Electronic control unit and control method thereof

Abstract

An electronic control unit may include: a cooling jacket disposed between a top case and a bottom case; a first plate on which a first semiconductor device in thermal contact with the bottom surface of the cooling jacket is mounted; a second plate on which a second semiconductor device in thermal contact with the bottom surface of the cooling jacket is mounted; a third plate on which a third semiconductor device in thermal contact with the top surface of the cooling jacket and the top case, respectively, is mounted; a control board in thermal contact with the bottom case; and a thermoelectric element having a cold side in thermal contact with the top surface of the cooling jacket and a hot side in thermal contact with the top housing. According to the invention, the heat of at least one semiconductor device can be effectively and reliably dissipated.

Description

Technical Field

[0001] This invention relates to an electronic control unit and a method for controlling the electronic control unit. Background Technology

[0002] Components installed within a vehicle may include engine control components (or motor control components), power transmission components, braking components, suspension components, steering components, instrument components, and information and communication control components.

[0003] An electronic control unit (ECU) is a control device that controls and manages the main components of a vehicle. Multiple ECUs are installed in the vehicle to control each component.

[0004] Electronic control units may include electronic control units with built-in chips for autonomous driving or installed in vehicle infotainment (software or media that adds entertainment to the transmission of information). Such electronic control units preferably have the chip or the substrate (control board) on which the chip is located properly cooled to cope with overheating of the chip.

[0005] An example of a cooling electronic control unit is an electronic module disclosed in U.S. Patent Publication No. 5323292 A (issued June 21, 1994), which discloses that the electronic module includes an aluminum heat sink surrounding an integrated circuit chip and a substrate, the heat sink including parallel fins that provide a larger surface area to dissipate heat to the surrounding atmosphere.

[0006] Patent documents

[0007] U.S. Authorized Patent Publication US 5323292 A (Authorized June 21, 1994) Summary of the Invention

[0008] The present invention provides an electronic control unit and a control method thereof, which can effectively and reliably dissipate heat from at least one semiconductor device even when the main cooling device is malfunctioning, that is, even when the main cooling device is in an abnormal state of its cooling operation.

[0009] The present invention provides an electronic control unit and a method thereof, wherein the electronic control unit is capable of effectively dissipating heat from at least one semiconductor device by means of a combination of cooling water and thermoelectric elements.

[0010] The electronic control unit of the present invention may include: a cooling jacket disposed between a top housing and a bottom housing, through which cooling water can flow; at least one plate on which a semiconductor device is mounted in thermal contact with the top and / or bottom surface of the cooling jacket; a control board disposed in the space formed by the top and bottom housings; a thermoelectric element, the cold side of which is in thermal contact with the top or bottom surface of the cooling jacket; and a valve for closing or opening a cooling water inlet and / or a cooling water outlet of the cooling jacket. In response to an abnormal state of the cooling jacket, the valve is configured to close the cooling water inlet and / or the cooling water outlet, and the thermoelectric element is configured to operate to cool the cooling jacket.

[0011] The electronic control unit may also include a temperature sensor configured to detect the temperature of at least one of the semiconductor device, at least one plate, and the cooling jacket. An abnormal state of the cooling jacket can be determined based on the detected temperature. Alternatively, the electronic control unit may include a sensor for measuring the flow rate of cooling water in or flowing into the cooling jacket. An abnormal state of the cooling jacket can be determined based on the measured flow rate.

[0012] Preferably, the temperature sensor can be configured to detect the temperature of the semiconductor device.

[0013] Preferably, the abnormal state of the cooling jacket can be the state when the detected temperature is equal to or higher than a preset temperature.

[0014] At least one plate may include at least one of the following: i) a first plate on which a first semiconductor device is mounted in thermal contact with the bottom surface of the cooling sleeve; ii) a second plate on which a second semiconductor device is mounted in thermal contact with the bottom surface of the cooling sleeve; iii) a third plate on which a third semiconductor device is mounted in thermal contact with the top surface of the cooling sleeve.

[0015] The control panel can be configured to make thermal contact with the top or bottom housing.

[0016] Preferably, the hot side of the thermoelectric element can be in thermal contact with the top housing, bottom housing, or ambient case.

[0017] Preferably, the valve can be configured to close the cooling water inlet of the cooling jacket.

[0018] The electronic control unit may further include: a first thermal interface material disposed between the top surface of the first semiconductor device and the bottom surface of the cooling sleeve when at least one plate includes a first plate; a second thermal interface material disposed between the top surface of the second semiconductor device and the bottom surface of the cooling sleeve when at least one plate includes a second plate; and / or a third thermal interface material disposed between the bottom surface of the third semiconductor device and the top surface of the cooling sleeve when at least one plate includes a third plate.

[0019] At least one of the first semiconductor device and the second semiconductor device may include a system-on-a-chip.

[0020] The third semiconductor device may include a neural network processing device.

[0021] The first board can be connected to the control board via the first connector, and the second board can be connected to the control board via the second connector.

[0022] The third board can be connected to the control board via wiring harnesses and cables.

[0023] The third plate can be fastened to the top housing.

[0024] The control panel can be secured to the bottom housing.

[0025] The top housing may include: a top body having an opening; and a heat dissipation member disposed in the opening and having heat dissipation fins.

[0026] The heat dissipation components can make thermal contact with the hot side.

[0027] The top housing may also include a heat insulation component disposed between the top body and the heat dissipation component.

[0028] The top housing may also include fastening components that combine heat dissipation components, heat insulation components, and the top body.

[0029] Valves and thermoelectric elements can be linked and activated in response to functional failures of the water-cooled circulation system connected to the cooling jacket.

[0030] The electronic control unit may also include a secondary thermoelectric element, the secondary cold side of which is in thermal contact with the side of the cooling jacket, and the secondary hot side of which is in thermal contact with the top housing or the bottom housing.

[0031] The top housing may have protruding ribs that make thermal contact with the secondary thermoelectric element's secondary heating side.

[0032] The first semiconductor device can be placed closer to the thermoelectric element in both the thermoelectric element and the auxiliary thermoelectric element.

[0033] The second and third semiconductor devices can be placed closer to the secondary thermoelectric element in the thermoelectric element and the secondary thermoelectric element.

[0034] The first semiconductor device may include a first temperature sensor; the second semiconductor device may include a second temperature sensor; and / or the third semiconductor device may include a third temperature sensor. In other words, the temperature sensor may include at least one of the first temperature sensor, the second temperature sensor, and the third temperature sensor.

[0035] The electronic control unit may also include a microcontroller configured to control the operation of valves and thermoelectric elements in response to signals corresponding to abnormal states of the cooling jacket.

[0036] The microcontroller unit can control thermoelectric elements, auxiliary thermoelectric elements, and valves based on the temperature sensor readings.

[0037] If the temperature sensed by the first temperature sensor is above the first set temperature, the microcontroller can apply voltage to the thermoelectric element and control the valve to switch to a closed mode that shuts off the cooling water inlet.

[0038] If the temperature sensed by the second temperature sensor is above the second set temperature or the temperature sensed by the third temperature sensor is above the third set temperature, the microcontroller can apply voltage to the auxiliary thermoelectric element, and the control valve will switch to the closed mode to close the cooling water inlet.

[0039] If the temperature sensed by the first temperature sensor is lower than the first set temperature, the microcontroller can stop applying voltage to the thermoelectric element and control the valve to switch to the open mode that opens the cooling water inlet.

[0040] If the temperature sensed by the second temperature sensor is lower than the second set temperature and the temperature sensed by the third temperature sensor is lower than the third set temperature, the microcontroller will not apply voltage to the auxiliary thermoelectric element, and the control valve will switch to the open mode to open the cooling water inlet.

[0041] The present invention also provides a method for controlling the above-mentioned electronic control unit, comprising: detecting an abnormal state of the cooling jacket or receiving a signal from an external device indicating an abnormal state of the cooling jacket; and, in response to the detection or the receipt, operating a valve to prevent cooling water from flowing into the cooling jacket and operating a thermoelectric element to cool the cooling jacket.

[0042] According to the present invention, the heat of at least one semiconductor device can be reliably and effectively dissipated by the cooling jacket and thermoelectric element.

[0043] In addition, since the heat of at least one semiconductor device can be dissipated through the cooling water of the cooling jacket or the top shell and the heat of the control board can be dissipated through the bottom shell, the heat of at least one semiconductor device and the heat of the control board can be dissipated rapidly.

[0044] In addition, since the first and second semiconductor devices, including the system-on-a-chip, can make thermal contact with the bottom surface of the cooling jacket, and the third semiconductor device, including the neural network processing device, can make thermal contact with the top surface of the cooling jacket, the heat transfer between the top and bottom surfaces of the cooling jacket can be kept balanced, and the cooling jacket can quickly dissipate heat from all three semiconductor devices.

[0045] In addition, the first and second boards, which are close to the control board, can be connected to the control board via connectors, while the third board, which is far from the control board, can be connected to the control board via wire harnesses, thereby minimizing the number of wire harnesses.

[0046] Additionally, the top housing may include: a top body having an opening; a heat dissipation member disposed in the opening and having heat dissipation fins; and the top housing may also include a heat insulation member disposed between the top body and the heat dissipation member, thereby minimizing the transfer of heat absorbed from the thermoelectric element to the third plate and minimizing overheating of the third plate.

[0047] In addition, since the fastening components can be combined with heat dissipation components, heat insulation components, and the top body, the number of fastening components that can be used to combine heat dissipation components, heat insulation components, and the top body can be minimized.

[0048] In addition, multiple areas of the cooling jacket can be rapidly cooled by utilizing a thermoelectric element that is in thermal contact with the top surface of the cooling jacket on the cold side and a secondary thermoelectric element that is in thermal contact with the side surface of the cooling jacket on the secondary cold side.

[0049] Furthermore, since the first semiconductor device is close to the thermoelectric element, and the second and third semiconductor devices are even closer to the auxiliary thermoelectric element, when a portion of the first, second, and third semiconductor devices overheats, power consumption can be minimized by activating only one of the thermoelectric element and the auxiliary thermoelectric element.

[0050] In addition, since the heat of the semiconductor device can be dissipated by the cooling water of the cooling jacket, and the thermoelectric element can dissipate heat of the semiconductor device by cooling the cooling jacket when at least one of the semiconductor devices is overheated, the power consumption of the thermoelectric element can be minimized.

[0051] In addition, since the valve can close the cooling water inlet and prevent cooling water from flowing into the cooling jacket when the thermoelectric element or auxiliary thermoelectric element absorbs heat from the cooling jacket, the inefficiency caused by high-temperature cooling water can be minimized. Attached Figure Description

[0052] Figure 1 This is a perspective view of an example of the electronic control unit of this embodiment.

[0053] Figure 2 This is a diagram showing the interior of an example of the electronic control unit of this embodiment.

[0054] Figure 3 This is an exploded perspective view of an example of the electronic control unit of this embodiment.

[0055] Figure 4 This diagram illustrates an example of the electronic control unit of this embodiment being cooled by a water-cooled circulation system.

[0056] Figure 5 This is a control block diagram of an example of the electronic control unit in this embodiment.

[0057] Figure 6 This is a flowchart of an example of the electronic control unit in this embodiment.

[0058] Figure 7 This is a cross-sectional view of another example of the electronic control unit in this embodiment.

[0059] Figure 8 This is a control block diagram of another example of the electronic control unit in this embodiment.

[0060] Explanation of reference numerals in the attached figures

[0061] 2: Cooling jacket 3: First plate

[0062] 4: Second board 5: Third board

[0063] 6: Control board 7: Thermoelectric element

[0064] 11; Top shell 12; Bottom shell

[0065] 71: Cold side 72: Hot side Detailed Implementation

[0066] Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0067] Figure 1 This is a perspective view of an example of the electronic control unit of this embodiment. Figure 2 This is a diagram showing the interior of an example of the electronic control unit of this embodiment. Figure 3 This is an exploded perspective view of an example of the electronic control unit of this embodiment.

[0068] The electronic control unit of this embodiment may include a cover 1, a cooling jacket 2, at least one plate, a control board 6, and a thermoelectric element 7. The at least one plate may include a first plate 3, a second plate 4, and a third plate 5.

[0069] The cover 1 can form the appearance of the electronic control unit.

[0070] An internal space S can be formed inside the housing 1. Various components constituting the electronic control unit can be accommodated in the internal space S.

[0071] Cooling jacket 2, first plate 3, second plate 4, third plate 5, control plate 6, thermoelectric element 7, auxiliary thermoelectric element 10, etc. can be accommodated in the internal space S and can be protected by the cover 1.

[0072] The cover 1 can be composed of a combination of multiple components.

[0073] The cover 1 may include a top housing 11 and a bottom housing 12.

[0074] The top housing 11 can form the top surface appearance of the electronic control unit. The bottom surface of the top housing 11 can be open. The top housing 11 may include an upper body 11a and a peripheral body 11b protruding from the body 11a.

[0075] The top housing 11 can be made of aluminum and can function as a heat sink.

[0076] Heat from at least one of the first plate 3, the second plate 4, and the third plate 5 can be transferred to the top shell 11, and the top shell 11 can dissipate the heat transferred from at least one of the first plate 3, the second plate 4, and the third plate 5 to the outside.

[0077] The bottom housing 12 can form the bottom surface of the electronic control unit. The top surface of the bottom housing 12 can be open. The bottom housing 12 may include a lower body 12a and a peripheral body 12b protruding from the lower body 12a.

[0078] The bottom housing 12 can be made of aluminum and can function as a heat sink.

[0079] The heat from the control board 6 can be transferred to the bottom housing 12, which can then dissipate the heat transferred from the control board 6 to the outside. Alternatively, if the control board 6 is positioned between the cooling jacket 2 and the top housing 11, it can be configured to transfer its heat to the top housing 11.

[0080] An example of the housing 1 may include a top housing 11 and a bottom housing 12, and may also include a frame 13 disposed between the top housing 11 and the bottom housing 12.

[0081] The frame 13 may include the surrounding main body 13a.

[0082] An example of frame 13 may be an intermediate shell configured between top shell 11 and bottom shell 12.

[0083] The peripheral body 13a of the frame 13 in one example may be located between the peripheral body 11b of the top housing 11 and the peripheral body 12b of the bottom housing 12, or it may be located between the peripheral body 2c of the cooling jacket 2 and the peripheral body 12b of the bottom housing 12. The peripheral body 13a may form the peripheral appearance of the electronic control unit.

[0084] Another example of frame 13 is that the entire frame 13 can be accommodated within the interior space S.

[0085] The frame 13 can form a mounting body 13b for mounting the cooling sleeve 2, and the frame 13 can support the cooling sleeve 2.

[0086] The frame 13 can be fastened to the top housing 11 from the underside. The frame 13 can be fastened to the top housing 11 by fastening members 13c such as screws or hooks.

[0087] Another example of the cover 1 may be one that does not include the frame 13, but includes a top shell 11 and a bottom shell 12. Another example of the cover 1 is one that includes a top shell 11 and a bottom shell 12, and the top shell 11 and the bottom shell 12 may be fastened by fastening members such as screws or hooks.

[0088] The cooling jacket 2 can be accommodated in the internal space S.

[0089] A cooling water flow path 21 can be formed inside the cooling jacket 2 for the flow of cooling water such as water supply.

[0090] The cooling jacket 2 may include an upper cooling plate 22 and a lower cooling plate 23 disposed on the lower side of the upper cooling plate 22, and a cooling water flow path 21 may be formed between the upper cooling plate 22 and the lower cooling plate 23.

[0091] The top surface of the upper cooling plate 22 can be the top surface 2a of the cooling sleeve 2.

[0092] The bottom surface of the lower cooling plate 23 can be the bottom surface 2b of the cooling sleeve 2.

[0093] The top surface 2a and the bottom surface 2b of the cooling jacket 2 can be heat-absorbing surfaces that absorb heat from the semiconductor device.

[0094] Either the top surface 2a or the bottom surface 2b of the cooling jacket 2 can be a heat dissipation surface that transfers heat to the thermoelectric element 7.

[0095] The cooling jacket 2 may include a peripheral body 2c that is exposed to the outside.

[0096] At least one of the upper cooling plate 22 and the lower cooling plate 23 can form the peripheral body 2c of the cooling sleeve 2.

[0097] A cooling water inlet 24 can be formed in the cooling jacket 2 to guide cooling water to the cooling water flow path 21. The cooling water inlet 24 can be protruding from one side of the cooling jacket 2. The cooling water inlet 24 can also be formed protruding from the peripheral body 2c of the cooling jacket 2.

[0098] A cooling water outlet 25 can be formed in the cooling jacket 2 to guide the cooling water passing through the cooling water flow path 21. The cooling water outlet 25 can be protruding from one side of the cooling jacket 2. The cooling water outlet 25 can also be formed protruding from the peripheral body 2c of the cooling jacket 2. The cooling water outlet 25 can be formed parallel to the cooling water inlet 24.

[0099] At least one of the cooling jacket 2 and the frame 13 can be fastened to the top housing 11 by fastening members 26 such as screws.

[0100] The first plate 3, the second plate 4, the third plate 5, and the thermoelectric element 7 can be distributed on the top surface 2a and the bottom surface 2b of the cooling jacket 2.

[0101] For example, when the first plate 3 and the second plate 4 are disposed on the bottom surface 2b of the cooling sleeve 2, the third plate 5 and the thermoelectric element 7 can be disposed on the top surface 2a of the cooling sleeve 2.

[0102] Conversely, when the first plate 3 and the second plate 4 are disposed on the top surface 2a of the cooling sleeve 2, the third plate 5 and the thermoelectric element 7 can be disposed on the bottom surface 2b of the cooling sleeve 2.

[0103] A first semiconductor device 31 can be mounted on the first plate 3. The first semiconductor device 31 can be mounted on the top surface of the first plate 3.

[0104] The first semiconductor device 31 can be in thermal contact with the bottom surface 2b of the cooling sleeve 2, and the heat of the first semiconductor device 31 can be transferred to the bottom surface 2b of the cooling sleeve 2.

[0105] An example of the first semiconductor device 31 may be a system-on-chip (SoC) mounted on the first board 3.

[0106] An example of the first semiconductor device 31 may be a semiconductor chip that performs autonomous driving for a vehicle.

[0107] The electronic control unit may include a first thermal interface material 32.

[0108] The first thermal interface material 32 can be disposed between the top surface of the first semiconductor device 31 and the bottom surface 2b of the cooling jacket 2. Examples of the first thermal interface material 32 can be a thermally conductive pad or a thermally conductive tape.

[0109] The first plate 3 can be fastened to the cooling sleeve 2 or the frame 13. The first plate 3 can be fastened to the cooling sleeve 2 or the frame 13 by fastening components such as screws.

[0110] The first plate 3 can be fastened to the cooling sleeve 2 or the frame 13 on the lower side of the cooling sleeve 2 by fastening components 33 such as screws.

[0111] The first board 3 can be connected to the control board 6 via a connector. An example of a connector could be a B2B connector (Board-to-board Connector) with both female and male heads.

[0112] The first board 3 can be connected to the control board 6 via the first connector 34.

[0113] A second semiconductor device 41 can be formed on the second plate 4. The second semiconductor device 41 can be mounted on the top surface of the second plate 4.

[0114] The second semiconductor device 41 can be in thermal contact with the bottom surface 2b of the cooling sleeve 2, and the heat of the second semiconductor device 41 can be transferred to the bottom surface 2b of the cooling sleeve 2.

[0115] The second semiconductor device 41 can be aligned with the first semiconductor device 31. The first semiconductor device 31 and the second semiconductor device 41 can be spaced apart in the horizontal direction.

[0116] The first semiconductor device 31 and the second semiconductor device 41 can respectively make thermal contact with the bottom surface 2b of the cooling sleeve 2 and can be cooled by the cooling sleeve 2.

[0117] The bottom surface 2b of the cooling jacket 2 can be a heat-absorbing surface that absorbs the heat from the first semiconductor device 31 and the second semiconductor device 41.

[0118] The second plate 4 can be aligned with the first plate 3. The second plate 4 can be separated from the first plate 3 in the horizontal direction.

[0119] An example of the second semiconductor device 41 may be a system-on-a-chip (SoC) mounted on the second board 4.

[0120] An example of the second semiconductor device 41 could be a semiconductor chip that performs autonomous driving for a vehicle.

[0121] The first semiconductor device 31 and the second semiconductor device 41 are CPUs of the same specifications. They can be distinguished as primary nodes and secondary nodes and perform the same functions. Even if a hardware failure occurs in one node, normal functions can be performed through mutual backup.

[0122] The electronic control unit may include a second thermal interface material 42.

[0123] The second thermal interface material 42 can be disposed between the top surface of the second semiconductor device 41 and the bottom surface 2b of the cooling jacket 2. Examples of the second thermal interface material 42 can be a thermally conductive pad or a thermally conductive tape.

[0124] The second plate 4 can be fastened to the cooling sleeve 2 or the frame 13. The second plate 4 can be fastened to the cooling sleeve 2 or the frame 13 by fastening components such as screws.

[0125] The second plate 4 can be fastened to the cooling sleeve 2 or the frame 13 on the underside of the cooling sleeve 2 by fastening components 43 such as screws.

[0126] The second board 4 can be connected to the control board 6 via a connector. An example of a connector could be a B2B connector with both female and male heads.

[0127] The second board 4 can be connected to the control board 6 via the second connector 44.

[0128] A third semiconductor device 51 can be mounted on the third board 5. The third semiconductor device 51 can be mounted on the bottom surface of the third board 5.

[0129] The third semiconductor device 51 can be in thermal contact with the top surface 2a of the cooling sleeve 2, and the heat of the third semiconductor device 51 can be transferred to the top surface 2a of the cooling sleeve 2.

[0130] An example of the third semiconductor device 51 may be a system-on-a-chip (SoC) mounted on the third board 5.

[0131] An example of the third semiconductor device 51 could be a semiconductor chip that performs autonomous driving for a vehicle.

[0132] An example of the third semiconductor device 51 could be a neural network processing unit (NPU).

[0133] When the third semiconductor device 51 is a neural network processing device (NPU), the heat generated by the third semiconductor device 51 will be relatively large when the third semiconductor device 51 is in operation. It is preferable to keep the heat transfer between the top surface 2a and the bottom surface 2b of the cooling jacket 2 balanced.

[0134] The heat generated by the first semiconductor device 31 and the second semiconductor device 41 can be relatively less than the heat generated by the neural network processing device (NPU).

[0135] When the first semiconductor device 31 and the second semiconductor device 41 are in thermal contact with the bottom surface 2b of the cooling sleeve 2, the third semiconductor device 51 can be in thermal contact with the top surface 2a of the cooling sleeve 2.

[0136] Conversely, when the first semiconductor device 31 and the second semiconductor device 41 are in thermal contact with the top surface 2a of the cooling sleeve 2, the third semiconductor device 51 can be in thermal contact with the bottom surface 2b of the cooling sleeve 2.

[0137] The third semiconductor device 51 can be separated from the first semiconductor device 31 or the second semiconductor device 41 through the cooling jacket 2.

[0138] The third semiconductor device 51 can be separated from either the first semiconductor device 31 or the second semiconductor device 41 in the vertical direction. The following description assumes that the third semiconductor device 51 is separated from the second semiconductor device 41 in the vertical direction.

[0139] The top surface 2a of the cooling jacket 2 can be a heat-absorbing surface that absorbs heat from the third semiconductor device 51.

[0140] The third semiconductor device 51 can be horizontally biased on the top surface 2a of the cooling jacket 2.

[0141] The electronic control unit may also include a third thermal interface material 52.

[0142] The third thermal interface material 52 can be disposed between the bottom surface of the third semiconductor device 51 and the top surface 2a of the cooling jacket 2. Examples of the third thermal interface material 52 can be a thermally conductive pad or a thermally conductive tape.

[0143] The third plate 5 can be fastened to the top housing 11. The third plate 5 can be fastened to the top housing 11 by fastening members 53 such as screws. A third plate fastening part 11c protruding downward can be formed on the top housing 11, and fastening members 53 such as screws can be fastened to the third plate fastening part 11c. An example of the third plate fastening part 11c can be a fastening boss such as a fastening screw.

[0144] A microcontroller unit (MCU) 61 can be installed on the control board 6. This microcontroller unit 61 can control the overall operation of the electronic control unit. The control board 6 can be a back plane board.

[0145] The control panel 6 can be in thermal contact with the cooling jacket 2.

[0146] The control plate 6 can be fastened to the control plate fastening part 2d formed in the cooling jacket 2 or frame 13 by fastening components 62 such as screws.

[0147] The control panel 6 can be in thermal contact with the bottom housing 12.

[0148] The control panel 6 can be fastened to the bottom housing 12.

[0149] The control panel 6 can be fastened to the bottom housing 12 by fastening components 63 such as screws.

[0150] The top surface of the control panel 6 can face the bottom surface of the first panel 3 and the bottom surface of the second panel 4 respectively.

[0151] The control panel 6 can be separated from the first panel 3 in the vertical direction.

[0152] The control board 6 can be connected to the first board 3 via the first connector 34.

[0153] The control panel 6 can be separated from the second panel 4 in the vertical direction.

[0154] The control board 6 can be connected to the second board 4 via the second connector 44.

[0155] The control board 6 can be connected to the third board 5 via a harness cable 64. The harness cable 64 connecting the control board 6 and the third board 5 can be a first harness cable.

[0156] The control board 6 can be connected to the thermoelectric element 7 via a harness cable 65. The harness cable 65 connecting the control board 6 and the thermoelectric element 7 can be a second harness cable.

[0157] The control board 6 can be connected to the auxiliary thermoelectric element 10 via a harness cable 66. The harness cable 66 connecting the control board 6 and the auxiliary thermoelectric element 10 can be a third harness cable.

[0158] The thermoelectric element 7 may include a cold side 71 and a hot side 72.

[0159] The cold side 71 can be in thermal contact with the top surface 2a of the cooling jacket 2.

[0160] In order to prioritize cooling the third semiconductor device 51, which generates a large amount of heat, the thermoelectric element 7 can contact the top surface 2a of the cooling sleeve 2 in the same manner as the third semiconductor device 51.

[0161] The hot side 72 can be in thermal contact with the top housing 11, such as Figure 2 As shown. However, if the thermoelectric element 7 is configured to contact the bottom surface of the cooling jacket 2, the hot side 72 can be in thermal contact with the bottom housing 12. Alternatively, the portion of the top housing 11 or the bottom housing 12 facing the hot side 72 can have an opening, allowing the hot side 72 to be exposed to ambient air.

[0162] The top surface 2a of the cooling jacket 2 can be a heat dissipation surface for dissipating heat to the thermoelectric element 7.

[0163] The top surface 2a of the cooling jacket 2 can serve as a heat absorption / heat dissipation surface, which absorbs the heat from the third semiconductor device 51 and dissipates the heat to the thermoelectric element 7.

[0164] The thermoelectric element 7 can be activated by at least one of the temperatures of the first semiconductor device 31, the second semiconductor device 41, and the third semiconductor device 51.

[0165] The thermoelectric element 7 can be positioned on the upper side of the cooling jacket 2 and aligned with the third plate 5.

[0166] The thermoelectric element 7 can be horizontally biased on the top surface 2a of the cooling jacket 2.

[0167] The thermoelectric element 7 can be separated from the third plate 5 in the horizontal direction.

[0168] The thermoelectric element 7 can be separated from one of the first plate 3 and the second plate 4 in the vertical direction. Hereinafter, the case in which the thermoelectric element 7 is separated from the first plate 3 in the vertical direction through the cooling jacket 2 will be described.

[0169] The heat from the hot side 72 can be transferred to the top housing 11, which can then dissipate the heat transferred from the hot side 72 to the outside.

[0170] The top shell 11 can be composed of a single component or a combination of multiple components.

[0171] The heat transferred from the hot side 72 to the top housing 11 is preferably not transferred to the third plate 5 as much as possible, and preferably, the portion of the top housing 11 in contact with the hot side 72 and the portion in contact with the third plate 5 are thermally isolated.

[0172] The top housing 11 may include: a top body 14, including a portion that contacts the third plate 5; and a heat dissipation member 15, including a portion that contacts the hot side 72, and may also include a heat insulation member 16 disposed between the heat dissipation member 15 and the top body 14 and blocking heat.

[0173] The top housing 11 may include: a top body 14 having an opening 14a; and a heat dissipation member 15 disposed in the opening 14a and having heat dissipation fins 15a.

[0174] The top body 14 may include an upper body 11a and a peripheral body 11b protruding from the upper body 11a.

[0175] The top body 14 may have a mounting section 14b for mounting the heat insulation component 16.

[0176] The heat dissipation member 15 may include a heat dissipation device having at least one heat sink 15a. The heat sink 15a may be formed on the exposed surface of the heat dissipation member 15. A plurality of heat sinks 15a may be formed, and the plurality of heat sinks 15a may be parallel to each other.

[0177] The heat dissipation component 15 can make thermal contact with the hot side 72 of the thermoelectric element 7.

[0178] The heat dissipation component 15 can form a fastening part 15b that is fastened to the top body 14.

[0179] The top housing 11 may also include a heat insulation member 16. The heat insulation member 16 may be disposed between the top body 14 and the heat dissipation member 15, and may prevent heat from the heat dissipation member 15 from being transferred to the top body 14.

[0180] The heat transferred from the thermoelectric element 7 to the heat dissipation member 15 can be blocked by the heat insulation member 16 to minimize the heat transferred to the top body 14, and can be dissipated to the outside through the heat sink 15a.

[0181] The electronic control unit may also include a fastening member 17 that connects the heat dissipation member 15, the heat insulation member 16, and the top body 14.

[0182] The fastening member 17 can pass through the fastening part 15b, the heat insulation member 16 and the mounting part 14b in sequence, and can be combined with the heat dissipation member 15, the heat insulation member 16 and the top body 14.

[0183] The electronic control unit may also include a valve 8, which is disposed at the cooling water inlet 24 and / or the cooling water outlet 25 of the cooling jacket 2, preferably disposed at the cooling water inlet 24.

[0184] An example of valve 8 can be an electric valve, and may include a motor. An example of valve 8 can be a motorized valve.

[0185] Valve 8 can be controlled to be in open or closed mode by microcontroller 61.

[0186] When valve 8 is in the open mode, valve 8 can be opened and the cooling water inlet 24 can be opened, and cooling water can flow into the cooling water flow path 21.

[0187] When valve 8 is in the closed mode, valve 8 is closed and blocks the cooling water inlet 24, which prevents cooling water from flowing into the cooling water flow path 21.

[0188] Valve 8 can actively control the flow rate by receiving signals from microcontroller unit 61, ensuring that the junction temperature, which varies according to the operating rate of the semiconductor device, does not exceed the allowable temperature (Max Tj) of the semiconductor device. Here, the junction temperature can be defined as the maximum temperature of the semiconductor device, which is the temperature output from the temperature sensor located on the semiconductor device.

[0189] Specifically, the microcontroller unit 61 can control the valve 8 and the thermoelectric element 7 in response to an abnormal state of the cooling jacket 2. The abnormal state of the cooling jacket 2 can be determined based on sensing data detected by sensors within the electronic control unit or based on data (signals) received from an external device indicating such an abnormal state of the cooling jacket 2. The sensors within the electronic control unit can be temperature sensors used to sense the temperature of at least one of the semiconductor device, at least one plate, and the cooling jacket 2. Alternatively, a sensor used to sense the flow rate of cooling water entering the cooling jacket can be used to determine the abnormal state of the cooling jacket 2.

[0190] The thermoelectric element 7 and valve 8 can be selectively operated.

[0191] When valve 8 is in the open mode, thermoelectric element 7 can be closed, and the heat from the first semiconductor device 31, the second semiconductor device 41, and the third semiconductor device 51 can be dissipated by the cooling water flowing into the cooling water flow path 21 and cooled by water.

[0192] When valve 8 is in the closed mode, thermoelectric element 7 can be turned on, and the heat from the first semiconductor device 31, the second semiconductor device 41, and the third semiconductor device 51 can be transferred to the top housing 11 through thermoelectric element 7 for air cooling.

[0193] Thermoelectric element 7 and valve 8 can be configured according to a water-cooled circulation system 9 connected to cooling jacket 2 (see reference). Figure 4 The functions of these components (e.g., abnormal states) interact and act in unison. See also... Figure 4 The water-cooled circulation system 9 is described.

[0194] The electronic control unit may also include an auxiliary thermoelectric element 10.

[0195] The secondary thermoelectric element 10 may include a secondary cold side 101 and a secondary hot side 102.

[0196] The auxiliary thermoelectric element 10 can be arranged vertically in the up-down direction.

[0197] The secondary cold side 101 can make thermal contact with the side of the cooling jacket 2.

[0198] The secondary cold side 101 can make thermal contact with the peripheral body 2c of the cooling jacket 2.

[0199] The secondary cold side 101 can contact one of the four peripheral bodies 2c of the cooling jacket 2.

[0200] The secondary heating side 102 can be in thermal contact with the top housing 11.

[0201] The side of the cooling jacket 2 can be a heat dissipation surface for transferring heat to the auxiliary thermoelectric element 10.

[0202] The auxiliary thermoelectric element 10 can operate according to at least one of the temperatures of the first semiconductor device 31, the second semiconductor device 41, and the third semiconductor device 51.

[0203] Ribs 11d may protrude from the top housing 11, making thermal contact with the secondary heating side 102 of the secondary thermoelectric element 10. Ribs 11c may protrude from the top body 14.

[0204] The first semiconductor device 31 can be closer to the thermoelectric element 7 in both the thermoelectric element 7 and the auxiliary thermoelectric element 10.

[0205] The second semiconductor device 41 and the third semiconductor device 51 can be closer to the auxiliary thermoelectric element 10 in the thermoelectric element 7 and the auxiliary thermoelectric element 10.

[0206] When the first semiconductor device 31 generates too much heat, the thermoelectric element 7 can be turned on. When the second semiconductor device 41 or the third semiconductor device 51 generates too much heat, the auxiliary thermoelectric element 10 can be turned on.

[0207] Figure 4 This diagram illustrates an example of the electronic control unit of this embodiment being cooled by a water-cooled circulation system. Figure 5 This is a control block diagram of an example of the electronic control unit in this embodiment. Figure 6 This is a flowchart of an example of the electronic control unit in this embodiment.

[0208] The water-cooled circulation system 9 may include: a heat exchanger 91; a cooling water tank 93 connected to the heat exchanger 91 via a heat exchanger outlet pipe 92; a pump 95 connected to the cooling water tank 93 via a pump inlet pipe 94; and a pump outlet pipe 96 connecting the pump 95 and an electronic control unit, wherein the electronic control unit and the heat exchanger 91 may be connected via a heat exchanger inlet pipe 97.

[0209] The heat exchanger 91 can dissipate the heat of the cooling water to the atmosphere by means of air cooling. An example of the heat exchanger 91 can be a radiator.

[0210] The pump outlet pipe 96 can be connected to the cooling water inlet 24 of the cooling jacket 2.

[0211] The heat exchanger inlet pipe 97 can be connected to the cooling water outlet 25 of the cooling jacket 2.

[0212] Cooling water can circulate through heat exchanger 91 and cooling jacket 2 to dissipate heat from the electronic control unit.

[0213] The water-cooled circulation system 9 may include a temperature sensor, a flow sensor, or a velocity sensor.

[0214] The water-cooled circulation system 9 can control valve 8 to switch to the closed mode of closing the cooling water inlet 24 based on the sensing values ​​of temperature sensor, flow sensor or velocity sensor.

[0215] In the water-cooled circulation system 9, there may be no cooling water flow due to a malfunction of pump 95, and the flow rate may be 0 m³ / s. 3 / hour or flow rate may be 0m / s.

[0216] In the water-cooled circulation system 9, the cooling water temperature may rise due to a malfunction of the heat exchanger 91.

[0217] When normal cooling water flows in through the cooling water inlet 24 of the cooling jacket 2 and flows out through the cooling water outlet 25 of the cooling jacket 2, the junction temperature of the first semiconductor device 31, the junction temperature of the second semiconductor device 41, and the junction temperature of the third semiconductor device 51 can be within the normal range.

[0218] However, when the normal cooling water cannot flow into the cooling water inlet 24 of the cooling jacket 2 due to a malfunction of the heat exchanger 91 or the pump 95, the temperature of the semiconductor device will rise sharply, the temperature of the semiconductor device will reach the limit temperature, and the semiconductor device will thermally shut down.

[0219] The first semiconductor device 31, the second semiconductor device 41, and the third semiconductor device 51 may each include a temperature sensor.

[0220] The first semiconductor device 31 may include a first temperature sensor 36, the second semiconductor device 41 may include a second temperature sensor 46, and the third semiconductor device 51 may include a third temperature sensor 56.

[0221] The first temperature sensor 36 can be disposed inside the first semiconductor device 31 and measure the junction temperature of the first semiconductor device 31.

[0222] The second temperature sensor 46 can be disposed inside the second semiconductor device 41 and measure the junction temperature of the second semiconductor device 41.

[0223] The third temperature sensor 56 can be disposed inside the third semiconductor device 51 and measure the junction temperature of the third semiconductor device 51.

[0224] The electronic control unit may also include a microcontroller unit 61.

[0225] The microcontroller unit 61 can compare the temperature input from the temperature sensor with the set temperature in real time. If the temperature input from the temperature sensor is above the set temperature, it can execute the logic to drive the thermoelectric element 7 and the auxiliary thermoelectric element 10. The microcontroller unit 61 can perform PWM (Pulse Width Modulation) control on at least one of the thermoelectric element 7 and the auxiliary thermoelectric element 10, applying voltage to ensure that at least one of the thermoelectric element 7 and the auxiliary thermoelectric element 10 has appropriate heat absorption and to minimize the thermal shutdown of the semiconductor device.

[0226] Additionally, when the microcontroller unit 61 executes the logic to drive at least one of the thermoelectric element 7 or the auxiliary thermoelectric element 10, it can prevent high-temperature cooling water from flowing into the cooling jacket 2 due to a failure of the heat exchanger 91 by blocking the cooling water inlet 24 with the valve 8.

[0227] The microcontroller unit 61 can control the thermoelectric element 7, the valve 8, and the auxiliary thermoelectric element 10 based on the sensing values ​​of the first temperature sensor 36, the second temperature sensor 46, and the third temperature sensor 56.

[0228] If the temperature T sensed from the first temperature sensor 36 SoC1 Set the first temperature T th In the above, the microcontroller unit 61 can apply voltage to the thermoelectric element (TEC1) 7 and control the valve 8 to change to the closed mode (S1)(S2)(S3) to close the cooling water inlet.

[0229] First set temperature T th It can be a temperature set below the critical temperature of the first semiconductor device 31. For example, if the critical temperature of the first semiconductor device 31 is 125°C, then the first set temperature T is... th It can be 120°C or 110°C.

[0230] When a voltage is applied to the thermoelectric element 7, the thermoelectric element (TEC1) 7 can be activated (S2).

[0231] When the control valve 8 is switched to the closed mode, the valve 8 can be closed to prevent cooling water from flowing into the cooling water inlet 24 (S3).

[0232] When the thermoelectric element 7 is turned on, the heat from the first semiconductor device 31 can be transferred to the cold side 71 of the thermoelectric element 7 through the cooling jacket 2, and the heat from the hot side 72 of the thermoelectric element 7 can be transferred to the heat dissipation component 15 and then to the atmosphere through the heat sink 15a, so as to dissipate heat in an air-cooled manner.

[0233] When valve 8 is in closed mode, the cooling water whose temperature has been raised due to the failure of heat exchanger 91 can no longer flow into the cooling water flow path 21 of cooling jacket 2, and can dissipate heat from thermoelectric element 7 to first semiconductor device 31 without interfering with the heat dissipation of the first semiconductor device 31.

[0234] If the temperature T sensed from the first temperature sensor 36 SoC1 Less than the first set temperature T th If so, the microcontroller unit 61 will not apply voltage to the thermoelectric element 7 and control the valve 8 to change to the open mode of opening the cooling water inlet 24 (S4)(S5)(S6).

[0235] When no voltage is applied to the thermoelectric element 7, the thermoelectric element (TEC1) 7 can be deactivated (S5).

[0236] If the control valve 8 is switched to the open mode, the valve 8 will be opened to allow cooling water to flow into the cooling water inlet 24 (S6).

[0237] If the temperature T sensed by the second temperature sensor 46 SoC2 The second set temperature Tth or the temperature T sensed by the third temperature sensor 56 is above the set temperature Tth. SoC3 Set the third temperature T th In the above, the microcontroller unit 61 can apply voltage to the auxiliary thermoelectric element (TEC2) 10 to change the control valve 8 to the closed mode (S7)(S8)(S9)(S3) to close the cooling water inlet.

[0238] Second set temperature T th The temperature can be set to be lower than the critical temperature of the second semiconductor device 41. For example, if the critical temperature of the second semiconductor device 41 is 125°C, the second set temperature T... th It can be 120°C or 110°C.

[0239] Second set temperature T th It can be set to be the same as the first set temperature or set to be different from the first set temperature.

[0240] Third set temperature T thThe temperature can be set to be lower than the critical temperature of the third semiconductor device 51. For example, if the critical temperature of the third semiconductor device 51 is 125°C, the third set temperature T... th It can be 120°C or 110°C.

[0241] Third set temperature T th It can be set to be the same as the first set temperature or set to be different from the first set temperature.

[0242] When a voltage is applied to the auxiliary thermoelectric element 10, the auxiliary thermoelectric element (TEC2) 10 can be activated (S9).

[0243] If the control valve 8 is switched to the closed mode, the valve 8 will be closed to prevent cooling water from flowing in through the cooling water inlet 24 (S3).

[0244] When the secondary thermoelectric element 10 is turned on, the heat from the second semiconductor device 41 or the third semiconductor device 51 can be transferred to the secondary cold side 101 through the cooling jacket 2, and the heat from the secondary hot side 102 of the secondary thermoelectric element 10 can be transferred to the top body 14 for air cooling.

[0245] When valve 8 is in the closed mode, the cooling water whose temperature has been raised due to the failure of heat exchanger 91 can no longer flow into the cooling water flow path 21 of cooling jacket 2, and can not interfere with the heat dissipation of the auxiliary thermoelectric element 10 to the second semiconductor device 41 and the third semiconductor device 51.

[0246] If the temperature T sensed from the second temperature sensor 46 SoC2 Less than the second set temperature T th And the temperature T sensed by the third temperature sensor 56 SoC3 When the temperature is below the third set temperature Tth, the microcontroller unit 61 will not apply voltage to the auxiliary thermoelectric element (TEC2) 10, and the control valve 8 will change to the open mode of opening the cooling water inlet (S10)(S11)(S12)(S6).

[0247] When no voltage is applied to the auxiliary thermoelectric element 10, the auxiliary thermoelectric element (TEC2) 10 can be deactivated (S12).

[0248] If the control valve 8 is switched to the open mode, the valve 8 will be opened to allow cooling water to flow in through the cooling water inlet 24 (S6).

[0249] An example of an electronic control unit is capable of applying voltage to thermoelectric element 7 or auxiliary thermoelectric element 10 based on the sensing values ​​of temperature sensor, flow sensor or velocity sensor of water-cooled circulation system 9, and controlling valve 8 to switch to a closed mode that closes cooling water inlet 24.

[0250] If the temperature sensed by the temperature sensor is above the set temperature, an example of the electronic control unit can apply voltage to the thermoelectric element 7 or the auxiliary thermoelectric element 10 and control the valve 8 to switch to the closed mode that closes the cooling water inlet 24.

[0251] If the flow rate sensed by the flow sensor is below the set flow rate, an example of the electronic control unit can apply voltage to the thermoelectric element 7 or the auxiliary thermoelectric element 10, and the control valve 8 changes to the closed mode to close the cooling water inlet 24.

[0252] If the flow rate sensed by the flow rate sensor is below the set flow rate, an example of the electronic control unit can apply voltage to the thermoelectric element 7 or the auxiliary thermoelectric element 10, and the control valve 8 changes to the closed mode to close the cooling water inlet 24.

[0253] One example of the electronic control unit is able to apply voltage to the auxiliary thermoelectric element 10 while applying voltage to the thermoelectric element 7.

[0254] During the period when valve 8 is in the open mode, an example of the electronic control unit is also able to apply voltage to thermoelectric element 7 or auxiliary thermoelectric element 10, and thermoelectric element 7 or auxiliary thermoelectric element 10 is also able to improve the heat dissipation performance of the jacket 2.

[0255] Figure 7 This is a cross-sectional view of another example of the electronic control unit in this embodiment. Figure 8 This is a control block diagram of another example of the electronic control unit in this embodiment.

[0256] Another example of an electronic control unit may include a housing 1, a cooling jacket 2, a first plate 3 for mounting a first semiconductor device 31, a second plate 4 for mounting a second semiconductor device 41, a third plate 5 for mounting a third semiconductor device 51, a control board 6, and a thermoelectric element 7.

[0257] Another example of the electronic control unit is that a thermoelectric element 7 can dissipate heat from the cooling jacket 2, and can also dissipate heat from the first semiconductor device 31, the second semiconductor device 41 and the third semiconductor device 51.

[0258] The cover 1 may include a top shell 11', a bottom shell 12, and a frame 13.

[0259] The top housing 11′ may differ from the top housing 11 of an example of an electronic control unit.

[0260] The top housing 11′ may include a contact body 15′ that is in thermal contact with the hot side 72 of the thermoelectric element 7.

[0261] The bottom housing 12 may be the same as or similar to the bottom housing 12 of an example of an electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0262] Frame 13 may be the same as or similar to the frame 13 of an example electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0263] The first semiconductor device 31 may be the same as or similar to the first semiconductor device 31 of an example of an electronic control unit. The same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0264] The first semiconductor device 31 may include a first temperature sensor 36.

[0265] The first plate 3 may be the same as or similar to the first plate 3 of an example of an electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0266] The second semiconductor device 41 may be the same as or similar to the second semiconductor device 41 of an example of an electronic control unit. The same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0267] The second semiconductor device 41 may include a second temperature sensor 46.

[0268] The second board 4 may be the same as or similar to the second board 4 of an example of an electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0269] The third semiconductor device 51 may be the same as or similar to the third semiconductor device 51 of an example electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0270] The third semiconductor device 51 may include a third temperature sensor 56.

[0271] The third board 5 may be the same as or similar to the third board 5 of an example electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0272] The control board 6 may be the same as or similar to the control board 6 of an example electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0273] The thermoelectric element 7 may include a cold side 71 and a hot side 72. The thermoelectric element 7 may be the same as or similar to the thermoelectric element 7 of an example of an electronic control unit, and the same reference numerals are used for the same configuration and detailed descriptions thereof are omitted.

[0274] Another example of an electronic control unit may include a microcontroller unit 61.

[0275] The microcontroller unit 61 can control the thermoelectric element 7 based on the sensing values ​​of the first temperature sensor 36, the second temperature sensor 46, and the third temperature sensor 56.

[0276] If the temperature sensed by the first temperature sensor 36 is above the first set temperature, or the temperature sensed by the second temperature sensor 46 is above the second set temperature, or the temperature sensed by the third temperature sensor 56 is above the third set temperature, then the microcontroller unit 61 may apply a voltage to the thermoelectric element 7.

[0277] If the temperature sensed by the first temperature sensor 36 is lower than the first set temperature, the temperature sensed by the second temperature sensor 46 is lower than the second set temperature, and the temperature sensed by the third temperature sensor 56 is lower than the third set temperature, then the microcontroller unit 61 may not apply voltage to the thermoelectric element.

[0278] For configurations identical to an example of an electronic control unit, the same reference numerals are used and detailed descriptions are omitted to avoid repetition.

[0279] The above description is merely an illustrative example of the technical concept of the present invention, and those skilled in the art will be able to make various modifications and variations without departing from the essential characteristics of the invention.

[0280] Therefore, the embodiments disclosed in this invention are not intended to limit the technical concept of the invention, but are used to illustrate the technical concept, and the scope of the technical concept of the invention is not limited by these embodiments.

[0281] The scope of protection of this invention should be interpreted by the appended claims, and all technical ideas within the equivalent scope should be interpreted as being included within the scope of this invention.

Claims

1. An electronic control unit, wherein, comprising: a cooling jacket (2) disposed between a top case (11) and a bottom case (12), through which cooling water is able to flow; at least one board (3, 4, 5) on which a semiconductor device (31, 41, 51) is mounted in thermal contact with a top surface and / or a bottom surface of the cooling jacket (2); a control board (6) disposed in a space formed by the top case (11) and the bottom case (12); a thermoelectric element (7) whose cold side (71) is in thermal contact with the top surface or the bottom surface of the cooling jacket (2); and a valve (8) for closing or opening a cooling water inlet (24) and / or a cooling water outlet (25) of the cooling jacket (2); in response to an abnormal state of the cooling jacket (2), the valve (8) is configured to close the cooling water inlet (24) and / or the cooling water outlet (25), and the thermoelectric element (7) is configured to operate to cool the cooling jacket (2). Further comprising:

2. The electronic control unit of claim 1, wherein, a temperature sensor configured to detect a temperature of at least one of the semiconductor device (31, 41, 51), the at least one board (3, 4, 5), and the cooling jacket (2); the abnormal state of the cooling jacket (2) is determined based on the detected temperature; the temperature sensor is configured to detect the temperature of the semiconductor device (31, 41, 51), and the abnormal state of the cooling jacket (2) is a state when the detected temperature is equal to or higher than a predetermined temperature.

3. The electronic control unit according to claim 1, wherein the at least one board (3, 4, 5) includes at least one of: a first board (3) on which a first semiconductor device (31) is mounted in thermal contact with a bottom surface of the cooling jacket (2); a second board (4) on which a second semiconductor device (41) is mounted in thermal contact with the bottom surface of the cooling jacket (2); and a third board (5) on which a third semiconductor device (51) is mounted in thermal contact with a top surface of the cooling jacket (2).

4. The electronic control unit according to claim 1, wherein the control board (6) is configured to be in thermal contact with the top case (11) or the bottom case (12).

5. The electronic control unit according to claim 1, wherein a hot side (72) of the thermoelectric element (7) is in thermal contact with the top case (11), or the bottom case (12), or a side case.

6. The electronic control unit according to claim 1, wherein the valve (8) is configured to close the cooling water inlet (24) of the cooling jacket (2). Further comprising at least one of: a first thermal interface material (32) disposed between a top surface of the first semiconductor device (31) and a bottom surface of the cooling jacket (2) in a case where the at least one board (3, 4, 5) includes the first board (3); 7. The electronic control unit of claim 3, wherein, a second thermal interface material (42) disposed between a top surface of the second semiconductor device (41) and the bottom surface of the cooling jacket (2) in a case where the at least one board (3, 4, 5) includes the second board (4); and a third thermal interface material (52) disposed between a top surface of the third semiconductor device (51) and a top surface of the cooling jacket (2) in a case where the at least one board (3, 4, 5) includes the third board (5). ​ and a third thermal interface material (52) is arranged between a bottom surface of the third semiconductor device (51) and a top surface of the cooling jacket (2) in the case where the at least one plate (3, 4, 5) includes the third plate (5).

8. The electronic control unit according to claim 5, wherein the top case (11) includes: a top body (14) formed with an opening portion (14a); and a heat dissipation member (15) arranged at the opening portion (14a) and formed with a heat dissipation fin (15a).

9. The electronic control unit according to claim 8, wherein the heat dissipation member (15) is in thermal contact with the hot side (72).

10. A control method for controlling the electronic control unit of any one of claims 1 to 14, wherein includes: detecting an abnormal state of the cooling jacket (2) or receiving a signal from an external device indicating the abnormal state of the cooling jacket (2); in response to the detection or the reception, operating the valve (8) to stop cooling water from flowing into the cooling jacket (2) and operating the thermoelectric element (7) to cool the cooling jacket (2).

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