparatus according to the first embodiment of the present disclosure;

[0018] Figure 4 This is a plan view for explaining the head of the inkjet head unit of the substrate processing apparatus according to the first embodiment of the present disclosure;

[0019] Figure 5 This is a plan view for explaining the alignment of the first group of inkjet head units of the substrate processing apparatus according to the first embodiment of the present disclosure;

[0020] Figure 6 This is a plan view for explaining the alignment of the second group of inkjet head units of the substrate processing apparatus according to the first embodiment of the present disclosure;

[0021] Figure 7 This is a plan view for explaining the alignment of the third group of inkjet head units of the substrate processing apparatus according to the first embodiment of the present disclosure.

[0022] Figure 8 It is a plan view used to explain the staining phenomenon of the inkjet head unit according to the comparative example;

[0023] Figure 9 This is a plan view showing the inkjet head unit according to the comparative example; and

[0024] Figure 10 This is a front view for explaining the inkjet head unit of the substrate processing apparatus according to the first embodiment of the present disclosure and the inkjet head unit according to the comparative example. Detailed Implementation

[0025] Embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. The advantages and features of this disclosure, as well as methods of implementing them, will become apparent from the embodiments described below in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments set forth below and can be embodied in various different forms. The embodiments are provided merely to complete this disclosure and to fully convey the scope of the invention to those skilled in the art, and this disclosure is defined only by the scope of the appended claims. Throughout the specification, the same reference numerals denote the same elements.

[0026] The terminology used herein is for descriptive purposes only and is not intended to limit this disclosure. In this specification, the singular form includes the plural form unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including”, as used herein, specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0027] Figure 1 This is a plan view illustrating a substrate processing apparatus according to some embodiments of the present disclosure.

[0028] Reference Figure 1 The substrate processing apparatus 100 may include a process processing unit 110, a maintenance unit 120, a rack unit 130, an inkjet head unit 140, a substrate processing liquid supply unit 150, a head alignment unit 160, and a controller 180.

[0029] The substrate processing apparatus 100 is used to process a substrate G (e.g., transparent glass) used in the manufacture of a display device. The substrate processing apparatus 100 can perform a printing process on the substrate G by spraying a substrate processing liquid onto the substrate G using an inkjet head unit 140.

[0030] The substrate processing apparatus 100 can use a substrate processing liquid. Here, the substrate processing liquid can be an ink, which is a chemical liquid used in the printing process of the substrate G. In other words, the substrate processing apparatus 100 can be configured as an inkjet printing apparatus that uses ink to form color filters on the substrate G. The substrate processing apparatus 100 can perform pixel printing on the substrate G using the substrate processing liquid and can be configured as a circulating inkjet printing facility to prevent nozzle ( Figure 4 The “140N” in the sample is blocked by the substrate processing liquid, but it is not limited to this.

[0031] While printing the substrate G using the substrate processing liquid, the process processing unit 110 supports the substrate G. The process processing unit 110 can support the substrate G using a non-contact method. For example, the process processing unit 110 can support the substrate G by suspending it in air, but this disclosure is not limited thereto. Alternatively, the process processing unit 110 can support the substrate G using a contact method.

[0032] The process processing unit 110 can move the substrate G while using an air-supported substrate G. For example, the process processing unit 110 may include a first platform 111 and an air hole 112.

[0033] A first platform 111 may be provided to allow a substrate G to be placed thereon. A perforation 112 may be formed to penetrate the first platform 111. A plurality of perforations 112 may be formed within a printing area on the first platform 111.

[0034] The vent 112 can spray air in the upward direction of the first platform 111, i.e., in the third direction 30. In this way, the vent 112 can make the substrate G placed on the first platform 111 float.

[0035] Although not shown, the process handling unit 110 may further include a clamping unit and a guide rail. When the substrate G moves along the longitudinal direction of the first platform 111, i.e., the first direction 10, the clamping unit can clamp the substrate G to prevent the substrate G from leaving the first platform 111. When the substrate G moves, the clamping unit can move in the same direction as the substrate G while clamping the substrate G along the guide rail. The clamping unit and the guide rail may be disposed outside the first platform 111.

[0036] The maintenance unit 120 measures the spray position (i.e., dots) and / or spray state of the substrate processing liquid on the substrate G. The maintenance unit 120 can measure the spray position and / or spray state of the substrate processing liquid of each of the plurality of nozzles provided in the inkjet head unit 140, and can provide the relevant measurement results to the controller 180.

[0037] For example, maintenance unit 120 may include a second platform 121, a third guide rail 122, a first plate 123, a calibration plate 124, and a camera module 125.

[0038] The second platform 121 may be arranged parallel to the first platform 111. The second platform 121 may include a maintenance area on its upper surface. The second platform 121 may be configured to have the same dimensions as the first platform 111. Alternatively, the second platform 121 may be configured to have smaller or larger dimensions than the first platform 111.

[0039] The third guide rail 122 guides the movement path of the first plate 123. The third guide rail 122 can be disposed on the second platform 121 as at least one line along the longitudinal direction of the second platform 121 (i.e., along the first direction 10). The third guide rail 122 can be implemented, for example, as a linear motor guide system.

[0040] Although not shown, the maintenance unit 120 may also include a fourth guide rail. Like the third guide rail 122, the fourth guide rail guides the movement path of the first plate 123 and may be disposed on the second platform 121 as at least one line along the width direction (i.e., the second direction 20) of the second platform 121.

[0041] The first plate 123 can move along the third guide rail 122 and / or the fourth guide rail on the second platform 121. The first plate 123 can move parallel to the substrate G along the third guide rail 122, and can move closer to or further away from the substrate G along the fourth guide rail.

[0042] The calibration plate 124 is used to measure the spray position of the substrate processing liquid on the substrate G. The calibration plate 124 can be mounted on the first plate 123 to measure the spray position of the substrate processing liquid, and can include multiple alignment marks, rulers, etc., and can be set along the longitudinal direction of the first plate 123, that is, along the first direction 10.

[0043] Meanwhile, although not shown, the calibration plate 124 may also be positioned near the inkjet head unit 140 together with a measuring device (e.g., camera module 125) configured to check the spraying state of the substrate processing liquid. For example, the calibration plate 124 and the measuring device may be mounted on the rack unit 130.

[0044] The camera module 125, serving as an optical device, is used to acquire image information about the substrate G. The image information acquired by the camera module 125 may include information about the positional alignment of the substrate G before printing, whether substrate processing liquid is being sprayed during printing, the spraying position of the substrate processing liquid, the spraying volume of the substrate processing liquid, the spraying area of ​​the substrate processing liquid, and / or the dot accuracy. Simultaneously, the camera module 125 can acquire not only image information about the substrate processing liquid being sprayed onto the substrate G, but also information about the calibration plate 124, and provides the acquired information to the controller 180.

[0045] During the processing of substrate G, camera module 125 can acquire image information about substrate G in real time. Camera module 125 can acquire image information by capturing images of substrate G in the first direction 10; in this case, camera module 125 may include a line scan camera. Camera module 125 can also acquire image information by capturing images of substrate G in units of a predetermined size area; in this case, camera module 125 may include a region scan camera.

[0046] The camera module 125 can be attached to the bottom or side surface of the rack unit 130 to acquire image information on the substrate G, onto which substrate processing liquid has been sprayed, but this disclosure is not limited thereto. The camera module 125 can also be attached to the side surface of the inkjet head unit 140. Various modifications can be made, such as mounting the camera module 125 in a fixed or movable manner.

[0047] The rack unit 130 supports the inkjet head unit 140. The rack unit 130 can be disposed above the first platform 111 and the second platform 121, so that the inkjet head unit 140 can spray substrate processing liquid onto the substrate G.

[0048] The rack unit 130 can be disposed on the first platform 111 and the second platform 121 with the width direction of the first platform 111 and the second platform 121, i.e., the second direction 20, as its longitudinal direction. The rack unit 130 can move along the first guide rail 170a and the second guide rail 170b in the longitudinal direction of the first platform 111 and the second platform 121, i.e., in the first direction 10. The first guide rail 170a and the second guide rail 170b can be disposed on the outside of the first platform 111 and the second platform 121 along the longitudinal direction of the first platform 111 and the second platform 121, i.e., along the first direction 10.

[0049] Although not shown, the substrate processing apparatus 100 may also include a rack moving unit. The rack moving unit causes the rack unit 130 to slide along a first guide rail 170a and a second guide rail 170b. The rack moving unit may be mounted within the rack unit 130 and may include a drive mechanism such as a motor.

[0050] In reference Figures 2 to 7 Before explaining the inkjet head unit 140 and the head alignment unit 160, the function and location of the inkjet head unit 140 will be briefly described below. The inkjet head unit 140 sprays the substrate processing liquid onto the substrate G in the form of droplets. The inkjet head unit 140 may be mounted on the side surface of the rack unit 130, but is not limited thereto.

[0051] The inkjet head unit 140 can move along the longitudinal direction of the frame unit 130, i.e., along the second direction 20, to be positioned at a desired point on the substrate G, but this disclosure is not limited thereto. The inkjet head unit 140 can also move along the height direction of the frame unit 130, i.e., along the third direction 30, and can rotate clockwise or counterclockwise.

[0052] Although not shown, the substrate processing apparatus 100 may also include an inkjet head moving unit. The inkjet head moving unit can linearly move or rotate the inkjet head unit 140 and may include a drive mechanism such as a motor.

[0053] The inkjet head unit 140 can also be fixedly mounted on the rack unit 130. In this case, the rack unit 130 can be configured to be movable.

[0054] The substrate processing liquid supply unit 150 can be configured as a reservoir for supplying substrate processing liquid to the inkjet head unit 140. For example, the substrate processing liquid supply unit 150 can be mounted on the rack unit 130 and can include a storage tank (not shown) and a pressure control module (not shown).

[0055] The storage tank stores the substrate processing liquid, and the pressure control module controls the internal pressure of the storage tank. The storage tank can supply an appropriate amount of substrate processing liquid to the inkjet head unit 140 based on the pressure provided by the pressure control module.

[0056] The substrate processing liquid supply unit 150 can be configured as a module integrated with the inkjet head unit 140. For example, the inkjet head unit 140 and the substrate processing liquid supply unit 150 can be arranged on the front surface of the frame unit 130, and the substrate processing liquid supply unit 150 can be positioned at a higher level than the inkjet head unit 140. However, this disclosure is not limited to this example.

[0057] The substrate processing liquid supply unit 150 can also be configured as a module separate from the inkjet head unit 140. For example, the inkjet head unit 140 and the substrate processing liquid supply unit 150 can be separately disposed on the front and rear surfaces of the frame unit 130, respectively.

[0058] The controller 180 controls the operation of each component of the substrate processing apparatus 100 (e.g., the process processing unit 110, the rack unit 130, the inkjet head unit 140, and the substrate processing liquid supply unit 150). For example, the controller 180 can control the operation of the vent 112 of the process processing unit 110, the camera module 125 of the maintenance unit 120, the rack unit 130, the inkjet head unit 140, and the pressure control module of the substrate processing liquid supply unit 150.

[0059] The controller 180 can be implemented as a computer or server including a process controller, a control program, an input module, an output module, a display module and / or a storage module.

[0060] The process controller may include a microprocessor for performing control functions on each component constituting the substrate processing apparatus 100. The control program can execute various processing operations of the substrate processing apparatus 100 under the control of the process controller. The storage module stores various programs, i.e., processing recipes, to execute various processing operations of the substrate processing apparatus 100 according to various data and processing conditions.

[0061] In addition, the controller 180 can also perform maintenance functions of the inkjet head unit 140. For example, based on the measurement results from the maintenance unit 120, the controller 180 can correct the spray position of the substrate processing liquid for each nozzle set in the inkjet head unit 140, or detect any defective nozzles (i.e., nozzles that are not spraying substrate processing liquid correctly) and perform cleaning operations on these defective nozzles.

[0062] The inkjet head unit 140 and the head alignment unit 160 will be described below.

[0063] Figure 2 This is a perspective view showing the state of the head alignment unit 160 provided in the inkjet head unit 140 of the substrate processing apparatus 100 according to the first embodiment of the present disclosure. Figure 3 This is a plan view showing the state in which the head alignment unit 160 is disposed in the inkjet head unit 140 of the substrate processing apparatus 100. Furthermore, Figure 4 This is a plan view used to explain the head 141 of the inkjet head unit 140 of the substrate processing apparatus 100.

[0064] also, Figure 5 This is a plan view used to explain the alignment of the first group P1 of the inkjet head unit 140 of the substrate processing apparatus 100. Figure 6 This is a plan view used to explain the alignment of the second group P2 of the inkjet head unit 140 of the substrate processing apparatus 100, and Figure 7 This is a plan view used to explain the alignment of the third group P3 of the inkjet head unit 140 of the substrate processing apparatus 100.

[0065] also, Figure 8 This is a plan view used to explain the staining phenomenon of the inkjet head unit 40 according to the comparative example. Figure 9 This is a plan view used to explain the inkjet head unit 400; and Figure 10 This is a front view used to explain the inkjet head unit 140 and inkjet head unit 40 of the substrate processing apparatus 100.

[0066] First refer to Figures 8 to 10 In the comparative example inkjet head unit 40, multiple groups 43 are disposed on the bracket plate 45. In each group 43, multiple heads 41 are arranged in a row. In other words, according to the comparative example, each head group (41 and 43) is a structure in which multiple heads 41 and group 43 are integrated together, and only one row of heads 41 along the first direction 10 is included in a group 43.

[0067] Due to the presence of the head retainer 47, the comparative example's multiple head groups (41 and 43) have limitations in sufficiently reducing the distance between adjacent head groups (41 and 43). That is, since the head retainer 47, which secures the respective head groups (41 and 43) to the bracket plate 45, requires bearings and / or a motor for, for example, position adjustment, the head retainer 47 inevitably occupies space on the bracket plate 45. Consequently, depending on the size of the head retainer 47, the multiple head groups (41 and 43) arranged along the second direction 20 are inevitably spaced apart.

[0068] Because the spacing between heads 41 is relatively large in each head group (41 and 43) of the comparative examples, problems such as stains (e.g., spots, lines, and / or area stains) may occur. That is, as Figure 8 As shown, on a substrate G with dotted points DT, there may be areas MR where no substrate treatment liquid has been applied.

[0069] To minimize these problems, the multiple heads 41 set in a group 43 are arranged to be offset from each other in a second direction 20. However, in order to offset the multiple heads 41, alignment tools such as adjusting screws may be required to adjust the position of the multiple heads 41, which increases the amount of work required for head alignment.

[0070] Furthermore, according to the comparative example, since the heads 41 in each group 43 are arranged in a single row, a head holder 47 is provided for the corresponding group 43. Therefore, the number of head holders 47 is doubled compared to the first embodiment, inevitably increasing the load. Therefore, if the same number of heads 41 as in the first embodiment is provided, the critical load differs due to the additional components such as the head holders 47, making it difficult to mount the inkjet head unit 40 on a single rack, thus requiring a dual-rack configuration.

[0071] This is because, such as Figure 10 As shown, if the bracket plate 45 of the inkjet head unit 40 is mounted on a single frame, the bracket plate 45 cannot be provided as designed, as indicated by reference numeral 45D, and due to sagging under load, the nozzle positioned on the right tilts downward, resulting in a change in distance along the first direction 10.

[0072] Conversely, the first embodiment addresses the problems associated with the comparative example, thereby reducing the number of head holders 147 compared to the comparative example. Therefore, the load on the inkjet head unit 140 mounted on the bracket plate 145 can be reduced. Thus, even with the same number of heads 141, the first embodiment allows the use of a single rack, eliminating the need for a dual-rack configuration.

[0073] When rack unit 130 is configured as a single rack instead of a dual rack, the configuration of inkjet head unit 140 can be simplified. Since the load on rack unit 130, which accounts for a large portion of the total load of substrate processing apparatus 100, can also be reduced, the workload required to disassemble substrate processing apparatus 110 during transport to reduce weight can be decreased. As a result, setup time can be shortened, and in some embodiments, substrate processing apparatus 100 can be shipped without disassembly.

[0074] Furthermore, in the substrate processing apparatus 100, since multiple heads 141 arranged in two rows along the second direction 20 can be provided in each individual group 143, the heads 141 can be arranged adjacent to each other without being interfered with by the head holder 147. Therefore, unlike the comparative example where the heads 41 need to be offset within each individual group 43 to prevent staining, the heads 141 provided in each individual group 143 can be arranged side by side in the first direction 10 without offset. That is, the center lines of the heads 141 can be aligned, so that the central axes between the first nozzles 140N can be aligned. Then, by simply offsetting the multiple groups 143 from each other in the second direction 20, head alignment can be performed on a group 143 basis rather than on a head 141 basis, thereby greatly reducing the working time and workload of head alignment.

[0075] This will be described in further detail below.

[0076] Reference Figures 2 to 7 The head 141 of the inkjet head unit 140 can be aligned by the head alignment unit 160.

[0077] For ease of description and understanding, assume that multiple groups 143 are arranged in multiple columns on the bracket plate 145, including a first group P1 arranged in the first column, a second group P2 arranged in the second column, and a third group P3 arranged in the third column. It is also assumed that multiple heads 141 are arranged in multiple rows and columns within each group 143. Heads 141 arranged in the same position without offset can be defined as a single unit, and the head 141 in the Mth row within the Nth group 143 can be defined as head HNM, where M and N are natural numbers. For example, refer to... Figure 4The head 141 in the first row of the first group P1 can be defined as head H11, and the head 141 in the second row of the second group P2 can be described as head H22.

[0078] exist Figure 4 In the illustration, multiple nozzles 140N are shown arranged in a row within each head 141. However, this is merely exemplary and various modifications can be made, such as arranging two or more rows of multiple nozzles 140N within each head 141.

[0079] The inkjet head unit 140 of the first embodiment may include a head 141, a group 143, a bracket plate 145, and a head holder 147.

[0080] The head 141 may include a port (not shown) for supplying substrate processing liquid and a plurality of nozzles 140N for pixel printing on the substrate G (see [link to documentation]). Figure 4 The head 141 can be formed to have the same dimensions.

[0081] Each head 141 can spray a substrate processing liquid of a specific color, such as red ink, green ink, or blue ink, onto the substrate G. The nozzles 140N can be arranged in multiple rows and / or columns in the order of red ink, green ink, and blue ink.

[0082] Multiple heads 141 can be provided in each group 143. Unlike the inkjet head unit 40 of the comparative example, in the inkjet head unit 140 of the first embodiment, a structure can be provided in which the heads 141 can be arranged without interference from the head holder 147, thereby preventing or reducing the occurrence of staining (see...). Figure 8 (MR in the text).

[0083] Specifically, multiple heads 141 can be provided in each group 143 along the first direction 10, and unlike the comparative example, they can be arranged in two rows along the second direction 20 (i.e., the arrangement direction of the nozzles 140N).

[0084] Furthermore, in the substrate processing apparatus 100 according to the first embodiment, the rack unit 130 supporting the head 141 can be configured as a single rack. For example, one end of the bracket plate 145 can be mounted on the rack unit 130, and the number of groups 143 and heads 141 mounted on the bracket plate 145 can be set to not exceed a critical load threshold, such that the other end of the bracket plate 145, which is the free end, can be prevented from sagging relative to the mounting end. [0085 Here, assuming that within each group 143, multiple heads 141 are arranged in two rows in the first direction 10, the number of groups 143 and heads 141 can be set to not exceed the critical load. In other words, to prevent staining, at least two rows of heads 141 can be arranged in each group 143, and multiple groups 143 and / or multiple heads 141 can be arranged in the column direction within the range not exceeding the critical load threshold.]

[0085] For example, group 143 can be arranged in four or fewer columns on bracket plate 145, and multiple heads 141 in two rows and up to five columns can be arranged within each group 143.

[0086] Specifically, such as Figure 4 As shown, three groups 143 can be provided on the bracket plate 145, and eight heads 141 can be provided in each group 143.

[0087] Furthermore, multiple adjacent groups 143 can be arranged such that the center lines of their heads 141 can be offset from each other in the second direction 20, as shown by the dashed lines. That is, in a group 143, multiple heads 141 can be arranged in a straight line in each row without offset from each other, and adjacent groups 143 can be offset from each other. Therefore, head alignment can be performed based on groups 143 rather than on individual heads 141, thereby reducing the time required to align the inkjet head unit 140.

[0088] In the inkjet head unit 140 of this embodiment, the nozzles 140N of the last row or rear row of the head 141 in the Nth column 143 can overlap with the nozzles 140N of the first row or front row of the head 141 in the (N+1)th column 143.

[0089] Specifically, as an example, refer to Figure 4 Reference symbol A in the bracket plate 145 indicates that the nozzle 140N of the last row or rear row of the head H11 in the first group P1 of the first column on the bracket plate 145 may overlap with the nozzle 40N of the first row or front row of the head H21 in the first row of the first row in the second group P2 of the second column on the bracket plate 45.

[0090] As an example, refer to Figure 4 In the attached figure, reference numeral B, the nozzle 140N of the last row or rear row head H12 in the second row of the first group P1 can overlap with the nozzle 140N of the first row or front row head H22 in the second row of the second group P2.

[0091] Since there is no interference from the head holder 147, the heads 141 can be arranged in two rows close to each other within each group 143. For example, the nozzle 140N of the first row or front row of the second row of the first group P1 in the first column can overlap with the nozzle 140N of the last row or rear row of the first row of the subsequent group 143 or the last group 143, such as the head H21 of the second group P2 or the head H31 of the third group P3.

[0092] As an example, refer to Figure 4 Reference symbol C indicates that the nozzle 140N of the first or front row head H12 in the second row of the first group P1 can overlap with the nozzle 140N of the last or rear row head H31 in the first row of the third group P3, which is located in the last column on the bracket plate 145. Therefore, since there is no gap between the nozzles 140N in the second direction 20, it is possible to prevent... Figure 8 The stain phenomenon indicated by "MR" in the image.

[0093] Each group 143 configured to combine multiple heads 141 together can be mounted on the rack unit 130 via a bracket plate 145.

[0094] Each group 143 may expose a plurality of nozzles 140N on its lower surface to spray substrate processing liquid, and may form insertion holes (not shown) corresponding to the shape and number of heads 141 to receive the heads 141. That is, one head 141 may be installed in each insertion hole so that the nozzles 140N can be exposed, but this disclosure is not limited thereto.

[0095] The bracket plate 145 can be formed as a frame structure and / or a box structure, and the bracket plate 145 is configured to allow multiple groups 143 to be mounted on the rack unit 130. That is, the bracket plate 145 can have various shapes and structures suitable for mounting on the rack unit 130.

[0096] In addition, the bracket plate 145 may include holes (not shown) for exposing nozzles 140N, similar to or like the insertion holes of group 143. In some embodiments, the substrate processing liquid supply unit 150 may also be mounted on the bracket plate 145.

[0097] The head retainer 147 is a component for securing assembly 143 to bracket plate 145, and the position of the head retainer 147 can be adjusted or controlled by retainer drive unit 147M. For example, each head retainer 147 may include a hole (not shown) for fastening bolts, and each retainer drive unit 147M may include a bearing and / or a motor, wherein known techniques are applied.

[0098] In the inkjet head unit 140, to shorten processing time, multiple heads 141, each having multiple nozzles 140N, can be assembled into each group 143 for alignment. The head groups (141 and 143) assembled in this way can be mounted on the bracket plate 145 and then on the rack unit 130.

[0099] The head alignment unit 160 can automatically perform head alignment in groups 143.

[0100] The head alignment unit 160 for aligning the inkjet head unit 140 will be described below. In some embodiments, the head alignment unit 160 may be removed after the head assemblies (141 and 143) have been aligned. However, preferably, the head alignment unit 160 may be retained on the bracket plate 145 to continuously secure the position of the head assemblies (141 and 143), thereby allowing realignment without reinstallation in the event of post-assembly positional errors.

[0101] The head alignment unit 160 can rotate the first end of group 143 relative to the second end of group 143 to adjust the alignment of group 143 along a first rotation direction (i.e., the θ direction). Furthermore, the head alignment unit 160 can adjust the position of each of the second group P2 and the third group P3 in a second direction 20.

[0102] For example, the head alignment unit 160 may include a first motor unit 160M1, a second motor unit 160M2 and a third motor unit 160M3, and the placement of the second group P2 and the third group P3 relative to the first group P1 in the first rotation direction and in the second direction 20 can be adjusted.

[0103] Reference Figure 5 The first motor unit 160M1 can push or pull the first group P1 from the first end along the first direction 10 to rotate the first group P1. For example, the first motor unit 160M1 may include a first motor 161 whose length can be adjusted in the first direction 10.

[0104] Here, the center of the head holder 147 located at the second end of the first group P1 serves as the first axis R1 for the rotation of the first group P1. Therefore, when the length of the first motor 161 is adjusted along the first direction 10 at the second end of the first group P1, the first group P1 can be pushed or pulled to adjust its placement in the first rotation direction.

[0105] Reference Figure 6 The second motor unit 160M2 can push or pull the second group P2 from the first end of the second group P2 along the first direction 10 to rotate the second group P2, and can also push or pull the second group P2 from the first end or the second end of the second group P2 along the second direction 20.

[0106] For example, the second motor unit 160M2 may include a second motor 162 whose length is adjustable along the first direction 10 and a third motor 163 whose length is adjustable along the second direction 20.

[0107] First, the third motor 163 of the second motor unit 160M2 can push or pull the second group of P2 in the second direction 20 to adjust the position of the second group of P2 in the second direction 20. Afterwards, or before, the second motor 162 can push or pull the second group of P2 in the first direction 10 to adjust the placement of the second group of P2 in the first rotational direction.

[0108] Here, the center of the head holder 147 located at the second end of the second group P2 serves as the second axis R2 for the rotation of the second group P2. Therefore, when the length of the second motor 162 is adjusted along the first direction 10 at the first end of the second group P2, the second group P2 can be pushed or pulled, thereby adjusting the placement of the second group P2 along the first rotation direction.

[0109] Reference Figure 7 The third motor unit 160M3 can push or pull the third group P3 from the first end of the third group P3 along the first direction 10 to rotate the third group P3, and can also push or pull the third group P3 from the first or second end of the third group P3 along the second direction 20.

[0110] For example, the third motor unit 160M3 may include a fourth motor 164 whose length is adjustable along the first direction 10 and a fifth motor 165 whose length is adjustable along the second direction 20.

[0111] First, the fifth motor 165 of the third motor unit 160M3 can push or pull the third group of P3 in the second direction 20 to adjust the position of the third group of P3 in the second position 20. Then, or before, the fourth motor 164 can push or pull the third group of P3 in the first direction 10 to adjust the placement of the third group of P3 in the first rotation direction.

[0112] Here, the center of the head holder 147 located at the second end of the third group P3 serves as the third axis R3 for the rotation of the third group P3. Therefore, when the length of the fourth motor 164 is adjusted along the first direction 10 at the first end of the third group P3, the third group P3 can be pushed or pulled, thereby adjusting the position of the third group P3 along the first rotation direction.

[0113] According to this embodiment, since multiple heads 141 can be aligned in groups 143 without the need for individual alignment of each head 141, the head alignment process can be simplified. Furthermore, since the number of head holders 147 can be reduced, the load on the inkjet head unit 140 supported by the rack unit 130 can be reduced. Therefore, the substrate processing apparatus 100 can be simplified, reducing limitations such as dual-rack requirements. As a result, the installation of the substrate processing apparatus 100 can be facilitated.

[0114] Although embodiments of the present disclosure have been described above with reference to the accompanying drawings, those skilled in the art will understand that various modifications can be made without departing from the technical spirit or essential characteristics of the present disclosure. Therefore, it should be understood that the above embodiments are illustrative in all respects and not restrictive.

Claims

1. A substrate processing apparatus comprising: an inkjet head unit configured to eject a substrate processing liquid; and a rack unit configured to support the inkjet head unit, wherein the inkjet head unit includes a plurality of heads each provided with a plurality of nozzles, and a plurality of groups in each of which the heads are installed so that the nozzles are exposed, and within each of the groups, a plurality of heads are arranged in a first direction and a second direction in which the nozzles are arranged. The heads are arranged in two rows within each of the groups.

2. The substrate processing apparatus according to claim 1, wherein 3. The substrate processing apparatus according to claim 2, wherein the groups are arranged offset from each other in the second direction and arranged in a plurality of columns, and within each of the groups, a plurality of heads in the same row are arranged side by side without offset in the first direction. The inkjet head unit further includes a carriage plate on which the groups are arranged and which is installed on the rack unit.

4. The substrate processing apparatus according to claim 1, wherein The inkjet head unit further includes a head holder configured to fix the groups to the carriage plate.

5. The substrate processing apparatus according to claim 4, wherein 6. The substrate processing apparatus according to claim 4, wherein the rack unit is arranged as a single rack, one end of the carriage plate is installed on the single rack; and the number of groups and heads installed on the carriage plate is arranged so as not to exceed a critical load threshold, so that the other end of the carriage plate, which is a free end, is prevented from sagging with respect to the installed end. The number of groups and heads set so as not to exceed the critical load is based on the heads arranged in two rows so that a plurality of heads are arranged in the first direction.

7. The substrate processing apparatus according to claim 6, wherein 8. The substrate processing apparatus according to claim 7, wherein groups are arranged in four or fewer columns on the carriage plate, and within each of the groups, a plurality of heads are arranged in two rows and at most five columns.

9. The substrate processing apparatus according to claim 4, wherein the groups are arranged offset from each other in the second direction based on center lines of the heads, and a nozzle of a last or rear head in an Mth row in a group in an Nth column on the carriage plate overlaps a nozzle of a first or front head in the Mth row in a group in an (N+1)th column. A nozzle of a first or front head in a second row of a group in a first column on the carriage plate overlaps a nozzle of a last or rear head arranged in a first row in the group in a rear or last column.

10. The substrate processing apparatus according to claim 9, wherein 11. The substrate processing apparatus according to claim 1, further comprising: a head alignment unit configured to rotate a first end of a group with respect to a second end of the group to adjust a placement of the group in a first rotation direction.

12. The substrate processing apparatus according to claim 11, wherein the heads are arranged in two or more rows within each of the groups, the groups include a first group arranged in an Nth column, a second group arranged in an N+1th column, and a third group arranged in an N+2th column, and the head alignment unit adjusts the placement of the second group and the third group with respect to the first group in the first rotation direction. ​ 13. The substrate processing apparatus of claim 12, wherein, The head alignment unit includes: a first motor unit configured to push or pull the first group from a first end of the first group in a first direction to rotate the first group; a second motor unit configured to push or pull the second group from a first end of the second group in a first direction to rotate the second group; and a third motor unit configured to push or pull the third group from a first end of the third group in a first direction to rotate the third group.

14. The substrate processing apparatus according to claim 13, wherein the head alignment unit adjusts positions of the second group and the third group in a second direction, the second motor unit pushes or pulls the second group from a first end of the second group to a second end of the second group in the second direction, and the third motor unit pushes or pulls the third group from a first end of the third group to a second end of the third group in the second direction.

15. The substrate processing apparatus according to claim 14, wherein the first motor unit includes a first motor whose length is adjustable in the first direction, the second motor unit includes a second motor whose length is adjustable in the first direction and a third motor whose length is adjustable in the second direction, and the third motor unit includes a fourth motor whose length is adjustable in the first direction and a fifth motor whose length is adjustable in the second direction.

16. A substrate processing apparatus comprising: an inkjet head unit configured to jet a substrate processing liquid provided as ink; and a rack unit configured to support the inkjet head unit and provided as a single rack, wherein the inkjet head unit includes: a plurality of heads each provided with a plurality of nozzles; a plurality of groups in each of which a head is installed so that the nozzles are exposed; a carriage plate on which the groups are provided and which is installed on the rack unit; a head holder configured to fix the groups to the carriage plate; and a head alignment unit configured to rotate a first end of the groups with respect to a second end of the groups to adjust placement of the groups in a first rotation direction, the groups are arranged in three columns on the carriage plate and offset from each other in a second direction of the nozzle arrangement based on center lines of the heads, and the groups include: a first group provided in a first column; a second group provided in a second column; and a third group provided in a third column, within each of the groups, the heads are provided in two rows and three or more columns, the plurality of heads in the same row within each of the groups are arranged side by side in the first direction without offset, and are provided in up to five columns, the nozzles of the heads in a last row or a subsequent row in the Mth row within the first group on the carriage plate overlap the nozzles of the heads in a first row or a preceding row in the Mth row within the second group, the nozzles of the heads in a first row or a preceding row in the second row within the first group on the carriage plate overlap the nozzles of the heads in a last row or a subsequent row in the first row within the third group, and the nozzles of the heads in a first row or a preceding row in the second row within the first group on the carriage plate overlap the nozzles of the heads in a last row or a subsequent row in the first row within the third group. The head alignment unit includes: a first motor unit including a first motor whose length is adjustable in a first direction and configured to push or pull the first group from a first end of the first group in the first direction to rotate the first group; a second motor unit including a second motor whose length is adjustable in the first direction and a third motor whose length is adjustable in a second direction and configured to push or pull the second group from a first end of the second group in the first direction to rotate the second group; and a third motor unit including a fourth motor whose length is adjustable in the first direction and a fifth motor whose length is adjustable in the second direction and configured to push or pull the third group from a first end of the third group in the first direction to rotate the third group.

17. An inkjet head unit provided in a substrate processing apparatus, comprising: a plurality of heads each provided with a plurality of nozzles; and a plurality of groups in each of which a head is mounted so that the nozzles are exposed, wherein a plurality of heads are provided in each of the groups along a first direction and a second direction of arrangement of the nozzles.

18. The inkjet head unit according to claim 17, wherein The heads are provided in two rows and a plurality of columns in each of the groups.

19. The inkjet head unit according to claim 18, wherein the groups are arranged offset from each other in the second direction and provided in a plurality of columns, and the heads in the same row located in each of the groups are arranged side by side with their center lines aligned without offset.

20. The inkjet head unit according to claim 17, further comprising: a carriage plate on which the groups are provided and which is mounted on a rack unit; and a head holder configured to fix the groups to the carriage plate. ​

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