Printing plate, image forming apparatus, and mounting method

Abstract

The invention relates to a printing plate, an image forming apparatus, and a mounting method. The printed board includes a plurality of through-holes including a first through-hole and a second through-hole arranged adjacently in an arrangement direction, a plurality of solder regions disposed corresponding to the plurality of through-holes, and first to fourth pads. The plurality of solder zones includes a first solder zone corresponding to the first via and a second solder zone corresponding to the second via. The first solder region is provided with a first solder region portion electrically connected to the first pad, and a second solder region portion electrically connected to the second pad and not electrically connected to the first solder region portion. The second solder region is provided with a third solder region portion electrically connected to the third pad, and a fourth solder region portion electrically connected to the fourth pad and not electrically connected to the third solder region portion.

Description

Technical Field

[0001] This invention relates to printed circuit boards, imaging devices, and mounting methods, and to printed circuit boards, for example, those used in imaging devices employing electrophotographic technology. Background Technology

[0002] In some cases of conventional printed circuit boards, when mounting components with multiple pins on the board, incorrect mounting is prevented by designing the transcription of the screen printing (Japanese Patent Application Publication No. (JP-A) 2011-222878). Summary of the Invention

[0003] The present invention includes the following structure.

[0004] (1) A printed circuit board, comprising: a through-hole arrangement, including a plurality of through holes including a first through hole and a second through hole arranged adjacent to each other in an arrangement direction; a plurality of solder pads respectively corresponding to the plurality of through holes, the plurality of solder pads including a first solder pad corresponding to the first through hole and a second solder pad corresponding to the second through hole; a first solder pad; a second solder pad; a third solder pad; and a fourth solder pad, wherein the first solder pad is provided with a first solder pad portion electrically connected to the first solder pad and a second solder pad portion electrically connected to the second solder pad but not electrically connected to the first solder pad portion, and wherein the second solder pad is provided with a third solder pad portion electrically connected to the third solder pad and a fourth solder pad portion electrically connected to the fourth solder pad but not electrically connected to the third solder pad portion.

[0005] (2) A printed circuit board, comprising: a plurality of through holes arranged adjacent to each other in an arrangement direction, including a first through hole, a second through hole and a third through hole; a plurality of solder pads respectively disposed corresponding to the plurality of through holes, the plurality of solder pads including a first solder pad corresponding to the first through hole, a second solder pad corresponding to the second through hole and a third solder pad corresponding to the third through hole; and a component, one end of the component being mounted to the second through hole and the other end of the component being mounted to the third through hole, and the component overlapping the first through hole when viewed in a direction perpendicular to the surface of the printed circuit board.

[0006] (3) An imaging apparatus for performing imaging on a recording material, the imaging apparatus comprising: the printing plate described in (1) or (2).

[0007] Further features of the invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of a laser beam printer according to the first and second embodiments.

[0009] Figure 2This is a perspective view showing the printed circuit board and connector posts of different products according to the first embodiment.

[0010] Figure 3 This is a schematic diagram of a printed circuit board according to the first embodiment.

[0011] Figure 4 This is a flowchart illustrating the process of assembling the control board according to the first embodiment into the product.

[0012] Figure 5 Parts (a), (b), (c), (d), (e), and (f) are schematic diagrams of the printed circuit board, connector posts, and inspection circuit according to the first embodiment.

[0013] Figure 6 Parts (a) and (b) are graphs showing the waveforms of the switch, power supply and voltmeter of the inspection circuit during inspection according to the first embodiment.

[0014] Figure 7 This is a schematic diagram of a printed circuit board according to the second embodiment.

[0015] Figure 8 Parts (a) and (b) are schematic diagrams of a printed circuit board with lead jumpers mounted thereon, according to the second embodiment.

[0016] Figure 9 Parts (a), (b), and (c) are perspective views showing the installation of a printed circuit board and connector posts in a conventional example. Detailed Implementation

[0017] In the construction described in JP-A 2011-222878, when components are mounted on a board, incorrect mounting may occur because the mounting position and orientation are not uniquely determined.

[0018] One object of the present invention is to make it easier to identify incorrect installation of components.

[0019] The following will describe Figure 9 Parts (a), (b), and (c). In Figure 9Parts (a), (b), and (c) show a front view of the connector post and a top view of the through-holes of the printed circuit board, with lead pins and corresponding through-holes connected by dashed lines. In recent years, imaging equipment models have diversified, and there are methods for manufacturing multiple models of printed circuit boards by switching components mounted on the same board. In the printed circuit board, through-holes (hereinafter referred to as "through-holes") are used to insert lead pins soldered to the board. Connector posts, including multiple lead pins, are mounted on the printed circuit board. Incidentally, a housing (not shown) is inserted into the connector post. Among the connector posts mounted on the printed circuit board, at least two types of connector posts with different numbers of lead pins are designed so that they can be mounted in the same location, thus reducing unnecessary wiring and lowering costs in low-cost models.

[0020] exist Figure 9 Parts (a), (b), and (c) show connector posts mounted on board 700. Board 700 is provided with 20 through holes, through which, for example, lead wires pass. Hereinafter, the 20 through holes are assigned reference numerals 701 to 720. For example, as... Figure 9 As shown in part (a), a connector post 720A, comprising 20 lead pins 1A'l to 20A'l, is mounted on a board 700 used in a high-performance imaging device. Here, lead pins 1A'l to 20A'l correspond to through holes 701 to 720, respectively. On the other hand, as... Figure 9 As shown in parts (b) and (c), connector post 720B, including 16 lead pins 1B'l to 16B'l, is mounted on board 700 for use in low-cost imaging devices.

[0021] Since board 700 includes 20 through holes 701 to 720, connector post 720A, including 20 lead pins 1A'l to 20A'l, can be uniquely mounted on board 700. On the other hand, in connector post 720B, including 16 lead pins 1B'l to 16B'l, the number of through holes 701 to 720 in board 700 is greater than the number of lead pins 1B'l to 16B'l in connector post 720B. Therefore, the mounting position and orientation of connector post 720B relative to board 700 is not uniquely determined, thus posing a risk of incorrect mounting. For example, in Figure 9 In part (b), the 16 lead pins 1B'l to 16B'l of connector post 720B are inserted into through holes 701 to 716 of board 700. Furthermore, in Figure 9 In part (c), the 16 lead pins 1B'l to 16B'l of connector post 720B are inserted into the through holes 705 to 720 of board 700.

[0022] <First Embodiment>

[0023] [Imaging equipment]

[0024] Figure 1 This is a cross-sectional view showing the structure of a laser beam printer, an example of an imaging device. The laser beam printer 100 (hereinafter referred to as printer 100) includes a photosensitive drum 101 on which an electrostatic latent image is formed, a charging unit 102 for uniformly charging the photosensitive drum 101, and a developing unit 103 for developing the electrostatic latent image formed on the photosensitive drum 101 to form a toner image. Furthermore, the printer 100 includes an exposure device 114 that uses a laser unit 113 to irradiate the photosensitive drum 101 with a laser and form an electrostatic latent image on the surface of the photosensitive drum 101. In the printer 100, the toner image formed on the photosensitive drum 101 is transferred via a transfer unit 105 to a sheet P, which is a recording material, fed from a cartridge 104. A sheet P with a toner image transferred onto it is conveyed to a fixing unit 106. The unfixed toner image is fixed onto the sheet P at the fixing unit 106, and the sheet P with the fixed toner image is discharged onto a tray 107. The imaging unit consists of a photosensitive drum 101, a charging unit 102, a developing unit 103, and a transfer unit 105. Furthermore, the printer 100 is equipped with a power supply unit 108, which supplies power to a drive unit (e.g., a motor) and a control board 109.

[0025] The control board 109 includes a CPU 109a as a control unit, and controls the imaging operation of the imaging unit, the conveying operation of the sheet P, etc. During the imaging operation, a signal output from the CPU 109a is transmitted from the control board 109 to the laser control board 110 via wire 111. The laser control board 110 controls the emission of the laser unit 113 based on this signal via wire 112. Incidentally, the imaging device using this invention is not limited to... Figure 1 The construction shown.

[0026] In the first embodiment, the laser unit 113 has different specifications; product A uses laser unit 113A and laser control board 110A, while product B uses laser unit 113B and laser control board 110B. Similarly, for wires 111 and 112, product A uses wires 111A and 112A, while product B uses wires 111B and 112B. In the first embodiment, product A has higher performance than product B, and because the number of wires in wire 111A is 20 while the number of wires in wire 111B is 16, the cost of product B is reduced.

[0027] [Control Panel 109]

[0028] exist Figure 2The diagram shows each portion of the control panel 109 for products A and B in the first embodiment. Figure 2 The diagram shows a front view of the connector housing and connector posts, and a top view of the through-holes on the printed circuit board. Lead pins and corresponding through-holes are connected by dashed lines. In products A and B, the same printed circuit board 200 is used, and by changing the specifications of the installed components and the components not installed or used, control boards 109A and 109B, respectively, are manufactured to be optimal for product A and product B, respectively. The printed circuit board 200 is provided with a plurality of through-holes, for example, 20 through-holes, through which lead pins pass, and these through-holes are assigned reference numerals 301 to 320. The through-holes 301 to 320 (through-hole arrangement) are arranged in two rows, such that through-holes 301, 303, ..., 319 with odd-numbered reference numerals and through-holes 302, 304, ..., 320 with even-numbered reference numerals are adjacent to each other on the printed circuit board 200 in an alternating manner. Furthermore, in the printed circuit board 200, the surface on which the soldered components are mounted, in other words, the surface opposite to the surface on which the mounted components are mounted, is defined as solder surface 200A (see [reference]). Figure 3 Furthermore, the longitudinal direction of the connector housing and connector pins, as described below, is defined as Dl. The longitudinal direction Dl is also the arrangement direction (or orientation) of the lead pins.

[0029] In product A, connector housing 201A and connector posts 202A are used to connect wire 111A and control board 109A. Connector posts 202A are soldered onto printed circuit board 200 to form control board 109A. Connector housing 201A includes 20 contact pins 1Ac to 20Ac, and contact pins 1Ac to 20Ac are electrically connected to wire 111A. Connector posts 202A, as the first connector, include 20 lead pins 1A1 to 20A1, and lead pins 1A1 to 20A1 are soldered to through holes 301 to 320, respectively. Incidentally, lead pins 1A1 to 20A1 are also arranged in two rows in a staggered manner to match through holes 301 to 320.

[0030] Incidentally, the number of through holes 301 to 320 on the printed circuit board 200 is 20, which is the same as the number of lead pins 1A1 to 20A1 of the connector post 202A. Therefore, the connector post 202A, which includes 20 lead pins 1A1 to 20A1, can be uniquely installed in the control board 109A.

[0031] On the other hand, in product B, connector housing 201B and connector posts 202B are used to connect wire 111B and control board 109B, and connector posts 202B are soldered onto printed circuit board 200 to form control board 109B. Connector housing 201B includes 16 contact pins 1Bc to 16Bc, and contact pins 1Bc to 16Bc are electrically connected to wire 111B. Connector posts 202B, as a second connector, include 16 lead pins 1B1 to 16B1. Similar to product A, the number of through holes 301 to 320 on printed circuit board 200 is 20, and the number of lead pins 1B1 to 16B1 on connector posts 202B is less than the number of through holes 301 to 320. Incidentally, lead pins 1B1 to 16B1 are also arranged in two rows in an alternating manner to match through holes 301 to 320.

[0032] Therefore, in control board 109B, the mounting position of connector post 202B, including 16 lead pins 1Bl to 16Bl, relative to printed circuit board 200 is not uniquely determined. Incidentally, in Figure 2 In the diagram, the lead pins 1Bl to 16Bl of connector post 202B are shown as examples mounted in through holes 301 to 316, and this is the correct mounting position. However, as for the mounting position of connector post 202B on the printed circuit board 200, there may be cases where it is mounted in through holes 303 to 318, or in through holes 305 to 320.

[0033] Incidentally, among the lead pins 1Bl to 16Bl of connector post 202B, lead pin 1Bl can be the smallest pin, and lead pin 16Bl can be the largest pin. Among the multiple lead pins included in connector post 202B, the largest pin (16Bl) is the lead pin located at one end of connector post 202B relative to the longitudinal direction D1 (first lead pin). Among the multiple lead pins included in connector post 202B, the smallest pin (1Bl) is the lead pin located at the other end of connector post 202B relative to the longitudinal direction D1 (second lead pin). Incidentally, lead pin 2Bl can be the smallest pin, and lead pin 15Bl can be the largest pin. Furthermore, the correct mounting state is defined as a first state, in which lead pin 16Bl of connector post 202B passes through through hole 316 and lead pin 1Bl passes through through hole 301. An incorrect installation state is defined as the second state, in which the lead pin 16Bl of connector post 202B passes through a through hole different from through hole 316, and the lead pin 1Bl passes through a through hole different from through hole 301.

[0034] [Printed plate 200]

[0035] Figure 3 A schematic diagram of the solder surface 200A of the printed circuit board 200 in the first embodiment is shown. Figure 2 The through holes 301 to 320 correspond to Figure 3 The solder pads 401 to 420 (multiple solder pads) are numbered. For example, through hole 301 corresponds to solder pad 401, and through hole 320 corresponds to solder pad 420. That is, the printed circuit board 200 includes solder pads 401 to 420, wherein copper foil surrounds through holes 301 to 320 on the solder surface 200A side.

[0036] In the first embodiment, the solder pad 416 (first solder pad) corresponding to the lead pin 16Bl (which is the largest pin of the connector post 202B) is divided into two solder pads: solder pad 416-1 (first solder pad portion) and solder pad 416-2 (second solder pad portion). Solder pads 416-1 and 416-2 are located at different positions in the direction along the surface of the printed circuit board 200 and in the intersecting direction intersecting the arrangement direction. In the intersecting direction, each of solder pads 416-1 and 416-2 is located between pads 421 and 422. The shortest distance between solder pads 416-1 and 416-2 is 0.3 mm or more. By constructing it in this way, the likelihood of solder pads 416-1 and 416-2 being soldered when soldering solder pads 416 and the lead pin is reduced. The through-hole 316 corresponding to solder pad 416 is a first through-hole.

[0037] At this time, the imaginary line L1 dividing the two solder areas 416-1 and 416-2 is parallel to the longitudinal direction Dl (the flow direction in the first embodiment). Moreover, solder area 416-1 is electrically connected to pad 421 (first pad) using copper foil, and solder area 416-2 is electrically connected to pad 422 (second pad) using copper foil.

[0038] Furthermore, in the longitudinal direction D1, the solder area 417 (second solder area) adjacent to solder area 416 is divided into two solder areas, namely solder area 417-1 (third solder area) and solder area 417-2 (fourth solder area). Solder areas 417-1 and 417-2 are located at different positions in the direction along the surface of the printed circuit board 200 and in the intersecting direction intersecting with the arrangement direction. In the intersecting direction, each of solder areas 417-1 and 417-2 is located between pads 423 and 424. The shortest distance between solder areas 417-1 and 417-2 is 0.3 mm or more. By constructing it in this way, the likelihood of solder areas 417-1 and 417-2 being soldered when soldering solder area 417 and lead pins is reduced. Incidentally, the through-hole 317 corresponding to solder area 417 is a second through-hole.

[0039] At this time, the imaginary line L2 dividing the two solder areas 417-1 and 417-2 is also parallel to the longitudinal direction Dl (the soldering direction in the first embodiment). Furthermore, solder area 417-1 is electrically connected to pad 423 (the third pad) using copper foil, and solder area 417-2 is electrically connected to pad 424 (the fourth pad) using copper foil. Pads 421 to 424 are electrodes, which are contacts of an inspection device (such as an in-circuit tester) that electrically detects mounting defects on the printed circuit board 200 during defect inspection.

[0040] Incidentally, in the first embodiment, the correct mounting position of the connector post 202B of product B is set as through holes 301 to 316, but it is not limited to this. The correct mounting position can be set as through holes 303 to 318 or through holes 305 to 320. Furthermore, in the first embodiment, pads 421 to 424 are provided only at one end; however, they can be provided only at the other end or at both ends. In this case, the through hole through which the lead pin 16B1 passes is defined as the first through hole, the through hole through which the lead pin 16B1 passes is defined as the second through hole, the solder area of ​​the first through hole is defined as the first solder area, and the solder area of ​​the second through hole is defined as the second solder area. Moreover, the solder area located at one end relative to the first solder area in the arrangement direction and / or the solder area located at the other end relative to the second solder area are defined as the third solder area. Furthermore, the third solder area can be the same as described above in... Figure 3 The first solder area and / or the solder area adjacent to the second solder area shown in the figure.

[0041] [Installation of Control Board 109B]

[0042] Figure 4 The process (mounting method) for mounting control board 109B onto product B is illustrated. In S500, the components required for the circuitry of control board 109B are placed on printed circuit board 200 (first step). In this embodiment, connector posts 202B are positioned such that lead pins are inserted into solder pads 401 to 416 of printed circuit board 200. In S501, solder is applied to the components placed on printed circuit board 200. In this embodiment, solder is applied by flow mounting (second step). The flow mounting of connector posts 202B will be described in detail below.

[0043] In S502, the printed circuit board 200 is inspected. During the inspection, it is checked whether the components are correctly mounted on the printed circuit board 200 and whether any defects appear on the mounted components (steps 3 and 4). If the inspection results are normal, proceed to S503. In S503, it is checked whether the connector post 202B is installed in the correct position. If the connector post is installed in the correct position, proceed to S504. This will be described in detail below. In S504, the printed circuit board 200, in which the components are correctly mounted, is assembled into the imaging device as the control board 109B. Incidentally, if there are problems with the inspection results in S502, or if the mounting position is incorrect in S503, the process terminates. Figure 4 The flowchart in the document.

[0044] In this manner, the mounting method for mounting components on the printed circuit board 200 includes a first step for inserting a plurality of lead pins into a plurality of through holes, a second step for soldering the plurality of lead pins onto a plurality of solder pads, a third step for connecting an inspection device to a first pad and a second pad and measuring a current signal, and a fourth step for connecting the inspection device to a third pad and a fourth pad and measuring a current signal.

[0045] [Flow soldering installation of printed circuit board 200]

[0046] exist Figure 4 In S501, the process of soldering the connector post 202B onto the printed circuit board 200 will be described. Figure 5 Parts (a), (b), (c), (d), and (f) are Figure 4 A schematic diagram of the printed circuit board 200 and connector post 202B in each process shown. Figure 5 Part (a) is a schematic diagram of printed circuit board 200, in which connector post 202B is inserted into the correct solder pad during process S500. Lead pins 1Bl to 16Bl of connector post 202B are inserted into solder pads 401 to 416.

[0047] Figure 5 Part (b) is a schematic diagram of the printed circuit board 200 and the connector post 202B, wherein from Figure 5The flow soldering installation begins in the state shown in part (a). The flow soldering direction during flow soldering installation is the longitudinal direction D1 of the connector post 202B. During flow soldering installation of the connector post 202B, in solder area 416, the lead pin 16Bl of the connector post 202B is soldered to solder area 416-1, and the lead pin 16Bl of the connector post 202B is soldered to solder area 416-2. Therefore, since solder areas 416-1 and 416-2, which are divided into two solder areas, are electrically connected through the same lead pin 16Bl, pads 421 and 422 are electrically connected.

[0048] On the other hand, since solder pad 417 does not include the 17th lead pin of connector post 202B, solder pads 417-1 and 417-2 are not electrically connected via lead pins even during flow soldering. Therefore, pads 423 and 424 are not electrically connected either.

[0049] In other words, when solder pads 416 and 417 are divided into two parts, with the connector post 202B pin present, the pads connected to the divided solder pads are electrically connected to each other. On the other hand, without the connector post 202B pin present, the pads connected to each divided solder pad become electrically disconnected.

[0050] Figure 5 Part (d) is a schematic diagram of the printed circuit board 200 and the connector post 202B, wherein the connector post 202B is inserted into the wrong solder pad during process S500. In this embodiment, the lead pins 1Bl to 16Bl of the connector post 202B are inserted into solder pads 403 to 418.

[0051] Figure 5 Part (e) is a schematic diagram of the printed circuit board 200 and the connector post 202B, wherein from Figure 5 The flow soldering installation begins in part (d) of the process. During flow soldering installation, the flow soldering direction is the longitudinal direction Dl of connector post 202B. Similar to... Figure 5 Welding zone 416 in part (b), Figure 5 In part (e), solder pad 416 is connected to solder pads 416-1 and 416-2 via lead pins (specifically, lead pin 14Bl) using solder. Therefore, pads 421 and 422 are electrically connected.

[0052] on the other hand, Figure 5 weld area 417 in part (e) and Figure 5The difference in solder patch 417 in part (b) is the insertion of a lead pin (specifically, lead pin 15Bl). Therefore, solder patches 417-1 and 417-2 are connected via solder through the lead pin. Thus, pads 423 and 424 are electrically connected.

[0053] [Flow soldering installation of printed circuit board 200]

[0054] The installation check of connector post 202B in S503 will be described. Figure 5 Part (c) is a schematic diagram showing the state when the printed circuit board 200, in which connector post 202B is correctly mounted, is connected to the inspection circuit 810. The inspection circuit 810 is connected in series with the power supply 800 and the current detection circuit 801. The inspection circuit 810 is configured such that one end is connected to pads 422 and 424, and the other end is connected to pads 421 and 423, and the connection between pads 421 and 423 can be switched by switch 804. More specifically, the state in which the inspection circuit 810 is connected to pad 421 can be switched by switch 804 between the state in which the inspection circuit 810 is connected to pad 423. Figure 5 In part (c), switch 804 is connected to pad 421. In this embodiment, current detection circuit 801 is configured such that resistor 802 and voltmeter 803 are connected in parallel.

[0055] Figure 6 Part (a) shows the examination as follows Figure 5 The waveform shown in part (c) when the connector post 202B is correctly mounted on the printed circuit board 200. Figure 6 In part (a), (i) indicates the state of switch 804 (connected to pad 421 or connected to pad 423), (ii) indicates whether power supply 800 is on or off, and (iii) indicates the voltage level (H, L) (electrical signal) of voltmeter 803. The horizontal axis represents time.

[0056] First, switch 804 is connected to pad 421, power supply 800 is turned on, and voltage is applied. At this time, since pads 421 and 422 are electrically connected, current flows through resistor 802 and voltage is applied to voltmeter 803. Then, switch 804 is switched to be connected to pad 423, and voltage is applied from power supply 800. At this time, since pads 423 and 424 are not electrically connected, current does not flow through resistor 802, and voltage is not applied to voltmeter 803.

[0057] Figure 5 Part (f) is a schematic diagram showing the state in which the printed circuit board 200, in which connector post 202B is incorrectly installed, is connected to the inspection circuit 810. The inspection circuit 810 and... Figure 5 The inspection circuit in part (c) is the same, and its description will be omitted. Figure 6 Part (b) shows the examination as follows Figure 5 The waveform shown in part (f) is when the connector post 202B is incorrectly installed on the printed circuit board 200. Figure 6 Part (b) of (i) to (iii) and Figure 6 The same as in part (a).

[0058] First, switch 804 is connected to pad 421 to turn on power supply 800 and apply voltage. At this time, since pads 421 and 422 are electrically connected, current flows through resistor 802 and voltage is applied to voltmeter 803. Afterward, switch 804 is switched to connect to pad 423, and voltage is applied from power supply 800. At this time, with… Figure 6 Unlike part (a), since pads 423 and 424 are electrically connected, current flows through resistor 802 and voltage is applied to voltmeter 803.

[0059] Therefore, since the voltage of voltmeter 803 differs when voltage is applied between pads 423 and 424, incorrect installation of connector post 202B can be detected. Furthermore, since this inspection can be performed along with the installation checks of other components, a large initial investment is not required. In the first embodiment, correct installation can be detected by confirming that there is no adjacent 17th lead corresponding to connector post 202B comprising 16 lead pins 1B1 to 16B1.

[0060] Furthermore, by dividing solder joint 401 into two parts, it can be confirmed that lead pin 1Bl (second lead pin) and lead pin 16Bl (first lead pin) of connector post 202B are present, while the 17th lead pin is absent. In this way, it can be confirmed that the number of lead pins of the installed connector is correct, which is 16. Furthermore, if the mounting components of connector post 202B can be properly managed, only one solder joint adjacent to the solder joint connected to the lead pin and not connected to the lead pin can be divided into two parts. Moreover, the total area (surface area) of the two divided solder joints can be greater than the area (surface area) of the other undivided solder joint (third solder joint). Therefore, since dividing the solder joints can reduce the reduction in connection strength, it is preferable that the area of ​​the divided solder joint is greater than the area of ​​the undivided solder joint. Furthermore, during flow soldering, when the solder area is divided into two parts parallel to the flow soldering direction, the occurrence of solder bridges can be reduced when the lead pins of connector post 202B are absent. Therefore, dividing the solder area parallel to the flow soldering direction is preferred. In addition, while the solder area is divided into two parts in the first embodiment, it is not limited to this. The solder area can be divided into two or more electrodes. Moreover, the two or more divided electrodes can be electrically connected only to the solder pads (contacts). Furthermore, the through holes 301 to 320 are arranged in an alternating manner; however, the through holes 301, 303, ..., 319 with odd-numbered reference numerals and the through holes 302, 304, ..., 320 with even-numbered reference numerals are arranged in two rows in an alternating manner on the printed circuit board 200. Furthermore, in the first embodiment, this configuration is suitable for leaded connectors; however, it is not limited to leaded connectors and can also be implemented for surface mount components.

[0061] As described above, according to the first embodiment, by dividing the solder pad of the connector post into two parts and connecting each divided solder pad to each pad, it is possible to determine whether the lead pin of the connector post is mounted on the solder pad. By applying such a configuration, it is possible to detect incorrect mounting of connector posts with a small number of pins at low cost.

[0062] As described above, according to the first embodiment, incorrect installation of components can be identified.

[0063] <Second Embodiment>

[0064] The imaging device used in the second embodiment is the same as that in the first embodiment, therefore its description will be omitted. Furthermore, the laser units 113A and 113B, wires 112A and 112B, laser control boards 110A and 110B, wires 111A and 111B, connector housings 201A and 201B, and connector posts 202A and 202B of products A and B used in the second embodiment are also similar. Therefore, these descriptions will also be omitted.

[0065] [Printed Plate 500]

[0066] In the second embodiment, the printed circuit board 500 is applied to the control board 109A and the control board 109B. Figure 7 A schematic diagram of the solder surface 500A of the printed circuit board 500 in the second embodiment is shown. In the printed circuit board 500, through-holes 501 to 520 (a plurality of through-holes) and solder pads 601 to 620 (a plurality of solder pads) are formed to mount connector posts 202A and connector posts 202B. Through-holes 501 to 520 are similar to through-holes 301 to 320 in the first embodiment.

[0067] In the second embodiment, through holes 521 and 522, different from through holes 501 to 520, and solder areas 621 (fourth solder area) and 622 (fifth solder area), different from solder areas 601 to 620, are formed on the printed circuit board 500. Solder areas 621 and 622 are configured such that the imaginary line L3 connecting solder areas 621 and 622 intersects the longitudinal direction Dl (the direction of lead pin arrangement). In the second embodiment, solder areas 621 and 622 are formed such that the imaginary line L3 is perpendicular to the longitudinal direction Dl.

[0068] In the second embodiment, a component including lead pins passing through solder pads 621 and 622 is mounted on a printed circuit board 500.

[0069] Figure 8 Parts (a) and (b) are schematic diagrams showing the installation of lead jumpers 523 (jumpers) to cover (or span) the through-holes 517 of the printed circuit board 500 in the second embodiment. Figure 8 Part (a) is a schematic diagram showing the connector post 202B installed in the correct mounting position, while Figure 8 Part (b) is a schematic diagram showing that the connector post 202B is installed in the wrong installation position.

[0070] The lead jumper 523 is a component in which one end is installed in a through hole 521, which serves as a second through hole, and the other end is installed in a through hole 522, which serves as a third through hole. When viewed in a direction perpendicular to the surface of the printed circuit board 200, the lead jumper 523 overlaps with the through hole 517, which serves as a first through hole.

[0071] like Figure 8 As shown in section (a), when connector post 202B is installed in the correct mounting position (first position) and lead jumper 523 is installed on solder pads 621 and 622, lead jumper 523 covers solder pad 617 (third solder pad). In other words, as Figure 8As shown in part (b), when connector post 202B is installed in the wrong state (second state), lead jumper 523 is arranged in a position where it interferes with connector post 202B.

[0072] The lead jumper 523 is mechanically mounted, thus preventing incorrect installation. With the lead jumper 523 pre-installed, connector pins 202B cannot be inserted into through-holes 517. Therefore, lead pins 1Bl to 16Bl of connector pins 202B can be inserted into through-holes 501 to 516; in other words, they can be inserted in the correct position, and incorrect installation is reliably prevented.

[0073] In the second embodiment, the lead jumper 523 is arranged to interfere only with one side of the connector, but is not limited thereto. For example, if there are empty lead pins at both ends, the lead jumper can be installed at both ends of the through hole. Furthermore, a solder area located at one end relative to the first solder area in the arrangement direction and / or at the other end relative to the second solder area is defined as a third solder area, and the lead jumper can be configured to cover the third solder area. In the second embodiment, a new hole is provided for inserting the lead jumper; however, it is not limited thereto. The lead jumper can be directly inserted into an unused through hole of the connector. For example, the lead jumper can be inserted into through holes 517 and 518.

[0074] In the second embodiment, the lead jumper 523 is arranged to block the through-hole 517, but is not limited thereto. The presence of the lead jumper alone can prevent the connector from being installed in the wrong position, without necessarily covering the through-hole. For example, the thickness of the lead jumper can also be used to prevent connector insertion.

[0075] In the second embodiment, a lead bridge is used; however, any component capable of interfering with incorrect insertion of the connector can be used, for example, an electronic component with attached leads can be used instead of a lead bridge. Furthermore, a large, sheet-like component can be used to block the through-hole. In this case, a mechanically mounted component is preferred. In the second embodiment, this configuration is suitable for leaded connectors; however, it is not limited to leaded connectors and can also be implemented for surface-mount components.

[0076] As described above, according to the second embodiment, when mounting connector pins with a small number of pins, the components are pre-positioned at locations that would interfere with the connector pins. By applying this configuration, a reliable means of preventing incorrect installation of the connector pins can be provided since the operator cannot insert them.

[0077] As described above, according to the second embodiment, incorrect installation of components can be identified.

[0078] Although the invention has been described with reference to exemplary embodiments, it should be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is consistent with the broadest interpretation to cover all such modifications and equivalent structures and functions.

Claims

1. A printing plate, comprising: Through-hole arrangement, including a plurality of through holes, including a first through hole and a second through hole, arranged adjacent to each other in the arrangement direction; Multiple solder areas are provided, each corresponding to a plurality of through holes, including a first solder area corresponding to the first through hole and a second solder area corresponding to the second through hole; First pad; Second pad; The third pad; and Fourth pad, The first solder area is provided with a first solder area portion electrically connected to the first solder pad and a second solder area portion electrically connected to the second solder pad but not electrically connected to the first solder area portion. The second solder area is provided with a third solder area portion electrically connected to the third solder pad and a fourth solder area portion electrically connected to the fourth solder pad but not electrically connected to the third solder area portion.

2. The printing plate according to claim 1, wherein, The plurality of solder areas includes a third solder area, and The surface area of ​​each of the first solder area, the second solder area, the third solder area, and the fourth solder area is smaller than the surface area of ​​the third solder area.

3. The printing plate according to claim 2, wherein, The first solder area and the second solder area are located in different positions along the surface of the printed circuit board and in a direction intersecting the arrangement direction. In the intersecting direction, the third weld zone and the fourth weld zone are located in different positions.

4. The printing plate according to claim 3, wherein, The shortest distance between the first weld area and the second weld area is 0.3 mm or more, and The shortest distance between the third weld area and the fourth weld area is 0.3 mm or more.

5. The printing plate according to claim 4, wherein, In the intersecting direction, each of the first solder area and the second solder area is located between the first pad and the second pad, and In the intersecting direction, each of the third solder area and the fourth solder area is located between the third solder pad and the fourth solder pad.

6. A printing plate, comprising: Through-hole arrangement, including a first through-hole, a second through-hole, and a third through-hole, multiple through-holes arranged adjacent to each other in the arrangement direction; Multiple solder pads are provided, each corresponding to one of the multiple through holes. The multiple solder pads include a first solder pad corresponding to the first through hole, a second solder pad corresponding to the second through hole, and a third solder pad corresponding to the third through hole; and A component, one end of which is mounted to the second through hole and the other end of which is mounted to the third through hole, and which overlaps with the first through hole when viewed in a direction perpendicular to the surface of the printed circuit board.

7. The printing plate according to claim 6, wherein, In a cross direction along the surface of the printed circuit board and intersecting the arrangement direction, the first solder pad is positioned between the second solder pad and the third solder pad.

8. The printing plate according to claim 7, wherein, In the arrangement direction, at least the first solder area, at least the second solder area and the third solder area are positioned at the same location.

9. The printing plate according to claim 8, wherein, The component in question is a jumper wire.

10. An imaging apparatus for performing imaging on a recording material, the imaging apparatus comprising: The printing plate according to claim 1.

11. The imaging device according to claim 10, further comprising: Photosensitive drum; An exposure apparatus configured to form an electrostatic latent image on the photosensitive drum; and A control unit configured to control the exposure apparatus. The control unit is included in the printed circuit board.

12. An imaging apparatus for performing imaging on a recording material, the imaging apparatus comprising: The printing plate according to claim 6.

13. The imaging device according to claim 12, further comprising: Photosensitive drum; An exposure apparatus configured to form an electrostatic latent image on the photosensitive drum; and A control unit configured to control the exposure apparatus. The control unit is included in the printed circuit board.

14. A mounting method for mounting mounting components on a substrate. in, The mounting component is provided with multiple lead pins. The substrate includes: Multiple through holes, wherein the multiple through holes include a first through hole and a second through hole; Multiple solder zones, each corresponding to a plurality of through holes; First pad; Second pad; The third pad; and Fourth pad, The plurality of welding zones include: In the first solder area, one of the plurality of lead pins to be installed in the first through hole is soldered to the first solder area. The first solder area is provided with a first solder area portion electrically connected to the first solder pad and a second solder area portion electrically connected to the second solder pad but not electrically connected to the first solder area portion; and In the second solder area, one of the plurality of lead pins to be installed in the second through hole is soldered to the second solder area. The second solder area is provided with a third solder area portion electrically connected to the third solder pad and a fourth solder area portion electrically connected to the fourth solder pad but not electrically connected to the third solder area portion. The installation method includes: The first step for inserting the plurality of lead pins into the plurality of through holes; The second step is used to solder the plurality of lead pins onto the plurality of solder areas; The third step is used to connect the inspection device to the first pad and the second pad and measure the current signal; and The fourth step is used to connect the inspection device to the third and fourth pads and measure the current signal.

Images