Voltage converter and method for producing voltage converter

Abstract

A voltage converter (10) is provided, comprising:-a first circuit board (11) having a first circuit section (13) of the voltage converter (10), the first circuit section (13) comprising a semiconductor chip (15) embedded between metal layers of the first circuit board (11), and-a second circuit board (12) having a second circuit section (13) of the voltage converter (10), the second circuit section (13) comprising a semiconductor chip (15) embedded between metal layers of the first circuit board (11), the second circuit board has a second circuit section (14) of the voltage converter (10), wherein the first circuit section (13) is electrically coupled to the second circuit section (14).

Description

Technical Field

[0001] The present invention relates to a voltage converter and a method for manufacturing the voltage converter. Background Technology

[0002] A voltage converter is a circuit that converts an input voltage into an output voltage required for a specific application. One type of voltage converter is a DC-DC converter (DC / DC converter, from the English "direct current"), which converts an input voltage into a DC output voltage.

[0003] For example, such DC / DC converters are required in accelerator cards used in artificial intelligence (AI) applications. Here, providing this DC / DC converter directly on the accelerator card enables precise voltage regulation and rapid response to load changes. This allows for the most optimized power supply possible for the accelerator card's processor and other components.

[0004] Different converter topologies can be used here, such as isolated or non-isolated topologies (that is, with or without current isolation between the input and output sides, such as switched capacitor-based converters, LLC converters, or buck converters).

[0005] Space available for DC / DC converters on such accelerator cards is limited, and in practice, even without explicit standardization, it is currently typically 23mm × 17mm. This means the voltage converter module must be housed within this area. Despite these size constraints, the voltage converter must offer good efficiency—that is, low power loss—should be able to deliver the maximum possible power, and be able to maintain the temperature within acceptable ranges during operation. Simultaneously, the solution should be cost-effective. Summary of the Invention

[0006] According to one embodiment, a voltage converter is provided, the voltage converter comprising:

[0007] - A first circuit board, the first circuit board having a first circuit segment of a voltage converter, wherein the first circuit segment includes a semiconductor chip embedded between metal layers of the first circuit board, and

[0008] - A second circuit board having a second circuit segment of a voltage converter, wherein the first circuit segment is electrically coupled to the second circuit segment.

[0009] According to another embodiment, a method for manufacturing a voltage converter is provided, the method comprising:

[0010] A first circuit board is provided, the first circuit board having a first circuit segment of a voltage converter, wherein the first circuit segment includes a semiconductor chip embedded between metal layers of the first circuit board; a second circuit board is provided, the second circuit board having a second circuit segment of a voltage converter; and the first circuit segment and the second circuit segment are electrically coupled.

[0011] The above summary provides only a brief overview of some implementation methods and should not be construed as limiting. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a voltage converter according to one embodiment.

[0013] Figure 2A This is a perspective view of a voltage converter according to one embodiment.

[0014] Figure 2B yes Figure 2A Side view of the voltage converter.

[0015] Figure 2C yes Figure 2A and Figure 2B A top view of the voltage converter.

[0016] Figure 2D yes Figures 2A to 2C The voltage converter is shown in the view below.

[0017] Figure 2E and Figure 2F yes Figures 2A to 2D A cross-sectional view of the circuit board of the voltage converter.

[0018] Figure 2G An alternative implementation method is shown.

[0019] Figure 3 This is a cross-sectional view of a circuit board of a voltage converter according to some embodiments.

[0020] Figures 4A to 4C A voltage converter with a heat-conducting plate according to one embodiment is shown, wherein... Figure 4A Showing the corresponding Figure 2C The view, and Figure 4B and Figure 4C A view of the heat-conducting plate is shown.

[0021] Figure 5A and Figure 5B Details of the coupling between circuit boards in various implementations are shown.

[0022] Figure 6A circuit diagram of a voltage converter according to some embodiments is shown, with divisions on a circuit board.

[0023] Figure 7 A circuit diagram of another voltage converter according to some embodiments is shown, with divisions on the circuit board.

[0024] Figure 8 A flowchart illustrating a method according to some implementations is shown. Detailed Implementation

[0025] The various embodiments are described in detail below. These embodiments are for illustrative purposes and should not be construed as limiting. Details, features, or variations described with respect to one embodiment may also apply to other embodiments, and will not be repeated thereafter. Unless otherwise stated, features of the different embodiments described can be combined with each other. For example, refer to... Figures 4A to 4C Specific heat-conducting plates that can be applied in the embodiments are described, and references are made to... Figure 5A and Figure 5B The specific coupling between the circuit boards is described. The heatsink and coupling components can be used independently of each other, or they can be used together. A similar situation applies to the other features described.

[0026] In the various embodiments described, the voltage converter circuit is divided into two circuit segments provided on different circuit boards. Here, an embedded semiconductor chip is used on one of the circuit boards, that is, a semiconductor chip embedded between different metal layers of the circuit board. Therefore, as described in more detail below, an improved implementation can be achieved compared to using a single circuit board for the voltage converter circuit.

[0027] Figure 1 A voltage converter 10 according to one embodiment is shown. The voltage converter 10 includes a first circuit board (PCB) 11 and a second circuit board 12. A first circuit segment 13 of the voltage converter 10 is disposed on the first circuit board 11, and a second circuit segment 14 of the voltage converter is disposed on the second circuit board 12. The first circuit segment 13 is electrically coupled to the second circuit segment 14 via an electrical coupling 16. Even if the electrical coupling 16 is in Figure 1 The circuit is schematically shown as a single wire, but the electrical coupling may include multiple individual electrical connections. The first circuit section 13 and the second circuit section 14 together form a voltage converter circuit, particularly a DC-DC voltage converter circuit. The first and second circuit sections may each contain discrete components, such as capacitors, resistors, transistors, coils, transformers, etc., components implemented in the metal layers of the corresponding circuit boards, such as coils, or integrated circuits.

[0028] The first circuit segment 13 has one or more semiconductor chips 15 embedded between metal layers of the first circuit board 11. The semiconductor chips may, in particular, contain one or more transistors, which can be used, for example, as switches in a voltage converter. Such transistors can be based on silicon or other semiconductor materials. For example, semiconductor materials with wide bandgap, such as GaN transistors, or GaN-HEMTs (high electron mobility transistors), can be used.

[0029] For illustration purposes, Figure 3 The following configuration is shown, in which a semiconductor chip 30 is embedded between metal layers 31 and 32 of a circuit board. Additional metal layers, denoted by L1 to L4 and L7 to L10, are connected to each other via vertical connections as shown. Here, the illustrated design of the metal layers is merely illustrative, and the metal layers can be configured as required for the corresponding wiring of the semiconductor chip and the remaining first circuit segment. The metal layers are separated from each other by a dielectric as is typically the case, and, particularly as seen in metal layer 32, can be connected to each other via vertical connections (e.g., VIA, Vertical Interconnect Access).

[0030] The dielectric between the metal layers acts as a casing for the chip 30, which is electrically connected to the metal layers through corresponding contacts.

[0031] Therefore, larger semiconductor chips can be used compared to non-embedded semiconductor chips, which, for example, require separate packaging. For example, chips with a diameter greater than 7mm can be used here. 2 Greater than 8mm 2 Greater than 10mm 2 or greater than 12mm 2 The chip area is larger than that of a bare die, whereas in a conventional solution with discrete components, only a smaller chip can be used on a circuit board with the same total available space. This, for example, enables an increase in the number of transistors within the same area, thereby providing voltage converters for higher power, higher voltage, and / or higher current.

[0032] The first circuit section 13 can be designed to draw a smaller current than the second circuit section during the operation of the voltage converter. In typical switching voltage converter implementations, there are circuit sections that draw relatively low current, for example, because these sections essentially only switch voltage potentials, while other sections draw higher currents, particularly the output section that supplies power to the load. In this way, the corresponding circuit board can be structurally adapted to different current-drawing requirements.

[0033] Therefore, the number of metal layers in the first circuit board 11 can be smaller than the number of metal layers in the second circuit board 12. Using semiconductor chips embedded between the metal layers of the first circuit board 11 may require a larger spacing between the metal layers. On the other hand, as mentioned above, when the first circuit segment conducts a smaller current than the second circuit segment, fewer metal layers are sufficient to conduct current with less loss. Therefore, for example, the first circuit board 11 may have between 6 and 10 metal layers, while the second circuit board 12 may have between 16 and 20 metal layers.

[0034] The metal layers of the second circuit board 12 can have a smaller spacing than the metal layers of the first circuit board 11, resulting in a higher metal content. The metal can be copper, as is common in circuit boards, where copper conducts current particularly well. In this way, losses in the second circuit board 12 can be kept low because the higher metal share allows for a larger line cross-section to conduct current in the second circuit board 12. One or more coils designed for high currents can also be implemented in the metal layers of the second circuit board 12, for example, in the form of a single coil or a transformer, such as an autotransformer or a planar transformer. Here, one or more turns of such a coil can also extend parallel across multiple metal layers.

[0035] Because of fewer metal layers, the first circuit board 11 can also be thinner overall than the second circuit board 12, which can provide more space for components on the first circuit board or in other locations.

[0036] The first circuit board 11 and the second circuit board 12 can be disposed above the third circuit board. Now refer to... Figures 2A to 2D The corresponding implementation examples will be described below.

[0037] Figure 2A A perspective view of a voltage converter according to an embodiment is shown, and Figure 2B A side view of a voltage converter according to an embodiment is shown. The voltage converter includes a first circuit board 20 and a second circuit board 21, which are electrically and mechanically coupled in a coupling region 210. As particularly in Figure 2B As can be seen, the second circuit board 21 has a stepped opening, into which the first circuit board is attached.

[0038] The first circuit board 20 and the second circuit board 21 are disposed above the third circuit board 22 and spaced apart from the third circuit board by a support element 23. Here, the element 23 may also have or form an electrical connection to electrically couple the composite consisting of the first circuit board 20 and the second circuit board 21 to the third circuit board 22 and the devices thereon.

[0039] The third circuit board 22 may have relatively few metal layers, especially fewer than the first circuit board 20 and the second circuit board 21, for example, four metal layers, and may have the dimensions required for its use in a voltage converter in a system, such as the 23mm × 17mm dimensions mentioned above, which is the quasi-standard for DC-DC voltage converters used in AI applications.

[0040] like Figure 2B As shown, components 24 and 25 for communicating with a corresponding system using a voltage converter can be provided on the third circuit board 22. Because the first circuit board 20 is thinner, components 24 and 25 can have a greater height below the first circuit board 20 than below the second circuit board 21.

[0041] Figure 2C An exemplary view of the first and second circuit boards 20, 21 from above, i.e., from the side opposite to the third conductor wall panel 22, is shown. Figure 2D The corresponding view is shown from below. Figure 2E and Figure 2F A cross-sectional view of a first circuit board 20 with embedded semiconductor chips is shown. (See from...) Figure 2C and Figure 2D As can be seen, various devices can be disposed on both sides of the first circuit board 20 and the second circuit board 21. This includes an integrated circuit 28 for the second circuit board 21, as well as transistor elements Q3, Q6 and coil device 25, and capacitors 27 and driver circuits 26 for transistors such as those embedded in the transistor chip of the first circuit board 20 (see [link]). Figure 2E and Figure 2F Because the first circuit board 20 has a smaller thickness, the capacitor 27 can be designed to a larger size compared to some conventional implementations. The first circuit board 20 and the second circuit board 21 communicate with each other via contact elements PH1 and PH2. (As in...) Figure 2E and Figure 2F As shown in the cross-sectional view, transistor chips Q1, Q2, Q4, and Q5 are located between metal layers 29 (in... Figure 2E and Figure 2F (Seen in the view above and below the transistor chip) embedded in the first circuit board 20, wherein in Figure 2E Two cavities are provided between the metal layers, with two chips disposed in each cavity (Q1 and Q2 in the first cavity and Q4 and Q5 in the second cavity), while... Figure 2F The device provides four cavities, with two chips disposed in each cavity. Figure 2F The situation also corresponds to Figure 2C The situation is as described in the text.

[0042] Then, circuit elements such as capacitor 27 can be disposed entirely or partially above the semiconductor chip, which results in a short connection path between the transistors in the semiconductor chip and the capacitor, thereby causing low parasitic capacitance.

[0043] In another embodiment, circuit boards 20 and 21 are not implemented separately, but are designed as a single circuit board 211. This single circuit board 211 shows areas of varying thickness in the illustrated cross-section. In this embodiment, the metal layers and other layers located between the metal layers, such as dielectrics, are... Figure 2G As shown, it can be implemented in two or more different lengths. Figure 2G In this embodiment, the layer comprising metal layers L1 to L6 in region 213 is longer than the layer comprising metal layers L7 and L8 in region 214. This creates a usable void 212. Dividing the metal layers into these regions is merely an example, and other divisions may be chosen. For example, regions 213 and 214 may each have the same number of metal layers or different numbers of metal layers, and the total number of metal layers may vary.

[0044] The empty space 212 can accommodate circuit elements 215, such as capacitors, or smaller circuit boards with corresponding circuits in a space-saving manner.

[0045] In particular, electrical components introduced or located on the introduced circuit board can conduct higher currents than components placed on the remaining larger circuit board 211.

[0046] The circuit element 214 introduced into the open area can be directly connected to the adjacent metal layer, here metal layer L7, by means of electrical connection 216. In this manner and method, larger components can also be integrated into a thinner area of ​​the circuit board in a space-saving manner.

[0047] In other embodiments, circuit board 211 is disposed above another circuit board (e.g., circuit board 22 described above), and circuit element 214 may additionally or alternatively be electrically connected to the other circuit board.

[0048] The use of circuit board 211 is not limited to voltage converters.

[0049] Therefore, a circuit board is provided, comprising a plurality of metal layers stacked vertically in a first direction, wherein a metal layer in a first region extending along the first direction has a smaller extension in at least one second direction different from the first direction than a metal layer in a second region extending along the same first direction but different from the first region. This allows for the formation of a void. One or more circuit elements can be provided in the void. The circuit elements can be electrically coupled to one of the metal layers, particularly one of the metal layers in the first region.

[0050] During the operation of a voltage converter, heat is generated, for example, due to switching losses or the flow of high current. To dissipate this heat, a cooling plate made of a metal with good thermal conductivity, such as copper or aluminum, is conventionally placed on a first and / or second circuit board. A more compact arrangement is possible by using embedded chips on the first circuit board, which allows for the lateral placement of additional heat-conducting elements at the first circuit board. Figures 4A to 4C The corresponding embodiments are shown in the figure.

[0051] As in Figure 4A As shown, thermally conductive material 40A laterally surrounds the first circuit board 20 on three sides. Here, the thermally conductive element 40A can be made of metal, in particular. Figure 4B and Figure 4C As shown, the heat-conducting element 40A can be connected to a plate 40B, which is positioned above the first circuit board 20 like a conventional cooling plate, and if necessary, also above a portion of the second circuit board 21, such as the area of ​​transistors Q3 and Q6. Therefore, in this embodiment, additional cooling can be provided compared to simply providing a cooling plate.

[0052] Different variations are feasible for coupling the first and second circuit boards. Figure 5A and Figure 5B A feasible example is shown here. Figure 5A An example of a second circuit board 51 is shown, such as the second circuit board 21 or 12 in the preceding figures, and Figure 5BAn example of a first circuit board 50 with an embedded chip 52 is shown. This first circuit board can be an example of a first circuit board 11 or 20. In the illustrated example, the first circuit board 50 has two protrusions 55, while the second circuit board 51 has two corresponding cutouts 53. In the assembled state, the protrusions 55 engage with the cutouts 53, thereby achieving precise positioning. Furthermore, the first circuit board 50 has electrical contacts 56, and the second circuit board 51 has electrical contacts 54, which contact each other during positioning, thereby electrically connecting the corresponding first circuit segment to the corresponding second circuit segment. The number and arrangement of the contacts 56 and 54 are matched here; however, the arrangement and number should be understood as illustrative only, meaning that more or fewer electrical contacts can be provided for the corresponding voltage converter circuit as needed. The shape, number, and positioning of the protrusions 55 and the corresponding cutouts 53 are also understood as illustrative only. Additionally, fastening mechanisms, such as clips, may be provided to form a fixed connection.

[0053] As already explained, different voltage converters can be used. Figure 6 and Figure 7 Two different feasible circuit topologies are shown.

[0054] Figure 6 An example of a so-called HSC converter (Hybrid Switched Capacitor Converter) based on a resonant converter with two phases is shown. Circuit segment 60 conducts low current during operation and is an example of a first circuit segment that can be implemented on a first circuit board (e.g., 11, 20, or 50), and circuit segment 61 is an example of a second circuit segment that can be implemented on a second circuit board (e.g., 12, 21, or 51). Transistors Q1, Q2, Q4, and Q5 of the first circuit segment 60 can be implemented by means of an embedded semiconductor chip, and capacitors C1 and C2 are then correspondingly implemented as discrete capacitors partially disposed above the semiconductor chip. The coil arrangement 62 forming a transformer in the second circuit segment 61 is an example of a coil arrangement that can be implemented by means of one or more turns in a metal layer of the second circuit board.

[0055] Figure 7 An example of an LLC half-bridge converter is shown. Here, the first circuit segment 70 can again be implemented on a corresponding first circuit board, and the second circuit segment 71 can be implemented on a corresponding second circuit board. The transistors Q1 to Q4 of the first circuit segment 70 can be implemented as embedded chips, and the capacitor shown can again be implemented as a discrete capacitor. The coil assembly 72 including the capacitor is another example of a component that can be implemented within the metal layer of the second circuit board.

[0056] Figure 8A flowchart illustrating a method for manufacturing a voltage converter according to some embodiments is shown. Figure 8 The method can be used, for example, to manufacture the voltage converter described above, and is described with reference to it.

[0057] In step 80, a first circuit board with a first circuit segment of a voltage converter is provided, wherein a semiconductor chip is embedded between the metal layers of the first circuit board for this purpose. The first circuit board can be the first circuit board of any of the embodiments described above.

[0058] In step 81, a second circuit board with a second circuit segment having a voltage converter is provided. The second circuit board can be the second circuit board of any of the embodiments described above. Steps 80 and 81 can also be performed in reverse order or in parallel. In step 82, the first circuit segment is then electrically coupled to the second circuit segment, for example, as described above, particularly referring to… Figure 5A and Figure 5B .

[0059] The composite consisting of the first and second circuit boards can then be disposed above the third circuit board, as is the case here. Figure 2A As shown in the image.

[0060] Some implementation methods are defined by the following examples:

[0061] Example 1. A voltage converter, the voltage converter comprising:

[0062] - A first circuit board having a first circuit segment of the voltage converter, wherein the first circuit segment includes a semiconductor chip embedded between metal layers of the first circuit board, and

[0063] - A second circuit board having a second circuit segment of the voltage converter, wherein the first circuit segment is electrically coupled to the second circuit segment.

[0064] Example 2. A voltage converter according to Example 1, wherein the first circuit segment is designed to conduct a smaller current than the second circuit segment during operation of the voltage converter.

[0065] Example 3. A voltage converter according to Example 1 or 2, wherein the number of metal layers of the first circuit board is smaller than the number of metal layers of the second circuit board.

[0066] Example 4. A voltage converter according to any one of Examples 1 to 3, wherein the second circuit segment includes one or more coils.

[0067] Example 5. A voltage converter according to any one of Examples 1 to 4, wherein the first circuit board and the second circuit board have mechanical and electrical coupling elements configured to mechanically couple the first and second circuit boards and provide electrical coupling between the first circuit segment and the second circuit segment.

[0068] Example 6. The voltage converter according to Example 5, wherein the mechanical coupling element includes a stepped opening in one of the first and second circuit boards, and wherein the other circuit board in the first and second circuit boards is adaptable to the stepped opening.

[0069] Example 7. A voltage converter according to any one of Examples 1 to 6, wherein the semiconductor chip comprises a transistor, and wherein the first circuit board further comprises a capacitor disposed at least partially overlapping the transistor in a top view.

[0070] Example 8. A voltage converter according to any one of Examples 1 to 7, wherein the first circuit board includes one or more sidewalls made of a thermally conductive material.

[0071] Example 9. The voltage converter according to Example 8, wherein the plurality of sidewalls are formed in a U-shape.

[0072] Example 10. A voltage converter according to any one of Examples 1 to 9, wherein the semiconductor chip has a diameter greater than 7 mm. 2 The area.

[0073] Example 11. A voltage converter according to any one of Examples 1 to 10, the voltage converter further comprising a third circuit board having contact elements configured to connect the voltage converter to a system including the voltage converter, wherein the first circuit board and the second circuit board are disposed above the third circuit board.

[0074] Example 12. A voltage converter according to any one of Examples 1 to 11, wherein the second circuit board does not have an embedded semiconductor chip.

[0075] Example 13. A method for manufacturing a voltage converter, the method comprising:

[0076] A first circuit board is provided, the first circuit board having a first circuit segment of the voltage converter, wherein the first circuit segment includes a semiconductor chip embedded between metal layers of the first circuit board.

[0077] A second circuit board is provided, the second circuit board having a second circuit segment of the voltage converter, and

[0078] The first circuit segment is electrically coupled to the second circuit segment.

[0079] Example 14. The method according to Example 13, wherein the method is designed for manufacturing a voltage converter according to any one of Examples 1 to 12.

[0080] While specific embodiments have been described and illustrated in this specification, those skilled in the art will recognize that various alternative and / or equivalent implementations can be chosen as substitutes for the specific embodiments shown and described herein without departing from the scope of the invention. This application is intended to cover all adaptations or variations of the specific embodiments discussed herein. Therefore, the invention is intended to be limited only by the claims and their equivalents.

Claims

1. A voltage converter (10), the voltage converter comprising: - A first circuit board (11, 20, 50) having a first circuit segment (13, 60, 70) of the voltage converter (10), wherein the first circuit segment (13, 60, 70) includes semiconductor chips (15, 30, 52) embedded between metal layers (31, 32) of the first circuit board (11, 20, 50), and - A second circuit board (12, 21, 51) having a second circuit segment (14, 61, 71) of the voltage converter (10), wherein the first circuit segment (13, 60, 70) is electrically coupled to the second circuit segment (14, 61, 71).

2. The voltage converter (10) according to claim 1, wherein the first circuit segment (13, 60, 70) is designed to conduct a smaller current than the second circuit segment (14, 61, 71) during operation of the voltage converter (10).

3. The voltage converter (10) according to claim 1 or 2, wherein the number of metal layers (31, 32) of the first circuit board (11, 20, 50) is less than the number of metal layers (31, 32) of the second circuit board (12, 21, 51).

4. The voltage converter (10) according to any one of claims 1 to 3, wherein the second circuit segment (14, 61, 71) comprises one or more coils (62, 72).

5. The voltage converter (10) according to any one of claims 1 to 4, wherein the first circuit board (11, 20, 50) and the second circuit board (12, 21, 51) have mechanical and electrical coupling elements (210, 53, 54, 55, 56) configured to mechanically couple the first and second circuit boards (10, 21, 50, 11, 22, 51) and provide electrical coupling between the first circuit segment (13, 60, 70) and the second circuit segment (14, 61, 71).

6. The voltage converter (10) according to claim 5, wherein the mechanical coupling element includes a stepped opening in one of the first and second circuit boards (10, 21, 50, 11, 22, 51), and wherein the other circuit board in the first and second circuit boards (10, 21, 50, 11, 22, 51) is adaptable to the stepped opening.

7. The voltage converter (10) according to any one of claims 1 to 6, wherein the semiconductor chip (15, 30, 52) comprises a transistor, and wherein the first circuit board (11, 20, 50) further comprises a capacitor disposed at least partially overlapping the transistor in a top view.

8. The voltage converter (10) according to any one of claims 1 to 7, wherein the first circuit board (11, 20, 50) includes one or more sidewalls (40A) made of thermally conductive material.

9. The voltage converter (10) according to claim 8, wherein the plurality of sidewalls (40A) are formed in a U-shape.

10. The voltage converter (10) according to any one of claims 1 to 9, wherein the semiconductor chip (15, 30, 52) has a diameter greater than 7 mm. 2 The area.

11. The voltage converter (10) according to any one of claims 1 to 10, the voltage converter further comprising a third circuit board (22) having contact elements (24, 25) configured to connect the voltage converter (10) to a system including the voltage converter (10), wherein the first circuit board (11, 20, 50) and the second circuit board (12, 21, 51) are disposed above the third circuit board (22).

12. The voltage converter (10) according to any one of claims 1 to 11, wherein the second circuit board (12, 21, 51) does not have an embedded semiconductor chip (15, 30, 52).

13. A method for manufacturing a voltage converter (10), the method comprising: A first circuit board (11, 20, 50) is provided, the first circuit board having a first circuit segment (13, 60, 70) of the voltage converter (10), wherein the first circuit segment (13, 60, 70) includes a semiconductor chip (15, 30, 52) embedded between metal layers (31, 32) of the first circuit board (11, 20, 50). A second circuit board (12, 21, 51) is provided, the second circuit board having a second circuit section (14, 61, 71) of the voltage converter (10), and The first circuit segment (13, 60, 70) is electrically coupled to the second circuit segment (14, 61, 71).

14. The method of claim 13, wherein the method is designed for manufacturing a voltage converter (10) according to any one of claims 1 to 12.

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