Silicon wafer surface cleanliness detection and active intervention deviation correction device of TBC battery

Abstract

The invention discloses a TBC battery silicon wafer surface cleanliness detection and active intervention deviation correction device, which comprises a roller assembly, and also comprises a frame which is suspended above the roller assembly and is provided with a light source; the detection modules are arranged on the frame, and four groups of detection modules are symmetrically arranged in a manner of corresponding to four edges of the silicon wafer; the roller assembly comprises a magnetic suspension roller shaft, a capillary roller and a roller; and the central module is electrically connected with the detection module and the magnetic suspension roll shaft. By arranging the magnetic suspension roll shaft, the roller rolls in a suspension manner, so that the horizontal supporting stability of the silicon wafer is improved, the heights of the liquid medicine in contact with the left and right sides of the silicon wafer are effectively kept consistent, and the winding surface is uniformly removed; besides, the edge of the silicon wafer is detected in real time through the detection module, and when the edge of the silicon wafer is not clean, the central module independently controls the corresponding magnetic suspension roll shaft to change the horizontal angle and the rotating speed so as to adjust the conveying posture of the silicon wafer to recover the horizontal stability.

Description

Technical Field

[0001] The present invention relates to the technical field of crystalline silicon cell manufacturing, and specifically relates to a device for detecting the cleanliness of the silicon wafer surface of a TBC cell and actively intervening and correcting deviations. Background Art

[0002] In the preparation process of TBC cells, when boron-doped amorphous silicon or phosphorus-doped amorphous silicon is prepared on one side of the silicon wafer, since the silicon wafers are placed in a quartz boat and prepared by gas-phase diffusion and gas-phase deposition CVD methods, it is inevitable that a part of boron-doped amorphous silicon or phosphorus-doped amorphous silicon will also be deposited or diffused on the edge part of the other side of the silicon wafer, that is, the wrap-around surface. The boron-doped amorphous silicon or phosphorus-doped amorphous silicon deposited on the edge of the silicon wafer will bring higher recombination and lower current density, seriously affecting the preparation of subsequent processes.

[0003] Existing methods such as a method for detecting surface residues of solar silicon wafers after cleaning described in CN102062733B. The patent conducts ultraviolet spectral analysis on the water sample filter paper after cleaning the solar silicon wafers. However, this invention requires extracting water samples for testing and analysis, which requires adding process steps and additional personnel operations. Moreover, under the current situation of continuous industrial production, passing the spot check does not fully cover the qualification of all batches of products in the production line at that time period. Therefore, the above invention is not conducive to the process production and does not have a feedback correction action. Additionally, there is also a silicon wafer etching residue online sorting device, a production line having the device, and a method described in CN112151426A. The patent measures the brightness values of the four sides and the edge of the silicon wafer through an infrared light source, quantifies the defective products numerically, and then eliminates the defective products through a conveyor device to achieve the effect that all products passed down are qualified products. The patent describes detecting unqualified products but does not make timely intervention and repair actions on the unqualified products. If the machine fails to continuously produce unqualified products, the device described in the patent needs to continuously sort out unqualified products and does not actively intervene and correct deviations, and is not suitable for dealing with problems when abnormalities occur during the manufacturing process.

[0004] The current solution involves using a chain-type machine to lay silicon wafers flat on capillary rollers with the wound side facing down and the non-wound side facing up, covered with a uniform DI water film. The lower half of the capillary rollers is immersed in an HF / HNO3 / H2SO4 solution. As the capillary rollers drive the silicon wafer forward, they carry the HF / HNO3 / H2SO4 solution to etch the lower surface and edges of the silicon wafer. This method removes residual boron-doped or phosphorus-doped amorphous silicon from the wound side and edges of the wafer. However, the current chain-type machine... Due to factors such as machine level, ground vibration, uneven film thickness, and pressure fluctuations within the etching tank, the height of the etching solution contacting the silicon wafer on both sides may be inconsistent. This can lead to incomplete removal of the wafer's surface curvature, resulting in excessive leakage current in the solar cells, cell failure, and the risk of hot spots in the modules. Furthermore, the horizontal angle and forward trajectory of the silicon wafer are controlled by capillary rollers. If one of these capillary rollers ages or its track malfunctions, it can also easily lead to incomplete etching. Therefore, there is an urgent need for a silicon wafer surface cleanliness detection and active intervention correction device for TBC solar cells to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a device for detecting and actively intervening in the cleanliness of silicon wafers in TBC batteries, so as to overcome the above-mentioned shortcomings in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A device for detecting and actively intervening in the cleanliness of silicon wafers for TBC batteries includes a roller assembly for rolling and cleaning silicon wafers, and further includes: a frame suspended above the roller assembly with a light source mounted thereon; a detection module mounted on the frame, with four sets symmetrically arranged corresponding to the four sides of the silicon wafer; the roller assembly includes a magnetic levitation roller shaft, capillary rollers, and a drum, with the capillary rollers connected between the magnetic levitation roller shaft and the drum to support the drum, and the magnetic levitation roller shaft used to drive the drum to rotate and control the drum to suspend or fall; and a central module electrically connected to the detection module and the magnetic levitation roller shaft, wherein when the detection module detects that the edge of the silicon wafer is not cleanly etched, the central module controls and changes the level and rotation speed of the magnetic levitation roller shaft to adjust the conveying posture of the silicon wafer.

[0008] Preferably, the detection module includes a laser detection module and a micro camera module.

[0009] Preferably, multiple rollers are arranged at equal intervals in the cleaning tank.

[0010] Preferably, the side wall of the cleaning tank is provided with a chamber, and a magnetic levitation bearing is provided in the chamber. One end of the magnetic levitation roller shaft movably passes through the side wall of the cleaning tank and cooperates with the magnetic levitation bearing.

[0011] Preferably, the chamber is equipped with a drive assembly for driving the magnetic levitation roller shaft to rotate.

[0012] Preferably, the drive assembly includes a drive shaft rotatably disposed within the chamber and a vertical shaft that is drive-connected to the drive shaft. A movable sleeve shaft is synchronously rotatably disposed on the vertical shaft, and the upper end of the sleeve shaft is drive-connected to one end of the magnetic levitation roller shaft.

[0013] Preferably, a support body is provided in the cleaning tank between two adjacent rollers, and a lever assembly is provided on the inner wall of the cleaning tank to allow the magnetic levitation roller shaft to move up and down with the support body.

[0014] Preferably, the lever assembly includes a lever that is rotatably mounted on the inner wall of the cleaning pool and a support member that is movable in a lifting manner. The support member supports the end of the magnetic levitation roller shaft and one end abuts against the upper side of one end of the lever. A support plate is provided on the support body that abuts against the upper side of the other end of the lever.

[0015] Preferably, the cleaning tank is equipped with a support that is movably lifted, the support body is rotatably mounted on the support, the support plate is movably mounted on the support, and the movement of the support plate is linked to the lifting of the support. When the support rises, the support plate moves closer to the roller on the side in which the silicon wafer is being transported and comes into contact with it.

[0016] Preferably, the side wall of the support plate is fixedly provided with a sliding pin that slides through the support, and the side wall of the cleaning pool is elastically rotatably provided with a round block, and the round block is provided with a sliding groove that matches the sliding pin.

[0017] In the above technical solution, the beneficial effects of the present invention are:

[0018] The silicon wafer surface cleanliness detection and active intervention correction device of this TBC battery uses a roller assembly consisting of a magnetic levitation roller shaft, capillary rollers, and drums to support and transport the silicon wafers. The drums are suspended and rolled, thereby improving the stability of the horizontal support of the silicon wafers and effectively maintaining the same height of the liquid contact with the silicon wafers on both sides, ensuring uniform removal of the deflection surface. In addition, the detection module detects the edges of the silicon wafers in real time. When the edges of the silicon wafers are not clean, the central module individually controls the corresponding magnetic levitation roller shaft to change the horizontal angle and speed to adjust the transport posture of the silicon wafers and restore horizontal stability, so as to ensure that each silicon wafer is etched clean according to the process requirements.

[0019] It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative only, and are not intended to limit this disclosure.

[0020] This application provides an overview of various implementations or examples of the technology described in this disclosure, and is not a full disclosure of the entire scope or all features of the disclosed technology. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a schematic diagram of the roller assembly structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the cleaning tank structure of the present invention;

[0025] Figure 4 This is a front view cross-sectional structural diagram of the cleaning tank of the present invention;

[0026] Figure 5 This is a side cross-sectional view of the cleaning tank of the present invention;

[0027] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point A;

[0028] Figure 7 This is a schematic diagram of the internal structure of the cleaning tank of the present invention;

[0029] Figure 8 For the present invention Figure 7 A magnified structural diagram at point B in the middle.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1. Frame; 2. Detection module; 3. Magnetic levitation roller; 4. Capillary roller; 5. Roller; 6. Central module; 7. Cleaning tank; 8. Chamber body; 9. Magnetic levitation bearing; 10. Drive shaft; 11. Vertical shaft; 12. Sleeve shaft; 13. Support body; 14. Lever; 15. Support component; 16. Support plate; 17. Support; 18. Sliding pin; 19. Circular block; 20. Sliding groove. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0033] Please see Figure 1-8 This invention provides a silicon wafer surface cleanliness detection and active intervention correction device for TBC batteries, including a roller assembly for rolling and cleaning silicon wafers, and further including: a frame 1 suspended above the roller assembly with a light source mounted thereon; a detection module 2 mounted on the frame 1, with four sets symmetrically arranged corresponding to the four sides of the silicon wafer; the roller assembly includes a magnetic levitation roller shaft 3, capillary rollers 4 and rollers 5, the capillary rollers 4 being connected between the magnetic levitation roller shaft 3 and the rollers 5 to support the rollers 5, the magnetic levitation roller shaft 3 being used to drive the rollers 5 to rotate and control the rollers 5 to be suspended or fall; and a central module 6 electrically connected to the detection module 2 and the magnetic levitation roller shaft 3. When the detection module 2 detects that the edge of the silicon wafer is not cleanly etched, the central module 6 controls and changes the horizontal and rotational speed of the magnetic levitation roller shaft 3 to adjust the conveying posture of the silicon wafer.

[0034] Specifically, the roller assembly supports the horizontal movement of the silicon wafer, the frame 1 is horizontally arranged and suspended above the roller assembly by an external bracket; the light source provides supplementary lighting directly below the frame 1 to ensure clear and accurate acquisition of visual information by the detection module 2; the magnetic levitation roller 3 is suspended during operation; multiple capillary rollers 4 are arranged in a group, evenly distributed along the length of the corresponding roller 5; the outer wall of the roller 5 is patterned to ensure sufficient adhesion of the cleaning solution; the central module 6 receives the visual information collected by the detection module 2, and after processing by the program, controls the corresponding magnetic levitation roller 3 to adjust its horizontal position or speed. Specifically, when a roller 5 malfunctions, the corresponding magnetic levitation roller 3 is de-suspended and falls to a certain height to detach from the support of the silicon wafer, thereby eliminating its influence on the silicon wafer's conveying posture; in addition, all magnetic levitation rollers 3 decelerate synchronously, extending the contact time between the other normally used rollers 5 that remain suspended and the silicon wafer, thereby ensuring the cleaning effect of the cleaning solution. In practical use, this technical solution improves the stability of the horizontal support for the silicon wafer by suspending and rolling the roller 5, effectively maintaining the consistent height of the liquid in contact with the silicon wafer on both sides, and ensuring uniform removal of the winding surface. In addition, the detection module 2 detects the edge of the silicon wafer in real time. When the edge of the silicon wafer is not clean, the central module 6 individually controls the corresponding magnetic levitation roller 3 to change the horizontal angle and speed to adjust the conveying posture of the silicon wafer and restore horizontal stability, so as to ensure that each silicon wafer can be etched cleanly according to the process requirements.

[0035] Compared with the prior art, the TBC battery silicon wafer surface cleanliness detection and active intervention correction device proposed in this embodiment of the invention supports and transports silicon wafers by setting up a roller assembly consisting of a magnetic levitation roller 3, a capillary roller 4, and a roller 5, allowing the roller 5 to levitate and roll, thereby improving the stability of the horizontal support of the silicon wafer, effectively maintaining the same height of the liquid contact with the silicon wafer on both sides, and ensuring uniform removal of the deflection surface; in addition, the detection module 2 detects the edge of the silicon wafer in real time. When the edge of the silicon wafer is not clean, the central module 6 individually controls the corresponding magnetic levitation roller 3 to change the horizontal angle and speed to adjust the conveying posture of the silicon wafer and restore horizontal stability, so as to ensure that each silicon wafer can be etched clean according to the process requirements.

[0036] As a preferred technical solution in this embodiment, the detection module 2 includes a laser detection module and a micro camera module.

[0037] Specifically, the main principle of the laser detection module is to detect surface cleanliness and determine its compliance by comparing the reflectivity difference between the oxide layer and the silicon surface. This detection method is based on diffuse reflection excitation and specific-angle spectral detection technology, where the specific angle refers to the incident angle formed by the laser source and the silicon wafer surface. Because silicon oxide and silicon have different surface roughness, their absorption rates to a fixed wavelength light source differ. By analyzing the reflectivity difference, the cleanliness of the silicon wafer surface can be determined, and proactive intervention and correction can be made based on the detection results. The specific method used by the laser detection module is to detect and calculate the film data within a local coordinate range of the cleaned silicon wafer, such as R... 反射a =P 样品a / P 校准 *R 校准 R 反射b =P 样品b / P 校准 *R 校准 R 反射c =P 样品c / P 校准 *R 校准 ......R 反射n =P 样品n / P 校准 *R 校准 Find R std =∑R 反射（1...n） *x （1...n） / ∑x （1...n） x is the number of data points detected within the local area; when R std ≥35%, deemed acceptable.

[0038] The main working principle of the micro camera module is as follows: within the detection range, by comparing the tower base sizes at each point and through arithmetic processing, a distribution density map of the tower base is generated, thereby quantitatively analyzing whether the test area is cleaned thoroughly. The specific implementation process of this detection method is: at different position areas of the silicon wafer, the micro camera scans and takes pictures vertically. By processing the acquired image data, the tower base size data (D 位置a , D 位置b .......D 位置n ) at each position (such as position a, position b....... position n) are obtained, thereby constructing a tower base size database. Based on this database, a distribution density map of the tower base is further generated, and it is determined whether the proportion of the tower base size ≥ 18μm in the test area exceeds 70%. If it exceeds, the cleaning is determined to be qualified.

[0039] Only when both the laser detection and the analysis of the micro camera's photos are qualified can it be determined as qualified. If the judged unqualified products, according to the position information provided in the database, are fed back to the magnetic levitation roller shaft 3, and the horizontal and transmission speeds are controlled separately to adjust the conveying attitude of the silicon wafer, so as to enhance the wet cleaning degree of each silicon wafer.

[0040] In another embodiment proposed by the present invention, it further includes a cleaning tank 7. A plurality of rollers 5 are arranged at equal intervals in the cleaning tank 7. Specifically, an appropriate amount of liquid medicine is filled in the cleaning tank 7, and the liquid level height submerges 20% - 40% of the lower part of the roller 5; the length of the silicon wafer in the conveying direction is not less than twice the distance between two adjacent rollers 5.

[0041] As a preferred technical solution of this embodiment, a housing 8 is provided on the side wall of the cleaning tank 7. A magnetic levitation bearing 9 is arranged in the housing 8. One end of the magnetic levitation roller shaft 3 penetrates through the side wall of the cleaning tank 7 movably and cooperates with the magnetic levitation bearing 9. Specifically, the housing 8 is provided on both opposite sides of the cleaning tank 7, and the magnetic levitation bearings 9 correspondingly arranged in the two side housings 8 just support both ends of the magnetic levitation roller shaft 3; a kidney-shaped hole for the magnetic levitation roller shaft 3 to penetrate is provided on the side wall of the cleaning tank 7; when the magnetic levitation bearing 9 is powered on and running, the magnetic levitation roller shaft 3 is coaxial and suspended with the magnetic levitation bearing 9, and when the magnetic levitation bearing 9 is powered off, the magnetic levitation roller shaft 3 drops to reduce the height.

[0042] As a preferred technical solution of this embodiment, a driving component for driving the magnetic levitation roller shaft 3 to rotate is arranged in the housing 8. Specifically, the driving component drives each magnetic levitation roller shaft 3 to rotate synchronously, in the same direction and at the same speed to achieve the rolling conveying and cleaning of the silicon wafer.

[0043] As a preferred embodiment, the drive assembly includes a drive shaft 10 rotatably disposed within the housing 8 and a vertical shaft 11 driveably connected to the drive shaft 10. A movable sleeve shaft 12 is synchronously rotatably disposed on the vertical shaft 11. The upper end of the sleeve shaft 12 is driveably connected to one end of the magnetic levitation roller shaft 3. Specifically, the drive shaft 10 is driven by a servo motor, and is horizontally disposed and perpendicular to the axial direction of each magnetic levitation roller shaft 3; the vertical shaft 11 is vertically disposed; the sleeve shaft 12 is sleeved on the upper end of the vertical shaft 11 and connected via a keyway, maintaining synchronous rotation while... Shaft 12 can move axially relative to vertical shaft 11, i.e., it can move up and down. A first bevel gear is coaxially connected to the drive shaft 10, and a second bevel gear meshing with the first bevel gear is coaxially connected to the lower end of vertical shaft 11. A third bevel gear is coaxially connected to the upper end of sleeve shaft 12, and a fourth bevel gear meshing with the third bevel gear is coaxially connected to one end of magnetic levitation roller shaft 3. An L-shaped component is sleeved on this end of magnetic levitation roller shaft 3, and the other end of the bent L-shaped component is sleeved on sleeve shaft 12, thereby maintaining the meshing relationship between the third and fourth bevel gears, so that sleeve shaft 12 moves up and down with magnetic levitation roller shaft 3. In actual use, the drive shaft 10 is driven to rotate by a servo motor, which then drives vertical shaft 11 to rotate. Sleeve shaft 12 rotates synchronously with vertical shaft 11, which in turn drives magnetic levitation roller shaft 3 to rotate. Magnetic levitation roller shaft 3 maintains its transmission relationship with sleeve shaft 12 regardless of whether it is suspended or falling.

[0044] In another embodiment of the present invention, a support body 13 is movably arranged between two adjacent rollers 5 inside the cleaning tank 7. A lever assembly is provided on the inner wall of the cleaning tank 7 to link the magnetic levitation roller 3 with the support body 13 for one-to-one movement. Specifically, multiple support bodies 13 are provided, each located between two adjacent rollers 5. The lever assembly links the roller 5 with the support bodies 13 on both sides. When the roller 5 descends, the support bodies 13 on both sides rise, and vice versa. When the roller 5 loses the magnetic support of the magnetic levitation roller 3 inside, it falls. The height of this fall is linked to the height of the rise of the support body 13, so that the support body 13 can cooperate with the other rollers 5 to horizontally support the silicon wafer. This prevents the silicon wafer from falling after losing the support of one of the rollers 5.

[0045] As a preferred embodiment, the lever assembly includes a lever 14 rotatably mounted on the inner wall of the cleaning tank 7 and a support 15 movably mounted for lifting. The support 15 supports the end of the magnetic levitation roller shaft 3, and one end abuts against the upper side of one end of the lever 14. A support plate 16 is provided on the support body 13, abutting against the upper side of the other end of the lever 14. Specifically, the lever 14 is disposed between the roller 5 and the support body 13, and is close to the inner wall of the cleaning tank 7. The lever 14 rotates in the vertical plane. The levers 14 on both sides of the roller 5 are symmetrically arranged. The support 15 is C-shaped and is fitted to the lower side of the end of the magnetic levitation roller shaft 3. The two ends of the support 15 are at the same height, and the ends are... The support member 15 is positioned higher than the lever 14 and abuts against the upper side of one end of the lever 14. Both ends of the support member 15 abut against the lever 14 on both sides of the roller 5. The support member 15 is slidably connected to the inner wall of the cleaning tank 7 via a slider groove. The support plate 16 extends horizontally to the upper side of the end of the lever 14 away from the support member 15. When the roller 5 falls, the support member 15 descends and presses down on one end of the lever 14, causing the other end of the lever 14 to lift up and push the support plate 16, which in turn causes the support body 13 to rise. When the roller 5 rises, the support plate 16 descends and presses down on one end of the lever 14, causing the other end of the lever 14 to push the support member 15, keeping the support member 15 close to the magnetic levitation roller shaft 3.

[0046] As a preferred embodiment, a support 17 is movably mounted inside the cleaning tank 7. A support body 13 is rolled on the support 17, and a support plate 16 is movably mounted on the support 17. The movement of the support plate 16 is linked to the lifting and lowering of the support 17. When the support 17 rises, the support plate 16 moves closer to and abuts against the roller 5 on the side where the silicon wafer is being transported. Specifically, the support 17 is horizontally arranged and parallel to the axial direction of the roller 5. The inner wall of the cleaning tank 7 is provided with a groove that matches the support 17. The two opposite sides of the support 17 are embedded in the groove to be guided for lifting and lowering. The support body 13 is preferably cylindrical. The gap between the lowest end of the support body 13 and the upper surface of the support plate 16 is preferably 1-3 mm. The support plate 16 moves horizontally; the weight of the rolling assembly is much greater than the total weight of all components on the support 17; a sliding pin 18 is fixedly installed on the side wall of the support plate 16, which slides through the support 17; a circular block 19 is elastically rotatably installed on the side wall of the cleaning tank 7; a sliding groove 20 matching the sliding pin 18 is provided on the circular block 19; the axis of the sliding pin 18 is parallel to the axis of the support body 13; the axis of the circular block 19 is parallel to the axis of the sliding pin 18; the center of the circular block 19 is correspondingly set to the lower end of the sliding groove 20; the outer ring of the circular block 19 is connected to the side wall of the cleaning tank 7 through a coil spring; under the elastic force of the coil spring, the circular block 19 automatically maintains itself in a direction that tilts the upper end of the sliding groove 20 toward the direction from which the silicon wafer is transported. In practical use, when any roller 5 malfunctions, the corresponding magnetic levitation roller shaft 3 falls, triggering the levers 14 on both sides to push the support plate 16 upward. The support plate 16 then drives the support 17 and the support body 13 to rise to the position supporting the silicon wafer. Simultaneously, the support plate 16 moves horizontally under the relative movement of the sliding pin 18 and the sliding groove 20 to approach the roller 5 on the side where the silicon wafer is being transported. The support plate 16 on the support 17 on the side where the silicon wafer is being transported abuts against the outer wall of the roller 5 at its normal height. The circular block 19 corresponding to this support plate 16 will rotate at a certain angle against the elastic force to ensure that the support plate 16 abuts against the roller 5 on that side, avoiding interference and moving away from the silicon wafer transport. The support plate 16 on the support 17 on the side facing the incoming direction abuts against the outer wall of the roller 5 after it has descended in height. The circular block 19 corresponding to this support plate 16 does not rotate or rotates at a smaller angle against the elastic force, so as to ensure that the support plate 16 abuts against the roller 5 on that side and avoids interference. Thus, as the roller 5 continues to rotate, the residual liquid on it can be scraped onto the support plate 16 after passing through it. As the silicon wafer passes through the support body 13, the support body 13 is passively rotated, and the support body 13 picks up the liquid collected in the gap between itself and the support plate 16. Then, by rolling, the liquid is also applied to the silicon wafer, thereby compensating for the loss of liquid application after the roller 5 descends, and ensuring that the cleaning effect is not weakened. Among them, the elastically rotating circular block 19 can passively adjust the distance between the upper end of the sliding groove 20 and the roller 5, thereby ensuring that the support plate 16 abuts against the outer wall of the roller 5 at different height positions.

[0047] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A device for detecting and actively intervening to correct the surface cleanliness of a silicon wafer of a TBC cell, comprising a roller assembly for rolling transport and cleaning of the silicon wafer, characterized in that, Also include: Frame (1), which is suspended above the roller assembly, which is provided with a light source; Detection module (2) is provided on the frame (1), and four groups are symmetrically arranged in a manner corresponding to the four edges of the silicon wafer; Roller assembly includes magnetic suspension roller shaft (3), capillary roller (4) and roller (5), capillary roller (4) is connected between magnetic suspension roller shaft (3) and roller (5) to support roller (5), magnetic suspension roller shaft (3) is used for driving roller (5) to rotate and controlling roller (5) to be suspended or to fall; Central module (6) is electrically connected with detection module (2) and magnetic suspension roller shaft (3), when detection module (2) detects that the edge of the silicon wafer is not etched cleanly, central module (6) controls to change the horizontal and rotating speed of magnetic suspension roller shaft (3) to adjust the conveying posture of the silicon wafer.

2. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 1, wherein, The detection module (2) includes a laser detection module and a microscopic camera module.

3. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 1, wherein, It also includes a cleaning pool (7), and the roller (5) is arranged at equal intervals in the cleaning pool (7).

4. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 3, wherein, The side wall of the cleaning pool (7) is provided with a warehouse body (8), the warehouse body (8) is provided with a magnetic suspension bearing (9), and one end of the magnetic suspension roller shaft (3) penetrates through the side wall of the cleaning pool (7) and cooperates with the magnetic suspension bearing (9).

5. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 4, wherein, The warehouse body (8) is provided with a driving assembly for driving the magnetic suspension roller shaft (3) to rotate.

6. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 5, wherein, The driving assembly includes a driving shaft (10) rotatably arranged in the warehouse body (8) and a vertical shaft (11) in transmission connection with the driving shaft (10), a liftable and movable sleeve shaft (12) is synchronously rotatably arranged on the vertical shaft (11), and an upper end of the sleeve shaft (12) is in transmission connection with one end of the magnetic suspension roller shaft (3).

7. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 3, wherein, The support body (13) is movably arranged between two adjacent rollers (5) in the cleaning pool (7), and a lever assembly is arranged on the inner wall of the cleaning pool (7) to link the magnetic suspension roller shaft (3) and the support body (13) to lift and lower.

8. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 7, wherein, The lever assembly includes a lever (14) rotatably arranged on the inner wall of the cleaning pool (7) and a supporting piece (15) movably arranged, the supporting piece (15) supports the end of the magnetic suspension roller shaft (3), and one end abuts on the upper side of one end of the lever (14), and the support body (13) is provided with a support plate (16) abutting on the upper side of the other end of the lever (14). 9.The TBC cell's silicon wafer surface cleanliness detection and active intervention correction device of claim 8, wherein, The support body (13) is rotatably arranged on the support base (17), and the support plate (16) is movably arranged on the support base (17), and the movement of the support plate (16) is linked with the lifting of the support base (17), when the support base (17) is lifted, the support plate (16) moves close to the roller (5) on the side of the direction of the silicon wafer conveying and abuts.

10. The TBC cell's silicon wafer surface cleanliness detection and proactive intervention correction device of claim 9, wherein, The side wall of the support plate (16) is fixedly provided with a sliding pin (18) sliding through the support base (17), the side wall of the cleaning pool (7) is elastically rotatably provided with a circular block (19), and the circular block (19) is provided with a sliding groove (20) matched with the sliding pin (18).

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