Display panel, preparation method thereof and display device

Abstract

The application provides a display panel and a preparation method thereof and a display device, and relates to the technical field of display. The display panel comprises a substrate, a plurality of pixel units arranged in an array, a dam isolation structure and an encapsulation layer. The dam isolation structure is arranged between any two adjacent sub-pixels. The dam isolation structure surrounds the sub-pixel. The dam isolation structure is not in contact with the light-emitting element. The height of the dam isolation structure along a first direction is less than or equal to the height of the light-emitting element along the first direction. The material of the dam isolation structure is an organic material. A non-transparent encapsulation layer covers the dam isolation structure, a pad and a front surface. The height of the non-transparent encapsulation layer along the first direction is less than or equal to the height of the light-emitting element along the first direction. At least a semi-transparent encapsulation layer covers the non-transparent encapsulation layer and the sub-pixel. The display panel provided by the application has high transmittance and low reflectivity, small light efficiency loss and is suitable for large-size display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Display panels composed of micro light-emitting diodes (Micro LED, also known as micro LED or μLED) and sub-millimeter light-emitting diodes (Mini LED) have advantages such as self-illumination, high brightness, high contrast, high resolution and color saturation, long lifespan, fast response speed and low power consumption, and are increasingly being researched and applied.

[0003] After die bonding or mass transfer, existing display panels composed of μLEDs and Mini LEDs typically require LED encapsulation for protection. However, current encapsulation processes, such as molding combined with ashing or using black anisotropic conductive film (B-ACF) as the underfill material, often result in at least one of the following problems for the display panel: low transmittance and high reflectance, leading to poor overall performance. Summary of the Invention

[0004] This application provides a display panel and its manufacturing method, as well as a display device. The display panel can have both high transmittance and low reflectance, with minimal light loss, and is suitable for large-size displays.

[0005] In a first aspect, a display panel is provided, comprising:

[0006] The substrate includes a front side and a back side, with the front side and back side disposed opposite to each other;

[0007] Multiple pixel units arranged in an array are disposed on the front side. Each pixel unit includes multiple sub-pixels arranged in an array. Each sub-pixel includes a light-emitting element and a pad. The pad is connected to the front side, and the light-emitting element is bonded to the pad. The light-emitting element has a side, a top surface facing away from the front side, and a bottom surface facing the front side. The top surface and the bottom surface are connected through the side.

[0008] A dam isolation structure is set between any two adjacent sub-pixels. The dam isolation structure surrounds the sub-pixel. The dam isolation structure does not contact the light-emitting element. The height of the dam isolation structure along the first direction is less than or equal to the height of the light-emitting element along the first direction. The material of the dam isolation structure is organic material.

[0009] The encapsulation layer includes a non-transparent encapsulation layer and at least a semi-transparent encapsulation layer. The non-transparent encapsulation layer covers the dam isolation structure, pads, and front side. The height of the non-transparent encapsulation layer along the first direction is less than or equal to the height of the light-emitting element along the first direction. The at least semi-transparent encapsulation layer covers the non-transparent encapsulation layer and the sub-pixel.

[0010] The first direction is the thickness direction of the substrate.

[0011] Because the above technical solution uses a dam-like isolation structure to separate the non-transparent encapsulation layer from the light-emitting element, and the non-transparent encapsulation layer serves as a bottom filler layer, its influence on the light emitted by the light-emitting element is minimal or even negligible, significantly reducing light reflectivity and greatly increasing light transmittance, resulting in low light loss and high luminous efficiency. Simultaneously, the non-transparent encapsulation layer covers the pads, making the pads almost unaffected by light reflectivity. Furthermore, the encapsulation layer protects the light-emitting element and substrate from corrosion by moisture, oxygen, and dust, and reduces damage from external mechanical stress. In addition, it can achieve better large-size displays, making this display panel suitable for a wide range of applications and promising for future expansion.

[0012] In some embodiments, along the first direction, the height of the non-transparent encapsulation layer is less than or equal to the height of the bottom surface of the light-emitting element.

[0013] In the above technical solution, by separating the non-transparent encapsulation layer from the top and side surfaces of the light-emitting element, and by using the non-transparent encapsulation layer as a bottom filler layer, the non-transparent encapsulation layer has little or no influence on the light emitted by the light-emitting element. This can significantly reduce the reflectivity of light and significantly increase the transmittance of light, resulting in minimal light efficiency loss. This allows the display panel to have both high transmittance and low reflectivity, and excellent light emission performance.

[0014] In some embodiments, along the first direction, the height of the dam isolation structure is less than or equal to the height of the bottom surface of the light-emitting element.

[0015] In the above technical solution, the non-transparent encapsulation layer is separated from the top and side surfaces of the light-emitting element by the dam isolation structure. At this time, the non-transparent encapsulation layer acts as the bottom filler layer, so that the non-transparent encapsulation layer has little or no influence on the light emitted by the light-emitting element, thereby greatly reducing the reflectivity of light and greatly increasing the transmittance of light. The light efficiency loss is small, so that the display panel has both high transmittance and low reflectivity, and good light emission effect.

[0016] In some embodiments, the non-transparent encapsulation layer does not contact the sides, top, and bottom of the light-emitting element.

[0017] In the above technical solution, the non-transparent encapsulation layer is separated from the top, side and bottom surfaces of the light-emitting element. The non-transparent encapsulation layer serves as the bottom filler layer, which makes the influence of the non-transparent encapsulation layer on the light emitted by the light-emitting element very small or even non-existent. This further reduces the reflectivity of light and further increases the transmittance of light, resulting in very small light efficiency loss. This allows the display panel to have both high transmittance and low reflectivity, resulting in excellent light emission performance.

[0018] In some embodiments, the dam isolation structure is configured not to contact the welding pads;

[0019] The spacing between the dam isolation structure and the pad along the second direction is greater than or equal to 5 μm; wherein, the second direction is perpendicular to the thickness direction of the substrate.

[0020] The above technical solution can further reduce the risk of the non-transparent encapsulation layer covering the light-emitting element, so that the non-transparent encapsulation layer will not come into contact with the light-emitting element as much as possible.

[0021] In some embodiments, the cross-section of the dam isolation structure along the first direction includes a side, a first side facing away from the front side, and a second side close to the front side. The first side and the second side are connected by the side, and the length of the first side along the second direction is less than or equal to the length of the second side along the second direction. The second direction is perpendicular to the thickness direction of the substrate.

[0022] The length of the second edge along the second direction is 5μm~20μm.

[0023] In the above technical solution, by setting the length of the second side of the dam isolation structure along the first direction to be greater than the length of the first side away from the substrate, the non-transparent encapsulation layer can better climb and follow the shape of the dam isolation structure, thereby minimizing the risk of the non-transparent encapsulation layer covering the light-emitting element and ensuring that the non-transparent encapsulation layer does not come into contact with the light-emitting element as much as possible.

[0024] In some embodiments, the transmittance of the non-transparent encapsulation layer is less than or equal to 70%.

[0025] In the above technical solution, the non-transparent encapsulation layer has very low transmittance and is almost opaque.

[0026] In some embodiments, each sub-pixel also includes a pin, and the light-emitting element is bonded to the pad via the pin;

[0027] The non-transparent encapsulation layer also covers at least a portion of each pin.

[0028] In the above technical solution, by setting a non-transparent encapsulation layer to cover at least a portion of each pin, the influence of the pin's reflectivity on light can be reduced.

[0029] Secondly, a method for manufacturing a display panel is provided, comprising the following steps:

[0030] A substrate is provided; wherein the substrate includes a front side and a back side, the front side and the back side being disposed opposite to each other;

[0031] Multiple pixel units are arranged in an array on the front side; wherein each pixel unit includes multiple sub-pixels arranged in an array, each sub-pixel includes a light-emitting element and a pad, the pad is connected to the front side, and the light-emitting element is bonded to the pad; the light-emitting element has a side, a top surface opposite to the front side and a bottom surface close to the front side, and the top surface and the bottom surface are connected through the side.

[0032] A dam isolation structure is formed between any two adjacent sub-pixels; wherein the dam isolation structure is arranged around the sub-pixel, the dam isolation structure does not contact the light-emitting element, the height of the dam isolation structure along the first direction is less than or equal to the height of the light-emitting element along the first direction, and the material of the dam isolation structure is an organic material.

[0033] A non-transparent encapsulation layer is formed on the side of the dam isolation structure away from the front, the side of the pad away from the front, and the front by using a liquid non-transparent material; wherein, the initial height of the liquid non-transparent material is less than or equal to the height of the dam isolation structure along the first direction, and the height of the non-transparent encapsulation layer along the first direction is less than or equal to the height of the light-emitting element along the first direction.

[0034] At least a semi-transparent encapsulation layer is formed on the side where both the non-transparent encapsulation layer and the sub-pixels are away from the front side;

[0035] The first direction is the thickness direction of the substrate.

[0036] Because the above technical solution employs an underfill process, which bonds and connects the light-emitting elements on the substrate, and then allows the liquid non-transparent material to flow level onto the front of the dam isolation structure, pads, and substrate, the liquid non-transparent material during the leveling process will be adsorbed onto the front of the dam isolation structure, pads, and substrate, and will rarely or almost never climb onto the light-emitting elements, especially avoiding climbing onto the sides and top of the light-emitting elements. This reduces the bottleneck of uneven distribution of the liquid non-transparent material and climbing onto the surface of the light-emitting elements, thereby achieving high light transmittance and low reflectance. In addition, this preparation method is simple and easy to implement, which is conducive to industrial production and application.

[0037] Thirdly, a display device is provided, comprising a display panel as described above or a display panel prepared by the method described above.

[0038] Because the above technical solution can reduce the reflectivity of light and increase the transmittance of light, and can achieve better large-screen display, the display device has better overall performance and is conducive to industrial production and application. Attached Figure Description

[0039] Figure 1 A schematic diagram of the structure of a display panel provided by related technologies is shown;

[0040] Figure 2 A schematic diagram of the structure of a display panel provided by related technologies is shown;

[0041] Figure 3 A schematic diagram of the structure of a display panel provided by related technologies is shown;

[0042] Figure 4 The present application provides schematic diagrams of the structure of a display panel according to some embodiments.

[0043] Figure 5 The present application provides schematic diagrams of the structure of a display panel according to some embodiments.

[0044] Figure 6 A top view of a display panel provided in some embodiments of this application is shown;

[0045] Figure 7 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0046] Figure 8 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0047] Figure 9 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0048] Figure 10 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0049] Figure 11 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0050] Figure 12 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0051] Figure 13 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0052] Figure 14 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0053] Figure 15 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0054] Figure 16 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown;

[0055] Figure 17 A process flow diagram of the manufacturing process of a display panel provided in some embodiments of this application is shown. Detailed Implementation

[0056] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0057] In the description of the embodiments of this application, the term "at least one" refers to one or more, and "more than one" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0058] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on or indirectly on the other component. When a component is referred to as "connected to" another component, it can be directly connected to or indirectly connected to the other component.

[0059] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0060] It should be understood that "electrical connection" in the embodiments of this application can be understood as physical contact and electrical conduction between components, or as the form of connection between different components in the circuit structure through a physical line that can transmit electrical signals.

[0061] In the description of the embodiments of this application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0062] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0063] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0064] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments in any suitable manner.

[0065] The advantages of μLED and Mini LED lie in their self-emissive nature, high brightness, high contrast, high resolution and color saturation, long lifespan, fast response speed, and low power consumption. As a result, they have been widely researched and applied in various fields, from micro-displays to consumer electronics to large-screen displays, and are recognized by the industry as a next-generation display technology with great development potential.

[0066] After die bonding or mass transfer, existing display panels composed of LEDs such as μLED and Mini LED usually require LED encapsulation to provide sufficient physical and electrical protection for the LEDs. This reduces the risk of LED failure due to long-term exposure to air or mechanical damage. It also provides functions such as light shielding and anti-reflection, thereby improving the stability of the LEDs and giving them good luminous effect and long lifespan.

[0067] Currently, commonly used LED packaging solutions in the industry include, but are not limited to, the following: Solution 1, such as... Figure 1 As shown, the LED can be bonded to the substrate 1 using a molding process. Then, a non-transparent encapsulation material 5 is applied to the LED using a mold pressing or injection molding method, and cured to form the desired shape. This process protects the LED, isolates it from moisture and oxygen, and enhances its optical performance. Simultaneously, the ash process can be used to remove photoresist and organic contaminants from the LED surface using plasma (e.g., oxygen plasma), cleaning the surface and reducing the impact of impurities on yield. It can also remove the portion of the non-transparent encapsulation material 5 located on the top of the LED away from the substrate 1, thus not affecting the top light emission of the LED. This process is complex.

[0068] but, Figure 1 The light emitted from the sides of the LEDs (including but not limited to red LED 21, green LED 22, and blue LED 23) is blocked by the non-transparent encapsulation material 5, resulting in significant sidewall light loss. Generally, the transmittance of the display panel in Scheme 1 is less than 50%, and the reflectivity is less than or equal to 2%. Moreover, since the molding process requires lamination, the non-transparent encapsulation material 5 will stretch the entire large-size substrate, and in severe cases, it will pull up the large-size substrate, making it prone to warping. This makes Scheme 1 difficult to apply to LEDs and their encapsulation on large-size substrates.

[0069] Option 2, such as Figure 2 As shown, a black anisotropic conductive film 6 can be used as the underfill material for components such as thin-film transistors (TFTs) in the substrate 1. Specifically, the LED pins 3 can be bonded to the raised pads 4 on the substrate 1 via thermoforming to achieve conductivity. The black anisotropic conductive film 6 at locations without pads 4 is not conductive, and a semi-transparent film 7 is superimposed to fix and protect the LED. Generally, the transmittance of the display panel in Scheme 2 is less than or equal to 50%, and the reflectivity is less than or equal to 5%.

[0070] but, Figure 2 The cost of the black anisotropic conductive film 6 is relatively high, and due to the limitations of the performance and manufacturing process of the black anisotropic conductive film 6 itself, Scheme 2 is difficult to apply to LEDs and their packaging on large-size substrates.

[0071] Option 3, such as Figure 3As shown, before LED bonding, a black matrix (BM) 8 can be coated on substrate 1, and then the black matrix 8 around the pads 4 can be completely etched away using a high-precision photolithography process to expose all the pads 4. This solution can achieve good uniformity of the black color of the display panel.

[0072] However, based on existing processes, Figure 3 The black matrix 8 will inevitably leave residue in the pad 4 area, requiring further processing using an etching process, which is quite complex. Simultaneously, because most of the black matrix 8 around pad 4 is etched away, the edges of pad 4 are exposed. This exposed pad 4 affects the reflectivity of the display panel, resulting in a reflectivity of around 3%, which is difficult to reduce further.

[0073] This demonstrates that various materials and processes have been used in related technologies to provide multiple solutions for LED packaging. However, traditional packaging solutions often suffer from the inability to balance transmittance and reflectivity, and are typically complex in process, making them unsuitable for applications on large-size substrates.

[0074] Therefore, in order to make the display panel have both high transmittance and low reflectance, while also being simple to implement and well-suited for large-size substrates, this application provides a display panel. This display panel uses a dam-like isolation structure formed by organic materials to separate the non-transparent encapsulation layer from the light-emitting element. The non-transparent encapsulation layer, acting as a bottom filler layer, has little or no impact on the light emitted by the light-emitting element, significantly reducing light reflectance and greatly increasing light transmittance, resulting in low light loss and good luminous efficiency. Furthermore, the non-transparent encapsulation layer and at least a semi-transparent encapsulation layer together protect the light-emitting element and substrate from corrosion by moisture, oxygen, and dust, and reduce damage from external mechanical stress. In addition, it can achieve good large-size display capabilities. This display panel has a wide range of applications and great potential for future expansion.

[0075] Based on the above, the embodiments of this application do not impose any restrictions on the specific types of display panels and display devices using them. Display panels can have various implementation methods, such as including but not limited to televisions, augmented reality (AR) glasses, virtual reality (VR) glasses, projectors, head-up displays (HUDs), digital car lights, or embedded image displays.

[0076] To facilitate a further understanding of the technical solutions in some embodiments of this application, the technical solutions of the display panel and its manufacturing method, the display device, and how these technical solutions solve the aforementioned technical problems are described in detail below with reference to specific embodiments and accompanying drawings. Each embodiment can be combined with others, and the same or similar concepts or processes may not be repeated in some embodiments. Obviously, the described embodiments are only some embodiments of this application, not all embodiments.

[0077] This application provides a display panel, such as... Figures 4 to 6 As shown, the display panel includes: a substrate 1, multiple pixel units 20 arranged in an array, a dam isolation structure 9, and an encapsulation layer 10.

[0078] Please refer to this again. Figures 4 to 6 The substrate 1 includes a front side 101 and a back side 102, which are disposed opposite to each other. Multiple pixel units 20 arranged in an array are disposed on the front side 101 of the substrate 1. Each pixel unit 20 includes multiple sub-pixels 2 arranged in an array. Each sub-pixel 2 includes a light-emitting element and a pad 4. The pad 4 is connected to the front side 101 of the substrate 1, and the light-emitting element is bonded to the pad 4. The light-emitting element has a side surface, a top surface facing away from the front side 101 of the substrate 1, and a bottom surface facing away from the front side 101 of the substrate 1. The top surface and bottom surface of the light-emitting element are connected through the side surface of the light-emitting element. A dam-like isolation structure 9 is disposed between any two adjacent... Between each sub-pixel 2, a dam isolation structure 9 is arranged around the sub-pixel 2. The dam isolation structure 9 does not contact the light-emitting element. The height of the dam isolation structure 9 along the first direction is less than or equal to the height of the light-emitting element along the first direction. The material of the dam isolation structure is an organic material. The encapsulation layer 10 includes a non-transparent encapsulation layer 111 and at least a semi-transparent encapsulation layer 112. The non-transparent encapsulation layer 111 covers the dam isolation structure 9, the pad 4 and the front side 101 of the substrate 1. The height of the non-transparent encapsulation layer 111 along the first direction is less than or equal to the height of the light-emitting element along the first direction. The at least semi-transparent encapsulation layer 112 covers the non-transparent encapsulation layer 111 and the sub-pixel 2.

[0079] It should be noted that the first direction ( Figures 4 to 6 The oy direction in the figure represents the thickness direction of substrate 1.

[0080] In applications, the display panel can be an active-drive display panel, that is, a display panel that can be driven autonomously, such as μLED and Mini LED display panels that use active driving.

[0081] In applications, substrate 1 can be a glass substrate, etc. Glass substrates have high transmittance of visible light, so that the light emitted by LEDs will not be significantly blocked or attenuated, thus preserving the brightness and color performance of the image; at the same time, the coefficient of thermal expansion of glass is low and controllable, so that it will not undergo significant warping, shrinkage or deformation during high-temperature processes, ensuring good alignment accuracy of fine circuits and LEDs and other structures.

[0082] The glass substrate can be any shape, such as rectangular or square. Figures 4 to 6 The illustrations are all based on the example of a rectangular glass substrate.

[0083] For example, the glass substrate may include a base glass, circuitry, a driving layer, and a surface modification layer. The base glass may be at least one of aluminosilicate glass, borosilicate glass, etc. The circuitry is primarily metal circuitry, and the material of the metal circuitry may be copper (Cu), etc. The driving layer may be a TFT driving layer, a complementary metal-oxide-semiconductor (CMOS) driving layer, etc., to achieve good control of the LED. The surface modification layer is typically a nanoscale thin film, and the material is often silicon oxide (SiO2) or silicon nitride (SiN). x These structures can improve the adhesion between the main glass and the metal circuitry. Of course, other structures are also possible, but they will not be described in detail here.

[0084] In applications, each pixel unit 20 includes multiple sub-pixels 2 arranged in an array. These sub-pixels 2 can be of the same color or different colors. The colors of the sub-pixels 2 can be distinguished based on the color of the light emitted by the light-emitting element. For example, the light-emitting element may include a red light-emitting diode 21, a green light-emitting diode 22, and a blue light-emitting diode 23. The red light-emitting diode 21 is bonded to multiple corresponding pads 4, the green light-emitting diode 22 is bonded to multiple corresponding pads 4, and the blue light-emitting diode 23 is bonded to multiple corresponding pads 4. However, this is not the only possibility; the specific application will determine the best approach.

[0085] Taking a μLED as an example, a μLED may include a first electrode, an epitaxial wafer, and a second electrode, which are sequentially stacked along the oy direction, starting from the front side of the glass substrate. The first electrode is an N-type electrode and the second electrode is a P-type electrode, or vice versa. The N-type electrode can be made of a metal, such as indium tin oxide (ITO), chromium / platinum / gold (Cr / Pt / Au), titanium / gold (Ti / Au), or titanium / silver / indium tin oxide (Ti / Ag / ITO). The P-type electrode can also be made of a metal, such as Cu, tin (Sn), silver (Ag), gold (Au), or indium (In). An epitaxial wafer typically includes an electron injection layer, a light-emitting layer, and a hole injection layer, which are sequentially stacked along the oy direction, starting from the glass substrate. The light-emitting layer is the light-emitting region of the epitaxial wafer and can confine charge carriers. The material of the light-emitting layer can be multiple quantum wells, etc. The electron injection layer can provide electrons and serve as the N-region of the light-emitting layer. The material of the electron injection layer can be any one of gallium nitride (GaN), gallium phosphide (GaP), or zinc oxide (ZnO). The hole injection layer can provide holes and serve as the P-region of the light-emitting layer. The material of the hole injection layer can be any one of GaN, GaP, or ZnO. In addition, there may be other films, which will not be listed here.

[0086] The bonding between the light-emitting element and the pad 4 means that the light-emitting element can be bonded to the pad 4 through the pin 3, which is not specifically limited here. Based on this, the pad 4 is connected to the front side 101 of the substrate 1, so that the driving layer on the substrate 1 can control the light emission of the light-emitting element.

[0087] Pad 4 can be Cu and its stack, Au and its alloys, Sn and its alloys, etc.

[0088] In applications, the setting of the dam isolation structure 9 between any two adjacent sub-pixels 2 specifically means that one or more dam isolation structures 9 are set between any two adjacent sub-pixels 2, depending on the actual application.

[0089] When multiple dam isolation structures 9 are set between any two adjacent sub-pixels 2, the two adjacent dam isolation structures 9 are separate and spaced apart. The spacing between any two adjacent dam isolation structures 9 can be adjusted according to the size of the sub-pixel 2, the size of the LED, the manufacturing process of the dam isolation structure 9 and its implementation effect.

[0090] The dam isolation structure 9 is specifically set around the sub-pixel 2 in a ring around the perimeter of the sub-pixel 2, so as to ensure that the non-transparent encapsulation layer 111 does not come into contact with the light-emitting element as much as possible through the dam isolation structure 9.

[0091] The height of the dam isolation structure 9 along the oy direction is less than or equal to the height of the light-emitting element along the oy direction. Specifically, the height of the dam isolation structure 9 along the oy direction is less than or equal to the height of the light-emitting layer in the light-emitting element along the oy direction.

[0092] The dam isolation structure 9 is made of organic materials, such as polyimide (PI), benzocyclobutene (BCB), and spin-on glass (SOG). Since inorganic materials, such as SiN, are typically deposited on the surface of the light-emitting element during its fabrication process, this is not the case. x Materials such as SiO2 are used to passivate surface / sidewall defects of the light-emitting element, improve electrical and optical performance, and ensure device stability and process compatibility. In this case, the damming isolation structure 9 is made of organic materials. Compared with inorganic materials, organic materials have higher surface energy, larger wetting angle, and lower free energy. This makes it easier for liquid non-transparent encapsulation materials, such as inks, to be adsorbed and spread on the surface of the damming isolation structure 9. In other words, the adsorption competition between the organic materials of the damming isolation structure 9 and the inorganic materials on the surface of the light-emitting element for the liquid non-transparent encapsulation material is such that the light-emitting element cannot compete with the damming isolation structure 9. This results in the liquid non-transparent encapsulation material being preferentially adsorbed by the damming isolation structure 9, reducing the adsorption of the liquid non-transparent encapsulation material on the light-emitting element, especially on the sides of the light-emitting element, thereby reducing the contact between the non-transparent encapsulation layer 111 formed by the liquid non-transparent encapsulation material and the light-emitting element.

[0093] In practice, each dam isolation structure 9 can have a certain distance between it and the pad 4 in each sub-pixel 2; or, each dam isolation structure 9 can be set to contact the pad 4 in each sub-pixel 2, without specific limitations.

[0094] It should be noted that the dam isolation structure 9 cannot be set above the side of the pad 4 that is away from the substrate 1.

[0095] In the application, the non-transparent encapsulation layer 111 covers the dam isolation structure 9. At this time, the portion of the non-transparent encapsulation layer 111 with a height greater than that of the dam isolation structure 9 ...

[0096] The non-transparent encapsulation layer 111 covers the pad 4, so that the pad 4 is not exposed, thus preventing the pad 4 from affecting the reflectivity of the display panel.

[0097] The non-transparent encapsulation layer 111 covers the front side 101 of the substrate 1, thereby providing good protection for the circuits, driving layers and surface modification layers provided on the front side 101 of the substrate 1, and improving the yield.

[0098] The height of the non-transparent encapsulation layer 111 along the oy direction is less than or equal to the height of the light-emitting element along the oy direction. In this case, the non-transparent encapsulation layer 111 will not contact the top surface or side surface of the light-emitting element. For example, the height of the non-transparent encapsulation layer 111 along the oy direction may be less than or equal to the height of the top surface of the light-emitting element on the side facing away from the front surface 101 of the substrate 1 along the oy direction; or, the height of the non-transparent encapsulation layer 111 along the oy direction may be less than or equal to the height of the bottom surface of the light-emitting element on the side facing away from the front surface 101 of the substrate 1 along the oy direction. No specific limitation is made here.

[0099] At least the semi-transparent encapsulation layer 112 covers the non-transparent encapsulation layer 111 and the sub-pixel 2, thereby serving to fix and protect the light-emitting element.

[0100] At least the semi-transparent encapsulation layer 112 refers to either a semi-transparent encapsulation layer or a fully transparent encapsulation layer, depending on the actual application. The semi-transparent encapsulation layer is made of semi-transparent materials, including but not limited to diffusing powder. While the semi-transparent encapsulation layer slightly reduces the transmittance of light emitted by the LED, it also absorbs reflected light, altering the optical path of the reflected light and making it less prone to reflection. Therefore, the reflectivity of the light emitted by the LED is relatively low. The fully transparent encapsulation layer, made of fully transparent materials, allows all light emitted by the LED to exit directly after entering, without loss or alteration of the optical path. This results in high transmittance of light emitted by the LED, but the reflectivity is not as low as that of the semi-transparent encapsulation layer.

[0101] In this embodiment, the transmittance of the display panel can reach 80% or higher. For example, the transmittance of the display panel can be 80%, 85%, 90%, 95%, or 100%, etc. The higher the transmittance, the more light is emitted, and the better the display effect of the display panel.

[0102] In this embodiment, the reflectivity of the display panel is less than or equal to 2%, and further, the reflectivity of the display panel is less than or equal to 1.5%. For example, the reflectivity of the display panel can be 0.1%, 0.5%, 1%, 1.2%, or 1.5%, etc. The lower the reflectivity, the less light is reflected, and the better the display effect of the display panel.

[0103] The display panel provided in this application embodiment has a liquid non-transparent encapsulation material preferentially attracted by the dam isolation structure formed by organic materials and distributed accordingly on the dam isolation structure, becoming a non-transparent encapsulation layer. Since the height of the dam isolation structure is less than or equal to the height of the light-emitting element, and the dam isolation structure does not contact the light-emitting element, the non-transparent encapsulation layer can be separated from the top and side surfaces of the light-emitting element through the dam isolation structure. At this time, the non-transparent encapsulation layer acts as a bottom filler layer, and its influence on the light emitted by the light-emitting element is minimal or even non-existent, thereby significantly reducing the reflectivity of light (e.g., the reflectivity can reach 2% or less) and significantly increasing the transmittance of light (e.g., the transmittance can reach 80% or more), resulting in minimal light efficiency loss. This allows the display panel to have both high transmittance and low reflectivity, and excellent light emission performance. At the same time, the non-transparent encapsulation layer covers the pads, making the pads have almost no influence on the reflectivity of light. Moreover, the non-transparent encapsulation layer and at least the semi-transparent encapsulation layer together protect the light-emitting element and the substrate from corrosion by moisture, oxygen, dust, etc., and can reduce damage from external mechanical stress. This improves the display effect and reliability of the display panel, and enables better large-size displays, which is beneficial for industrial production and application.

[0104] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this application embodiment, along the oy direction, the height of the non-transparent encapsulation layer 111 is less than or equal to the height of the bottom surface of the light-emitting element.

[0105] The display panel provided in this application embodiment separates the non-transparent encapsulation layer from the top and side surfaces of the light-emitting element. The non-transparent encapsulation layer serves as a bottom filler layer, which makes the influence of the non-transparent encapsulation layer on the light emitted by the light-emitting element very small or even non-existent. This can significantly reduce the reflectivity of light and significantly increase the transmittance of light, resulting in minimal light efficiency loss. The display panel thus combines high transmittance and low reflectivity, and has good light emission performance.

[0106] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this application embodiment, along the oy direction, the height of the dam isolation structure 9 is less than or equal to the height of the bottom surface of the light-emitting element.

[0107] In the display panel provided in this application embodiment, the liquid non-transparent encapsulation material is preferentially attracted by the dam isolation structure formed by the organic material and distributed in a conformal manner on the dam isolation structure, becoming a non-transparent encapsulation layer. The dam isolation structure realizes the separation of the non-transparent encapsulation layer from the top and side surfaces of the light-emitting element. At this time, the non-transparent encapsulation layer acts as a bottom filler layer, and its influence on the light emitted by the light-emitting element is minimal or even non-existent. This can significantly reduce the reflectivity of light and significantly increase the transmittance of light, resulting in minimal light efficiency loss. This allows the display panel to have both high transmittance and low reflectivity, and good light emission effect.

[0108] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this embodiment, the non-transparent encapsulation layer 111 does not contact the side, top, and bottom surfaces of the light-emitting element.

[0109] The display panel provided in this application embodiment has a liquid non-transparent encapsulation material that is preferentially attracted by the dam isolation structure formed by organic materials and distributed in a conformal manner on the dam isolation structure, becoming a non-transparent encapsulation layer. The non-transparent encapsulation layer is separated from the top, side and bottom surfaces of the light-emitting element. As a bottom filler layer, the non-transparent encapsulation layer has very little or no influence on the light emitted by the light-emitting element, thereby further reducing the reflectivity of light and further increasing the transmittance of light. The light efficiency loss is very small, so that the display panel has both high transmittance and low reflectivity, and the light emission effect is very good.

[0110] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this embodiment, the dam isolation structure 9 and the pad 4 are not in contact, and the distance between the dam isolation structure 9 and the pad 4 along the second direction is greater than or equal to 5μm.

[0111] Among them, the second direction ( Figures 4 to 6 The ox direction in the substrate is perpendicular to the thickness direction of the substrate.

[0112] For example, the spacing between the dam isolation structure 9 and the pad 4 along the ox direction can be 5μm, 6μm, 7μm, 8μm, 9μm or 10μm, etc.

[0113] The display panel provided in this application embodiment, by setting a dam isolation structure and pads, especially with a distance of 5μm or more between the dam isolation structure and the metal pads, can further form an opaque encapsulation layer by preferentially adsorbing liquid opaque encapsulation material through the dam isolation structure made of organic material. This reduces the risk of the opaque encapsulation layer climbing onto the outer surface of the light-emitting element, especially the side of the light-emitting element, so that the opaque encapsulation layer will not come into contact with the light-emitting element as much as possible.

[0114] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this application embodiment, the cross section of the dam isolation structure 9 along the oy direction includes a side, a first side on the side away from the front face 101 of the substrate 1, and a second side on the side close to the front face 101 of the substrate 1. The first side and the second side are connected by the side. The length of the first side along the ox direction is less than or equal to the length of the second side along the ox direction. The length of the second side along the ox direction is 5μm to 20μm.

[0115] In applications, the cross-sectional shape of the dam isolation structure 9 along the oy direction can be any of the following: square, rectangle, trapezoid, etc. Taking a square cross-sectional shape of the dam isolation structure 9 along the oy direction as an example, the cross-sectional shape of the dam isolation structure 9 along the oy direction includes two sides, and the first side is connected to the second side through the two sides.

[0116] For example, the length of the second edge along the ox direction can be 5μm, 8μm, 10μm, 13μm, 17μm or 20μm, etc.

[0117] The display panel provided in this application embodiment, by setting the length of the second side of the dam isolation structure along the first direction, which is closer to the front side of the substrate, is greater than the length of the first side away from the front side of the substrate, can allow the liquid non-transparent encapsulation material to better climb and conform to the shape of the dam isolation structure made of organic material, and form a non-transparent encapsulation layer. This minimizes the risk of the non-transparent encapsulation layer covering the surface of the light-emitting element, especially the side of the light-emitting element, and makes the non-transparent encapsulation layer as completely non-contact with the light-emitting element as possible.

[0118] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this application embodiment, the transmittance of the non-transparent encapsulation layer 111 is less than or equal to 70%.

[0119] In applications, the non-transparent material of the non-transparent encapsulation layer 111 is preferably a black material, such as black ink.

[0120] The display panel provided in this application embodiment has a very low transmittance of the non-transparent encapsulation layer, making it almost opaque.

[0121] In some embodiments, such as Figures 4 to 6 As shown, in the display panel provided in this application embodiment, each sub-pixel also includes a pin 3, the light-emitting element and the pad 4 are bonded through the pin 3, and the non-transparent encapsulation layer also covers at least a portion of each pin 3.

[0122] It should be noted that the number of pins 3 can be determined based on the number of pads 4. Generally, the number of pins 3 is the same as the number of pads 4.

[0123] It should be understood that "the non-transparent encapsulation layer also covers at least a portion of each pin 3" means that the non-transparent encapsulation layer can also cover a portion of each pin 3; or, the non-transparent encapsulation layer can also cover the entirety of each pin 3, without any specific limitation here.

[0124] It should be noted that before the light-emitting elements are fabricated on the wafer and transferred in large quantities to the glass substrate, each light-emitting element already has at least one pin 3 formed. Each pin 3 is a structure with a certain height and volume; for example, the shape of the pin 3 can be a cuboid, a cube, etc. Thus, the non-transparent encapsulation layer 111 can be kept out of contact with the bottom surface of the light-emitting element through the pin 3.

[0125] The display panel provided in this application embodiment reduces the influence of the pins on the reflectivity of light by providing a non-transparent encapsulation layer that covers at least a portion of each pin.

[0126] This application embodiment also provides a method for manufacturing a display panel, which may include the following steps:

[0127] S1, Provide a substrate.

[0128] The substrate includes a front side and a back side, which are arranged opposite to each other.

[0129] S2. Multiple pixel units are arranged in an array on the front side of the substrate.

[0130] Each pixel unit includes multiple sub-pixels arranged in an array. Each sub-pixel includes a light-emitting element and a pad. The pad is connected to the front side, and the light-emitting element is bonded to the pad. The light-emitting element has a side, a top surface facing away from the substrate, and a bottom surface facing near the substrate. The top surface and the bottom surface are connected through the side.

[0131] S3. Use organic materials to form a dam isolation structure between any two adjacent sub-pixels.

[0132] The dam isolation structure is set around the sub-pixel, and the dam isolation structure does not contact the light-emitting element. The height of the dam isolation structure along the oy direction is less than or equal to the height of the light-emitting element along the oy direction.

[0133] S4. An opaque encapsulation layer is formed on the side of the dam isolation structure facing away from the front of the substrate, the side of the pad facing away from the front of the substrate, and the front of the substrate using a liquid opaque material.

[0134] Among them, the initial height of the liquid non-transparent material is less than or equal to the height of the dam isolation structure along the oy direction, and the height of the non-transparent encapsulation layer along the oy direction is less than or equal to the height of the light-emitting element along the oy direction.

[0135] In some embodiments, the non-transparent encapsulation layer does not contact the side of the light-emitting element. In some embodiments, the contact area is smaller than the contact area in the prior art; for example, the non-transparent encapsulation layer contacts a portion of the side of the light-emitting element.

[0136] S5. At least a semi-transparent encapsulation layer is formed on the side where both the non-transparent encapsulation layer and the sub-pixels are away from the substrate.

[0137] In this application, taking liquid non-transparent material as liquid black ink and inkjet printing (IJP) of liquid black ink as an example, the initial height of the liquid non-transparent material refers to the height of the liquid black ink initially located on the left and / or right side of the dam isolation structure along the ox direction during IJP. This height needs to be less than or equal to the height of the dam isolation structure along the first direction, that is, the liquid black ink cannot overflow the dam isolation structure before IJP. In this way, while calculating an appropriate amount of liquid black ink in advance, and based on the fact that the organic material of the dam isolation structure has a larger surface energy, a larger wetting angle, and a lower free surface than the inorganic material on the surface of the light-emitting element, the liquid black ink will be preferentially adsorbed by the dam isolation structure and more easily adsorbed and spread on the surface of the dam isolation structure. This can ensure that the liquid black ink does not climb to the side of the light-emitting element and the top surface away from the substrate during the IJP printing process.

[0138] It should be noted that the substrate, pixel unit, dam isolation structure, non-transparent encapsulation layer and semi-transparent encapsulation layer in the embodiments of this application can all refer to the above embodiments, and will not be repeated here.

[0139] The display panel fabrication method provided in this application involves bonding and connecting light-emitting elements on a substrate, followed by an underfill process to allow liquid non-transparent material to flow onto the dam isolation structure, pads, and the front side of the substrate. During this flow, the liquid material preferentially adheres to the dam isolation structure made of organic material, and rarely or never climbs onto the light-emitting elements with inorganic material on their surface. In particular, it does not flow onto the sides of the light-emitting elements, and it is even more difficult to flow onto the top surface of the light-emitting elements. This reduces the bottleneck of uneven distribution of liquid non-transparent material and its climbing onto the light-emitting elements, thereby achieving high light transmittance and low reflectance. Furthermore, this fabrication method is simple and easy to implement, which is beneficial for industrial production and application.

[0140] Please refer to the following. Figures 7 to 17 Taking glass substrate 11 as an example, the preparation method of the dam isolation structure 9 in the embodiments of this application will be specifically described.

[0141] Step 1, as follows Figure 7 As shown, two pads 4 are formed on the front side of the glass substrate 11 along the oy direction, and a protective layer 12 is formed on the front side of the glass substrate 11, the side of the pads 4, and the upper surface of the pads 4 facing away from the glass substrate 11.

[0142] Among them, the upper surface of the pad 4 that is away from the glass substrate 11 is the upper surface that is connected to the side of the pad 4.

[0143] It should be noted that the protective layer 12 may also only cover the side of the pad 4, without covering the upper surface of the pad 4 that is away from the glass substrate 11. No specific limitation is made here.

[0144] The thickness of the protective layer 12 along the oy direction is 3000 Å to 4000 Å. For example, the thickness of the protective layer 12 along the oy direction can be 3000 Å, 3200 Å, 3400 Å, 3600 Å, 3800 Å, or 4000 Å. The protective layer 12 can both side-cover the pad 4 to reduce the contact of the subsequent etching solution with the side of the pad 4, and reduce the risk of the bonding force between the pad 4 and the glass substrate 11 being reduced due to the side of the pad 4 being etched, thereby achieving good protection for the pad 4, the glass substrate 11, and the circuits, driving layers, and surface modification layers provided on the front side of the glass substrate 11 through the protective layer 12; moreover, the protective layer 12 is very thin, so that it will not affect the light efficiency due to excessive thickness.

[0145] The protective layer 12 can be made of an insulating material, such as an inorganic insulating material. Inorganic insulating materials include, but are not limited to, SiO2 and SiN. x wait.

[0146] Step 2, as follows Figure 8 As shown, along the oy direction, a first planarization layer 13 is formed on the side of the protective layer 12 and the pad 4 away from the glass substrate 11.

[0147] The first planarization layer 13 can be deposited and formed by physical vapor deposition (PVD) process. The first planarization layer 13 can be one or more layers, and no specific limitation is made here.

[0148] The thickness of the first planarization layer 13 along the oy direction is 1μm to 3μm. For example, the thickness of the first planarization layer 13 along the oy direction can be 1μm, 2μm or 3μm, etc.

[0149] Step 3, as follows Figure 9 As shown, along the oy direction, a first photoresist 14 is coated on the side of the first planarization layer 13 facing away from the glass substrate 11.

[0150] The first photoresist 14 is a positive photoresist, which allows the exposed area to be removed while retaining the unexposed area.

[0151] Step 4, as follows Figure 10 As shown, the first photoresist 14 is exposed and developed to etch away the first photoresist 14 corresponding to the pad 4.

[0152] Step 5, as follows Figure 11As shown, the first photoresist 14 is exposed and developed, and the first planarization layer 13 corresponding to the pad 4 is etched to expose the upper surface of the pad 4 on the side away from the glass substrate 11 where the first photoresist 14 has been removed.

[0153] It should be noted that the first planarization layer 13 and the first photoresist 14 corresponding to the pad 4 can also be etched in the same step.

[0154] Step 6, as follows Figure 12 As shown, the remaining first photoresist 14 is removed.

[0155] Step 7, as follows Figure 13 As shown, along the oy direction, a whole layer of PI is formed on the side of the pad 4, the protective layer 12 and the first planarization layer 13 away from the glass substrate 11.

[0156] One of these processes involves depositing and forming a PI layer using PVD technology.

[0157] Step 8, as follows Figure 14 As shown, along the oy direction, a second photoresist 15 is coated on the side of the entire PI layer facing away from the glass substrate 11.

[0158] The second photoresist 15 is a negative photoresist, which allows the exposed area to be preserved and the unexposed area to be removed.

[0159] Step 9, as follows Figure 15 As shown, the second photoresist 15 is exposed, developed, and baked to retain the second photoresist 15 corresponding to the two adjacent pads 4.

[0160] Step 10, as follows Figure 16 As shown, the second photoresist 15 and the entire PI layer are then exposed and developed.

[0161] Step 11, as follows Figure 17 As shown, the second photoresist 15 on the side of each PI away from the glass substrate 11 is removed to form a dam isolation structure 9.

[0162] The thickness of the dam isolation structure 9 along the oy direction is 5μm to 50μm. For example, the thickness of the dam isolation structure 9 along the oy direction can be 5μm, 10μm, 20μm, 30μm, 40μm or 50μm, etc.

[0163] It should be noted that the thickness of the dam isolation structure 9 along the oy direction can be adjusted according to the height of the LED along the oy direction, as long as it does not affect the light emission of the side of the LED and the upper surface of the LED facing away from the glass substrate 11.

[0164] also, Figures 4 to 6 The substrate 1 may include Figures 7 to 17 The glass substrate 11, protective layer 12, and first planarization layer 13, etc., are not specifically limited here.

[0165] Based on the above, further, after forming the LED and connecting it to the pad 4 through the pin 3, liquid black ink can be applied to at least one side of the dam isolation structure 9 along the ox direction. At this time, the initial height of the liquid black ink (the height of the liquid black ink on one side of the dam isolation structure 9 during IJP) is set to be less than or equal to the height of the upper surface of the dam isolation structure 9 along the oy direction and away from the front side of the glass substrate 11. The amount of liquid black ink required for each product is calculated in advance. Then, the liquid black ink is applied. At this time, the liquid black ink is preferentially adsorbed onto the dam isolation structure 9 formed by organic material according to the capillary adsorption effect, and climbs and follows the shape of the surface of the dam isolation structure 9. After curing, a non-transparent encapsulation layer is formed. This non-transparent encapsulation layer will not contact the surface of the light-emitting element, especially the side of the light-emitting element.

[0166] It should be noted that the initial height of the liquid black ink can be adjusted according to the thickness of the non-transparent encapsulation layer to be formed along the oy direction, and the liquid black ink should overflow the dam isolation structure 9 during the IJP process.

[0167] Furthermore, the height of the non-transparent encapsulation layer is determined by the IJP process and the calculated total amount of liquid black ink required for each product. Specifically, in this application, liquid black ink is IJPed from the left and / or right side along the ox direction of the dam isolation structure 9, rather than from the top of the side of the light-emitting element away from the glass substrate 11. Therefore, during IJP, the liquid black ink flows smoothly in a manner similar to water overflowing. When the liquid black ink attempts to climb onto the surface of the light-emitting element, especially the sides, it must first pass through the dam isolation structure 9 formed by the organic material and be preferentially adsorbed onto the organic material based on capillary adsorption. Unless there is a very large amount of liquid black ink remaining, it is difficult to continue climbing onto the sides of the light-emitting element, let alone the top surface, thereby reducing the contact between the liquid black ink and the sides of the light-emitting element.

[0168] The display panel manufacturing method provided in this application involves connecting an LED to a glass substrate and then using an underfill process to print liquid black ink on the glass substrate. During the process of the liquid black ink flowing and covering the entire glass substrate, it is preferentially adsorbed by the damming isolation structure formed by organic materials. That is, the liquid black ink is separated from the LED through the damming isolation structure. As a result, there is almost no liquid black ink on the surface of the LED, especially on the sides. This significantly improves the uneven printing of liquid black ink and the bottleneck of ink climbing to the LED surface. It also reduces the impact of the non-transparent encapsulation layer formed by the liquid black ink on the light output of the LED, reduces light loss, reduces reflectivity, and increases transmittance. This method is simple to implement and is beneficial for industrial production and application.

[0169] This application also provides a display device, including the display panel described above or a display panel prepared by the above-described method.

[0170] The display device provided in this application embodiment can reduce the reflectivity of light (e.g., the reflectivity can reach 2% or less) and increase the transmittance of light (e.g., the transmittance can reach 80% or more). That is, it can effectively improve the transmittance of the display device while reducing the reflectivity, reducing light loss, and achieving better large-screen display. This results in better overall performance of the display device and is beneficial for industrial production and application.

[0171] This section only introduces some content related to the invention point; other content can be obtained by referring to relevant technologies, and will not be explained in detail here.

[0172] It should be understood that the above description is merely to help those skilled in the art better understand the embodiments of this application, and is not intended to limit the scope of the embodiments of this application. Based on the examples given above, those skilled in the art can obviously make various equivalent modifications or changes. For example, some steps in various embodiments of the method may be optional, or new steps may be added; or any combination of two or more of the above embodiments. Such modifications, changes, or combinations also fall within the scope of the embodiments of this application.

[0173] It should also be understood that the above description of the embodiments of this application focuses on highlighting the differences between the various embodiments. Any similarities or differences not mentioned can be referred to each other. For the sake of brevity, they will not be repeated here.

[0174] It should also be understood that the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0175] It should also be understood that the methods, situations, categories, and classifications of embodiments in this application are for the convenience of description only and should not constitute a special limitation. Various methods, categories, situations, and features in embodiments can be combined without contradiction.

[0176] It should also be understood that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0177] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display panel, characterized in that, include: A substrate includes a front side and a back side, wherein the front side and the back side are disposed opposite to each other; Multiple pixel units arranged in an array are disposed on the front side. Each pixel unit includes multiple sub-pixels arranged in an array. Each sub-pixel includes a light-emitting element and a pad. The pad is connected to the front side, and the light-emitting element is bonded to the pad. The light-emitting element has a side, a top surface facing away from the front side, and a bottom surface facing the front side. The top surface and the bottom surface are connected through the side. A dam isolation structure is disposed between any two adjacent sub-pixels. The dam isolation structure surrounds the sub-pixel and does not contact the light-emitting element. The height of the dam isolation structure along a first direction is less than or equal to the height of the light-emitting element along the first direction. The material of the dam isolation structure is an organic material. The dam isolation structure cannot be disposed above the side of the pad facing away from the substrate. The encapsulation layer includes a non-transparent encapsulation layer and at least a semi-transparent encapsulation layer. The non-transparent encapsulation layer covers the dam isolation structure, the pads, and the front side. The height of the non-transparent encapsulation layer along the first direction is less than or equal to the height of the light-emitting element along the first direction. The at least semi-transparent encapsulation layer covers the non-transparent encapsulation layer and the sub-pixel. The non-transparent encapsulation layer does not contact the side, top, or bottom surfaces of the light-emitting element. Wherein, the first direction is the thickness direction of the substrate.

2. The display panel according to claim 1, characterized in that, Along the first direction, the height of the non-transparent encapsulation layer is less than or equal to the height of the bottom surface of the light-emitting element.

3. The display panel according to claim 1 or 2, characterized in that, Along the first direction, the height of the dam isolation structure is less than or equal to the height of the bottom surface of the light-emitting element.

4. The display panel according to claim 1 or 2, characterized in that, The dam isolation structure is configured to not contact the welding pad; The distance between the dam isolation structure and the pad along the second direction is greater than or equal to 5 μm; wherein the second direction is perpendicular to the thickness direction of the substrate.

5. The display panel according to claim 1 or 2, characterized in that, The cross-section of the dam isolation structure along the first direction includes a side, a first side away from the front side, and a second side close to the front side. The first side and the second side are connected through the side. The length of the first side along the second direction is less than or equal to the length of the second side along the second direction. The second direction is perpendicular to the thickness direction of the substrate. The length of the second edge along the second direction is 5μm~20μm.

6. The display panel according to claim 1 or 2, characterized in that, The transmittance of the non-transparent encapsulation layer is less than or equal to 70%.

7. The display panel according to claim 1 or 2, characterized in that, Each of the sub-pixels also includes a pin, through which the light-emitting element is bonded to the pad; The non-transparent encapsulation layer also covers at least a portion of each of the pins.

8. A method for manufacturing a display panel, characterized in that, Includes the following steps: A substrate is provided; wherein the substrate includes a front side and a back side, the front side and the back side being disposed opposite to each other; Multiple pixel units are arranged in an array on the front side; wherein each pixel unit includes multiple sub-pixels arranged in an array, each sub-pixel includes a light-emitting element and a pad, the pad is connected to the front side, and the light-emitting element is bonded to the pad; the light-emitting element has a side surface, a top surface facing away from the front side, and a bottom surface facing the front side, the top surface and the bottom surface are connected through the side surface; A dam isolation structure is formed between any two adjacent sub-pixels; wherein the dam isolation structure is arranged around the sub-pixel, the dam isolation structure does not contact the light-emitting element, the height of the dam isolation structure along the first direction is less than or equal to the height of the light-emitting element along the first direction, and the material of the dam isolation structure is an organic material; the dam isolation structure cannot be arranged above the side of the pad facing away from the substrate. A non-transparent encapsulation layer is formed on the side of the dam isolation structure opposite to the front, the side of the pad opposite to the front, and the front using a liquid non-transparent material; wherein the initial height of the liquid non-transparent material is less than or equal to the height of the dam isolation structure along a first direction, and the height of the non-transparent encapsulation layer along the first direction is less than or equal to the height of the light-emitting element along the first direction; the non-transparent encapsulation layer does not contact the side, top, or bottom surfaces of the light-emitting element; At least a semi-transparent encapsulation layer is formed on the side of both the non-transparent encapsulation layer and the sub-pixel that is opposite to the front side; Wherein, the first direction is the thickness direction of the substrate.

9. A display device, characterized in that, The display panel includes the display panel as described in any one of claims 1 to 7 or the display panel prepared by the method described in claim 8.

Images