Probe replacement and test management control method and management machine
By acquiring the identification information and probe specifications of the test connector through the management unit, sensitive and non-sensitive feature codes can be distinguished. Only probes with sensitive feature codes need to be replaced, which solves the problem of detection inaccuracy and waste caused by probe wear, and achieves the goals of cost reduction and environmental protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2026-03-10
AI Technical Summary
In the prior art, the probes of the test connector wear out after repeated testing of IC chips, resulting in performance degradation and inaccurate testing. Furthermore, replacing all the probes is wasteful.
The system obtains the identification information of the test connector through the management unit, reads the corresponding probe specifications, and displays the probes with sensitive feature codes for replacement. It distinguishes between probes with sensitive and non-sensitive feature codes and only replaces probes with sensitive feature codes.
This effectively avoids probe waste, reduces replacement costs, and achieves the environmental goals of energy conservation and carbon reduction.
Smart Images
Figure CN121633769A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a control method, and more particularly to a probe replacement and test management control method and management machine for testing connectors. Background Technology
[0002] A test handler is a testing device for integrated circuit chips (IC chips). The test handler's IC test load board has an IC test socket, which serves as the signal transmission medium between the test handler and the IC chip during testing. The test socket includes a base and a contact module disposed on the base. The contact module has several probes that must physically contact the contacts on the IC chip to establish an electrical connection in order to transmit signals for testing.
[0003] Each IC chip tested by this test connector counts as one test operation. With tens of thousands of IC chips potentially requiring testing on a production line, the test connector may need to perform tens of thousands of tests. These probes will wear down with each physical contact with the IC chip, altering the contact impedance. Therefore, the performance of the test connector often deteriorates with the number of tests, leading to inaccurate detection. A direct solution would be to remove and discard all used probes (old probes) from the test connector and replace them with new ones. However, not all old probes require immediate replacement, making a complete replacement unnecessary and wasteful. Summary of the Invention
[0004] In view of this, the main objective of the present invention is to provide a probe replacement and test management control method and management machine, in order to overcome the waste caused by replacing all test connectors with new probes as described in the prior art.
[0005] The probe replacement and testing management and control method of the present invention is implemented in a management unit and includes the following steps:
[0006] Obtain identification information for a test connector, wherein the test connector is transmitted from a test sorting machine to the management machine, and the test connector contains several probes;
[0007] Retrieves a probe specification corresponding to the identification information from a database. The probe specification includes a probe code and a signature for each probe of the test connector, wherein the signature is either a sensitive signature or a non-sensitive signature; and
[0008] Display the probe code and signature of the probes of the specified probes, so as to replace the probe in the test connector that corresponds to the sensitive signature.
[0009] As described above in the probe replacement and test management control method, the probes included in the test connector include power probes, reference potential probes, and signal probes; in the probe specification, the feature code of the signal probe is the sensitive feature code, and the feature codes of the power probe and the reference potential probe are the non-sensitive feature codes.
[0010] As described above in the probe replacement and test management control method, the probes included in the test connector include high-frequency probes and general probes other than the high-frequency probes; in the probe specification, the feature code of the high-frequency probe is the sensitive feature code, and the feature code of the general probe is the non-sensitive feature code.
[0011] As described above in the probe replacement and test management control method, the probes included in the test connector include high-bandwidth probes and general probes other than the high-bandwidth probes; in the probe specification, the feature code of the high-bandwidth probe is the sensitive feature code, and the feature code of the general probe is the non-sensitive feature code.
[0012] As described above in the probe replacement and test management control method, the probes included in the test connector are defined with multiple probe categories; the feature code of at least one of the probes in the multiple probe categories is the sensitive feature code, and the feature codes of the probes in the other probe categories are the non-sensitive feature codes.
[0013] The probe replacement and test management machine of this invention includes:
[0014] An input unit is used to acquire identification information of a test connector, wherein the test connector includes a plurality of probes;
[0015] A display unit; and
[0016] A central processing unit is connected to the input unit and the display unit. The central processing unit reads a probe specification corresponding to the identification information from a database. The probe specification includes a probe code and a feature code for each probe of the test connector, wherein the feature code is a sensitive feature code or a non-sensitive feature code. The central processing unit displays the probe codes and feature codes of the probes of the probe specification through the display unit to replace the probe in the test connector corresponding to the sensitive feature code.
[0017] As described above, the probe replacement and test management unit includes several probes in the test connector, including power probes, reference potential probes, and signal probes. In the probe specification, the feature code of the signal probe is the sensitive feature code, and the feature codes of the power probe and the reference potential probe are the non-sensitive feature codes.
[0018] As described above, the probe replacement and test management unit includes several probes in the test connector, including high-frequency probes and general probes other than the high-frequency probes; in the probe specification, the feature code of the high-frequency probe is the sensitive feature code, and the feature code of the general probe is the non-sensitive feature code.
[0019] As described above, the probe replacement and test management unit includes several probes in the test connector, including high-bandwidth probes and general probes other than high-bandwidth probes; in the probe specification, the feature code of the high-bandwidth probe is the sensitive feature code, and the feature code of the general probe is the non-sensitive feature code.
[0020] As described above, the probe replacement and test management machine includes a number of probes in the test connector, which are defined by multiple probe categories. The feature code of at least one of the probes in the multiple probe categories is the sensitive feature code, and the feature codes of the probes in the other probe categories are the non-sensitive feature codes.
[0021] In summary, this invention allows the identification of probes corresponding to sensitive feature codes in the test connector for easy replacement, rather than requiring the replacement of all probes as described in previous technologies. Therefore, this invention effectively avoids wasting probes, significantly reducing probe replacement costs and achieving energy conservation and carbon reduction in an era of heightened environmental awareness. Attached Figure Description
[0022] Figure 1 : A block diagram illustrating an embodiment of the management machine and a test classification machine of the present invention.
[0023] Figure 2 : A schematic flowchart of an embodiment of the probe replacement and test management control method of the present invention.
[0024] Figure 3 This invention provides a three-dimensional perspective view of an example of a test connector.
[0025] Brief explanation of the icon numbers
[0026] 10: Management machine 100: Computer
[0027] 101: Central Processing Unit; 102: Input Unit
[0028] 103: Storage unit; 104: Display unit
[0029] 105: Network Interface 106: Remote Hard Drive
[0030] 20: Test sorting machine; 30: Test connector
[0031] 300: Identification unit; 31: Base
[0032] 32: Contact module; 320: Probe
[0033] 40: IC Chip ID: Identification Information
[0034] DB: Database Detailed Implementation
[0035] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means employed by the present invention to achieve its intended purpose.
[0036] Please refer to Figure 1 and Figure 2 The probe replacement and test management control method of the present invention is implemented in a management machine 10. The management machine 10 can be set up together with a test sorting machine 20 in the test plant area, or the management machine 10 and the test sorting machine 20 can form a test management system as a whole.
[0037] For example, the test sorter 20 is an existing device, and its test load board has a test connector 30 (IC Test Socket). During testing, the test connector 30 serves as the medium for signal transmission between the test sorter 20 and an IC chip 40. The test connector 30 can be referenced from... Figure 3 For example, it includes a base 31 and a contact module 32 disposed on the base 31. The contact module 32 has several probes 320. The probes 320 must physically contact the contacts on the IC chip 40 to form an electrical connection in order to transmit signals for detection.
[0038] The management unit 10 may include a computer 100, which basically includes a central processing unit 101 and an input unit 102, a storage unit 103, and a display unit 104 connected to the central processing unit 101. The central processing unit 101 is a processor chip, mainly responsible for information processing; the input unit 102 may be a keyboard, mouse, barcode scanner, or digital camera; the storage unit 103 may be a traditional hard disk (HDD), solid-state drive (SSD), or portable information storage device (such as a mobile hard drive or USB flash drive); the display unit 104 may be an LCD monitor; the computer 100 may also include a network interface 105, which may be a wired network interface or a wireless network interface, and the central processing unit 101 connects to the network interface 105 to connect to a remote hard drive 106 (or cloud hard drive) through the network interface 105.
[0039] An embodiment of the probe replacement and test management control method of the present invention includes the following steps:
[0040] Step S01: The management unit 10 obtains an identification information ID of the test connector 30, wherein the test connector 30 is transferred from the test sorting machine 20 to the management unit 10. Regarding the transfer method of the test connector 30, for example, the test connector 30 may be unloaded from the test sorting machine 20 by a worker and then carried to the management unit 10 by a worker, thus achieving the transfer of the test connector 30. However, this is not limited to the foregoing; for example, the test connector 30 may be transferred from the test sorting machine 20 to the management unit 10 using other automated equipment (such as a robot or robotic arm).
[0041] In the embodiments of the present invention, please refer to Figure 3 The test connector 30 may have an identification section 300, which records or stores identification information (ID) belonging to the test connector 30. Each test connector 30 has an identification section 300 and corresponds to an identification information ID. The identification information IDs of different test connectors 30 are also different from each other, representing that each test connector 30 is used to test a specific type of IC chip 40. For example, Figure 3 For example, the identification part 300 may be a portion of a one-dimensional barcode, two-dimensional barcode, or string of characters (e.g., English letters, Arabic numerals) formed by ink printing, stickers, or laser engraving. In other embodiments, the identification part 300 may be a radio frequency tag (RFID) capable of storing the identification information ID. The input unit 102 of the management unit 10 can be configured to correspond to the form of the identification unit 300. Therefore, the input unit 102 can be used to obtain the identification information ID of the test connector 30. For example, the input unit 102 can be a barcode scanner to scan and obtain the identification information ID recorded in the barcode of the identification unit 300. In other embodiments, the input unit 102 can be a digital camera that can capture an image of the identification unit 300 and transmit it to the central processing unit 101, which performs optical character recognition (OCR) on the image to obtain the identification information ID of the identification unit 300. In other embodiments, the input unit 102 can be an RFID reader to directly read and obtain the identification information ID stored in the RFID form of the identification unit 300. In other embodiments, the input unit 102 can be a keyboard or mouse for the operator to input the identification information ID.
[0042] Regarding the timing of the transfer of the test connector 30 from the test sorting machine 20 to the management machine 10, for example, on the production line, each IC chip 40 tested by the test connector 30 is counted as one test action. The test sorting machine 20 can automatically record the number of test actions of the test connector 30. When the number of test actions of the test connector 30 reaches a warning threshold, the test connector 30 can be removed from the test sorting machine 20 and transferred to the management machine 10. The warning threshold is an adjustable preset value, which can be determined according to the specifications of the IC chip 40. For example, some high-end IC chips 40 may require a lower threshold number of tests. As another example, on the production line, if the yield of the test sorting machine 20 is low and persists for a period of time, it indicates that the test connector 30 may be malfunctioning, and the test connector 30 can be removed from the test sorting machine 20 and transferred to the management machine 10.
[0043] Step S02: The management unit 10 reads a probe specification corresponding to the identification information ID from a database DB. The probe specification includes a probe code and a feature code for each probe 320 included in the test connector 30. In an embodiment of the present invention, the database DB can be established in the storage unit 103 and / or the remote hard disk 106 so that the central processing unit 101 can access the database DB. The database DB stores multiple identification information IDs and a probe specification corresponding to each identification information ID. The multiple identification information IDs correspond to different multiple test connectors 30 (for ease of understanding, please refer to the table below for an example of only three test connectors A, B, and C). The probe specifications corresponding to different identification information IDs can be different or the same. In the probe specification corresponding to each identification information ID, the probe code corresponds to the position of each probe 320 of each test connector 30. For example, each probe code can be a probe coordinate. Each feature code corresponding to each probe code is a sensitive feature code or a non-sensitive feature code. The sensitive feature code and the non-sensitive feature code are different from each other. For example, the sensitive feature code can be "00" and the non-sensitive feature code can be "11".
[0044] Identification Information ID probe specifications Test connector A ABC-123 Specification X Test connector B DEF-456 Specification Y Test connector C GHI-789 Specification Z
[0045] In the database DB, each identification information ID and its corresponding probe specification are preset data. That is to say, the probe specifications of different test connectors 30 in the database DB are preset data. It is understood that the probe function of the test connector 30 corresponds to the contact function of the IC chip 40 under test. Since the contact function of the IC chip 40 is known, the present invention can pre-establish probe specifications corresponding to multiple identification information IDs (test connectors 30) in the database DB. The preset method of its feature code is described in the following embodiment.
[0046] Method 1: The probes of the test connector 30 can be defined as power pins and ground pins according to their functions. Other probes besides power pins and ground pins can be defined as signal pins. Signal pins can be used to transmit memory signals, input / output (I / O) signals, or communication interface signals of the IC chip 40. In other words, the probes 320 included in the test connector 30 can include three types: power pins, ground pins, and signal pins. It is understood that power pins and ground pins are used to transmit power, while signal pins are used to transmit AC or DC signals. However, the voltage or current of AC or DC signals is weaker than that of the power supply, so AC or DC signals are more affected by probe degradation. In this method, the feature codes of signal pins can be preset as sensitive feature codes, while the feature codes of power pins and ground pins can be preset as non-sensitive feature codes.
[0047] Method 2: The probes of the test connector 30 can be defined as high-frequency probes according to their functions, while other probes can be defined as general probes. That is, the probes 320 included in the test connector 30 can be categorized into two types based on a frequency threshold value: high-frequency probes for transmitting high-frequency signals and general probes. This frequency threshold value is a preset value. For example, if the object to be tested by the test connector 30 is a 5G communication technology IC chip 40, some probes of the test connector 30 may be used for high-frequency signals. These probes for transmitting high-frequency signals can be defined as high-frequency probes, and high-frequency signals are more significantly affected by probe degradation. Therefore, in this method, the feature codes of the high-frequency probes can be preset as sensitive feature codes, and the feature codes of the general probes can be preset as non-sensitive feature codes.
[0048] Method 3: The probes of the test connector 30 can be defined as high-bandwidth probes according to their functions, while other probes can be defined as general probes. That is, the probes 320 included in the test connector 30 can be categorized into two types based on a bandwidth range: high-bandwidth probes for transmitting high-bandwidth signals and general probes. This bandwidth range is a preset value. High-bandwidth signals are more significantly affected by probe degradation. For example, the frequency of the test signal for a high-bandwidth probe can be the highest and lowest frequencies within that bandwidth range (i.e., the limiting frequency). However, due to probe degradation, the highest or lowest frequency test signal may not be able to pass through the high-bandwidth probe smoothly, leading to inaccurate detection. Therefore, in this method, the feature code of the high-bandwidth probe can be preset as a sensitive feature code, and the feature code of the general probe can be preset as a non-sensitive feature code.
[0049] Method 4: The probes 320 included in the test connector 30 can be defined into multiple probe categories according to the test item, namely, a first probe category, a second probe category, ... and an Nth probe category, where N is a positive integer. Each probe 320 of the test connector 30 belongs to at least one probe category, and probes included in different probe categories may be repeated or not. The multiple probe categories correspond to different test items. In this method, the feature code of at least one probe in the multiple probe categories can be preset as a sensitive feature code, and the feature codes of probes in other probe categories can be preset as non-sensitive feature codes. For example, the test items for IC chip 40 may include premature failure test (EFT), high temperature operating life test (HTOL), electrostatic discharge test (ESD), etc., etc. Based on rules of thumb, IC chip 40 specifications and / or production line requirements, operators can assess from the test records which test items and which probes 320 are more severely degraded when the yield of the test sorting machine 20 decreases, and then preset the multiple probe categories and the feature codes of each probe 320 in each probe category as sensitive feature codes or non-sensitive feature codes.
[0050] Therefore, in step S02, after the central processing unit 101 of the management unit 10 obtains the identification information ID of the test connector 30, it can search the database DB for a probe specification that matches the identification information ID. This probe specification is the current probe specification of the test connector 30, and it records the probe code and feature code of the plurality of probes 320 contained in the test connector 30. Continuing with the example shown in the table above, if the identification information ID obtained by the management unit 10 from the test connector 30 in step S01 is "DEF-456", in step S02, it can search the database DB for the matching identification information ID "DEF-456" and read its corresponding probe specification "Specification Y".
[0051] Step S03: The management unit 10 displays the probe codes and feature codes of the plurality of probes 320 of the probe specification, so as to replace the probe in the test connector 30 corresponding to the sensitive feature code. In an embodiment of the present invention, the central processing unit 101 can display the probe codes and feature codes of the plurality of probes 320 of the probe specification through the display unit 104. By recognizing that the feature codes of the plurality of probes 320 of the test connector 30 are respectively sensitive feature codes and non-sensitive feature codes, the probe corresponding to the sensitive feature code can be replaced intuitively, instead of having to replace all probes 320, effectively avoiding the waste of probes.
[0052] The database DB stores historical data corresponding to each identification information ID. The historical data includes the probe code and feature code of each probe that is replaced each time the test connector 30 is replaced. Therefore, when the identification information ID of the test connector 30 is obtained in the aforementioned step S01, the central processing unit 101 of the management unit 10 can not only read the corresponding probe specification from the database DB, but also read the corresponding historical data from the database DB, and display the probe specification and the historical data through the display unit 104. The probe specification and the historical data can be used as a reference for replacing the probe.
[0053] In summary, there are many types of IC chips 40 that need to be tested on the production line of the testing plant, and the specifications of different IC chips 40 are also different. In response to the diverse specifications of IC chips 40, the testing plant also needs to have a variety of test connectors 30 with corresponding specifications. Each type of test connector 30 can have hundreds or thousands of probes. Through this invention, the probes corresponding to sensitive feature codes in each test connector 30 can be displayed to facilitate replacement, instead of replacing all probes as described in the previous technology. Therefore, this invention can effectively avoid the waste of probes, not only greatly reducing the cost of probe replacement, but also achieving the environmental protection goal of energy saving and carbon reduction.
[0054] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.
Claims
1. A probe exchange and test management control method, characterized by, The probe replacement and test management control method is implemented in a management machine, and includes the following steps: acquiring an identification information of a test connector, wherein the test connector is transferred from a test sorting machine to the management machine, and the test connector includes a plurality of probes; reading a probe specification corresponding to the identification information from a database, wherein the probe specification includes a probe code and a feature code of each probe of the test connector, and the feature code is a sensitive feature code or a non-sensitive feature code; and displaying the probe code and the feature code of the plurality of probes of the probe specification to replace the probe corresponding to the sensitive feature code in the test connector.
2. The probe replacement and test management control method according to claim 1, characterized by, The plurality of probes included in the test connector includes power supply probes, reference potential probes, and signal probes; in the probe specification, the feature code of the signal probes is the sensitive feature code, and the feature codes of the power supply probes and the reference potential probes are the non-sensitive feature codes.
3. The probe replacement and test management control method of claim 1, wherein, The plurality of probes included in the test connector includes high-frequency probes and general probes other than the high-frequency probes; in the probe specification, the feature code of the high-frequency probes is the sensitive feature code, and the feature codes of the general probes are the non-sensitive feature codes.
4. The probe replacement and test management control method of claim 1, wherein, The plurality of probes included in the test connector includes high-frequency wide probes and general probes other than the high-frequency wide probes; in the probe specification, the feature code of the high-frequency wide probes is the sensitive feature code, and the feature codes of the general probes are the non-sensitive feature codes.
5. The probe replacement and test management control method of claim 1, wherein, The plurality of probes included in the test connector is defined as a plurality of probe categories; the feature code of the probes of at least one of the plurality of probe categories is the sensitive feature code, and the feature codes of the probes of the other probe categories are the non-sensitive feature codes.
6. A probe exchange and test management machine characterized by, comprises: an input unit configured to acquire an identification information of a test connector, wherein the test connector includes a plurality of probes; a display unit; and a central processing unit connected to the input unit and the display unit, the central processing unit reads a probe specification corresponding to the identification information from a database, wherein the probe specification includes a probe code and a feature code of each probe of the test connector, and the feature code is a sensitive feature code or a non-sensitive feature code; the central processing unit displays the probe code and the feature code of the plurality of probes of the probe specification through the display unit to replace the probe corresponding to the sensitive feature code in the test connector.
7. The probe replacement and test management machine of claim 6, wherein, The plurality of probes included in the test connector includes power supply probes, reference potential probes, and signal probes; in the probe specification, the feature code of the signal probes is the sensitive feature code, and the feature codes of the power supply probes and the reference potential probes are the non-sensitive feature codes.
8. The probe replacement and test management machine of claim 6, wherein, The plurality of probes included in the test connector includes high-frequency probes and general probes other than the high-frequency probes; in the probe specification, the feature code of the high-frequency probes is the sensitive feature code, and the feature codes of the general probes are the non-sensitive feature codes.
9. The probe replacement and test management machine of claim 6, wherein, The plurality of probes included in the test connector include high-frequency wide probes and general probes other than the high-frequency wide probes; in the probe specification, the characteristic code of the high-frequency wide probes is the sensitive characteristic code, and the characteristic code of the general probes is the non-sensitive characteristic code.
10. The probe replacement and test management machine of claim 6, wherein, The plurality of probes included in the test connector are defined as a plurality of probe categories; the characteristic code of the probes of at least one of the plurality of probe categories is the sensitive characteristic code, and the characteristic code of the probes of the other probe categories is the non-sensitive characteristic code.