Display assembly and terminal device
By employing a combined structure of a first substrate, a first adhesive layer, a second substrate, a first light-shielding layer, and a masking adhesive in the display component, step differences are eliminated, the thickness of the adhesive layer is reduced, the problem of excessive thickness in the display component is solved, and both thinness and performance improvement are achieved.
Patent Information
- Application Number
- CN202411188293.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2026-03-13
AI Technical Summary
The thickness of the display components makes it difficult to meet the structural design requirements of terminal devices towards thinner and lighter designs.
The display assembly employs a combination structure consisting of a first substrate, a first adhesive layer, a second substrate, a first light-shielding layer, a first masking adhesive, and a second adhesive layer. The first masking adhesive fills the gap between the second substrate and the first light-shielding layer, eliminating step differences and reducing the thickness of the second adhesive layer, thereby reducing the overall thickness of the display assembly.
This achieved a thinner and lighter display component, reducing the overall thickness and weight, while meeting the requirements for wear resistance, fingerprint resistance, and impact resistance, thus reducing costs.
Smart Images

Figure CN121661906A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of terminal technology, and in particular to a display component and a terminal device. Background Technology
[0002] Display components are an important part of terminal devices such as mobile phones and tablets. However, the thickness of display components makes it difficult to meet the structural design requirements of terminal devices that are moving towards thinner and lighter designs. Summary of the Invention
[0003] In view of this, it is necessary to provide a display component with a thinner profile and a terminal device including the display component to solve the above problems.
[0004] In a first aspect, this application provides a display assembly, including a first substrate, a first adhesive layer, a second substrate, a first light-shielding layer, a first masking adhesive, a second adhesive layer, and a display panel. The first adhesive layer is located between the first substrate and the second substrate, and bonds the first substrate and the second substrate; the first light-shielding layer and the second substrate are located on the surface of the first adhesive layer opposite to the first substrate; the first masking adhesive is located between the second substrate and the first light-shielding layer; the second adhesive layer is located on the surface of the second substrate and the surface of the first masking adhesive opposite to the first substrate, and covers a portion of the first light-shielding layer; the display panel is located on the surface of the second adhesive layer opposite to the first substrate.
[0005] In the above design, the first masking adhesive is filled between the second substrate and the first light-shielding layer, and there is no obvious step difference between the second substrate and the first light-shielding layer. Therefore, the thickness of the second adhesive layer is sufficient to meet the bonding requirements, and there is no need to add extra thickness to compensate for the step difference. That is, compared with related technologies, this embodiment can significantly reduce the thickness of the second adhesive layer, thereby reducing the overall thickness of the display component. In addition, the overall thickness of the first substrate, the first adhesive layer and the second substrate can be reduced relative to the thickness of the cover plate, and the thickness of the second adhesive layer can be reduced relative to the thickness of the adhesive layer, so the overall quality of the display component can also be reduced accordingly.
[0006] In one possible implementation, the second substrate and the first light-shielding layer are flush with the surface opposite to the first substrate.
[0007] In the above design, there is no obvious height difference or protrusion between the second substrate and the surface of the first light-shielding layer away from the first substrate. Therefore, the thickness of the second adhesive layer is sufficient to meet the bonding requirements, and there is no need to add extra thickness to compensate for the step difference. This can significantly reduce the thickness of the second adhesive layer, thereby reducing the overall thickness of the display component.
[0008] In one possible implementation, the total thickness of the first substrate, the first adhesive layer, and the second substrate is d1, and the display component satisfies: 20μm≤d1≤60μm.
[0009] In the above design, the total thickness of the assembly formed by the combination of the first substrate, the first adhesive layer, and the second substrate is less than the thickness of the cover plate in the related technology, which can satisfy the various performance requirements of the cover plate in the related technology, thereby helping to reduce the overall thickness of the display assembly.
[0010] In one possible implementation, the thickness of the second adhesive layer is d2, and the display component satisfies: 3μm≤d2≤35μm.
[0011] In the above design, the thickness of the second adhesive layer is smaller than that of the adhesive layer in the related technology, which helps to reduce the overall thickness of the display component.
[0012] In one possible implementation, the first masking adhesive is formed by curing liquid glue.
[0013] In the above design, during the assembly of the display components, the liquid adhesive can fully fill the gap between the second substrate and the first light-shielding layer. Therefore, the first masking adhesive formed after curing can fully fill the gap between the second substrate and the first light-shielding layer.
[0014] In one possible implementation, the display component further includes a second light-shielding layer and a second masking adhesive; the second substrate has a first through hole, the second light-shielding layer and the second masking adhesive are both located in the first through hole, the second masking adhesive surrounds the second light-shielding layer, the second masking adhesive is located between the second substrate and the second light-shielding layer, and the second substrate surrounds the second masking adhesive.
[0015] In the above design, which is another application scenario of this application, the second masking adhesive is filled between the second substrate and the second light-shielding layer, and there is no obvious step difference between the second substrate and the second light-shielding layer. In this case, the thickness of the second adhesive layer can meet the bonding requirements, and there is no need to add extra thickness to compensate for the step difference. That is, compared with related technologies, this embodiment can significantly reduce the thickness of the second adhesive layer, thereby reducing the overall thickness of the display component.
[0016] In one possible implementation, the second light-shielding layer has a second through hole, the second adhesive layer has a third through hole, the second through hole and the third through hole are interconnected, a portion of the surface of the first adhesive layer is exposed to the second through hole, and a portion of the surface of the second light-shielding layer is exposed to the third through hole.
[0017] In the above design, the area corresponding to the projection of the second through hole is the light-transmitting area of the display component. The third through hole, which is connected to the second through hole, is used for light to pass through the second through hole and the third through hole to realize the function of the lens module.
[0018] In one possible implementation, the display panel has a fourth through hole, which is connected to the third through hole, and the space formed by the second through hole, the third through hole and / or the fourth through hole is used to accommodate the lens module.
[0019] In the above design, the lens module is housed in the space formed by the second through hole, the third through hole and / or the fourth through hole, which can reduce the overall thickness of the terminal device.
[0020] In one possible implementation, the second masking adhesive is formed by curing liquid glue.
[0021] During the assembly of the display components, the liquid adhesive can fully fill the gap between the second substrate and the second light-shielding layer. Therefore, the second masking adhesive formed after curing can fully fill the gap between the second substrate and the second light-shielding layer.
[0022] Secondly, embodiments of this application provide a terminal device, which includes a display component.
[0023] In the above design, the display components are thinner and lighter, which conforms to the structural design of thinner and lighter terminal devices. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the terminal device provided in the embodiment of this application in a hovering state.
[0025] Figure 2 This is a schematic diagram of the terminal device provided in the embodiment of this application in a folded state.
[0026] Figure 3 This is a top view of the display component provided in the embodiment of this application when it is in the unfolded state.
[0027] Figure 4 A cross-sectional schematic diagram of the edge region of a display component provided for the related technology of this application.
[0028] Figure 5 A cross-sectional schematic diagram of the corresponding areas of the display component and lens module provided for the related technology of this application.
[0029] Figure 6 This is a cross-sectional schematic diagram of the edge region of the display component provided in an embodiment of this application.
[0030] Figure 7A This is a cross-sectional schematic diagram showing the first adhesive layer being bonded to the surface of the first substrate, as provided in an embodiment of this application.
[0031] Figure 7B To bond the second substrate to Figure 7A A schematic cross-sectional view of the surface of the first adhesive layer is shown.
[0032] Figure 7C To bond the first light-shielding layer to Figure 7B A schematic cross-sectional view of the surface of the first adhesive layer is shown.
[0033] Figure 7D In order to be in Figure 7C The diagram shows a cross-sectional view of the first masking adhesive formed between the second substrate and the first light-shielding layer.
[0034] Figure 7E In order to be in Figure 7D A schematic cross-sectional view of the second adhesive layer bonded to the surface of the second substrate is shown.
[0035] Figure 8 This is a cross-sectional schematic diagram of the corresponding areas of the display component and lens module provided in the embodiments of this application.
[0036] Explanation of main component symbols
[0037]
[0038] Detailed Implementation
[0039] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. Many specific details are set forth in the following description to provide a thorough understanding of this application; the described embodiments are merely some, not all, of the embodiments described in this application.
[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.
[0041] In the various embodiments of this application, for ease of description and not limitation, the term "connection" used in the patent application specification and claims is not limited to physical or mechanical connections, whether direct or indirect. Terms such as "upper," "lower," "above," "below," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship also changes accordingly.
[0042] Please see Figure 1 and Figure 2 , Figure 1 and Figure 2 These are schematic diagrams showing the terminal device 200 in different states according to embodiments of this application.
[0043] The terminal device 200 includes a display component 100. The terminal device 200 may include, but is not limited to, products with a display component 100 such as mobile phones, tablets, laptops, cameras, and wearable devices. Wearable devices include, but are not limited to, smart bracelets, smartwatches, and smart glasses.
[0044] In this embodiment, the terminal device 200 is an inward-folding screen mobile phone as an example for explanation. Figure 1 The terminal device 200 is in a hovering state. Figure 2 The terminal device 200 is in a folded state. The terminal device 200 includes a first body 201, a second body 202, and a hinge mechanism 203. The hinge mechanism 203 rotatably connects the first body 201 and the second body 202. The angle between the first body 201 and the second body 202 can be changed to enable the foldable screen phone to achieve different states, such as an unfolded state, a hovering state, and a folded state. In other embodiments, when the terminal device 200 is a foldable screen phone, the foldable screen phone can be a tri-fold phone, a quad-fold phone, etc.; in other embodiments, the terminal device 200 can also be a candybar phone.
[0045] In this embodiment, the display component 100 is a foldable screen of the terminal device 200. The foldable screen is used to display images, videos, etc., and its state can change with the state of the terminal device 200. The foldable screen can be an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a microorganic light-emitting diode (MALED) display, a quantum dot light-emitting diode (QLED) display, a liquid crystal display (LCD), etc. In other embodiments, depending on the specific type of the terminal device 200, the display component 100 may not have foldable capabilities, for example, it may be used in a candybar phone, a laptop computer, a smartwatch, etc.
[0046] Please refer to the following: Figure 3 , Figure 3This is a top view of the display component 100 provided in this embodiment when it is in an unfolded state. The display component 100 can be divided into a display area I and a first shielding area II-1. The display area I is used to realize the display function of the foldable screen. In this embodiment, the first shielding area II-1 is located in the edge region of the display component 100 and surrounds the display area I.
[0047] In this embodiment, the terminal device 200 may further include a lens module 35, which is a front-facing camera for an inward-folding screen mobile phone. The lens module 35 is located inside the terminal device 200, and external light needs to pass through the display assembly 100 to realize the functions of the lens module 35, such as shooting, recognition, and scanning. Therefore, the display assembly 100 may further include a light-transmitting area III and a second blocking area II-2, where the light-transmitting area III allows light to pass through, and the second blocking area II-2 surrounds the light-transmitting area III. It is understood that in some other embodiments, when the terminal device 200 does not have a lens module 35, the light-transmitting area III may be omitted.
[0048] Please see Figure 4 , Figure 4 This is a cross-sectional schematic diagram of the edge region of a display assembly 100a provided for the related technology of this application. The display assembly 100a includes a cover plate 11, an ink layer 12, and an adhesive layer 13. The ink layer 12 covers the surface of the edge region of the cover plate 11, and the area corresponding to the projection of the ink layer 12 along the stacking direction of the cover plate 11 and the ink layer 12 is the shielding area of the terminal device 200. The adhesive layer 13 is located on the surface of the cover plate 11 and covers a portion of the ink layer 12. The ink layer 12 has a certain thickness, that is, there is a step difference between the ink layer 12 and the cover plate 11. The adhesive layer 13 is usually thicker, for example, the thickness of the adhesive layer 13 is greater than or equal to 50 μm, to compensate for the step difference between the ink layer 12 and the cover plate 11. If the adhesive layer 13 is too thin, it will be difficult to compensate for the step difference between the ink layer 12 and the cover plate 11. Air bubbles are likely to form between the adhesive layer 13, the ink layer 12, and the cover plate 11, affecting the performance of the display component 100a, such as the display effect. If the thickness of the adhesive layer 13 is increased to compensate for the step difference, the overall thickness of the display component 100a will be too thick, which is not conducive to the thin and light structural design of the display component 100a. It should be noted that, unless otherwise specified, the "thickness" in the relevant technology or embodiments of this application refers to the dimension in the direction of the stacking.
[0049] Please see Figure 5 , Figure 5This is a cross-sectional schematic diagram of the area corresponding to the display component 100a and the lens module 35, provided for some other related technologies of this application. The display component 100a includes a cover plate 11, an adhesive layer 13, and an ink layer 12. The ink layer 12 covers the surface of the cover plate 11 and has a first opening 122. Along the stacking direction, the area corresponding to the projection of the first opening 122 is the light-transmitting area of the terminal device 200. The adhesive layer 13 has a second opening 132 and covers the surface of the cover plate 11. The edge area of the adhesive layer 13 with the second opening 132 covers the edge area of the ink layer 12. The first opening 122 and the second opening 132 are connected. Part of the surface of the cover plate 11 is exposed to the first opening 122 and the second opening 132, and the surface of the ink layer 12 not covered by the adhesive layer 13 is exposed to the second opening 132. The ink layer 12 has a certain thickness, that is, there is a step difference between the ink layer 12 and the cover plate 11. The adhesive layer 13 is usually thicker to compensate for the difference between the ink layer 12 and the cover plate 11. If the adhesive layer 13 is thinner, it will be difficult to compensate for the difference between the ink layer 12 and the cover plate 11. Air bubbles are easily formed between the adhesive layer 13, the ink layer 12 and the cover plate 11, which will affect the performance of the display component 100a. If the thickness of the adhesive layer 13 is increased to compensate for the difference, the overall thickness of the display component 100a will be thicker, which is not conducive to the thinner and lighter structural design of the display component 100a.
[0050] Furthermore, the cover plate 11 in the related technology is located on the outermost side of the display component 100a and needs to combine wear resistance, fingerprint resistance, high strength, excellent impact resistance, thin and light-transmitting design, and excellent light transmission performance. However, the stringent requirements of these performance standards can lead to increased costs (such as R&D costs, production costs, etc.), and a single material cannot fully meet all these high standards. For example, reducing the thickness of the cover plate 11 to meet the thin and light design will correspondingly reduce the impact resistance of the cover plate 11.
[0051] Please see Figure 6 , Figure 6 This is a cross-sectional schematic diagram of the edge region of the display component 100 provided in the embodiments of this application, specifically... Figure 3 The diagram shows a cross-sectional view of the edge region of the display component 100. The display component 100 provided in this embodiment has a relatively thin overall thickness, enabling a lightweight and thin structural design for the display component 100.
[0052] In this embodiment, the display assembly 100 may include a first substrate 21, a first adhesive layer 22, a second substrate 23, a first light-shielding layer 24, a first masking adhesive 25, a second adhesive layer 26, and a display panel 27. The first adhesive layer 22 bonds the first substrate 21 and the second substrate 23 and is located on the outside of the terminal device 200, together protecting the components of the display assembly 100 facing the inside of the terminal device 200; the first light-shielding layer 24 and the first masking adhesive 25 are used to block light, thereby preventing light leakage from the display assembly 100; the second adhesive layer 26 bonds the second substrate 23 and the display panel 27, and the display panel 27 is used to realize the display function of the terminal device 200.
[0053] In this embodiment, the first substrate 21 is located on the outermost layer of the display component 100 and has good wear resistance and fingerprint resistance. The first adhesive layer 22 is located between the first substrate 21 and the second substrate 23 and bonds the first substrate 21 and the second substrate 23. The first substrate 21, the first adhesive layer 22 and the second substrate 23 together form an assembly for protecting the internal components of the terminal device 200. The assembly formed by the first substrate 21, the first adhesive layer 22 and the second substrate 23 generally has good strength, impact resistance, thin and light design, and good light transmittance.
[0054] By combining the first substrate 21, the first adhesive layer 22, and the second substrate 23, complementary functions can be achieved. For example, the first substrate 21 satisfies some of the performance requirements, while the second substrate 23 satisfies others. This is less difficult than a single-layer cover plate 11 simultaneously satisfying multiple performance requirements, and it also expands the range of material choices for the first substrate 21 and the second substrate 23, which helps reduce costs. The first adhesive layer 22, located between the first substrate 21 and the second substrate 23, can also act as a buffer, further enhancing impact resistance.
[0055] Specifically, in related technologies, the thickness of the cover plate 11 is typically greater than 60 μm to meet various performance requirements. In this embodiment, the thickness of the first adhesive layer 22 is relatively thin. The presence of the first adhesive layer 22 does not significantly increase the thickness of the display component 100. For example, in some embodiments, the total thickness of the first substrate 21, the first adhesive layer 22, and the second substrate 23 is d1. The display component 100 can satisfy the requirement that 20 μm ≤ d1 ≤ 60 μm, which is less than the thickness of the cover plate 11 in related technologies. This satisfies the various performance requirements of the cover plate 11 in related technologies, thereby helping to reduce the overall thickness of the display component 100. In some specific embodiments, the total thickness d1 of the first substrate 21, the first adhesive layer 22, and the second substrate 23 can be 25 μm, 30 μm, 36 μm, 45 μm, 52 μm, 58 μm, or any value within the range of any two of the above values.
[0056] Both the first substrate 21 and the second substrate 23 have light-transmitting properties. The material of the first substrate 21 or the second substrate 23 can be glass, polyimide (PI), polyethylene terephthalate (PET), etc. The first substrate 21 is located on the outermost layer of the display component 100, and the second substrate 23 is located on the inner side of the display component 100 relative to the first substrate 21. In the same embodiment, the materials of the first substrate 21 and the second substrate 23 can be the same or different, as long as it meets the actual usage requirements of the terminal device 200.
[0057] The first adhesive layer 22 has light-transmitting properties. The first adhesive layer 22 can be an adhesive with adhesive properties, such as pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear resin (OCR).
[0058] In this embodiment, when the first substrate 21 is in its unfolded state, it is approximately rectangular. The shape of the first adhesive layer 22 is approximately adapted to the shape of the first substrate 21, and the outer contour of the second substrate 23 is approximately adapted to the outer contour of the first substrate 21. The size of the second substrate 23 is slightly smaller than the size of the first substrate 21. Along the direction in which the first substrate 21, the first adhesive layer 22, and the second substrate 23 are stacked, the second substrate 23 is located within the projection area of the first substrate 21.
[0059] The first light-shielding layer 24 is bonded to the surface of the first adhesive layer 22 facing away from the first substrate 21 and surrounds the second substrate 23, which means that the first light-shielding layer 24 is disposed in the edge area of the encapsulation substrate. The second substrate 23 and the surface of the first light-shielding layer 24 facing away from the first substrate 21 are flush, and the thickness of the second substrate 23 and the thickness of the first light-shielding layer 24 are substantially the same.
[0060] It should be noted that the term "flush" in this application can refer to the fact that the surfaces of the second substrate 23 and the first light-shielding layer 24 facing away from the first substrate 21 are in the same plane, and there is no obvious height difference or protrusion between the second substrate 23 and the first light-shielding layer 24. In actual products, due to installation errors, measurement errors, material shrinkage or expansion, there may be some deviations between the surfaces of the second substrate 23 and the first light-shielding layer 24 facing away from the first substrate 21, such as errors within ±0.2μm, ±0.5μm, ±1μm, etc., all of which fall within the scope of the interpretation of "flush" in this application.
[0061] The first masking adhesive 25 is located between the second substrate 23 and the first light-shielding layer 24. The first masking adhesive 25 is used to fill the gap between the second substrate 23 and the first light-shielding layer 24. The first masking adhesive 25 is also bonded to the surfaces exposed on the second substrate 23 and the first light-shielding layer 24. The first masking adhesive 25 is formed by curing liquid adhesive. The liquid adhesive can fully fill the gap between the second substrate 23 and the first light-shielding layer 24. Therefore, the first masking adhesive 25 formed after curing can fully fill the gap between the second substrate 23 and the first light-shielding layer 24. In addition, the surfaces of the second substrate 23 and the first light-shielding layer 24 that are opposite to the first substrate 21 are approximately flush. Therefore, there is no step difference between the second substrate 23, the first masking adhesive 25 and the first light-shielding layer 24, or the step difference caused by assembly error is negligible.
[0062] Both the first light-blocking layer 24 and the first masking adhesive 25 are opaque materials. The first light-blocking layer 24 can be ink, or it can be Mylar film, polyimide (PI), polyethylene terephthalate (PET), etc., with added light-blocking agents to make the first light-blocking layer 24 opaque. The light-blocking agent can include, but is not limited to, at least one of graphite, carbon black, and ink. Similarly, the first masking adhesive 25 can also have a light-blocking agent added to the adhesive so that it forms an opaque first masking adhesive 25 after curing. The first light-blocking layer 24 and the first masking adhesive 25 can have the same or similar blackness, meaning that there is no obvious color difference to the naked eye.
[0063] The second adhesive layer 26 adheres to the display panel 27 and the second substrate 23. The second adhesive layer 26 is also located on the surface of the first masking adhesive 25 away from the first substrate 21 and can cover a portion of the first light-shielding layer 24. A portion of the surface of the first light-shielding layer 24 is exposed to the second adhesive layer 26.
[0064] The first masking adhesive 25 and the first light-shielding layer 24 are used to block light from the edge area of the display panel 27, thereby preventing light leakage from the display assembly 100. In this embodiment, along the direction of stacking, the area corresponding to the projection of the first masking adhesive 25 and the first light-shielding layer 24 is the first masking area II-1 of the terminal device 200; the area not blocked by the first masking adhesive 25 and the first light-shielding layer 24 is the display area I of the terminal device 200.
[0065] Since the first masking adhesive 25 is filled between the second substrate 23 and the first light-shielding layer 24, and there is no significant step difference between the second substrate 23 and the first light-shielding layer 24, the thickness of the second adhesive layer 26 is sufficient to meet the bonding requirements, and there is no need to increase the thickness to compensate for the step difference. That is, compared with related technologies, this embodiment can significantly reduce the thickness of the second adhesive layer 26, thereby reducing the overall thickness of the display component 100. In addition, the overall thickness of the first substrate 21, the first adhesive layer 22 and the second substrate 23 can be reduced relative to the thickness of the cover plate 11, and the thickness of the second adhesive layer 26 can be reduced relative to the thickness of the adhesive layer 13, so the overall weight of the display component 100 can also be reduced accordingly.
[0066] In this embodiment, the thickness of the second adhesive layer 26 is d2. The display component 100 can satisfy: 3μm≤d2≤35μm. In some specific embodiments, it can be 3μm, 5μm, 8μm, 10μm, 14μm, 16μm, 20μm, 25μm, 30μm or any value within the range of any two of the above values.
[0067] Please see Figure 6 , Figures 7A to 7E , Figure 6 , Figures 7A to 7E This is a cross-sectional schematic diagram of an assembled display assembly 100 provided in some embodiments of this application.
[0068] Please see Figure 7A First, the first adhesive layer 22 is bonded to the surface of the first substrate 21. The shape of the first adhesive layer 22 is approximately adapted to the shape of the first substrate 21.
[0069] Please see Figure 7B The second substrate 23 is bonded to the surface of the first adhesive layer 22 away from the first substrate 21, and both the first substrate 21 and the first adhesive layer 22 protrude relative to the second substrate 23.
[0070] Please see Figure 7C The first light-shielding layer 24 is bonded to the first adhesive layer 22 and exposed on the surface of the second substrate 23, and the first light-shielding layer 24 surrounds the second substrate 23.
[0071] Please see Figure 7D Liquid adhesive is filled into the second substrate 23 and the first light-shielding layer 24. The adhesive is fluid and can fully fill the gap between the second substrate 23, the first light-shielding layer 24 and the first adhesive layer 22. The adhesive is cured to form the first masking adhesive 25. In this step, even if there is an acceptable step difference between the second substrate 23 and the first light-shielding layer 24 due to error, the liquid adhesive can compensate for the step difference to a certain extent, thereby helping to reduce the thickness of the second adhesive layer 26.
[0072] Please see Figure 7E The second adhesive layer 26 is bonded to the second substrate 23 and the first masking adhesive 25 and covers part of the surface of the first light-shielding layer 24.
[0073] Please refer to it again. Figure 6 The display panel 27 is then bonded to the surface of the second adhesive layer 26 to obtain the display assembly 100.
[0074] Please see Figure 8 , Figure 8 This is a cross-sectional schematic diagram of the corresponding areas of the display component 100 and the lens module 35 provided in the embodiments of this application, specifically... Figure 3 The cross-sectional schematic diagram of the corresponding area of the display component 100 and the lens module 35 shown is as follows: Figure 6 and Figure 8 for Figure 3 The diagram shows cross-sectional views of different regions of the display component 100.
[0075] In this embodiment, the display component 100 may further include a second light-shielding layer 31 and a second masking adhesive 32. The second light-shielding layer 31 is annular, and the second light-shielding layer 31 and the first light-shielding layer 24 are spaced apart. The first adhesive layer 22 also bonds the second light-shielding layer 31 and the first substrate 21. The second masking adhesive 32 is located between the second substrate 23 and the second light-shielding layer 31. The second masking adhesive 32 is used to fill the gap between the second substrate 23 and the second light-shielding layer 31, and it is also bonded to the surfaces exposed to the second substrate 23 and the second light-shielding layer 31. The second masking adhesive 32 is formed by curing adhesive, that is, the second masking adhesive 32 is liquid before curing, which can fully fill the gap between the second substrate 23 and the second light-shielding layer 31. In addition, the surfaces of the second substrate 23 and the second light-shielding layer 31 that are opposite to the first substrate 21 are approximately flush, so there is no step difference between the second substrate 23, the second masking adhesive 32 and the second light-shielding layer 31, or the step difference caused by assembly error is negligible. The second light-shielding layer 31 and the second masking adhesive 32 are both made of opaque materials. For details, please refer to the first light-shielding layer 24 and the first masking adhesive 25.
[0076] The second adhesive layer 26 also adheres to a portion of the surface of the second masking adhesive 32 and the second light-shielding layer 31, with a portion of the surface of the second light-shielding layer 31 exposed to the second adhesive layer 26.
[0077] A first through-hole 232 is formed on the second substrate 23. The second light-shielding layer 31 and the second masking adhesive 32 are both located within the first through-hole 232, with the second masking adhesive 32 surrounding the second light-shielding layer 31. A second through-hole 312 is formed on the second light-shielding layer 31; a third through-hole 262 is formed on the second adhesive layer 26; and a fourth through-hole 272 is formed on the display panel 27. The first through-hole 232, the second through-hole 312, the third through-hole 262, and the fourth through-hole 272 all penetrate their respective components along the stacking direction. The second through-hole 312, the third through-hole 262, and the fourth through-hole 272 are interconnected. A portion of the surface of the first adhesive layer 22 is exposed to the second through-hole 312, and a portion of the surface of the second light-shielding layer 31 is exposed to the third through-hole 262. At least a portion of the lens module 35 is located in the space formed by the second through hole 312, the third through hole 262 and / or the fourth through hole 272, so the terminal device 200 does not need to reserve the entire thickness for mounting the lens module 35, thereby reducing the overall thickness of the terminal device 200.
[0078] The area corresponding to the projection of the second through hole 312 is the light-transmitting area III of the display component 100. The area corresponding to the projection of the second masking adhesive 32 and the second light-shielding layer 31 is the second shielding area II-2 of the terminal device 200. The area not shielded by the second masking adhesive 32 and the second light-shielding layer 31 and located away from the light-transmitting area III is the display area I of the terminal device 200. The second shielding area II-2 surrounds the light-transmitting area III, and the display area I surrounds the second shielding area II-2.
[0079] Since the second masking adhesive 32 is filled between the second substrate 23 and the second light-shielding layer 31, and there is no obvious step difference between the second substrate 23 and the second light-shielding layer 31, the thickness of the second adhesive layer 26 is sufficient to meet the bonding requirements, and there is no need to increase the thickness to compensate for the step difference. That is, compared with related technologies, this embodiment can significantly reduce the thickness of the second adhesive layer 26, thereby reducing the overall thickness of the display component 100.
[0080] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.
Claims
1. A display component, characterized in that, include: First substrate; First adhesive layer; The second substrate has the first adhesive layer located between the first substrate and the second substrate, and bonding the first substrate and the second substrate together. The first light-shielding layer and the second substrate are located on the surface of the first adhesive layer opposite to the first substrate; The first masking adhesive is located between the second substrate and the first light-shielding layer; The second adhesive layer is located on the surface of the second substrate and the first masking adhesive that is away from the first substrate, and covers a portion of the first light-shielding layer; as well as The display panel is located on the surface of the second adhesive layer that is opposite to the first substrate.
2. The display component according to claim 1, characterized in that, The second substrate and the first light-shielding layer are flush with the surface of the first substrate.
3. The display component according to claim 1, characterized in that, The total thickness of the first substrate, the first adhesive layer and the second substrate is d1, and the display component satisfies: 20μm≤d1≤60μm.
4. The display component according to claim 1, characterized in that, The thickness of the second adhesive layer is d2, and the display component satisfies: 3μm≤d2≤35μm.
5. The display component according to claim 1, characterized in that, The first masking adhesive is formed by curing liquid glue.
6. The display component according to any one of claims 1-5, characterized in that, The display component further includes a second light-shielding layer and a second masking adhesive; the second substrate has a first through hole, the second light-shielding layer and the second masking adhesive are both located in the first through hole, the second masking adhesive surrounds the second light-shielding layer, the second masking adhesive is located between the second substrate and the second light-shielding layer, and the second substrate surrounds the second masking adhesive.
7. The display component according to claim 6, characterized in that, The second light-shielding layer has a second through hole, and the second adhesive layer has a third through hole. The second through hole and the third through hole are interconnected. A portion of the surface of the first adhesive layer is exposed to the second through hole, and a portion of the surface of the second light-shielding layer is exposed to the third through hole.
8. The display component according to claim 7, characterized in that, The display panel has a fourth through hole, which is connected to the third through hole. The space formed by the second through hole, the third through hole and / or the fourth through hole is used to accommodate the lens module.
9. The display component according to claim 6, characterized in that, The second masking adhesive is formed by curing liquid glue.
10. A terminal device, characterized in that, The terminal device includes the display component as described in any one of claims 1-9.
Citation Information
Patent Citations
Display and bonding method thereof
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CN110060583A
Composite cover plate and display device
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TW200905240A