Electronic component transfer method and device, equipment and medium

Abstract

The invention discloses an electronic component transfer method and device, equipment and a medium. According to the method, before a plurality of electronic components are transferred from a first substrate to a second substrate, a visual effect simulation diagram of the second substrate is obtained based on first substrate data and a first transfer algorithm, and the visual effect simulation diagram can simulate the light emitting effect of the transferred electronic components on the second substrate; therefore, whether the uniformity of the optical parameters of the transferred electronic component meets the requirement or not can be estimated in advance. Thus, according to the method, the effect of the transfer method can be verified before the electronic component is transferred, the cost for verifying the effect of the transfer method can be reduced, the risk of poor image quality can be preposed, and therefore poor image quality can be effectively avoided.

Description

Technical Field

[0001] This application relates to the field of electronic components, and in particular to a method, apparatus, device, and medium for transferring electronic components. Background Technology

[0002] During the manufacturing process of display modules, multiple electronic components are typically mixed according to certain rules and then transferred to the substrate of the display module. This is to prevent the optical parameters (such as wavelength and brightness) of the electronic components in the display module from becoming regionally concentrated, thereby improving the uniformity of the display effect. Based on the mixing rules, there are currently several transfer methods.

[0003] However, for the above-mentioned transfer methods, the effectiveness of the transfer method is currently verified after the electronic components have been transferred, which results in high verification costs. Furthermore, the final image quality of the display module cannot be guaranteed before the electronic components are transferred, which can easily lead to poor image quality of the display module. Summary of the Invention

[0004] This application provides a method, apparatus, device, and medium for transferring electronic components. The technical solution is as follows:

[0005] According to a first aspect of this application, a method for transferring electronic components is provided for transferring a plurality of said electronic components from a first substrate to a second substrate, the method comprising:

[0006] Acquire first substrate data of the first substrate, the first substrate data including optical data and position information of a plurality of electronic components located on the first substrate;

[0007] A first correspondence between the first substrate and the second substrate is determined based on a first transfer algorithm, wherein the first transfer algorithm is used to indicate rules for transferring at least a portion of the electronic components on the first substrate to the second substrate;

[0008] Based on the first substrate data and the first correspondence, the second substrate data of the second substrate is determined, and a visual effect simulation diagram of the second substrate is obtained based on the second substrate data. The visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the multiple electronic components located on the second substrate.

[0009] Based on the visual simulation diagram of the second substrate, determine whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements.

[0010] After the optical parameters of the plurality of electronic components on the second substrate meet the requirements, the plurality of electronic components are transferred from the first substrate to the second substrate.

[0011] Optionally, the optical data includes a first parameter; based on the visual simulation diagram of the second substrate, determining whether the uniformity of the optical parameters of the plurality of electronic components on the second substrate meets the requirements includes:

[0012] In the visual simulation diagram of the second substrate, multiple first partitions are defined. The first parameters of electronic components in the same first partition are located in the same parameter range, and the first references of electronic components in different first partitions are located in different parameter ranges.

[0013] Determine whether the difference between the first parameters corresponding to any two adjacent first partitions is less than a first preset value;

[0014] After determining that the difference between the first parameters corresponding to any two adjacent first partitions is less than the first preset value, it is determined that the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements.

[0015] After determining that the difference between the optical parameters of two adjacent first partitions is not less than the first preset value, it is determined that the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements.

[0016] Optionally, the first parameter includes at least one of the wavelength, brightness, and color coordinates of the light emitted by the electronic component.

[0017] Optionally, the first parameter corresponding to the first partition is the average value of the first parameters of each electronic component within the first partition.

[0018] Optionally, the method further includes:

[0019] After the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements, an adjusted first transfer algorithm is determined, and the step of determining the first correspondence between the first substrate and the second substrate based on the first transfer algorithm is executed.

[0020] Optionally, after transferring the plurality of electronic components from the first substrate to the second substrate, the method further includes:

[0021] The position data of the plurality of electronic components are obtained, including: position information of the plurality of electronic components on the first substrate, and position information of the plurality of electronic components on the second substrate;

[0022] Based on the position data of the plurality of electronic components, the second substrate data of the second substrate is updated, and an updated visual effect simulation diagram of the second substrate is obtained based on the updated second substrate data. The updated visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the plurality of electronic components after transfer.

[0023] Optionally, after obtaining the first substrate data of the first substrate, the method further includes:

[0024] A visual simulation image of the first substrate is obtained based on the data of the first substrate. The visual simulation image of the first substrate is used to simulate the light-emitting effect of multiple electronic components on the first substrate.

[0025] Optionally, the first substrate is the original substrate, and the second substrate is the intermediate substrate;

[0026] Alternatively, the first substrate may be an original substrate, and the second substrate may be a product substrate;

[0027] Alternatively, the first substrate may be an intermediate substrate, and the second substrate may be a product substrate.

[0028] Optionally, the method is further used to transfer a plurality of the electronic components from the first substrate to the second substrate, and then from the second substrate to the third substrate; the method further includes:

[0029] After the uniformity of the light emission effect of the multiple electronic components on the second substrate meets the requirements, a second transfer algorithm is determined. The second transfer algorithm is used to indicate the rule of sequentially transferring each of the multiple electronic components on the second substrate to the third substrate according to the arrangement order of the multiple electronic components on the second substrate.

[0030] The second correspondence between the second substrate and the third substrate is determined based on the second transfer algorithm;

[0031] Based on the second substrate data and the second correspondence, the third substrate data of the third substrate is determined, and a visual effect simulation diagram of the third substrate is obtained based on the third substrate data. The visual effect simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate.

[0032] Based on the visual simulation diagram of the third substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements.

[0033] After the optical parameters of the plurality of electronic components on the third substrate meet the requirements, the plurality of electronic components are transferred from the second substrate to the third substrate.

[0034] Optionally, the method is further used to transfer a plurality of the electronic components from the first substrate to the second substrate, and then from the second substrate to the third substrate; the method further includes:

[0035] After the uniformity of the light emission effect of multiple electronic components on the second substrate does not meet the requirements, the multiple electronic components are transferred from the first substrate to the second substrate, and a third transfer algorithm is determined. The third transfer algorithm is used to indicate the rules for randomly transferring each of the multiple electronic components on the second substrate to the third substrate according to the random order of the multiple electronic components on the second substrate.

[0036] The second correspondence between the second substrate and the third substrate is determined based on the third transfer algorithm;

[0037] Based on the second substrate data and the second correspondence, the third substrate data of the third substrate is determined, and a visual effect simulation diagram of the third substrate is obtained based on the third substrate data. The visual effect simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate.

[0038] Based on the visual simulation diagram of the third substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements.

[0039] After the optical parameters of the plurality of electronic components on the third substrate meet the requirements, the plurality of electronic components are transferred from the second substrate to the third substrate.

[0040] Optionally, the first substrate is a raw substrate, the second substrate is an intermediate substrate, and the third substrate is a product substrate.

[0041] Secondly, a light-emitting element transfer device is provided, the transfer device comprising:

[0042] The first acquisition module is used to acquire first substrate data of the first substrate, the first substrate data including optical data and position information of a plurality of electronic components located on the first substrate;

[0043] A first determining module is used to determine a first correspondence between the first substrate and the second substrate based on a first transfer algorithm, wherein the first transfer algorithm is used to indicate rules for transferring at least a portion of the electronic components on the first substrate to the second substrate.

[0044] The second acquisition module is used to determine the second substrate data of the second substrate according to the first substrate data and the first correspondence relationship, and to acquire the visual effect simulation diagram of the second substrate based on the second substrate data. The visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the multiple electronic components located on the second substrate.

[0045] The second determining module is used to determine, based on the visual simulation diagram of the second substrate, whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements.

[0046] The transfer module is used to transfer the multiple electronic components from the first substrate to the second substrate after the optical parameters of the multiple electronic components on the second substrate meet the requirements.

[0047] Thirdly, a computer device is provided, the computer device comprising: a memory and a processor, the memory storing at least one computer program, the at least one computer program being loaded and executed by the processor to implement any of the methods described above.

[0048] Fourthly, a computer-readable storage medium is provided, wherein at least one computer program is stored therein, the at least one computer program being loaded and executed by a processor to implement any of the methods described above.

[0049] Fifthly, a computer program product is provided, including a computer program / instructions that, when executed by a processor, implement any of the methods described above.

[0050] The beneficial effects of the technical solutions provided in this application include at least the following:

[0051] A method for transferring electronic components is provided. Before transferring multiple electronic components from a first substrate to a second substrate, this method obtains a visual simulation image of the second substrate based on data from the first substrate and a first transfer algorithm. The visual simulation image can simulate the light-emitting effect of the transferred electronic components on the second substrate, thereby allowing for an advance assessment of whether the uniformity of the optical parameters of the transferred electronic components meets the requirements. Thus, this method can verify the effectiveness of the transfer method before the electronic components are transferred, reducing the cost of verifying the effectiveness of the transfer method and proactively mitigating the risk of poor image quality, thereby effectively avoiding image quality defects. Attached Figure Description

[0052] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0053] Figure 1 This is a schematic diagram of the structure of a raw substrate, an intermediate substrate, and a product substrate;

[0054] Figure 2 This is a flowchart of a method for transferring electronic components provided in an embodiment of this application;

[0055] Figure 3 This is a schematic diagram comparing a simulated visual image of a second substrate and a physical visual image provided in an embodiment of this application;

[0056] Figure 4 This is a flowchart of another electronic component transfer method provided in the embodiments of this application;

[0057] Figure 5 This application provides a visual simulation diagram of another first substrate and a second substrate according to an embodiment;

[0058] Figure 6 This is a flowchart of another electronic component transfer method provided in the embodiments of this application;

[0059] Figure 7 This is a schematic diagram of another electronic component transfer method provided in an embodiment of this application;

[0060] Figure 8 This is a schematic diagram of an electronic component transfer device provided in an embodiment of this application.

[0061] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0063] To facilitate understanding of the embodiments of this disclosure, the original substrate, intermediate substrate, and product substrate will be briefly introduced below.

[0064] Please refer to Figure 1 , Figure 1This is a schematic diagram of a primary substrate, an intermediate substrate, and a product substrate. The primary substrate A1, intermediate substrate A2, and product substrate A3 each include multiple arrayed electronic components B. The primary substrate A1 can serve as a carrier for manufacturing the electronic components B; it can be a substrate for a wafer. The intermediate substrate A2 can serve as a carrier for temporarily or temporarily supporting the electronic components B; it can be a carrier for sorting sheets (bin sheets), such as blue film or UV (Ultraviolet Ray) film. The product substrate A3 can serve as a carrier for fixing the electronic components B to produce light-emitting devices; it can be a display substrate in a display module or display screen.

[0065] Figure 1 Only a portion of the electronic components B on the original substrate A1, intermediate substrate A2, and product substrate A3 are shown. For example, the number of electronic components B on an original substrate A1 can be 500k-650k, the number of electronic components B on an intermediate substrate A2 can be 20k-30k, and the number of electronic components B on a product substrate A3 can be approximately 20k.

[0066] Depending on the fabrication process of electronic component B, the optical parameters of multiple electronic components B formed on the same original substrate A1 will differ. These optical parameters include wavelength, brightness, color coordinates, voltage, and current. Typically, the optical parameters of multiple electronic components B on the same original substrate A1 are randomly distributed. Furthermore, electronic components B on the original substrate A1 may exhibit optical aggregation, meaning that the optical parameters of some electronic components B are highly similar in a certain region, such as... Figure 1 The original substrate A1 is shown with areas having the same numbers, and electronic components B with the same numbers indicate similar optical parameters. In this case, when transferring electronic components B from the original substrate A1, it is necessary to mix electronic components B so that there are no areas where the optical parameters of electronic components B are too concentrated on the intermediate substrate A2 or the product substrate A3, in order to avoid poor image quality, such as stripes, agglomeration, color blocks, etc.

[0067] Optionally, electronic component B may be a light-emitting diode (LED), such as a mini light-emitting diode (Mini-LED) or a micro light-emitting diode (Micro-LED), but is not limited thereto.

[0068] This application provides a method for transferring electronic components, which is used to transfer multiple electronic components from a first substrate to a second substrate.

[0069] Optionally, this transfer method can be applied to the manufacturing process of a light-emitting device. Three exemplary embodiments are described below:

[0070] (1) The first substrate is the original substrate, and the second substrate is the intermediate substrate.

[0071] (2) The first substrate is the original substrate, and the second substrate is the product substrate.

[0072] (3) The first substrate is an intermediate substrate, and the second substrate is a product substrate.

[0073] In the manufacturing process of light-emitting devices, the transfer of electronic components typically involves two processes:

[0074] In the first scenario, the electronic components are initially located on the original substrate and then directly transferred from the original substrate to the product substrate, where other processes are performed to obtain the light-emitting device. Therefore, the second embodiment described above can be considered the transfer process in this scenario.

[0075] In the second scenario, the electronic component is initially located on the original substrate, then transferred from the original substrate to one or more intermediate substrates, and finally transferred from one of the intermediate substrates to the product substrate, where other processes are performed to obtain the light-emitting device. Therefore, the first and third embodiments described above can represent different stages of the transfer process in this scenario.

[0076] Please refer to Figure 2 , Figure 2 This is a flowchart of a method for transferring electronic components according to an embodiment of this application. The method includes:

[0077] Step 201: Obtain the first substrate data of the first substrate.

[0078] The first substrate data includes optical data and positional information of multiple electronic components located on the first substrate. The optical data can be used to indicate the light-emitting characteristics of the multiple electronic components on the first substrate. The optical data may include at least one of the following raw data: wavelength, brightness, color coordinates, voltage, current, etc., or, alternatively, the optical data may include data after data transformation of these raw data.

[0079] Position information can be used to indicate the position of multiple electronic components on a first substrate. The position information may include coordinate information of the multiple light-emitting components on the first substrate, which may include, but is not limited to, absolute coordinates or relative coordinates. For example, the coordinate information may include the row coordinates and column coordinates of the electronic components, where the row coordinates indicate the row number of the electronic component on the first substrate, and the column coordinates indicate the column number of the electronic component on the first substrate.

[0080] Alternatively, acquiring the first substrate data can include the following two implementation methods:

[0081] (1) When the first substrate is the original substrate, the optical data and position information of multiple electronic components on the original substrate can be tested in practice.

[0082] The optical data can be obtained by testing the optical characteristics of multiple electronic components, or it can be derived from data provided by the manufacturer. The method for testing position information can include: taking a picture of the first substrate, then establishing a coordinate system based on the picture and determining the coordinate information of each first light-emitting element, thereby obtaining the position information.

[0083] The test results can be stored in local memory or a cloud server, and the first substrate data can be read from local memory or received from a computer device.

[0084] (2) When the first substrate is an intermediate substrate, the data of the first substrate can be determined based on the optical data and position information of multiple electronic components on the original substrate, as well as the correspondence between the original substrate and the intermediate substrate.

[0085] Alternatively, when the intermediate substrate is a raw material provided by the manufacturer, the first implementation method can also be used to obtain the first substrate data.

[0086] Step 202: Determine the first correspondence between the first substrate and the second substrate based on the first transfer algorithm.

[0087] The first transfer algorithm is used to indicate the rules for transferring at least a portion of the electronic components on the first substrate to the second substrate. The first transfer algorithm includes, but is not limited to, a die-picking algorithm, a die-placement / die-bonding algorithm, and a path planning algorithm.

[0088] For example, a chip transfer device can pick up electronic components from a first substrate using transfer elements and transfer the electronic components to a second substrate according to the movement path of the transfer elements and the target arrangement points on the second substrate. A die-picking algorithm can be used to indicate the picking order of electronic components on the first substrate. A die-placement / die-bonding algorithm can be used to indicate the order in which electronic components are picked up from the target arrangement points on the second substrate. The die-placement algorithm is used in the transfer process from the original substrate to the intermediate substrate, and the die-bonding algorithm is used in the transfer process from the intermediate substrate to the product substrate, or vice versa. A path planning algorithm is used to indicate the movement path of the transfer elements.

[0089] Therefore, the first correspondence determined by the first transfer algorithm can be used to indicate the correspondence between the positions of the electronic components to be transferred on the first substrate and the second substrate.

[0090] Optionally, the first transfer algorithm may be a transfer subroutine for electronic components, which may be distributed to one or more transfer devices, thereby enabling one or more transfer devices to transfer electronic components based on the transfer subroutine.

[0091] Step 203: Determine the second substrate data of the second substrate based on the first substrate data and the first correspondence relationship, and obtain the visual simulation diagram of the second substrate based on the second substrate data.

[0092] The second substrate data includes optical data and position information of multiple electronic components to be transferred to the second substrate. Based on the second substrate data, a visual simulation image of the second substrate can be obtained before the electronic components are transferred. The visual simulation image of the second substrate can be used to simulate the light-emitting effect of multiple electronic components located on the second substrate. That is, the visual simulation image can combine the optical data and position information of the electronic components to simulate the final pixel image quality on the second substrate. In this way, the mixing effect of the first transfer algorithm can also be predicted.

[0093] When the first substrate is the original substrate and the second substrate is the intermediate substrate, the data of the second substrate can also be used as the source data for the next process, that is, the data of the first substrate during the process of transferring electronic components from the intermediate substrate to the product substrate.

[0094] In this application, the method for fabricating the visual simulation image of the second substrate may include:

[0095] (1) Construct a visual effect simulation model using optical data and position information as parameters. Optical data may include at least one of the following original parameters: wavelength, brightness, color coordinates, voltage, current, etc. Alternatively, optical data may include data after data transformation of these original parameters. Data transformation refers to calculating several original parameters through mathematical relationships. For example, the visual effect simulation model uses wavelength parameters and coordinate information as parameters.

[0096] (2) The visual effect simulation diagram of the second substrate is obtained by simulating the data of the second substrate through a visual effect simulation model. For example, the data of the second substrate may include the wavelength and coordinate information of multiple electronic components to be transferred. Then, the light emission color at each position on the second substrate can be simulated by the visual effect simulation model, thereby simulating the image quality effect of the final pixel on the second substrate.

[0097] Please refer to Figure 3 , Figure 3This is a comparative schematic diagram of a visual effect simulation image and a physical visual effect image of a second substrate provided in this application embodiment. The physical visual effect image C1 can be obtained by photographing the electronic components on the illuminated second substrate (product substrate) with an optical camera. The grayscale visual effect image C2 is a grayscale image processed from the physical visual effect image C1, and C2 clearly represents the optical distribution of the electronic components on the second substrate. The visual effect simulation image C3 is a visual effect simulation image of the second substrate created using second substrate data (optical data and position information), and the visual effect simulation image C3 can predict the optical distribution of the electronic components on the second substrate. Comparing C1, C2, and C3, it can be seen that the optical distribution in the visual effect simulation image C3 provided in this application embodiment is similar to that in the grayscale visual effect image; therefore, the visual effect simulation image C3 can effectively represent the actual image quality effect of the display module. Furthermore, the visual effect simulation image can visualize the transferred image quality effect, improving the ease of verifying the transfer effect of the transfer method.

[0098] Step 204: Based on the visual simulation diagram of the second substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements.

[0099] The uniformity of optical parameters of multiple electronic components on the second substrate refers to the similarity of the optical parameters of multiple electronic components. The higher the similarity of the optical parameters, the lower the possibility of optical aggregation, and the better the image quality after transfer.

[0100] Optionally, determining whether the uniformity of optical parameters meets the requirements can include the following two implementation methods:

[0101] (1) This application can determine whether the uniformity of the optical parameters of multiple electronic components meets the requirements by determining whether there are obvious image quality defects, such as stripes, clustering, color blocks, etc., in the visual effect simulation diagram.

[0102] This application allows for direct visual inspection to determine the presence of stripes, clusters, or color blocks, or confirmation through image recognition algorithms. For an example, please refer to [link / reference]. Figure 3 The C32 region differs significantly in chromaticity from the adjacent C31 and C33 regions. Therefore, the C32 region exhibits obvious image quality defects and poor uniformity of optical parameters.

[0103] (2) This application can combine visual effect simulation diagrams and second substrate data to determine whether the uniformity of optical parameters of multiple electronic components meets the requirements.

[0104] Since the visual simulation image of the second substrate is created based on the data of the second substrate, which also includes optical data of electronic components, this application can further quantify the degree of image quality defects based on the optical data. For example, please refer to... Figure 3 Furthermore, this application can further improve the accuracy of the judgment by confirming whether the optical data of region C32 differs significantly from those of the adjacent regions C31 and C33.

[0105] Step 205: After the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements, the multiple electronic components are transferred from the first substrate to the second substrate.

[0106] Once the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements, it can be predicted that the image quality after transfer will be good. This indicates that the transfer effect of the first transfer algorithm is good. Therefore, multiple electronic components can be transferred from the first substrate to the second substrate using a transfer device according to the first transfer algorithm, thereby effectively reducing the probability of defective products and improving product quality and efficiency. The transfer device involved in the embodiments of this application may include, but is not limited to, sorting machines, die bonders, pick-and-place machines, laser mass transfer equipment, etc.

[0107] For specific transfer methods, please refer to Chinese Patent Application No. 202410661003.3, entitled "Method for determining the picking order of light-emitting elements, picking method and transfer method of light-emitting elements, device, equipment and medium", and Chinese Patent Application No. 202410600390.X, entitled "Light-emitting element transfer method and light-emitting element transfer system". The embodiments of this application will not be described in detail here.

[0108] In summary, this application provides a method for transferring electronic components. Before transferring multiple electronic components from a first substrate to a second substrate, the method obtains a visual simulation image of the second substrate based on the first substrate data and a first transfer algorithm. The visual simulation image can simulate the light-emitting effect of the transferred electronic components on the second substrate, thereby allowing for an advance prediction of whether the uniformity of the optical parameters of the transferred electronic components meets the requirements. Thus, this method can verify the effectiveness of the transfer method before the electronic components are transferred, reducing the cost of verifying the effectiveness of the transfer method and proactively mitigating the risk of poor image quality, thereby effectively avoiding poor image quality.

[0109] This application also provides another method for transferring electronic components; please refer to [link / reference]. Figure 4 , Figure 4 This is a flowchart of another method for transferring electronic components provided in an embodiment of this application. The method is used to transfer multiple electronic components from a first substrate to a second substrate. The method includes:

[0110] Step 401: Obtain the first substrate data of the first substrate.

[0111] The first substrate data includes optical data and position information of multiple electronic components located on the first substrate.

[0112] The details of step 401 are the same as those of step 201 above, and will not be described in detail here.

[0113] Step 402: Obtain a visual simulation diagram of the first substrate based on the data of the first substrate.

[0114] The visual simulation diagram of the first substrate is used to simulate the light-emitting effects of multiple electronic components on the first substrate. The visual simulation diagram of the first substrate can visualize the light-emitting effects of multiple electronic components on the first substrate, thereby intuitively demonstrating the quality of the first substrate.

[0115] The method for creating the visual simulation diagram of the first substrate can refer to step 203 above, and will not be detailed here.

[0116] Please refer to Figure 5 , Figure 5 This application provides another visual simulation diagram of a first substrate and a second substrate. The first substrate can be an intermediate substrate, and the second substrate can be a product substrate. S21, S22, S23, and S24 are visual simulation diagrams of four first substrates (sorting sheets), respectively. The number of second substrates (display modules) is one. S31, S32, and S33 are visual simulation diagrams of the electronic components to be transferred corresponding to three transfer devices on the second substrate, respectively. Combining S31, S32, and S33 yields the visual simulation diagram S3 of the second substrate.

[0117] For example, Figure 5 The visual simulation images of the four first substrates all show horizontal stripes. The stripes in S21, S22, and S23 are less noticeable, and the corresponding visual simulation images of the second substrates S31 and S32 also do not show obvious image quality defects. The stripes in S24 are the most pronounced, and the corresponding visual simulation image of the second substrate S33 also shows obvious image quality defects, such as the color block shown in the upper right corner of S33. This results in a color block also appearing in the upper right corner of the final visual simulation image of the second substrate S3. However, comparing S33 and S3, it can be seen that the color block in S3 is less noticeable. This suggests that transferring electronic components to a single second substrate using multiple transfer devices can increase the disorder of the electronic component arrangement, thereby improving the image quality to some extent.

[0118] Therefore, on the one hand, the image quality of the second substrate can be predicted through the visual simulation diagram of the first substrate, so that measures can be taken in advance to improve the image quality of the second substrate. For example, please refer to... Figure 5Based on S24, it can be determined that the disorder of electronic components on the first substrate is poor. Therefore, the first transfer algorithm can be optimized. For example, the number of transfer devices and sorting sheets can be increased, which can effectively improve the disorder of electronic components on the second substrate.

[0119] On the other hand, the visual simulation of the first substrate can present the quality of the raw materials (sorted wafers or wafers), facilitating the tracing of the reasons for poor image quality in the final product (display module), thereby allowing for stricter control standards at the raw material level. For example, please refer to... Figure 5 When the image quality of the second substrate is poor as determined by the visual simulation diagram S3 of the second substrate, the problem is first identified by the visual simulation diagrams (S31, S32 and S33) of multiple transfer devices. Then, the problem is identified by the visual simulation diagrams (S21, S22, S23 and S24) of the first substrate.

[0120] Step 403: Determine the first correspondence between the first substrate and the second substrate based on the first transfer algorithm.

[0121] The first transfer algorithm is used to indicate the rules for transferring at least a portion of the electronic components on the first substrate to the second substrate.

[0122] The details of step 403 are the same as those of step 202 mentioned above, and will not be described in detail here.

[0123] Step 404: Determine the second substrate data of the second substrate based on the first substrate data and the first correspondence relationship, and obtain the visual simulation diagram of the second substrate based on the second substrate data.

[0124] The visual simulation diagram of the second substrate is used to simulate the light-emitting effect of multiple electronic components located on the second substrate.

[0125] The details of step 404 are the same as those in step 203 above, and will not be elaborated here.

[0126] Steps 405 to 408 provide a method for determining whether the uniformity of optical parameters meets the requirements based on optical data, so as to quantify and improve accuracy.

[0127] Step 405: In the visual simulation diagram of the second substrate, determine multiple first partitions.

[0128] The first parameters of electronic components within the same first partition are located within the same parameter range, while the first references of electronic components in different first partitions are located within different parameter ranges. Here, the parameter range can be determined based on the first parameter.

[0129] Optionally, the first parameter includes at least one of the wavelength, brightness, and color coordinates of the light emitted by the electronic component. That is, the first parameter can be a single parameter or a combination of at least two parameters. Taking wavelength as an example, the wavelength can be divided into several wavelength intervals based on the maximum and minimum wavelengths of multiple electronic components in the second substrate. Light-emitting components located in the same wavelength interval are then in the same first partition.

[0130] For example, please refer to Figure 5 The visual simulation diagram S3 of the second substrate may include three first regions: C31, C32 and C33, with the first parameter being the wavelength. The average wavelength of region C31 is 622.1235 nanometers, and the average wavelength of region C32 is 621.6909 nanometers.

[0131] Step 406: Determine whether the difference between the first parameters corresponding to any two adjacent first partitions is less than the first preset value.

[0132] Optionally, the first parameter corresponding to the first partition is the average value of the first parameters of each electronic component within the first partition.

[0133] The smaller the difference in the first parameter between any two adjacent first partitions, the better the uniformity of the optical parameters. The first preset value can be a value of the first parameter preset according to requirements, and the range of the first preset value can be 1 nanometer to 2 nanometers. For example, the first preset value can be 1 nanometer. Please refer to... Figure 5 Regions C31 and C32 are two adjacent first partitions with the most obvious differences, and the wavelength difference between them is 0.4326 nanometers, which is less than the first preset value. The wavelength difference between the corresponding regions in S33 is 0.9714 nanometers. Therefore, this method can also prove that using multiple sorting plates and multiple transfer devices can effectively improve the problem of poor image quality.

[0134] In addition, the first preset value when the second substrate is an intermediate substrate can be greater than the first preset value when the second substrate is a product substrate. That is, the control standard of the sorting sheet can be lower than the control standard of the display module. This is because after the electronic components are transferred to the intermediate substrate, they are transferred to the product substrate. The disorder of the electronic component arrangement can also be improved in various ways. Therefore, sorting sheets with poor disorder can also be used to reduce the waste of raw materials.

[0135] Step 407: After determining that the difference between the first parameters corresponding to any two adjacent first partitions is less than the first preset value, determine that the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements, and execute step 409.

[0136] Step 408: After determining that the difference between the optical parameters of two adjacent first partitions is not less than the first preset value, determine that the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements, and execute step 412.

[0137] Step 409: After the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements, the multiple electronic components are transferred from the first substrate to the second substrate.

[0138] The details of step 409 are the same as those in step 205 above, and will not be described in detail here.

[0139] Step 410: Obtain the position data of multiple electronic components.

[0140] The position data of multiple electronic components includes: position information of multiple electronic components on the first substrate, and position information of multiple electronic components on the second substrate. The position data of multiple electronic components can reflect the actual transfer status of multiple electronic components during the transfer process.

[0141] For example, during the transfer process, if some electronic components are in poor condition or damaged, the transfer device can skip these problematic electronic components and pick up the next one. The position information in the substrate data is obtained based on a preset first transfer algorithm. Therefore, the position information of multiple electronic components on the second substrate and the position information in the second substrate data may differ.

[0142] Optionally, this application can receive position data of multiple electronic components from a transfer device used to transfer multiple electronic components from a first substrate to a second substrate. The transfer device can record the position information of each transferred electronic component on the first substrate and its position information on the second substrate during the transfer process. Alternatively, the position data of the multiple electronic components can also be recorded by other computer devices; this application does not limit this.

[0143] Step 411: Update the second substrate data of the second substrate according to the position data of multiple electronic components, and obtain the updated visual simulation diagram of the second substrate based on the updated second substrate data.

[0144] The updated visual simulation diagram of the second substrate is used to simulate the light-emitting effect of multiple electronic components after transfer. Steps 410 and 411 provide a method for obtaining the updated visual simulation diagram of the second substrate, which can facilitate the elimination of variables existing in the transfer process, thereby improving the accuracy of the light-emitting effect simulated by the visual simulation diagram.

[0145] In addition, the visual simulation diagram of the second substrate before transfer can be compared with the updated visual simulation diagram of the second substrate after transfer. If the two are the same, it can be proven that no problem occurred during the transfer process. If the two are different, it is convenient to check whether there is a problem with the transfer process, such as whether there is a problem with the transfer function or the mixing function of the transfer equipment.

[0146] Step 412: After the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements, determine the adjusted first transfer algorithm and execute step 403.

[0147] In this application, adjusting the first transfer algorithm may include optimizing at least one of the following: the crystal picking algorithm, the crystal placement / bonding algorithm, and the path planning algorithm. Through step 412, the first transfer algorithm can be selected through multiple iterations until a better algorithm is found, thereby improving the yield of the final product.

[0148] The optimized die-picking algorithm can increase the randomness of picking up electronic components from the first substrate; for example, the number of spaced arrangement points can be increased during picking. The optimized die-placement / bonding algorithm can increase the randomness of acquiring electronic components from target arrangement points on the second substrate; for example, the number of spaced target arrangement points can be increased during die-placement / bonding. The optimized path planning algorithm can change the path of the transfer element; for example, the path of the transfer element can be changed from an S-shape to a spiral shape.

[0149] Additionally, adjusting the first transfer algorithm may also include increasing the number of transfer devices or the number of sorting pieces, as detailed in step 402. Figure 5 The corresponding content will not be elaborated upon here.

[0150] This application provides another method for transferring electronic components. The method is also used to transfer multiple electronic components from a first substrate to a second substrate, and then from the second substrate to a third substrate.

[0151] Optionally, the first substrate is the original substrate, the second substrate is the intermediate substrate, and the third substrate is the product substrate.

[0152] Please refer to Figure 6 , Figure 6 This is a flowchart of another electronic component transfer method provided in an embodiment of this application, the method comprising:

[0153] Step 601: Obtain the first substrate data of the first substrate.

[0154] The first substrate data includes optical data and position information of multiple electronic components located on the first substrate.

[0155] The details of step 601 are the same as those of step 201 above, and will not be described in detail here.

[0156] Step 602: Determine the first correspondence between the first substrate and the second substrate based on the first transfer algorithm.

[0157] The first transfer algorithm is used to indicate the rules for transferring at least a portion of the electronic components on the first substrate to the second substrate.

[0158] The details of step 602 are the same as those of step 202 mentioned above, and will not be described in detail here.

[0159] Step 603: Determine the second substrate data of the second substrate based on the first substrate data and the first correspondence relationship, and obtain the visual simulation diagram of the second substrate based on the second substrate data.

[0160] The details of step 603 are the same as those of step 203 mentioned above, and will not be described in detail here.

[0161] Step 604: Based on the visual simulation diagram of the second substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements.

[0162] The visual simulation diagram of the second substrate is used to simulate the light-emitting effect of multiple electronic components located on the second substrate.

[0163] For details regarding step 604, please refer to step 204 above, or steps 405 to 408, which will be omitted here.

[0164] Step 605: After the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements, the multiple electronic components are transferred from the first substrate to the second substrate, and a second transfer algorithm is determined.

[0165] The details of transferring multiple electronic components from the first substrate to the second substrate are described in step 205 above and are omitted here.

[0166] The second transfer algorithm is used to indicate the rules for sequentially transferring each electronic component to the third substrate according to the arrangement order of the multiple electronic components on the second substrate.

[0167] This is because once the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements, it can be determined that the disorder of the electronic component arrangement on the second substrate is sufficient. During the process of transferring electronic components from the second substrate to the third substrate, the electronic components do not need to be mixed. Therefore, the transfer equipment does not need to have the function of mixing electronic components. It only needs to transfer them in the order of arrangement, thereby reducing the requirements for the transfer equipment and reducing the production difficulty.

[0168] Step 606: Determine the second correspondence between the second substrate and the third substrate based on the second transfer algorithm.

[0169] The details of step 606 can be found in step 202 above, where the first correspondence was determined. These details are omitted here.

[0170] Step 607: Determine the third substrate data of the third substrate based on the second substrate data and the second correspondence, and obtain the visual simulation diagram of the third substrate based on the third substrate data.

[0171] The visual simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate.

[0172] The details of step 607 can be found in the description of determining the visual simulation diagram of the second substrate in step 203 above, and will not be elaborated here.

[0173] Step 608: Based on the visual simulation diagram of the third substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements.

[0174] The details of step 608 can be found in step 204 above, which describes the correspondence between the visual simulation diagrams of the second substrate. These details are omitted here.

[0175] Step 609: After the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements, the multiple electronic components are transferred from the second substrate to the third substrate.

[0176] The details of step 609 can be found in step 205 above, which describes the transfer of multiple electronic components from the first substrate to the second substrate. These details are omitted here.

[0177] Step 610: After the uniformity of the light emission effect of multiple electronic components on the second substrate does not meet the requirements, the multiple electronic components are transferred from the first substrate to the second substrate, and a third transfer algorithm is determined.

[0178] The third transfer algorithm is used to indicate the rules for randomly transferring various electronic components from the second substrate to the third substrate according to a random order.

[0179] This is because the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements, which indicates that the arrangement of electronic components on the second substrate is not chaotic enough. However, the second substrate is not the final product. Therefore, during the process of transferring electronic components from the second substrate to the third substrate, a transfer device can be used to mix the electronic components to ensure the image quality of the final product.

[0180] Optionally, the corresponding third transfer algorithm can be determined by combining the transfer rules of different transfer devices. The following three examples illustrate this:

[0181] In a first exemplary embodiment, the transfer device can be a needle-type die bonder. The principle of transferring electronic components using a needle-type die bonder is as follows: a second substrate is placed on top of a third substrate, and multiple electronic components on the second substrate correspond one-to-one with multiple arrangement points on the third substrate, that is, each electronic component on the second substrate corresponds to one arrangement point on the third substrate. During transfer, the needle of the needle-type die bonder pushes the electronic components on the second substrate downwards to the corresponding arrangement points on the third substrate, thereby transferring the electronic components.

[0182] When the needle-type die bonder uses the first mode to transfer electronic components, the second substrate is not moved (or only slightly moved in a limited area to ensure precise alignment and compensate for alignment deviations between the electronic components and their placement points). Therefore, the overall efficiency of transferring electronic components is high, and the first mode can also be called the fast-placing mode. When the needle-type die bonder uses the second mode to transfer electronic components, the second substrate needs to be moved once for each first electronic component transferred. Compared to the first mode, the efficiency of transferring light-emitting chips in the second mode is lower, and the second mode can also be called the slow-placing mode. Therefore, the third transfer algorithm can be determined based on the transfer rules of the first or second mode.

[0183] In a second exemplary embodiment, the transfer device can be a swing-arm die bonder. A swing-arm die bonder is used to transfer electronic components from one substrate to another. Therefore, the third transfer algorithm can be determined based on the pick-up rules and die-bonding rules of the swing-arm die bonder.

[0184] In a third exemplary embodiment, the transfer device can be a laser mass transfer device. Laser transfer devices are used to transfer a large number of electronic components onto a product substrate using laser transfer technology. Therefore, the third transfer algorithm can be determined based on the transfer rules of the laser mass transfer device.

[0185] Since the transfer rules in the three embodiments are different, and the third transfer algorithm determined by them is different, the visual simulation diagram of the third substrate obtained in the end is also different.

[0186] Step 611: Determine the second correspondence between the second substrate and the third substrate based on the third transfer algorithm.

[0187] The relevant content of step 611 can be found in the content of determining the first correspondence in step 202 above, and will not be detailed here.

[0188] Step 612: Determine the third substrate data of the third substrate based on the second substrate data and the second correspondence relationship, obtain the visual simulation diagram of the third substrate based on the third substrate data, and execute step 608.

[0189] The visual simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate.

[0190] The details of step 612 can be found in the description of determining the visual simulation diagram of the second substrate in step 203 above, and will not be elaborated here.

[0191] Step 613: After the uniformity of the light emission effect of multiple electronic components on the second substrate does not meet the requirements, determine the adjusted first transfer algorithm and execute step 602.

[0192] The details of step 613 can be found in step 412 above, and will not be elaborated here.

[0193] It should be noted that steps 610 and 613 are related as OR. If the uniformity of the light emission effect of multiple electronic components on the second substrate does not meet the requirements, only one of steps 610 and 613 needs to be selected.

[0194] This application also provides another method for transferring electronic components; please refer to [link / reference]. Figure 7 , Figure 7 This is a schematic diagram of another electronic component transfer method provided in an embodiment of this application. The method is used to transfer multiple electronic components from the original substrate A1 to an intermediate substrate A2, and then from the intermediate substrate A2 to the product substrate A3. This method can continuously optimize the first transfer algorithm and the second transfer algorithm.

[0195] The sorting process, which involves transferring multiple electronic components from the original substrate A1 (circular wafer) to the intermediate substrate A2 (sorting wafer), can be referenced from [reference needed]. Figure 4 The transfer method is shown. Using this method, the transfer effect can be predicted from the visual simulation diagram of the second substrate A2 before transfer, thereby continuously optimizing the first transfer algorithm. This can further increase the disorder of the arrangement of electronic components on the sorting sheet after transfer, avoiding optical aggregation.

[0196] The die bonding process, which transfers multiple electronic components from the intermediate substrate A2 (sorting wafer) to the product substrate A3 (display substrate), can be referenced. Figure 4The transfer method shown, that is, the sorting process and the die bonding process, can also use the same optimization algorithm. With this transfer method, the transfer effect can be predicted by the visual simulation diagram of the third substrate A3 before the transfer, so that the second transfer algorithm can be continuously optimized, thereby increasing the disorder of the arrangement of electronic components on the display substrate after transfer, avoiding optical aggregation phenomenon, and improving image quality.

[0197] In addition, before determining the better first transfer algorithm and second transfer algorithm, the transfer step can be omitted. In this way, if the final product image quality is poor based on the visual effect simulation diagram of the third substrate A3, the first transfer algorithm can be optimized to avoid the possibility that optimizing only the second transfer algorithm may still not achieve a good image quality.

[0198] In summary, this application provides a method for transferring electronic components. Before transferring multiple electronic components from a first substrate to a second substrate, the method obtains a visual simulation image of the second substrate based on the first substrate data and a first transfer algorithm. The visual simulation image can simulate the light-emitting effect of the transferred electronic components on the second substrate, thereby allowing for an advance prediction of whether the uniformity of the optical parameters of the transferred electronic components meets the requirements. Thus, this method can verify the effectiveness of the transfer method before the electronic components are transferred, reducing the cost of verifying the effectiveness of the transfer method and proactively mitigating the risk of poor image quality, thereby effectively avoiding poor image quality.

[0199] On the other hand, embodiments of this application provide an electronic component transfer device, please refer to... Figure 8 , Figure 8 This is a schematic diagram of an electronic component transfer device provided in an embodiment of this application. The transfer device 800 includes:

[0200] The first acquisition module 810 is used to acquire first substrate data of the first substrate, the first substrate data including optical data and position information of multiple electronic components located on the first substrate;

[0201] The first determining module 820 is used to determine a first correspondence between the first substrate and the second substrate based on a first transfer algorithm, wherein the first transfer algorithm is used to indicate rules for transferring at least a portion of the electronic components on the first substrate to the second substrate.

[0202] The second acquisition module 830 is used to determine the second substrate data of the second substrate according to the first substrate data and the first correspondence relationship, and to acquire the visual effect simulation diagram of the second substrate based on the second substrate data. The visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of multiple electronic components located on the second substrate.

[0203] The second determining module 840 is used to determine whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements based on the visual simulation diagram of the second substrate.

[0204] The transfer module 850 is used to transfer multiple electronic components from the first substrate to the second substrate after the optical parameters of multiple electronic components on the second substrate meet the requirements.

[0205] On the other hand, embodiments of this application provide a computer device, which includes a memory and a processor. The memory stores at least one computer program, which is loaded and executed by the processor to implement any of the methods provided in the above embodiments.

[0206] On the other hand, a computer-readable storage medium is provided, which stores at least one computer program, which is loaded and executed by a processor to implement the method provided in any of the above embodiments.

[0207] On the other hand, a computer program product is provided, including a computer program / instructions that, when executed by a processor, implement the method provided in any of the above embodiments.

[0208] In this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" means two or more, unless otherwise expressly defined.

[0209] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0210] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0211] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0212] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for transferring electronic components, characterized in that, The method for transferring a plurality of said electronic components from a first substrate to a second substrate includes: Acquire first substrate data of the first substrate, the first substrate data including optical data and position information of a plurality of electronic components located on the first substrate; A first correspondence between the first substrate and the second substrate is determined based on a first transfer algorithm, wherein the first transfer algorithm is used to indicate rules for transferring at least a portion of the electronic components on the first substrate to the second substrate; Based on the first substrate data and the first correspondence, the second substrate data of the second substrate is determined, and a visual effect simulation diagram of the second substrate is obtained based on the second substrate data. The visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the multiple electronic components located on the second substrate. Based on the visual simulation diagram of the second substrate, determine whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements. After the optical parameters of the plurality of electronic components on the second substrate meet the requirements, the plurality of electronic components are transferred from the first substrate to the second substrate.

2. The method according to claim 1, characterized in that, The optical data includes a first parameter; based on the visual simulation diagram of the second substrate, determining whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements includes: In the visual simulation diagram of the second substrate, multiple first partitions are defined. The first parameters of electronic components in the same first partition are located in the same parameter range, and the first references of electronic components in different first partitions are located in different parameter ranges. Determine whether the difference between the first parameters corresponding to any two adjacent first partitions is less than a first preset value; After determining that the difference between the first parameters corresponding to any two adjacent first partitions is less than the first preset value, it is determined that the uniformity of the optical parameters of the multiple electronic components on the second substrate meets the requirements. After determining that the difference between the optical parameters of two adjacent first partitions is not less than the first preset value, it is determined that the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements.

3. The method according to claim 2, characterized in that, The first parameter includes at least one of the wavelength, brightness, and color coordinates of the light emitted by the electronic component.

4. The method according to claim 2, characterized in that, The first parameter corresponding to the first partition is the average value of the first parameter of each electronic component within the first partition.

5. The method according to any one of claims 1 to 4, characterized in that, The method further includes: After the uniformity of the optical parameters of multiple electronic components on the second substrate does not meet the requirements, an adjusted first transfer algorithm is determined, and the step of determining the first correspondence between the first substrate and the second substrate based on the first transfer algorithm is executed.

6. The method according to any one of claims 1 to 4, characterized in that, After transferring the plurality of electronic components from the first substrate to the second substrate, the method further includes: The position data of the plurality of electronic components are obtained, including: position information of the plurality of electronic components on the first substrate, and position information of the plurality of electronic components on the second substrate; Based on the position data of the plurality of electronic components, the second substrate data of the second substrate is updated, and an updated visual effect simulation diagram of the second substrate is obtained based on the updated second substrate data. The updated visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the plurality of electronic components after transfer.

7. The method according to any one of claims 1 to 4, characterized in that, After obtaining the first substrate data of the first substrate, the method further includes: A visual simulation image of the first substrate is obtained based on the data of the first substrate. The visual simulation image of the first substrate is used to simulate the light-emitting effect of multiple electronic components on the first substrate.

8. The method according to any one of claims 1 to 4, characterized in that, The first substrate is the original substrate, and the second substrate is the intermediate substrate; Alternatively, the first substrate may be the original substrate, and the second substrate may be the product substrate; Alternatively, the first substrate may be an intermediate substrate, and the second substrate may be a product substrate.

9. The method according to claim 1, characterized in that, The method is further used to transfer a plurality of the electronic components from the first substrate to the second substrate, and then from the second substrate to the third substrate; the method further includes: After the uniformity of the light emission effect of the multiple electronic components on the second substrate meets the requirements, a second transfer algorithm is determined. The second transfer algorithm is used to indicate the rule of sequentially transferring each of the multiple electronic components on the second substrate to the third substrate according to the arrangement order of the multiple electronic components on the second substrate. The second correspondence between the second substrate and the third substrate is determined based on the second transfer algorithm; Based on the second substrate data and the second correspondence, the third substrate data of the third substrate is determined, and a visual effect simulation diagram of the third substrate is obtained based on the third substrate data. The visual effect simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate. Based on the visual simulation diagram of the third substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements. After the optical parameters of the plurality of electronic components on the third substrate meet the requirements, the plurality of electronic components are transferred from the second substrate to the third substrate.

10. The method according to claim 1, characterized in that, The method is further used to transfer a plurality of the electronic components from the first substrate to the second substrate, and then from the second substrate to the third substrate; the method further includes: After the uniformity of the light emission effect of multiple electronic components on the second substrate does not meet the requirements, the multiple electronic components are transferred from the first substrate to the second substrate, and a third transfer algorithm is determined. The third transfer algorithm is used to indicate the rules for randomly transferring each of the multiple electronic components on the second substrate to the third substrate according to the random order of the multiple electronic components on the second substrate. The second correspondence between the second substrate and the third substrate is determined based on the third transfer algorithm; Based on the second substrate data and the second correspondence, the third substrate data of the third substrate is determined, and a visual effect simulation diagram of the third substrate is obtained based on the third substrate data. The visual effect simulation diagram of the third substrate is used to simulate the light-emitting effect of multiple electronic components located on the third substrate. Based on the visual simulation diagram of the third substrate, determine whether the uniformity of the optical parameters of the multiple electronic components on the third substrate meets the requirements. After the optical parameters of the plurality of electronic components on the third substrate meet the requirements, the plurality of electronic components are transferred from the second substrate to the third substrate.

11. The method according to claim 9 or 10, characterized in that, The first substrate is the original substrate, the second substrate is the intermediate substrate, and the third substrate is the product substrate.

12. A light-emitting element transfer device, characterized in that, The transfer device includes: The first acquisition module is used to acquire first substrate data of the first substrate, the first substrate data including optical data and position information of a plurality of electronic components located on the first substrate; A first determining module is used to determine a first correspondence between the first substrate and the second substrate based on a first transfer algorithm, wherein the first transfer algorithm is used to indicate rules for transferring at least a portion of the electronic components on the first substrate to the second substrate. The second acquisition module is used to determine the second substrate data of the second substrate according to the first substrate data and the first correspondence relationship, and to acquire the visual effect simulation diagram of the second substrate based on the second substrate data. The visual effect simulation diagram of the second substrate is used to simulate the light-emitting effect of the multiple electronic components located on the second substrate. The second determining module is used to determine, based on the visual simulation diagram of the second substrate, whether the uniformity of the optical parameters of multiple electronic components on the second substrate meets the requirements. The transfer module is used to transfer the multiple electronic components from the first substrate to the second substrate after the optical parameters of the multiple electronic components on the second substrate meet the requirements.

13. A computer device, characterized in that, The computer device includes a memory and a processor, wherein the memory stores at least one computer program, which is loaded and executed by the processor to implement the method according to any one of claims 1 to 11.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores at least one computer program, which is loaded and executed by a processor to implement the method according to any one of claims 1 to 11.

15. A computer program product comprising a computer program / instructions, characterized in that, When the computer program / instructions are executed by the processor, they implement the method described in any one of claims 1 to 11.

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