Photoetching modeling file generation method and device, computer equipment and storage medium
By selecting target measurement points and linking them to target images during lithographic modeling, automatic or semi-automatic modeling file generation is achieved, solving the problems of time-consuming and error-prone traditional lithographic modeling and realizing more efficient and accurate modeling file generation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2026-03-10
AI Technical Summary
Traditional photolithography modeling methods are time-consuming and prone to errors, affecting modeling efficiency and accuracy.
By acquiring the initial modeling file, selecting target measurement points and linking target images, the modeling file is generated automatically or semi-automatically, including influencing factor detection and image validity detection, and the measurement information is updated or maintained to generate an accurate modeling file.
It improves the generation rate and accuracy of lithography modeling files, simplifies program complexity, and enhances the effectiveness and accuracy of models.
Smart Images
Figure CN121634716A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of photolithography, and in particular, to a photolithography modeling file generation method, a photolithography model establishment method, a photolithography modeling file generation device, a computer device, a storage medium, and a computer program product. BACKGROUND
[0002] With the progress of integrated circuit technology, semiconductor manufacturing technology is constantly developing towards smaller sizes and more layers, which puts higher requirements on computing lithography models. In order to ensure that the lithography model has sufficient accuracy for smaller size design patterns, a large amount of measurement data needs to be collected for lithography modeling (such as OPC modeling).
[0003] In the traditional way, the modeling data is obtained manually, which consumes time and is prone to errors in the data processing process, affecting the modeling efficiency and model accuracy. SUMMARY
[0004] Therefore, it is necessary to provide a photolithography modeling file generation method, a photolithography model establishment method, a photolithography modeling file generation device, a computer device, a storage medium, and a computer program product that can effectively improve the generation rate and accuracy of the photolithography modeling file.
[0005] A photolithography modeling file generation method comprises:
[0006] Obtaining an initial modeling file, the initial modeling file comprising measurement information of a plurality of measurement points, the measurement information comprising measurement values;
[0007] Linking a target picture according to a target measurement point, the target measurement point being a selected measurement point from the plurality of measurement points, and the target picture being a measurement picture corresponding to the target measurement point;
[0008] Generating modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point.
[0009] In one embodiment, the obtaining of the initial modeling file comprises:
[0010] Obtaining a measurement text file of a plurality of measurement pictures;
[0011] Generating the initial modeling file according to the measurement text file of the plurality of measurement pictures.
[0012] In one embodiment, the generating of the modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point comprises:
[0013] A first detection is performed on the exposure pattern where the target measurement point is located in the target image, wherein the first detection is the detection of factors affecting the measurement value;
[0014] When the result of the first detection is normal, the measurement information of the target measurement point in the initial modeling file remains unchanged and is used as the modeling file information of the target measurement point.
[0015] In one embodiment, when the result of the first detection is abnormal, the measurement value in the measurement information of the target measurement point is updated in the initial modeling file to generate the modeling file information of the target measurement point.
[0016] In one embodiment, generating the modeling file information of the target measurement points based on the target image and the measurement information of the target measurement points includes:
[0017] A second detection is performed on the exposure pattern where the target measurement point is located in the target image. The second detection is an image validity detection.
[0018] When the result of the second detection is abnormal, the measurement information of the target measurement point in the initial modeling file is closed or deleted.
[0019] When the result of the second detection is normal, the first detection is performed on the exposure pattern where the target measurement point is located in the target image.
[0020] In one embodiment, the target image includes a contour-marked image and the original image.
[0021] The first detection of the exposure pattern where the target measurement point is located in the target image includes:
[0022] Detect the graphic contour of the exposure pattern where the target measurement point is located in the contour mark image;
[0023] When the result of the first detection is abnormal, the measurement value in the measurement information of the target measurement point is updated in the initial modeling file to generate the modeling file information of the target measurement point, including:
[0024] When the graphic contour contains a noisy image, the graphic contour is regenerated in the original image in the area of the exposed graphic where the target measurement point is located after removing the noisy image.
[0025] Based on the regenerated graphic contour in the original image, the measurement value of the target measurement point is recalculated.
[0026] The recalculation results are updated to the measurement values of the target measurement points in the initial modeling file to generate the modeling file information of the target measurement points.
[0027] In one embodiment,
[0028] The first detection of the exposure pattern where the target measurement point is located in the target image includes:
[0029] Compare the actual shape of the exposure pattern where the target measurement point is located in the target image with the preset shape;
[0030] When the result of the first detection is abnormal, the measurement value in the measurement information of the target measurement point is updated in the initial modeling file to generate the modeling file information of the target measurement point, including:
[0031] When the actual shape of the exposure pattern where the target measurement point is located in the target image is inconsistent with the preset shape, the measurement value of the target measurement point is recalculated according to the actual shape.
[0032] The recalculation results are updated to the measurement values of the target measurement points in the initial modeling file to generate the modeling file information of the target measurement points.
[0033] In one embodiment, the target image includes a contour marker image, and comparing the actual shape of the exposure pattern containing the target measurement point in the target image with a preset shape includes:
[0034] The actual contour shape of the exposure pattern where the target measurement point in the contour mark image is located is compared with the preset contour shape.
[0035] In one embodiment, linking the target image based on the target measurement point includes:
[0036] In response to a trigger event at the target measurement point, the target image is displayed.
[0037] A method for establishing a photolithography model, comprising:
[0038] According to any of the above-described lithography modeling file generation methods, modeling file information of the plurality of measurement points in the initial modeling file is generated to convert the initial modeling file into a final modeling file;
[0039] Based on the final modeling file, a lithography model is created.
[0040] A photolithography modeling file generation apparatus, the apparatus comprising:
[0041] The acquisition module is used to acquire an initial modeling file, which includes measurement information of multiple measurement points, and the measurement information includes measurement values.
[0042] The linking module is used to link a target image based on a target measurement point, wherein the target measurement point is a measurement point selected from the plurality of measurement points, and the target image is a measurement image corresponding to the target measurement point.
[0043] The generation module generates modeling file information for the target measurement points based on the target image and the measurement information of the target measurement points.
[0044] A computer device includes a memory and a processor, the memory storing a computer program, the processor executing the computer program to implement the steps of any of the methods described above.
[0045] A computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of any of the methods described above.
[0046] A computer program product includes a computer program that, when executed by a processor, implements the steps of any of the methods described above.
[0047] The aforementioned method for generating lithographic modeling files, method for establishing lithographic models, apparatus for generating lithographic modeling files, computer equipment, storage medium, and computer program products first obtain an initial modeling file, then select target measurement points from multiple measurement points, and link target images (measurement images corresponding to the target measurement points) based on the target measurement points. Establishing a link between the target measurement points and the target images effectively improves the generation speed and accuracy of lithographic modeling files. Attached Figure Description
[0048] Figure 1 This is a flowchart illustrating a method for generating lithography modeling files in one embodiment;
[0049] Figure 2 This is a flowchart illustrating the photolithography modeling file generation method in another embodiment;
[0050] Figure 3 This is a flowchart illustrating the method for generating lithography modeling files in yet another embodiment;
[0051] Figure 4 This is a flowchart illustrating the method for generating lithography modeling files in another embodiment;
[0052] Figure 5 This is a schematic diagram of a portion of the tables in an initial modeling file formed in one embodiment;
[0053] Figure 6 This is a schematic diagram of a portion of the tables in the initial modeling file formed in another embodiment;
[0054] Figure 7This is a structural block diagram of a photolithography modeling file generation device in one embodiment;
[0055] Figure 8 This is a partial schematic diagram of a measurement image in one embodiment. Detailed Implementation
[0056] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0057] In one embodiment, see Figure 1 This paper provides a method for generating photolithography modeling files, including the following steps:
[0058] Step S10: Obtain the initial modeling file. The initial modeling file includes measurement information of multiple measurement points, and the measurement information includes measurement values.
[0059] The initial modeling file is an initial text file used for lithography modeling. For example, the initial modeling file is an initial gauge file used to build an optical proximity correction (OPC) model.
[0060] Before performing photolithography modeling, the photoresist on the wafer can first be exposed and developed using photolithography. Then, a measurement image of the exposed pattern on the wafer can be obtained using a scanning electron microscope (SEM, etc.).
[0061] Please see Figure 8 A single measurement image can contain several complete exposure patterns 10, or only a portion of a larger exposure pattern (not shown). Several measurement points (such as measurement point 1 and measurement point 2) can be set on the same measurement image to measure the linewidth of the corresponding exposure pattern 10 at a specific location and angle. It can be understood that "several" means one or more. Furthermore, it can be understood that a measurement point represents a measurement line segment used to measure the linewidth of the exposure pattern 10 it is located at a specific location and angle. The position coordinates of the measurement point can be represented by the coordinates of the two endpoints of the measurement line segment. "Multiple measurement points" in the initial modeling file can refer to multiple measurement points measuring multiple different locations of multiple different exposure patterns 10, and different locations on the same exposure pattern 10 can be measured at different angles to form different measurement points. "Multiple measurement points" in the initial modeling file can come from "multiple measurement images". Specifically, for example, the initial modeling file has m measurement points, which can come from n measurement images, and it is understood that the values of m and n can be different (or not necessarily the same).
[0062] The initial modeling file includes measurement information for multiple measurement points. This measurement information includes measurement values, which can be linewidth values. Additionally, the measurement information may include the name of the measurement point, its coordinates, the 3sigma linewidth, chip coordinates, and the graphic type.
[0063] Step S20: Link the target image based on the target measurement point. The target measurement point is the measurement point selected from multiple measurement points, and the target image is the measurement image corresponding to the target measurement point.
[0064] Based on the coordinates or names of each measurement point, one of the multiple measurement points in the initial modeling file can be selected as the target measurement point.
[0065] After measuring the exposed pattern on the wafer using SEM or similar methods, a measurement image can be obtained not only as an image file but also as a corresponding measurement text file. The measurement text file can include measurement information for each measurement point in the measurement image.
[0066] Measurement text files and image files are linked. Based on the measurement points in the measurement text file, corresponding image files can be linked, and thus, corresponding measurement images can be linked. Therefore, based on the target measurement point, its corresponding image file can be linked, and thus, the target image can be linked.
[0067] Step S30: Generate modeling file information for the target measurement points based on the target image and the measurement information of the target measurement points.
[0068] Based on the target image, it can be determined whether the measurement information of the target measurement points is accurate. Based on the judgment result, the measurement information of the target measurement points in the initial modeling file can be kept unchanged and used as the modeling file information of the target measurement points; or the measurement information of the target measurement points in the initial modeling file can be corrected to generate the modeling file information of the target measurement points.
[0069] After processing one target measurement point, the target measurement point can be changed, and steps S20 to S30 can be repeated to process each measurement point in the initial modeling file, thereby converting the initial modeling file into the final modeling file. The final modeling file can be used for lithography modeling.
[0070] In this embodiment, an initial modeling file is first obtained, then a target measurement point is selected from multiple measurement points, and a target image (the measurement image corresponding to the target measurement point) is linked based on the target measurement point. Establishing a link between the target measurement point and the target image can effectively improve the generation speed and accuracy of the lithography modeling file.
[0071] In one embodiment, see Figure 2Step S10 includes:
[0072] Step S11: Obtain measurement text files of multiple measurement images.
[0073] It can acquire measurement text files as well as image files.
[0074] As an example, measurement images can be obtained through SEM. In this case, the SEM machine can acquire both measurement text files and image files. The measurement text file may include an MSR file. The image files can be image files output by the SEM.
[0075] Step S12: Generate an initial modeling file based on the measurement text files of multiple measurement images.
[0076] It can read the measurement information of each measurement point from the measurement text file (such as an MSR file) of each measurement image. Then, it can organize the measurement information of multiple measurement points (such as m measurement points) from multiple measurement images (such as n measurement images) to generate an initial modeling file. The initial modeling file has a different file format than the measurement text file, so the file format can be automatically converted.
[0077] In this embodiment, an initial modeling file can be automatically generated based on the original measurement text file of the measurement image.
[0078] In one embodiment, step S20 includes:
[0079] Step S21: In response to the trigger event of the target measurement point, display the target image.
[0080] At this point, after the initial modeling file is created, it can be opened.
[0081] As an example, the initial modeling file can be in tabular format. See also... Figure 5 as well as Figure 6 In the initial modeling file, each line of data represents the measurement information of one measurement point. Different lines of data represent the measurement information of different measurement points.
[0082] After opening the initial modeling file, relevant personnel can click on the table row containing the target measurement point to trigger the target measurement point. The system can then respond to the trigger event of the target measurement point, link to the corresponding image file, and open and display the target image in that image file.
[0083] At this time, it is convenient for relevant staff to conduct intuitive monitoring of the target measurement points based on the target image.
[0084] Afterwards, relevant staff can determine whether the measurement information of the target measurement points needs to be corrected based on the monitoring results of the target image.
[0085] As an example, step S21, in response to the trigger event of the target measurement point, displays the target image and, simultaneously, the first control. When relevant personnel monitor an abnormality in the exposure pattern of the target measurement point in the target image, they can click the first control to automatically import the target image into external processing software. The external processing software then executes step S30, generating a modeling file information for the target measurement point based on the target image and the measurement information of the target measurement point. Specifically, the external processing software remeasures the exposure pattern of the target measurement point to re-obtain its measurement information, and updates this re-obtained information to the initial modeling file, generating the modeling file information for the target measurement point. Conversely, when relevant personnel monitor a normal exposure pattern of the target measurement point in the target image, the measurement information of the target measurement point in the initial modeling file remains unchanged, serving as the modeling file information for the target measurement point.
[0086] At this point, the modeling file information and the final modeling file are obtained using a semi-automatic method. On the one hand, by automatically connecting to the target image, and when there are abnormalities in the exposure pattern of the target measurement point in the target image, it can automatically connect to external processing software, which can improve the file generation effect and simplify the program complexity. On the other hand, this embodiment can display the target image, thereby enabling the identification of abnormalities in the pattern that are difficult for manual software algorithms to identify, thus making the obtained modeling file information and the final modeling file more accurate.
[0087] It is understood that this embodiment is only one implementation method of this application. In other embodiments, in step S20, after automatically selecting the target measurement points, the image file of the target image can be automatically linked according to the selected target measurement points, without displaying the target image. Then, in step S30, it is possible to automatically detect whether the exposure pattern where the target measurement points are located in the target image has abnormal conditions, and automatically update or maintain the measurement information of the target measurement points in the initial modeling file according to the detection results, thereby generating the modeling file information of the target measurement points. Thus, after taking all measurement points in the initial modeling file as target measurement points, the initial modeling file is automatically converted into the final modeling file. At this time, the final modeling file can be generated in a fully automatic manner. In other embodiments, a combination of semi-automatic and fully automatic methods can be used to achieve the generation of the final modeling file.
[0088] In one embodiment, see Figure 3 Step S30 includes:
[0089] Step S33: Perform a first detection on the exposure pattern where the target measurement point is located in the target image. The first detection is the detection of factors affecting the measurement value.
[0090] When obtaining measurement images by imaging exposure patterns using methods such as SEM, there may be factors influencing the measurement values (such as line width values) of various measurement points within the measurement image. Therefore, the measurement values (such as line width values) of each measurement point in the measurement text file of the measurement image obtained through SEM may be incorrect, which in turn may lead to errors in the measurement values (such as line width values) of each measurement point in the initial modeling file.
[0091] This step allows for the initial detection of factors affecting the measurement values of the target measurement points.
[0092] Step S34: When the result of the first detection is normal, the measurement information of the target measurement points in the initial modeling file is kept unchanged and used as the modeling file information of the target measurement points.
[0093] The factors affecting the measurement value of the target measurement point during the first test can be one or more. When multiple influencing factors are tested first, the result of the first test can be judged as normal if the test results of each influencing factor are normal; otherwise, the result of the first test can be judged as abnormal.
[0094] When the result of the first test is normal, it means that the measurement values (such as line width values) of the target measurement points in the initial modeling file are relatively accurate. Therefore, the measurement information of the target measurement points in the initial modeling file can be kept unchanged and used as the modeling file information of the target measurement points.
[0095] In one embodiment, see Figure 3 Step S33 is followed by:
[0096] Step S35: When the result of the first detection is abnormal, update the measurement value in the measurement information of the target measurement point in the initial modeling file to generate the modeling file information of the target measurement point.
[0097] When the result of the first detection is abnormal, it indicates that the exposure pattern of the target measurement point in the target image has an abnormal condition, which may lead to errors in the measurement value (such as line width value) of the target measurement point in the initial modeling file. At this time, the measurement value (such as line width value) of the target measurement point can be recalculated and updated to the initial modeling file to form the modeling file information of the target measurement point.
[0098] When one influencing factor is abnormal, the measurement value of the target measurement point can be recalculated according to the corresponding recalculation method for that influencing factor. When multiple influencing factors are abnormal, the measurement value of the target measurement point can be recalculated by combining multiple corresponding recalculation methods.
[0099] In this embodiment, abnormal conditions in the exposure pattern of the target measurement point in the target image can be automatically detected, thereby further improving the efficiency of modeling file generation.
[0100] In one embodiment, see Figure 4 Step S30 includes:
[0101] Step S31: Perform a second detection on the exposure pattern where the target measurement point is located in the target image. The second detection is an image validity detection.
[0102] As explained above, before photolithography modeling, the photoresist on the wafer can first be exposed and developed using photolithography. However, in the actual process, issues such as photoresist collapse may occur, leading to abnormal exposure patterns (such as breaks or connections). Therefore, in the measurement images obtained after exposure using SEM or similar methods, locations with abnormal exposure patterns do not represent the normal exposure conditions. Thus, measurement points at these locations are invalid measurement points, i.e., not valid measurement points. Photolithography modeling, on the other hand, models the normal exposure conditions.
[0103] Based on this, the validity of the image can be detected by examining the exposure pattern of the target measurement point in the target image.
[0104] Step S32: When the result of the second detection is abnormal, close or delete the measurement information of the target measurement points in the initial modeling file.
[0105] When the result of the second detection is abnormal, it indicates that the exposure pattern containing the target measurement point is invalid, meaning the target measurement point is an invalid measurement point. Therefore, the measurement information of the target measurement point can be turned off or deleted in the initial modeling file.
[0106] If the result of the second detection is normal, perform the first detection on the exposure pattern where the target measurement point is located in the target image. That is, if the result of the second detection is normal, proceed to step S33.
[0107] When the second detection result is normal, it indicates that the exposure pattern containing the target measurement point is a valid pattern. Therefore, the target measurement point can be used for photolithography modeling. At this point, performing the first detection on the exposure pattern containing the target measurement point in the target image can further ensure the accuracy of the target measurement point's measurement information.
[0108] In this embodiment, by first performing a second detection on the exposure pattern where the target measurement point is located in the target image, all measurement points used for photolithography modeling can be considered valid measurement points, thereby improving the accuracy of photolithography modeling.
[0109] In other embodiments, when the modeling file information and final modeling file are obtained in a semi-automatic manner, after step S21, relevant personnel can also perform a second detection on the exposure pattern where the target measurement point is located in the target image. Simultaneously, in response to the target measurement point trigger event, step S21 can display the target image and a second control. When relevant personnel detect that the exposure pattern where the target measurement point is located is invalid, they can click the second control to delete or close the measurement information of the target measurement point in the initial modeling file.
[0110] In one embodiment, the target image linked according to the target measurement point in step S20 may include a contour marker image, and may also include the original image.
[0111] When measuring an exposure pattern using SEM or similar methods, two types of measurement images can be obtained for the same measurement point. One is the original image, or raw image. The other is an image with outline markings added to the original image, or outline-marked image. The outline markings can be, for example, dashed boxes. SEM or similar methods calculate the measurement values (such as line width) for each measurement point based on the outline marking image.
[0112] In this case, step S33 includes:
[0113] Step S331a: Detect the graphic contour of the exposure pattern where the target measurement point is located in the contour marker image.
[0114] Measurement images obtained through SEM and other measurements may contain noise in addition to the exposed image. Therefore, when adding contour markers to the exposed image to calculate the measurement values (such as line width) at each measurement point, the contour markers may mistakenly include the noise image within the exposed image, thus enclosing the noise image and creating an incorrect contour. Consequently, the calculation of the measurement values (such as line width) at each measurement point may become inaccurate.
[0115] Therefore, the graphic contour of the exposure pattern where the target measurement point is located in the contour-marked image can be detected.
[0116] Accordingly, step S35 includes:
[0117] Step S351a: When the graphic contour contains a noisy image, the graphic contour is regenerated in the original image in the area of the noise-removed image of the exposed graphic where the target measurement point is located.
[0118] When a graphic outline contains noisy images, it indicates that the outline is incorrect. In this case, the original image can be processed to obtain the area of the noisy image removed from the exposure pattern where the target measurement point is located. Then, the graphic outline can be regenerated within this area.
[0119] Step S352a: Recalculate the measurement values of the target measurement points based on the regenerated graphic contour in the original image.
[0120] The regenerated graphic contour in the original image is the contour of the exposure pattern after eliminating noise interference. Therefore, by recalculating based on this graphic contour, accurate and effective measurement values of the target measurement points can be obtained.
[0121] Step S353a: Update the recalculation results to the measurement values of the target measurement points in the initial modeling file to generate the modeling file information of the target measurement points.
[0122] In this embodiment, the original image is linked to the contour marker image along with the target measurement point in step S2. The contour marker image effectively detects anomalies in the exposure pattern contour where the target measurement point is located. The original image does not contain any external contour markers. Therefore, by using the original image, when the exposure pattern contour where the target measurement point is located is abnormal, it is easier to reconstruct an accurate pattern contour, thereby facilitating the acquisition of accurate measurement calculation results.
[0123] In some other embodiments, only the contour marker image may be linked in step S20. In this case, in step S35, the contour of the exposure pattern where the target measurement point is located may be removed first, and then a contour without noise image may be regenerated. The measurement values of the target measurement point in the initial modeling file may be recalculated and updated based on the new contour.
[0124] In one embodiment, step S33 includes:
[0125] Step S331b: Compare the actual shape of the exposure pattern where the target measurement point is located in the target image with the preset shape.
[0126] The actual shape is the actual shape of the exposed pattern. The preset shape is the shape of the exposed pattern to be formed by the desired exposure.
[0127] When calculating the measurement values of each exposure point in a metrology machine such as SEM, the calculation is usually based on the calculation method of the preset shape to be formed. However, in the actual exposure process, the exposed pattern may undergo a significant degree of deformation, resulting in a deviation between the actual shape and the preset shape, leading to inaccurate measurement values calculated using the preset shape.
[0128] For example, if the preset shape is circular, the SEM machine will take the average of multiple direct measurements along the center as the measurement value. However, during actual exposure, the circle may deform into a rhombus. In this case, using the circular calculation method will lead to inaccurate measurement values.
[0129] For example, if the preset shape is a straight strip, the SEM machine can use the average width of the strip at multiple locations along its extension direction as the measurement value. However, during actual exposure, the strip may be concave in the middle. In this case, using the same calculation method as for the straight strip will lead to inaccurate measurement values.
[0130] This is based on comparing the actual shape of the exposure pattern containing the target measurement point with a preset shape. During the comparison, for example, the similarity between the actual shape and the preset shape can be calculated. If the similarity between the actual shape and the preset shape is greater than the preset similarity, then the actual shape is considered to be consistent with the preset shape. Otherwise, the actual shape is considered to be inconsistent with the preset shape.
[0131] Accordingly, step S35 includes:
[0132] Step S351b: When the actual shape of the exposure pattern where the target measurement point is located in the target image is inconsistent with the preset shape, the measurement value of the target measurement point is recalculated according to the actual shape.
[0133] For example, when the preset shape is a circle but the actual shape is a rhombus, the measurement value of the target measurement point can be recalculated based on the rhombus. Specifically, when the actual shape is a rhombus, the longest diagonal of the rhombus can be used as the measurement value of the target measurement point.
[0134] For example, when the preset shape is a straight strip, but the actual shape is a strip with a concave center, the measurement value of the target measurement point can be recalculated based on the concave center shape. Specifically, when the actual shape is a strip with a concave center, the minimum value of the width at multiple positions along the extension direction of the strip can be used as the measurement value of the target measurement point.
[0135] Step S352b: Update the recalculation results to the measurement values of the target measurement points in the initial modeling file to generate the modeling file information of the target measurement points.
[0136] In one embodiment, the target image includes a contour marker image. That is, step S20 can link the contour marker image of the target measurement point based on the target measurement point.
[0137] Step S331b includes:
[0138] The actual outline shape of the exposure pattern containing the target measurement point in the outline marker image is compared with the preset outline shape.
[0139] Meanwhile, as an example, in step S351b, the measurement value of the target measurement point in the contour marker image can be recalculated based on the actual contour shape of the target measurement point in the contour marker image. In this case, step S20 only needs to link the contour marker image based on the target measurement point, and does not need to link the original image.
[0140] Alternatively, as another example, step S20 can link both the contour marker image and the original image based on the target measurement point. In step S351, a contour can also be added to the exposure pattern where the target measurement point is located in the original image, thereby recalculating the measurement value of the target measurement point based on the actual shape. Alternatively, the calculation of the measurement value of the target measurement point is not limited to first forming a contour. This application has no restrictions on either.
[0141] In this embodiment, by linking the outline marker image, the actual shape can be easily and effectively compared with the preset outline shape by comparing the existing actual outline shape with the preset outline shape.
[0142] Of course, in other embodiments, the comparison between the actual shape and the preset shape is not limited to a contour comparison. In step S331, the actual shape of the exposure pattern containing the target measurement point in the original image can also be compared with the preset shape. It is understood that these variations are within the scope of protection of this application.
[0143] It should be understood that, although Figures 1-4 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figures 1-4 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.
[0144] In one embodiment, a method for establishing a photolithography model is also provided, comprising:
[0145] Step S1: Based on any of the above-mentioned photolithography modeling file generation methods, generate modeling file information for multiple measurement points in the initial modeling file, so as to convert the initial modeling file into the final modeling file.
[0146] Step S2: Based on the final modeling file, establish the lithography model.
[0147] The final modeling file can be imported into computational lithography modeling software for model fitting and verification, thereby establishing a lithography model.
[0148] In one embodiment, see Figure 7 A photolithography modeling file generation device is provided, including: an acquisition module 100, a linking module 200 and a generation module 300.
[0149] The acquisition module 100 is used to acquire the initial modeling file, which includes measurement information of multiple measurement points, including measurement values.
[0150] The linking module 200 is used to link a target image based on a target measurement point. The target measurement point is a measurement point selected from multiple measurement points, and the target image is the measurement image corresponding to the target measurement point.
[0151] The generation module 300 generates modeling file information for the target measurement points based on the target image and the measurement information of the target measurement points.
[0152] In one embodiment, the acquisition module 100 includes an acquisition unit and an initial generation unit.
[0153] The acquisition unit is used to acquire measurement text files and image files of multiple measurement images.
[0154] The initial generation unit is used to generate an initial modeling file based on measurement text files from multiple measurement images.
[0155] In one embodiment, the generation module 300 includes a first detection unit and a first processing unit.
[0156] The first detection unit is used to perform a first detection on the exposure pattern where the target measurement point is located in the target image. The first detection is the detection of factors affecting the measurement value.
[0157] The first processing unit is used to keep the measurement information of the target measurement points in the initial modeling file unchanged when the result of the first detection is normal, so as to use it as the modeling file information of the target measurement points.
[0158] In one embodiment, the first processing unit is further configured to update the measurement value in the measurement information of the target measurement point in the initial modeling file when the result of the first detection is abnormal, so as to generate the modeling file information of the target measurement point.
[0159] In one embodiment, the generation module 300 further includes a second detection unit and a second processing unit.
[0160] The second detection unit is used to perform a second detection on the exposure pattern where the target measurement point is located in the target image. The second detection is image validity detection.
[0161] The second processing unit is used to close or delete the measurement information of the target measurement point in the initial modeling file when the result of the second detection is abnormal, and to perform a first detection on the exposure pattern where the target measurement point is located in the target image when the result of the second detection is normal.
[0162] In one embodiment, the target image includes a contour-marked image and the original image.
[0163] The first detection unit is used to detect the graphic outline of the exposure pattern where the target measurement point is located in the contour mark image.
[0164] The first processing unit is used to regenerate the graphic contour in the region of the noise-removed image of the exposed graphic where the target measurement point is located in the original image when the graphic contour contains a noisy image; recalculate the measurement value of the target measurement point based on the regenerated graphic contour in the original image; and update the measurement value of the target measurement point in the initial modeling file with the recalculated result to generate the modeling file information of the target measurement point.
[0165] In one embodiment, the first detection unit is used to compare the actual shape of the exposure pattern where the target measurement point is located in the target image with a preset shape.
[0166] The first processing unit is used to recalculate the measurement value of the target measurement point based on the actual shape when the actual shape of the exposure pattern where the target measurement point is located in the target image is inconsistent with the preset shape; and to update the measurement value of the target measurement point in the initial modeling file with the recalculated result to generate the modeling file information of the target measurement point.
[0167] In one embodiment, the first processing unit is used to compare the actual contour shape of the exposure pattern where the target measurement point in the contour mark image is located with a preset contour shape.
[0168] In one embodiment, the link module 200 is used to display a target image in response to a trigger event of the target measurement point.
[0169] Specific limitations regarding the lithography modeling file generation device can be found in the limitations of the lithography modeling file generation method described above, and will not be repeated here. Each module in the aforementioned lithography modeling file generation device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.
[0170] In one embodiment, a computer device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps in the above method embodiments.
[0171] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon that, when executed by a processor, implements the steps in the above method embodiments.
[0172] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps in the above method embodiments.
[0173] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.
[0174] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0175] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A method of lithographic modeling file generation, characterized by, The method comprises: obtaining an initial modeling file, the initial modeling file comprising measurement information of a plurality of measurement points, the measurement information comprising measurement values; linking a target picture according to a target measurement point, the target measurement point being a measurement point selected from the plurality of measurement points, the target picture being a measurement picture corresponding to the target measurement point; generating modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point.
2. The lithography modeling file generation method of claim 1, wherein, The obtaining of the initial modeling file comprises: obtaining a plurality of measurement text files of measurement pictures; generating the initial modeling file according to the plurality of measurement text files of the measurement pictures.
3. The lithography modeling file generation method of claim 1, wherein, The generating of the modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point comprises: performing first detection on an exposure pattern in which the target measurement point in the target picture is located, the first detection being detection of an influencing factor of the measurement value; when a result of the first detection is normal, keeping the measurement information of the target measurement point in the initial modeling file unchanged as the modeling file information of the target measurement point.
4. The lithography modeling file generation method of claim 3, wherein, when the result of the first detection is abnormal, updating a measurement value in the measurement information of the target measurement point in the initial modeling file to generate the modeling file information of the target measurement point.
5. The lithographic modeling file generation method according to claim 3 or 4, characterized by, The generating of the modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point comprises: performing second detection on the exposure pattern in which the target measurement point in the target picture is located, the second detection being picture validity detection; when a result of the second detection is abnormal, closing or deleting the measurement information of the target measurement point in the initial modeling file; when the result of the second detection is normal, performing the first detection on the exposure pattern in which the target measurement point in the target picture is located.
6. The lithography modeling file generation method of claim 4, wherein, The target picture comprises a contour mark picture and an original picture, the first detection on the exposure pattern in which the target measurement point in the target picture is located comprises: detecting a pattern contour of the exposure pattern in which the target measurement point in the contour mark picture is located; when the result of the first detection is abnormal, updating a measurement value in the measurement information of the target measurement point in the initial modeling file to generate the modeling file information of the target measurement point comprises: when the pattern contour contains a noise image, regenerating a pattern contour in an area in which the exposure pattern in which the target measurement point is located is removed from the original picture, the area being free of the noise image; recomputing the measurement value of the target measurement point according to the regenerated pattern contour in the original picture; updating the recomputed result to the measurement value of the target measurement point in the initial modeling file to generate the modeling file information of the target measurement point.
7. The photolithography modeling file generation method according to claim 4, wherein the first detection on the exposure pattern in which the target measurement point in the target picture is located comprises: comparing an actual shape of the exposure pattern in which the target measurement point in the target picture is located with a preset shape. When the first detection result is abnormal, updating a measurement value in the measurement information of the target measurement point in the initial modeling file to generate modeling file information of the target measurement point, including: When the actual shape of the exposure pattern where the target measurement point in the target picture is located is inconsistent with the preset shape, recalculating the measurement value of the target measurement point according to the actual shape; Updating the recalculated result to the measurement value of the target measurement point in the initial modeling file to generate the modeling file information of the target measurement point.
8. The lithography modeling file generation method of claim 7, wherein, The target picture includes a contour mark picture, and the actual shape of the exposure pattern where the target measurement point in the target picture is located is compared with the preset shape, including: The actual contour shape of the exposure pattern where the target measurement point in the contour mark picture is located is compared with the preset contour shape.
9. The photolithography modeling file generation method of claim 1, wherein, The target picture is linked according to the target measurement point, including: In response to a trigger event of the target measurement point, the target picture is displayed.
10. A method of establishing a lithography model, characterized by, Including: The photolithography modeling file generation method according to any one of claims 1 to 9 generates modeling file information of the plurality of measurement points in the initial modeling file to convert the initial modeling file into a final modeling file; According to the final modeling file, a photolithography model is established.
11. An apparatus for generating a lithography modeling file, the apparatus comprising: The device includes: An acquisition module is configured to acquire an initial modeling file, wherein the initial modeling file includes measurement information of a plurality of measurement points, and the measurement information includes measurement values; A linking module is configured to link a target picture according to a target measurement point, wherein the target measurement point is a selected measurement point from the plurality of measurement points, and the target picture is a measurement picture corresponding to the target measurement point; A generation module is configured to generate modeling file information of the target measurement point according to the target picture and the measurement information of the target measurement point.
12. A computer device comprising a memory and a processor, the memory storing a computer program, characterized in that, The processor executes the computer program to implement the steps of the method in any one of claims 1 to 9.
13. A computer readable storage medium having stored thereon a computer program, characterized in that The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 9.
14. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the method in any one of claims 1 to 9.