Heat dissipation assembly, electronic equipment and heat dissipation control method

Abstract

The invention discloses a heat dissipation assembly, electronic equipment and a heat dissipation control method, and belongs to the technical field of electronic equipment. The heat dissipation assembly comprises a heat dissipation hole group which is arranged on the back of the main body and is communicated with the internal space of the main body; the decorative plate is arranged on the main body in a turnover manner so as to shield or avoid the heat dissipation hole group; the driving part is arranged between the main body and the decorative plate, the driving part is in signal connection with the control part, and the driving part can drive the decorative plate to turn over according to a received control signal sent by the control part. And when the equipment is in a high-load working state and needs a large amount of heat dissipation, the control part can provide the driving part with the control part to control the decorative plate to turn over in time to avoid the heat dissipation hole set, and it is ensured that the heat dissipation channel is smooth. The aesthetic pursuit of a user for the appearance of the equipment is met, and meanwhile function exertion at the key heat dissipation moment is not affected.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, in particular to a heat dissipation assembly, an electronic device and a heat dissipation control method. BACKGROUND

[0002] In the field of electronic devices today, with the continuous improvement of performance, the heat generated is also increasing. To meet the needs of consumers for large-screen desktop office and portable mobile office scenarios, notebook computers, folding PCs (Personal Computer) or folding tablet products have been introduced.

[0003] Large-size folding PCs generally adopt a fanless or fan-side air inlet scheme (heat dissipation holes are arranged on the side) to achieve a simple and integrated elegant appearance, considering the delicate and high-end experience of the product. However, this approach has obvious defects.

[0004] On the one hand, in the past heat dissipation design, it is common to simply open fixed heat dissipation holes on the device shell. Such fixed heat dissipation holes are always exposed, not only affecting the neatness of the device appearance, but also easily allowing dust, debris and other foreign matter to enter the device interior, causing damage to internal components. For example, in a portable notebook computer, the long-term exposure of the heat dissipation holes can cause dust to accumulate inside, affecting the heat dissipation effect and even damaging the hardware.

[0005] On the other hand, the above-mentioned fanless or fan-side air inlet scheme has low overall heat dissipation efficiency. The above two design schemes can only improve performance by thickening the overall machine to increase the air inlet channel, or sacrifice experience by limiting the frequency of the CPU. When the device is in a low-load operation, excessive heat dissipation holes may cause unnecessary heat dissipation, affecting the energy utilization efficiency of the device; while when the device is in a high-load working state, the fixed heat dissipation holes may not be able to meet the demand for rapid heat dissipation, resulting in overheating of the device and affecting performance and stability. For example, in some professional graphics processing work, the working load of the device may increase sharply in a short period of time, and if the heat dissipation cannot be carried out in time, the program may crash or data may be lost. In addition, some electronic devices may adopt a closed shell design for the sake of appearance, completely ignoring the heat dissipation demand, resulting in frequent overheating protection and even shutdown of the device during use. SUMMARY

[0006] The present application provides a heat dissipation assembly, an electronic device and a heat dissipation control method, which are used to reasonably dissipate heat from the electronic device.

[0007] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0008] In a first aspect, a heat dissipation assembly is provided for an electronic device, the electronic device comprising a main body and a control unit installed in the main body, the heat dissipation assembly comprising: a heat dissipation hole group, the heat dissipation hole group being arranged on a back of the main body and being in communication with an internal space of the main body; a decorative plate, the decorative plate being reversibly arranged on the main body to shield or avoid the heat dissipation hole group; and a driving unit, the driving unit being arranged between the main body and the decorative plate, the driving unit being in signal connection with the control unit, and the driving unit being capable of driving the decorative plate to reverse according to a control signal sent by the control unit.

[0009] The heat dissipation assembly provided by the embodiments of the present application adopts a reversible decorative plate and is driven by a driving unit to realize automatic reversing of the decorative plate. When the electronic device is normally operated or does not need to dissipate a large amount of heat, the decorative plate can completely shield the heat dissipation hole group, effectively preventing external dust from entering the internal space of the main body through the heat dissipation hole group, and effectively protecting the precise components in the internal space of the electronic device. When the device is in a high-load working state and needs to dissipate a large amount of heat, the control unit can provide the driving unit with a control signal to timely reverse the decorative plate to avoid the heat dissipation hole group, thereby ensuring smooth heat dissipation. The heat dissipation assembly meets the aesthetic pursuit of users for the appearance of the device and does not affect the performance of the device in a critical heat dissipation moment.

[0010] In an embodiment, the driving unit is mounted on the main body, and an output end of the driving unit is in driving connection with the decorative plate. Mounting the driving unit on the main body provides a stable support basis for the driving unit, reduces possible shaking or displacement in the driving process, and enhances the structural stability of the entire heat dissipation assembly.

[0011] In an embodiment, the driving unit comprises a telescopic motor, and the telescopic motor comprises a telescopic rod, an end of the telescopic rod away from the main body forming an output end of the driving unit. The structure of the telescopic rod ensures stable output of driving force. During the reversing of the decorative plate, the telescopic rod can provide continuous and uniform force to avoid jamming or instability and ensure reliable operation of the heat dissipation assembly.

[0012] In an embodiment, the end of the telescopic rod away from the main body is rotatably connected with the decorative plate. Rotatable connection helps to eliminate possible jamming and resistance, ensures smoothness of the reversing action, and thus enables the heat dissipation hole group to be quickly and accurately avoided or shielded.

[0013] In one embodiment, the end of the telescopic rod away from the main body is magnetically connected with the decorative plate. The magnetic connection ensures stable and effective power transmission between the telescopic rod and the decorative plate, enabling the decorative plate to timely and accurately perform the flipping action according to the heat dissipation needs of the device. The fault tolerance space of the magnetic connection greatly reduces the precision requirements of the telescopic rod and the decorative plate during installation. This makes the production and assembly process more simple, improves production efficiency, and reduces production costs. During the use of the electronic device, slight deformation of the main body or components may occur due to factors such as temperature changes and mechanical stress. The fault tolerance characteristics of the magnetic connection can adapt to such deformation, ensuring the normal flipping of the decorative plate and not being affected by the slight deformation of the device.

[0014] In one embodiment, the end of the telescopic rod away from the main body is provided with a first magnetic part, and the side of the decorative plate close to the main body is provided with a second magnetic part. The positions of the first magnetic part and the second magnetic part correspond to each other. The first magnetic part and the second magnetic part corresponding in position attract each other, ensuring that the decorative plate flips as required, thereby achieving effective heat dissipation control.

[0015] In one embodiment, the upper side of the decorative plate is pivotally connected with the back of the main body, and the lower side of the decorative plate is provided with an anti-skid structure. The upper side of the decorative plate is pivotally connected with the back of the main body, combined with the anti-skid structure on the lower side, making the decorative plate more stable during opening and closing, and not easily shaking or moving accidentally.

[0016] In one embodiment, a damping part is provided between the decorative plate and the main body. The damping part can make the decorative plate move more smoothly during flipping or moving, avoid sudden movement, and reduce the impact and vibration caused by inertia.

[0017] In one embodiment, the heat dissipation assembly further comprises an auxiliary heat dissipation hole, which is provided on the side of the main body and communicates with the internal space of the main body. The auxiliary heat dissipation hole is located on the side of the main body and communicates with the internal space, providing an additional way for heat dissipation. This allows more hot air to be quickly discharged from the device, and cold air can also enter from more directions, thereby significantly increasing the speed and efficiency of heat dissipation.

[0018] In one embodiment, the heat dissipation assembly further comprises a heat dissipation device, which is provided in the internal space of the main body. The heat dissipation device provided in the internal space of the main body can directly dissipate heat from the heat source, greatly improving the heat dissipation efficiency and ensuring that the device can maintain a low temperature state during high-intensity operation, maintaining stable performance.

[0019] In one embodiment, the heat dissipation device comprises a fan, and the fan is in signal connection with the control unit. The fan is in signal connection with the control unit, so that the operation of the fan can be intelligently adjusted according to the actual heat dissipation demand of the equipment, avoiding energy waste and excessive noise caused by continuous high-speed operation, and at the same time, strong heat dissipation wind power can be provided in time when needed.

[0020] The second aspect of the present application provides an electronic device, comprising a main body, a heat dissipation assembly and a control unit installed in the main body, wherein the heat dissipation assembly is the heat dissipation assembly described above.

[0021] Through the above technical solution, since the electronic device comprises the heat dissipation assembly described above, at least all the beneficial effects of the heat dissipation assembly are possessed, which will not be repeated here.

[0022] The third aspect of the present application provides a heat dissipation control method, comprising:

[0023] In response to the electronic device satisfying a heat dissipation control condition, the decorative plate provided on the main body of the electronic device is controlled to be opened to avoid the heat dissipation hole group provided on the back of the main body and in communication with the internal space of the main body; wherein the heat dissipation control condition comprises at least one of the following: the performance mode of the electronic device, the temperature information of the electronic device indicating that the shell temperature value or the central processing unit temperature value reaches a preset critical value.

[0024] In one embodiment, after the decorative plate provided on the main body of the electronic device is controlled to be opened, the method further comprises: controlling the fan provided in the main body to start.

[0025] In one embodiment, after the decorative plate provided on the main body of the electronic device is controlled to be opened, the method further comprises:

[0026] obtaining temperature information of the electronic device;

[0027] If the temperature information indicates that the shell temperature value or the central processing unit temperature value is lower than the preset critical value, the decorative plate provided on the main body of the electronic device is controlled to be closed to block the heat dissipation hole group.

[0028] In one embodiment, in the case that the heat dissipation control condition comprises the performance mode of the electronic device, the decorative plate provided on the main body of the electronic device is controlled to be opened, comprising:

[0029] obtaining running information of the electronic device in the performance mode, wherein the running information is at least used to represent the number of running software or opened files in the electronic device;

[0030] According to the running information, the opening angle of the decorative plate is controlled.

[0031] In one embodiment, in the case that the heat dissipation control condition comprises the temperature information of the electronic device, the decorative plate provided on the main body of the electronic device is controlled to be opened, comprising:

[0032] According to the temperature information of the electronic device, the opening angle of the decorative plate is controlled. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is a structural schematic diagram of an electronic device provided by an embodiment of the present application;

[0034] Figure 2 is a rear view schematic diagram of an electronic device provided by an embodiment of the present application;

[0035] Figure 3 is a structural schematic diagram of an electronic device provided by an embodiment of the present application, in which a decorative plate is hidden;

[0036] Figure 4 is a structural schematic diagram of an electronic device provided by an embodiment of the present application, in which the inside of the main body is displayed;

[0037] Figure 5 is a right view schematic diagram of an electronic device provided by an embodiment of the present application;

[0038] Figure 6 is an enlarged view of area A in FIG. 8; Figure 5

[0039] Figure 7 is an enlarged view of area B in FIG. 8; Figure 5

[0040] Figure 8 is a structural schematic diagram of a telescopic motor provided by an embodiment of the present application;

[0041] Figure 9 is a structural schematic diagram of an embodiment of the telescopic motor provided by the present application, in which the telescopic rod has a first magnetic part;

[0042] Figure 10 is a structural schematic diagram of a decorative plate provided by an embodiment of the present application;

[0043] Figure 11 is a structural schematic diagram of an embodiment of the decorative plate provided by the present application, in which the decorative plate has a second magnetic part;

[0044] Figure 12 is a flowchart of a heat dissipation control method provided by an embodiment of the present application;

[0045] Figure 13 is a flowchart of an optional heat dissipation control method provided by an embodiment of the present application;

[0046] Figure 14 is a flowchart of an optional heat dissipation control method provided by an embodiment of the present application.

[0047] In the drawings, the meanings of the respective reference numerals are as follows:​​

[0048] 10, main body; 11, heat dissipation hole group; 12, auxiliary heat dissipation hole;

[0049] 20, control part;

[0050] 30, decorative plate; 31, connecting hole; 32, second magnetic part; 33, anti-skid structure;

[0051] 40, driving part; 41, telescopic motor; 411, telescopic rod; 42, first magnetic part;

[0052] 50, heat dissipation device; DETAILED DESCRIPTION

[0053] In order to make the objects, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0054] It should be understood that, in the description of the present application, it is to be understood that the terms "length", "width", "thickness", "top", "bottom", "inner", "outer", "upper", "lower", "left", "right" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0055] The terms "first", "second", "third", "fourth" and the like are merely used to distinguish descriptions, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. For example, the first pushing part and the second pushing part are merely used to distinguish different pushing parts, and do not limit the order, the first pushing part can also be named as the second pushing part, and the second pushing part can also be named as the first pushing part, without departing from the scope of various described embodiments. And the terms "first", "second", "third", "fourth" and the like do not limit the features indicated to be different.

[0056] In the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected" and the like should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrated; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0057] In the embodiments of the present application, "and / or" only describes the association relationship of the associated objects, and means that there can be three relationships; for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are an "or" relationship.

[0058] It should be noted that in the embodiments of the present application, the words "in an embodiment", "exemplarily", "for example" and the like are used to represent as an example, illustration or description. Any embodiment or design scheme described as "in an embodiment", "exemplarily", "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words "in an embodiment", "exemplarily", "for example" and the like are intended to present the relevant concept in a specific way.

[0059] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments.

[0060] In the heat dissipation design of the related art, it is common to simply open fixed heat dissipation holes on the device shell. Such fixed heat dissipation holes are always exposed, not only affecting the neatness of the appearance of the device, but also easily allowing dust, debris and the like to enter the interior of the device, causing damage to the internal components. For example, in a portable notebook computer, the long-term exposed heat dissipation holes can cause dust to accumulate inside, affecting the heat dissipation effect, and even damaging the hardware.

[0061] On the other hand, the above fanless or fan-side air inlet scheme has low overall heat dissipation efficiency. The above two design schemes can only increase the air inlet channel by thickening the overall machine to improve performance, or sacrifice experience by limiting the frequency of the CPU. When the device is in a low load operation, too many open heat dissipation holes can cause unnecessary heat dissipation, affecting the energy utilization efficiency of the device; and when the device is in a high load working state, the fixed heat dissipation holes can not meet the demand for rapid heat dissipation, thereby causing the device to overheat, affecting the performance and stability. For example, in some professional graphics processing work, the working load of the device can increase sharply in a short time, and if the heat dissipation cannot be performed in time, the program can crash or data loss can occur. In addition, some electronic devices pursue aesthetics and adopt a closed shell design, completely ignoring the heat dissipation demand, resulting in frequent overheating protection and even shutdown of the device during use.

[0062] The embodiment of the present application provides a heat dissipation assembly, which is used for an electronic device, and the electronic device comprises a main body and a control part installed in the main body. It should be noted that the electronic device refers to an internet hardware product with information collection, processing and connection capabilities, and can realize intelligent sensing, interaction, big data service and other functions, and is an important carrier of internet and artificial intelligence technologies, such as smart phones, tablet computers, folding PCs, notebook computers and the like.

[0063] Please refer to Figures 1 to 4 As shown in the figure, the heat dissipation assembly comprises a heat dissipation hole group 11, a decorative plate 30 and a driving part 40, the heat dissipation hole group 11 is arranged on the back of the main body 10 and communicates with the internal space of the main body 10; the decorative plate 30 is reversibly arranged on the main body 10 to shield or avoid the heat dissipation hole group 11; the driving part 40 is arranged between the main body 10 and the decorative plate 30, the driving part 40 is signal connected with the control part 20, and the driving part 40 can drive the decorative plate 30 to reverse according to the control signal sent by the control part 20 received. It should be noted that the main body 10 is the main structure of the electronic device, which contains various hardware and internal space. The part responsible for controlling and coordinating the operation of other components in the electronic device usually includes chips and related control circuits. The driving part 40 is used to provide power to drive the decorative plate 30 to perform the reversing action.

[0064] Referring to Figure 3 As shown in the figure, the heat dissipation assembly in the embodiment of the present application is provided with the heat dissipation hole group 11 communicating with the internal space on the back of the main body 10, which provides a direct and efficient dissipation channel for the heat inside the electronic device. The heat can be quickly discharged from the inside of the device to the outside through the heat dissipation hole group 11, which significantly reduces the temperature inside the device. This effectively avoids the problems of performance degradation, lag and even system crash caused by overheating. For example, when a notebook computer runs large games or complex graphics processing software for a long time, efficient heat dissipation can ensure the stable work of key components such as CPU and GPU, and ensure the smooth progress of games or work. However, the heat dissipation hole group 11 also provides a path for dust and other impurities to enter the internal space of the main body 10, and the invasion of dust may cause circuit short circuit, component wear and tear and other problems, affecting the normal operation and service life of the device.

[0065] To this end, the heat dissipation assembly in the embodiments of the present application adopts a reversible decorative plate 30, which is driven by a driving part 40 to realize automatic turning of the decorative plate 30. In the closed state of shielding the heat dissipation hole group 11, the decorative plate 30 can effectively prevent external dust from entering the inside of the main body 10 through the heat dissipation hole group 11, effectively protecting the precision components inside the electronic device. For example, when using the electronic device in a place with a lot of dust, the decorative plate 30 can prevent dust from entering and keep the inside of the device clean, reducing the failure caused by dust accumulation. When the electronic device is running normally or does not need a lot of heat dissipation, the decorative plate 30 can completely shield the heat dissipation hole group 11, making the appearance of the device neat and uniform, greatly enhancing the overall aesthetic appearance. When the device is in a high-load working state and needs a lot of heat dissipation, the control part 20 can provide the driving part 40 with control of the timely turning of the decorative plate 30 to avoid the heat dissipation hole group 11, ensuring the smoothness of the heat dissipation channel. It meets the user's aesthetic pursuit of the appearance of the device, while not affecting the function of the key heat dissipation moment. For example, for a super-thin notebook computer with a delicate appearance, when on standby or lightly used, the decorative plate 30 is closed, showing a simple and elegant appearance; while performing high-intensity computation, the decorative plate 30 is opened to ensure the heat dissipation effect and not affect the performance. The signal connection between the driving part 40 and the control part 20 realizes intelligent and precise control of the heat dissipation assembly.

[0066] When the electronic device meets the heat dissipation control condition, such as the running performance mode, the shell temperature value or the central processor temperature value reaching the preset critical value, the control part 20 will send a control signal to the driving part 40, thereby driving the decorative plate 30 to make corresponding actions. Especially when the heat dissipation control condition includes temperature information of the electronic device, the opening angle of the decorative plate 30 can be controlled according to the specific temperature condition. When the temperature is low, the opening angle of the decorative plate 30 is small; as the temperature rises, the opening angle gradually increases, realizing fine adjustment of the degree of heat dissipation. For example, when the device just starts to heat up and the temperature rises slightly, the decorative plate 30 opens a small angle, moderately dissipates heat, and to some extent prevents dust from entering; when the temperature rises sharply and approaches the dangerous critical value, the decorative plate 30 is completely opened to avoid the heat dissipation hole group 11 for heat dissipation to the maximum extent. In one embodiment, the TDP (Thermal Design Power) is increased by about 50%, from 15W to 22W.

[0067] The heat dissipation hole group 11 is a group of holes distributed on the back of the main body 10. These holes can serve as air inlets to introduce external cooler air into the device interior, promoting air circulation to carry away heat; or as air outlets to expel the heated air inside the device to the external environment. In some cases, they can also serve as both air inlets and outlets, achieving more complex and efficient heat dissipation airflow circulation. For example, in a notebook computer, the bottom heat dissipation holes can mainly serve as air inlets, while the side and back heat dissipation holes can mainly serve as air outlets.

[0068] The driving part 40 in the embodiment of the application is installed on the main body 10, and the output end of the driving part 40 is drivingly connected with the decorative plate 30. Installing the driving part 40 on the main body 10 provides a stable support basis for the driving part 40, reduces the shaking or displacement that may occur during driving, and enhances the structural stability of the entire heat dissipation assembly. For example, when the electronic device is subjected to slight impact or vibration, the driving part 40 can remain in a fixed position, ensuring its normal driving of the decorative plate 30 to flip over. The driving connection between the output end of the driving part 40 and the decorative plate 30 enables direct and accurate transmission of power.

[0069] In other embodiments, the output end of the driving part 40 is non-drivingly connected with the decorative plate 30, and an elastic reset member such as a torsion spring is arranged between the decorative plate 30 and the main body 10, ensuring that the decorative plate 30 can quickly and accurately automatically return to the initial position after the driving part 40 stops applying force. This automatic reset feature not only facilitates user use without manual operation to restore the position of the decorative plate 30, but also improves the continuity and convenience of device operation. The non-driving connection between the driving part 40 and the decorative plate 30 and the cooperation of the elastic reset member simplify the control logic of the driving part 40. The driving part 40 only needs to focus on providing the power required to open the decorative plate 30, without the need for complex control algorithms to achieve the reset operation. This reduces the complexity of the system, reduces the number and cost of control parts 20, and improves the reliability and stability of the entire system.

[0070] In the normal state, the decorative plate 30 is in the closed position, i.e., the position completely shielding the heat dissipation hole group 11, and the torsion spring is in the initial torsion state, storing a certain amount of elastic potential energy. When the electronic device needs to open the decorative plate 30 for heat dissipation or other operations, the output end of the driving part 40 starts to apply force. This force overcomes the torque of the torsion spring, causing the decorative plate 30 to gradually open and the torsion spring to further twist, storing more elastic potential energy. With the continuous action of the driving part 40, the decorative plate 30 reaches the required opening angle. At this time, the driving part 40 stops outputting power. During the entire process, the driving part 40 provides the initial power to open the decorative plate 30, while the torsion spring is responsible for the automatic reset of the decorative plate 30.

[0071] Referring toFigure 5 、 Figures 7 to 8 As shown in FIG. 6, the driving part 40 in the embodiment of the present application includes a telescopic motor 41, which includes a telescopic rod 411. The end of the telescopic rod 411 away from the main body 10 forms the output end of the driving part 40. When the electronic device starts running, the sensors inside the device will monitor the running state and temperature information of the device in real time. If the electronic device enters a high-load running state, such as running a large game or performing complex graphics processing, the control part 20 will receive the relevant signals. At this time, the control part 20 will determine whether the cooling mode needs to be started according to the preset program and conditions. If it is determined that cooling is needed, the control part 20 will send an instruction to the telescopic motor 41. After receiving the instruction, the telescopic motor 41 starts working. The motor drives the telescopic rod 411 to extend, and the end of the telescopic rod 411 away from the main body 10 serves as the output end of the driving part 40, pushing the decorative plate 30 to perform a flipping action. As the telescopic rod 411 continues to extend, the decorative plate 30 gradually avoids the heat dissipation hole group 11, so that the heat dissipation hole group 11 is completely exposed to the external environment, thereby allowing the heat inside the electronic device to be quickly dissipated through the heat dissipation hole group 11. The structure of the telescopic rod 411 ensures stable output of driving force. During the flipping process of the decorative plate 30, continuous and uniform force can be provided to avoid stuttering or unstable situations and ensure reliable operation of the cooling assembly. In one embodiment, the side of the decorative plate 30 close to the telescopic rod 411 is provided with a connecting hole 31, as shown in FIG. 7, and the end of the telescopic rod 411 away from the main body 10 is inserted into the connecting hole 31 and is in interference fit with the connecting hole 31. Figure 10

[0072] The end of the telescopic rod 411 away from the main body 10 is rotatably connected to the decorative plate 30 in the embodiment of the present application. When the temperature inside the electronic device drops below the preset safety value or the device is no longer in a high-load running state, such as ending a large game or a complex graphics processing task, the sensors inside the device will transmit this change information to the control part 20. After receiving the relevant signals, the control part 20 determines that the cooling mode needs to be turned off, i.e., the decorative plate 30 blocks the heat dissipation hole group 11, according to the preset program and conditions. Subsequently, the control part 20 sends an instruction to the telescopic motor 41 to indicate that the telescopic rod 411 is retracted. After receiving the retraction instruction, the telescopic motor 41 starts working and drives the telescopic rod 411 to gradually retract. As the telescopic rod 411 retracts, its end away from the main body 10 pulls the decorative plate 30. Due to the rotatable connection between the end of the telescopic rod 411 and the decorative plate 30, the decorative plate 30 starts to flip under the action of the pulling force and gradually returns to the initial position to block the heat dissipation hole group 11.

[0073] ​During the process of turning over and closing the decorative plate 30, the telescopic rod 411 continuously provides stable and uniform pulling force, ensuring that the decorative plate 30 can be smoothly and accurately closed in place, restoring the integrity of the appearance of the device, and reducing the possibility of foreign matter such as dust entering the interior of the device. The end of the telescopic rod 411 is rotatably connected with the decorative plate 30, so that the decorative plate 30 can be more flexible in adjusting the angle and position during the turning over process, adapting to different installation environments and heat dissipation requirements. The rotatable connection helps to eliminate the possible jamming and resistance during the turning over process, ensuring the smoothness of the turning over action, so that the heat dissipation hole group 11 can be quickly and accurately avoided or shielded.

[0074] In another embodiment of the present application, the end of the telescopic rod 411 away from the main body 10 is magnetically connected with the decorative plate 30. When the electronic device is started and begins to run, the internal sensor continuously monitors the running state and temperature of the device. If the device enters a high-load running state, the control part 20 receives the relevant signal and determines that the heat dissipation mode needs to be turned on, and sends an extension instruction to the telescopic motor 41. The telescopic motor 41 is started and drives the telescopic rod 411 to extend, driving the decorative plate 30 to turn over, avoiding the heat dissipation hole group 11, so that the heat inside the device can be dissipated.

[0075] When the temperature of the device drops below the preset value, or is no longer in a high-load running state, the control part 20 determines that the heat dissipation mode needs to be turned off, and sends a retraction instruction to the telescopic motor 41. The telescopic motor 41 drives the telescopic rod 411 to retract, and at this time, the telescopic rod 411 drives the decorative plate 30 to reverse turn over through the pulling force of the magnetic connection. As the telescopic rod 411 continues to retract, the decorative plate 30 gradually returns to the initial position and re-shields the heat dissipation hole group 11. Similarly, during the process of the telescopic motor 41 driving the telescopic rod 411 to retract and driving the decorative plate 30 to close, the fault tolerance space of the magnetic connection also plays a similar role, allowing a certain degree of positional inaccuracy, ensuring that the decorative plate 30 can accurately return to the position of shielding the heat dissipation hole group 11.

[0076] For example, after the electronic device is used for a long time, the main body 10 may swell slightly due to heat generation, but the fault tolerance space of the magnetic connection can still allow the heat dissipation assembly to work normally and not be affected by the change in the position of the components caused by the swelling.

[0077] Throughout the process, the magnetic connection ensures stable and effective power transmission between the telescopic rod 411 and the decorative plate 30, enabling the decorative plate 30 to flip timely and accurately according to the heat dissipation needs of the device. The fault tolerance space of the magnetic connection greatly reduces the precision requirements of the telescopic rod 411 and the decorative plate 30 during installation. This makes the production and assembly process more convenient, improves production efficiency, and reduces production costs. During the use of the electronic device, slight deformation of the main body 10 or components may occur due to factors such as temperature changes and mechanical stress. The fault tolerance characteristics of the magnetic connection can adapt to such deformation, ensuring the normal flipping of the decorative plate 30 and not being affected by the slight deformation of the device. At the same time, in the vibration environment generated during the operation of the device, the magnetic connection can also maintain effective connection and will not be affected by vibration. During the movement of the telescopic rod 411 pushing the decorative plate 30, even if there is a certain positional deviation or angular error, the fault tolerance space of the magnetic connection can allow the existence of such deviation, avoiding the possibility of motion interference and jamming due to too precise fitting, making the flipping action smoother.

[0078] Referring to Figure 9 and Figure 11 , the end of the telescopic rod 411 away from the main body 10 is provided with a first magnetic part 42, and the side of the decorative plate 30 close to the main body 10 is provided with a second magnetic part 32. The position of the first magnetic part 42 corresponds to the position of the second magnetic part 32. When the electronic device starts to operate, the internal monitoring system monitors the state and temperature of the device in real time. Once the device enters a high-load operating state, the control part 20 determines that the heat dissipation mode needs to be turned on and sends instructions to the telescopic motor 41.

[0079] When the temperature of the device decreases, the control part 20 decides to turn off the heat dissipation mode, and the telescopic motor 41 drives the telescopic rod 411 to retract. Throughout the process, the first magnetic part 42 and the second magnetic part 32 corresponding in position attract each other, ensuring that the decorative plate 30 flips as required, thereby achieving effective heat dissipation control.

[0080] When there is no need for heat dissipation, but the user expects to open the decorative plate 30 and make it play the role of a support plate, the user applies an external force of a certain size and direction to the decorative plate 30. This external force acts on the decorative plate 30, gradually overcoming the magnetic attraction between the first magnetic part 42 and the second magnetic part 32. With the continuous action of the external force, the magnetic force can no longer tightly attract the decorative plate 30 and the main body 10 together, and the decorative plate 30 separates from the main body 10.

[0081] During the separation of the decorative plate 30 and the main body 10, the user can accurately control the size and direction of the applied external force according to actual needs and specific use scenarios to ensure that the decorative plate 30 can smoothly and smoothly separate from the main body 10 and can be opened to the desired angle and position in the expected manner.

[0082] Once the decorative plate 30 is successfully separated from the main body 10 and opened to a suitable angle, the user can use it as a support plate. For example, when using electronic devices outdoors, the user can manually open the decorative plate 30 and adjust the angle to allow the electronic device to obtain a more comfortable viewing angle that meets their own visual needs and operating habits, thereby obtaining a more comfortable user experience.

[0083] When the automatic heat dissipation function of the device needs to be restored later, the user only needs to move the opened decorative plate 30 towards the main body 10. As the decorative plate 30 gradually approaches the main body 10, the magnetic force acting range between the first magnetic part 42 and the second magnetic part 32 gradually takes effect. The magnetic force will automatically attract the decorative plate 30, making it accurately return to the initial position connected to the main body 10, and restore to the normal heat dissipation state, providing protection for the stable operation of the device.

[0084] The decorative plate 30 in the embodiment of the present application is provided with a damping part between the main body 10. The setting of the damping part can make the decorative plate 30 move more smoothly during the turning or moving process, avoid rapid and abrupt movement, and reduce the impact and vibration caused by inertia. During the movement of the decorative plate 30, the damping part can absorb and buffer energy, reduce the collision and friction noise between parts, and provide a quieter use environment. The damping part can be a friction plate, friction block, etc., which is set at the rotating shaft between the decorative plate 30 and the main body 10 to increase the friction.

[0085] In another embodiment of the present application, a fixed rotating motor is arranged in the main body 10 of the electronic device. This position is both convenient for the installation and maintenance of the motor, and can effectively transmit power to the decorative plate 30. The rotating motor is firmly installed in the selected position by screws or other fixing devices. The input end of the rotating motor is signal-connected with the control part 20 to receive the control signal. A speed change structure is installed on the output shaft of the rotating motor. The speed change structure can be a transmission system such as a gear set. For example, a multi-stage gear combination is adopted to realize the adjustment of the rotating speed and torque through the cooperation of gears of different sizes. The rotating shaft of the decorative plate 30 is connected with the output end of the speed change structure through a shaft coupling or other suitable connecting components. When the rotating motor receives the start signal from the control part 20, the motor starts to rotate. The rotating motion of the motor is adjusted in speed and increased in torque by the speed change structure, and is then converted into a speed and force suitable for the overturning of the decorative plate 30. When the electronic device is started, the sensors inside the device will continuously monitor the operating state and temperature and other parameters of the device. The control part 20 will receive these monitoring data in real time. During the operation of the electronic device, if the control part 20 judges that heat dissipation is needed according to the preset conditions, such as the internal temperature of the device rising to a certain threshold, or the device entering a high-performance mode, the control part 20 will send a start signal to the rotating motor. After receiving the start signal, the rotating motor starts to operate. The output shaft of the motor rotates, and the power is transmitted to the speed change structure connected therewith. The gear set in the speed change structure adjusts the rotating speed and torque according to its transmission ratio. After the speed change, the power has a more suitable speed and torque to drive the decorative plate 30 to overturn. The adjusted power is transmitted to the rotating shaft of the decorative plate 30 through the connecting components such as the shaft coupling. The rotating shaft is driven to rotate, thereby driving the decorative plate 30 to overturn. With the overturning of the decorative plate 30, the heat dissipation hole group 11 that was originally blocked is gradually exposed, so that the heat inside the electronic device can be exchanged with the external environment through the heat dissipation hole group 11 to achieve heat dissipation. During the heat dissipation process, the sensors will continue to monitor the temperature and other parameters of the device. Once the temperature drops to a safe range, or the operating state of the device no longer requires a large amount of heat dissipation, the control part 20 will send a stop or reverse signal to the rotating motor. The rotating motor stops rotating or reverses according to the new signal, drives the decorative plate 30 to reverse through the speed change structure and the rotating shaft, re-blocks the heat dissipation hole group 11, maintains the integrity of the appearance of the device, and prevents dust and other foreign matters from entering. During the whole working process, the rotating motor, the speed change structure and the decorative plate 30 work cooperatively to intelligently and accurately control the overturning of the decorative plate 30 according to the actual heat dissipation demand of the electronic device, thereby effectively guaranteeing the normal operation and performance of the device.

[0086] The upper side of the decorative plate 30 in the embodiment of the present application is pivotally connected to the back of the main body 10, and the lower side of the decorative plate 30 is provided with an anti-skid structure 33. The upper side of the decorative plate 30 is pivotally connected to the back of the main body 10, so that the decorative plate 30 can play a certain supporting role when it is opened, thereby increasing the stability and convenience of the device in use. When the decorative plate 30 is opened as a support, no additional support components are needed, the internal space of the device is saved, and the overall structure is more compact. When the decorative plate 30 is opened to a certain angle, it itself forms a support structure. At this time, the decorative plate 30 can bear a certain weight and provide stable support for the device. For example, when a user watches a video, the user can open the decorative plate 30 to a suitable angle to place the device at an angle, so that a comfortable viewing experience can be obtained without the aid of other supports. When it is necessary to close the decorative plate 30, the user applies a downward force to the decorative plate 30, and the decorative plate 30 is again flipped downward about the pivot point until it returns to the initial position. The upper side of the decorative plate 30 is pivotally connected to the back of the main body 10, and in combination with the anti-skid structure 33 on the lower side, the decorative plate 30 is more stable during opening and closing and is not easy to shake or move accidentally. The anti-skid structure 33 on the lower side can effectively prevent the decorative plate 30 from sliding downward or accidentally falling when it is in the opened state, thereby improving the safety in use. The anti-skid structure 33 can be anti-skid lines, that is, raised stripes, grid or wavy lines are designed on the lower surface of the decorative plate 30 to increase the friction. The anti-skid structure 33 can also be an anti-skid pad made of rubber or silicone and the like and installed at the lower part of the decorative plate 30, which has a large friction.

[0087] Referring to Figure 5 and Figure 6As shown, the heat dissipation assembly in the embodiment of the present application further comprises auxiliary heat dissipation holes 12, which are arranged on the side of the main body 10 and communicate with the internal space of the main body 10. The auxiliary heat dissipation holes 12 are located on the side of the main body 10 and communicate with the internal space, providing an additional path for heat dissipation. This allows more hot air to be quickly discharged from the device, and cold air can also enter from more directions, thereby significantly increasing the speed and efficiency of heat dissipation. For example, in the case of high-load operation, such as large data processing or long-time gaming, this enhanced heat dissipation effect can effectively prevent the device from overheating and causing performance degradation or automatic shutdown. The heat distribution inside the main body 10 is usually not uniform. When only the back heat dissipation hole group 11 is working, it may cause poor air flow in some areas. The presence of the side auxiliary heat dissipation holes 12, in cooperation with the back heat dissipation hole group 11, forms a more complete and smooth air circulation system. Hot air can be quickly discharged from all directions, and cold air can also enter more evenly, thereby avoiding the occurrence of "hot spots" inside the device and ensuring the overall temperature balance. In actual use, the placement position of the device and the surrounding environment may be different. Sometimes the back of the device may be close to an object, blocking the normal ventilation of the back heat dissipation hole group 11. At this time, the side auxiliary heat dissipation holes 12 become the key heat dissipation channel. For example, when using a notebook computer on a soft bed, the back heat dissipation holes may be blocked, but the side auxiliary heat dissipation holes 12 can ensure that the heat dissipation function is not greatly affected.

[0088] The heat dissipation assembly in the embodiment of the present application further comprises a heat dissipation device 50 arranged in the internal space of the main body 10. Arranging the heat dissipation device 50 in the internal space of the main body 10 can directly dissipate heat from the heat source, greatly improving the heat dissipation efficiency and ensuring that the device can maintain a low temperature state and stable performance during high-intensity operation. The heat dissipation device 50 is distributed in the internal space and can more evenly dissipate heat to the entire internal environment, avoiding local overheating and thereby protecting various components. When the electronic device is started and begins to operate, the internal electronic components such as the processor and graphics card will generate a large amount of heat. The heat dissipation device 50 located in the internal space of the main body 10 immediately begins to work. If it is a fan-type heat dissipation device 50, the fan will rotate to generate airflow, carrying heat away from the surface of the heat-generating components and guiding the hot air to be discharged outside the main body 10 through the heat dissipation holes. If it is a liquid cooling heat dissipation device 50, the cooling liquid will circulate in the pipeline, absorbing heat and carrying it to the radiator for heat dissipation. Under the continuous action of the heat dissipation device 50, the temperature inside the device is controlled within a suitable range, ensuring the stable operation and good performance of the electronic device.

[0089] The heat dissipation device 50 in the embodiments of the present application includes a fan, which is in signal connection with the control unit 20. The fan is in signal connection with the control unit 20, so that the operation of the fan can be intelligently adjusted according to the actual heat dissipation demand of the equipment, avoiding energy waste and excessive noise caused by continuous high-speed operation, and at the same time, strong heat dissipation air can be provided in time when needed. The control unit 20 can accurately control the speed of the fan according to the received temperature signals and the like, so as to realize more fine heat dissipation adjustment and meet the heat dissipation requirements under different working conditions. When the equipment is in low load operation or at a low temperature, the control unit 20 can reduce the speed of the fan or even stop the fan, so as to achieve the effects of energy saving and noise reduction. Reasonable control of the operation of the fan avoids unnecessary overuse, reduces the wear of the fan, and prolongs the service life of the fan. After the electronic equipment is started, the control unit 20 starts to monitor various parameters in the equipment in real time, such as temperature, operating load and the like. If the temperature gradually increases or the load increases during the operation of the equipment, the control unit 20 receives the related signals. According to the preset algorithm and strategy, the control unit 20 judges that the heat dissipation needs to be enhanced, and sends a signal to the fan. After receiving the instruction of the control unit 20, the fan starts to speed up, enhances air flow, and improves the heat dissipation effect. Conversely, if the temperature of the equipment decreases to a suitable range or the load decreases, the control unit 20 will reduce the speed of the fan or stop the operation of the fan accordingly.

[0090] For example, when the electronic equipment is performing simple document processing, the fan can operate at a low speed or be temporarily stopped; when performing high-load operation such as large-scale games, the control unit 20 will instruct the fan to operate at full speed, and the decorative plate 30 will be opened to ensure good heat dissipation.

[0091] The second aspect of the present application provides an electronic equipment, which comprises a main body, a heat dissipation assembly and a control unit installed in the main body, and the heat dissipation assembly is the heat dissipation assembly described above. The electronic equipment refers to an Internet hardware product with information collection, processing and connection capabilities, which can realize intelligent sensing, interaction, big data services and the like, and is an important carrier of Internet and artificial intelligence technologies, such as smart phones, tablet computers, folding PCs, notebook computers and the like. The main body is the main structure and shell part of the electronic equipment, which contains and protects various internal components of the equipment, such as circuit boards, batteries, display screens and the like.

[0092] For example, for a notebook computer, the main body includes a screen shell, in which key components such as a mainboard, a processor, a hard disk and a memory are installed. For a smart phone, the main body is usually composed of front and rear shells, which contain components such as a screen, a battery, a camera module and a mainboard.

[0093] The control unit is the core control unit of the electronic device, responsible for coordinating and managing the functions and operations of the device. It usually includes one or more microprocessors, chipsets, memories and related control circuits. The control unit receives signals from various sensors and input devices, processes them according to pre-set programs and algorithms, and sends instructions to other components to achieve normal operation and specific functions of the device.

[0094] For example: in a notebook computer, the control unit is usually the central processing unit (CPU) and related chipsets on the motherboard, which control the startup, running programs, power management, input and output operations of the device. In a smartphone, the control unit is mainly the processor of the phone, responsible for processing various tasks such as running the operating system, application programs, managing communication functions, etc.

[0095] The third aspect of the present application provides a heat dissipation control method, which comprises:

[0096] In response to the electronic device meeting the heat dissipation control condition, the decorative plate provided on the main body of the electronic device is opened to avoid the heat dissipation hole group provided on the back of the main body and communicating with the internal space of the main body; wherein the heat dissipation control condition includes at least one of the following: the performance mode of the electronic device, the temperature information of the electronic device indicating that the shell temperature value or the central processing unit temperature value reaches the preset critical value.

[0097] The heat dissipation control method in the embodiments of the present application is suitable for various electronic devices with high requirements for heat dissipation, and can play a significant role in the following scenarios: high-performance computing scenarios: when a game notebook computer runs a large 3D game, performs graphics rendering or complex scientific calculations, the device will generate a large amount of heat, at which time the heat dissipation control method can open the decorative plate for heat dissipation according to the device performance mode and temperature information. Long working time scenarios: devices such as servers and workstations need to run continuously for a long time, and the temperature may gradually rise during the long working process, and the heat dissipation is started when the temperature reaches the preset critical value. Multi-task processing scenarios: when a smartphone or tablet computer runs multiple large application programs, performs video calls and downloads files, etc. Multi-task operation, the method can effectively control the heat dissipation.

[0098] For example:

[0099] Game scenario: a game player is using a high-performance game notebook computer to play a large 3D game. After the game starts, the computer automatically switches to performance mode, obtains this running information, and controls the decorative plate to open to a certain angle to provide space for the heat dissipation hole group to dissipate heat.

[0100] Alternatively, after the game starts, the computer automatically switches to performance mode, obtains this running information, and as the game progresses, the device temperature continues to rise. When the central processor temperature value reaches the preset critical value, the decorative plate opens, and the heat dissipation intensity is increased to ensure smooth operation of the game. The preset critical value can be a preset value of the shell temperature or the CPU junction temperature, for example, the shell temperature preset critical value can be between 50℃ and 55℃. Because a large amount of heat is generated during gaming, it is necessary to prevent the shell temperature from being too high to cause user discomfort while ensuring performance. The junction temperature preset critical value can be between 90℃ and 100℃. In order to maximize the performance of the CPU, it is allowed to operate at a higher temperature, but it still needs to be closely monitored to prevent overheating damage.

[0101] Work scenario: A server in an office is processing a large amount of data continuously. Due to long-time operation, the device temperature gradually rises. When the temperature information indicates that the shell temperature value reaches the preset critical value, the heat dissipation control method is started, the decorative plate is opened, the fan is started, and the heat dissipation effect is enhanced to ensure the stable operation of the server and avoid data processing interruption.

[0102] Mobile device scenario: A user uses a smartphone outdoors while opening navigation, online video playback, and social media applications. Due to multi-task operation, the phone temperature gradually rises. When the temperature information indicates that the preset critical value is reached, the heat dissipation control method works, the decorative plate is opened to help the phone dissipate heat and prevent the occurrence of lag or battery overheating.

[0103] Referring to FIG. 1, Figure 12 Figure 12 FIG. 1 is a flow diagram of a heat dissipation control method provided by an embodiment of the present application. In an optional example, the heat dissipation control method includes:

[0104] S101, in response to the electronic device satisfying the heat dissipation control condition, controlling the decorative plate provided on the main body of the electronic device to open to avoid the heat dissipation hole group provided on the back of the main body and communicating with the internal space of the main body.

[0105] The heat dissipation control condition includes at least one of the following: the electronic device runs in performance mode, the temperature information of the electronic device indicates that the shell temperature value or the central processor temperature value reaches the preset critical value.

[0106] After controlling the decorative plate provided on the main body of the electronic device to open, the method further includes:

[0107] S102, controlling the fan provided in the main body to start.

[0108] ​When the electronic device performs high-intensity graphic processing, video editing, large software compilation and other tasks, a large amount of heat will be generated, and rapid and effective heat dissipation is needed at this time. For example, in graphic design work, a designer uses a computer to perform a complex 3D graphic design project. When the system detects that the decorative plate is opened, the internal temperature of the device continues to rise due to the current work task, and the fan is started. The fan quickly runs, quickly discharges the high heat generated by the graphics card and CPU, and ensures that the graphic rendering process is not interrupted or lagged due to overheating.

[0109] After the decorative plate provided on the main body of the electronic device is opened, the method further includes: obtaining temperature information of the electronic device; and if the temperature information indicates that the shell temperature value or the central processor temperature value is lower than a preset threshold value, controlling the decorative plate provided on the main body of the electronic device to be closed to shield the heat dissipation hole group. After the decorative plate on the main body of the electronic device is opened, the system will continue to obtain the temperature information of the electronic device. The temperature sensor will monitor the shell temperature value and the central processor temperature value respectively, and transmit these data to the control part. The control part compares the received temperature value with the preset threshold value. If the shell temperature value or the central processor temperature value is lower than the preset threshold value, the control part will send a command to drive the related device to close the decorative plate, thereby shielding the heat dissipation hole group. For example, after the electronic device completes a high-load task, the temperature gradually decreases, and when the temperature decreases below the preset threshold value, the decorative plate is automatically closed to restore the integrity of the appearance of the device, while reducing dust entering and reducing the energy consumption and noise of the device during operation.

[0110] In another embodiment, please refer to Figure 13 , Figure 13 An optional flowchart of a heat dissipation control method provided by the embodiment of the present application is shown. In an optional example, the heat dissipation control method includes:

[0111] S101, in response to the electronic device satisfying a heat dissipation control condition, controlling a decorative plate provided on the main body of the electronic device to be opened to avoid a heat dissipation hole group provided on the back of the main body and in communication with the internal space of the main body.

[0112] The heat dissipation control condition includes at least one of the following: the performance mode of the electronic device, and the temperature information of the electronic device indicating that the shell temperature value or the central processor temperature value reaches a preset threshold value.

[0113] After the decorative plate provided on the main body of the electronic device is opened in step S101, the method further includes:

[0114] S201, obtaining whether the performance mode of the electronic device is exited.

[0115] S202, if the performance mode is exited, controlling the decorative plate provided on the main body of the electronic device to be closed to shield the heat dissipation hole group.

[0116] After the decorative plate on the main body of the electronic device is controlled to open, the running state of the electronic device is continuously monitored. Information whether the device exits the performance mode is obtained through a relevant detection mechanism. Once it is determined that the device exits the performance mode, the control unit receives a corresponding signal. The control unit then issues an instruction to drive a relevant mechanical or electronic device to make the decorative plate start a closing action. Until the decorative plate completely covers the heat dissipation hole group, the initial state of the device is restored. For example, when the user starts the performance mode when playing a game on the gamebook, the performance mode is exited after the game is finished, and the decorative plate is automatically closed, which prevents dust from entering and keeps the appearance of the device clean, and adjusts the heat dissipation requirement to adapt to the low heat state of the device.

[0117] Please refer to Figure 14 , the flowchart of an optional heat dissipation control method provided by the embodiment of the present application is shown. Figure 14 In an example, when the heat dissipation control condition includes that the electronic device runs in the performance mode, the decorative plate provided on the main body of the electronic device is controlled to open, which includes the following steps.

[0118] S301, running information of the electronic device in the performance mode is obtained, wherein the running information is used to at least represent the number of running software or opened files in the electronic device.

[0119] S302, the opening angle of the decorative plate is controlled according to the running information.

[0120] In the above optional implementation, by obtaining the running information in the performance mode, the opening angle of the decorative plate can be accurately controlled according to the actual work load of the device, the fine adjustment of the heat dissipation effect is realized, and the insufficient or excessive heat dissipation is avoided. According to the number of running software or opened files, the angle of the decorative plate can be controlled, the heat dissipation resources can be reasonably distributed, the energy utilization efficiency can be improved, and the endurance of the device can be prolonged. When the heat dissipation control condition determines that the electronic device is in the running performance mode, the system starts to obtain the related running information. By monitoring the software and process, the number of running software and opened files is counted. The number information is transmitted to the control unit for analysis and processing. The control unit converts the running information into specific control instructions for the opening angle of the decorative plate according to the preset algorithm and strategy.

[0121] For example, if the running information indicates that the device runs multiple large software and a large number of files at the same time, the control unit instructs the decorative plate to open a larger angle to provide stronger heat dissipation; and if the number of running software and files is small, the decorative plate opens a smaller angle to ensure heat dissipation while saving energy and reducing noise.

[0122] Game scene: when the player runs a large 3D game on the electronic device, the game will occupy a large number of system resources, and at the same time, multiple related auxiliary software may be started. At this time, the system obtains these running information, and according to the number of software and files, the opening angle of the decorative plate is increased accordingly, so as to ensure that the device can be efficiently cooled during high-intensity game process, maintain stable performance, and avoid the situation of lag or frame drop.

[0123] Multimedia creation scene: when editing videos, making animations, etc., multiple large software such as video editing software, special effect software, material library, etc. are usually opened at the same time, and a large number of files are processed. According to these running information, the system accurately adjusts the opening angle of the decorative plate to provide sufficient and appropriate cooling for the device, and prevents software crashes or data loss caused by overheating.

[0124] Multi-task office scene: when dealing with complex office tasks, multiple office software such as Word, Excel, PowerPoint, etc. may be run at the same time, and a large number of documents and data files may be opened. According to these running information, the system reasonably controls the opening angle of the decorative plate, which can effectively cool and avoid unnecessary energy consumption and noise.

[0125] In another embodiment, when the cooling control condition includes temperature information of the electronic device, the opening of the decorative plate provided on the main body of the electronic device is controlled, including:

[0126] According to the temperature information of the electronic device, the opening angle of the decorative plate is controlled.

[0127] In the above optional implementation, the opening angle of the decorative plate is controlled according to the real-time temperature information of the electronic device, which can realize accurate adjustment of the cooling effect and ensure that the device temperature is always maintained within a safe and reasonable range. According to the temperature, the opening angle is accurately controlled to avoid unnecessary excessive cooling, thereby saving energy and improving the energy utilization efficiency of the device. Effectively control the temperature of the device to reduce the damage of high temperature to electronic components, reduce the aging speed of the device, and prolong its service life. When the cooling control condition is based on the temperature information of the electronic device, the temperature sensor will monitor the temperature of the device in real time. The obtained temperature data will be transmitted to the control unit. The control unit calculates the appropriate angle at which the decorative plate should be opened according to the preset temperature and opening angle correspondence. Then, the control unit issues an instruction to drive the related mechanical or electronic device to adjust the opening angle of the decorative plate. For example, if the temperature is low, the decorative plate may only open a small angle; when the temperature is high, the decorative plate will open a larger angle to enhance the cooling effect.

[0128] Long time high load computing scenario: when performing large-scale data processing, scientific computing and other tasks, the temperature of the device will gradually rise. The system gradually increases the opening angle of the decorative plate according to the rising temperature, ensures the heat dissipation effect, and prevents the device from malfunctioning due to overheating.

[0129] High temperature environment use scenario: using electronic devices in hot summer or high temperature environment without air conditioning, the device is easy to heat up. At this time, the opening angle of the decorative plate is adjusted flexibly according to the temperature information, which can effectively cope with the heat dissipation challenge brought by high temperature outside.

[0130] Multimedia playing scenario: when watching high-definition video or playing audio for a long time, the device will also generate some heat. The opening angle of the decorative plate is controlled by the temperature information, which can ensure heat dissipation while not producing too much noise to affect user experience.

[0131] The above examples are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should be included in the protection scope of the present application.

Claims

1. A heat dissipating assembly for an electronic device, the electronic device including a main body and a control section mounted within the main body, characterized by, The heat dissipation assembly comprises: A heat dissipation hole group is arranged on the back of the main body and communicates with the internal space of the main body; A decorative plate is reversibly arranged on the main body to shield or avoid the heat dissipation hole group; A driving part is arranged between the main body and the decorative plate, the driving part is signal-connected with the control part, and the driving part can drive the decorative plate to reverse according to the control signal received from the control part.

2. The heat dissipating assembly of claim 1, wherein, The driving part is mounted on the main body, and the output end of the driving part is drivingly connected with the decorative plate.

3. The heat dissipating assembly of claim 2, wherein, The driving part comprises a telescopic motor, and the telescopic motor comprises a telescopic rod, and the end of the telescopic rod away from the main body forms the output end of the driving part.

4. The heat dissipating assembly of claim 3, wherein, The end of the telescopic rod away from the main body is rotatably connected with the decorative plate.

5. The heat dissipating assembly of claim 3, wherein, The end of the telescopic rod away from the main body is magnetically connected with the decorative plate.

6. The heat dissipating assembly of claim 5, wherein, The end of the telescopic rod away from the main body is provided with a first magnetic part, and the side of the decorative plate close to the main body is provided with a second magnetic part, and the positions of the first magnetic part and the second magnetic part correspond to each other.

7. The heat dissipating assembly of claim 1, wherein, The upper side of the decorative plate is pivotally connected with the back of the main body, and the lower side of the decorative plate is provided with an anti-skid structure.

8. The heat dissipating assembly of claim 1, wherein, A damping part is arranged between the decorative plate and the main body.

9. The heat dissipating assembly of claim 1, wherein, The heat dissipation assembly further comprises an auxiliary heat dissipation hole, and the auxiliary heat dissipation hole is arranged on the side of the main body and communicates with the internal space of the main body.

10. The heat dissipating assembly of any one of claims 1 to 9, wherein, The heat dissipation assembly further comprises a heat dissipation device arranged in the internal space of the main body.

11. The heat dissipating assembly of claim 10, wherein, The heat dissipation device comprises a fan, and the fan is signal-connected with the control part.

12. An electronic device, comprising: The heat dissipation assembly comprises a main body, a heat dissipation assembly and a control part mounted in the main body, and the heat dissipation assembly is the heat dissipation assembly according to any one of claims 1-11.

13. A heat dissipation control method characterized by comprising: It comprises: In response to the electronic device satisfying the heat dissipation control condition, the decorative plate arranged on the main body of the electronic device is opened to avoid the heat dissipation hole group arranged on the back of the main body and communicating with the internal space of the main body; wherein the heat dissipation control condition comprises at least one of the following: the electronic device performance mode, the temperature information of the electronic device indicating that the shell temperature value or the central processor temperature value reaches the preset critical value.

14. The heat dissipation control method of claim 13, wherein, After the decorative plate arranged on the main body of the electronic device is opened, the method further comprises: controlling the fan arranged in the main body to start.

15. The heat dissipation control method according to Claim 13, wherein After the decorative plate arranged on the main body of the electronic device is opened, the method further comprises: Obtaining the temperature information of the electronic device; If the temperature information indicates that the shell temperature value or the central processor temperature value is lower than the preset critical value, the decorative plate arranged on the main body of the electronic device is closed to shield the heat dissipation hole group.

16. The heat dissipation control method according to claim 13, wherein In the case that the heat dissipation control condition comprises the electronic device performance mode, the opening of the decorative plate arranged on the main body of the electronic device comprises: acquire running information of the electronic device in the performance mode, wherein the running information is used for at least representing a number of running software or opened files in the electronic device; control an opening angle of the decorative plate according to the running information.

17. The heat dissipation control method of claim 13, wherein, In a case where the heat dissipation control condition comprises temperature information of the electronic device, the control of the opening of the decorative plate arranged on the main body of the electronic device comprises: controlling the opening angle of the decorative plate according to the temperature information of the electronic device.

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