Three-dimensional micro-nano optical element preparation system and method and related equipment

Abstract

The embodiment of the invention relates to the technical field of micro-nano manufacturing, and discloses a three-dimensional micro-nano optical element preparation system and method and related equipment.The system comprises a data control and processing end, a light field generation and modulation device, a sample platform and an online monitor, and the online monitor measures the morphology size of a first micro-nano optical element obtained through preliminary preparation; the data control and processing end determines whether to correct the first micro-nano optical element according to a deviation value between the second three-dimensional structure data and the first three-dimensional structure data, and if yes, correction data is acquired from a preset correction database according to the deviation value; and the light field generation and modulation device adjusts the light field according to the correction data so as to correct the first micro-nano optical element based on the adjusted light field. Through the mode, the closed-loop preparation process provided by the embodiment of the invention can eliminate the deviation of the morphology size, and realizes the nanoscale morphology control precision and uniformity, thereby improving the consistency and yield of finished products.

Description

Technical Field

[0001] This invention relates to the field of micro-nano manufacturing technology, specifically to a three-dimensional micro-nano optical element fabrication system, method, and related equipment. Background Technology

[0002] With the rapid development of technologies such as AR displays, superlenses, and smart sensors, the market demand for three-dimensional micro-nano optical components is experiencing explosive growth. Traditional technologies use two-dimensional photolithography to manufacture three-dimensional micro-nano optical components, but this can only generate two-dimensional structures and cannot directly create three-dimensional morphologies with continuous curved surfaces or stepped structures. Grayscale photolithography, by modulating the exposure dosage, can form three-dimensional structures from photoresist in a single exposure, demonstrating enormous potential in the manufacture of micro-nano optical components.

[0003] However, existing grayscale lithography technology faces severe challenges in pursuing higher precision and uniformity, and its main drawbacks include: 1. Due to the nonlinear response of photoresist to exposure dose and the slight fluctuations in the energy distribution of the light field, the actual structure depth deviates from the expected value, resulting in poor uniformity of the fabricated micro-nano optical components, which is especially noticeable when processing large areas. 2. At the micro-nano scale, light diffraction and scattering can cause blurring of structural edges and loss of details, destroying the intended three-dimensional morphology, resulting in low morphology fidelity and affecting the performance of optical components. 3. The existing manufacturing of micro-nano optical components is an open-loop process that includes design, manufacturing, and testing. If the finished product is unqualified, the process parameters need to be readjusted and the design, manufacturing, and testing need to be re-executed. The process is cumbersome and has poor controllability, and the consistency of the finished product needs to be improved. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention provide a three-dimensional micro / nano optical element fabrication system, method and related equipment to solve the problems existing in the prior art.

[0005] According to one aspect of the present invention, a three-dimensional micro / nano optical element fabrication system is provided, the three-dimensional micro / nano optical element fabrication system comprising a data control and processing terminal, a light field generator and modulator, a sample platform and an online monitoring instrument; The data control and processing terminal is used to encode the three-dimensional structural data of the target micro-nano optical element into grayscale information, and input the grayscale information into the light field generator and modulator. The light field generator and modulator is used to generate a mask pattern and a light field based on the grayscale information, so as to project the mask pattern onto the photoresist plane of the sample platform through the light field; The data control and processing terminal is also used to control the sample platform according to the three-dimensional structure data, so that the photoresist on the sample platform is exposed and developed according to the mask pattern and the light field, so as to initially prepare the first micro-nano optical element. The online monitoring instrument is used to non-contactly measure the morphology and size of the first micro-nano optical element and feed back the measured second three-dimensional structural data to the data control and processing terminal. The data control and processing terminal is also used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data. If so, it retrieves correction data from a preset correction database based on the deviation value and sends the correction data to the light field generator and modulator. The light field generator and modulator is further configured to adjust the light field according to the correction data, so as to perform a second exposure on the first micro-nano optical element based on the adjusted light field to obtain the second micro-nano optical element.

[0006] In an optional manner, the online monitoring instrument is also used to measure the morphology and size of the second micro-nano optical element and feed back the measured third three-dimensional structural data to the data control and processing terminal; The data control and processing terminal is also used to determine whether the deviation value between the third three-dimensional structural data and the first three-dimensional structural data is zero. If the deviation value is zero, the correction is successful, and the correction result corresponding to the correction data is fed back to the correction database.

[0007] In one alternative embodiment, the data control and processing terminal is further configured to perform a correction again and feed the correction result back to the correction database if the deviation value is not zero.

[0008] In one alternative approach, the correction data includes linewidth deviation and exposure time and light field intensity associated with the linewidth deviation; The data control and processing terminal is specifically used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data. If so, the linewidth deviation is determined based on the deviation value, the correlation data of exposure time and light field intensity corresponding to the linewidth deviation is obtained from the correction database, and the correlation data is sent to the light field generator and modulator. The light field generator and modulator is specifically used to adjust the light field according to the exposure time and the light field intensity, so as to correct the first micro-nano optical element based on the adjusted light field and obtain the second micro-nano optical element.

[0009] In one optional approach, the data control and processing terminal is further configured to collect multiple successfully corrected correction data samples, train a preset machine learning model based on the correction data samples to learn the optimal nonlinear mapping relationship between the linewidth deviation, the light field intensity, and the exposure time, and obtain new correction data based on the trained machine learning model to optimize and expand the correction database.

[0010] In one optional embodiment, the data control and processing terminal is specifically used to encode the first three-dimensional structural data of the preset micro-nano optical element into grayscale information, compensate the grayscale information based on the preset compensation database, perform optical proximity effect correction on the compensated grayscale information to obtain the corrected grayscale information, and input the corrected grayscale information into the light field generator and modulator and send it to the sample platform.

[0011] In one optional embodiment, the three-dimensional micro / nano optical element fabrication system further includes an optical performance measuring instrument for measuring the optical performance parameters of the first micro / nano optical element and / or the second micro / nano optical element, and sending the optical performance parameters to the data control and processing terminal. The data control and processing terminal is also used to determine whether the optical performance parameters are the same as the expected optical performance parameters of the target micro / nano optical element. If they are the same, a success signal is generated to execute subsequent process flows.

[0012] According to another aspect of the present invention, a method for fabricating three-dimensional micro / nano optical elements is provided. This method is performed based on the aforementioned three-dimensional micro / nano optical element fabrication system, and the method includes: A substrate is prepared on the sample platform, and photoresist is spin-coated onto the substrate. Acquire the first three-dimensional structural data of the target micro / nano optical element, and encode the first three-dimensional structural data into grayscale information; A mask pattern and a light field are generated based on the grayscale information, so that the mask pattern is projected onto the photoresist plane through the light field; The sample platform is moved according to the first three-dimensional structural data, so that the photoresist on the sample platform is exposed and developed according to the mask pattern and the light field, so as to initially prepare the first micro-nano optical element. The topography and dimensions of the first micro / nano optical element are measured non-contactly to obtain the second three-dimensional structural data; Whether to correct the first micro-nano optical element is determined based on the deviation value between the second three-dimensional structural data and the first three-dimensional structural data. If so, correction data is obtained from the preset correction database. The light field is adjusted according to the correction data, and the first micro-nano optical element is subjected to a second exposure based on the adjusted light field to obtain the second micro-nano optical element.

[0013] According to another aspect of the present invention, a computer device is provided, comprising: a processor, a memory, a communication interface, and a communication bus, wherein the processor, the memory, and the communication interface communicate with each other through the communication bus; the memory is used to store at least one executable instruction, wherein the executable instruction causes the processor to perform the operations performed by the data control and processing terminal as described above.

[0014] According to another aspect of the present invention, a computer-readable storage medium is provided, the storage medium storing at least one executable instruction, which, when executed on a computer device, causes the computer device to perform the operations performed by the data control and processing terminal as described above.

[0015] The three-dimensional micro / nano optical element fabrication system of this embodiment integrates grayscale lithography, online monitoring, and feedback correction to construct an intelligent closed-loop fabrication process for three-dimensional micro / nano optical elements. By measuring the morphology and size of the first micro / nano optical element through an online monitoring instrument, when the morphology and size do not meet the requirements, it can automatically make decisions and call correction data for correction or reprocessing. Compared with the existing open-loop process, this online, real-time, and automated feedback control and correction mechanism can eliminate deviations in morphology and size, solve the problems of uneven depth and morphology distortion, and especially the edges and details of the three-dimensional micro / nano optical element can be corrected again. The fabrication process is simplified, and nanoscale morphology control precision and uniformity can be achieved, thereby greatly improving the consistency and yield of the finished product.

[0016] The above description is merely an overview of the technical solutions of the embodiments of the present invention. In order to better understand the technical means of the embodiments of the present invention and to implement them in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the embodiments of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description

[0017] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A schematic diagram of an embodiment of the three-dimensional micro / nano optical element fabrication system provided by the present invention is shown; Figure 2 A schematic diagram of another embodiment of the three-dimensional micro / nano optical element fabrication system provided by the present invention is shown; Figure 3A schematic flowchart of the fabrication method for three-dimensional micro / nano optical elements provided in an embodiment of the present invention is shown; Figure 4 A schematic diagram of the structure of a computer device provided in an embodiment of the present invention is shown. Detailed Implementation

[0018] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0019] Figure 1 A schematic diagram of the structure of the three-dimensional micro / nano optical element fabrication system provided in an embodiment of the present invention is shown, as follows: Figure 1 As shown, the three-dimensional micro / nano optical element fabrication system includes a data control and processing terminal, a light field generator and modulator, a sample platform, and an online monitoring instrument. The data control and processing terminal is used to encode the first three-dimensional structural data of the target micro-nano optical element into grayscale information, and input the grayscale information into the light field generator and modulator.

[0020] The first three-dimensional structural data includes length, width, and height distribution data. The height distribution data results in the fabricated micro / nano optical element having a surface with inconsistent heights. The first three-dimensional structural data is encoded as grayscale information, with a grayscale quantization level of 8-16 bits. This grayscale quantization level determines the high precision of the control over the morphology of the micro / nano optical element.

[0021] Before encoding grayscale information, the substrate is fixed on the sample platform, and then photoresist is spin-coated on the substrate. The thickness of the photoresist can range from 0.1μm to 1μm, which can cover the needs from surface microstructures to high aspect ratio structures.

[0022] The light field generator and modulator is used to generate a mask pattern and a light field based on grayscale information, so as to project the mask pattern onto the photoresist plane of the sample platform through the light field.

[0023] Preferably, the light field generator and modulator is a digital micromirror device (DMD) or a spatial light modulator (SLM). The light field generator and modulator receives grayscale information, generates a corresponding digital mask pattern, and dynamically modulates the illumination light field to form a light field with the desired light intensity distribution.

[0024] In this embodiment, the light field generator and modulator can use a light source with a wavelength in the ultraviolet band. To ensure consistent exposure metering, the light source power of the light field generator and modulator is constant, resulting in a power stability within ±1%. The resolution of the light field generator and modulator can be selected as 2K (1920x1080) or 4K (3840x2160), depending on the complexity of the mask pattern. The pixel size can be 1μm-5μm, which, together with the objective lens, determines the system's maximum resolution. The refresh rate can be greater than 1kHz, enabling the light field generator and modulator to perform high-speed dynamic exposure and dose modulation.

[0025] In order to enable the light field generator and modulator to project the mask pattern onto the photoresist plane with high precision through the modulated light field, the projection objective of the light field generator and modulator in this embodiment can have a reduction ratio of 5X-20X, a numerical aperture (NA) of 0.1-0.4, a limiting resolution of 0.5μm-2μm, and an image field size determined by the single exposure area, which can be greater than or equal to 10mm*10mm.

[0026] The data control and processing terminal is also used to control the movement of the sample platform according to the first three-dimensional structural data, so that the photoresist set on the sample platform is exposed and developed according to the mask pattern and light field, so as to initially prepare the first micro-nano optical element.

[0027] The online monitoring instrument is used to non-contactly measure the morphology and dimensions of the first micro-nano optical element and feeds back the measured second three-dimensional structural data to the data control and processing terminal.

[0028] In this embodiment, the online monitoring instrument can non-contactly measure the morphology and size of the first micro / nano optical element through white light interferometry or confocal chromatography. In order to accurately measure the morphology and size, the vertical resolution of the online monitoring instrument can be less than 0.1 nm, the lateral resolution can be less than 0.1 μm, and the measurement speed can be a single point / line scan greater than 10 kHz to achieve rapid measurement.

[0029] The data control and processing terminal is also used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structural data and the first three-dimensional structural data. If so, it retrieves correction data from a preset correction database based on the deviation value and sends the correction data to the light field generator and modulator.

[0030] If the deviation between the second and first three-dimensional structural data is not zero, indicating a discrepancy between them, and the morphology and dimensions of the first micro / nano optical element do not match those of the target micro / nano optical element, then the first micro / nano optical element needs to be corrected. If the deviation between the second and first three-dimensional structural data is zero, it means that the morphology of the first micro / nano optical element obtained from this exposure and development is basically consistent with that of the target micro / nano optical element, and subsequent processes can continue. It is worth noting that a very small deviation between the second and first three-dimensional structural data, close to zero, can also be considered as a zero deviation.

[0031] The correction database stores correction data, which consists of historically successfully corrected data. This data is empirical and can be continuously expanded and optimized through automatic machine learning.

[0032] The light field generator and modulator are also used to adjust the light field according to the correction data, so as to perform a second exposure on the first micro-nano optical element based on the adjusted light field to obtain the second micro-nano optical element.

[0033] In this embodiment, the light field generator and modulator adjusts the light field according to the correction data. Adjusting the light field can involve adjusting the intensity of the light field and / or the exposure time. If the topographic size of the first micro / nano optical element does not reach the topographic size of the target micro / nano optical element, the intensity of the light field and / or the exposure time can be determined based on the deviation value, the light field can be adjusted, and the first micro / nano optical element can be corrected based on the adjusted light field.

[0034] The three-dimensional micro / nano optical element fabrication system of this embodiment integrates grayscale lithography, online monitoring, and feedback correction to construct an intelligent closed-loop fabrication process for three-dimensional micro / nano optical elements. By measuring the morphology and size of the first micro / nano optical element through an online monitoring instrument, when the morphology and size do not meet the requirements, it can automatically make decisions and call correction data for correction or reprocessing. Compared with the existing open-loop process, this online, real-time, and automated feedback control and correction mechanism can eliminate deviations in morphology and size, solve the problems of uneven depth and morphology distortion, and especially the edges and details of the three-dimensional micro / nano optical element can be corrected again. The fabrication process is simplified, and nanoscale morphology control precision and uniformity can be achieved, thereby greatly improving the consistency and yield of the finished product.

[0035] Furthermore, the online monitoring instrument is also used to measure the morphology and size of the second micro-nano optical element and to feed back the measured third three-dimensional structural data to the data control and processing terminal. The data control and processing terminal is also used to determine whether the deviation between the third three-dimensional structural data and the first three-dimensional structural data is zero. If the deviation is zero, the correction is successful and the correction result corresponding to the correction data is fed back to the correction database.

[0036] In this embodiment, the online monitoring instrument measures the morphology and size of the corrected second micro-nano optical element. If the deviation between the morphology and size of the second micro-nano optical element and the morphology and size of the target micro-nano optical element is zero, it indicates that the correction is successful and the correction data used is the optimal correction data, which can achieve the expected result with one correction. Therefore, the correction result corresponding to the correction data will be fed back to the correction database, and the correction result will be a successful correction. The correction database can associate the correction data with the corresponding number of successful corrections to distinguish and retain high-quality correction data and delete low-quality correction data from the correction database, thereby optimizing the correction database.

[0037] The data control and processing terminal is also used to perform a second correction if the deviation value is not zero, and then feed the correction result back to the correction database. The second correction is basically the same as the first correction, and the correction result is fed back to the database. The purpose is to identify the correction data that failed the first correction, thereby optimizing the correction data in the correction database.

[0038] It is worth noting that when the deviation between the third-dimensional structural data and the first-dimensional structural data is very small, close to zero, it can also be considered that the deviation between the two is zero.

[0039] Furthermore, the correction data includes linewidth deviation and exposure time and light field intensity associated with the linewidth deviation; The data control and processing terminal is specifically used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data. If so, the linewidth deviation is determined based on the deviation value, the correlation data of exposure time and light field intensity corresponding to the linewidth deviation is obtained from the correction database, and the correlation data is sent to the light field generator and modulator. The light field generator and modulator is specifically used to adjust the light field according to the light field intensity and the exposure time, so as to correct the first micro-nano optical element based on the adjusted light field to obtain the second micro-nano optical element.

[0040] Preferably, this embodiment employs interferometric exposure, where two or more coherent light waves are superimposed in space to form interference fringes. When two coherent light waves with the same frequency, consistent vibration direction, and constant phase difference meet, they form stable alternating bright and dark fringes. The exposure amounts at the center and sides of the dark fringes differ, while the light intensity reaches its maximum at the bright fringes. Linewidth, the width of the spectral power distribution, is the most direct measurement method in interferometric exposure. The deviation value can determine the corresponding linewidth deviation. The correction database converts the linewidth deviation into the corresponding exposure time and light field intensity, and links these key process parameters—linewidth deviation, exposure time, and light field intensity—to make the correction process no longer blind trial and error. The data control and processing end determines the linewidth deviation that needs adjustment based on the deviation in morphology and size, and then automatically calls upon verified or empirically determined combinations of light field intensity and exposure time to change the exposure dose, thereby correcting the first micro / nano optical element. This makes the correction operation more scientifically based and improves correction efficiency and reliability.

[0041] In one embodiment, the data control and processing terminal is also used to collect multiple successfully corrected correction data samples, train a preset machine learning model based on the correction data samples to learn the optimal nonlinear mapping relationship between linewidth deviation and exposure time and light field intensity, and obtain new correction data based on the trained machine learning model to optimize and expand the correction database.

[0042] To improve the completeness and intelligence of the correction database, this embodiment uses a machine learning algorithm to automatically optimize and expand the correction data by continuously learning from each successful correction case. Based on the new morphology and size deviation values, it predicts the optimal process parameters for linewidth deviation, exposure time, and light field intensity.

[0043] The machine learning model in this embodiment can employ a reinforcement learning model, which treats each successful correction as a rewarding positive action, allowing the model to autonomously learn how to select the optimal process parameters based on the current topographic size deviation value, thereby dynamically optimizing the correction data. In other embodiments, deep neural networks (DNNs) or convolutional neural networks (CNNs) can also be used. These networks extract topographic size features and learn a complex nonlinear mapping from these features to the optimal process parameters. Then, the data control and processing end can utilize the trained deep neural network or convolutional neural network to quickly predict one or more candidate process parameters based on the topographic deviation value measured by the online monitoring instrument. Finally, optimization algorithms such as genetic algorithms can be invoked to perform a fine search in the neighborhood of these candidate solutions to obtain the optimal correction data.

[0044] Furthermore, the data control and processing terminal is specifically used to encode the first three-dimensional structural data of the preset micro-nano optical element into grayscale information, compensate the grayscale information based on the preset compensation database, correct the optical proximity effect on the compensated grayscale information to obtain the corrected grayscale information, and input the corrected grayscale information into the light field generator and modulator and send it to the sample platform.

[0045] In the initial data encoding stage, the data control and processing end uses a compensation database to compensate for grayscale information and further corrects it using optical proximity correction (OPC), which is a type of feedforward control. Optical proximity correction technology is mainly used in the semiconductor manufacturing field, such as in semiconductor integrated circuit manufacturing and microelectronic device manufacturing. In this embodiment, it is applied to the fabrication of three-dimensional micro / nano optical elements to solve the problem of deviation between the actual pattern and the mask pattern. Specifically, in micro / nano lithography, due to light diffraction, resist effects, etc., the actual pattern will always deviate from the design pattern (i.e., proximity effect). In this embodiment, the pattern data is pre-distorted and corrected before exposure, and then combined with subsequent online monitoring and feedback correction to form a composite control strategy of feedforward and feedback, so that the final fabricated micro / nano optical element can more effectively approximate the target micro / nano optical element.

[0046] In one embodiment, the three-dimensional micro / nano optical element fabrication system further includes a second light field generator and modulator for point exposure of the first micro / nano optical element and / or the second micro / nano optical element based on a femtosecond laser.

[0047] The second light field generator and modulator utilizes femtosecond lasers to achieve high-precision three-dimensional pinpoint exposure at micro- and nano-scale dimensions. This wavelength of light is transparent to most photoresist materials, allowing it to penetrate deep into the material without absorption. By controlling the laser focus position in three-dimensional space, the second light field generator and modulator can achieve true three-dimensional direct writing, creating complex three-dimensional structures such as suspended or hollow structures. In one embodiment, the second light field generator and modulator can be a TPP printhead.

[0048] In one embodiment, such as Figure 2 As shown, the three-dimensional micro / nano optical element fabrication system also includes an optical performance measuring instrument, used to measure the optical performance parameters of the first micro / nano optical element and / or the second micro / nano optical element, and send the optical performance parameters to the data control and processing terminal; The data control and processing terminal is also used to determine whether the optical performance parameters are the same as the expected optical performance parameters of the target micro / nano optical element. If they are the same, a success signal is generated to execute subsequent process flows.

[0049] In this embodiment, the optical performance parameters of the first and / or second micro / nano optical elements can be measured using an optical performance measuring instrument. These parameters include, but are not limited to, transmittance, wavefront aberration, and focal length. The measured parameters are then compared with the expected optical performance parameters of the target micro / nano optical element. If the optical performance parameters are the same, the next process can be executed; if there is a significant difference, correction or re-fabrication is required. It is worth noting that in this embodiment, in addition to the optical performance parameters being the same, if the difference between the two is small and within a set range, they can also be considered to have the same optical performance parameters. This embodiment enables closed-loop control from formal resemblance to intrinsic similarity, thereby improving the quality of the fabricated micro / nano optical elements.

[0050] It is worth noting that the aforementioned optical performance measuring instrument can be a standalone instrument or integrated into the aforementioned online monitoring instrument to achieve online monitoring of the fabricated micro-nano optical components; no limitation is made here.

[0051] Figure 3 A flowchart of a method for fabricating three-dimensional micro / nano optical elements according to an embodiment of the present invention is shown. This method is performed based on the aforementioned three-dimensional micro / nano optical element fabrication system. Figure 3 As shown, the method includes the following steps: S10, Prepare a substrate on the sample platform and spin-coat photoresist onto the substrate; S20, acquire the first three-dimensional structural data of the target micro-nano optical element, and encode the first three-dimensional structural data into grayscale information; S30, generate a mask pattern and a light field based on the grayscale information, so as to project the mask pattern onto the photoresist plane through the light field; S40, the sample platform is moved according to the first three-dimensional structural data, so that the photoresist on the sample platform is exposed and developed according to the mask pattern and the light field, so as to initially prepare the first micro-nano optical element. S50, non-contact measurement of the topography and dimensions of the first micro / nano optical element to obtain second three-dimensional structural data; S60, determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data; if so, obtain correction data from the preset correction database. S70, the light field is adjusted according to the correction data, and the first micro-nano optical element is corrected based on the adjusted light field to obtain the second micro-nano optical element.

[0052] The embodiment of the three-dimensional micro / nano optical element fabrication method in this example is basically the same as the embodiment of the three-dimensional micro / nano optical element fabrication system described above, and the above embodiments can be referred to.

[0053] The three-dimensional micro / nano optical element fabrication method of this embodiment integrates grayscale lithography, online monitoring, and feedback correction to construct an intelligent closed-loop fabrication process for three-dimensional micro / nano optical elements. By measuring the morphology and size of the first micro / nano optical element through an online monitoring instrument, when the morphology and size do not meet the requirements, it can automatically make decisions and call correction data for correction or reprocessing. Compared with the existing open-loop process, this online, real-time, and automated feedback control and correction mechanism can eliminate deviations in morphology and size, solve the problems of uneven depth and morphology distortion, and especially the edges and details of the three-dimensional micro / nano optical element can be corrected again. The fabrication process is simplified, and nanometer-level morphology control precision and uniformity can be achieved, thereby greatly improving the consistency and yield of the finished product.

[0054] Figure 4 The diagram shows a structural schematic of an embodiment of the computer device of the present invention. The specific embodiments of the present invention do not limit the specific implementation of the computer device.

[0055] like Figure 4 As shown, the computer device may include: a processor 402, a communications interface 404, a memory 406, and a communications bus 408.

[0056] The processor 402, communication interface 404, and memory 406 communicate with each other via communication bus 408. Communication interface 404 is used to communicate with other computer devices, such as clients or other server network elements. The processor 402 executes program 410, specifically performing the relevant steps described above in the computer device embodiment.

[0057] Specifically, program 410 may include program code, which includes computer-executable instructions.

[0058] Processor 402 may be a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present invention. The computer device includes one or more processors, which may be processors of the same type, such as one or more CPUs; or processors of different types, such as one or more CPUs and one or more ASICs.

[0059] Memory 406 is used to store program 410. Memory 406 may include high-speed RAM memory, and may also include non-volatile memory, such as at least one disk storage device.

[0060] Specifically, program 410 can be called by processor 402 to enable the computer device to perform the operations performed by the above data control and processing terminal.

[0061] This embodiment integrates grayscale lithography, online monitoring, and feedback correction to construct an intelligent closed-loop fabrication process for three-dimensional micro / nano optical components. The morphology and dimensions of the first micro / nano optical component are measured by an online monitoring instrument. If the morphology and dimensions do not meet requirements, the system can automatically make decisions and call upon correction data for correction or reprocessing. Compared to existing open-loop processes, this online, real-time, and automated feedback control and correction mechanism can eliminate morphology and dimensional deviations, solve problems of depth inhomogeneity and morphology distortion, and especially allow for further correction of the edges and details of the three-dimensional micro / nano optical component. The fabrication process is simplified, and nanometer-level morphology control precision and uniformity are achieved, thereby significantly improving the consistency and yield of the finished product.

[0062] This invention provides a computer-readable storage medium storing at least one executable instruction that, when executed on a computer device, causes the computer device to perform the operations performed by the aforementioned data control and processing terminal.

[0063] This invention provides a computer program that can be called by a processor to enable a computer device to perform the operations performed by the aforementioned data control and processing terminal.

[0064] This invention provides a computer program product, which includes a computer program stored on a computer-readable storage medium. The computer program includes program instructions, which, when executed on a computer, cause the computer to perform the operations performed by the aforementioned data control and processing terminal.

[0065] The algorithms or displays provided herein are not inherently related to any particular computer, virtual system, or other device. Various general-purpose systems can also be used in conjunction with the teachings herein. The required structure for constructing such systems is apparent from the above description. Furthermore, the embodiments of the present invention are not directed to any particular programming language. It should be understood that the content of the invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing the best mode of implementation of the invention.

[0066] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0067] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the embodiments of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the above description of exemplary embodiments of the invention. However, this disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim.

[0068] Those skilled in the art will understand that modules in the computer device of the embodiments can be adaptively modified and placed in one or more computer devices different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or computer device so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0069] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be construed as limiting the order of execution.

Claims

1. A three-dimensional micro / nano optical element fabrication system, characterized in that, The three-dimensional micro-nano optical element fabrication system includes a data control and processing terminal, a light field generator and modulator, a sample platform, and an online monitoring instrument. The data control and processing terminal is used to encode the first three-dimensional structural data of the target micro-nano optical element into grayscale information, and input the grayscale information into the light field generator and modulator. The light field generator and modulator is used to generate a mask pattern and a light field based on the grayscale information, so as to project the mask pattern onto the photoresist plane of the sample platform through the light field; The data control and processing terminal is also used to control the movement of the sample platform according to the first three-dimensional structure data, so that the photoresist on the sample platform is exposed and developed according to the mask pattern and the light field, so as to initially prepare the first micro-nano optical element. The online monitoring instrument is used to non-contactly measure the morphology and size of the first micro-nano optical element and feed back the measured second three-dimensional structural data to the data control and processing terminal. The data control and processing terminal is also used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data. If so, it retrieves correction data from a preset correction database based on the deviation value and sends the correction data to the light field generator and modulator. The light field generator and modulator is further configured to adjust the light field according to the correction data, so as to perform a second exposure on the first micro-nano optical element based on the adjusted light field to obtain the second micro-nano optical element.

2. The system according to claim 1, characterized in that, The online monitoring instrument is also used to measure the shape and size of the second micro-nano optical element and feed back the measured third three-dimensional structural data to the data control and processing terminal. The data control and processing terminal is also used to determine whether the deviation value between the third three-dimensional structural data and the first three-dimensional structural data is zero. If the deviation value is zero, the correction is successful, and the correction result corresponding to the correction data is fed back to the correction database.

3. The system according to claim 2, characterized in that, The data control and processing terminal is also used to perform correction again and feed back the correction result to the correction database if the deviation value is not zero.

4. The system according to claim 1 or 2, characterized in that, The correction data includes linewidth deviation and exposure time and light field intensity associated with the linewidth deviation; The data control and processing terminal is specifically used to determine whether to correct the first micro-nano optical element based on the deviation value between the second three-dimensional structure data and the first three-dimensional structure data. If so, the linewidth deviation is determined based on the deviation value, the correlation data of exposure time and light field intensity corresponding to the linewidth deviation is obtained from the correction database, and the correlation data is sent to the light field generator and modulator. The light field generator and modulator is specifically used to adjust the light field according to the exposure time and the light field intensity, so as to perform a second exposure on the first micro-nano optical element based on the adjusted light field to obtain the second micro-nano optical element.

5. The system according to claim 4, characterized in that, The data control and processing terminal is also used to collect multiple successfully corrected correction data samples, train a preset machine learning model based on the correction data samples to learn the optimal nonlinear mapping relationship between the linewidth deviation, the light field intensity, and the exposure time, and obtain new correction data based on the trained machine learning model to optimize and expand the correction database.

6. The system according to claim 1, characterized in that, The data control and processing terminal is specifically used to encode the first three-dimensional structural data of the preset micro-nano optical element into grayscale information, compensate the grayscale information based on the preset compensation database, correct the optical proximity effect of the compensated grayscale information to obtain the corrected grayscale information, and input the corrected grayscale information into the light field generator and modulator and send it to the sample platform.

7. The system according to claim 1, characterized in that, The three-dimensional micro / nano optical element fabrication system also includes an optical performance measuring instrument, used to measure the optical performance parameters of the first micro / nano optical element and / or the second micro / nano optical element, and send the optical performance parameters to the data control and processing terminal; The data control and processing terminal is also used to determine whether the optical performance parameters are the same as the expected optical performance parameters of the target micro / nano optical element. If they are the same, a success signal is generated to execute subsequent process flows.

8. A method for fabricating three-dimensional micro / nano optical elements, characterized in that, The method for fabricating three-dimensional micro / nano optical elements is performed based on the three-dimensional micro / nano optical element fabrication system according to any one of claims 1-7, and the method includes: A substrate is prepared on the sample platform, and photoresist is spin-coated onto the substrate. Acquire the first three-dimensional structural data of the target micro / nano optical element, and encode the first three-dimensional structural data into grayscale information; A mask pattern and a light field are generated based on the grayscale information, so that the mask pattern is projected onto the photoresist plane through the light field; The sample platform is moved according to the first three-dimensional structural data, so that the photoresist on the sample platform is exposed and developed according to the mask pattern and the light field, so as to initially prepare the first micro-nano optical element. The topography and dimensions of the first micro / nano optical element are measured non-contactly to obtain the second three-dimensional structural data; Whether to correct the first micro-nano optical element is determined based on the deviation value between the second three-dimensional structural data and the first three-dimensional structural data. If so, correction data is obtained from the preset correction database. The light field is adjusted according to the correction data, and the first micro-nano optical element is subjected to a second exposure based on the adjusted light field to obtain the second micro-nano optical element.

9. A computer device, characterized in that, include: The processor, memory, communication interface, and communication bus are provided, wherein the processor, memory, and communication interface communicate with each other via the communication bus. The memory is used to store at least one executable instruction that causes the processor to perform the operations performed by the data control and processing terminal as described in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The storage medium stores at least one executable instruction, which, when executed on a computer device, causes the computer device to perform the operations performed by the data control and processing terminal as described in any one of claims 1-7.

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