A diamond substrate cutting apparatus and method

Abstract

The application belongs to the technical field of semiconductor processing, and particularly relates to a diamond substrate cutting device and a cutting method, which comprises a mounting frame, a cutting component, a height adjusting component, a feeding component, a mounting component and a rotating component. The controller controls the opening of the vacuum chuck control valve covered by the diamond substrate, so that the covered vacuum cavity is used to fix the diamond substrate through negative pressure adsorption. Then, the controller controls the height adjusting component to adjust the vertical height of the cutting blade. The controller controls the rotation of the cutting motor and the feeding component to drive the cutting blade to cut the diamond substrate below. After the cutting is completed, the feeding component stops. The controller controls the rotating component to drive the diamond substrate on the mounting component to rotate to the next cutting position. The above operation is repeated to cut all the required cutting positions on the diamond substrate, so that the automatic cutting of the diamond substrate is realized, and the cutting efficiency of the diamond substrate is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor processing, and particularly relates to a diamond substrate cutting device and a cutting method. BACKGROUND

[0002] The diamond substrate is a semiconductor substrate made of diamond material, and is mainly used for solving the heat dissipation problem of high-power electronic devices. Due to the extremely high thermal conductivity, the diamond becomes an ideal choice for a new generation of semiconductor devices, especially in high-frequency and high-power applications such as GaN-based power devices.

[0003] The existing cutting method of the diamond substrate sheet mainly adopts the cutting modes of blade saw blade, grinding wheel, diamond wire, laser, high-pressure water knife and the like for single straight line cutting. The above processing method directly acts force on the surface of the substrate sheet during cutting, and the impact force in the cutting process is easy to cause the corner collapse and breakage of the substrate sheet, and the direction of the substrate sheet cracking is also difficult to control, resulting in uneven edges and affecting the subsequent process. Moreover, the debris generated during cutting is easy to splash onto the surface of the substrate sheet, which is difficult to remove, thereby reducing the quality of the finished chip. In addition, different sizes of the substrate sheet need to customize different specifications of the cutting device, which is not limited to the diameter, but also has different thicknesses and side shapes. Therefore, for occasions with high requirements for size diversity, the existing cutting device cannot meet the use requirements.

[0004] In view of the above problems, the existing cutting device mainly adopts the mechanical clamping mode. Although it can also adapt to the processing of diamond substrates of different sizes to a certain extent, when the thickness and side shape of the diamond substrate change, more mechanical grippers need to be designed for adaptation, thereby increasing the complexity of the device and the conversion time during the change, thereby affecting the production efficiency. Moreover, the existing cutting device is not very high in automation, which further affects the cutting efficiency of the diamond substrate. SUMMARY

[0005] In order to make up for the deficiencies of the prior art, the application provides a diamond substrate cutting device and a cutting method. The application is mainly used to solve the problem that the existing cutting device adopts the mechanical clamping mode, when the thickness and side shape of the diamond substrate change, more mechanical grippers need to be designed for adaptation, thereby increasing the complexity of the device and the conversion time during the change, thereby affecting the production efficiency. Moreover, the existing cutting device is not very high in automation, which further affects the cutting efficiency of the diamond substrate.

[0006] The technical scheme adopted by the present application to solve its technical problems is: the present application provides a diamond substrate cutting equipment, which comprises a mounting frame, a cutting component, a height adjusting component, a feeding component, a mounting component and a rotating component; the upper end of the mounting frame is provided with the feeding component for carrying the horizontal movement of the height adjusting component; the height adjusting component is used for carrying the up-down movement of the cutting component; the cutting component comprises a cutting blade and a cutting motor; the cutting motor is fixedly connected horizontally below the height adjusting component; the output shaft end of the cutting motor is provided with the cutting blade; the lower side of the cutting component is provided with the mounting component for mounting and fixing the parts to be cut; the mounting component comprises a vacuum chuck; the vacuum chuck is internally provided with vacuum cavities of layer-by-layer sleeve rings; each vacuum cavity is individually connected to a control valve for controlling vacuumizing; the lower side of the mounting component is provided with the rotating component for carrying the rotation of the mounting component; the rotating component is connected to the mounting frame.

[0007] The feeding component can be moved by a motor-driven synchronous belt to drive the mounting plate for mounting the height adjusting component to move on a linear guide rail; the height adjusting component can be moved along the vertical direction by a telescopic component cooperating with a guide column to drive the receiving plate for mounting the cutting component; and the rotating component can be rotated by a motor-driven pinion to drive the gear ring connected to the vacuum chuck.

[0008] Preferably, the upper surface of the vacuum chuck is inclined by 0.5-1° relative to the cutting blade.

[0009] Preferably, the mounting component further comprises a positioning mechanism; the positioning mechanism comprises a positioning rod, a guide groove, a driving groove disc, a first gear ring, a first gear and a positioning motor; a group of waist-shaped grooves are uniformly and radially spaced apart on the vacuum chuck; the guide groove is arranged below the vacuum chuck corresponding to the position of the waist-shaped groove; the upper end of the positioning rod extends out of the waist-shaped groove, and the lower end of the positioning rod is provided with a sliding part; the sliding part is slidingly connected in the guide groove; the lower end of the positioning rod is inserted into the arc-shaped groove on the driving groove disc; the driving groove disc is rotationally connected to the fixed column below the vacuum chuck; the first gear ring is fixedly connected below the driving groove disc; the first gear meshing with the first gear ring is connected to the output shaft of the positioning motor; and the positioning motor is fixedly connected to the fixed plate fixedly connected with the fixed column.

[0010] Preferably, the upper end of the positioning rod is provided as a stepped shaft; a threaded hole is arranged on the end face of the upper end of the positioning rod; a positioning sleeve is sleeved on the stepped shaft; a V-shaped groove is arranged on one side of the positioning sleeve; a gasket is arranged above the positioning sleeve; and the gasket is penetrated by a screw, and the screw is connected in the threaded hole on the end face of the upper end of the positioning rod.

[0011] Preferably, the cutting device further comprises a cleaning component; the cleaning component comprises a chip blowing unit and a chip collecting unit; the chip blowing unit is arranged on one side of the cutting blade; the chip blowing unit blows air to the lowest cutting edge of the cutting blade through high-pressure airflow; the chip collecting unit is arranged on the other side of the cutting blade; the chip collecting unit is used to collect the chips blown by the chip blowing unit.

[0012] Preferably, a dust collection hood is arranged on the cutting blade; the lower end of the dust collection hood is a semi-enclosed structure arranged on the cutting blade; the upper end of the dust collection hood is connected to a suction pump.

[0013] Preferably, the angle between the outlet direction of the chip blowing unit and the cutting blade is 45-80°.

[0014] Preferably, the chip collecting unit comprises an adhesive cloth, a conveying roller, a conveying motor, a scraping box, a cleaning tank and a drying air nozzle; the adhesive cloth is provided with a silicon-based pressure-sensitive adhesive; the adhesive cloth is supported and driven by a plurality of conveying rollers; the conveying motor drives one of the conveying rollers to rotate; the adhesive cloth close to the cutting blade is arranged obliquely; the adhesive cloth moves in sequence through the scraping box, the cleaning tank and the drying air nozzle; one side of the scraping box is in contact with the adhesive cloth; the adhesive cloth needs to be immersed in the cleaning tank; the cleaning tank is cleaned by ultrasonic waves; the drying air nozzle is used to continuously blow and dry the cleaned adhesive cloth.

[0015] Preferably, the adhesive cloth close to the cutting blade is supported and connected by a buffer support; the buffer support comprises a swing rod, a rotating rod and an elastic member; one end of the swing rod is hinged to a mounting support plate for mounting the conveying roller; the elastic member is arranged between one end of the swing rod and the mounting support plate; the other end of the swing rod is rotatably connected to the rotating rod; the adhesive cloth passes around the rotating rod. The elastic member 728 is a U-shaped structure made of elastic material.

[0016] A method for cutting a diamond substrate, the method comprising the steps of:

[0017] S1: after the diamond substrate to be cut is placed on the vacuum chuck, the controller controls the positioning motor to drive the first gear to rotate through an electrical signal, and then the first gear drives the driving groove disc to rotate through the meshing of the first gear ring, and then the arc-shaped groove arranged on the driving groove disc simultaneously extrudes the lower end of the positioning rod, and then the sliding part at the lower end of the positioning rod moves stably along the guide groove, and then the upper end of the positioning rod is driven to move along the waist-shaped groove on the vacuum chuck, and then the upper end of the positioning rod pushes the diamond substrate placed on the vacuum chuck to the center position of the vacuum chuck, when the torque detected by the torque sensor arranged between the output shaft of the positioning motor and the first gear exceeds the threshold value, the controller controls the positioning motor to stop and the electromagnetic brake;

[0018] S2: the controller controls the vacuum chuck control valve covering the diamond substrate to be opened through an electrical signal, and then the vacuum cavity covering the diamond substrate is fixed by negative pressure adsorption;

[0019] S3: then the controller controls the vertical height of the cutting blade to be adjusted through an electrical signal;

[0020] S4: then the controller controls the cutting motor to rotate and controls the feeding component to drive the cutting blade to cut the diamond substrate below;

[0021] S5: after the cutting is completed, the feeding component stops, the controller controls the rotating component to drive the diamond substrate on the mounting component to rotate through an electrical signal, and then the diamond substrate is rotated to the next cutting position;

[0022] S6: the above S4 and S5 operations are repeated to cut all the required cutting positions on the diamond substrate.

[0023] The beneficial effects of the present application are as follows:

[0024] 1. The controller controls the vacuum chuck control valve covering the diamond substrate to be opened, and then the vacuum cavity covering the diamond substrate is fixed by negative pressure adsorption, and then the controller controls the vertical height of the cutting blade to be adjusted, the controller controls the cutting motor to rotate and controls the feeding component to drive the cutting blade to cut the diamond substrate below, after the cutting is completed, the feeding component stops, the controller controls the rotating component to drive the diamond substrate on the mounting component to rotate to the next cutting position, and the above operations are repeated to cut all the required cutting positions on the diamond substrate, thereby realizing automatic cutting of the diamond substrate, and improving the cutting efficiency of the diamond substrate.

[0025] 2. The application avoids the vertical impact of the cutting blade on the diamond substrate and the vacuum chuck by setting the upper surface of the vacuum chuck to be inclined at 0.5-1° relative to the cutting blade, and then using the cutting blade tip to contact the diamond substrate laterally, on one hand, the non-perpendicular impact of the cutting blade on the diamond substrate can reduce the degree of diamond substrate notch collapse, thereby improving the cutting accuracy of the diamond substrate; on the other hand, it prevents the cutting blade from penetrating the diamond substrate vertically and causing damage to the vacuum chuck, thereby improving the service life of the vacuum chuck and the stability of the equipment operation.

[0026] 3. The application drives the first gear to rotate by the controller controlling the positioning motor, then the first gear drives the driving groove disc to rotate through the meshing of the first gear ring, then the arc-shaped groove arranged on the driving groove disc simultaneously extrudes the lower end of the positioning rod, then the sliding part at the lower end of the positioning rod moves stably along the guide groove, then the upper end of the positioning rod is driven to move along the waist-shaped groove on the vacuum chuck, then the upper end of the positioning rod pushes the diamond substrate placed on the vacuum chuck to the center position of the vacuum chuck, when the torque detected by the torque sensor arranged between the positioning motor output shaft and the first gear exceeds the threshold value, the controller controls the positioning motor to stop and the electromagnetic brake, thereby realizing the positioning of the cylindrical diamond substrate, then the controller controls the vacuum chuck control valve covered by the diamond substrate to open, thereby the vacuum cavity covered by the diamond substrate is fixed by negative pressure adsorption, thereby completing the automatic positioning and fixing of the diamond substrate, then the controller controls the positioning motor to reverse, thereby driving the positioning rod to move away from the waist-shaped groove on the vacuum chuck, thereby leaving space for the cutting component to cut the diamond substrate. By setting the positioning mechanism cooperating with the vacuum chuck, the automatic positioning and fixing of the diamond substrate can be realized, thereby improving the installation and fixing efficiency of the diamond substrate, and thereby improving the cutting efficiency of the cutting equipment.

[0027] 4. The application sets the scrap blowing unit and the scrap collecting unit on the two sides of the cutting blade, then blows the cutting scrap generated by the cutting blade cutting the diamond substrate to the opposite scrap collecting unit through the scrap blowing unit, then the cutting scrap is collected by the scrap collecting unit, thereby preventing the cutting scrap from splashing onto the surface of the diamond substrate, which is difficult to remove, thereby reducing the quality of the finished chip. Moreover, by using this way, the scrap blowing unit blows away the cutting scrap and also takes away the heat generated by cutting, thereby ensuring that the cutting edge of the cutting blade will not overheat and thereby affect continuous cutting, thereby improving the stable operation of the cutting equipment. BRIEF DESCRIPTION OF DRAWINGS

[0028] The application will be further described below with reference to the drawings.

[0029] Figure 1 It is the overall structure schematic diagram of the cutting equipment of the application.

[0030] Figure 2 is a structural schematic diagram of the feeding component in the application;

[0031] Figure 3 is a structural schematic diagram of the height adjusting component in the application;

[0032] Figure 4 is a structural schematic diagram of the cleaning component in the application;

[0033] Figure 5 is a structural schematic diagram of the chip collecting unit in the application;

[0034] Figure 6 is a structural schematic diagram of the chip collecting unit in the application;

[0035] Figure 7 is a connection schematic diagram of the swing rod and the elastic member in the application;

[0036] Figure 8 is a structural schematic diagram of the elastic member in the application;

[0037] Figure 9 is a structural schematic diagram of the mounting component in the application;

[0038] Figure 10 is a structural schematic diagram of the mounting component in the application;

[0039] Figure 11 is a connection schematic diagram of the first gear ring and the first gear in the application;

[0040] Figure 12 is a connection schematic diagram of the sliding part and the guide groove in the application;

[0041] Figure 13 is a connection schematic diagram of the positioning rod and the positioning sleeve in the application;

[0042] Figure 14 is a structural schematic diagram of the vacuum cavity in the application;

[0043] In the figure: mounting frame 1, cutting component 2, cutting blade 21, cutting motor 22, height adjusting component 3, feeding component 4, mounting component 5, vacuum chuck 51, vacuum cavity 510, fixing column 511, fixing plate 512, positioning rod 52, sliding part 521, positioning sleeve 522, V-shaped groove 5221, gasket 523, screw 524, guide groove 53, driving groove disc 54, first gear ring 55, first gear 56, positioning motor 57, rotating component 6, cleaning component 7, scrap blowing unit 71, scrap collecting unit 72, sticky cloth 721, conveying roller 722, conveying motor 723, scraping box 724, cleaning tank 725, air-drying air nozzle 726, swing rod 727, elastic member 728, dust suction cover 73. DETAILED DESCRIPTION

[0044] In order to make the technical means, creative features, purposes and effects of the present application easy to understand, the present application is further described below in combination with specific embodiments.

[0045] As shown in Figures 1 to 3 A diamond substrate cutting device, comprising a mounting frame 1, a cutting component 2, a height adjusting component 3, a feeding component 4, a mounting component 5 and a rotating component 6; the upper end of the mounting frame 1 is provided with the feeding component 4 for carrying the horizontal movement of the height adjusting component 3; the height adjusting component 3 is used to carry the cutting component 2 to move up and down; the cutting component 2 comprises a cutting blade 21 and a cutting motor 22; the cutting motor 22 is fixedly connected horizontally below the height adjusting component 3; the output shaft end of the cutting motor 22 is provided with the cutting blade 21; the lower part of the cutting component 2 is provided with the mounting component 5 for mounting and fixing the parts to be cut; the mounting component 5 comprises a vacuum chuck 51; the vacuum chuck 51 is provided with a vacuum cavity 510 with layer-by-layer sleeve rings inside; each vacuum cavity 510 is individually connected to a control valve to control vacuumizing; the lower part of the mounting component 5 is provided with the rotating component 6 for carrying the rotation of the mounting component 5; the rotating component 6 is connected to the mounting frame 1.

[0046] The feeding component 4 can be achieved by moving the synchronous belt driven by the motor to drive the mounting plate for mounting the height adjusting component 3 to move on the linear guide rail; the height adjusting component 3 can be achieved by driving the receiving plate for mounting the cutting component 2 to move along the vertical direction through the cooperation of the telescopic component and the guide column; the rotating component 6 can be achieved by driving the pinion gear through the motor to drive the gear ring connected to the vacuum chuck 51 to rotate.

[0047] In operation, the diamond substrate to be cut is placed on the vacuum chuck 51, the controller controls the vacuum chuck 51 covered by the diamond substrate to open the control valve through an electrical signal, so that the vacuum cavity 510 covered by the diamond substrate is fixed by negative pressure adsorption, then the controller controls the height adjusting component 3 to adjust the vertical height of the cutting blade 21 through an electrical signal, and the specific adjustment height can be determined according to the thickness of the diamond substrate minus the thickness required by the subsequent splitting process, then the controller controls the cutting motor 22 to rotate while controlling the feeding component 4 to drive the cutting blade 21 to cut the diamond substrate below, after the cutting is completed, the feeding component 4 stops, the controller controls the rotating component 6 to drive the diamond substrate on the mounting component 5 to rotate, and then rotate to the next cutting position, then the controller controls the feeding component 4 to drive the cutting blade 21 to cut the diamond substrate, and the above operation is repeated to cut all the required cutting positions on the diamond substrate, thereby realizing automatic cutting of the diamond substrate, and improving the cutting efficiency of the diamond substrate.

[0048] The upper surface of the vacuum chuck 51 is inclined to the cutting blade 21 by 0.5-1°.

[0049] By setting the upper surface of the vacuum chuck 51 to be inclined to the cutting blade 21 by 0.5-1°, the cutting blade 21 contacts the diamond substrate from the side, thereby avoiding the vertical impact of the cutting blade 21 on the diamond substrate and the vacuum chuck 51, on the one hand, the non-vertical impact of the cutting blade 21 on the diamond substrate can reduce the degree of cutting notch collapse of the diamond substrate, thereby improving the cutting precision of the diamond substrate; on the other hand, the vertical impact of the cutting blade 21 on the diamond substrate is prevented, thereby preventing the diamond substrate from being penetrated and damaging the vacuum chuck 51, thereby improving the service life of the vacuum chuck 51 and the stability of the equipment operation.

[0050] As Figures 9 to 14As shown, the mounting component 5 further comprises a positioning mechanism; the positioning mechanism comprises a positioning rod 52, a guide groove 53, a driving groove disc 54, a first gear ring 55, a first gear 56 and a positioning motor 57; a plurality of waist-shaped grooves are evenly and radially spaced apart on the vacuum chuck 51; the guide groove 53 is arranged below the vacuum chuck 51 corresponding to the position of the waist-shaped groove; the upper end of the positioning rod 52 extends out of the waist-shaped groove, and the lower end of the positioning rod 52 is provided with a sliding part 521; the sliding part 521 is slidingly connected in the guide groove 53; the lower end of the positioning rod 52 is inserted into the arc-shaped groove on the driving groove disc 54; the driving groove disc 54 is rotationally connected to the fixed column 511 below the vacuum chuck 51; the first gear ring 55 is fixedly connected below the driving groove disc 54; the first gear 56 engaged with the first gear ring 55 is connected to the output shaft of the positioning motor 57; and the positioning motor 57 is fixedly connected to the fixed plate 512 fixedly connected with the fixed column 511.

[0051] After placing the diamond substrate to be cut on the vacuum chuck 51, the controller controls the positioning motor 57 to drive the first gear 56 to rotate through an electrical signal, and then the first gear 56 drives the driving groove disc 54 to rotate through meshing with the first gear ring 55, and then the arc-shaped groove arranged on the driving groove disc 54 simultaneously extrudes the lower end of the positioning rod 52, and then the sliding part 521 at the lower end of the positioning rod 52 moves stably along the guide groove 53, and then the upper end of the positioning rod 52 is driven to move along the waist-shaped groove on the vacuum chuck 51, and then the upper end of the positioning rod 52 pushes the diamond substrate placed on the vacuum chuck 51 to the center position of the vacuum chuck 51, and when the torque detected by the torque sensor arranged between the output shaft of the positioning motor 57 and the first gear 56 exceeds the threshold value, the controller controls the positioning motor 57 to stop and the electromagnetic brake, and then the cylindrical diamond substrate is positioned, and then the controller controls the vacuum chuck 51 valve covered by the diamond substrate to be opened, and then the vacuum cavity 510 covered by the diamond substrate is fixed by negative pressure adsorption, and then the automatic positioning and fixing of the diamond substrate are completed, and then the controller controls the positioning motor 57 to reverse, and then the positioning rod 52 is driven to move away from the waist-shaped groove on the vacuum chuck 51, and then space is left for the cutting component 2 to cut the diamond substrate. By arranging the positioning mechanism cooperating with the vacuum chuck 51, the automatic positioning and fixing clamping of the diamond substrate can be realized, and then the installation and fixing efficiency of the diamond substrate is improved, and then the cutting efficiency of the cutting equipment is improved.

[0052] As Figure 13As shown, the upper end of the positioning rod 52 is provided as a stepped shaft; a threaded hole is arranged on the upper end face of the positioning rod 52; a positioning sleeve 522 is sleeved on the stepped shaft; a V-shaped groove 5221 is arranged on one side of the positioning sleeve 522; a gasket 523 is arranged above the positioning sleeve 522; the gasket 523 is penetrated by a screw 524, and the screw 524 is connected in the threaded hole on the upper end face of the positioning rod 52.

[0053] It is more convenient and fast to use the form of vacuum adsorption for thinner diamond substrates, but for thicker diamond substrates, the cutting depth is also increased, which leads to the increase of cutting, and in turn requires the increase of the force of clamping and fixing the diamond substrate. In this case, the mechanical clamping method undoubtedly can best guarantee the stability of cutting. In the case, the V-shaped groove 5221 structure and the positioning sleeve 522 capable of rotating at an angle are arranged on the upper end of the positioning rod 52, and then the circular arc surface or the V-shaped surface can be selected to contact and clamp the diamond substrate by rotating the positioning sleeve 522. If the side surface of the diamond substrate to be cut is a cylindrical surface, the circular arc surface on one side of the positioning sleeve 522 is selected to contact and clamp the diamond substrate. If the side surface of the diamond substrate to be cut is a circular drum surface, the V-shaped surface on one side of the positioning sleeve 522 is selected to contact and clamp the diamond substrate. For diamond substrates of different thicknesses, the positioning sleeve 522 is slid along the stepped shaft arranged on the upper end of the positioning rod 52 to ensure that the two surfaces of the V-shaped surface are always in contact with the circular drum surface of the diamond substrate, thereby ensuring the contact effect and having a wider application range. When the thickness of the diamond substrate changes during the replacement of the product, the positioning rod 52 needs to be controlled first, and the V-shaped surface of the positioning sleeve 522 is used to clamp the diamond substrate. After the diamond substrate is in contact with all the V-shaped surfaces, the screw 524 is tightened to limit the axial highest position of the positioning sleeve 522, that is, to make the positioning sleeve 522 bear the axial tension, thereby limiting the axial position of the diamond substrate. In this way, the diamond substrate of different thicknesses can be stably and reliably clamped, and the cutting equipment has higher cutting quality and a larger application range.

[0054] As shown in the figure, Figures 1 to 6 As shown, the cutting device further comprises a cleaning component 7; the cleaning component 7 comprises a chip blowing unit 71 and a chip collecting unit 72; the chip blowing unit 71 is arranged on one side of the cutting blade 21; the chip blowing unit 71 blows air to the cutting edge at the lowest part of the cutting blade 21 through high-pressure airflow; the chip collecting unit 72 is arranged on the other side of the cutting blade 21; the chip collecting unit 72 is used to collect the chips blown by the chip blowing unit 71.

[0055] By setting the blowing chip unit 71 and the chip collecting unit 72 on both sides of the cutting blade 21 respectively, and then blowing the cutting chip generated by the cutting blade 21 to the opposite chip collecting unit 72 through the blowing chip unit 71, and then the cutting chip is collected by the chip collecting unit 72, thereby preventing the cutting chip from splashing onto the surface of the diamond substrate and being difficult to remove, thereby reducing the quality of the finished chip. Moreover, in this way, the blowing chip unit 71 also removes the heat generated during cutting while blowing away the cutting chip, thereby ensuring that the cutting edge of the cutting blade 21 will not overheat and thereby affect continuous cutting, thereby improving the stable operation of the cutting equipment.

[0056] As shown in Figures 1 to 4 , the cutting blade 21 is provided with a dust cover 73; the lower end of the dust cover 73 is a semi-enclosed structure cover on the cutting blade 21; the upper end of the dust cover 73 is connected to a suction pump.

[0057] By covering the cutting blade 21 with the dust cover 73 of the surrounding structure, the cutting small particle dust generated by the cutting blade 21 cutting the diamond substrate can be sucked away in time, thereby making up for the defect that the chip collecting unit 72 cannot collect small particle dust, thereby maximizing the collection of cutting chips and dust generated during cutting, thereby preventing the cutting chip and dust from spreading onto the surface of the diamond substrate, thereby avoiding the problem of reducing the quality of the finished chip due to the inability to remove. Moreover, the blowing chip unit 71 can accelerate the lifting of small particle dust, thereby being more efficiently removed by the suction pump, thereby improving the removal effect.

[0058] As shown in Figures 3 to 4 , the angle between the outlet direction of the blowing chip unit 71 and the cutting blade 21 is 45-80°.

[0059] By limiting the angle between the outlet direction of the blowing chip unit 71 and the cutting blade 21 to 45-80°, the airflow blown by the blowing chip unit 71 is better moved in the horizontal direction, on the one hand, the cutting chip can be moved more quickly to the opposite chip collecting unit 72, on the other hand, the cutting chip can be reduced in the vertical direction and the diamond substrate. Impact rebound, thereby reducing the cutting chip impact rebound to spread to other surfaces of the diamond substrate, thereby improving the production quality of the finished chip.

[0060] As shown in Figures 4 to 6As shown, the chip collection unit 72 includes an adhesive cloth 721, a conveying roller 722, a conveying motor 723, a scraping box 724, a cleaning box 725, and a drying nozzle 726. The adhesive cloth 721 is coated with silicone-based pressure-sensitive adhesive. The adhesive cloth 721 is supported and driven by multiple conveying rollers 722. The conveying motor 723 drives one of the conveying rollers 722 to rotate. The adhesive cloth 721 is inclined near the cutting blade 21. The adhesive cloth 721 passes sequentially through the scraping box 724, the cleaning box 725, and the drying nozzle 726 in its moving direction. One side of the scraping box 724 contacts the adhesive cloth 721. The adhesive cloth 721 needs to be immersed in the cleaning box 725. The cleaning box 725 is cleaned using ultrasonic cleaning. The drying nozzle 726 is used to continuously blow air to dry the cleaned adhesive cloth 721.

[0061] By setting a continuously circulating adhesive cloth 721 on the other side of the cutting blade 21, not only can the chips blown by the chip blowing unit 71 be adhered to the adhesive cloth 721 in a timely manner, but also, because the adhesive cloth 721 is circulating, and a scraping box 724, a cleaning box 725 and a drying nozzle 726 are set behind it, the adhesive cloth 721 with chips is sequentially hung up to remove the sticky chips, the residual chips on the adhesive cloth 721 are removed by ultrasonic waves, and the cleaned adhesive cloth 721 is dried to restore its adhesiveness. This allows the adhesive cloth 721 to maintain a good adhesive effect, thereby ensuring the cleaning effect of the chip collection unit 72, reducing the spread of chips, and improving the processing quality of the finished chip.

[0062] like Figures 5 to 8 As shown, the adhesive fabric 721 near the cutting blade 21 is supported and connected by a buffer frame; the buffer frame support includes a swing rod 727, a rotating rod, and an elastic element 728; one end of the swing rod 727 is hinged to a mounting plate for mounting the conveyor roller 722; the elastic element 728 is disposed between one end of the swing rod 727 and the mounting plate; the other end of the swing rod 727 is rotatably connected to the rotating rod; the adhesive fabric 721 passes around the rotating rod.

[0063] The elastic element 728 is a U-shaped structure made of elastic material. By setting an adhesive cloth 721 close to the cutting blade 21 and supporting it with a buffer frame, the elasticity of the elastic element 728 ensures that the adhesive cloth 721 will not damage the chip collection unit 72 after contacting the diamond substrate, thus ensuring the safety of the equipment. Based on this, in actual use, the adhesive cloth 721 can be placed as close as possible to the upper surface of the diamond substrate, thereby reducing the chip blowing unit 71 from passing the chips through the gap between the adhesive cloth 721 and the diamond substrate, thus reducing the diffusion of chips and improving the processing quality of the finished chip.

[0064] As Figures 1 to 3 shown, a diamond substrate cutting method, the method comprising the following steps:

[0065] S1: after placing the diamond substrate to be cut on the vacuum chuck 51, the controller controls the positioning motor 57 to drive the first gear 56 to rotate through an electrical signal, and then the first gear 56 drives the driving groove disc 54 to rotate through meshing with the first gear ring 55, and then the arc-shaped groove provided on the driving groove disc 54 simultaneously extrudes the lower end of the positioning rod 52, and then the sliding part 521 at the lower end of the positioning rod 52 moves stably along the guide groove 53, and then the upper end of the positioning rod 52 is driven to move along the waist-shaped groove on the vacuum chuck 51, and then the upper end of the positioning rod 52 pushes the diamond substrate placed on the vacuum chuck 51 to the center position of the vacuum chuck 51, and when the torque detected by the torque sensor provided between the output shaft of the positioning motor 57 and the first gear 56 exceeds the threshold value, the controller controls the positioning motor 57 to stop and the electromagnetic brake;

[0066] S2: the controller controls the vacuum chuck 51 covering the diamond substrate to open through an electrical signal, and then the vacuum cavity 510 covering the diamond substrate is fixed by negative pressure adsorption;

[0067] S3: then the controller controls the height adjusting component 3 to adjust the vertical height of the cutting blade 21 through an electrical signal;

[0068] S4: then the controller controls the cutting motor 22 to rotate while controlling the feeding component 4 to drive the cutting blade 21 to cut the diamond substrate below;

[0069] S5: after the cutting is completed, the feeding component 4 stops, and the controller controls the rotating component 6 to drive the diamond substrate on the mounting component 5 to rotate through an electrical signal, and then rotates to the next cutting position;

[0070] S6: repeating the above S4 and S5 operations can realize cutting all required cutting positions on the diamond substrate.

[0071] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the above specific embodiments, and the above specific embodiments are only illustrative and not restrictive, and those skilled in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, which are all within the protection of the present application.

Claims

1. A diamond substrate cutting apparatus, characterised in that: The utility model provides a cutting device for diamond substrate, including mounting frame (1), cutting part (2), height adjustment part (3), feed part (4), installation part (5) and rotation part (6), the mounting frame (1) upper end is provided for carrying the feed part (4) of height adjustment part (3) lateral movement, height adjustment part (3) is used for carrying cutting part (2) and goes up and down movement, cutting part (2) includes cutting blade (21) and cutting motor (22), cutting motor (22) is transversely fixedly connected below height adjustment part (3), and the output shaft end of cutting motor (22) is provided with cutting blade (21), and the below of cutting part (2) is provided for installing and fixing the installation part (5) of the part to be cut, installation part (5) includes vacuum chuck (51), and the inside of vacuum chuck (51) is provided with vacuum cavity (510) of layer after layer sleeve ring, and each vacuum cavity (510) is individually connected control valve control vacuumizing, and the below of installation part (5) is provided for carrying the rotation of rotation part (6) of installation part (5), and rotation part (6) is connected on the mounting frame (1), The diamond substrate cutting device further comprises a cleaning part (7); the cleaning part (7) comprises a scrap blowing unit (71) and a scrap collecting unit (72); the scrap blowing unit (71) is arranged on one side of the cutting blade (21); the scrap collecting unit (72) is arranged on the other side of the cutting blade (21); The installation part (5) further comprises a positioning mechanism; the positioning mechanism comprises a positioning rod (52), a guide groove (53), a driving groove disc (54), a first gear ring (55), a first gear (56) and a positioning motor (57); a group of waist-shaped grooves are uniformly and spaced apart in a radial direction on the vacuum chuck (51); the guide groove (53) is arranged below the vacuum chuck (51) and corresponds to the positions of the waist-shaped grooves; the positioning rod (52) has an upper end extending out of the waist-shaped grooves, and a lower end of the positioning rod (52) is provided with a sliding part (521); the sliding part (521) is slidingly connected in the guide groove (53); the lower end of the positioning rod (52) is inserted into an arc-shaped groove on the driving groove disc (54); the driving groove disc (54) is rotationally connected to a fixed column (511) below the vacuum chuck (51); the first gear ring (55) is fixedly connected below the driving groove disc (54); the first gear (56) engaged with the first gear ring (55) is connected to an output shaft of the positioning motor (57); and the positioning motor (57) is fixedly connected to a fixed plate (512) fixedly connected with the fixed column (511). The chip collecting unit (72) comprises a sticky cloth (721), a conveying roller (722), a conveying motor (723), a scraping box (724), a cleaning tank (725) and a air-drying nozzle (726); the sticky cloth (721) is provided with a silicon-based pressure-sensitive adhesive; the sticky cloth (721) is supported and driven by the plurality of conveying rollers (722); one of the conveying rollers (722) is driven to rotate by the conveying motor (723); the sticky cloth (721) close to the cutting blade (21) is arranged obliquely; the moving direction of the sticky cloth (721) sequentially passes through the scraping box (724), the cleaning tank (725) and the air-drying nozzle (726); one side of the scraping box (724) is in contact with the sticky cloth (721); the sticky cloth (721) needs to be immersed in the cleaning tank (725); The cleaning tank (725) is cleaned by ultrasonic waves; the air-drying nozzle (726) is used for continuously blowing and drying the cleaned sticky cloth (721); The sticky cloth (721) close to the cutting blade (21) is supported and connected by a buffer frame; the buffer frame support comprises a swing rod (727), a rotating rod and an elastic member (728); one end of the swing rod (727) is hinged to a mounting support plate for mounting the conveying roller (722); the elastic member (728) is arranged between one end of the swing rod (727) and the mounting support plate; the other end of the swing rod (727) is rotatably connected to the rotating rod; the sticky cloth (721) passes around the rotating rod.

2. A diamond substrate cutting apparatus according to claim 1, wherein: The upper surface of the vacuum chuck (51) is inclined by 0.5-1° relative to the cutting blade (21).

3. A diamond substrate cutting apparatus according to claim 1, wherein: The upper end of the positioning rod (52) is provided as a stepped shaft; a threaded hole is arranged on the upper end face of the positioning rod (52); a positioning sleeve (522) is sleeved on the stepped shaft; a V-shaped groove (5221) is arranged on one side of the positioning sleeve (522); a gasket (523) is arranged above the positioning sleeve (522); the gasket (523) is penetrated by a screw (524), and the screw (524) is connected in the threaded hole in the upper end face of the positioning rod (52).

4. A diamond substrate cutting apparatus according to claim 1, wherein: The chip blowing unit (71) blows air to the cutting edge at the lowest part of the cutting blade (21) through high-pressure airflow; the chip collecting unit (72) is used for collecting the chips blown by the chip blowing unit (71).

5. A diamond substrate cutting apparatus according to claim 4, wherein: A dust suction cover (73) is arranged on the cutting blade (21); the lower end of the dust suction cover (73) is a semi-enclosed structure cover arranged on the cutting blade (21); the upper end of the dust suction cover (73) is communicated with a suction pump.

6. A diamond substrate cutting apparatus according to claim 5, wherein: The angle between the air outlet direction of the chip blowing unit (71) and the cutting blade (21) is 45-80°.

7. A method of cutting a diamond substrate, suitable for use with the apparatus of any one of claims 1-6, wherein: The method comprises the following steps: S1: After placing the diamond substrate to be cut on the vacuum chuck (51), the controller controls the positioning motor (57) to drive the first gear (56) to rotate through an electrical signal, and then the first gear (56) drives the driving groove disc (54) to rotate by engaging the first gear ring (55), and then the arc-shaped groove provided on the driving groove disc (54) simultaneously extrudes the lower end of the positioning rod (52), and then the sliding part (521) at the lower end of the positioning rod (52) moves stably along the guide groove (53), and then the upper end of the positioning rod (52) is driven to move along the waist-shaped groove on the vacuum chuck (51), and then the upper end of the positioning rod (52) pushes the diamond substrate placed on the vacuum chuck (51) to the center position of the vacuum chuck (51), and when the torque detected by the torque sensor provided between the output shaft of the positioning motor (57) and the first gear (56) exceeds the threshold value, the controller controls the positioning motor (57) to stop and the electromagnetic brake; S2: The controller controls the valve of the vacuum chuck (51) covering the diamond substrate to open through an electrical signal, and then the vacuum cavity (510) covering the diamond substrate is fixed by negative pressure adsorption; S3: Then the controller controls the height adjusting component (3) to adjust the vertical height of the cutting blade (21) through an electrical signal; S4: Then the controller controls the cutting motor (22) to rotate while controlling the feeding component (4) to drive the cutting blade (21) to cut the diamond substrate below; S5: After the cutting is completed, the feeding component (4) stops, and the controller controls the rotating component (6) to drive the diamond substrate on the mounting component (5) to rotate through an electrical signal, and then rotate to the next cutting position; S6: Repeat the above S4 and S5 operations to cut all the required cutting positions on the diamond substrate.

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