Integrated production and manufacturing method of high-reliability layer-adding adhesive film

By controlling the entire process of the additive film for FC-BGA packaging substrate, including adhesive stability control, coating process optimization and oven parameter adjustment, the problems of unstable adhesive storage, difficulty in controlling coating thickness and impurity contamination have been solved, and the production of additive films with high reliability and consistency has been achieved.

CN121666092APending Publication Date: 2026-03-13SHENZHEN NEWFILMS NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-03-13

AI Technical Summary

Technical Problem

Existing adhesive films for FC-BGA packaging substrates suffer from problems during manufacturing, such as poor adhesive storage stability, difficulty in controlling coating thickness precision, high risk of impurity contamination, and difficulty in ensuring production consistency.

Method used

The uniformity of the adhesive solution is controlled by constant temperature storage, low-speed stirring, and solid content/particle size analysis. A closed coating head is used and the coating process is optimized by DOE design. The oven parameters are controlled by orthogonal experiments, and online thickness measurement and impurity detection equipment are used to ensure the stability and consistency of the production process.

Benefits of technology

It achieves full-process production control of high-reliability additive films, improves product stability and consistency, and is suitable for mass production of high-precision electronic packaging materials.

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Abstract

The invention discloses an integrated production and manufacturing method of a high-reliability layer-adding adhesive film, and belongs to the field of flip chip ball grid array packaging substrates. The method comprises the following steps: glue solution storage stability control: carrying out constant-temperature storage, low-speed stirring and solid content / particle size analysis on a solvent type resin mixture containing more than 60% of inorganic filler to ensure uniformity; a closed coating head is adopted, a runner and a glue flowing opening are designed through fluid mechanics, and the coating precision is improved in combination with a DOE experiment (production line vehicle speed and glue feeding speed parameter optimization); drying oven process control: in a thousand-level dust-free drying oven, controlling the temperature / air volume through an orthogonal experiment, synchronously detecting key indexes, and ensuring the performance of the adhesive film and the bonding force of the protective film; and thickness and impurity control: the coating thickness precision of the layer-adding adhesive film is controlled, and a multi-stage filtering system, online thickness measuring equipment and online impurity detecting equipment are adopted to ensure the product quality. By means of the method, reliability and consistency of products are achieved.
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Description

Technical Field

[0001] This invention relates to the field of flip-chip ball grid array packaging substrates, and more particularly to an integrated manufacturing method for a high-reliability additive film. Background Technology

[0002] The overall capacity utilization rate of the flip-chip ball grid array (FC-BGA) packaging substrate industry is gradually recovering, and the industry's demand for high-performance additive films continues to grow. Existing additive films have technical pain points such as high dielectric loss tangent, insufficient glass transition temperature, and insufficient flame retardant properties, which restrict the performance improvement and industrial application of FC-BGA packaging substrates.

[0003] Based on the optimal core formula ratio and preparation process parameters, the manufacturing process was optimized through small-scale and pilot-scale experiments to improve yield and establish a refined control standard for the entire process, so as to achieve high stability and consistency in production and promote the industrialization technology development and practical product application of the add-on film for FC-BGA packaging substrate.

[0004] Therefore, existing technologies still need improvement and development. Summary of the Invention In view of the shortcomings of the prior art, the purpose of this invention is to provide an integrated manufacturing method for high-reliability additive films, aiming to solve the industrialization technical problems of existing additive films for FC-BGA packaging substrates, such as poor storage stability of adhesive solution, difficulty in controlling coating thickness accuracy, high risk of impurity contamination, and difficulty in ensuring production consistency.

[0005] The technical solution of the present invention is as follows: An integrated manufacturing method for a high-reliability additive film includes the following steps: Provide an adhesive solution, wherein the adhesive solution is a solvent-based resin mixture containing more than 60% inorganic filler; Adhesive storage stability control: The storage container containing the adhesive is kept at a constant temperature and the adhesive is continuously stirred at a low speed. The uniformity of the adhesive is characterized by solid content test and image particle size analysis. Coating process optimization: A closed coating head is adopted, and the matching flow channel and glue outlet are designed through fluid dynamics characterization. During the production line verification stage, DOE design is performed on the machine speed and glue feeding speed to obtain the optimal parameter ratio. Oven process control: Orthogonal experimental design was carried out on temperature and air volume in a Class 1000 cleanroom oven to detect the melt viscosity, volatile matter, gelation time and flexibility of the thickened film, and to measure the adhesion between the release film, protective film and thickened film. Thickness and impurity control: The thickness accuracy of the coating film is controlled by adjusting the equipment tension, selecting the coating head, and matching the linkage system. Multi-stage filtration system, online thickness measurement equipment, and online impurity detection equipment are used to ensure product quality.

[0006] Optionally, the mixing head used for mixing may be an emulsifying, dendritic, or multi-head design.

[0007] Optionally, during the process of controlling the storage stability of the adhesive, the state of the adhesive is also determined by periodically testing the gelation time and viscosity of the adhesive.

[0008] Optionally, the DOE design employs orthogonal experimental design or response surface methodology, with machine speed and glue injection speed as variables, and the uniformity of the overlay film thickness and production efficiency as response indicators.

[0009] Optionally, during the production line verification phase, online monitoring equipment is also used to monitor key parameters in the production process in real time to ensure a stable and controllable production environment.

[0010] Optionally, the online impurity detection equipment uses optical imaging technology to identify impurities.

[0011] Optionally, the thickness of the additional adhesive film coating is controlled within a tolerance range of ±1μm.

[0012] Beneficial Effects: This invention provides an integrated manufacturing method for high-reliability laminated adhesive films. It is a full-process production control method for laminated adhesive films (used in FC-BGA packaging substrates, etc.). The core lies in achieving product reliability and consistency through adhesive stability control, coating process optimization, oven parameter control, and thickness / impurity management. Key steps include: Adhesive storage stability control: For solvent-based resin mixtures containing more than 60% inorganic fillers (i.e., adhesive), uniformity is ensured through constant temperature storage, low-speed stirring, and solid content / particle size analysis. Coating process optimization: A closed coating head is used, and the flow channel and dispensing nozzle are designed through fluid dynamics, combined with DOE experiments (optimization of production line speed and adhesive feed rate parameters) to improve coating accuracy. Oven process and performance control: In a Class 1000 cleanroom oven, temperature / airflow is controlled through orthogonal experiments, and key indicators such as melt viscosity and volatile matter are simultaneously detected to ensure adhesive film performance and protective film adhesion. This method achieves product reliability and consistency through full-process parameterized control, combined with material characterization and process verification, and is suitable for mass production of high-precision electronic packaging materials. Detailed Implementation

[0013] This invention provides an integrated manufacturing method for high-reliability laminated films. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0014] This invention achieves product reliability and consistency by controlling the entire production process of the laminated film and combining material characterization and process verification. The following section details an integrated manufacturing method for a high-reliability laminated film provided by this invention.

[0015] Based on the optimal core formula ratio and preparation process parameters, the manufacturing process was optimized through small-scale and pilot-scale experiments to improve yield and establish a refined control standard for the entire process, so as to achieve high stability and consistency in production and promote the industrialization technology development and practical product application of the add-on film for FC-BGA packaging substrate.

[0016] During the manufacturing process, the quality of raw materials is strictly controlled, using high-purity, high-performance materials to ensure product stability from the source. Advanced automated production equipment is employed in the production process to precisely control various process parameters, minimizing the impact of human factors on product quality. Simultaneously, a comprehensive quality inspection system is established to monitor and sample each stage of the production process in real time, ensuring that products meet high quality standards. These measures not only achieve high production stability but also guarantee high consistency between different batches, laying a solid foundation for the industrialization technology and practical application of add-on films for flip-chip ball grid array (FC-BGA) packaging substrates.

[0017] Storage stability of the adhesive solution. The adhesive solution of this invention is a solvent-based resin mixture containing more than 60% inorganic fillers. This special composition necessitates careful attention to environmental conditions during storage. The storage environment should be dry, well-ventilated, and the temperature controlled within a suitable range to prevent excessive solvent evaporation or agglomeration of inorganic fillers, which could affect the performance stability of the adhesive solution. Simultaneously, the storage container should be made of a well-sealed material to prevent external impurities from contaminating the adhesive solution, ensuring that the quality of the adhesive solution remains stable throughout storage and providing a reliable raw material guarantee for subsequent production applications.

[0018] To prevent reactions caused by excessively high surface temperatures, the storage container (such as a storage tank) of the adhesive solution is kept at a constant temperature. Simultaneously, the state of the adhesive solution is determined by periodically monitoring its gelation time and viscosity. The adhesive solution is continuously stirred at low speed. The stirring head in the tank employs an emulsifying, dendritic, multi-head design to ensure sufficient dispersion of the adhesive solution at low speeds and prevent sedimentation. The uniformity of the adhesive solution can be verified by testing its solid content at different heights. Furthermore, image particle size analysis equipment can be used for optical detection of the adhesive solution's state, characterizing the particle shape, size, and distribution of inorganic fillers within the adhesive solution.

[0019] Selection and Design of Coating Head. Given that this invention uses a solvent-based coating, a closed design should be prioritized for the coating head. This effectively avoids problems caused by open designs, such as environmental pollution from solvent evaporation and deviations in coating thickness control. First, the adhesive solution is characterized by hydrodynamics. Then, the rheological curve data is provided to the coating head design company to design a flow channel and nozzle that matches the adhesive solution. During the production line validation phase, Design of Experiments (DOE) is performed on different machine speeds and adhesive feed rates to obtain the optimal parameter ratio, thereby optimizing production efficiency and product quality. Simultaneously, during production line validation, online monitoring equipment is used to monitor key parameters in real time, such as temperature, pressure, and humidity, to ensure a stable and controllable production environment. Multiple performance tests are conducted on the produced laminated film, including tensile strength, peel strength, and heat resistance, to comprehensively evaluate product quality. By collecting and analyzing data from the production line validation phase, the production process is continuously adjusted and optimized to further improve product stability and consistency.

[0020] Oven temperature and airflow optimization. The product of this invention is an additive film, which needs to maintain good flowability and storage properties. This requires that the oven interior maintain a Class 1000 cleanroom environment and be monitored regularly to prevent contamination and reduced insulation reliability of the material. Orthogonal experimental design was used to explore the optimal conditions for temperature and airflow. The basic physical properties of the additive film were determined by testing its melt viscosity, volatile matter, gelation time, and flexibility. Precision tensile testing equipment was used to measure the adhesion strength between the release film, protective film, and additive film, preventing quality issues such as rollover and tearing during application by substrate manufacturers. Thickness and impurity control. By adjusting equipment tension, selecting appropriate coating heads, and debugging and matching the linkage system, the thickness accuracy of the overlay film coating is maintained within a tolerance range of ±1μm. Online thickness measurement equipment continuously monitors thickness data; if the data exceeds the standard, an alarm is immediately triggered and the machine is shut down to prevent defective products from flowing into downstream processes. The coating production line is equipped with a Class 1000 cleanroom environment, with a multi-stage adhesive filtration system installed at the front end. The oven interior adopts a Class 1000 cleanroom design and implements strict control. Additionally, online impurity detection equipment is added at the rear of the production line to prevent defective products from entering subsequent processes. In summary, this invention provides an integrated manufacturing method for high-reliability laminated adhesive films. Key steps include: **Adhesive solution storage stability control:** For solvent-based resin mixtures containing over 60% inorganic fillers (i.e., the adhesive solution), uniformity is ensured through constant-temperature storage, low-speed stirring, and solid content / particle size analysis. **Coating process optimization:** A closed coating head is employed, with fluid dynamics design of the flow channel and dispensing nozzle, combined with DOE experiments (optimization of production line speed and dispensing speed parameters) to improve coating accuracy. **Oven process and performance control:** In a Class 1000 cleanroom oven, temperature / airflow is controlled through orthogonal experiments, while key indicators such as melt viscosity and volatile matter are simultaneously monitored to ensure adhesive film performance and protective film adhesion. This method represents a comprehensive production control approach for laminated adhesive films. Its core lies in achieving product reliability and consistency through adhesive solution stability control, coating process optimization, oven parameter control, and thickness / impurity management. It is suitable for the mass production of high-precision electronic packaging materials.

[0021] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An integrated manufacturing method for a high-reliability laminated film, characterized in that, Includes the following steps: Provide an adhesive solution, wherein the adhesive solution is a solvent-based resin mixture containing more than 60% inorganic filler; Adhesive storage stability control: The storage container containing the adhesive is kept at a constant temperature and the adhesive is continuously stirred at a low speed. The uniformity of the adhesive is characterized by solid content test and image particle size analysis. Coating process optimization: A closed coating head is adopted, and the matching flow channel and glue outlet are designed through fluid dynamics characterization. During the production line verification stage, DOE design is performed on the machine speed and glue feeding speed to obtain the optimal parameter ratio. Oven process control: Orthogonal experimental design was carried out on temperature and air volume in a Class 1000 cleanroom oven to detect the melt viscosity, volatile matter, gelation time and flexibility of the thickened film, and to measure the adhesion between the release film, protective film and thickened film. Thickness and impurity control: The thickness accuracy of the coating film is controlled by adjusting the equipment tension, selecting the coating head, and matching the linkage system. Multi-stage filtration system, online thickness measurement equipment, and online impurity detection equipment are used to ensure product quality.

2. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, The mixing head used is designed for emulsification, dendritic, or multiple mixing heads.

3. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, During the process of controlling the storage stability of the adhesive, the gelation time and viscosity of the adhesive are also tested periodically to determine the state of the adhesive.

4. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, The DOE design employs orthogonal experimental design or response surface methodology, with machine speed and glue injection speed as variables, and the uniformity of the overlay film thickness and production efficiency as response indicators.

5. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, During the production line verification phase, online monitoring equipment is also used to monitor key parameters in the production process in real time to ensure a stable and controllable production environment.

6. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, Online impurity detection equipment uses optical imaging technology to identify impurities.

7. The integrated manufacturing method for the high-reliability laminated film according to claim 1, characterized in that, The thickness of the adhesive film coating is precisely controlled within the tolerance range of ±1μm.