Frame assembly, camera module and electronic equipment

Abstract

The invention relates to a frame assembly, a camera module and electronic equipment. The frame assembly comprises a circuit board and a first support. The circuit board is used for arranging an image sensor of the camera module; the first support is arranged on the circuit board and is in heat conduction contact with the circuit board, the first support is used for surrounding an image sensor of the camera module, and the heat conduction efficiency of a material of the first support is higher than that of a plastic material. According to the frame assembly, the circuit board can quickly and efficiently conduct heat generated by the image sensor to the first support to be dissipated, the heat dissipation efficiency of the image sensor can be improved, the performance stability of the camera module is improved, and the service life of the camera module is prolonged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera, in particular to a frame assembly, a camera module and an electronic device. BACKGROUND

[0002] More and more electronic devices such as smart phones, tablet computers and electronic readers are provided with camera modules to realize the photographing function. In the camera module, an image sensor is usually arranged on a printed circuit board, and a plurality of supports are arranged on the printed circuit board, which can be used as mounting and bearing elements of a lens, an anti-shake driving mechanism or a filter. However, the heat dissipation efficiency of the conventional camera module for the image sensor is low, which affects the performance stability and service life of the camera module. SUMMARY

[0003] The embodiments of the present application provide a frame assembly, a camera module and an electronic device capable of improving the heat dissipation efficiency of the camera module for the image sensor, so as to solve the above technical problems.

[0004] A frame assembly comprises:

[0005] a circuit board for arranging an image sensor of a camera module; and

[0006] a first support arranged on the circuit board and in thermal contact with the circuit board, the first support being arranged around the image sensor of the camera module, and the thermal conductivity of the material of the first support being higher than that of plastic.

[0007] A camera module comprises an image sensor and the frame assembly as described above, and the image sensor is arranged on the circuit board.

[0008] An electronic device comprises the camera module as described above.

[0009] The frame assembly described above is in thermal contact with the circuit board for arranging the image sensor, and the material of the first support is improved to have a thermal conductivity higher than that of plastic, so that the circuit board can quickly and efficiently conduct the heat generated by the image sensor to the first support for dissipation, which is conducive to improving the heat dissipation efficiency of the image sensor and thus improving the performance stability and service life of the camera module. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0011] Figure 1 Structure diagram of an electronic device in some embodiments.

[0012] Figure 2 Structure diagram of a camera module in some embodiments.

[0013] Figure 3 Structure diagram of a camera module in some embodiments. Figure 2 Structure diagram of a camera module in some embodiments.

[0014] Figure 4 Structure diagram of a camera module in some embodiments.

[0015] Figure 5 Structure diagram of a camera module in some embodiments. Figure 4 Structure diagram of a camera module in some embodiments.

[0016] Figure 6 Structure diagram of a camera module in some embodiments. Figure 5 Structure diagram of a camera module in some embodiments.

[0017] Figure 7 Structure diagram of a camera module in some embodiments. Figure 5 Structure diagram of a camera module in some embodiments.

[0018] Figure 8 Structure diagram of a camera module in some embodiments. Figure 7 Structure diagram of a camera module in some embodiments.

[0019] Figure 9 Structure diagram of an electronic device in some embodiments.

[0020] Reference signs:

[0021] 10, electronic device; 11, middle frame; 12, display screen; 20, camera module; 21, lens; 22, image sensor; 23, magnetic element; 24, frame assembly; 241, circuit board; 242, first support; 2421, mounting portion; 2422, frame portion; 2423, box portion; 2424, hole structure; 2425, accommodating groove; 243, second support; 244, third support. DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0023] As used herein, "electronic device" refers to, but is not limited to, a device capable of receiving and / or transmitting communication signals connected via any one or more of the following connection methods:

[0024] (1) Via wired connection, such as via Public Switched Telephone Networks (PSTN), Digital Subscriber Line (DSL), digital cable, or direct cable connection;

[0025] (2) Via wireless interface, such as cellular network, wireless local area network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter.

[0026] An electronic device configured to communicate via a wireless interface can be referred to as a "mobile terminal". Examples of mobile terminals include, but are not limited to, the following electronic devices:

[0027] (1) Satellite phone or cellular phone;

[0028] (2) A Personal Communications System (PCS) terminal that can combine cellular radio telephone with data processing, fax and data communication capabilities;

[0029] (3) Radio telephone, pager, Internet / intranet access, web browser, notepad, calendar, personal digital assistant (PDA) equipped with a Global Positioning System (GPS) receiver;

[0030] (4) Conventional above-knee and / or palm-sized receivers;

[0031] (5) Conventional knee-mounted and / or handheld wireless telephone transceivers, etc.

[0032] In traditional camera modules that achieve optical image stabilization by moving the lens relative to the image sensor, the image sensor is typically mounted on a printed circuit board (PCB). Various brackets are mounted on the PCB to hold coils, magnets, filters, and lenses. These brackets are usually made of plastic and are connected to the PCB via a connecting structure, rather than being directly mounted on the PCB. This results in low heat conduction efficiency between the PCB and the brackets. Furthermore, the plastic brackets themselves have poor heat dissipation capabilities. The heat generated by the image sensor cannot be effectively dissipated through the plastic brackets, leading to low heat dissipation efficiency from the camera module to the image sensor, which affects the performance stability and lifespan of the image sensor.

[0033] To address the aforementioned issues, the present application provides a frame component, a camera module, and an electronic device in the following embodiments.

[0034] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 These are schematic diagrams illustrating the structures of the electronic device 10 and the camera module 20 in some embodiments. The electronic device 10 provided in this application includes, but is not limited to, any applicable electronic product such as a smartphone, tablet computer, or e-reader. The camera module 20 is disposed within the electronic device 10 to enable the electronic device 10 to perform a shooting function. In some embodiments, the electronic device 10 may include a mid-frame 11, a display screen 12, and a back panel. The display screen 12 and the back panel are respectively disposed on opposite sides of the mid-frame 11, and the display surface of the display screen 12 is exposed beyond the mid-frame 11 to perform a display function. The camera module 20 includes, but is not limited to, a front-facing camera or a rear-facing camera of the electronic device 10. Depending on the type of camera module 20, its placement within the electronic device 10 varies; the camera module 20 may be disposed on the back panel, on the mid-frame 11, or below the display screen 12.

[0035] Combination Figure 3 and Figure 4As shown, in some embodiments, the camera module 20 includes a lens 21, an image sensor 22, and a frame assembly 24. The lens 21 may include one or more lenses with optical power for collecting and adjusting light to improve the imaging quality of the camera module 20. The image sensor 22 includes, but is not limited to, a charge-coupled device (CCD) and a complementary metal-oxide-semiconductor (CMOS). The frame assembly 24 includes a circuit board 241 and a first support 242. The circuit board 241 may be a rigid-flex board, including a printed circuit board portion and a flexible circuit board portion combined with the printed circuit board. The image sensor 22 is fixedly disposed on the printed circuit board portion of the circuit board 241, and the first support 242 is fixedly disposed on the printed circuit board portion of the circuit board 241 and is disposed around the image sensor 22. The function and structural configuration of the first support 242 are not limited; for example, the first support 242 may serve as a support structure for the lens 21 or as the outermost structural component of the frame assembly 24. In some embodiments, the camera module 20 may also achieve optical image stabilization by using lens 21 stabilization. In this case, the camera module 20 further includes a driving mechanism consisting of a coil (not shown) and a magnetic element 23. The magnetic element 23 is fixed relative to the lens 21. The first bracket 242 serves as the mounting and support structure for the coil. The coil is mounted on the first bracket 242 and electrically connected to the printed circuit board portion of the circuit board 241 via a flexible circuit board to facilitate power supply and control of the coil. The coil and the magnetic element 23 work together to drive the lens 21 to shake relative to the image sensor 22 to achieve optical image stabilization. The flexible circuit board portion of the circuit board 241 is located outside the first bracket 242 and can extend outside the camera module 20 to electrically connect to components such as the motherboard or controller of the electronic device 10.

[0036] Furthermore, in some embodiments, the first bracket 242 is in thermally conductive contact with the circuit board 241, for example, it is disposed on and in thermally conductive contact with the printed circuit board portion of the circuit board 241. The thermal conductivity of the material of the first bracket 242 is higher than that of the plastic material. The aforementioned frame assembly 24 enables the first bracket 242 to be in thermally conductive contact with the circuit board 241 used to house the image sensor 22. At the same time, the material of the first bracket 242 is improved to make its thermal conductivity higher than that of the plastic material. This facilitates the circuit board 241 to quickly and efficiently conduct the heat generated by the image sensor 22 to the first bracket 242 for dissipation. In other words, the first bracket 242 and the circuit board 241 can work together as a whole to provide heat dissipation for the image sensor 22, which helps to improve the heat dissipation efficiency of the image sensor 22, thereby improving the performance stability and service life of the camera module 20.

[0037] The material of the first bracket 242 is not limited, as long as the thermal conductivity of the first bracket 242 is higher than that of traditional plastic brackets and it makes thermally conductive contact with the circuit board 241 to improve the heat dissipation efficiency of the image sensor 22. In some embodiments, the first bracket 242 is made of metal, which can effectively improve the heat dissipation efficiency. The material of the first bracket 242 includes, but is not limited to, any suitable metal material such as aluminum alloy, stainless steel, or iron.

[0038] Understandably, when the first bracket 242 is made of metal, it can be fabricated using 3D printing technology, allowing for greater freedom in its structure and layout to meet the more complex layout and heat dissipation requirements of the frame assembly 24 and the camera module 20. In some embodiments, the first bracket 242 is fabricated on the printed circuit board portion of the circuit board 241 using 3D printing technology. This improves the bonding strength between the first bracket 242 and the circuit board 241, enhances the structural reliability of the frame assembly 24, and also improves the thermal conductivity between the first bracket 242 and the circuit board 241, thereby further improving the heat dissipation performance of the frame assembly 24 for the image sensor 22.

[0039] In other embodiments, the frame assembly 24 may further include a thermally conductive element (not shown). The thermally conductive element is disposed between the circuit board 241 and the first support 242, with its opposite sides making thermal contact with both the circuit board 241 and the first support 242, ensuring that the circuit board 241 and the first support 242 are in thermal contact. The thermal conductivity of the thermally conductive element is greater than that of the circuit board 241 and the first support 242. By placing a thermally conductive element with higher thermal conductivity between the circuit board 241 and the first support 242, the thermal conductivity between the circuit board 241 and the first support 242 can be further improved, thereby further enhancing the heat dissipation efficiency of the frame assembly 24 for the image sensor 22. The thermally conductive element includes, but is not limited to, any element with good thermal conductivity, such as a graphite sheet, copper foil, liquid metal thermal pad, or thermally conductive silicone pad.

[0040] Combination Figure 5 , Figure 6 , Figure 7 and Figure 8 As shown, in some embodiments, at least a portion of the first bracket 242 is provided with a hole structure 2424 or a groove structure. For example, at least a portion of the first bracket 242 is provided with an array of hole structures 2424, or with one or more groove structures extending in a straight line or bending. Providing hole structures 2424 or groove structures within the first bracket 242 can increase the heat dissipation area of ​​the first bracket 242, thereby improving the heat dissipation efficiency of the first bracket 242 and further improving the heat dissipation efficiency of the frame assembly 24 for the image sensor 22. Figure 7 and Figure 8In the embodiment shown, the first support 242 is provided with an array of holes 2424 as an example.

[0041] In some embodiments, the first support 242 includes four sequentially connected frame portions 2423, thus the first support 242 is generally rectangular, and the image sensor 22 may be generally square. The four frame portions 2423 are respectively disposed on the four edges of the image sensor 22. At least one frame portion 2423 of the first support 242 is provided with a hole structure 2424 or a groove structure. The number of frame portions 2423 with hole structures 2424 or groove structures can be any number from 1 to 4. The more frame portions 2423 with hole structures 2424 or groove structures, the better the heat conduction efficiency of the first support 242 is improved. Conversely, the fewer frame portions 2423 with hole structures 2424 or groove structures, the better the heat conduction efficiency of the first support 242 is improved, while also taking into account the improvement of the structural strength of the first support 242 and reducing the design and manufacturing difficulty of the first support 242. When at least one frame portion 2423 is provided with a hole structure 2424, multiple hole structures 2424 can be arranged in an array on a plane parallel to the outer surface of the frame portion 2423 to make full use of the space of the frame portion 2423 and effectively improve the heat conduction efficiency.

[0042] In some embodiments, the pore structure 2424 or the groove structure is filled with a phase change material, which is capable of vaporizing when absorbing heat and liquefying when releasing heat. Thus, when the first support 242 absorbs heat conducted from the circuit board 241, at least a portion of the phase change material can absorb heat and vaporize, then transfer to a lower-temperature location within the pore structure 2424 or the groove structure and release heat to liquefy. This improves the heat conduction efficiency within the first support 242, thereby further enhancing the heat dissipation efficiency of the first support 242 for the image sensor 22. The phase change material includes, but is not limited to, any suitable medium such as water, Freon refrigerants, acetone, ethanol, or nanofluids.

[0043] In some embodiments, when at least one frame portion 2423 of the first bracket 242 is provided with a groove structure, at least a portion of one or more groove structures extends away from the circuit board 241 in the direction pointing from the first bracket 242. Thus, since the heat of the first bracket 242 is mainly conducted from the circuit board 241, the temperature of the portion of the first bracket 242 near the circuit board 241 is generally higher than the temperature of the portion away from the circuit board 241. The phase change material located within the groove structure can absorb heat and vaporize near the circuit board 241, then transfer along the groove structure to the portion away from the circuit board 241, releasing heat and liquefying, before flowing along the groove structure back to the position near the circuit board 241 to absorb heat and vaporize again. The combination of the groove structure arrangement with the layout of the first bracket 242 and the circuit board 241, and the characteristics of the phase change material, effectively improves the heat dissipation efficiency of the first bracket 242 for the image sensor 22.

[0044] Understandably, the use of metal material for the first support 242 makes the support suitable for 3D printing technology, thereby increasing the structural design freedom of the first support 242, reducing the difficulty of setting the hole structure 2424, groove structure and phase change material of the first support 242, and reducing the manufacturing difficulty of the frame component 24 while improving heat dissipation performance.

[0045] Please see again. Figure 5 and Figure 6 In some embodiments, the first bracket 242 includes a mounting portion 2421 and a frame portion 2422. The mounting portion 2421 is disposed on the printed circuit board portion of the circuit board 241 and is in thermally conductive contact with the circuit board 241. The frame portion 2422 is connected to the side of the mounting portion 2421 facing away from the circuit board 241. When the first bracket 242 includes four sequentially connected frame portions 2423, the frame portion 2422 can be considered to be composed of the four frame portions 2423. The projected area of ​​the mounting portion 2421 on the circuit board 241 is larger than that of the frame portion 2422. The mounting portion 2421 can be generally flat, and the radial dimension of the mounting portion 2421 is larger than that of the frame portion 2422. Providing a mounting portion 2421 with a larger coverage area in thermally conductive contact with the circuit board 241 on the first bracket 242 is beneficial to improving the heat conduction efficiency between the first bracket 242 and the circuit board 241, thereby further improving the heat dissipation efficiency of the frame assembly 24 for the image sensor 22.

[0046] In some embodiments, when the first bracket 242 is used to mount the coils in the drive mechanism of the camera module 20, the camera module 20 may be provided with at least two drive mechanisms. These at least two drive mechanisms are respectively used to drive the lens 21 to move relative to the first bracket 242 in two mutually perpendicular directions to achieve optical image stabilization. These two mutually perpendicular directions can be two mutually perpendicular directions on the plane of the circuit board 241 where the image sensor 22 is located. At least two frame portions 2423 are provided with receiving slots 2425, and the coils of at least two drive mechanisms are correspondingly housed within the receiving slots 2425 of the frame portions 2423. Additionally, at least one frame portion 2423 is provided with a hole structure 2424 or a slot structure.

[0047] For example, in Figure 4 and Figure 5 In the illustrated embodiment, taking the example of three frame portions 2423 having receiving slots 2425, and another frame portion 2423 having a hole structure 2424 or a slot structure, there are three driving mechanisms. Three coils are correspondingly located within the three receiving slots 2425. Two coils are opposite each other and located on opposite sides of the lens 21, used to drive the lens 21 to shake in one direction, and the other coil is used to drive the lens 21 to shake in another direction perpendicular to it. By providing receiving slots 2425 and hole structures 2424 or slot structures on different frame portions 2423, the receiving slots 2425 and hole structures 2424 or slot structures do not interfere with each other. This also helps to balance the placement of the hole structures 2424 or slot structures and the receiving slots 2425, improving heat dissipation performance while optimizing the layout of the camera module 20, which is beneficial for reducing the size of the camera module 20 and thus facilitating miniaturization.

[0048] Please see again. Figure 4In some embodiments, the frame assembly 24 may further include a second bracket 243, which is disposed on the circuit board 241 and surrounded by the first bracket 242, with the second bracket 243 in thermally conductive contact with the circuit board 241. The camera module 20 also includes a filter (not shown) disposed on the second bracket 243. The filter is disposed on the lens 21 and the image sensor 22 and is used to filter out interference light to improve the imaging quality of the camera module 20. The filter includes, but is not limited to, an infrared filter element. The thermal conductivity of the material of the second bracket 243 is higher than that of plastic. The material of the second bracket 243 includes, but is not limited to, metal. The second bracket 243 may also be fabricated by 3D printing. The specific material and fabrication method of the second bracket 243 can be obtained with reference to the first bracket 242. The thermal contact method between the second bracket 243 and the circuit board 241 can also be obtained with reference to the first bracket 242. The second bracket 243, used to mount the filter, is also configured to make thermal contact with the circuit board 241. At the same time, the material of the second bracket 243 is improved to make its heat conduction efficiency higher than that of the traditional plastic bracket. This is beneficial for the circuit board 241 to conduct the heat of the image sensor 22 to the second bracket 243 and dissipate it through the second bracket 243. In other words, the circuit board 241, the first bracket 242 and the second bracket 243 work together as a whole to dissipate heat from the image sensor 22, which is beneficial to further improve the heat dissipation efficiency of the frame assembly 24 for the image sensor 22.

[0049] When the camera module 20 is equipped with a drive mechanism and uses lens 21 for image stabilization, the frame assembly 24 also includes a third bracket 244. The third bracket 244 is located on the side of the second bracket 243 facing away from the circuit board 241 and is surrounded by the first bracket 242. The lens 21 is fixedly mounted on the third bracket 244, and the magnetic element 23 of the drive mechanism is mounted on the third bracket 244 and is arranged opposite to the coil. The magnetic element 23 includes, but is not limited to, any suitable magnetic structure such as a magnet or permanent magnet. It is understood that when the direction and / or magnitude of the current applied to the coil changes, the magnetic force between the coil and the magnetic element 23 changes, which can drive the third bracket 244 to cause the lens 21 to shake relative to the first bracket 242 and the image sensor 22 in two mutually perpendicular directions to achieve optical image stabilization.

[0050] It should be noted that in the above embodiments, the camera module 20 achieves optical image stabilization by driving the lens 21 to shake, i.e., it uses lens 21 for image stabilization. In other embodiments, the frame assembly 24 involved in this application can also be applied to the camera module 20 that uses image sensor 22 for image stabilization. For example, the image sensor 22 is mounted on the circuit board 241 via a bracket, or the printed circuit board 241 of the circuit board 241 includes two parts that can shake with each other, and the two parts are connected to each other by elastic elements such as elastic cantilever arms. The image sensor 22 is disposed in one of the parts, as long as thermal contact between the image sensor 22 and the circuit board 241 can be achieved. In this embodiment, the first bracket 242 can be a support structure for the lens 21, a support structure for the driving mechanism of the image sensor 22, or the outermost structural component of the frame assembly 24. The circuit board 241 can conduct the heat generated by the image sensor 22 to the first bracket 242, which also helps to improve the heat dissipation efficiency of the frame assembly 24 for the image sensor 22.

[0051] refer to Figure 9 , Figure 9 This is a schematic diagram of the structure of an electronic device 10 provided in an embodiment of this application. The electronic device 10 may include a radio frequency (RF) circuit 501, a memory 502 including one or more computer-readable storage media, an input unit 503, a display unit 504, a sensor 505, an audio circuit 506, a wireless Fidelity (WiFi) module 507, a processor 508 including one or more processing cores, and a power supply 509, among other components. Those skilled in the art will understand that... Figure 9 The structure of the electronic device 10 shown does not constitute a limitation on the electronic device 10. It may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0052] The radio frequency (RF) circuit 501 can be used to send and receive information, or to receive and send signals during a call. Specifically, it receives downlink information from the base station and hands it over to one or more processors 508 for processing; additionally, it sends uplink data to the base station. Typically, the RF circuit 501 includes, but is not limited to, an antenna, at least one amplifier, a tuner, one or more oscillators, a Subscriber Identity Module (SIM) card, a transceiver, a coupler, a low-noise amplifier (LNA), a duplexer, etc. Furthermore, the RF circuit 501 can also communicate wirelessly with networks and other devices. This wireless communication can use any communication standard or protocol, including but not limited to GSM, GPRS, CDMA, WCDMA, LTE, email, and SMS.

[0053] Memory 502 can be used to store applications and data. The applications stored in memory 502 contain executable code. Applications can be composed of various functional modules. Processor 508 executes various functional applications and data processing by running the applications stored in memory 502. Memory 502 may primarily include a program storage area and a data storage area. The program storage area may store the operating system, applications required for at least one function (such as sound playback, image playback, etc.), etc.; the data storage area may store data created based on the use of electronic device 10 (such as audio data, phonebook, etc.). Furthermore, memory 502 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, memory 502 may also include a memory controller to provide access to memory 502 for processor 508 and input unit 503.

[0054] Input unit 503 can be used to receive input numbers, character information, or user characteristic information (such as fingerprints), and to generate keyboard, mouse, joystick, optical, or trackball signal inputs related to user settings and function control. Specifically, in one embodiment, input unit 503 may include a touch-sensitive surface and other input devices. The touch-sensitive surface, also known as a touch display or touchpad, can collect user touch operations on or near it (such as user operations using fingers, styluses, or any suitable object or accessory on or near the touch-sensitive surface) and drive corresponding connection devices according to a pre-set program. Optionally, the touch-sensitive surface may include a touch detection device and a touch controller. The touch detection device detects the user's touch orientation and the signal generated by the touch operation, transmitting the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, sends it to the processor 508, and can receive and execute commands from the processor 508.

[0055] Display unit 504 can be used to display information input by the user or information provided to the user, as well as various graphical user interfaces of electronic device 10. These graphical user interfaces can be composed of graphics, text, icons, video, and any combination thereof. Display unit 504 may include a display panel. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD), organic light-emitting diode (OLED), etc. Further, a touch-sensitive surface can cover the display panel. When the touch-sensitive surface detects a touch operation on or near it, it transmits the information to processor 508 to determine the type of touch event. Subsequently, processor 508 provides corresponding visual output on the display panel according to the type of touch event. Although in Figure 9 In this context, the touch-sensitive surface and the display panel are two separate components for implementing input and output functions. However, in some embodiments, the touch-sensitive surface and the display panel can be integrated to achieve both input and output functions.

[0056] The electronic device 10 may also include at least one sensor 505, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor may include an ambient light sensor and a proximity sensor. The ambient light sensor can adjust the brightness of the display panel according to the ambient light level, and the proximity sensor can turn off the display panel and / or backlight when the electronic device 10 is moved to the ear. As a type of motion sensor, a gravity acceleration sensor can detect the magnitude of acceleration in various directions (generally three axes). When stationary, it can detect the magnitude and direction of gravity and can be used for applications that recognize the phone's posture (such as landscape / portrait switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer, tapping), etc. Other sensors that may be configured in the electronic device 10, such as gyroscopes, barometers, hygrometers, thermometers, and infrared sensors, will not be described in detail here.

[0057] Audio circuit 506 provides an audio interface between the user and electronic device 10 via a speaker and microphone. Audio circuit 506 converts received audio data into electrical signals, transmits them to the speaker, and the speaker outputs them as sound signals. Conversely, the microphone converts collected sound signals into electrical signals, which are then received by audio circuit 506, converted back into audio data, and processed by processor 508. The audio data is then transmitted via radio frequency circuit 501 to, for example, another electronic device 10, or output to memory 502 for further processing. Audio circuit 506 may also include a headphone jack to facilitate communication between peripheral headphones and electronic device 10.

[0058] WiFi (Wireless Fidelity) is a short-range wireless transmission technology. Electronic device 10, through WiFi module 507, can help users send and receive emails, browse web pages, and access streaming media, providing users with wireless broadband internet access. Although Figure 9 The wireless fidelity module 507 is shown, but it is understood that it is not a necessary component of the electronic device 10 and can be omitted as needed without changing the nature of the invention.

[0059] The processor 508 is the control center of the electronic device 10. It connects various parts of the electronic device 10 via various interfaces and lines. By running or executing applications stored in the memory 502 and calling data stored in the memory 502, it performs various functions and processes data of the electronic device 10, thereby providing overall monitoring of the electronic device 10. Optionally, the processor 508 may include one or more processing cores; preferably, the processor 508 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 508.

[0060] The electronic device 10 also includes a power supply 509 that supplies power to the various components. Preferably, the power supply 509 can be logically connected to the processor 508 through a power management system, thereby enabling functions such as charging, discharging, and power consumption management through the power management system. The power supply 509 may also include one or more DC or AC power supplies, recharging systems, power fault detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0061] although Figure 9 As not shown in the diagram, the electronic device 10 may also include a Bluetooth module, etc., which will not be described in detail here. In specific implementation, the above modules can be implemented as independent entities, or they can be arbitrarily combined and implemented as the same or several entities. For the specific implementation of the above modules, please refer to the previous method embodiments, which will not be described in detail here.

[0062] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A frame assembly, characterized by The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module.

2. The frame assembly of claim 1, wherein, The application relates to a camera module.

3. The frame assembly of claim 2, wherein, The application relates to a camera module.

4. The frame assembly of claim 1, wherein, The application relates to a camera module.

5. The frame assembly of claim 4, wherein, The application relates to a camera module.

6. The frame assembly of claim 4, wherein, The application relates to a camera module.

7. The frame assembly of claim 4, wherein, The application relates to a camera module.

8. The frame assembly of claim 4, wherein, The application relates to a camera module.

9. Frame assembly according to any of claims 1-8, characterized in that The application relates to a camera module.

10. Frame assembly according to any of claims 1-8, characterized in that The application relates to a camera module.

11. The frame assembly of claim 10, wherein, The application relates to a camera module.

12. Frame assembly according to any of claims 1-8, characterized in that The application relates to a camera module.

13. An image capture module, comprising: The application relates to a camera module.

14. An electronic device, comprising: The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. The application relates to a camera module. 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