Display device and testing method thereof

Abstract

The invention provides a display device and a testing method thereof. The display device comprises a display substrate (11), an integrated circuit (12) and a flexible circuit board (13), wherein the integrated circuit (12) and the flexible circuit board (13) are respectively bound and connected with the display substrate (11); the display substrate (11) comprises a plurality of first substrate bonding pads (111A) and a plurality of second substrate bonding pads (111B); the integrated circuit comprises a test signal end and a plurality of first connection pads (121); the display substrate (11) or the integrated circuit (12) comprises a first switch unit (S1) and a second switch unit (S2); the at least two first connection pads (121) are electrically connected with a test signal end through the first switch unit (S1), the at least two second substrate pads (111B) are electrically connected with the test signal end through the second switch unit (S2), and the integrated circuit (12) controls on-off of the first switch unit (S1) and the second switch unit (S2). An impedance test signal of a test signal end passes through a detection path where the first switch unit (S1) and the second switch unit (S2) are located, and then the binding connection condition between the integrated circuit (12) and the display substrate (11) or between the flexible circuit board (13) and the display substrate (11) is detected.

Description

Display devices and their testing methods

[0001] This application claims priority to Chinese Patent Application No. 202410693121.2, filed on May 30, 2024, entitled “Display Device and Testing Method Thereof”, the contents of which are to be understood as incorporated herein by reference. Technical Field

[0002] This article relates to, but is not limited to, the field of display technology, and in particular to a display device and its testing method. Background Technology

[0003] Organic light-emitting diodes (OLEDs) are active-matrix display devices with advantages such as self-illumination, wide viewing angle, high contrast, low power consumption, and extremely fast response speed. With the continuous development of display technology, display devices using OLEDs as light-emitting elements and controlled by thin-film transistors (TFTs) have become the mainstream products in the display field.

[0004] Summary of the Invention

[0005] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0006] In a first aspect, embodiments of this disclosure provide a display device, including a display substrate, the display substrate including a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on a side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a portion of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit including a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; and a flexible circuit board located in the non-display area, the flexible circuit board including a plurality of second connecting pads, the plurality of second connecting pads being bonded to the plurality of second substrate pads. The circuit board is configured to bond pads together. The integrated circuit includes a test signal terminal, and the display substrate or the integrated circuit includes a first switching unit and a second switching unit. The plurality of integrated circuit pads include a plurality of first connection pads, which are bonded to another portion of first substrate pads on the display substrate. At least two of the first connection pads are electrically connected to the test signal terminal via the first switching unit, and at least two of the second substrate pads are electrically connected to the test signal terminal via the second switching unit. The integrated circuit is configured to control the on / off state of the first and second switching units, causing the impedance test signal from the test signal terminal to pass through the detection paths of the first and second switching units, thereby detecting the bonding connection between the integrated circuit and the display substrate, or between the flexible circuit board and the display substrate.

[0007] In an exemplary embodiment, the first switching unit and the second switching unit are located in the non-display area of ​​the display substrate; wherein, the plurality of integrated circuit pads further include a first control pad, a second control pad, and a plurality of test pads, the first control pad, the second control pad, and the plurality of test pads being correspondingly bonded to another portion of the first substrate pads on the display substrate, the first control pad being electrically connected to the gate electrode of the first switching unit and configured to control the on / off state of the first switching unit; the second control pad being electrically connected to the gate electrode of the second switching unit and configured to control the on / off state of the second switching unit; the plurality of test pads being connected to the test signal terminal and configured to receive the impedance test signal.

[0008] In an exemplary embodiment, at least two of the plurality of first connection pads are electrically connected to the test signal terminal via the first switching unit, including: at least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads via the first switching unit; at least two of the plurality of second substrate pads are electrically connected to the test signal terminal via the second switching unit, including: at least two of the plurality of second substrate pads are electrically connected to the at least two test pads via the second switching unit; the integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate by controlling the on / off state of the first switching unit and the second switching unit and transmitting the impedance test signal through the at least two test pads.

[0009] In an exemplary embodiment, the first switching unit and the second switching unit are located in the integrated circuit, and the integrated circuit further includes a first code control terminal and a second code control terminal; the first code control terminal is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit; the second code control terminal is electrically connected to the gate electrode of the second switching unit and is configured to control the on / off state of the second switching unit.

[0010] In an exemplary embodiment, the display substrate further includes a third connection portion, through which at least two of the plurality of first connection pads are connected.

[0011] In an exemplary embodiment, the first switching unit includes a first sub-switch and a second sub-switch; the gate electrode of the first sub-switch is connected to the first code control terminal, the first pole of the first sub-switch is connected to the first test signal terminal, and the second pole of the first sub-switch is connected to the corresponding first connection pad; the gate electrode of the second sub-switch is connected to the first code control terminal, the first pole of the second sub-switch is connected to the first test signal terminal, and the second pole of the second sub-switch is connected to the corresponding first connection pad.

[0012] In an exemplary embodiment, the display substrate further includes a fourth connection portion arranged in pairs, the fourth connection portion being configured to connect the first substrate pad and the corresponding second substrate pad.

[0013] In an exemplary embodiment, the flexible circuit board further includes a second connection portion, through which the second substrate pads connected to the same pair of fourth connection portions are connected.

[0014] In an exemplary embodiment, the second switching unit includes a third sub-switch and a fourth sub-switch. The gate electrode of the third sub-switch is connected to the second code control terminal, the first electrode of the third sub-switch is connected to the first test signal terminal, and the second electrode of the third sub-switch is connected to the corresponding first connection pad. The gate electrode of the fourth sub-switch is connected to the second code control terminal, the first electrode of the fourth sub-switch is connected to the first test signal terminal, and the second electrode of the fourth sub-switch is connected to the corresponding first connection pad.

[0015] In an exemplary embodiment, the plurality of integrated circuit pads further includes a plurality of test pads, which are correspondingly bonded to another portion of the first substrate pads on the display substrate; the display substrate further includes a crack detection line, which partially surrounds the display area; the crack detection line is electrically connected to the test pads; the integrated circuit further includes a third code control terminal and a third switch unit, the third control pad being electrically connected to the gate electrode of the third switch unit and configured to control the on / off state of the third switch unit; the crack detection line is configured to detect whether a crack has appeared in the display substrate by transmitting the impedance test signal.

[0016] In an exemplary embodiment, the third switching unit includes a fifth sub-switch and a sixth sub-switch. The gate electrode of the fifth sub-switch is connected to the third code control terminal, the first electrode of the fifth sub-switch is connected to the first test signal terminal, and the second electrode of the fifth sub-switch is connected to the corresponding test pad. The gate electrode of the sixth sub-switch is connected to the third code control terminal, the first electrode of the sixth sub-switch is connected to the first test signal terminal, and the second electrode of the sixth sub-switch is connected to the corresponding test pad.

[0017] Secondly, embodiments of this disclosure provide a testing method for a display device, applied to the display device described above. The method includes: an integrated circuit transmitting a first control signal to a first switching unit to control the first switching unit to open; the integrated circuit transmitting a second control signal to a second switching unit to control the second switching unit to close; the integrated circuit's test signal terminal emitting an impedance test signal, the impedance test signal passing through a detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or, the integrated circuit transmitting the second control signal to the first switching unit to control the first switching unit to close; the integrated circuit's second switching unit transmitting the first control signal to control the second switching unit to open; the integrated circuit's test signal terminal emitting the impedance test signal, the impedance test signal passing through a detection path where the second switching unit is located, to test the bonding connection between the flexible circuit board and the display substrate; or, the integrated circuit transmitting the second control signal to the first switching unit to control the first switching unit to close; the integrated circuit transmitting the second control signal to the second switching unit to control the second switching unit to close. In an exemplary embodiment, the first switching unit and the second switching unit are located in the integrated circuit. The method includes: a first code control terminal of the integrated circuit sends a first control signal to control the first switching unit to open; a second code control terminal of the integrated circuit sends a second control signal to control the second switching unit to close; a test signal terminal of the integrated circuit sends an impedance test signal, the impedance test signal passing through the detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or, the first code control terminal of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control terminal of the integrated circuit sends the first control signal to control the second switching unit to open; the test signal terminal of the integrated circuit sends the impedance test signal, the impedance test signal passing through the detection path where the second switching unit is located, to test the bonding connection between the flexible circuit board and the display substrate; or, the first code control terminal of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control terminal of the integrated circuit sends the second control signal to control the second switching unit to close.

[0018] In an exemplary embodiment, when the first switch unit or the second switch unit is in the open state, the method further includes: the third code control terminal of the integrated circuit transmits the second control signal to the third switch unit to control the third switch unit to close.

[0019] In an exemplary embodiment, when the first switch unit and the second switch unit are in the off state, the method further includes: the third code control terminal of the integrated circuit transmits the first control signal to the third switch unit to control the third switch unit to open; and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

[0020] In an exemplary embodiment, the first control signal and the second control signal are voltage signals.

[0021] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood.

[0022] Overview of the attached figures

[0023] The accompanying drawings are used to provide an understanding of the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.

[0024] Figure 1 is a schematic diagram of the structure of a display device in some technologies;

[0025] Figure 2 is a side view of the display device shown in Figure 1;

[0026] Figure 3 is a schematic diagram of the bonding connection between the integrated circuit, the flexible circuit board and the display substrate;

[0027] Figure 4 is a schematic diagram of the display device in an exemplary embodiment of the present disclosure;

[0028] Figure 5 is a schematic diagram of the structure of the display substrate of Figure 4 in an exemplary embodiment;

[0029] Figure 6 is a schematic diagram of the integrated circuit in Figure 4 in an exemplary embodiment;

[0030] Figure 7 is a cross-sectional view of the display substrate at the first sub-switch in an exemplary embodiment;

[0031] Figure 8 is a schematic diagram of the display device in yet another exemplary embodiment;

[0032] Figure 9 is a schematic diagram of the structure of the display substrate of Figure 8 in an exemplary embodiment;

[0033] Figure 10 is a schematic diagram of the integrated circuit in Figure 8 in an exemplary embodiment;

[0034] Figure 11 is a schematic diagram of the first selection circuit in an exemplary embodiment.

[0035] Detailed Explanation

[0036] This disclosure describes several embodiments, but these descriptions are exemplary and not restrictive, and many more embodiments and implementations are possible within the scope of the embodiments described herein, which will be apparent to those skilled in the art. Although many possible combinations of features are shown in the drawings and discussed in the detailed description, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with or in lieu of any other feature or element in any other embodiment.

[0037] This disclosure includes and contemplates combinations of features and elements known to those skilled in the art. The embodiments, features, and elements disclosed in this disclosure may also be combined with any conventional features or elements to form a unique inventive scheme as defined by the claims. Any feature or element of any embodiment may also be combined with features or elements from other inventive schemes to form another unique inventive scheme as defined by the claims. Therefore, it should be understood that any feature shown and / or discussed in this disclosure may be implemented individually or in any suitable combination. Therefore, the embodiments are not limited except by the limitations imposed by the appended claims and their equivalents. Furthermore, various modifications and changes may be made within the scope of the appended claims.

[0038] Furthermore, in describing representative embodiments, the specification may have presented methods and / or processes as a specific sequence of steps. However, the method or process should not be limited to the specific order of steps described herein, to the extent that the method or process does not depend on the specific order of steps described herein. As will be understood by those skilled in the art, other sequences of steps are also possible. Therefore, the specific order of steps set forth in the specification should not be construed as a limitation of the claims. Moreover, the claims relating to the method and / or process should not be limited to the steps performed in the order written, and those skilled in the art will readily understand that these orders can be varied and still remain within the spirit and scope of the embodiments disclosed herein.

[0039] In the accompanying drawings, the size of one or more constituent elements, the thickness of layers, or areas are sometimes exaggerated for clarity. Furthermore, the drawings schematically illustrate ideal examples, and this disclosure is not limited to the shapes or values ​​shown in the drawings.

[0040] The ordinal numbers such as "first," "second," and "third" used in this specification are used to avoid confusion among the constituent elements, not to limit the quantity. The term "multiple" in this disclosure refers to two or more quantities.

[0041] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of the constituent elements being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0042] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the meaning of these terms in this disclosure as appropriate.

[0043] In this specification, a transistor is a device that includes at least three terminals: a gate electrode, a drain electrode, and a source electrode. A transistor has a channel region between the drain electrode (drain terminal, drain region, or drain) and the source electrode (source terminal, source region, or source), and current can flow through the drain electrode, the channel region, and the source electrode. Note that in this specification, the channel region refers to the region through which current primarily flows.

[0044] In this specification, the first electrode can be the drain electrode and the second electrode can be the source electrode, or vice versa. In cases where transistors with opposite polarities are used or the current direction changes during circuit operation, the functions of the "source electrode" and "drain electrode" may sometimes be interchanged. Therefore, in this specification, the "source electrode" and "drain electrode" can be interchanged, and the "source terminal" and "drain terminal" can be interchanged.

[0045] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0046] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0047] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0048] Figure 1 is a schematic diagram of the structure of a display device in some technologies. Figure 2 is a side view of the display device shown in Figure 1, illustrating the state after the bonding area is bent. As shown in Figures 1 and 2, the display device provided in this embodiment includes: a display substrate 11, and an integrated circuit (IC) 12 and a flexible printed circuit (FPC) 13 bonded to the display substrate 11. The display substrate 11 includes: a display area 100 and a non-display area 200 surrounding the display area 100. The non-display area 200 includes: a bonding area 300 located on the side of the display area 100 along the second direction Y. The display area 100 includes at least a plurality of regularly arranged pixel units. For example, the plurality of pixel units can be arranged in an array along the first direction X and the second direction Y, with the first direction X and the second direction Y intersecting. The plurality of pixel units are configured to display dynamic pictures or still images, and the display area 100 can be referred to as the effective area (AA). In an exemplary embodiment, the display device can be deformable, such as rolled, bent, folded, or rolled up.

[0049] In an exemplary embodiment, the shape of the display area 100 can be a quadrilateral, a circle, an ellipse, a polygon of other shapes, or an irregular shape, and the corners of the display area 100 can be rounded. This disclosure does not limit this.

[0050] In an exemplary embodiment, the bonding region 300 may include a fan-out region 400, a driver chip region 600, and a bonding pin region 700 arranged sequentially along a direction away from the display region 100. The fan-out region 400 is connected to the display region 100 and may include at least multiple parallel data leads. Power lines, data lines, and other signal lines located in the display region 100 can pass through the fan-out region 400 via fan-out routing and connect to their corresponding signal providing terminals. The driver chip region 600 may include at least multiple bonding pads. The integrated circuit 12 can be bonded to the display substrate 11 via the multiple bonding pads of the driver chip region 600. The integrated circuit 12 is configured to connect to multiple data fan-out lines, and the integrated circuit 12 may be a driver integrated circuit (DIC). The bonding pin region 700 may include at least multiple bonding pads. The flexible circuit board 13 can be bonded to the display substrate 11 via the multiple bonding pads of the bonding pin region 700.

[0051] In an exemplary embodiment, the bonding region 400 may further include a bending region 500, which may be located between the fan-out region 400 and the driver chip region 600. The bending region 500 is connected to the fan-out region 400 and may include a composite insulating layer with grooves. It is configured to bend the bonding region 300 to the back of the display region 100. After the bonding region 300 is bent, the integrated circuit 12 and the flexible circuit board 13 are bent to the back of the display region 100.

[0052] In an exemplary embodiment, as shown in FIG1, two crack detection lines 201 are provided in the non-display area 200. These two crack detection lines 201 surround the outside of the display area 100, and their two ends are connected to the integrated circuit 12. The integrated circuit 12 can provide crack detection signals to the crack detection lines 201, thereby detecting cracks in the display substrate 11 around the display area 100. The number and distribution of the crack detection lines 201 can be set as needed, and this disclosure does not limit this.

[0053] In an exemplary embodiment, after the integrated circuit 12 and the flexible circuit board 13 are bonded to the display substrate 11, the effect of the bonding connection needs to be detected. For example, the bonding status between the flexible circuit board 13 and the display substrate 11 can be determined by detecting the impedance between the flexible circuit board 13 and the display substrate 11, and the bonding status between the integrated circuit 12 and the display substrate 11 can be determined by detecting the impedance between the integrated circuit 12 and the display substrate 11.

[0054] Figure 3 is a schematic diagram of the bonding connection between the integrated circuit, the flexible circuit board, and the display substrate, illustrating the simplified structure of the display substrate. In Figure 3, the pads, alignment marks, test points, and connecting lines on the display device can be arranged symmetrically, and this disclosure does not impose any limitations on this. As shown in Figure 3, the bonding area of ​​the display substrate 11 is provided with multiple first substrate pads 111A, multiple second substrate pads 111B, multiple first connecting lines 112, and multiple second connecting lines 113. The multiple first substrate pads 111A are configured to be bonded to the integrated circuit 12, and the multiple second substrate pads 111B are configured to be bonded to the flexible circuit board 13. The multiple first substrate pads 111A can be arranged sequentially along the first direction X, and the multiple second substrate pads 111B can be arranged sequentially along the first direction X. The multiple second substrate pads 111B can be located on one side of the multiple first substrate pads 111A along the second direction Y. The integrated circuit 12 includes multiple integrated circuit pads, including first connection pads 121 and multiple test pads 123. The multiple first connection pads 121 can be located at both ends of the integrated circuit 12 in the second direction Y, and the multiple test pads 123 can be located at both ends of the integrated circuit 12 in the first direction X. The first connection pads 121 are configured to be bonded to the display substrate 11 through corresponding first substrate pads 111A. The test pads 123 are configured to be connected to the crack detection line 201 to provide crack detection signals to the crack detection line 201. The integrated circuit 12 also includes multiple third connection lines 122, which are configured to connect two corresponding first connection pads 121. The two first connection pads 121 can be two adjacent pads in the first direction X. The flexible circuit board 13 includes multiple second connection pads 131, multiple alignment marks 132, multiple test points 133, multiple fourth connection lines 134, and multiple second test pads 135. The multiple test points 133 include a first point A and a second point B arranged in pairs, and a third point C and a fourth point D arranged in pairs. The multiple fourth connection lines 134 are used to connect the first point A and the second point B to the corresponding second connection pads 131, and to connect the third point C and the fourth point D to the corresponding second test pads 135. Multiple second connection pads 131 are configured to bond to the display substrate 11 via corresponding second substrate pads 111B, and to the first point A and the second point B via a fourth connection line 134. After the second connection pads 131 are connected to the second substrate pads 111B, they can be interconnected via the first connection line 112 on the display substrate 11, as shown in Figure 3. The first connection line 112 can connect two adjacent second substrate pads 111B along the first direction X, thereby forming a test path between the first point A and the second point B. Subsequently, impedance testing can be performed at the first point A and the second point B using probes to determine the bonding effect between the display substrate 11 and the flexible circuit board 13.The first substrate pad 111A, connected to the first connecting pad 121, can be connected to the second test pad 135 of the flexible circuit board 13 via the corresponding second connecting line 113 and second substrate pad 111B on the display substrate 11. The second test pad 135 can be connected to the third point C and the fourth point D via the corresponding fourth connecting line 134. With the connection of the third connecting line 122, a test path is formed between the third point C and the fourth point D. Subsequently, impedance testing can be performed at the third point C and the fourth point D using probes to determine the bonding connection effect between the display substrate 11 and the integrated circuit 12. By setting the second test pad 135 and related structures on the flexible circuit board 13, the connection between the first connecting pad 121 and the first substrate pad 111A can be detected at the test point 133 of the flexible circuit board 13, which facilitates the detection of the bonding connection between the display substrate 11, the integrated circuit 12, and the flexible circuit board 13.

[0055] In an exemplary embodiment, the alignment mark 132 is set near the test point 133. For example, the alignment mark 132 can be set on one side of the test point 133 in the first direction X, so that the probe can accurately find the corresponding test point when the test is performed.

[0056] As shown in Figure 3, during impedance testing, the alignment mark 132 can be used to quickly locate the test point 133. The probe of the impedance testing equipment can accurately find the corresponding test point 133 and perform impedance detection on the above-mentioned test path to determine whether there is any abnormality in the bonding connection. In the probe-type impedance detection method, as shown in Figure 3, it is necessary to pre-set the alignment mark 132, test point 133, fourth connecting line 134, and second test pad 135 on the flexible circuit board 13. Due to the limitations of the detection equipment and probe size, the size of the alignment mark 132 and test point 133 cannot be reduced. This makes the structure of the flexible circuit board 13 complex, with low space utilization, and large thickness and weight, which is not conducive to achieving a thinner and lighter display device, nor is it conducive to achieving a narrow bezel. Furthermore, the probe-type impedance detection method requires specialized detection equipment, resulting in high production costs. The contact-type testing method is time-consuming, resulting in high time costs, which is not conducive to improving the production capacity of display devices.

[0057] This disclosure provides a display device, including a display substrate, the display substrate including a display area and a non-display area surrounding the display area; a plurality of sub-pixels located in the display area; a plurality of data lines located in the display area and extending to the non-display area, the plurality of sub-pixels and the plurality of data lines being electrically connected; a plurality of first substrate pads and a plurality of second substrate pads located in the non-display area, the plurality of second substrate pads being located on a side of the plurality of first substrate pads away from the display area, the plurality of data lines being electrically connected to a portion of the plurality of first substrate pads; an integrated circuit located in the non-display area, the integrated circuit including a plurality of integrated circuit pads, the plurality of integrated circuit pads being bonded to the plurality of first substrate pads; and a flexible circuit board located in the non-display area, the flexible circuit board including a plurality of second connecting pads, the plurality of second connecting pads being bonded to the plurality of second substrate pads. The integrated circuit includes a test signal terminal, and the display substrate or the integrated circuit includes a first switch unit and a second switch unit. The plurality of integrated circuit pads include a plurality of first connection pads, which are correspondingly bonded to another portion of first substrate pads on the display substrate. At least two of the plurality of first connection pads are electrically connected to the test signal terminal via the first switch unit, and at least two of the plurality of second substrate pads are electrically connected to the test signal terminal via the second switch unit. The integrated circuit is configured to control the on / off state of the first switch unit and the second switch unit, causing the impedance test signal of the test signal terminal to pass through the detection paths of the first switch unit and the second switch unit, thereby detecting the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate.

[0058] The display device provided in this disclosure can detect the bonding effect between the integrated circuit and the display substrate by forming a detection path at the bonding connection between the integrated circuit and the display substrate, and transmitting an impedance test signal to the detection path using the integrated circuit. Similarly, by forming a detection path at the bonding connection between the flexible circuit board and the display substrate, and transmitting an impedance test signal to the detection path using the integrated circuit, the bonding effect between the flexible circuit board and the display substrate can be detected. The display device provided in this disclosure facilitates the detection of the bonding effect between the display substrate, the integrated circuit, and the flexible circuit board. It eliminates the need for probe detection and redundant structures such as alignment marks and test points on the flexible circuit board, significantly saving space and layout space on the flexible circuit board. This helps reduce the thickness and weight of the flexible circuit board and the display device, achieving a thinner and lighter display device with a narrower bezel.

[0059] In an exemplary embodiment, the first switching unit and the second switching unit are located in the non-display area of ​​the display substrate; wherein, the plurality of integrated circuit pads further include a first control pad, a second control pad, and a plurality of test pads, the first control pad, the second control pad, and the plurality of test pads being correspondingly bonded to another portion of the first substrate pads on the display substrate, the first control pad being electrically connected to the gate electrode of the first switching unit and configured to control the on / off state of the first switching unit; the second control pad being electrically connected to the gate electrode of the second switching unit and configured to control the on / off state of the second switching unit; the plurality of test pads being connected to the test signal terminal and configured to receive the impedance test signal.

[0060] In an exemplary embodiment, at least two of the plurality of first connection pads are electrically connected to the test signal terminal via the first switching unit, including: at least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads via the first switching unit; at least two of the plurality of second substrate pads are electrically connected to the test signal terminal via the second switching unit, including: at least two of the plurality of second substrate pads are electrically connected to the at least two test pads via the second switching unit; the integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate by controlling the on / off state of the first switching unit and the second switching unit and transmitting impedance test signals through the at least two test pads.

[0061] In an exemplary embodiment, "another part" of the first substrate pads refers to a portion of the remaining first substrate pads excluding the first substrate pads connected to the data line. The first control pad, the second control pad, the first connection pad, and the test pad are respectively connected to different first substrate pads.

[0062] In an exemplary embodiment, the first switching unit and the second switching unit are located in the integrated circuit, and the integrated circuit further includes a first code control terminal and a second code control terminal; the first code control terminal is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit; the second code control terminal is electrically connected to the gate electrode of the second switching unit and is configured to control the on / off state of the second switching unit.

[0063] Figure 4 is a schematic diagram of the display device structure in an exemplary embodiment of this disclosure. Figure 4 shows enlarged views of bonding pads and traces, while other structures and areas are omitted. The arcs in Figure 4 represent traces crossing but not connecting. Figure 4 illustrates an example where the display device structure is symmetrically distributed along a first direction; this disclosure does not limit this. As shown in Figure 4, the display device includes a display substrate 11, an integrated circuit 12, and a flexible circuit board 13. The display substrate 11 includes a display area 100 and a non-display area 200 surrounding the display area 100. The non-display area 200 includes a bonding area 300 located on one side of the display area 100. The integrated circuit 12 and the flexible circuit board 13 are bonded and connected in the bonding area 300. The integrated circuit 12 is located on one side of the display area 100 in the second direction Y, and the flexible circuit board 13 is located on one side of the integrated circuit 12 along the second direction Y. The display area 100 includes multiple sub-pixels P, which can be arranged in an array. A column of sub-pixels P arranged along the second direction Y can be connected to the same data line 101. Multiple data lines 101 can be connected to the integrated circuit 12. The integrated circuit 12 provides data signals to the corresponding sub-pixels through the data lines 101 to drive the sub-pixels to display.

[0064] Figure 5 is a schematic diagram of the display substrate of Figure 4 in an exemplary embodiment, and Figure 6 is a schematic diagram of the integrated circuit of Figure 4 in an exemplary embodiment. Figures 5 and 6 illustrate the arrangement of structures such as bonding pads on the display substrate and the integrated circuit. As shown in Figures 4 to 6, the display substrate 11 in the non-display area 200 includes a first switching unit S1, a second switching unit S2, a plurality of first substrate pads 111A and a plurality of second substrate pads 111B. The plurality of first substrate pads 111A are located in the integrated circuit area 600 and are configured to be bonded to the integrated circuit 12. The plurality of second substrate pads 111B are located in the bonding pin area 700 and are configured to be bonded to the flexible circuit board 13. The integrated circuit 12 includes a test signal terminal, a first control pad 124A, a second control pad 124B, multiple test pads 123, and multiple first connection pads 121. The test signal terminal may include a first test signal terminal P1 and a second test signal terminal P2. The first test signal terminal P1 and the second test signal terminal P2 can be connected to the corresponding test pads 123 respectively. The multiple first connection pads 121 are distributed along the second direction Y at both ends of the integrated circuit 12. The integrated circuit 12 covers the integrated circuit area 600. The multiple first connection pads 121 located near the end of the display area 100 are correspondingly bonded and connected to a portion of the first substrate pads 111A and connected to the corresponding data lines 101. A plurality of first connection pads 121 located at the end furthest from the display area 100 are bonded to corresponding first substrate pads 111A. At least two of the plurality of first connection pads 121 located at the end furthest from the display area 100 are electrically connected to at least two test pads 123 through a first switching unit S1, forming a detection path between the display substrate 11 and the integrated circuit 12 to facilitate the transmission of impedance test signals. A first control pad 124A is electrically connected to the gate electrode of the first switching unit S1 and is configured to control the on / off state of the first switching unit. The first control pad 124A, the second control pad 124B, and the plurality of test pads 123 are correspondingly bonded to a portion of the remaining first substrate pads 111A. The flexible circuit board 13 covers the bonding pin area 700, including a plurality of second connection pads 131. The second connection pads 131 are bonded to corresponding second substrate pads 111B. At least two of the second substrate pads 111B are electrically connected to at least two test pads 123 via a second switching unit S2, forming a detection path between the display substrate 11 and the flexible circuit board 13. A second control pad 124B is electrically connected to the gate electrode of the second switching unit S2, configured to control the on / off state of the second switching unit S2. The integrated circuit 12 is configured to detect the bonding connection between the integrated circuit 12 and the display substrate 11, or between the flexible circuit board 13 and the display substrate 11, by controlling the on / off state of the first switching unit S1 and the second switching unit S2 and transmitting impedance test signals through at least two test pads 123.

[0065] In an exemplary embodiment, as shown in FIG5, a plurality of second substrate pads 111B may be distributed along the first direction D1 at opposite ends of the bonding pin area 700. As shown in FIG6, a plurality of first control pads 124A, a plurality of second control pads 124B, and a plurality of test pads 123 may be distributed along the first direction D1 at both ends of the integrated circuit 12. This disclosure does not limit this.

[0066] In an exemplary embodiment, the bonding area 300 may further include a bending area located between the display area 100 and the integrated circuit 12. The position of the bending area can be shown in FIG1. ​​The bending area is configured to bend the bonding area 300 to the back of the display area 100. After bending, the integrated circuit 12 and the flexible circuit board 13 can be bent to the back of the display area 100, thereby achieving a narrow bezel.

[0067] In an exemplary embodiment, multiple pads on the integrated circuit 12 can be connected one-to-one with multiple first substrate pads 111A on the display substrate 11. Structures such as the crack detection line 201 and the switch unit can be electrically connected to the pads on the integrated circuit 12 through the corresponding first substrate pads 111A.

[0068] In an exemplary embodiment, the first switching unit S1, the second switching unit S2, and the third switching unit S3 can be transistors, and the gate electrode of the transistor can be connected to the corresponding control pad.

[0069] In an exemplary embodiment, as shown in FIG4, the integrated circuit 12 may include a first connection portion 126, which can be connected to two first connection pads 121. The two first connection pads 121 are respectively connected to two test pads 123. The first switching unit may include a first sub-switch K1 and a second sub-switch K2. A first sub-switch K1 is disposed between one pair of first connection pads 121 and test pads 123, and a second sub-switch K2 is disposed between another pair of first connection pads 121 and test pads 123. The gate electrodes of the first sub-switch K1 and the second sub-switch K2 are both connected to a first control pad 124A. By providing the first connection portion 126 inside the integrated circuit 12, the integrated circuit 12 itself has the conditions to form a detection path. The traces on the display substrate 11 only need to be connected to the corresponding pads to form a detection path, which helps to save the trace space of the display substrate 11 and facilitates the trace layout. In other embodiments, the first connection portion 126 may be connected to a greater number of first connection pads 121, and the first switching unit may include a greater number of sub-switches; this disclosure does not limit this.

[0070] In an exemplary embodiment, as shown in FIG4, the gate electrode of the first sub-switch K1 can be connected to the corresponding first control pad 124A via the first trace L1. The first electrode of the first sub-switch K1 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby achieving connection between the first electrode and the corresponding first connection pad 121. The second electrode of the first sub-switch K1 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby achieving connection between the second electrode and the corresponding test pad 123. The gate electrode of the second sub-switch K2 can be connected to the corresponding first control pad 124A via the fourth trace L4, and the fourth trace L4 and the first trace L1 can be interconnected. The first pole of the second sub-switch K2 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the fifth trace L5, thereby connecting the first pole to the corresponding first connection pad 121. The second pole of the second sub-switch K2 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the sixth trace L6, thereby connecting the second pole to the corresponding test pad 123.

[0071] In an exemplary embodiment, as shown in FIG4, the flexible circuit board 13 may include a second connection portion 136, which can be connected to two second connection pads 131. The two second connection pads 131 are respectively connected to two test pads 123 of the integrated circuit 12. The second switching unit may include a third sub-switch K3 and a fourth sub-switch K4. The third sub-switch K3 is disposed between one pair of second connection pads 131 and the test pads 123, and the fourth sub-switch K4 is disposed between the other pair of second connection pads 131 and the test pads 123. The gate electrodes of the third sub-switch K3 and the fourth sub-switch K4 are both connected to the second control pad 124B. By providing the second connection portion 136 inside the flexible circuit board 13, the flexible circuit board 13 itself has the conditions to form a detection path. The traces on the display substrate 11 only need to be connected to the corresponding pads to form a detection path, which helps to save the trace space of the display substrate 11 and facilitates the trace layout. In other embodiments, the second connection portion 136 may be connected to a greater number of second connection pads 131, and the second switching unit may include a greater number of sub-switches; this disclosure does not limit this.

[0072] In an exemplary embodiment, as shown in FIG4, the gate electrode of the third sub-switch K3 can be connected to the corresponding second control pad 124B via the seventh trace L7. The first electrode of the third sub-switch K3 can be connected to the corresponding second substrate pad 111B on the display substrate 11 via the eighth trace L8, thereby connecting the first electrode to the corresponding second connection pad 131. The second electrode of the third sub-switch K3 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the ninth trace L9, thereby connecting the second electrode to the corresponding test pad 123. The ninth trace L9 can be interconnected with the sixth trace L6. The gate electrode of the fourth sub-switch K4 can be connected to the corresponding second control pad 124B via the tenth trace L10. The tenth trace L10 can be interconnected with the seventh trace L7. The first pole of the fourth sub-switch K4 can be connected to the corresponding second substrate pad 111B on the display substrate 11 via the eleventh trace L11, thereby connecting the first pole to the corresponding second connection pad 131. The second pole of the fourth sub-switch K4 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the twelfth trace L12, thereby connecting the second pole to the corresponding test pad 123. The twelfth trace L12 and the third trace L3 can be connected to each other.

[0073] In an exemplary embodiment, the display substrate 11 includes a crack detection line 201, which partially surrounds the display area 100 of the display substrate 11. The display substrate 11 also includes a third switching unit S3, and the integrated circuit 12 includes a third control pad 124C. The crack detection line 201 can be connected to two test pads 123 through the third switching unit S3, and the third control pad 124C is electrically connected to the gate electrode of the third switching unit S3, configured to control the on / off state of the third switching unit S3. In this embodiment, by setting the crack detection line 201 to be electrically connected to the two test pads 123, the integrated circuit 12 can use the crack detection signal to detect the crack condition of the display substrate 11. In an exemplary embodiment, the first switch unit S1 and the second switch unit S2 can be controlled to be closed and the third switch unit S3 can be controlled to be open to detect cracks in the display substrate 11. Then, the first switch unit S1 can be controlled to be open and the second switch unit S2 and the third switch unit S3 can be closed to test the bonding connection between the display substrate 11 and the integrated circuit 12. Finally, the first switch unit S1 and the third switch unit S3 can be controlled to be closed and the second switch unit S2 can be opened to detect the bonding connection between the display substrate 11 and the flexible circuit board 13. This bonding connection detection method is fast and accurate, does not require the use of specific probe detection equipment, and does not require the addition of new production processes. It not only helps to achieve the thinning of the display device, but also improves the production efficiency of the display device. In other embodiments, at least two of the first switch unit S1, the second switch unit S2, and the third switch unit S3 can be turned on at a time, enabling integrated testing of at least two detection items. For example, the first switch unit S1 and the second switch unit S2 can be turned on while the third switch unit S3 is turned off, allowing simultaneous testing of the bonding connection between the display substrate 11 and the integrated circuit 12. Alternatively, the first switch unit S1 and the third switch unit S3 can be turned on while the second switch unit S2 is turned off, allowing testing of the bonding connection between the display substrate 11 and the integrated circuit 12. The present disclosure does not limit the detection of the bonding connection between the display substrate 11 and the integrated circuit 12, as well as the crack condition of the display substrate 11. Alternatively, the second switch unit S2 and the third switch unit S3 can be turned on while the first switch unit S1 is turned off, allowing simultaneous detection of the bonding connection between the display substrate 11 and the integrated circuit 12, as well as the crack condition of the display substrate 11.

[0074] In an exemplary embodiment, as shown in FIG4, the two ends of the crack detection line 201 are respectively connected to two test pads 123. The third switching unit may include a fifth sub-switch K5 and a sixth sub-switch K6. A fifth sub-switch K5 is provided between one end of the crack detection line 201 and the test pad 123, and a sixth sub-switch K6 is provided between the other end of the crack detection line 201 and the test pad 123. The gate electrodes of the fifth sub-switch K5 and the sixth sub-switch K6 are both connected to the third control pad 124C.

[0075] In an exemplary embodiment, as shown in FIG4, the gate electrode of the fifth sub-switch K5 can be connected to the corresponding third control pad 124C via the thirteenth trace L13. The first electrode of the fifth sub-switch K5 can be connected to one end of the crack detection line 201. The second electrode of the fifth sub-switch K5 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the fourteenth trace L14, thereby realizing the connection between the second electrode and the corresponding test pad 123. The fourteenth trace L14 can be interconnected with the ninth trace L9. The gate electrode of the sixth sub-switch K6 can be connected to the corresponding third control pad 124C via the fifteenth trace L15. The fifteenth trace L15 and the thirteenth trace L13 can be interconnected. The first pole of the sixth sub-switch K6 can be connected to the other end of the crack detection line 201. The second pole of the sixth sub-switch K6 can be connected to the corresponding first substrate pad 111A on the display substrate 11 through the sixteenth trace L16, thereby realizing the connection between the second pole and the corresponding test pad 123. The sixteenth trace L16 and the twelfth trace L12 can be connected to each other.

[0076] Figure 7 is a cross-sectional view of the display substrate at the first sub-switch in an exemplary embodiment. Cross-sectional views of the other sub-switches can be seen with reference to Figure 7. As shown in Figure 7, the first sub-switch K1 is a transistor, including a semiconductor layer 303, a gate electrode 305, a first electrode 311, and a second electrode 312. In the direction perpendicular to the display substrate, the display substrate may include a substrate 301, a buffer layer 302, a semiconductor layer 303, a first insulating layer 304, a gate electrode 305, a second insulating layer 306, a third trace L3, a third insulating layer 308, a source / drain metal layer, and a planarization layer 309. The source / drain metal layer may include the first electrode 311, the second electrode 312, and the first trace L1. The gate electrode 305 can be connected to the corresponding first control pad 124A through the first trace L1. The first trace L1 and the gate electrode 305 can be connected through vias. The orthographic projection of the first trace L1 on the substrate 301 and the orthographic projection of the gate electrode 305 on the substrate 301 can overlap each other. The first electrode 311 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the second trace L2, thereby connecting the first electrode 311 to the corresponding first connection pad 121. The first electrode 311 and the second trace L2 can be interconnected or form an integral structure. The second electrode 312 can be connected to the corresponding first substrate pad 111A on the display substrate 11 via the third trace L3, thereby connecting the second electrode to the corresponding test pad 123. The third trace L3 and the second electrode 312 can be connected via vias. The orthographic projection of the third trace L3 on the substrate 301 does not overlap with the orthographic projection of the gate electrode 305 on the substrate 301. The substrate 301 can be a flexible substrate, facilitating bending. The first insulating layer 304 and the second insulating layer 306 can be referred to as gate insulating layers, the third insulating layer 308 can be referred to as interlayer insulating layers, and the planarization layer 309 can be on the same layer as the pixel definition layer of the display area; this disclosure does not impose any limitations on this.

[0077] Figure 8 is a schematic diagram of the display device in another exemplary embodiment. Some structures and areas are omitted from the diagram. Figure 8 illustrates the structure of the display device as being symmetrically distributed along the first direction, but this disclosure does not limit it. The difference between Figure 8 and Figure 4 is that the integrated circuit includes a test signal terminal and a selection circuit. The first switch unit, the second switch unit, the third switch unit, and related wiring are all located in the selection circuit of the integrated circuit. The remaining structure can be referred to the description of Figure 4 above, and will not be repeated here.

[0078] Figure 9 is a schematic diagram of the structure of the display substrate of Figure 8 in an exemplary embodiment, and Figure 10 is a schematic diagram of the structure of the integrated circuit of Figure 8 in an exemplary embodiment. As shown in Figures 8 to 10, the integrated circuit 12 may include a first selection circuit 125A, a second selection circuit 125B, a first test signal terminal P1, and a second test signal terminal P2. The first selection circuit 125A and the first test signal terminal P1 are connected. The first test signal terminal P1 can emit an impedance test signal. After passing through the first selection circuit 125A, the impedance test signal can enter at least one of the detection paths between the integrated circuit 12 and the display substrate 11 and between the flexible circuit board 13 and the display substrate 11, thereby detecting the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11. The second selection circuit 125B is connected to the second test signal terminal P2. The second test signal terminal P2 can emit an impedance test signal. After passing through the second selection circuit 125B, the impedance test signal can enter at least one of the detection paths of the integrated circuit 12 and the display substrate 11 and the flexible circuit board 13 and the display substrate 11, thereby detecting the bonding connection between the integrated circuit 12 and the display substrate 11 or between the flexible circuit board 13 and the display substrate 11. As shown in Figures 8 to 10, the first selection circuit 125A and the second selection circuit 125B can be symmetrically distributed along the first direction X. The first test signal terminal P1 and the second test signal terminal P2 can be symmetrically distributed along the first direction X. The integrated circuit 12 and the display substrate 11 can include two detection paths, which can be symmetrically distributed along the first direction X. The flexible circuit board 13 and the display substrate 11 can include two detection paths, which can be symmetrically distributed along the first direction X. The first selection circuit 125A and the second selection circuit 125B can detect the detection path located on the same side as themselves in the first direction X. This disclosure does not limit the number and distribution of the test signal terminals and selection circuits.

[0079] In an exemplary embodiment, as shown in Figures 8 to 10, the display substrate 11 may include a third connection portion 114. The third connection portion 114 can connect two adjacent first substrate pads 111A. These two adjacent first substrate pads 111A can be bonded to corresponding first connection pads 121, and can also be connected to a first selection circuit 125A or a second selection circuit 125B. By providing the third connection portion 114, a detection path can be formed between the integrated circuit 12 and the display substrate 11, so as to detect the bonding connection between the integrated circuit 12 and the display substrate 11 using impedance test signals from the first selection circuit 125A or the second selection circuit 125B. In other embodiments, the two adjacent first substrate pads 111A may also be connected via a first connection portion 126; this disclosure does not limit this connection.

[0080] In an exemplary embodiment, as shown in Figures 8 to 10, the display substrate 11 may include a pair of fourth connecting portions 115. The fourth connecting portions 115 can connect the first substrate pad 111A and the corresponding second substrate pad 111B. A pair of fourth connecting portions 115 can be connected to two adjacent second substrate pads 111B. The second substrate pads 111B connected to the same pair of fourth connecting portions 115 can be connected through a second connecting portion 136. The first substrate pad 111A connected to the same pair of fourth connecting portions 115 can be connected to a first selection circuit 125A or a second selection circuit 125B, thereby forming a detection path between the flexible circuit board 13 and the display substrate 11, so as to detect the bonding connection between the flexible circuit board 13 and the display substrate 11 using the impedance test signal from the first selection circuit 125A or the second selection circuit 125B.

[0081] In an exemplary embodiment, in the first direction X, the display substrate 11 includes two crack detection lines 201, which are located on the left and right sides of the display area 100, respectively. The first selection circuit 125A can also be electrically connected to the crack detection line 201 located on the left side. The impedance test signal, after passing through the first selection circuit 125A, can also enter the crack detection line 201 located on the left side, thereby detecting cracks on the left side of the display panel. As shown in Figures 8 to 10, the first selection circuit 125A can be connected to the test pad 123 located on the left side of the integrated circuit 12 in the first direction X. Since the test pad 123 located on the left side of the integrated circuit 12 is connected to the crack detection line 201 located on the left side through the corresponding first substrate pad 111A, the first selection circuit 125A and the crack detection line 201 located on the left side are electrically connected. The second selection circuit 125B can also be connected to the crack detection line 201 located on the right side. The impedance test signal, after passing through the second selection circuit 125B, can also enter the crack detection line 201 located on the right side, thereby detecting cracks on the right side of the display panel. The second selection circuit 125B can also be connected to the test pad 123 located on the right side of the integrated circuit 12 in the first direction X. Since the test pad 123 located on the right side of the integrated circuit 12 is connected to the crack detection line 201 located on the right side through the corresponding first substrate pad 111A, an electrical connection between the second selection circuit 125B and the crack detection line 201 located on the right side is achieved. Figure 11 is a schematic diagram of the first selection circuit in an exemplary embodiment. The arcs in Figure 11 represent traces crossing but not connected. As shown in Figure 11, the first selection circuit 125A includes a first code control terminal F1, a second code control terminal F2, a first switch unit S1, and a second switch unit S2. One end of the first switch unit S1 is connected to the first test signal terminal P1, and the other end of the first switch unit S1 is connected to the corresponding first connection pad 121. The first switch unit S1 can be turned on or off under the control of the first code control terminal F1, so that the impedance test signal from the first test signal terminal P1 can or cannot enter the detection path between the integrated circuit 12 and the display substrate 11. One end of the second switch unit S2 is connected to the first test signal terminal P1, and the other end of the second switch unit S2 is connected to the corresponding first connection pad 121. The second switch unit S2 can be turned on or off under the control of the second code control terminal F2, so that the impedance test signal from the first test signal terminal P1 can or cannot enter the detection path between the flexible circuit board 13 and the display substrate 11.

[0082] In an exemplary embodiment, the first switching unit S1 may include a first sub-switch K1 and a second sub-switch K2. The impedance test signal is output to the detection path between the integrated circuit 12 and the display substrate 11 via the first sub-switch K1 and the second sub-switch K2, i.e., OUT1 in FIG11. The gate electrode of the first sub-switch K1 is connected to the first code control terminal F1, the first pole of the first sub-switch K1 is connected to the first test signal terminal P1, and the second pole of the first sub-switch K1 is connected to the corresponding first connection pad 121. The gate electrode of the second sub-switch K2 is connected to the first code control terminal F1, the first pole of the second sub-switch K2 is connected to the first test signal terminal P1, and the second pole of the second sub-switch K2 is connected to the corresponding first connection pad 121. The second switching unit S2 may include a third sub-switch K3 and a fourth sub-switch K4. The impedance test signal is output to the detection path between the flexible circuit board 13 and the display substrate 11 via the third sub-switch K3 and the fourth sub-switch K4, i.e., OUT2 in FIG11. The gate electrode of the third sub-switch K3 is connected to the second code control terminal F2. The first pole of the third sub-switch K3 is connected to the first test signal terminal P1. The second pole of the third sub-switch K3 is connected to the corresponding first connection pad 121. The gate electrode of the fourth sub-switch K4 is connected to the second code control terminal F2. The first pole of the fourth sub-switch K4 is connected to the first test signal terminal P1. The second pole of the fourth sub-switch K4 is connected to the corresponding first connection pad 121.

[0083] In an exemplary embodiment, the first selection circuit 125A further includes a third code control terminal F3 and a third switch unit S3. One end of the third switch unit S3 is connected to the first test signal terminal P1, and the other end of the third switch unit S3 is connected to the corresponding test pad 123. The third switch unit S3 can be turned on or off under the control of the third code control terminal F3, so that the impedance test signal from the first test signal terminal P1 can enter or not enter the crack detection line 201.

[0084] In an exemplary embodiment, the third switching unit S3 may include a fifth sub-switch K5 and a sixth sub-switch K6. The impedance test signal is output to the crack detection line 201, i.e., OUT3 in FIG11, through the fifth sub-switch K5 and the sixth sub-switch K6. The gate electrode of the fifth sub-switch K5 is connected to the third code control terminal F3, the first electrode of the fifth sub-switch K5 is connected to the first test signal terminal P1, and the second electrode of the fifth sub-switch K5 is connected to the corresponding test pad 123. The gate electrode of the sixth sub-switch K6 is connected to the third code control terminal F3, the first electrode of the sixth sub-switch K6 is connected to the first test signal terminal P1, and the second electrode of the sixth sub-switch K6 is connected to the corresponding test pad 123.

[0085] In an exemplary embodiment, the first code control terminal F1, the second code control terminal F2, and the third code control terminal F3 can be configured to output code instructions of the integrated circuit 12. The code instructions can be voltage signals. For example, the first code control terminal F1, the second code control terminal F2, or the third code control terminal F3 can output a first control signal to control the corresponding sub-switch to open, and the first code control terminal F1, the second code control terminal F2, or the third code control terminal F3 can output a second control signal to control the corresponding sub-switch to close. The first control signal can be a low voltage signal, such as -7 volts, and the second control signal can be a high voltage signal, such as +7 volts. This disclosure does not limit this.

[0086] In an exemplary embodiment, the principle of the second selection circuit 125B is similar to that of the first selection circuit 125A, and can be referred to the foregoing description of FIG11, which will not be repeated here.

[0087] This disclosure also provides a method for testing a display device, the method comprising:

[0088] The integrated circuit transmits a first control signal to the first switching unit to control the first switching unit to open; the integrated circuit transmits a second control signal to the second switching unit to control the second switching unit to close; the test signal terminal of the integrated circuit emits an impedance test signal, which passes through the detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or,

[0089] The integrated circuit transmits the second control signal to the first switching unit to control the first switching unit to turn off; the integrated circuit's second switching unit transmits the first control signal to control the second switching unit to turn on; the integrated circuit's test signal terminal emits the impedance test signal, which passes through the detection path where the second switching unit is located to test the bonding connection between the flexible circuit board and the display substrate; or...

[0090] The integrated circuit transmits the second control signal to the first switching unit to control the first switching unit to turn off; the integrated circuit transmits the second control signal to the second switching unit to control the second switching unit to turn off.

[0091] In an exemplary embodiment, the first switching unit and the second switching unit are located on the display substrate. The method includes: an integrated circuit transmitting a first control signal to the first switching unit via a first control pad to control the first switching unit to turn on; the integrated circuit transmitting a second control signal to the second switching unit via a second control pad to control the second switching unit to turn off; and the integrated circuit transmitting an impedance test signal to a first connection pad via a test pad to test the bonding connection between the integrated circuit and the display substrate; or...

[0092] The integrated circuit transmits a second control signal to the first switching unit via a first control pad to control the first switching unit to turn off; the integrated circuit transmits a first control signal to the second switching unit via a second control pad to control the second switching unit to turn on; the integrated circuit transmits an impedance test signal to the second connection pad via a test pad to test the bonding connection between the flexible circuit board and the display substrate; or...

[0093] The integrated circuit transmits a second control signal to the first switching unit through the first control pad to control the first switching unit to turn off; the integrated circuit transmits a second control signal to the second switching unit through the second control pad to control the second switching unit to turn off.

[0094] In an exemplary embodiment, when the first switch unit or the second switch unit is in the open state, the method further includes: the integrated circuit transmitting a second control signal to the third switch unit through a third control pad to control the third switch unit to close.

[0095] In an exemplary embodiment, when the first switch unit and the second switch unit are in the off state, the method further includes: the integrated circuit transmitting a first control signal to the third switch unit through the third control pad to control the third switch unit to open; and the integrated circuit transmitting an impedance test signal to the first connection pad through the test pad to detect cracks in the display substrate.

[0096] In an exemplary embodiment, as shown in FIG4, when testing the bonding connection between integrated circuit 12 and display substrate 11, integrated circuit 12 can issue code instructions to open the first sub-switch K1 and the second sub-switch K2 through the first control signal, and to close the third sub-switch K3 to the sixth sub-switch K6 through the second control signal. Integrated circuit 12 can transmit an impedance test signal to the detection path between integrated circuit 12 and display substrate 11 through test pad 123 to detect the impedance in the detection path. Based on the detection result, it can be determined whether there is a problem with the bonding connection between integrated circuit 12 and display substrate 11. When testing the bonding connection between the flexible circuit board 13 and the display substrate 11, the integrated circuit 12 can issue code instructions to open the third sub-switch K3 and the fourth sub-switch K4 via a first control signal, and close the first sub-switch K1, the second sub-switch K2, the fifth sub-switch K5, and the sixth sub-switch K6 via a second control signal. The integrated circuit 12 can transmit impedance test signals to the detection path between the flexible circuit board 13 and the display substrate 11 through the test pad 123 to detect the impedance within the detection path. Based on the detection results, it can be determined whether there is a problem with the bonding connection between the flexible circuit board 13 and the display substrate 11. When performing crack detection on the display substrate 11, the integrated circuit 12 can issue code instructions to open the fifth sub-switch K5 and the sixth sub-switch K6 via a first control signal, and close the first sub-switch K1 to the fourth sub-switch K4 via a second control signal. The integrated circuit 12 can transmit impedance test signals to the crack detection line 201 via the test pad 123 to detect the impedance of the crack detection line 201. Based on the detection results, it can be determined whether there is a crack in the display substrate 11. In other embodiments, at least two detection items can be integrated and detected at a time by controlling the on / off state of the switching unit, which will not be elaborated here.

[0097] In an exemplary embodiment, one of the two test pads 123 can be used to emit an impedance test signal. After passing through the detection path, the impedance test signal reaches the other test pad 123. The transmission of the impedance test signal within the detection path can detect the connection between the bonding pads. The transmission of the impedance test signal within the crack detection line 201 can detect whether a crack exists on the display substrate. This disclosure does not limit the detection principle or method.

[0098] In an exemplary embodiment, the first control signal and the second control signal can be voltage signals. In another exemplary embodiment, the first control signal can be a low voltage signal, such as -7 volts, and the second control signal can be a high voltage signal, such as +7 volts. In other embodiments, the first control signal can be a high voltage signal, and the second control signal can be a low voltage signal. The terms "low voltage signal" and "high voltage signal" are relative concepts, and the transistor type and conduction signal of the switching unit can be set as needed; this disclosure does not impose any limitations on this.

[0099] In an exemplary embodiment, the first switching unit and the second switching unit are located in the integrated circuit, and the method includes: a first code control terminal of the integrated circuit sending a first control signal to control the first switching unit to open; a second code control terminal of the integrated circuit sending a second control signal to control the second switching unit to close; and a test signal terminal of the integrated circuit sending an impedance test signal, the impedance test signal passing through a detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or...

[0100] The first code control terminal of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control terminal of the integrated circuit sends the first control signal to control the second switching unit to open; the test signal terminal of the integrated circuit sends the impedance test signal, which passes through the detection path where the second switching unit is located, to test the bonding connection between the flexible circuit board and the display substrate; or...

[0101] The first code control terminal of the integrated circuit sends out the second control signal to control the first switching unit to turn off; the second code control terminal of the integrated circuit sends out the second control signal to control the second switching unit to turn off.

[0102] In an exemplary embodiment, when the first switch unit or the second switch unit is in the open state, the method further includes: the third code control terminal of the integrated circuit transmits the second control signal to the third switch unit to control the third switch unit to close.

[0103] In an exemplary embodiment, when the first switch unit and the second switch unit are in the off state, the method further includes: the third code control terminal of the integrated circuit transmits the first control signal to the third switch unit to control the third switch unit to open; and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

[0104] The display device provided in this disclosure can be any product or component with display function, such as an OLED display, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. This disclosure is not limited to this.

[0105] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A display device, comprising: A display substrate, the display substrate including a display area and a non-display area surrounding the display area; Multiple sub-pixels are located in the display area; Multiple data lines are located in the display area and extend to the non-display area, and the multiple sub-pixels and the multiple data lines are electrically connected; Multiple first substrate pads and multiple second substrate pads are located in the non-display area. The multiple second substrate pads are located on the side of the multiple first substrate pads away from the display area. The multiple data lines are electrically connected to a portion of the multiple first substrate pads. An integrated circuit is located in the non-display area. The integrated circuit includes multiple integrated circuit pads, which are bonded to the multiple first substrate pads. A flexible circuit board is located in the non-display area. The flexible circuit board includes a plurality of second connection pads, which are bonded to a plurality of second substrate pads. The integrated circuit includes a test signal terminal, and the display substrate or the integrated circuit includes a first switching unit and a second switching unit; The plurality of integrated circuit pads include a plurality of first connection pads, which are correspondingly bonded to another portion of first substrate pads on the display substrate. At least two of the plurality of first connection pads are electrically connected to the test signal terminal through a first switching unit. At least two of the plurality of second substrate pads are electrically connected to the test signal terminal through a second switching unit. The integrated circuit is configured to control the on / off state of the first switching unit and the second switching unit so that the impedance test signal of the test signal terminal passes through the detection path where the first switching unit and the second switching unit are located, thereby detecting the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate.

2. The display device according to claim 1, wherein, The first switching unit and the second switching unit are located in the non-display area of ​​the display substrate; The plurality of integrated circuit pads further includes a first control pad, a second control pad, and a plurality of test pads. The first control pad, the second control pad, and the plurality of test pads are connected to another portion of the display substrate. A substrate pad is correspondingly bonded and connected. The first control pad is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit. The second control pad is electrically connected to the gate electrode of the second switching unit and is configured to control the on / off state of the second switching unit. The plurality of test pads are connected to the test signal terminal and are configured to receive the impedance test signal.

3. The display device according to claim 2, wherein, At least two of the plurality of first connection pads are electrically connected to the test signal terminal through the first switching unit, including: at least two of the plurality of first connection pads are electrically connected to at least two of the plurality of test pads through the first switching unit; At least two of the plurality of second substrate pads are electrically connected to the test signal terminal through the second switching unit, including: at least two of the plurality of second substrate pads are electrically connected to the at least two test pads through the second switching unit; The integrated circuit is configured to detect the bonding connection between the integrated circuit and the display substrate or between the flexible circuit board and the display substrate by controlling the on / off state of the first switching unit and the second switching unit and transmitting the impedance test signal through the at least two test pads.

4. The display device according to claim 1, wherein, The first switching unit and the second switching unit are located in the integrated circuit, which further includes a first code control terminal and a second code control terminal; the first code control terminal is electrically connected to the gate electrode of the first switching unit and is configured to control the on / off state of the first switching unit; the second code control terminal is electrically connected to the gate electrode of the second switching unit and is configured to control the on / off state of the second switching unit.

5. The display device according to claim 4, wherein, The display substrate further includes a third connection portion, through which at least two of the plurality of first connection pads are connected.

6. The display device according to claim 5, wherein, The first switching unit includes a first sub-switch and a second sub-switch; the gate electrode of the first sub-switch is connected to the first code control terminal, the first pole of the first sub-switch is connected to the first test signal terminal, and the second pole of the first sub-switch is connected to the corresponding first connection pad; the gate electrode of the second sub-switch is connected to the first code control terminal, the first pole of the second sub-switch is connected to the first test signal terminal, and the second pole of the second sub-switch is connected to the corresponding first connection pad.

7. The display device according to claim 4, wherein, The display substrate further includes a fourth connecting portion arranged in pairs, the fourth connecting portion being configured to connect the first substrate pad and the corresponding second substrate pad.

8. The display device according to claim 7, wherein, The flexible circuit board further includes a second connection portion, and the second substrate pads connected to the same pair of fourth connection portions are connected through the second connection portion.

9. The display device according to claim 8, wherein, The second switching unit includes a third sub-switch and a fourth sub-switch. The gate electrode of the third sub-switch is connected to the second code control terminal, the first electrode of the third sub-switch is connected to the first test signal terminal, and the second electrode of the third sub-switch is connected to the corresponding first connection pad. The gate electrode of the fourth sub-switch is connected to the second code control terminal, the first electrode of the fourth sub-switch is connected to the first test signal terminal, and the second electrode of the fourth sub-switch is connected to the corresponding first connection pad.

10. The display device according to claim 4, wherein, The plurality of integrated circuit pads also include a plurality of test pads, which are correspondingly bonded to another portion of the first substrate pads on the display substrate; the display substrate also includes crack detection lines, which partially surround the display area; the crack detection lines are electrically connected to the test pads. The integrated circuit further includes a third code control terminal and a third switch unit. The third control pad is electrically connected to the gate electrode of the third switch unit and is configured to control the on / off state of the third switch unit. The crack detection line is configured to detect whether a crack has appeared on the display substrate by transmitting the impedance test signal.

11. The display device according to claim 10, wherein, The third switching unit includes a fifth sub-switch and a sixth sub-switch. The gate electrode of the fifth sub-switch is connected to the third code control terminal, the first electrode of the fifth sub-switch is connected to the first test signal terminal, and the second electrode of the fifth sub-switch is connected to the corresponding test pad. The gate electrode of the sixth sub-switch is connected to the third code control terminal, the first electrode of the sixth sub-switch is connected to the first test signal terminal, and the second electrode of the sixth sub-switch is connected to the corresponding test pad.

12. A method for testing a display device, applied to the display device as described in any one of claims 1 to 11, the method comprising: The integrated circuit transmits a first control signal to the first switching unit to control the first switching unit to open; The integrated circuit transmits a second control signal to the second switching unit to control the second switching unit to turn off; the test signal terminal of the integrated circuit emits an impedance test signal, which passes through the detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or, The integrated circuit transmits the second control signal to the first switching unit to control the first switching unit to turn off; the second switching unit of the integrated circuit transmits the first control signal to control the second switching unit to turn on; the test signal terminal of the integrated circuit outputs the impedance test signal, and the impedance test signal passes through the first... The detection path containing the two switching units is used to test the bonding connection between the flexible circuit board and the display substrate; or... The integrated circuit transmits the second control signal to the first switching unit to control the first switching unit to turn off; the integrated circuit transmits the second control signal to the second switching unit to control the second switching unit to turn off.

13. The test method according to claim 12, wherein, The first switching unit and the second switching unit are located in the integrated circuit. The method includes: a first code control terminal of the integrated circuit sends a first control signal to control the first switching unit to open; a second code control terminal of the integrated circuit sends a second control signal to control the second switching unit to close; a test signal terminal of the integrated circuit sends an impedance test signal, the impedance test signal passing through the detection path where the first switching unit is located, to test the bonding connection between the integrated circuit and the display substrate; or... The first code control terminal of the integrated circuit sends the second control signal to control the first switching unit to close; the second code control terminal of the integrated circuit sends the first control signal to control the second switching unit to open; the test signal terminal of the integrated circuit sends the impedance test signal, which passes through the detection path where the second switching unit is located, to test the bonding connection between the flexible circuit board and the display substrate; or... The first code control terminal of the integrated circuit sends out the second control signal to control the first switching unit to turn off; the second code control terminal of the integrated circuit sends out the second control signal to control the second switching unit to turn off.

14. The test method according to claim 13, wherein, When the first switch unit or the second switch unit is in the open state, the method further includes: the third code control terminal of the integrated circuit transmits the second control signal to the third switch unit to control the third switch unit to close.

15. The test method according to claim 13, wherein, When the first switch unit and the second switch unit are in the off state, the method further includes: the third code control terminal of the integrated circuit transmits the first control signal to the third switch unit to control the third switch unit to open; and the integrated circuit transmits an impedance test signal to the crack detection line through the test pad to perform crack detection on the display substrate.

16. The test method according to claim 12, wherein, The first control signal and the second control signal are voltage signals.

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