Electronic equipment

Abstract

The invention provides electronic equipment, and relates to the technical field of terminal equipment. The sound production device is used for solving the problem that the sound production device of the electronic equipment adopts an open-type rear cavity and easily causes vibration and pressing abnormal sound. The electronic equipment comprises a middle frame, a sound production device, a separator, a battery and a mainboard. The middle frame comprises a frame and a middle plate, and the middle plate is fixed in the frame. The sounding device is located on one side of the middle plate. The separator and the sounding device are positioned on the same side of the middle plate; the separator and the inner wall of the frame form a first space, and the sounding device is located in the first space. The battery and the separator are arranged on the same side of the middle plate, and the battery is located outside the first space. The main board and the battery are arranged on the same side of the middle board, and part of the main board is located outside the first space.

Description

Technical Field

[0001] This application relates to the field of terminal equipment technology, and more particularly to an electronic device. Background Technology

[0002] In electronic devices (such as mobile phones), the audio performance of the sound-generating device is a crucial factor affecting user experience. Most sound-generating devices employ an open-back cavity design; however, this design is prone to vibration and rattling noises when pressed, negatively impacting the user experience. Summary of the Invention

[0003] This application provides an electronic device that addresses the problem of vibration and abnormal noise caused by using an open rear cavity in the sound-generating device of the electronic device.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, an electronic device is provided, comprising a mid-frame, a sound-generating device, an isolator, a battery, and a motherboard. The mid-frame includes a frame and a mid-plate, the mid-plate being fixed within the frame. The sound-generating device is located on one side of the mid-plate. The isolator is disposed on the mid-plate, and the isolator and the sound-generating device are located on the same side of the mid-plate; the isolator and the inner wall of the frame form a first space, and the sound-generating device is located within the first space. The battery and the isolator are disposed on the same side of the mid-plate, and the battery is located outside the first space. The motherboard and the battery are disposed on the same side of the mid-plate, and a portion of the motherboard is located outside the first space.

[0006] The electronic device provided in the first aspect of this application comprises a first space formed by the inner wall of the separator and the frame, in which a sound-generating device is located. This first space serves as the rear cavity of the sound-generating device, while the battery is located outside the rear cavity. Therefore, when the area corresponding to the battery on the outer surface of the electronic device is pressed, the vibration caused by the compression of the internal space cannot be transmitted to the first space, i.e., it cannot be transmitted to the rear cavity of the sound-generating device, thereby preventing abnormal noises from the sound-generating device and ensuring its sound quality.

[0007] For example, when the electronic device is a foldable screen terminal, at least two mid-frames are provided, which are rotatably connected by a pivot mechanism. The electronic device also includes a foldable screen and a back cover, which are located on both sides of the mid-frame. The aforementioned isolation component, sound-emitting device, and battery can be disposed between the back cover and the mid-frame, or between the foldable screen and the mid-frame.

[0008] Furthermore, the electronic device may also include a display screen, also known as an outer screen or secondary screen. This display screen is located on the side of the mid-frame away from the folding screen; that is, a back cover is located on one of the two mid-frames, and the display screen is located on the other. Isolators, sound-emitting devices, and batteries may also be located between the display screen and the mid-frame.

[0009] Furthermore, since a portion of the motherboard is located outside the first space, this area can be electrically connected to components outside the first space. For example, the battery and the motherboard can be electrically connected via an electrical connector (e.g., a flexible circuit board). This way, the electrical connector does not need to pass through the insulating member, and there is no conflict between them; that is, it does not affect the insulating effect of the insulating member, nor does it damage the electrical connector.

[0010] In one possible implementation of the first aspect of this application, the isolation member includes a first isolation member and a second isolation member. The first isolation member is disposed on the surface of the motherboard away from the middle plate, and the second isolation member is disposed between the motherboard and the middle plate. In this way, the thickness of the isolation member can be reduced along the thickness direction of the electronic device, avoiding an increase in the width of the isolation member due to its large thickness, thereby helping the isolation member save space.

[0011] In one possible implementation of the first aspect of this application, a second space is formed between the end of the spacer and the inner wall of the frame, and the second space is filled with a sealing material. In this structure, the sealing material filling the second space can seal the gap between the end of the spacer and the inner wall of the frame, thereby improving the sealing effect of the spacer on the first space.

[0012] For example, along the thickness direction of the electronic device, when the isolator is disposed between the middle plate and the aforementioned back cover, the two ends of the second space are sealed by the middle plate and the back cover or outer screen, thereby forming a sealed space. After filling the second space with sealing material, the gap between the end of the isolator and the inner wall of the frame can be sealed.

[0013] In one possible implementation of the first aspect of this application, a first subspace is formed between the end of the first isolator and the inner wall of the frame, a second subspace is formed between the end of the second isolator and the inner wall of the frame, and a third subspace is formed between the edge of the motherboard and the inner wall of the frame. The first, third, and second subspaces are sequentially distributed along the thickness direction of the electronic device and are interconnected to form a second space. In this way, the gaps between the end of the first isolator and the inner wall of the frame, the edge of the motherboard and the inner wall of the frame, and the end of the second isolator and the inner wall of the frame can be sealed by a sealing material, thereby improving the sealing effect of the first space.

[0014] In one possible implementation of the first aspect of this application, the cross-sectional areas of the first subspace, the third subspace, and the second subspace decrease sequentially along the direction from the main board to the middle plate. That is, the first, third, and second subspaces form a progressively descending stepped structure along the direction from the main board to the middle plate. In this way, when filling the second space with sealing material, the sealing material, such as sealant, has fluidity before solidification. Therefore, the sealing material can flow along the stepped structure to the bottom of the second space (i.e., the surface of the middle plate), thereby reducing the risk of the second space not being completely filled after the sealing material is filled, thus improving the sealing effect.

[0015] In one possible implementation of the first aspect of this application, the vertical projection of the first subspace onto the middle plate covers the vertical projection of the third subspace onto the middle plate, and the vertical projection of the third subspace onto the middle plate covers the vertical projection of the second subspace onto the middle plate. With this structure, it is possible to avoid the formation of spaced areas between the first spacer and the middle plate, and between the main board and the middle plate, within the second space, thereby further reducing the risk that the sealing material cannot completely fill the second space.

[0016] In one possible implementation of the first aspect of this application, the cross-sectional areas of the second subspace, the third subspace, and the first subspace decrease sequentially along the direction from the middle plate to the main plate; an injection port is provided on the middle plate, and the injection port communicates with the second space. In this structure, sealing material can be filled into the second space from one side of the middle plate through the injection port. The sealing material can flow along the stepped structure formed by the sequential descent of the second, third, and first subspaces to fill the second space completely.

[0017] In one possible implementation of the first aspect of this application, the vertical projection of the second subspace onto the middle plate covers the vertical projection of the third subspace onto the middle plate, and the vertical projection of the third subspace onto the middle plate covers the vertical projection of the first subspace onto the middle plate. This structure creates a stepped structure that descends sequentially in the direction from the middle plate to the main plate, which is beneficial for improving the filling rate of the sealing material in the second space.

[0018] In one possible implementation of the first aspect of this application, the sidewall of the first spacer forming the first subspace is called the first sidewall, the sidewall of the second spacer forming the second subspace is called the second sidewall, and the sidewall of the main board forming the third subspace is called the third sidewall. Partial areas of the first sidewall, partial areas of the second sidewall, and partial areas of the third sidewall are flush with each other. This structure facilitates increasing the volume of the second space, thereby increasing the amount of sealing material and improving the sealing effect.

[0019] For example, portions of the first sidewall, the second sidewall, and the third sidewall can be flush with each other along the thickness direction of the electronic device. That is, the first sidewall, the second sidewall, and the third sidewall are all perpendicular to the middle plate.

[0020] In one possible implementation of the first aspect of this application, a first groove is formed on the end face of the isolator. The first groove extends along the thickness direction of the electronic device and penetrates both sides of the isolator. The first groove and the inner wall of the frame form a second space. In this structure, the inner wall of the first groove on the end face of the isolator and the inner wall of the frame enclose the aforementioned second space.

[0021] For example, the first isolation member has a first groove at its end, which encloses the inner wall of the frame to form a first subspace. The motherboard has a third groove at its edge, which encloses the inner wall of the frame to form a third subspace. The second isolation member has a second groove at its end, which encloses the inner wall of the frame to form a second subspace.

[0022] In one possible implementation of the first aspect of this application, a first protrusion is provided on the inner wall of the frame, and a second protrusion is provided at the end of the spacer. The first protrusion faces the end face of the spacer, and the second protrusion faces the inner wall of the frame, forming a second space between the first and second protrusions. In this structure, the space between the first and second protrusions forms the second space.

[0023] For example, the first isolation member is provided with a first sub-protrusion, and forms a first sub-space with the first protrusion. A third sub-protrusion is provided on the edge of the motherboard, and forms a third sub-space with the first protrusion. A second isolation member is provided with a second sub-protrusion, and forms a second sub-space with the first protrusion.

[0024] In one possible implementation of the first aspect of this application, at least one set of recesses and protrusions are provided between the end of the isolator and the inner wall of the frame. One of the recesses and protrusions is disposed on the isolator, and the other is disposed on the frame. The protrusions extend into the recesses. In this structure, the recesses and protrusions cooperate to form a bent and extended gap between the isolator and the frame, which forms the aforementioned second space. Because the gap is bent and extended, the path of air vibration propagation is lengthened, thereby effectively dissipating the energy of air vibration propagation and preventing air vibration propagation.

[0025] In one possible implementation of the first aspect of this application, multiple sets of recesses and protrusions are provided, and these multiple sets of recesses and protrusions are distributed at intervals along the extending direction of the frame. With this structure, the length of the bent and extended gap can be further extended, thereby further improving the effect of preventing the propagation of air vibrations.

[0026] In one possible implementation of the first aspect of this application, the motherboard includes a board body and a raised plate, the raised plate being disposed on the surface of the board body, and a first spacer being disposed on the surface of the raised plate away from the board body. In this structure, the distance between the motherboard and the aforementioned display screen or back cover can be reduced by raising the plate (and, if a motherboard bracket is provided, the distance between the motherboard and the motherboard bracket can be reduced), thus further reducing the thickness of the first spacer, thereby reducing the width of the spacer.

[0027] For example, the main body of the panel and the extension plate can be integrally formed. Alternatively, they can be separate structures; for example, the extension plate can be a metal plate or metal gasket welded to the main body of the panel, or a plastic plate bonded to the main body of the panel.

[0028] In one possible implementation of the first aspect of this application, a first protrusion is provided on the surface of the middle plate facing the motherboard, and a second spacer is disposed between the first protrusion and the motherboard. This structure reduces the distance between the middle plate and the motherboard, thereby reducing the thickness of the second spacer and consequently making it easier to reduce the width of the spacer.

[0029] In one possible implementation of the first aspect of this application, the electronic device further includes an electrical connector located outside the first space. One end of the electrical connector is electrically connected to the area of ​​the motherboard located outside the first space, and the other end of the electrical connector is electrically connected to the components of the electronic device.

[0030] For example, the electrical connector can be a flexible circuit board, which can be electrically connected to the motherboard via a BTB connector. Therefore, by placing the electrical connector outside the first space, conflicts between the isolator and the electrical connector can be avoided, thus preventing the isolator from affecting the connection stability of the BTB connector.

[0031] In one possible implementation of the first aspect of this application, the electronic device further includes a motherboard bracket, which is disposed on the side of the motherboard away from the middle plate, and an electrical connector is disposed between the motherboard and the motherboard bracket; the isolation member further includes a third isolation member, which is disposed on the side of the motherboard bracket away from the motherboard, and the first isolation member abuts against the motherboard bracket. In this structure, the isolation members can be further layered between the motherboards, i.e., a third isolation member is disposed between the motherboard bracket and the display screen or back cover, thereby reducing the thickness of the first isolation member and further reducing the width of the isolation member.

[0032] In one possible implementation of the first aspect of this application, the motherboard bracket includes a first sub-bracket and a second sub-bracket, which are spaced apart. A first spacer and a third spacer are respectively disposed on both sides of the first sub-bracket, and an electrical connector is disposed between the motherboard and the second sub-bracket. In this structure, the motherboard bracket is a split structure, consisting of a first sub-bracket and a second sub-bracket. The first sub-bracket is disposed between the first and third spacers, with a portion of the first sub-bracket located within the aforementioned first space to fix some components on the motherboard. The second sub-bracket is located outside the first space to fix the electrical connector, thus making the overall structure more flexible.

[0033] In one possible implementation of the first aspect of this application, the isolator extends along the width direction of the electronic device, and its end is disposed opposite to the inner wall of the frame. For example, the end face of the isolator may abut against the inner wall of the frame; or, the end face of the isolator may have a gap with the inner wall of the frame, and a seal is achieved through the aforementioned second space and the filling sealing material. In this structure, along the length direction of the electronic device, the isolator divides the interior of the frame into two regions: one region serves as an open rear cavity for a sound-generating device, and the other region is used to install batteries and other components.

[0034] In one possible implementation of the first aspect of this application, a second protrusion is formed on the inner wall of the frame. One end of the spacer is disposed opposite to the inner wall of the frame, and the other end of the spacer is disposed opposite to the second protrusion. For example, the end face of the spacer and the side wall of the second protrusion can abut against each other; or, there can be a gap between them, and a seal is achieved through the aforementioned second space and the filling sealing material. In this structure, by utilizing some structures inside the frame, namely the second protrusion, as the boundary of the first space, the material of the spacer can be saved, which is beneficial to reducing costs.

[0035] In one possible implementation of the first aspect of this application, a partition is provided on the middle plate, dividing the middle plate into a first region and a second region. A sound-generating device is disposed in the first region, and a battery is disposed in the second region. The partition includes a first part and a second part. The surface of the first part away from the middle plate is flush with the surface of the frame. Along the thickness direction of the electronic device, the thickness of the second part is less than the thickness of the first part. One end of the partition is disposed opposite to the inner wall of the frame, and the other end of the partition is disposed opposite to the first part. The second part is located outside the first space. For example, the end face of the partition can abut against the side wall of the first part; or, there can be a gap between them, and sealing is achieved through the aforementioned second space and the filling of a sealing material.

[0036] In this way, one end of the isolator abuts against the first part of the partition. The isolator can include multiple segments extending in different directions. For example, one part of the isolator extends along the width of the electronic device and abuts against the inner wall of the frame, while another part extends along the length of the electronic device and abuts against the first part. Therefore, this increases the volume of the first space and correspondingly increases the usable area on the motherboard.

[0037] In one possible implementation of the first aspect of this application, the first region includes a first sub-region and a second sub-region, the first sub-region and the second region being distributed along the length direction of the electronic device, and the second sub-region and the second region being distributed along the width direction of the electronic device; a sound-emitting device is disposed in the first sub-region, and an isolating member is disposed in the second sub-region. This structure facilitates further increasing the volume of the first space and correspondingly increasing the usable area of ​​the motherboard.

[0038] In one possible implementation of the first aspect of this application, the first region further includes a third sub-region, which is located on the side of the second region away from the first sub-region. The third sub-region is equipped with a sound-emitting device, and two isolators are provided. Along the length of the electronic device, a second portion is located between the two isolators. In this structure, two sound-emitting devices are provided, and each of the two sound-emitting devices forms the aforementioned first space as an open rear cavity, which is beneficial for improving the audio performance of the electronic device.

[0039] In one possible implementation of the first aspect of this application, a connection hole is formed on the middle plate, and the connection hole is located within a first space; the electronic device also includes an isolation part, which is disposed on the side of the middle plate away from the isolation element. The isolation part and the inner wall of the frame form a third space; or, the isolation part extends circumferentially around the connection hole to form a third space; in a plane parallel to the middle plate, the connection hole is located within the third space, and the battery is located outside the area where the third space is located. In this structure, the first space and the third space together serve as an open rear cavity for the sound-emitting device, which is beneficial for further improving the audio effect of the sound-emitting device.

[0040] In one possible implementation of the first aspect of this application, the isolation part is foam, adhesive backing, glue, or rubber.

[0041] In one possible implementation of the first aspect of this application, the insulating element is foam, adhesive backing, glue, or rubber.

[0042] In one possible implementation of the first aspect of this application, the electronic device further includes a battery cover and a display module, which are located on opposite sides of a middle plate and fixedly connected to a frame. A spacer abuts between the battery cover and the middle plate; or, the spacer abuts between the display module and the middle plate. In this case, the electronic device is a candybar phone, and the spacer and the sound-emitting device can be disposed between the middle plate and the battery cover, or between the middle plate and the display module.

[0043] In one possible implementation of the first aspect of this application, the electronic device further includes a hinge mechanism, with multiple mid-frames provided, and two adjacent mid-frames rotatably connected by a hinge mechanism; at least one mid-frame contains a sound-emitting device and an isolator. In this case, the electronic device is a foldable screen phone, and the rear cavity structure of the sound-emitting device can be determined based on actual design needs. For example, each mid-frame may use an isolator to form an open rear cavity for the sound-emitting device. Alternatively, the sound-emitting devices in some mid-frames may use this structure, while the sound-emitting devices in others may use a closed rear cavity, etc.

[0044] In one possible implementation of the first aspect of this application, the electronic device further includes a back cover, with a back cover provided on each mid-frame, and a spacer abutting between the back cover and the mid-frame.

[0045] In one possible implementation of the first aspect of this application, the electronic device further includes a display screen, which is fixed to a mid-frame with an isolator, the isolator abutting between the display screen and the mid-frame. Attached Figure Description

[0046] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0047] Figure 2 An exploded view of an electronic device provided in an embodiment of this application;

[0048] Figure 3 This is a front view of the electronic device provided in the embodiments of this application when it is in a folded state;

[0049] Figure 4 for Figure 3 A cross-sectional structural diagram of the provided electronic device;

[0050] Figure 5 An exploded view of an electronic device provided in an embodiment of this application;

[0051] Figure 6 for Figure 5 AA cross-section view;

[0052] Figure 7 An exploded view of another electronic device provided in the embodiments of this application;

[0053] Figure 8 for Figure 7 BB cross-section;

[0054] Figure 9 An exploded view of yet another electronic device provided in the embodiments of this application;

[0055] Figure 10 for Figure 9 CC cross-section;

[0056] Figure 11 A partial cross-sectional view of another motherboard provided for the internal configuration of the electronic device according to an embodiment of this application;

[0057] Figure 12 A partial structural diagram of an electronic device provided in an embodiment of this application, which has another type of isolation component internally disposed;

[0058] Figure 13 for Figure 12 The provided structural diagram of the isolation component;

[0059] Figure 14 A partial structural diagram of the electronic device 01 provided in the embodiments of this application;

[0060] Figure 15 for Figure 14 Enlarged view of the structure of region D;

[0061] Figure 16 A partial structural diagram of a second space provided in an embodiment of this application;

[0062] Figure 17 A partial structural diagram of another second space provided in an embodiment of this application;

[0063] Figure 18 A partial structural diagram of another second space provided in an embodiment of this application;

[0064] Figure 19 A partial structural diagram of another second space provided in an embodiment of this application;

[0065] Figure 20 A partial structural diagram of another sealing method between the spacer and the frame provided in this application;

[0066] Figure 21 A structural diagram of another electronic device provided in an embodiment of this application;

[0067] Figure 22 for Figure 21 EE cross-section;

[0068] Figure 23A partial cross-sectional view of another electronic device provided in an embodiment of this application;

[0069] Figure 24 A partial cross-sectional structural view of another electronic device provided in an embodiment of this application;

[0070] Figure 25 A partial cross-sectional view of another electronic device provided in an embodiment of this application;

[0071] Figure 26 A partial structural diagram of another electronic device provided in an embodiment of this application;

[0072] Figure 27 for Figure 26 FF cross-sectional view;

[0073] Figure 28 A structural diagram of another partition provided in an embodiment of this application;

[0074] Figure 29 This is another internal structure diagram of the middle frame provided in an embodiment of this application;

[0075] Figure 30 A structural diagram of another partition provided in an embodiment of this application;

[0076] Figure 31 A structural diagram of another partition provided in an embodiment of this application;

[0077] Figure 32 An exploded view of another electronic device provided in an embodiment of this application.

[0078] Reference numerals: 01-Electronic device; 10-Folding screen; 11-First display area; 12-Second display area; 13-Third display area; 20-Support device; 100-Middle frame; 110-Border; 111-Sound hole; 112-First protrusion; 113-Step portion; 113a-First surface; 113b-Second surface; 114-Second groove; 115-Protrusion; 120-Middle plate; 120a-Connecting hole; 120b-Injection port; 121-First area; 121a-First sub-area; 121b-Second sub-area; 121c-Third sub-area; 122-Second area; 123-Third area; 130-First boss; 140-Second boss; 150-Blocking portion; 151-First part; 152-Second part; 200-Rotating mechanism; 300- Rear cover; 400-Display screen; 30-Sound device; 30a-Front cavity; 30b-Rear cavity; 31-Core; 31a-Diaphragm; 32-Housing; 33-Bracket; 40-Main board; 41-Board body; 42-Elevating plate; 43-Third side wall; 44-Electrical connector; 45-BTB connector; 50-Main board bracket; 60-Battery; 70-Isolator; 71-First groove; 72-Second protrusion; 73-Recess; 500-First isolator; 510-First side wall; 600-Second isolator; 610-Second side wall; 700-Third isolator; 800-Isolation part; 80-Display module; 90-Battery cover; S1-First space; S2-Second space; S21-First subspace; S22-Second subspace; S23-Third subspace; S3-Third space. Detailed Implementation

[0079] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0080] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0081] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0082] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0083] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, a tablet computer, etc., and the mobile phone can be a candybar phone or a foldable phone with a foldable screen (including an inward-folding screen and an outward-folding screen). For ease of explanation, the following description uses a mobile phone with an inward-folding screen as an example.

[0084] Please see Figure 1 and Figure 2 , Figure 1 This is a structural diagram of the electronic device 01 provided in the embodiments of this application. Figure 2 This is an exploded view of an electronic device 01 provided in an embodiment of this application. The electronic device 01 may include a foldable screen 10 and a support device 20.

[0085] For ease of description below, an XYZ coordinate system is established, defining the width direction of electronic device 01 as the X-axis, the length direction of electronic device 01 as the Y-axis, and the thickness direction of electronic device 01 as the Z-axis. It is understood that the coordinate system of electronic device 01 can be flexibly set according to actual needs; this application only provides an example and should not be considered a specific limitation thereof. Figure 1 and Figure 2 The electronic device 01 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0086] The aforementioned foldable screen 10 is used to display images, videos, etc. The foldable screen 10 may include a first display area 11, a second display area 12, and a third display area 13, with the third display area 13 disposed between the first display area 11 and the second display area 12. When the foldable screen 10 is folded, the third display area 13 is bent, and the first display area 11 and the second display area 12 are positioned opposite each other. At least the third display area 13 of the foldable screen 10 is made of a flexible material. The first portion 151 and the second portion 152 of the foldable screen 10 may be made of a flexible material, a rigid material, or a combination of both. Therefore, this application does not impose any special limitations in this regard.

[0087] Among them, the aforementioned foldable screen 10 can be an organic light-emitting diode (OLED) display screen 400, an active-matrix organic light-emitting diode (AMOLED) display screen 400, a mini light-emitting diode display screen 400, a micro light-emitting diode display screen 400, a micro organic light-emitting diode display screen 400, a quantum dot light-emitting diode (QLED) display screen 400, a liquid crystal display screen 400, etc.

[0088] The aforementioned support device 20 is used to support the foldable screen 10. The support device 20 may include two mid-frames 100 and a hinge mechanism 200, which connects the two mid-frames 100. The first display area 11 and the second display area 12 of the foldable screen 10 are respectively supported and attached to the two mid-frames 100. The third display area 13 of the foldable screen 10 is supported and attached to the hinge mechanism 200. The two mid-frames 100 are rotatably connected via the hinge mechanism 200, allowing the electronic device 01 to rotate between the unfolded and folded states.

[0089] In some examples, the aforementioned middle frame 100 may include a side frame 110 and a middle plate 120, with the middle plate 120 fixed within the side frame 110. For example, the middle plate 120 and the side frame 110 may be fixed by welding, bonding, snap-fitting, or threaded connection. Alternatively, the middle plate 120 and the side frame 110 may be integrally formed, that is, the middle plate 120 and the side frame 110 form a single structural component.

[0090] Furthermore, the first display area 11 and the second display area 12 of the aforementioned foldable screen 10 are respectively fixedly connected to the borders 110 of the two mid-frames 100. For example, the foldable screen 10 and the borders 110 can be fixedly connected by means of adhesive or snap-fit. Therefore, this application does not impose any special limitations on this.

[0091] Please continue reading. Figure 1 and Figure 2 , Figure 1 and Figure 2The diagrams shown are structural schematics of the electronic device 01 in its unfolded state. When the electronic device 01 is in its unfolded state, the two mid-frames 100 and the hinge mechanism 200 are aligned with the surfaces of the folding screen 10, allowing the folding screen 10 to be fully opened and ensuring its flatness. In this state, a large-screen display can be achieved, providing users with a better experience.

[0092] Please see Figure 3 and Figure 4 , Figure 3 This is a front view of the electronic device 01 provided in this application embodiment when it is in a folded state. Figure 4 for Figure 3 The provided cross-sectional structural diagram of the electronic device 01 shows that the cross-section is parallel to the XZ plane. When the foldable screen 10 terminal is in a folded state, the first display area 11 and the second display area 12 of the foldable screen 10 are opposite each other, the third display area 13 is bent, and the two middle frames 100 are protected outside the foldable screen 10. Figure 1 and Figure 2 The foldable screen 10 shown is invisible to the user to prevent it from being scratched or damaged, thus providing effective protection for the foldable screen 10.

[0093] In addition, please see Figure 5 , Figure 5 This is an exploded view of an electronic device 01 provided in an embodiment of this application. The aforementioned support device 20 also includes a back cover 300, which is fixed to the side of the frame 110 away from the folding screen 10. The back cover 300, the frame 110, and the folding screen 10 together enclose the inner cavity of the electronic device 01. The middle plate 120 is disposed in the inner cavity, and the inner cavity can accommodate the components of the electronic device 01.

[0094] For example, the components may include a motherboard 40, a control chip (e.g., a system-on-a-chip, SOC), a graphics processing unit (GPU), a camera module, a sound-emitting device 30, and a battery 60. These components are all electrically connected to each other through the motherboard 40, thereby enabling the different functions of the electronic device 01.

[0095] In some embodiments, the electronic device 01 may further include a display screen 400 (also referred to as an outer screen or a secondary screen), which is a flat screen, i.e., the display screen 400 cannot be bent. The display screen 400 is disposed on the side of the frame 110 away from the folding screen 10, i.e., the back cover 300 is disposed on one of the two middle frames 100, and the display screen 400 is disposed on the other of the two middle frames 100.

[0096] Furthermore, when electronic device 01 is in a folded state (such as...) Figure 4 When the electronic device 01 is folded (as shown), the image can be displayed on the display screen 400. The overall size of the electronic device 01 is small, which makes it easy to operate the electronic device 01 with one hand. This makes the electronic device 01 suitable for different usage scenarios and helps to improve the user experience.

[0097] Based on this, please continue to refer to Figure 5 The aforementioned sound-emitting device 30 can be used to enable audio playback of the electronic device 01. For example, the sound-emitting device 30 can be a speaker or a handset. At least one sound-emitting device 30 can be disposed within each of the two mid-frames 100 of the electronic device 01. For example, one sound-emitting device 30 can be disposed within the mid-frame 100 with the back cover 300, and two sound-emitting devices 30 can be disposed within the mid-frame 100 with the display screen 400. In the following embodiments, the mid-frame 100 with the display screen 400 will be used as an example for description.

[0098] Please see Figure 6 , Figure 6 for Figure 5 The above-mentioned sound-generating device 30 may include a housing 32 and a core 31 disposed within the housing 32. A diaphragm 31a is disposed in the core 31, which divides the cavity inside the housing 32 into two independent sound chambers, namely a front chamber 30a and a rear chamber 30b. The front chamber 30a is connected to the outside through a sound outlet 111 disposed on the middle frame 100. When the diaphragm 31a vibrates, it can compress the air in the front chamber 30a and the rear chamber 30b, thereby emitting audio.

[0099] For example, the aforementioned sound outlet 111 can be formed on the frame 110, and the sound outlet 111 penetrates the inner wall and outer wall of the frame 110. Furthermore, the sound outlet 111 can also be formed between the inner wall of the frame 110 and the side wall of the display screen 400.

[0100] The rear cavity 30b located inside the housing 32 is referred to as a closed rear cavity. In this structure, the volume of the housing 32 is affected by the internal sound cavity (including the front cavity 30a and the rear cavity 30b), resulting in a larger volume of the housing 32, which is not conducive to the trend of making the electronic device 01 thinner and lighter. Therefore, the sound-generating device 30 can also adopt an open rear cavity structure.

[0101] Specifically, please refer to Figure 7 and Figure 8 , Figure 7 An exploded view of another electronic device 01 provided in this application embodiment. Figure 8 for Figure 7The BB cross-sectional view shows that the electronic device 01 is equipped with the aforementioned open rear cavity sound-emitting device 30. The sound-emitting device 30 may include a core 31 and a support 33. The support 33 is fixed to the middle plate 120 and to the surface of the middle plate 120 away from the folding screen 10. The core 31 is disposed on the support 33, and the aforementioned front cavity 30a is formed between the core 31 (i.e., the aforementioned diaphragm 31a) and the support 33, and the front cavity 30a communicates with the sound outlet 111.

[0102] Furthermore, the space on the side of the diaphragm 31a away from the front cavity 30a is the space between the middle plate 120 and the display screen 400. Therefore, the space between the middle plate 120 and the display screen 400 forms the rear cavity 30b of the sound-generating device 30, i.e., an open rear cavity. In this structure, since the support 33 only forms the front cavity 30a between itself and the core 31, i.e., the support 33 does not need to completely enclose the core 31, it is beneficial to reduce the overall volume of the sound-generating device 30, thereby contributing to the thinning and lightening of the electronic device 01.

[0103] However, when the open-back cavity sound-emitting device 30 emits sound, the vibration of the diaphragm 31a of the sound-emitting device will cause the air in the back cavity 30b to vibrate, which in turn will cause the display screen 400 to vibrate (when the sound-emitting device 30 is located between the back cover 300 and the middle plate 120, it will cause the back cover 300 to vibrate), affecting the user experience.

[0104] Furthermore, during user operation, the display screen 400 may be pressed. When the display screen 400 is pressed, the space between the display screen 400 and the middle plate 120 is compressed, which causes the air in the space to be compressed, which in turn causes the diaphragm 31a to vibrate, causing the sound-emitting device 30 to emit sound and causing abnormal noise.

[0105] Based on this, in some examples, the support for the display screen 400 can be improved by placing some support material (e.g., foam) between the middle plate 120 and the display screen 400. Alternatively, a sealing material (e.g., adhesive) can be placed around the sound-generating device 30 to define the rear cavity 30b of the sound-generating device 30, thereby improving the problem of abnormal noise from the sound-generating device 30 when the display screen 400 is pressed.

[0106] However, the aforementioned motherboard 40 and battery 60 are also housed within the middle frame 100. The motherboard 40 and battery 60 can be distributed along the length direction (i.e., the Y-axis direction) of the electronic device 01. Since the motherboard 40, battery 60, and sound-emitting device 30 are all located on the same side surface of the middle plate 120, the aforementioned support material or sealing material may be disposed on the surface of the battery 60 or motherboard 40 facing the display screen 400, such as... Figure 7 The location indicated by the medium-circular shaded area.

[0107] In this way, when the support material is placed on the surface of the battery 60, it will compress the battery 60 because it needs to provide support between the battery 60 and the display screen 400. After the battery 60 is charged and discharged, it will expand, which will increase the relative force between the battery 60 and the support material, that is, increase the compressive force of the support material on the battery 60.

[0108] Furthermore, when the display screen 400 is pressed, the pressure is transmitted to the battery 60 through the support material. However, the battery 60 cannot withstand external pressure, so the battery 60 may be damaged under the above circumstances.

[0109] When the sealing material surrounds the sound-generating device 30, the limited internal space of the electronic device 01 results in a reduction in the volume of the rear cavity 30b, which is detrimental to improving the sound quality of the sound-generating device 30. Furthermore, the sealing material needs to be placed on the surface of the motherboard 40. Increasing the volume of the rear cavity 30b surrounded by the sealing material would increase the area occupied by the sealing material on the motherboard 40, thus affecting the placement of other components.

[0110] To resolve the above issues, please refer to [link / reference]. Figure 9 and Figure 10 , Figure 9 An exploded view of another electronic device 01 provided in the embodiments of this application. Figure 10 for Figure 9 The CC cross-sectional view. The electronic device 01 includes the aforementioned mid-frame 100, folding screen 10, display screen 400, back cover 300, motherboard 40, battery 60, and sound-emitting device 30.

[0111] The electronic device 01 also includes an isolator 70, which is disposed on the middle plate 120 and on the same side surface of the middle plate 120 as the sound-emitting device 30. The isolator 70 abuts against the display screen 400 and the middle plate 120. For example, the isolator 70 can be made of materials such as foam, adhesive, glue, or rubber, or other sealing materials. Therefore, this application does not impose any special limitations on it.

[0112] The isolator 70 and the inner wall of the frame 110 form a first space S1, that is, the isolator 70, the inner wall of the frame 110, the middle plate 120 and the display screen 400 together enclose the first space S1. The sound-emitting device 30 is located inside the first space S1, and the battery 60 is located outside the first space S1.

[0113] Based on this, the isolator 70, together with the inner wall of the frame 110, forms a first space S1, which constitutes the open rear cavity of the sound-generating device 30. Since the battery 60 is located outside this first space S1, i.e., outside the open rear cavity of the sound-generating device 30, when the area corresponding to the battery 60 on the display screen 400 is pressed, the resulting internal air compression is isolated outside the first space S1 and will not be transmitted to the area where the sound-generating device 30 is located. This prevents the diaphragm 31a of the sound-generating device 30 from vibrating, thus avoiding abnormal noise from the sound-generating device 30. Simultaneously, there is no need to provide support material on the surface of the battery 60, thereby avoiding pressure on the battery 60 and reducing the risk of damage to the battery 60.

[0114] In addition, please continue to refer to Figure 9 and Figure 10 The aforementioned motherboard 40 may be partially disposed within the first space S1. Specifically, the aforementioned isolation member 70 may include a first isolation member 500 and a second isolation member 600. The first isolation member 500 is disposed on the surface of the motherboard 40 away from the middle plate 120, that is, the first isolation member 500 is located between the motherboard 40 and the display screen 400. The second isolation member 600 is disposed between the motherboard 40 and the middle plate 120. That is, the isolation member 70 is disposed on the motherboard 40, and isolation members 70 (i.e., the first isolation member 500 and the second isolation member 600) are disposed on both sides of the motherboard 40.

[0115] In this way, the size of the motherboard 40 can be determined based on actual needs, without being affected by the size of the first space S1, and the size setting of the motherboard 40 is not limited. Furthermore, a first isolator 500 and a second isolator 600 are respectively provided on both sides of the motherboard 40, so that a seal can be formed between the motherboard 40 and the display screen 400, and between the motherboard 40 and the middle plate 120, to isolate the first space S1 and prevent mutual interference between the areas where the sound-emitting device 30 and the battery 60 are located.

[0116] Furthermore, since the aforementioned spacer 70 is made of materials such as foam, adhesive, glue, or rubber, which are relatively soft and fluid before solidification, a larger thickness (the dimension along the Z-axis) will lead to a corresponding increase in its width (the dimension perpendicular to its extension direction and perpendicular to the Z-axis). Therefore, to reduce the width of the first spacer 500 and the second spacer 600, it is necessary to reduce the thickness of both the first spacer 500 and the second spacer 600.

[0117] Specifically, please refer to Figure 11 , Figure 11This is a partial cross-sectional view of another motherboard 40 internally configured in the electronic device 01 provided in this application embodiment. The motherboard 40 may include a board body 41 and a support plate 42. The support plate 42 is disposed on the surface of the board body 41 away from the middle plate 120, and the support plate 42 is fixedly connected to the board body 41. For example, the two can be integrally formed; or they can adopt a separate structure, that is, the support plate 42 can be a metal plate or metal gasket welded to the board body 41, or the support plate 42 can be a plastic plate or the like bonded to the board body 41.

[0118] The aforementioned first isolation member 500 is disposed on the surface of the raised plate 42 away from the plate body 41, that is, the first isolation member 500 abuts against the plate body 41 and the display screen 400. In this structure, by setting the main board 40 as a partially raised structure, the distance between the main board 40 and the display screen 400 is reduced, that is, the thickness of the first isolation member 500 is reduced, thereby reducing the width of the first isolation member 500, which helps to save the space occupied on the main board 40.

[0119] Furthermore, please continue reading Figure 11 A first protrusion 130 can also be provided on the surface of the middle plate 120 facing the motherboard 40, and a second spacer 600 can be provided on the surface of the first protrusion 130, that is, the second spacer 600 abuts against the first protrusion 130 and the motherboard 40. In other words, by reducing the distance between the middle plate 120 and the motherboard 40 through the first protrusion 130, it is beneficial to reduce the width of the second spacer 600, thereby saving internal space of the electronic device 01.

[0120] To improve the isolation and sealing performance of the aforementioned isolator 70, please refer to [link / reference needed]. Figure 12 and Figure 13 , Figure 12 A partial structural diagram of an electronic device 01 provided in this application embodiment, which has another isolation member 70 internally disposed, is shown. Figure 13 for Figure 12 A structural diagram of the provided isolator 70 is shown. A second space S2 can be formed between the end of the isolator 70 and the inner wall of the frame 110. The second space S2 can extend along the thickness direction of the electronic device 01 and extend from the display screen 400 side to the middle plate 120 side. The second space S2 can be filled with a sealing material. For example, sealant can be filled into the second space S2 by a dispensing process.

[0121] In this way, by filling the second space S2 with sealing material, the gap between the isolator 70 and the inner wall of the frame 110 caused by assembly precision can be further sealed, thereby preventing air vibration from being transmitted to the first space S1 through the gap, which is beneficial to further improving the isolation and sealing performance of the isolator 70.

[0122] For example, a first groove 71 may be provided on the end face of the aforementioned isolation member 70. The first groove 71 extends through both sides of the isolation member 70 along the thickness direction (i.e., the Z-axis direction) of the electronic device 01. The end of the isolation member 70 abuts against the inner wall of the frame 110. The inner wall of the first groove 71 and the inner wall of the frame 110 enclose the aforementioned second space S2.

[0123] And, please see Figure 14 and Figure 15 , Figure 14 This is a partial structural diagram of the electronic device 01 provided in the embodiments of this application. Figure 15 for Figure 14 Enlarged view of the structure of region D. A second groove 114 can also be provided on the inner wall of the frame 110. The second groove 114 is arranged opposite to the first groove 71. The first groove 71 and the second groove 114 together form the second space S2, which helps to increase the volume of the second space S2, that is, helps to increase the amount of sealing material filling, thereby improving the sealing effect.

[0124] In some examples, please refer to [link / reference]. Figure 14 and Figure 15 When the isolation member 70 is disposed on the motherboard 40, that is, when the isolation member 70 includes the first isolation member 500 and the second isolation member 600, the second space S2 may include the first subspace S21, the second subspace S22 and the third subspace S23. The first subspace S21 is formed between the end of the first isolation member 500 and the inner wall of the frame 110, the second subspace S22 is formed between the end of the second isolation member 600 and the inner wall of the frame 110, and the third subspace S23 is formed between the edge of the motherboard 40 and the inner wall of the frame 110. The first subspace S21, the third subspace S23 and the second subspace S22 are distributed sequentially along the Z-axis and are interconnected with each other, thereby forming the second space S2.

[0125] For example, the end face of the first isolation member 500, the end face of the second isolation member 600, and the edge of the main board 40 are all formed with groove structures, and respectively enclosed with the inner wall of the frame 110 to form the first subspace S21, the second subspace S22, and the third subspace S23, thereby forming the second space S2.

[0126] Furthermore, to further improve the sealing performance of the aforementioned second space S2, along the Z-axis direction, and along the direction from the main board 40 to the middle plate 120, i.e. along... Figure 15As shown in the top-to-bottom direction, the cross-sectional areas of the first subspace S21, the third subspace S23, and the second subspace S22 decrease sequentially. Since the sealing material is filled into the second space S2 from the side of the first isolator 500, the cross-sectional areas of the first subspace S21, the third subspace S23, and the second subspace S22 decrease sequentially along the direction from the main board 40 to the middle plate 120. This allows the sealing material to first fill the second subspace 820, and then sequentially fill the second subspace S22, the third subspace S23, and the first subspace S21, thereby improving the sealing effect.

[0127] Furthermore, along the Z-axis, the vertical projection of the first subspace S21 onto the middle plate 120 overlaps the vertical projection of the third subspace S23 onto the middle plate 120, and the vertical projection of the third subspace S23 onto the middle plate 120 overlaps the vertical projection of the second subspace S22 onto the middle plate 120. In this way, along the direction from the main plate 40 to the middle plate 120, the inner wall of the second space S2 can form a gradually decreasing stepped structure. When filling the second space S2, the sealing material (i.e., sealant) can flow downwards along this stepped structure (e.g., ...). Figure 15 The flow (as shown in the top-to-bottom direction) is towards the middle plate 120, which helps to increase the filling rate of the sealing material in the second space S2, thereby reducing the risk of gaps in the second space S2 where no sealing material is filled, and thus improving the sealing effect of the second space S2.

[0128] In other examples, during the installation of electronic device 01, it is also possible to first... Figure 9 The display screen 400 shown is intended to be mounted on the middle frame 100. In this case, sealant needs to be filled into the second space S2 from the middle plate 120 side. Therefore, please refer to... Figure 16 , Figure 16 This is a partial structural diagram of a second space S2 provided in an embodiment of this application, along the direction from the middle plate 120 to the main plate 40, i.e. Figure 16 In the direction from bottom to top, the cross-sectional areas of the second subspace S22, the third subspace S23 and the first subspace S21 decrease sequentially, and an injection port 120b is provided on the middle plate 120, which is connected to the second space S2.

[0129] Furthermore, along the Z-axis, the vertical projection of the second subspace S22 onto the middle plate 120 overlaps the vertical projection of the third subspace S23 onto the middle plate 120, and the vertical projection of the third subspace S23 onto the middle plate 120 overlaps the vertical projection of the first subspace S21 onto the middle plate 120. Thus, along the direction from the middle plate 120 to the main plate 40 ( Figure 16The middle plate 120 (from bottom to top) can form a gradually decreasing stepped structure. When the sealing material is filled through the injection port 120b on the middle plate 120, the sealing material can flow along the stepped structure, thereby increasing the filling rate of the sealing material in the second space S2, reducing the risk of unfilled space in the second space, and improving the sealing effect.

[0130] Based on this, the first isolation member 500 forms the sidewall of the first subspace S21 as the first sidewall 510, the second isolation member 600 forms the sidewall of the second subspace S22 as the second sidewall 610, and the main board 40 forms the sidewall of the third subspace S23 as the third sidewall 43. The first sidewall 510, the second sidewall 610, and the third sidewall 43 together form the aforementioned stepped structure.

[0131] In another possible example, please continue reading. Figure 15 And in conjunction with reference Figure 17 , Figure 17 This is a partial structural diagram of another second space S2 provided in an embodiment of this application. Parts of the first sidewall 510, the second sidewall 610, and the third sidewall 43 can form the aforementioned stepped structure, and the areas of the first sidewall 510, the second sidewall 610, and the third sidewall 43 that do not form a stepped structure can be flush with each other along the Z-axis direction.

[0132] In this way, the filling rate of the sealing material in the second space S2 can be increased, and the volume of the second space S2 can be increased to increase the filling amount of the sealing material, thereby further improving the sealing effect between the end of the separator 70 and the inner wall of the frame 110.

[0133] In some other possible embodiments, please refer to Figure 18 , Figure 18 This is a partial structural diagram of another second space S2 provided in an embodiment of this application. A first protrusion 112 is provided on the inner wall of the frame 110, and a second protrusion 72 is provided at the end of the separator 70. The first protrusion 112 is opposite to the end face of the separator 70, and the second protrusion 72 is opposite to the inner wall of the frame 110. The second space S2 is formed between the first protrusion 112 and the second protrusion 72, that is, the first protrusion 112 and the second protrusion 72 are spaced apart. The end face of the separator 70, the side wall of the first protrusion 112, the inner wall of the frame 110, and the side wall of the second protrusion 72 enclose and form the second space S2.

[0134] For example, Figure 17 The ends of the first isolation member 500, the second isolation member 600, and the edge of the main board 40 are all provided with protruding structures to form... Figure 18 The second protrusion 72 shown can cooperate with the first protrusion 112 to form a second space S2.

[0135] It is understood that the structure of the second space S2 described above is not limited to the two structures mentioned above. For example, please refer to... Figure 19 , Figure 19 This is a partial structural diagram of another second space S2 provided in an embodiment of this application. A step portion 113 can be provided at the junction of the first protrusion 112 and the inner wall of the frame 110. The step portion 113 includes a first surface 113a and a second surface 113b, both parallel to the Z-axis direction. The first surface 113a is connected to the inner wall of the frame 110, and the second surface 113b is connected to the first protrusion 112. The end face of the second protrusion 72 faces the inner wall of the frame 110, and the side wall of the second protrusion 72 abuts against the first surface 113a of the step portion 113. The end face of the isolator 70, the side wall of the first protrusion 112, the second surface 113b of the step portion 113, and the side wall of the second protrusion 72 enclose and form the second space S2. That is, the end of the isolator 70 and the inner wall of the frame 110 can also cooperate with each other through other forms of concave-convex structures to enclose and form the second space S2. Therefore, this application does not impose any special limitations on this.

[0136] In some other possible examples, see Figure 20 , Figure 20 This is a partial structural diagram illustrating another sealing method between the spacer 70 and the frame 110 provided in this application. At least one set of recesses 73 and protrusions 115 may be provided between the end of the spacer 70 and the inner wall of the frame 110. One of the recesses 73 and protrusions 115 is located on the spacer 70, and the other is located on the frame 110. The protrusions 115 extend into the recesses 73. For example, the recesses 73 may be groove structures formed at the end of the spacer 70, and the protrusions 115 may be protrusion structures provided on the inner wall of the frame 110.

[0137] In this way, the recessed portion 73 and the protruding portion 115 cooperate with each other, allowing the gap between the end of the spacer 70 and the inner wall of the frame 110 (i.e., Figure 19 The second space S2 shown forms a bent and extended slit structure. When the air vibrates, the vibration propagates in this bent and extended slit, effectively dissipating the energy of the vibration propagation, thereby preventing the vibration from being relayed.

[0138] Furthermore, when multiple sets of recessed portions 73 and protruding portions 115 are provided, the length of the bent and extended gap can be further extended, thereby further improving the energy loss during vibration propagation and enhancing the effect of preventing air vibration propagation. With this structure, the sealing and isolation of the first space S1 can be achieved without filling it with the aforementioned sealing material.

[0139] In another embodiment, please refer to Figure 21 and Figure 22 , Figure 21 This is a structural diagram of another electronic device 01 provided in an embodiment of this application. Figure 22 for Figure 21 The EE cross-sectional view is shown. The electronic device 01 also includes an electrical connector 44, one end of which is electrically connected to the area of ​​the motherboard 40 located outside the first space S1, and the other end of which is used for electrical connection to other components. For example, the electrical connector 44 can be an FPC board (Flexible Printed Circuit Board), and the components can be the battery 60 or circuit boards located in other areas.

[0140] Electrical connection between electrical connector 44 and motherboard 40 can be achieved through BTB connector 45 (Board-to-board Connectors). BTB connector 45 includes a male head and a female head, one fixed on motherboard 40 and the other fixed on FPC board. The two are plugged into each other to achieve electrical connection between FPC board and motherboard 40.

[0141] To avoid affecting the FPC board and BTB connector 45, the electrical connector 44 provided in this embodiment is located outside the first space S1, that is, the male or female connector of the BTB connector 45 is fixed to the area of ​​the motherboard 40 outside the first space S1. In this way, the isolator 70 and the FPC board will not conflict with each other, that is, the isolation and sealing performance of the isolator 70 will not be affected, nor will the connection stability of the FPC board be affected.

[0142] In addition, please see Figure 23 , Figure 23 This is a partial cross-sectional view of another electronic device 01 provided in an embodiment of this application. The electronic device 01 may also include a motherboard bracket 50, which is disposed on the side of the motherboard 40 away from the middle plate 120. An electrical connector 44 is disposed between the motherboard 40 and the motherboard bracket 50, so that the motherboard bracket 50 can limit the electrical connector 44, thereby improving the connection stability between the electrical connector 44 and the motherboard 40.

[0143] In this case, the aforementioned isolation member 70 may also include a third isolation member 700, which is disposed on the side of the motherboard bracket 50 away from the motherboard 40, that is, the third isolation member 700 abuts between the display screen 400 and the motherboard bracket 50, and the aforementioned first isolation member 500 abuts between the motherboard bracket 50 and the motherboard 40.

[0144] In this way, the space between the display screen 400 and the middle plate 120 is divided into three parts along the Z-axis and sealed separately: a second isolator 600 is provided between the middle plate 120 and the main board 40, a first isolator 500 is provided between the main board 40 and the main board bracket 50, and a third isolator 700 is provided between the main board bracket 50 and the display screen 400. This helps to reduce the thickness of the first isolator 500, the second isolator 600, and the third isolator 700 along the Z-axis, thereby reducing the width of the isolator 70 and saving space.

[0145] It is understood that in this case, the aforementioned subspace is also provided between the third isolation member 700 and the inner wall of the motherboard bracket 50 and the frame 110. That is, the second space S2 is composed of five subspaces (including the aforementioned first subspace S21, second subspace S22, third subspace S23, and the subspace formed between the third isolation member 700 and the frame 110, and the subspace formed between the motherboard bracket 50 and the frame 110). Its specific structure is the same as that of the above embodiment, so it will not be described again here.

[0146] In addition, please see Figure 24 , Figure 24 This is a partial cross-sectional view of another electronic device 01 provided in an embodiment of this application. The motherboard bracket 50 may include a first sub-bracket 51 and a second sub-bracket 52. The first sub-bracket 51 and the second sub-bracket 52 are spaced apart. The first isolation member 500 and the third isolation member 700 are respectively disposed on the two side surfaces of the first sub-bracket 51. The electrical connector 44 is disposed between the motherboard 40 and the second sub-bracket 52. That is, the motherboard bracket 50 forms a split structure, so that the positions of the first sub-bracket 51 and the second sub-bracket 52 can be flexibly set according to the distribution of components inside the electronic device 01, which helps to reduce the risk of conflict in the distribution positions of components.

[0147] In another embodiment, since the folding screen 10 is located on the side of the middle plate 120 away from the motherboard 40, the folding screen 10 and the motherboard 40 also need to be electrically connected via a flexible connector (i.e., an FPC board). Therefore, please refer to... Figure 25 , Figure 25 This is a partial cross-sectional view of another electronic device 01 provided in the embodiment of this application. The middle plate 120 of the electronic device 01 has a connection hole 120a for a flexible connector to pass through. The connection hole 120a is located in the first space S1 mentioned above.

[0148] To prevent air vibrations from being transmitted through the connection hole 120a to the space between the middle plate 120 and the folding screen 10, and further to the area where the battery 60 is located. Please refer to [further details]. Figure 25The electronic device 01 provided in this application embodiment also includes an isolation part 800, which is disposed on the side of the middle plate 120 away from the sound-generating device 30, that is, the isolation part 800 abuts between the middle plate 120 and the folding screen 10.

[0149] The isolation section 800 and the inner wall of the frame 110 form a third space S3, that is, the isolation section 800, the inner wall of the frame 110, the middle plate 120, and the foldable screen 10 together enclose and form the third space S3. Alternatively, the isolation section 800 extends circumferentially around the connecting hole 120a to form the third space S3, that is, the isolation section 800, the middle plate 120, and the foldable screen 10 together enclose and form the third space S3. In a plane parallel to the middle plate 120, that is, in the XY plane, the connecting hole 120a is located inside the third space S3, and the battery 60 is located outside the third space S3.

[0150] In this way, the first space S1 formed between the middle plate 120 and the display screen 400, and the third space S3 formed between the middle plate 120 and the folding screen 10, both form the open rear cavity of the sound-emitting device 30. This helps to increase the size of the open rear cavity of the sound-emitting device 30, thereby improving the sound quality of the sound-emitting device 30. Furthermore, it helps to further improve the isolation and sealing effect between the open rear cavity of the sound-emitting device 30 and the battery 60, so as to avoid mutual interference between the two and improve the reliability of the overall structure.

[0151] It should be noted that in some other possible embodiments, the battery 60, motherboard 40, and sound-generating device 30 may also be disposed between the middle plate 120 and the folding screen 10. In this case, the separator 70 is disposed between the middle plate 120 and the folding screen 10, and the separator 800 is disposed between the middle plate 120 and the display screen 400. The specific structure of this embodiment is the same as that of the aforementioned embodiments; the only difference is the change in their placement. Therefore, it will not be described again.

[0152] Based on this, the specific structure of the isolation member 70 provided in the embodiments of this application has been described in detail above. The specific setting position and layout structure of the isolation member 70 within the middle frame 100 of the electronic device 01 will be described in detail below.

[0153] The isolator 70 can extend along the width direction of the electronic device 01, that is, along the X-axis direction, and the two end faces of the isolator 70 are respectively disposed opposite to the two inner walls of the frame 110 extending along the Y-axis direction (e.g., Figure 21 As shown), for example, the end face of the spacer 70 can abut against the inner wall of the frame 110; or, there may be a gap between the end face of the spacer 70 and the inner wall of the frame 110 (i.e., due to assembly error), and then through the second space S2 (as shown above). Figures 15-17(As shown) to achieve sealing. The battery 60 and the sound-generating device 30 are located on both sides of the insulating member 70, that is, the area where the sound-generating device 30 is provided is the first space S1.

[0154] In some examples, the inner wall of border 110 may have a protruding structure based on design requirements; for example, see [link to relevant documentation]. Figure 26 and Figure 27 , Figure 26 This is a partial structural diagram of another electronic device 01 provided in an embodiment of this application. Figure 27 for Figure 26 The image shows a cross-sectional view of the frame 110. A second protrusion 140 may be provided on the inner wall of the frame 110. This second protrusion 140 can be used to limit the movement of some components and provide support for the display screen 400. One end face of the aforementioned isolator 70 may be disposed opposite to the side wall of the second protrusion 140, and the other end face of the isolator 70 may be disposed opposite to the inner wall of the frame 110 (the opposite side inner wall). For example, the end of the isolator 70 and the second protrusion 140 may abut against each other; alternatively, there may be a gap between them, and a seal may be achieved through the aforementioned second space S2.

[0155] In addition, please continue to refer to Figure 26 and Figure 27 To limit the position of the battery 60, a partition 150 can be provided on the middle plate 120. The partition 150 divides the surface of the middle plate 120 into a first region 121 and a second region 122. The sound-emitting device 30 is disposed in the first region 121, and the battery 60 is disposed in the second region 122. In this structure, the partition 150 can define an area for placing the battery 60, so as to fix the battery 60 and prevent the battery 60 from moving.

[0156] In some other possible examples, see Figure 28 , Figure 28 This is a structural diagram of another partition portion 150 provided in an embodiment of this application. The partition portion 150 may include a first portion 151 and a second portion 152. The surface of the first portion 151 away from the middle plate 120 is flush with the surface of the frame 110, meaning the surface of the frame 110 and the first portion 151 are in the same plane, and this plane is parallel to the XY plane. Along the Z-axis, the thickness of the second portion 152 is less than the thickness of the first portion 151. That is, the first portion 151 can provide support for the display screen 400, and there is a gap between the second portion 152 and the display screen 400.

[0157] Among them, the first part 151 mentioned above can be used for Figure 27The display screen 400 shown forms a support, thereby further reducing the risk of the battery 60 being squeezed when the display screen 400 is pressed. The gap between the second part 152 and the display screen 400 can be used to install the aforementioned electrical connector 44, for example, an electrical connector 44 for connecting the battery 60 and the motherboard 40.

[0158] Therefore, the extension direction of the aforementioned isolation element 70 can be flexibly set according to requirements. For example, please refer to [link to relevant documentation]. Figure 28 A portion of the spacer 70 can extend along the X-axis, and a portion can extend along the Y-axis. One end of the spacer 70 is positioned opposite the inner wall of the frame 110, and the other end of the spacer 70 can be positioned opposite the side wall of the first portion 151 of the partition 150. For example, the two can abut against each other, or there can be a gap between them. Furthermore, the second space S2 can be provided between the end of the spacer 70 and the first portion 151 of the partition 150 to ensure sealing performance.

[0159] This will increase the usable area of ​​the motherboard 40 within the first space S1, allowing for the placement of more components to avoid wasting space on the motherboard 40. This will also improve the integration of components within the electronic device 01, thereby contributing to the thinner and lighter design of the electronic device 01.

[0160] It is understood that the extension direction of the aforementioned isolator 70 is not unique. The extension direction of the isolator 70 can also form a certain angle with the X-axis or Y-axis, that is, the isolator 70 can extend at an angle. Its specific extension direction can be flexibly changed based on the distribution of components on the motherboard 40. For example, the isolator 70 can be set in the gap between adjacent components on the motherboard 40, so that the isolator 70 will not affect the distribution of different components on the motherboard 40, which is beneficial for saving space.

[0161] In other embodiments, please refer to Figure 29 , Figure 29 This is an internal structural diagram of another middle frame 100 provided in an embodiment of this application. The middle frame 100 may be provided with two sound-emitting devices 30. One sound-emitting device 30 (referred to as the first sound-emitting device 30a) is provided at the top of the middle frame 100 along the Y-axis direction, and the other sound-emitting device 30 (referred to as the second sound-emitting device 30b) is provided at the bottom of the middle frame 100 along the Y-axis direction.

[0162] The first sound-generating device 30a can adopt the aforementioned open rear cavity structure, while the second sound-generating device 30b can adopt a closed rear cavity structure. Alternatively, both the first sound-generating device 30a and the second sound-generating device 30b can adopt the aforementioned open rear cavity structure.

[0163] For example, the battery 60 is provided with the aforementioned partition portion 150 on both sides along the Y-axis to limit the area for fixing the battery 60. That is, the two partition portions 150 on both sides of the battery 60 divide the middle plate 120 into a first region 121, a second region 122, and a third region 123 distributed sequentially along the Y-axis. The first sound-emitting device 30a and the main board 40 are disposed in the first region 121, the battery 60 is disposed in the second region 122, and the second sound-emitting device 30b is disposed in the third region 123.

[0164] The first region 121 and the second region 122 are respectively provided with the above-mentioned isolation member 70, that is, the first sound-emitting device 30a and the second sound-emitting device 30b are respectively isolated to form the corresponding first space S1, so that the first sound-emitting device 30a and the second sound-emitting device 30b both form the above-mentioned open rear cavity structure, and both are isolated from the battery 60 to avoid mutual interference.

[0165] It is understood that the structure of the isolation member 70 corresponding to the first sound-generating device 30a and the second sound-generating device 30b is the same as that in the above embodiment, and therefore will not be described again. Furthermore, a circuit board may also be provided in the second region 122, which can be electrically connected to the main board 40 through an electrical connector 44, and the electrical connector 44 extends through the second part 152 of the partition 150.

[0166] In another example, please see Figure 30 , Figure 30 This is a structural diagram of another partition 150 provided in an embodiment of this application. The partition 150 divides the middle plate 120 into a first region 121 and a second region 122, and the battery 60 is disposed in the second region 122. The first region 121 includes a first sub-region 121a and a second sub-region 121b. The first sub-region 121a and the second region 122 are distributed along the Y-axis direction, and the second sub-region 121b and the second region 122 are distributed along the X-axis direction.

[0167] When only one sound-emitting device 30 is provided, the sound-emitting device 30 can be disposed within the first sub-region 121a, and the isolator 70 can be disposed within the second sub-region 121b. This structure facilitates increasing the size of the first space S1, i.e., increasing the size of the open rear cavity of the sound-emitting device 30, thereby improving the sound quality of the sound-emitting device 30. Furthermore, it allows for an increase in the size of the motherboard 40, thereby increasing the usable area on the motherboard 40 to provide more space for component placement.

[0168] When two sound-generating devices 30 are provided (i.e., a first sound-generating device 30a and a second sound-generating device 30b), please refer to Figure 31 , Figure 31This is a structural diagram of another partition portion 150 provided in an embodiment of this application. The first region 121 may further include a third sub-region 121c, which is located on the side of the second region 122 away from the first sub-region 121a, i.e., the first sub-region 121a, the second region 122, and the third sub-region 121c are distributed sequentially along the Y-axis. The first sound-emitting device 30a may be disposed in the first sub-region 121a, the second sound-emitting device 30b may be disposed in the third sub-region 121c, and the main board 40 may extend from the first sub-region 121a into the third sub-region 121c.

[0169] It should be noted that, in the above Figure 27 , Figure 29 , Figure 30 as well as Figure 31 In the middle, the areas defined by the dashed lines correspond to the first region 121 (including the first sub-region 121a, the second sub-region 121b, and the third sub-region 121c) and the second region 122 formed by the partition 150 dividing the middle plate 120.

[0170] Furthermore, when both the first sound-emitting device 30a and the second sound-emitting device 30b adopt an open rear cavity, the aforementioned isolation member 70 is provided for the first sound-emitting device 30a and the second sound-emitting device 30b respectively, so as to form a first space S1 for the first sound-emitting device 30a and the second sound-emitting device 30b respectively. Also, along the Y-axis direction, the second portion 152 of the partition 150 is located between the two isolation members 70.

[0171] For example, please continue reading Figure 31 Both isolation members 70 can be disposed in the second sub-region 121b. Both isolation members 70 extend along the X-axis direction and are distributed along the Y-axis direction. The second part 152 of the partition 150 is located in the area between the two isolation members 70, so that the electrical connector 44 for connecting the battery 60 and the motherboard 40 can extend to both sides of the partition 150 through the second part 152, thereby realizing the electrical connection between the battery 60 and the motherboard 40.

[0172] Alternatively, only one of the two isolation elements 70 may be located within the second sub-region 121b. Or, neither of the two isolation elements 70 may be located within the second sub-region 121b, but rather within the first sub-region 121a and the third sub-region 121c, respectively. Therefore, this application does not impose any special limitations on the specific location of the two isolation elements 70.

[0173] Based on this, the aforementioned electronic device 01 includes two mid-frames 100, each of which can house at least one of the aforementioned sound-emitting devices 30. Each sound-emitting device 30 can employ the aforementioned open rear cavity structure, meaning that each sound-emitting device 30 is provided with the aforementioned isolation member 70 and isolation portion 800. Alternatively, some of the sound-emitting devices 30 can adopt the aforementioned open rear cavity structure, while others can adopt a closed rear cavity structure (e.g., Figure 21 (As shown). Therefore, this application does not impose any special limitations on this.

[0174] In other embodiments, the electronic device 01 may also include a plurality of mid-frames 100 and a plurality of... Figure 2 and Figure 3 The pivot mechanism 200 shown can be configured in two ways, for example, with three middle frames 100 and two pivot mechanisms 200. Each pair of adjacent middle frames 100 is rotatably connected by a pivot mechanism 200. Furthermore, when the electronic device 01 is in a folded state, the two middle frames 100 on either side can be located on either side of the middle middle frame 100 along the Z-axis, or the two middle frames 100 on either side can be located on the same side of the middle middle frame 100 along the Z-axis, and stacked on top of each other.

[0175] In this case, the aforementioned sound-generating device 30, along with corresponding isolation members 70 and isolation sections 800, can be installed within each of the multiple middle frames 100, with their specific structures and installation positions being the same as in the above embodiment. Therefore, this application does not impose any special limitations on the number, structure, or position of the sound-generating devices 30 installed within the multiple middle frames 100.

[0176] In other possible embodiments, the electronic device 01 provided in this application may also be a candybar phone, that is, the electronic device 01 is not foldable and has an approximately rectangular plate-like structure. Please refer to Figure 32 , Figure 32 An exploded view of another electronic device 01 provided in an embodiment of this application.

[0177] Specifically, the electronic device 01 includes the aforementioned mid-frame 100, battery cover 90, and display module 80. Both the battery cover 90 and display module 80 are stacked on top of the mid-plate 120 and fixedly connected to the frame 110. The mid-frame 100 may house the aforementioned sound-emitting device 30, motherboard 40, and battery 60. The sound-emitting device 30 can be located between the mid-plate 120 and the battery cover 90, or between the mid-plate 120 and the display module 80. There may be one sound-emitting device 30 or two sound-emitting devices.

[0178] When the sound-generating device 30 adopts the above-mentioned open rear cavity, the above-mentioned isolation member 70 and isolation section 800 are provided for the sound-generating device 30. Figure 32(Not shown in the text) Its specific structure is the same as that of the aforementioned embodiments. Therefore, this application will not repeat the description.

[0179] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0180] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: The application relates to an electronic device, comprising: a middle frame comprising a frame and a middle plate fixed in the frame; a sound device located on one side of the middle plate; a partition located on the same side of the middle plate as the sound device; the partition and the inner wall of the frame form a first space, and the sound device is located in the first space; a battery located on the same side of the middle plate as the partition and outside the first space; a main plate located on the same side of the middle plate as the battery and partially outside the first space.

2. The electronic device of claim 1, wherein, The partition comprises a first partition and a second partition; the first partition is arranged on the surface of the main plate away from the middle plate; and the second partition is arranged between the main plate and the middle plate.

3. The electronic device of claim 2, wherein, The end of the partition and the inner wall of the frame form a second space, and the second space is filled with sealing material.

4. The electronic device of claim 3, wherein, The end of the first partition and the inner wall of the frame form a first sub-space; the end of the second partition and the inner wall of the frame form a second sub-space; the edge of the main plate and the inner wall of the frame form a third sub-space; the first sub-space, the third sub-space and the second sub-space are sequentially arranged along the thickness direction of the electronic device and are in communication with each other to form the second space.

5. The electronic device of claim 4, wherein, The cross-sectional area of the first sub-space, the third sub-space and the second sub-space decreases in sequence along the direction from the main plate to the middle plate.

6. The electronic device of claim 5, wherein, The vertical projection of the first sub-space on the middle plate covers the vertical projection of the third sub-space on the middle plate, and the vertical projection of the third sub-space on the middle plate covers the vertical projection of the second sub-space on the middle plate.

7. The electronic device of claim 4, wherein, The cross-sectional area of the second sub-space, the third sub-space and the first sub-space decreases in sequence along the direction from the middle plate to the main plate; and an injection port is arranged on the middle plate and is in communication with the second space.

8. The electronic device of claim 7, wherein, The vertical projection of the second sub-space on the middle plate covers the vertical projection of the third sub-space on the middle plate, and the vertical projection of the third sub-space on the middle plate covers the vertical projection of the first sub-space on the middle plate.

9. The electronic device of any of claims 4-8, wherein, The side wall of the first sub-space formed by the first partition is a first side wall; the side wall of the second sub-space formed by the second partition is a second side wall; and the side wall of the third sub-space formed by the main plate is a third side wall. The partial area of the first side wall, the partial area of the second side wall and the partial area of the third side wall are flush with each other.

10. The electronic device of any of claims 3-9, wherein, A first groove is arranged on the end surface of the partition and extends along the thickness direction of the electronic device and penetrates through the two side surfaces of the partition; and the first groove and the inner wall of the frame form the second space.

11. The electronic device of any of claims 3-9, wherein, A first protrusion is arranged on the inner wall of the frame; a second protrusion is arranged on the end of the partition; the first protrusion is opposite to the end surface of the partition; the second protrusion is opposite to the inner wall of the frame; and the first protrusion and the second protrusion form the second space.

12. The electronic device of claim 2, wherein, At least one set of recesses and protrusions are arranged between the end of the isolation piece and the inner wall of the frame, one of the recesses and the protrusions is arranged on the isolation piece, and the other of the recesses and the protrusions is arranged on the frame, and the protrusion extends into the recess.

13. The electronic device of claim 12, wherein, The recesses and the protrusions are arranged in multiple sets, and the multiple sets of the recesses and the protrusions are distributed along the extension direction of the frame.

14. The electronic device of any of claims 2-13, wherein, The main plate comprises a plate body and a raised plate, the raised plate is arranged on the surface of the plate body, and the first isolation piece is arranged on the surface of the raised plate away from the plate body.

15. The electronic device of any of claims 2-14, wherein, The surface of the middle plate facing the main plate is provided with a first boss, and the second isolation piece is arranged between the first boss and the main plate.

16. The electronic device of any of claims 1-15, wherein, The electronic device further comprises an electrical connector, the electrical connector is located outside the first space, one end of the electrical connector is electrically connected to the region of the main plate located outside the first space, and the other end of the electrical connector is electrically connected to the components of the electronic device.

17. The electronic device of claim 16, wherein, The electronic device further comprises a main plate support, the main plate support is arranged on the side of the main plate away from the middle plate, and the electrical connector is arranged between the main plate and the main plate support; the isolation piece further comprises a third isolation piece, the third isolation piece is arranged on the side of the main plate support away from the main plate, and the first isolation piece abuts against the main plate support.

18. The electronic device of claim 17, wherein, The main plate support comprises a first sub-support and a second sub-support, the first isolation piece and the third isolation piece are respectively arranged on the two side surfaces of the first sub-support, and the electrical connector is arranged between the main plate and the second sub-support.

19. The electronic device of any of claims 1-18, wherein, The isolation piece extends along the width direction of the electronic device, and the end of the isolation piece is arranged opposite to the inner wall of the frame.

20. The electronic device of claim 19, wherein, A second boss is formed on the inner wall of the frame, one end of the isolation piece abuts against the inner wall of the frame, and the other end of the isolation piece is arranged opposite to the second boss.

21. The electronic device of any of claims 1-18, wherein, The middle plate is provided with a partitioning portion, the partitioning portion divides the middle plate into a first region and a second region, the sound generating device is arranged in the first region, and the battery is arranged in the second region. The partitioning portion comprises a first part and a second part, the surface of the first part away from the middle plate is flush with the surface of the frame, in the thickness direction of the electronic device, the thickness of the second part is smaller than the thickness of the first part, one end of the isolation piece is arranged opposite to the inner wall of the frame, the other end of the isolation piece is arranged opposite to the first part, and the second part is located outside the first space.

22. The electronic device of claim 21, wherein, The first region comprises a first sub-region and a second sub-region, the first sub-region and the second region are distributed along the length direction of the electronic device, and the second sub-region and the second region are distributed along the width direction of the electronic device; the sound generating device is arranged in the first sub-region, and the isolation piece is arranged in the second sub-region.

23. The electronic device of claim 22, wherein, The first region further comprises a third sub-region, and the third sub-region is arranged on the side of the second region away from the first sub-region. The third sub-region is provided with the sound generating device, the isolating piece is provided with two, along the length direction of the electronic device, the second part is located between the two isolating pieces.

24. The electronic device of any of claims 1-23, wherein, The middle plate is provided with a connecting hole in the first space; the electronic device further comprises an isolating part, which is arranged on the side of the middle plate away from the isolating piece; The isolating part and the inner wall of the frame form a third space; or the isolating part extends around the connecting hole to form the third space; in the plane parallel to the middle plate, the connecting hole is located in the third space, and the battery is located outside the area where the third space is located.

25. The electronic device of claim 24, wherein, The isolating part is foam, back glue, glue or rubber.

26. The electronic device of any of claims 1-25, wherein, The isolating piece is foam, back glue, glue or rubber.

27. The electronic device of any of claims 1-26, wherein, The electronic device further comprises a battery cover and a display module, the battery cover and the display module are respectively located on both sides of the middle plate, and the battery cover and the display module are respectively fixedly connected with the frame; The isolating piece abuts between the battery cover and the middle plate; or the isolating piece abuts between the display module and the middle plate.

28. The electronic device of any of claims 1-26, wherein, The electronic device further comprises a hinge mechanism, the middle frame is provided with a plurality of, and adjacent two middle frames are rotationally connected through a hinge mechanism; at least one middle frame is provided with the sound generating device and the isolating piece.

29. The electronic device of claim 28, wherein, The electronic device further comprises a rear cover, the rear cover is arranged on each middle frame, and the isolating piece abuts between the rear cover and the middle plate.

30. The electronic device of claim 28, wherein, The electronic device further comprises a display screen, the display screen is fixed on the middle frame provided with the isolating piece, and the isolating piece abuts between the display screen and the middle plate.

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