Preparation method of square tungsten-zirconium alloy

Abstract

The invention provides a preparation method of a square tungsten-zirconium alloy, and belongs to the technical field of tungsten alloy processing. A specific tool is introduced in the preparation process, and an indexing taper hole formed in an upper die of the specific tool is buckled with a taper pin arranged on a lower die of the specific tool, so that after secondary cutting is finished, only the upper die and the lower die of the specific tool need to be separated and then rotated by 90 degrees, and the specific tool can be used for machining the workpiece. And the upper die and the lower die are buckled through the indexing taper holes and the taper pins again, three times of cutting can be directly carried out, the strip-shaped tungsten-zirconium alloy does not need to be disassembled and fixed again, the technological process is greatly simplified, the time needed by production is shortened, and the production efficiency is improved. The result of the embodiment shows that the size precision of the prepared square tungsten-zirconium alloy is 4 + / -0.03 mm, the roughness is Ra 3.2, the perpendicularity is + / -0.03 mm, the machining time for producing a single square tungsten-zirconium alloy is only 0.1 min, the production efficiency is high, and the cost is low.

Description

Technical Field

[0001] This invention relates to the field of tungsten alloy processing technology, and in particular to a method for preparing a square tungsten-zirconium alloy. Background Technology

[0002] Tungsten-zirconium alloys, due to their high density, high strength, and high reactivity, can be used to replace traditional inert materials for fragmentation in warheads, achieving a dual destructive effect combining kinetic and chemical energy penetration, significantly enhancing the destructive power of traditional warheads. However, tungsten-zirconium alloys are typical difficult-to-machine materials, with high hardness (HRC>50) and high brittleness. Traditional machining methods (such as milling and turning) have the following inherent drawbacks: extremely low machining efficiency, severe tool wear, high production costs, and a tendency to produce machining defects such as chipping and microcracks during processing, resulting in low yield rates. While wire electrical discharge machining (EDM) can machine irregularly shaped products and avoid chipping during processing, it also suffers from low machining efficiency, and traditional machining methods are costly.

[0003] Multi-wire cutting (MFD) is a cutting process that uses the high-speed reciprocating motion of a metal wire (or a metal wire coated with diamond powder) combined with the cutting properties of the abrasive (or the diamond wire itself) to process brittle materials such as silicon, sapphire, and magnetic materials. Before MFD processing, the workpiece is fixed on the platform of the MFD equipment, and a single cut divides the material into hundreds or even thousands of thin slices. However, because MFD operates in only one direction, cutting square products requires removing the workpiece for secondary clamping, necessitating a total of three processes: fixing, cutting, and disassembling. The workpiece is prone to shifting during these processes, leading to non-perpendicularity of the square products and a low yield.

[0004] Therefore, providing a method for preparing square tungsten-zirconium alloy products that can achieve high efficiency, low cost, and high quality has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0005] The purpose of this invention is to provide a method for preparing square tungsten-zirconium alloy. The square tungsten-zirconium alloy provided by this invention has high quality, short processing time per piece, high production efficiency, and low cost.

[0006] To achieve the above-mentioned objectives, the present invention provides the following technical solution: This invention provides a method for preparing a square tungsten-zirconium alloy, comprising the following steps: (1) After grinding and leveling the tungsten-zirconium alloy billet, it is fixed on the multi-wire cutting machine platform for one cut, and then ground to obtain sheet tungsten-zirconium alloy; (2) After the sheet-like tungsten-zirconium alloy obtained in step (1) is bonded and stacked, it is fixed to the upper mold of the specific tooling. Then, the lower mold of the specific tooling is fixed on the multi-wire cutting platform. Next, the upper mold of the specific tooling is fastened to the lower mold. Finally, a second cutting is performed to obtain a strip-like tungsten-zirconium alloy connected to the specific tooling. The specific tooling includes an upper mold and a lower mold. The upper mold is provided with an indexing tapered hole. The lower mold is provided with a tapered pin. (3) The strip-shaped tungsten-zirconium alloy obtained in step (2) and connected to a specific tooling is rotated 90° and then cut three times, and then vibrated and polished to obtain a square tungsten-zirconium alloy.

[0007] Preferably, the grinding and leveling method in step (1) is to fix the tungsten-zirconium alloy blank on a surface grinder and use a carbide grinding wheel to grind one side of the tungsten-zirconium alloy blank flat.

[0008] Preferably, the grinding wheel linear speed during the grinding and leveling process is 600~800m / min, the table reciprocating speed is 1~10m / min, and the vertical feed rate is 0.01~0.05mm / cycle.

[0009] Preferably, the cutting allowance in step (1) is 0.05~0.1mm.

[0010] Preferably, in step (1), the spacing between the diamond wires on the multi-wire cutting platform during a single cut is 4.05~4.1mm, the cutting speed of the diamond wires is 500~1500m / s, the workpiece feed speed is 0.05~0.5mm / min, the cutting tension is 10~50N, the diameter of the diamond wires is 0.1~0.3mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

[0011] Preferably, in step (1), the grinding disc pressure is 0.1~1MPa, the rotation speed of the upper and lower grinding discs is 20~35r / min, and the rotation speed of the sun gear is 1~10rpm.

[0012] Preferably, in step (2), the upper mold and the lower mold are independently square in shape; the upper mold and the lower mold are the same size.

[0013] Preferably, in step (2), during the secondary cutting, the spacing of the diamond wires on the multi-wire cutting platform is 4mm, the cutting speed of the diamond wires is 500~1500m / s, the workpiece feed speed is 0.1~0.2mm / min, the cutting tension is 10~50N, the diameter of the diamond wires is 0.1~0.3mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

[0014] Preferably, in step (3), the interval between the diamond wires on the multi-wire cutting platform during the three cuts is 4 mm, the cutting speed of the diamond wire is 500~1500 m / s, the workpiece feed speed is 0.1~0.2 mm / min, the cutting tension is 10~50 N, the diameter of the diamond wire is 0.1~0.3 mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

[0015] Preferably, the abrasive used in the vibration polishing in step (3) is alumina with a particle size of 2-4 mm; the vibration frequency of the vibration polishing is 100-500 times / min and the time is 20-40 min.

[0016] This invention provides a method for preparing a square tungsten-zirconium alloy, comprising the following steps: (1) grinding and leveling a tungsten-zirconium alloy billet and fixing it on a multi-wire cutting machine platform for a first cut, followed by grinding to obtain a sheet-like tungsten-zirconium alloy; (2) bonding and stacking the sheet-like tungsten-zirconium alloy obtained in step (1) and fixing it on the upper mold of a specific tooling, then fixing the lower mold of the specific tooling on the multi-wire cutting platform, then fastening the upper mold of the specific tooling onto the lower mold, and finally performing a second cut to obtain a strip-like tungsten-zirconium alloy connected to the specific tooling; the specific tooling includes an upper mold and a lower mold; the upper mold is provided with an indexing cone hole; the lower mold is provided with a tapered pin; (3) rotating the strip-like tungsten-zirconium alloy connected to the specific tooling obtained in step (2) by 90° and then performing a third cut, followed by vibration polishing to obtain a square tungsten-zirconium alloy. This invention introduces specific tooling during the manufacturing process. The upper die of this tooling uses a dividing conical hole, and the lower die uses a tapered pin, for engagement. After the second cut, the upper and lower dies of the tooling are simply separated, rotated 90°, and then re-engaged using the dividing conical hole and tapered pin for a third cut. This eliminates the need to disassemble and re-fix the strip-shaped tungsten-zirconium alloy, significantly simplifying the process, shortening production time, and improving efficiency. Results from the embodiments show that the square tungsten-zirconium alloy prepared by the method provided by this invention has a dimensional accuracy of 4±0.03mm, a surface roughness of Ra3.2, and a perpendicularity of ±0.03mm, indicating high quality. Furthermore, the processing time for producing a single square tungsten-zirconium alloy is only 0.1 minutes, far shorter than the processing time of traditional wire EDM (3 minutes), resulting in high production efficiency and low cost. Attached Figure Description

[0017] Figure 1 A schematic diagram of the upper mold of a specific tooling provided by the present invention; Figure 2 A schematic diagram of the lower mold structure for a specific tooling provided by the present invention; Figure 3A schematic diagram of the structure of the tungsten-zirconium alloy being cut on a multi-wire cutting machine platform according to the present invention; Figure 4 A process flow diagram of grinding and three-stage cutting of tungsten-zirconium alloy billet provided by the present invention; Figure 5 Here is a photograph of the square tungsten-zirconium alloy obtained in Example 1; Figure 6 The image shows a physical sample of the square tungsten-zirconium alloy obtained in Comparative Example 1. Detailed Implementation

[0018] This invention provides a method for preparing a square tungsten-zirconium alloy, comprising the following steps: (1) After grinding and leveling the tungsten-zirconium alloy billet, it is fixed on the multi-wire cutting machine platform for one cut, and then ground to obtain sheet tungsten-zirconium alloy; (2) After the sheet-like tungsten-zirconium alloy obtained in step (1) is bonded and stacked, it is fixed to the upper mold of the specific tooling. Then, the lower mold of the specific tooling is fixed on the multi-wire cutting platform. Next, the upper mold of the specific tooling is fastened to the lower mold. Finally, a second cutting is performed to obtain a strip-like tungsten-zirconium alloy connected to the specific tooling. The specific tooling includes an upper mold and a lower mold. The upper mold is provided with an indexing tapered hole. The lower mold is provided with a tapered pin. (3) The strip-shaped tungsten-zirconium alloy obtained in step (2) and connected to a specific tooling is rotated 90° and then cut three times, and then vibrated and polished to obtain a square tungsten-zirconium alloy.

[0019] This invention involves grinding and leveling a tungsten-zirconium alloy billet, fixing it on a multi-wire cutting machine platform for one-time cutting, and then grinding it to obtain sheet-like tungsten-zirconium alloy.

[0020] This invention does not impose any special limitations on the chemical composition, size, or specific source of the tungsten-zirconium alloy billet; commercially available tungsten-zirconium alloys well-known to those skilled in the art can be used as the billet. In one embodiment of this invention, the size of the tungsten-zirconium alloy billet can be 120mm × 120mm × 100mm; the tungsten-zirconium alloy billet can be a 65W20Zr7Nb8Ti alloy.

[0021] In this invention, the preferred method for grinding leveling is to fix the tungsten-zirconium alloy blank on a surface grinder and use a carbide grinding wheel to grind one side of the tungsten-zirconium alloy blank flat. This invention does not have a specific limitation on the model or source of the surface grinder; any commercially available surface grinder well-known to those skilled in the art can be used. In this invention, the material of the carbide grinding wheel is preferably carbide; the grit size of the carbide grinding wheel is preferably 100 mesh; the linear speed of the grinding wheel during grinding leveling is preferably 600~800 m / min; the reciprocating speed of the worktable during grinding leveling is preferably 1~10 m / min; and the vertical feed rate during grinding leveling is preferably 0.01~0.05 mm / cycle. In one embodiment of the present invention, the linear speed of the grinding wheel during the grinding leveling process can be 620 m / min, 640 m / min, 650 m / min, 660 m / min, 680 m / min, 700 m / min, 720 m / min, 740 m / min, 750 m / min, 760 m / min, or 780 m / min; the reciprocating speed of the worktable during the grinding leveling process can be 2 m / min, 3 m / min, 4 m / min, 5 m / min, 6 m / min, 7 m / min, 8 m / min, or 9 m / min; and the vertical feed rate during the grinding leveling process can be 0.02 mm / stroke, 0.03 mm / stroke, or 0.04 mm / stroke. The present invention uses grinding leveling to flatten one side of the tungsten-zirconium alloy billet, facilitating the subsequent fixing of the billet on the multi-wire cutting machine platform during a single cut, thus preventing movement of the billet during the cutting process and avoiding changes in its cutting accuracy.

[0022] The present invention does not impose any special limitations on the specific model and source of the multi-wire cutting machine platform; any commercially available multi-wire cutting machine platform known to those skilled in the art can be used.

[0023] This invention preferably uses adhesive to fix the tungsten-zirconium alloy billet onto the multi-wire cutting machine platform. This invention does not have specific limitations on the type or source of the adhesive; any commercially available adhesive well-known to those skilled in the art can be used, as long as it prevents the tungsten-zirconium alloy billet from moving during the cutting process. As one embodiment of this invention, the adhesive can be ethyl α-cyanoacrylate adhesive.

[0024] In this invention, the cutting allowance for a single cut is preferably 0.05~0.1mm, more preferably 0.06~0.09mm, and even more preferably 0.07~0.08mm. By controlling the cutting allowance, this invention lays the foundation for subsequent grinding and avoids problems such as uneven cutting caused by excessively thick tungsten-zirconium alloy blanks during the cutting process.

[0025] In this invention, the spacing of the diamond wires on the multi-wire cutting platform during a single cut is preferably 4.05~4.1mm; the cutting speed of the diamond wires on the multi-wire cutting platform during a single cut is preferably 500~1500m / s; the workpiece feed speed during a single cut is preferably 0.05~0.5mm / min; the cutting tension during a single cut is preferably 10~50N; the diameter of the diamond wires during a single cut is preferably 0.1~0.3mm, more preferably 0.2mm; the temperature of the cutting fluid during a single cut is preferably 20~30℃; the mass concentration of the cutting fluid during a single cut is preferably 1~10%; and the cutting fluid is preferably ZK-805 produced by Zhongke Jintai Company. This invention does not impose any special limitations on the specific composition and source of the cutting fluid; commercially available cutting fluids well known to those skilled in the art can be used. In one embodiment of the present invention, the spacing of the diamond wires on the multi-wire cutting platform during a single cut can be 4.06mm, 4.07mm, 4.08mm, or 4.09mm; the cutting speed of the diamond wires on the multi-wire cutting platform during a single cut can be 600m / s, 700m / s, 800m / s, 900m / s, 1000m / s, 1100m / s, 1200m / s, 1300m / s, or 1400m / s; and the workpiece feed rate during a single cut can be 0.06mm / min, 0.08mm / min, or 0.1m / min. The cutting speed can be 0.15 mm / min, 0.2 mm / min, 0.25 mm / min, 0.3 mm / min, 0.35 mm / min, 0.4 mm / min, or 0.45 mm / min; the cutting tension during a single cut can be 15 N, 20 N, 25 N, 30 N, 35 N, 40 N, or 45 N; the temperature of the cutting fluid during a single cut can be 22℃, 24℃, 25℃, 26℃, or 28℃; and the mass concentration of the cutting fluid during a single cut can be 2%, 3%, 4%, 5%, 6%, 7%, 8%, or 9%. This invention, by controlling the process parameters during a single cut, can ensure that the diamond wire does not break during the cutting process.

[0026] In this invention, the grinding is preferably performed on a double-end grinding machine. This invention does not impose any special limitations on the specific model or source of the double-end grinding machine; any commercially available double-end grinding machine well-known to those skilled in the art can be used. This invention does not impose any special limitations on the specific grinding operation; grinding is sufficient to remove the deformation and machining allowance caused by deformation during a single cutting process. In one embodiment of the present invention, the abrasive material in the double-end grinding machine can be diamond; the diamond particle size can be 300 mesh; the grinding disc pressure during grinding can be 0.1~1MPa, or even 0.2MPa, 0.3MPa, 0.4MPa, 0.5MPa, 0.6MPa, 0.7MPa, 0.8MPa, or 0.9MPa; the rotational speed of the upper and lower grinding discs during grinding can be 20~35r / min, or even 22r / min, 24r / min, 25r / min, 27r / min, 28r / min, 30r / min, 32r / min, or 34r / min; the rotational speed of the sun gear during grinding can be 1~10rpm, or even 2rpm, 3rpm, 4rpm, 5rpm, 6rpm, 7rpm, 8rpm, or 9rpm. The present invention can remove deformation and machining allowance caused by deformation during a single cutting process through grinding.

[0027] After obtaining the sheet-like tungsten-zirconium alloy, the present invention bonds and stacks the sheet-like tungsten-zirconium alloy and fixes it on the upper mold of a specific tooling. Then, the lower mold of the specific tooling is fixed on a multi-wire cutting platform. Next, the upper mold of the specific tooling is snapped onto the lower mold. Finally, a second cutting is performed to obtain a strip-like tungsten-zirconium alloy connected to the specific tooling.

[0028] In this invention, the preferred method for bonding the sheet-like tungsten-zirconium alloy is to apply adhesive to both sides of the sheet-like tungsten-zirconium alloy and then bond them together. This invention does not impose any special limitations on the specific composition and amount of the adhesive; commercially available adhesives well-known to those skilled in the art can be used. As one embodiment of this invention, the adhesive can be ethyl α-cyanoacrylate adhesive.

[0029] In this invention, fixing the lower mold of the specific tooling onto the multi-wire cutting platform is preferably done by applying adhesive to the lower mold and then fixing it onto the multi-wire cutting platform. This invention does not impose any special limitations on the specific composition and amount of the adhesive; commercially available adhesives well-known to those skilled in the art can be used. As one embodiment of this invention, the adhesive can be ethyl α-cyanoacrylate adhesive.

[0030] The present invention does not have any special limitations on the specific operation of the stacking, and it is sufficient to stack multiple sheet-like tungsten-zirconium alloys.

[0031] In this invention, the specific tooling includes an upper die and a lower die; the upper die and the lower die are preferably square in shape; the upper die and the lower die are preferably the same size. This invention does not impose any special limitations on the material of the specific tooling; any material well-known to those skilled in the art can be used, as long as damage is avoided during the cutting process.

[0032] In this invention, the upper mold is provided with an indexing conical hole; the indexing conical hole preferably includes a circular protrusion located at the center of the upper mold, small circular protrusions between each side of the circular protrusion and the square, and four protrusions at the four corners of the square; the diameter of the circular protrusion is preferably 20-50% of the side length of the square; the center of the circular protrusion preferably overlaps with the center of the square; the diameter of the small circular protrusion is preferably 10-20% of the diameter of the circular protrusion; the distance between the small circular protrusion and the circular protrusion and the side length is preferably the same; the shape of the four protrusions is preferably the same. By setting the structure, position, and size of the indexing conical hole in the upper mold, this invention can ensure that the position of the protrusion structure of the indexing conical hole remains the same after the upper mold is rotated by 90°, 180°, 270°, or 360°.

[0033] In this invention, a tapered pin is provided in the lower mold. This invention does not impose any special limitations on the specific shape, size, or position of the tapered pin; it is determined based on the technical knowledge of those skilled in the art that it can be fitted with the indexing tapered hole in the upper mold.

[0034] A schematic diagram of the upper mold structure of the specific tooling provided by this invention is shown below. Figure 1 As shown; a schematic diagram of the lower mold structure of a specific tooling is shown below. Figure 2 As shown. By Figure 1 and Figure 2 As can be seen, by setting an indexing cone hole in the upper die of a specific tooling and a cone pin in the lower die, and strictly limiting the position of the indexing cone hole and the cone pin, the present invention can ensure that after the upper or lower die is rotated by multiples of 90°, the upper die and the lower die can still fit together well to form a specific tooling. This ensures that after the second cutting, only the specific tooling needs to be separated, and then the upper die is selected to be refitted after 90°, so that a third cutting can be performed without disassembly. This greatly improves production efficiency and the accuracy of the product is not affected.

[0035] In this invention, the spacing between the diamond wires on the multi-wire cutting platform during the secondary cutting is preferably 4 mm; the cutting speed of the diamond wires on the multi-wire cutting platform during the secondary cutting is preferably 500~1500 m / s; the workpiece feed speed during the secondary cutting is preferably 0.1~0.2 mm / min; the cutting tension during the secondary cutting is preferably 10~50 N; the diameter of the diamond wires during the secondary cutting is preferably 0.1~0.3 mm, more preferably 0.2 mm; the temperature of the cutting fluid during the secondary cutting is preferably 20~30℃; and the mass concentration of the cutting fluid during the secondary cutting is preferably 1~10%. This invention does not impose any special limitations on the specific composition and source of the cutting fluid; commercially available cutting fluids well known to those skilled in the art can be used. In one embodiment of the present invention, the cutting speed of the diamond wire on the multi-wire cutting platform during the secondary cutting can be 600m / s, 700m / s, 800m / s, 900m / s, 1000m / s, 1100m / s, 1200m / s, 1300m / s, or 1400m / s; the workpiece feed speed during the secondary cutting can be 0.12mm / min, 0.14mm / min, 0.15mm / min, 0.16mm / min, or 0.18mm / min; the cutting tension during the secondary cutting can be 15N, 20N, 25N, 30N, 35N, 40N, or 45N; the temperature of the cutting fluid during the secondary cutting can be 22℃, 24℃, 25℃, 26℃, or 28℃; and the mass concentration of the cutting fluid during the secondary cutting can be 2%, 3%, 4%, 5%, 6%, 7%, 8%, or 9%. This invention, by controlling the process parameters during secondary cutting, can ensure that the diamond wire does not break during the secondary cutting process, while also ensuring high precision of the cut product.

[0036] After obtaining a strip-shaped tungsten-zirconium alloy connected to a specific tooling, the present invention rotates the strip-shaped tungsten-zirconium alloy connected to the specific tooling by 90° and cuts it three times, and then performs vibration polishing to obtain a square tungsten-zirconium alloy.

[0037] In this invention, the preferred method of rotating 90° is to separate the upper and lower dies of the specific tooling, then rotate the upper die 90° and attach it to the lower die. This invention does not have a specific limitation on the direction of rotation; clockwise or counterclockwise rotation is acceptable. By employing the above-described rotation method, and then utilizing the engagement of the tapered pin of the lower die and the indexing tapered hole of the upper die in the specific tooling, precise angular positioning is achieved. This ensures that the strip-shaped tungsten-zirconium alloy can be transformed into a square tungsten-zirconium alloy during three cuts, without requiring disassembly of the strip-shaped tungsten-zirconium alloy, significantly improving production efficiency without affecting product precision.

[0038] In this invention, the spacing between the diamond wires on the multi-wire cutting platform during the three cuts is preferably 4 mm; the cutting speed of the diamond wires on the multi-wire cutting platform during the three cuts is preferably 500~1500 m / s; the workpiece feed speed during the three cuts is preferably 0.1~0.2 mm / min; the cutting tension during the three cuts is preferably 10~50 N; the diameter of the diamond wires during the three cuts is preferably 0.1~0.3 mm, more preferably 0.2 mm; the temperature of the cutting fluid during the three cuts is preferably 20~30℃; and the mass concentration of the cutting fluid during the three cuts is preferably 1~10%. This invention does not impose any special limitations on the specific composition and source of the cutting fluid; commercially available cutting fluids well known to those skilled in the art can be used. In one embodiment of the present invention, the cutting speed of the diamond wire on the multi-wire cutting platform during the three cuts can be 600m / s, 700m / s, 800m / s, 900m / s, 1000m / s, 1100m / s, 1200m / s, 1300m / s, or 1400m / s; the workpiece feed speed during the three cuts can be 0.12mm / min, 0.14mm / min, 0.15mm / min, 0.16mm / min, or 0.18mm / min; the cutting tension during the three cuts can be 15N, 20N, 25N, 30N, 35N, 40N, or 45N; the temperature of the cutting fluid during the three cuts can be 22℃, 24℃, 25℃, 26℃, or 28℃; and the mass concentration of the cutting fluid during the three cuts can be 2%, 3%, 4%, 5%, 6%, 7%, 8%, or 9%. This invention, by controlling the process parameters during the three cutting operations, can ensure that the diamond wire does not break during the cutting process, while also ensuring high precision of the cut product.

[0039] In this invention, the abrasive used for vibratory polishing is preferably alumina; the particle size of the abrasive is preferably 2-4 mm; the vibration frequency of the vibratory polishing is preferably 100-500 times / min; and the vibration polishing time is preferably 20-40 min. As one embodiment of this invention, the particle size of the abrasive can be 3 mm; the vibration frequency of the vibratory polishing can be 150 times / min, 200 times / min, 250 times / min, 300 times / min, 350 times / min, 400 times / min, or 450 times / min; and the vibration polishing time can be 25 min, 30 min, or 35 min. This invention can remove burrs from the surface of square tungsten-zirconium alloys through vibratory polishing.

[0040] This invention does not impose any special limitations on the size of the square tungsten-zirconium alloy; it can be selected according to actual needs. In one embodiment of this invention, the size of the square tungsten-zirconium alloy can be 4mm × 4mm × 4mm; the dimensional accuracy requirement for the square tungsten-zirconium alloy can be 4 ± 0.05mm.

[0041] The structural schematic diagram of the tungsten-zirconium alloy being cut on a multi-wire cutting machine platform provided by this invention is shown below. Figure 3 As shown. By Figure 3 As can be seen, the multi-wire cutting machine platform has many parallel diamond wires, which continuously cut the tungsten-zirconium alloy through the rotation of three shafts.

[0042] The process flow diagram of the tungsten-zirconium alloy billet provided by this invention, which involves grinding and three-stage cutting, is shown below. Figure 4 As shown. By Figure 4 As can be seen, after the billet is ground flat, it can be cut in three different directions to transform the tungsten-zirconium alloy billet into a square tungsten-zirconium alloy.

[0043] This invention introduces specific tooling during the manufacturing process. The upper die of the tooling is fitted with an indexing cone hole, and the lower die is fitted with a cone pin. In this way, after the second cutting is completed, the upper and lower dies of the tooling are simply separated, rotated 90°, and then fitted back together through the indexing cone hole and cone pin. This allows for direct third cutting without the need to disassemble and re-fix the strip-shaped tungsten-zirconium alloy. This significantly simplifies the process, shortens the production time, and improves production efficiency.

[0044] The technical solutions of this invention will be clearly and completely described below with reference to the embodiments thereof. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0045] Example 1 A method for preparing a square tungsten-zirconium alloy comprises the following steps: (1) A tungsten-zirconium alloy blank (65W20Zr7Nb8Ti alloy) with dimensions of 120mm×120mm×100mm is fixed on a surface grinder. A carbide grinding wheel is used to grind and level one side of the tungsten-zirconium alloy blank with dimensions of 120mm×120mm. Then, α-cyanoacrylate adhesive is used to fix the ground and leveled side on the multi-wire cutting machine platform for one cut. Then, it is ground on a double-end face grinding machine to obtain a sheet of tungsten-zirconium alloy with a thickness of 4±0.05mm. The material of the carbide grinding wheel is 100-mesh carbide. The linear speed of the grinding wheel during the grinding and leveling is 720m / min, the reciprocating speed of the worktable is 6m / min, and the vertical feed is... The feed rate is 0.02 mm / cut; the cutting allowance for each cut is 0.1 mm; the spacing between the diamond wires on the multi-wire cutting platform during a single cut is 4.1 mm; the cutting speed of the diamond wires is 900 m / s; the workpiece feed rate is 0.2 mm / min; the cutting tension is 30 N; the diameter of the diamond wires is 0.2 mm; the temperature of the cutting fluid is 24℃; the mass concentration of the cutting fluid is 5%; and the cutting fluid is ZK-805 produced by Zhongke Jintai Company. The abrasive material in the double-end grinding machine is diamond, with a diamond particle size of 300 mesh. The grinding disc pressure during grinding is 0.4 MPa; the rotation speed of the upper and lower grinding discs during grinding is 24 r / min; and the rotation speed of the sun gear during grinding is 4 rpm. (2) After the sheet-like tungsten-zirconium alloy obtained in step (1) is bonded and stacked using ethyl α-cyanoacrylate adhesive, it is fixed to the upper mold of a specific tooling. Then, the lower mold of the specific tooling is fixed to the multi-wire cutting platform using ethyl α-cyanoacrylate adhesive. Next, the upper mold of the specific tooling is attached to the lower mold, and finally, a second cut is performed to obtain a strip-shaped tungsten-zirconium alloy connected to the specific tooling. The specific tooling includes an upper mold and a lower mold. The upper mold is provided with an indexing tapered hole. The lower mold is provided with a tapered pin. The structural diagram of the upper mold and the lower mold of the specific tooling is shown below. Figure 1 and Figure 2 As shown; during the secondary cutting, the spacing of the diamond wires on the multi-wire cutting platform is 4mm, the cutting speed of the diamond wires is 900m / s, the workpiece feed speed is 0.15mm / min, the cutting tension is 30N, the diameter of the diamond wires is 0.2mm, the temperature of the cutting fluid is 24℃, and the mass concentration of the cutting fluid is 5%. (3) Separate the upper and lower molds of the specific tooling in the strip tungsten zirconium alloy obtained in step (2) and connected to the specific tooling. Then rotate the upper mold 90° and attach it to the lower mold. Then perform three cuts and finally perform vibration polishing to obtain a square tungsten zirconium alloy. During the three cuts, the spacing of the diamond wires on the multi-wire cutting platform is 4 mm, the cutting speed of the diamond wires is 900 m / s, the workpiece feed speed is 0.15 mm / min, the cutting tension is 30 N, the diameter of the diamond wires is 0.2 mm, the temperature of the cutting fluid is 24 °C, and the mass concentration of the cutting fluid is 5%. The abrasive used for vibration polishing is alumina with a particle size of 2-4 mm. The vibration frequency of vibration polishing is 300 times / min, and the vibration polishing time is 30 min.

[0046] Comparative Example 1 A method for preparing a square tungsten-zirconium alloy comprises the following steps: (1) A tungsten-zirconium alloy blank (65W20Zr7Nb8Ti alloy) with dimensions of 120mm×120mm×100mm is fixed on a surface grinder. A carbide grinding wheel is used to grind and level one side of the tungsten-zirconium alloy blank with dimensions of 120mm×120mm. Then, conventional electrical discharge wire cutting is used. Finally, the blank is ground on a double-end face grinding machine to obtain a sheet of tungsten-zirconium alloy with a thickness of 4±0.05mm. The carbide grinding wheel is made of 100-mesh carbide. The grinding wheel linear speed during grinding and leveling is 720m / min, the table reciprocating speed is 6m / min, and the vertical feed is 0.02mm / time. The grinding abrasive in the double-end face grinding machine is diamond with a particle size of 300 mesh. The grinding disc pressure during grinding is 0.4MPa, the rotation speed of the upper and lower grinding discs during grinding is 24r / min, and the rotation speed of the sun gear during grinding is 4rpm. (2) The sheet-like tungsten-zirconium alloy obtained in step (1) is cut into individual square products by an electrical discharge wire cutting device to obtain square tungsten-zirconium alloy.

[0047] The physical images of the square tungsten-zirconium alloys obtained in Example 1 and Comparative Example 1 are shown in the following figures, respectively. Figure 5 and Figure 6 As shown, the precision of the square tungsten-zirconium alloys obtained in Example 1 and Comparative Example 1 was tested, and the results are shown in Table 1: Table 1 shows the precision of the square tungsten-zirconium alloys obtained in Example 1 and Comparative Example 1.

[0048] Depend on Figures 5-6As can be seen from Table 1, the dimensional accuracy and roughness of the square tungsten-zirconium alloy obtained by the preparation method provided by the present invention are the same as those of the square tungsten-zirconium alloy obtained by the traditional process, and the perpendicularity is lower, indicating that the square tungsten-zirconium alloy obtained by the preparation method provided by the present invention is of higher quality. At the same time, the preparation time of a single square tungsten-zirconium alloy by the preparation method provided by the present invention is only 0.1 min, which is much lower than the 3 min of the traditional process, resulting in a significant improvement in production efficiency and lower production cost.

[0049] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method for preparing a square tungsten-zirconium alloy, characterized in that, Includes the following steps: (1) After grinding and leveling the tungsten-zirconium alloy billet, it is fixed on the multi-wire cutting machine platform for one cut, and then ground to obtain sheet tungsten-zirconium alloy; (2) After the sheet-like tungsten-zirconium alloy obtained in step (1) is bonded and stacked, it is fixed to the upper mold of the specific tooling. Then, the lower mold of the specific tooling is fixed on the multi-wire cutting platform. Next, the upper mold of the specific tooling is fastened to the lower mold. Finally, a second cutting is performed to obtain a strip-like tungsten-zirconium alloy connected to the specific tooling. The specific tooling includes an upper mold and a lower mold. The upper mold is provided with an indexing tapered hole. The lower mold is provided with a tapered pin. (3) The strip-shaped tungsten-zirconium alloy obtained in step (2) and connected to a specific tooling is rotated 90° and then cut three times, and then vibrated and polished to obtain a square tungsten-zirconium alloy.

2. The preparation method according to claim 1, characterized in that, In step (1), the grinding and leveling method is to fix the tungsten-zirconium alloy blank on a surface grinder and use a carbide grinding wheel to grind one side of the tungsten-zirconium alloy blank flat.

3. The preparation method according to claim 2, characterized in that, The grinding wheel linear speed during the grinding and leveling process is 600~800m / min, the table reciprocating speed is 1~10m / min, and the vertical feed rate is 0.01~0.05mm / cycle.

4. The preparation method according to claim 1, characterized in that, The cutting allowance for each cut in step (1) is 0.05~0.1mm.

5. The preparation method according to claim 1, characterized in that, In step (1), the spacing of the diamond wires on the multi-wire cutting platform during a single cut is 4.05~4.1mm, the cutting speed of the diamond wires is 500~1500m / s, the workpiece feed speed is 0.05~0.5mm / min, the cutting tension is 10~50N, the diameter of the diamond wires is 0.1~0.3mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

6. The preparation method according to claim 1, characterized in that, In step (1), the grinding disc pressure during grinding is 0.1~1MPa, the rotation speed of the upper and lower grinding discs during grinding is 20~35r / min, and the rotation speed of the sun gear during grinding is 1~10rpm.

7. The preparation method according to claim 1, characterized in that, In step (2), the upper mold and the lower mold are independently square in shape; the upper mold and the lower mold are the same size.

8. The preparation method according to claim 1, characterized in that, In step (2), during the secondary cutting, the spacing of the diamond wires on the multi-wire cutting platform is 4mm, the cutting speed of the diamond wires is 500~1500m / s, the workpiece feed speed is 0.1~0.2mm / min, the cutting tension is 10~50N, the diameter of the diamond wires is 0.1~0.3mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

9. The preparation method according to claim 1, characterized in that, In step (3), the interval between the diamond wires on the multi-wire cutting platform during the three cuts is 4 mm, the cutting speed of the diamond wire is 500~1500 m / s, the workpiece feed speed is 0.1~0.2 mm / min, the cutting tension is 10~50 N, the diameter of the diamond wire is 0.1~0.3 mm, the temperature of the cutting fluid is 20~30℃, and the mass concentration of the cutting fluid is 1~10%.

10. The preparation method according to claim 1, characterized in that, The abrasive used in step (3) for vibration polishing is alumina with a particle size of 2-4 mm; the vibration frequency of vibration polishing is 100-500 times / min and the time is 20-40 min.

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