Structural design for distributing loss power to two sidewalls
By breaking down electronic devices into multiple components and using pins or spring elements to press the cooling body together, the problem of poor cooling performance caused by mechanical tolerances is solved, and the optimized distribution of power loss and improved cooling performance are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-26
- Publication Date
- 2026-03-10
AI Technical Summary
In electronic devices with multiple laterally arranged circuit boards, mechanical tolerances prevent the cooling element from fully adhering to the sidewalls of the housing, resulting in poor cooling performance. Existing solutions are complex and costly.
The electronic device is divided into first and second electronic components, and the cooling element is pressed against the inside of the housing by clamping elements such as pins or spring elements. The pins engage with recesses on the housing, or the spring elements are designed to provide elasticity on the connecting circuit board, compensating for housing tolerances to achieve optimized cooling element clamping.
It achieves optimized power distribution and improved cooling performance within electronic devices, and is simple and does not require additional complex or costly measures to ensure a tight fit between the cooling element and the housing, preventing mutual heating.
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Figure CN121645786A_ABST
Abstract
Description
Technical Field
[0001] This invention relates generally to the field of electrical engineering, and more particularly to the field of power electronics. Specifically, this invention relates to an electronic device, and more particularly to a power supply system. Background Technology
[0002] To date, in electronic devices with more than one laterally arranged circuit board, the circuit boards containing components are individually screwed onto an outer cooling body or cooling plate, and then these circuit boards are screwed together. This "cooling body-circuit board-circuit board-cooling body" assembly is then housed in a metal casing. However, mechanical tolerances can prevent the cooling body from fully adhering to the inner sidewall of the casing. The result is poor cooling performance. This situation must either be tolerated or improved through additional, complex, and costly cooling measures, such as heat pipes. Summary of the Invention
[0003] The objective of this invention is to improve the cooling of electronic devices without resorting to complex or costly measures.
[0004] This task is solved by an electronic device, specifically a power supply system, which includes: -case; - A first electronic component, particularly a first power supply unit, which includes a first cooling element; and - A second electronic component, particularly a second power supply unit, which includes a second cooling body; -The first electronic component and the second electronic component are arranged within the housing; and - The first and second cooling elements are pressed against the inside of the housing by a clamping element.
[0005] By splitting the power supply system into a first electronic component and a second electronic component, optimized power loss distribution within the electronic device is achieved. The clamping element enables precise pressing of the cooling element against the inside of the housing, thereby compensating for tolerances in the components (especially the housing).
[0006] Advantageously, at least one clamping element is constructed as a pin, which is included by a first and / or second electronic component, wherein the pin engages with a recess on the housing.
[0007] By constructing at least one clamping element as a pin, optimized clamping of the electronic component inside the housing can be achieved after the electronic component is pushed into the housing. Here, the pin is preferably made of an insulating material, but it can also be made of a circuit board or a cooling element. The pin is constructed to be flexible. The pin may have a bevel or a guide bevel. This bevel facilitates insertion of the pin into a recess on the housing. The engagement between the pin and the recess is such that the pin presses against the inner edge of the recess, thereby pressing the electronic component or cooling element outward and clamping the cooling element against the inside of the housing.
[0008] Advantageously, the electronic device also includes a connecting circuit board through which the first electronic component and the second electronic component are electrically and mechanically interconnected, and at least one clamping element is configured as a spring element contained in the connecting circuit board.
[0009] Designing the clamping element as a spring element is another advantageous way to press the coolant against the inside of the housing, thereby compensating for housing component tolerances and ensuring optimized heat transfer from the coolant to the housing.
[0010] Advantageously, the connecting circuit board is split into a first connecting circuit board and a second connecting circuit board, and the spring element generates an elastic effect between the first connecting circuit board and the second connecting circuit board.
[0011] This measure can further improve the compression effect of the cooling element on the inside of the housing.
[0012] Advantageously, the spring element is composed of an elastic extension of the first part of the connecting circuit board, which cooperates with the second part of the connecting circuit board.
[0013] This method allows for the very simple manufacture of spring elements without the need for additional components.
[0014] Advantageously, the first and second cooling bodies are pressed against the opposite sidewalls of the housing.
[0015] This measure further optimizes the distribution of power losses within the casing. The sidewalls of the casing can thus be used for cooling in an optimal manner. Furthermore, the cooling elements can be positioned as far apart as possible to prevent mutual heating.
[0016] Advantageously, the first and second electronic components have the same electrical function and are connected in parallel.
[0017] The term "identical electrical function" refers to the first and second electronic components achieving the same intended purpose. For example, each of the two electronic components can be a power supply unit. This measure allows an electronic device or power supply system to be split into two electronic components or two power supply units, each providing half of the rated current or rated power required by the electronic device or power supply system. Splitting it into two electronic components or two power supply units enables spatial separation of the electronic components, thereby optimizing the allocation of power losses within the electronic device.
[0018] Advantageously, the electronic device further includes a first fastening element that is shaped to fit a first circuit board of a first electronic component or a second circuit board of a second electronic component; the first fastening element has threads and at least one spring arm; and is screwed onto the first or second electronic component such that a force is applied through the first fastening element (especially through at least one spring arm) to press the first circuit board against a first cooling body, or to press the second circuit board against a second cooling body.
[0019] This measure ensures optimized heat transfer from the circuit board to the cooling element.
[0020] Advantageously, the electronic device also includes a second fastening element that is laterally fastened to the circuit board, through which electronic components between the cooling body and the second fastening element can be pressed onto the cooling body.
[0021] This measure can improve the contact between electronic components and the cooling body.
[0022] Advantageously, the electronic device is a power supply system, with the first electronic component being the first power supply unit and the second electronic component being the second power supply unit.
[0023] This measure enables the configuration of a power supply system in a particularly advantageous manner, in which the two power supply units are distributed within the housing, thus the power loss of the two power supply units is generated in a distributed manner within the electronic device.
[0024] The task is also solved by a method for assembling electronic equipment, wherein a first electronic component and a second electronic component are pushed into a housing, and a first cooling body and a second cooling body are pressed against the inside of the housing by a clamping element.
[0025] This method can advantageously compensate for component tolerances in the housing, allowing the cooling element to be pressed tightly against the inside of the housing and fully or completely against it. The method can be implemented simply and automatically.
[0026] Advantageously, the first connecting circuit board and the second connecting circuit board are electrically connected to each other.
[0027] After the electronic components are pushed into the housing, some of the connecting circuit boards are connected. This operation allows the clamping element, which is constructed as a spring element, to first press the cooling body against the housing, and then fix the position by connecting some of the connecting circuit boards. Attached Figure Description
[0028] Based on the features of the dependent claims, the invention, and other advantageous embodiments thereof, will be described in detail below with the aid of embodiments shown in the accompanying drawings. In the drawings: Figure 1 The first figure shows an exemplary structural design of an electronic device according to the present invention, without a cooling body and a housing; Figure 2 The second figure shows an exemplary structural design of an electronic device according to the present invention, which has a cooling body but no housing; Figure 3 The third figure shows an exemplary structural design of an electronic device according to the present invention, which has a cooling body but no housing; Figure 4 The fourth figure shows an exemplary structural design of an electronic device according to the present invention, having a cooling body located in a housing; Figure 5 An exemplary first detailed view of a clamping element configured as a pin is shown; Figure 6 An exemplary second detailed view of a clamping element configured as a pin is shown; Figure 7 An exemplary illustration is shown of a connecting circuit board with a clamping element configured as a spring element; Figure 8 An exemplary illustration of one step in a method for assembling an electronic device is shown; Figure 9 A detailed view of the clamping element, constructed as a spring element, is shown; Figure 10 An exemplary illustration of a connection circuit board for an electronic device is shown, excluding the front cover; Figure 11 An exemplary first illustration of the first fastening element is shown; Figure 12 An exemplary second illustration of the first fastening element is shown; Figure 13 An exemplary third illustration of the first fastening element is shown; Figure 14 An exemplary fourth illustration of the first fastening element is shown; Figure 15 An exemplary first illustration of the second fastening element is shown; Figure 16 An exemplary second illustration shows the second fastening element; and Figure 17 An exemplary third illustration of the second fastening element is shown. Detailed Implementation
[0029] Figure 1 The first figure shows an exemplary structural design of an electronic device 1 according to the present invention, without a cooling body and housing. The electronic device 1 shown in the figure is a power supply system in this embodiment. Figure 1 The figure also shows a first electronic component 3 and a second electronic component 5, which in this embodiment are a first power supply unit 3 and a second power supply unit 5, respectively. The first electronic component 3 includes a first circuit board 14, and the second electronic component 5 includes a second circuit board 15. Various electronic components are mounted on the first circuit board 14 and the second circuit board 15. A connecting circuit board 10 is also shown in the figure. The two power supply units 3 and 5 are electrically and mechanically interconnected through the connecting circuit board 10. In this example, the electronic components 3 and 5 (especially their circuit boards 14 and 15) are parallel to each other and arranged along the sidewall of the housing 2, while the connecting circuit board 10 is perpendicular to the electronic components 3 and 5 (especially their circuit boards 14 and 15).
[0030] In this example, the first power supply unit 3 and the second power supply unit 5 are connected in parallel to form a power supply system. A 40A power supply system is divided into two 20A power supply units 3 and 5. By implementing the 40A power supply system with two 20A power supply units 3 and 5, power loss is distributed. Each side wall of the housing 2 is responsible for the complete cooling of one 20A power supply unit 3 or 5, thereby achieving power distribution on both sides of the housing 2. The two electronic components 3 and 5 are arranged in a mirror-symmetrical manner, cooling outwards to the left and right sides, respectively.
[0031] Figure 2The second figure illustrates an exemplary structural design of an electronic device 1 according to the invention, with cooling bodies 4 and 6 but without a housing 2. A first electronic assembly 3 with a first circuit board 14 and a second electronic assembly 5 with a second circuit board 15 are shown. Furthermore, the first cooling body 4 and the second cooling body 6 are also shown. The cooling bodies 4 and 6 are designed as L-shaped cooling bodies, extending along opposite sidewalls of the housing 2 (not shown) and along the first circuit board 14 and the second circuit board 15, respectively. A first insulator 16 and a second insulator 17 are also shown. The insulators 16 and 17 are designed as insulating plates, respectively located at least partially between the first circuit board 14 and the first cooling body 4, and between the second circuit board 15 and the second cooling body 6. The insulators 16 and 17 have openings (not shown) containing ceramic insulators designed for heat transfer. The ceramic insulators are in contact with the circuit boards 14 and 15 and the cooling bodies 4 and 6, respectively, ensuring that heat is transferred from the respective circuit boards 14 and 15 (especially the electronic components on the respective circuit boards 14 and 15 under heat load) to the respective cooling bodies 4 and 6. The first circuit board 14, the first insulating component 16, and the first cooling body 4 are interconnected, in this example by bolts. Similarly, the second circuit board 15, the second insulating component 17, and the second cooling body 6 are also interconnected (in this example by bolts). These connections (or bolt connections) are completed before the electronic components 3 and 5 are installed into the housing 2.
[0032] In the unassembled state shown in the figure, the two electronic components 3 and 5 can move relative to each other. Cooling bodies 4 and 6 together form a system consisting of a tongue 18 and an arcuate bracket 19 at one end, with the tongue 18 inserted into the arcuate bracket 19. The tongue 18 and the arcuate bracket 19 ensure that the electronic components can approach and move away from each other in the unassembled state (i.e., before and during installation into the housing 2).
[0033] The figure also shows multiple clamping elements 7. In this example, four clamping elements 7 are designed as pins 8. These pins 8 are part of the insulators 16 and 17 in this example. The pins 8 face the back of the device 1 (or housing 2, not shown). The pins 8 have bevels that facilitate insertion into the housing 2. This will be explained later. Figures 4 to 7 Further explanation is provided below.
[0034] The figure also shows a connecting circuit board 10 through which the first and second electronic components 3 and 5 are electrically and mechanically interconnected. In this example, the connecting circuit board 10 is divided into a first connecting circuit board 11 and a second connecting circuit board 12. These two connecting circuit boards 11 and 12 partially overlap. This will be explained later. Figures 8 to 10 Further explanation is provided below.
[0035] The figure also shows a front cover, which, in the current illustration, is located at the rear of the electronic device 1. The front cover includes display elements, operating elements, a data interface, and a power interface.
[0036] Figure 3 The third figure shows an exemplary structural design of the electronic device 1 according to the invention, with cooling bodies 4 and 6 but without a housing 2. This view is used to further illustrate the system consisting of a tongue 18 and an arcuate frame 19. This system improves mechanical stability and simplifies installation before and during the insertion of electronic components 3 and 5 into the housing 2, because the electronic components 3 and 5 can only move along one axis.
[0037] Figure 4 The fourth figure illustrates an exemplary structural design of an electronic device 1 according to the present invention, having cooling elements 4 and 6 located within a housing 2. The figure shows a view of the rear wall of the housing 2 (or electronic device 1). The housing 2 (or the rear wall of the housing 2) here has recesses 9, four in this example. The recesses 9 are arranged such that when electronic components 3 and 5 are pushed in, clamping elements 7 (or pins 8) can be inserted into the recesses 9. The beveled surface of the clamping elements 7 (or pins 8) facilitates insertion. Simultaneously, the recesses 9 press the clamping elements 7 (or pins 8) outward toward the corresponding sidewall of the housing 2. This presses the corresponding electronic components 3 and 5 (especially the corresponding cooling elements 4 and 6) against the sidewall of the housing 2 from the inside. This ensures optimized heat transfer from the cooling elements 4 and 6 to the housing 2. In particular, it compensates for mechanical tolerances of the housing 2 that would otherwise prevent the cooling elements 4 and 6 from fully conforming to the housing 2. The insulators 16 and 17 here are made of an insulating material that is elastic, which is beneficial for achieving a compression effect.
[0038] Figure 5 and Figure 6 Exemplary first and second detail views of a clamping element 7 designed as a pin 8 are shown respectively.
[0039] Figure 7 An exemplary illustration of one step in a method for assembling electronic device 1 is shown. The figure shows a basic assembly consisting of... Figure 2 The assembly shown (comprising electronic components 3 and 5, including cooling elements 4 and 6) is pushed into housing 2 along assembly direction A. In this example, clamping elements 7 and 8 (i.e., pins 8 composed of insulators 16 and 17) engage with recesses 9 on housing 2. After full insertion, clamping elements 7 and 8 press cooling elements 4 and 6 against the inner surface of housing 2 along clamping direction B.
[0040] Figure 8An exemplary illustration of a connecting circuit board 10 with a clamping element 7 designed as a spring element 13 is shown. The connecting circuit board 10 here is divided into a first connecting circuit board 11 and a second connecting circuit board 12. In the unassembled state, these two connecting circuit boards 11 and 12 can be supported close to and far from each other. This is achieved in this example by extensions designed on the connecting circuit boards 11 and 12. Furthermore, the first connecting circuit board 11 also includes a clamping element 7, which in this example is designed as a spring element 13. The spring element 13 in this example is formed by the first connecting circuit board 11 itself, serving as an elastic extension of the connecting circuit board 11. When the connecting circuit boards 11 and 12 are pressed against each other, the spring element 13 impedes the relative movement of the connecting circuit boards 11 and 12 and generates a force that pushes the connecting circuit boards 11 and 12 outward toward the sidewall of the housing 2. This mutual pressing occurs during the insertion process of the electronic components 3 and 5 into the housing 2. The resulting force is transmitted through electronic components 3 and 5 to cooling elements 4 and 6, thereby pressing cooling elements 4 and 6 firmly against the inner surface of housing 2. After electronic components 3 and 5 are pushed into housing 2, some connecting circuit boards 11 and 12 need to be interconnected to prevent them from moving further. This connection is achieved in this example using bolted connectors 20. These bolted connectors also enable electrical connections between some connecting circuit boards 11 and 12.
[0041] Figure 9 A detailed view of the clamping element 7, designed as a spring element 13, is shown. This spring element 13 provides elasticity between the first connecting circuit board 11 and the second connecting circuit board 12. In this example, the spring element 13 is integrally constructed with the first connecting circuit board 11 as an extension of that connecting circuit board 11.
[0042] The clamping element 7, designed as a pin 8, ensures that the cooling elements 4 and 6 are clamped in the rear region of the housing 2; while the clamping element 7, designed as a spring element 13, ensures that the cooling elements 4 and 6 are clamped in the front region of the housing 2.
[0043] Figure 10 An exemplary illustration of the connection circuit board 10 of electronic device 1 is shown, excluding the front cover. A first portion of the connection circuit board 11 and a second portion of the connection circuit board 12 are shown. These two portions of the connection circuit boards 11 and 12 are interconnected by a connector 20 (a bolted connector in this example). Therefore, Figure 10The electronic device 1 shown is in an assembled state. These connectors establish a mechanical and electrical connection between the two partially connected circuit boards. Once connected, the two partially connected circuit boards can no longer move relative to each other. On one of the two partially connected circuit boards (the first partially connected circuit board 11 in this example), an elongated hole (Langlöcher) is provided in the area where the connector 20 is located. On the other of the two partially connected circuit boards (the second partially connected circuit board 12 in this example), a hole (Löcher) is provided in the area where the connector 20 is located. The holes and elongated holes, or the areas around the holes and elongated holes, can be metallized. The holes and elongated holes allow the connection of the partially connected circuit boards 11 and 12 to still be achieved after the electronic components 3 and 5 are pushed into the housing 2, because the combination of holes and elongated holes can compensate for the relative movement between the partially connected circuit boards 11 and 12 respectively. The connector 20 can be used to position or fix the partially connected circuit boards 11 and 12 relative to each other and establish an electrical connection between them. The connector 20 is installed after the electronic components 3 and 5 are pushed into the housing 2. In addition, a flat ribbon cable is provided in the upper area of the connecting circuit board 10, through which some connecting circuit boards can achieve additional electrical connections.
[0044] Figure 11 An exemplary first illustration of a first fastening element 21 is shown. The first fastening element 21 includes a body with internal threads 26 and at least one spring arm 22 (two spring arms 22 in this example). The first fastening element is an injection-molded part, and its threads can be either injection-molded or injected metal threads. The body includes a portion that can be inserted into or pass through circuit boards 14, 15. This portion has an anti-rotation structure (a hexagonal section in this example) and a snap hook 27. When the first fastening element 21 is inserted into circuit boards 14, 15, the hexagonal section is located within a recess in circuit boards 14, 15 and acts as an anti-rotation mechanism. In this case, the snap hook is located on the side of the circuit board opposite the remaining portion of the first fastening element 21, preventing the first fastening element 21 from dislodging. A recess extends within the body of the first fastening element 21, in which the threads 26 are located. The first fastening element 21 can be bolted to the circuit board from the side where the snap hook 27 is located. During the bolting process, the spring arm 22 presses against the circuit boards 14 and 15. Furthermore, the body of the first fastening element 21 also has a step, which, like the spring arm 22, also adheres to the circuit boards 14 and 15 and transmits force to them during bolting. During bolting, the spring arm 22 presses against the circuit boards 14 and 15 first, and only then does the step press against them. This design is highly advantageous for the clamping effect because the spring arm 22 is elastic.
[0045] Figure 12An exemplary second illustration of the first fastening element 21 is shown.
[0046] Figure 13 An exemplary third illustration of the first fastening element 21 is shown in cross-sectional view. The figure shows that the first fastening element 21 has two spring arms 22 and a body with a built-in recess, within which a thread 26 is located. The first fastening element 21 is fastened to circuit boards 14 and 15. Insulators 16 and 17 are provided along circuit boards 14 and 15. Circuit boards 14 and 15 have recesses in which insulators 24 are disposed. Cooling elements 4 and 6 are arranged along insulators 16 and 17 and insulators 24. Insulators 24 are designed to be electrically insulating (e.g., made of ceramic) and form thermal contact with areas on circuit boards 14 and 15 that generate high heat (e.g., areas where electronic components 23 are disposed). The electronic components 23 that generate high heat are, for example, rectifiers or power factor correction (PFC) transistors. On circuit boards 14 and 15, elements such as vias or copper sleeves are provided between the electronic component 21 and the insulator 24 to improve heat transfer through the circuit boards 14 and 15. The spring arm 22 and the body of the first fastening element 21 preferably apply force to the circuit boards 14 and 15 themselves, thereby pressing the circuit boards 14 and 15 against the insulator 24. In this way, heat transfer for electronic components with different geometries can be improved without adjusting the first fastening element 21 according to the geometry of the electronic component 23.
[0047] Figure 13 The connection between the first fastening element 21 and the assembly consisting of circuit boards 14 and 15, insulators 16 and 17, insulator 24, and cooling bodies 4 and 6 is also shown. In this example, bolts 25 pass through cooling bodies 4 and 6, are inserted into the threads 26 of the first fastening element 21, and are secured. Clips 27 prevent the first fastening element 21 from being pushed out of circuit boards 14 and 15, and anti-rotation structures prevent the first fastening element from rotating. This connection structure allows for optimal heat transfer from the electronic component 23 to the cooling bodies 4 and 6 via the insulator 24. Crucially, the bolt connection operation must be performed from the soldering side of circuit boards 14 and 15. This design simplifies the assembly process because it eliminates the need for free space on the component side of circuit boards 14 and 15 for assembly tools to enter.
[0048] Figure 14An exemplary fourth illustration of the first fastening element 21 is shown. The figure emphasizes the snap hook 27, which secures the first fastening element 21 to the circuit boards 14 and 15. The circuit boards 14 and 15 have flexible regions along which the snap hook 27 slides upon insertion, and these flexible regions elastically return to their original position. Furthermore, the figure also shows an anti-rotation structure for the first fastening element 21.
[0049] Figure 15 An exemplary first illustration of a second fastening element 28 is shown. The second fastening element 28 includes a body with internal threads 26. A recess extends within the body of the second fastening element 28, and the threads 26 are located within this recess. When the second fastening element 28 is mounted on circuit boards 14 and 15, the recess within the body of the second fastening element 28 extends parallel to circuit boards 14 and 15. The second fastening element 28 also includes at least one support portion 29 and at least one hook 30; in this example, the second fastening element 28 includes two supports 29 and two hooks 30. The hooks 30 allow the second fastening element 28 to be mounted laterally on the circuit boards 14 and 15. The supports 29 prevent the second fastening element 29 from tilting towards the circuit boards 14 and 15.
[0050] Figure 16 An exemplary second illustration of the second fastening element 28 is shown. The figure shows an electronic component 23 disposed between the second fastening element 28 and the cooling bodies 4 and 6. The electronic component 23 has an opening (not shown) passing through it. The electronic component 23 is bolted to the cooling bodies 4 and 6 and the second fastening element using bolts (not shown). Specifically, the bolt originates from the cooling bodies 4 and 6, passes through the opening in the electronic component 23, and is inserted into the thread 26 of the second fastening element 28. During bolting, the support portion 29 prevents the second fastening element 28 from tilting towards the circuit boards 14 and 15. The electronic component 23 is pressed firmly onto the cooling bodies 4 and 6 by the bolting connection and the second fastening element 28. Bolting from the cooling bodies 4 and 6 side simplifies the manufacturing (or assembly) process of the electronic device 1 because it eliminates the need to reserve free space for bolting tools in the area of the circuit boards 14 and 15.
[0051] Figure 17 An exemplary third illustration of the second fastening element 28 is shown. The figure is a rear view of the second fastening element 28, including the electronic component 23. An opening through the electronic component 23 is also shown. Cooling bodies 4 and 6, and bolts for securing the electronic component 23 to them, are not shown.
[0052] List of reference numerals 1 electronic device 2 shells 3 First Electronic Component 4 First Cooling Body 5 Second Electronic Component 6 Second Cooling Body 7 clamping elements 8 pins 9. Notch 10 Connecting Circuit Boards 11 First part connection circuit board 12. Second part of the connecting circuit board 13 Spring Elements 14 First Circuit Board 15 Second Circuit Board 16 First Insulating Component 17 Second Insulating Component 18 tongue slices 19 Bow-shaped frame 20 Circuit Board Connectors 21 First fastening element 22 spring arms 23 electronic components 24 Insulator 25 bolts 26 thread 27 Clip Hook 28 Second fastening element 29 Support section 30 hooks.
Claims
1. Electronic device (1), in particular power supply system, comprising: - a housing (2); - a first electronic assembly (3), in particular a first power supply unit, comprising a first cooling body (4); and - a second electronic assembly (5), in particular a second power supply unit, comprising a second cooling body (6); - wherein the first and second electronic assemblies (3, 5) are arranged within the housing (2); and - the first and second cooling bodies (4, 6) are compressed on the inside of the housing (2) by a compression element (7).
2. The electronic device (1) according to claim 1, wherein The at least one compression element (7) is configured as a pin (8) which is comprised by the first and / or second electronic assembly (3, 5) and which cooperates with a recess (9) on the housing (2).
3. The electronic device (1) according to any one of claims 1 or 2, wherein The electronic device (1) further comprises a connection circuit board (10) by which the first and second electronic assemblies (3, 5) are electrically and mechanically connected to each other, and the at least one compression element is configured as a spring element (13) which is comprised by the connection circuit board (10).
4. The electronic device (1) according to claim 3, wherein The connection circuit board (10) is split into a first partial connection circuit board (11) and a second partial connection circuit board (12), and the spring element (13) exerts an elastic action between the first and second partial connection circuit boards (11, 12).
5. The electronic device (1) according to claim 4, wherein The spring element (13) is constituted by an elastic extension of the first partial connection circuit board (11) which cooperates with the second partial connection circuit board (12).
6. The electronic device (1) according to any one of claims 1 to 5, wherein The first and second cooling bodies (4, 6) are compressed on opposite side walls of the housing (2).
7. The electronic device (1) according to any one of claims 1 to 6, wherein The first and second electronic assemblies (3, 5) have the same electrical function and are connected in parallel.
8. Electronic device (1) according to any one of claims 1 to 7, further comprising a first fastening element (21) which is arranged in a form-fit in a first circuit board (14) of the first electronic assembly (3) or in a second circuit board (15) of the second electronic assembly (5); the first fastening element has a thread (26) and at least one spring arm (22); and the first fastening element is screwed with the first or second electronic assembly (3, 5) such that a force is exerted by the first fastening element (21), in particular by the at least one spring arm (22), which presses the first circuit board (14) against the first cooling body (4) or the second circuit board (15) against the second cooling body (6).
9. Electronic device (1) according to any one of claims 1 to 8, further comprising a second fastening element (28) which fastens laterally on the circuit board (14, 15), by means of which the electronic components (23) between the cooling body (4, 6) and the second fastening element (28) can be pressed against the cooling body (4, 6).
10. The electronic device (1) according to any one of the preceding claims, wherein The electronic device (1) is a power supply system, the first electronic assembly (3) is a first power supply unit, and the second electronic assembly (5) is a second power supply unit.
11. Method for assembling an electronic device (1) according to any one of claims 1 to 10, wherein, The first and second electronic assemblies (3, 5) are pushed into the housing and the first and second cooling bodies (4, 6) are pressed against the inside of the housing (2) by means of the pressing element (7).
12. The method of claim 11, wherein, The electronic device (1) is constructed in the form of any one of claims 4 or 5, and wherein the first and second partial connection circuit boards (11, 12) are electrically connected to one another.
9. Electronic device (1) according to any one of claims 1 to 8, further comprising a second fastening element (28) which fastens laterally on the circuit board (14, 15), by means of which the electronic components (23) between the cooling body (4, 6) and the second fastening element (28) can be pressed against the cooling body (4, 6). The electronic device (1) is a power supply system, the first electronic assembly (3) is a first power supply unit, and the second electronic assembly (5) is a second power supply unit. The first and second electronic assemblies (3, 5) are pushed into the housing and the first and second cooling bodies (4, 6) are pressed against the inside of the housing (2) by means of the pressing element (7). The electronic device (1) is constructed in the form of any one of claims 4 or 5, and wherein the first and second partial connection circuit boards (11, 12) are electrically connected to one another.