Method for manufacturing probe head manufactured by superposing probe pins

Abstract

The present invention relates to a method for manufacturing a probe, and more particularly, to a method for manufacturing a probe and a probe, which can finely adjust the pitch between pins by superposing the probe pins and can freely form the length and shape of the probe pins. A method for manufacturing a probe according to an embodiment of the present invention includes a first photoresist forming step, a first elastic layer forming step, a hollow forming step, a first pin forming step, a second elastic layer superimposing step, a layer superimposing step, a second photoresist forming step, and a sacrificial layer removing step. The present invention also provides a probe manufactured by performing the steps of the manufacturing method. According to the present invention, a probe having a fine pitch can be manufactured, a probe capable of simultaneously inspecting a plurality of devices can be provided, and the shape of a probe pin can be easily and freely formed. In addition, since the probe pins are vertically formed and wiring is easy, more probe pins can be formed in the same area, so that the density of the probe pins can be improved, and the probe pins can be easily connected to a probe station.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a probe, specifically, a method for manufacturing a probe that can finely adjust the spacing between probe pins by stacking probe pins and can freely form the length and shape of the probe pins. Background Technology

[0002] After the electrical device is manufactured, testing equipment needs to be connected to it to test its electrical characteristics. While it is possible to simply connect the testing equipment to the electrodes of the electrical device for testing, manual testing of each device during mass production is time-consuming and costly. Therefore, probes that provide electrical connection through mechanical contact with the electrical device have been developed and are now in use.

[0003] With the development of technology, the integration of circuits has increased, the size of electrical devices has become smaller and smaller, and the size and spacing of electrodes have also been reduced to units below micrometers. Therefore, the corresponding probes also need to be reduced to tiny sizes.

[0004] However, probe pins manufactured using existing technology are typically produced by growing the probe pins along their length, which makes it difficult to freely manufacture the shape of the probe pins and also presents the problem of difficulty in finely forming the gaps, or pin pitch, between the probe pins. Summary of the Invention

[0005] Technical issues One object of the present invention is to manufacture a probe with a fine pitch.

[0006] Another object of the present invention is to provide a probe capable of simultaneously inspecting multiple devices.

[0007] Another object of the present invention is to provide a method for manufacturing a probe in which the shape of the probe pin can be easily and freely formed.

[0008] Solution to the problem The present invention provides a method for manufacturing a probe, comprising: a first elastic layer forming step, forming a first elastic layer; a first pin forming step, forming one or more first probe pins on the upper surface of the first elastic layer; and a second elastic layer stacking step, forming a second elastic layer on the first elastic layer on which the first probe pins are formed.

[0009] Furthermore, the present invention provides a method for manufacturing a probe, which includes a second pin forming step of forming one or more second probe pins on the upper surface of a second elastic layer.

[0010] Furthermore, the present invention provides a method for manufacturing a probe, which further includes a layer stacking step of repeatedly stacking a layer composed of a pin layer and an elastic layer by repeating the first pin forming step and the second elastic layer stacking step a predetermined number of times.

[0011] In addition, the present invention provides a method for manufacturing a probe, wherein the first pin forming step is achieved by arranging the first probe pins in parallel on a plane on the upper surface of the first elastic layer.

[0012] In addition, the present invention provides a method for manufacturing a probe, wherein, in the first pin forming step, the gap between the other ends of the first probe pin, i.e., the second gap, is larger than the first gap between one end of the first probe pin, and the first probe pin is formed in a shape in which one end is connected to the other end.

[0013] In addition, the present invention provides a method for manufacturing a probe, wherein, in the first pin forming step, the first probe pin is formed such that one end and the other end are rod-shaped, and its center has an impact absorption structure for absorbing impact.

[0014] In addition, the present invention provides a method for manufacturing a probe, wherein, in the first elastic layer forming step and the second elastic layer stacking step, elastic sacrificial layers are formed at both ends of the first probe pin.

[0015] In addition, the present invention provides a method for manufacturing a probe, wherein, before the first elastic layer forming step, a first photoresist forming step is further included, in which a first photoresist including a first sacrificial layer is formed at both ends of the first probe pin; and after the second elastic layer stacking step, a second photoresist forming step is further included, in which a second photoresist including a second sacrificial layer is formed at both ends of the first probe pin.

[0016] In addition, the present invention provides a method for manufacturing a probe, which further includes a sacrificial layer removal step for removing the elastic sacrificial layer.

[0017] The present invention provides a method for manufacturing a probe, which further includes a sacrificial layer removal step of removing a first sacrificial layer and a second sacrificial layer.

[0018] In addition, the present invention provides a method for manufacturing a probe, wherein a first elastic layer forming step is performed on the upper surface of a substrate, and before or after the first elastic layer forming step, a hollow forming step is further included in forming one or more hollow structures on the lower surface of the substrate.

[0019] The present invention provides a probe comprising: a first elastic layer; one or more first probe pins formed on the upper surface of the first elastic layer; and a second elastic layer formed on the first elastic layer having the first probe pins.

[0020] In addition, the present invention provides a probe comprising one or more second probe pins formed on the upper surface of a second elastic layer.

[0021] In addition, the present invention provides a probe in which a layer consisting of a first probe pin and a second elastic layer is repeatedly stacked a predetermined number of times.

[0022] Furthermore, the present invention provides a probe in which first probe pins are arranged in parallel on a plane on the upper surface of a first elastic layer.

[0023] In addition, the present invention provides a probe in which the gap between the other ends of the first probe pin, i.e., the second gap, is larger than the first gap between the first ends of the first probe pin, and the first probe pin is formed in a shape in which one end is connected to the other end.

[0024] In addition, the present invention provides a probe in which a first probe pin is formed such that one end and the other end are rod-shaped, and its center has an impact absorption structure for absorbing impact.

[0025] In addition, the present invention provides a probe in which elastic sacrificial layers are formed at both ends of the first probe pin in the first elastic layer and the second elastic layer.

[0026] In addition, the present invention provides a probe, which further includes: a first photoresist, including a first sacrificial layer formed at both ends of a first probe pin on the lower surface of a first elastic layer; and a second photoresist, including a second sacrificial layer formed at both ends of a first probe pin on the upper surface of a second elastic layer.

[0027] In addition, the present invention provides a probe in which an elastic sacrificial layer is removed.

[0028] In addition, the present invention provides a probe in which a first sacrificial layer and a second sacrificial layer are removed.

[0029] In addition, the present invention provides a probe in which a first elastic layer is formed on the upper surface of a substrate, and one or more hollows are formed on the lower surface of the substrate.

[0030] Invention Effects According to the present invention, a probe with a fine pitch can be manufactured.

[0031] Alternatively, a probe capable of simultaneously inspecting multiple devices can be provided.

[0032] Alternatively, a method for manufacturing a probe that allows for easy and free shaping of the probe pin can be provided.

[0033] In addition, because the probe pins are formed vertically, wiring is easy, so more probe pins can be formed in the same area, thereby increasing the density of probe pins and making it easy to connect to the probe station. Attached Figure Description

[0034] Figure 1A diagram of a probe used to illustrate a method for manufacturing a probe according to an embodiment of the present invention.

[0035] Figure 2 A perspective view of a probe according to an embodiment of the present invention is shown.

[0036] Figure 3 A flowchart illustrating a method for manufacturing a probe according to an embodiment of the present invention.

[0037] Figure 4 A perspective view of a probe according to an embodiment of the present invention is shown.

[0038] Figure 5 A diagram illustrating the formation of a substrate sacrificial layer according to an embodiment of the present invention.

[0039] Figure 6 A diagram illustrating the steps of forming a first photoresist according to an embodiment of the present invention.

[0040] Figure 7 A diagram illustrating the steps of forming a first sacrificial layer on a first photoresist according to an embodiment of the present invention.

[0041] Figures 8 to 13 A diagram illustrating the first elastic layer forming step of forming an elastic sacrificial layer according to an embodiment of the present invention.

[0042] Figure 14 A diagram illustrating the first pin forming step according to an embodiment of the present invention.

[0043] Figure 15 A diagram illustrating the second elastic layer formation step according to an embodiment of the present invention.

[0044] Figure 16 A diagram illustrating the layer stacking steps according to an embodiment of the present invention.

[0045] Figure 17 A diagram illustrating the steps of forming a second photoresist according to an embodiment of the present invention.

[0046] Figure 18 A diagram illustrating the sacrificial layer removal steps according to an embodiment of the present invention.

[0047] Figure 19 A diagram illustrating the state in which a probe pin is formed on a plane according to an embodiment of the present invention.

[0048] Figure 20 A diagram illustrating a probe pin including an impact-absorbing structure according to an embodiment of the present invention.

[0049] Figure 21A diagram illustrating the hollow formation step according to an embodiment of the present invention.

[0050] Figure 22 A perspective view of a substrate implementing the hollow formation step according to an embodiment of the present invention, viewed from bottom to top. Detailed Implementation

[0051] The best way to implement the invention The present invention provides a method for manufacturing a probe, comprising: a first elastic layer forming step, forming a first elastic layer; a first pin forming step, forming one or more first probe pins on the upper surface of the first elastic layer; and a second elastic layer stacking step, forming a second elastic layer on the first elastic layer on which the first probe pins are formed. The present invention also provides a probe comprising: a first elastic layer; one or more first probe pins formed on the upper surface of the first elastic layer; and a second elastic layer formed on the first elastic layer on which the first probe pins are formed.

[0052] Methods for implementing the invention Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings to enable those skilled in the art to easily implement the present invention. The present invention can be implemented through various different methods and is not limited to the embodiments disclosed below. Furthermore, in order to clearly disclose the present invention in the drawings, parts unrelated to the present invention have been omitted, and the same or similar reference numerals have been used for the same or similar components in the drawings.

[0053] The objectives and effects of this invention will naturally be understood or become clearer from the following description, but the objectives and effects of this invention are not limited to the following description.

[0054] The objectives, features, and advantages of the present invention will become clearer from the following detailed description. Furthermore, in describing the present invention, detailed descriptions of relevant prior art may be omitted where it is deemed unnecessary to obscure the essence of the invention. Hereinafter, embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0055] Figure 1 A diagram of a probe used to illustrate a method for manufacturing a probe according to an embodiment of the present invention. Figure 2 A perspective view of a probe according to an embodiment of the present invention is shown. Figure 3 A flowchart illustrating a method for manufacturing a probe according to an embodiment of the present invention. Figure 4 A perspective view of a probe according to an embodiment of the present invention is shown. (Refer to...) Figures 1 to 4A method for manufacturing a probe 10 according to an embodiment of the present invention includes: a first photoresist formation step (S10), a first elastic layer formation step (S20), a hollow layer formation step (S30), a first pin formation step (S40), a second elastic layer stacking step (S50), a layer stacking step (S60), a second photoresist formation step (S70), and a sacrificial layer removal step (S80). Each step will be described in detail below.

[0056] Figure 4 A perspective view of a probe 10 according to an embodiment of the present invention is shown. (Refer to...) Figure 4 The probe 10 may include multiple probe pins and may include a first photoresist 300 and a second photoresist 700 located above and below the multiple probe pins. In this case, the length direction of the probe pins is defined as the y-axis direction, the pin layers are stacked in the vertical direction of the substrate 100, as described above, the vertical direction of the substrate 100 is defined as the z-axis direction, and multiple probe pins may be arranged horizontally to each other in the pin layers, as described above, the direction in which the probe pins are arranged in the pin layers is defined as the x-axis direction. On the other hand, Figures 5 to 18 For along Figure 3 The cross-sectional view shown by the arrow in the image is used to illustrate the superposition process. Figure 19 and Figure 20 This is a diagram viewed from the z-axis direction.

[0057] The substrate sacrificial layer formation step is the step of forming a substrate sacrificial layer 200 on the substrate 100. (Refer to...) Figure 5 It can be confirmed that the substrate sacrificial layer 200 is formed on the substrate 100 by performing the substrate sacrificial layer formation step. At this time, the substrate 100 can be various types of wafers, and the substrate sacrificial layer 200, as a sacrificial layer, is configured to be eventually removed to separate the probe 10 from the substrate 100. Therefore, it can be made of various materials used for sacrificial layers, but in one embodiment of the present invention, aluminum is used as an example for illustration.

[0058] When the substrate sacrificial layer 200 is formed in this way, the probe 10 can eventually be separated from the substrate 100 by the sacrificial layer removal step (S80). Based on the substrate sacrificial layer 200, components for constituting the probe 10 can be stacked thereon.

[0059] On the other hand, the above-mentioned substrate sacrificial layer formation step can be performed before the first photoresist formation step. The above-mentioned substrate sacrificial layer can be removed by forming a hollow in the substrate through the hollow formation step (S30), which will be described in detail below.

[0060] The first photoresist formation step (S10) is a step performed between the substrate sacrificial layer formation step and the first elastic layer formation step (S20), and is a step of coating the first photoresist 300 onto the substrate sacrificial layer 200. The first photoresist formation step (S10) includes the steps of coating the photoresist onto the substrate sacrificial layer 200 and forming the first sacrificial layer 310. Figure 6 This illustrates the steps of coating a first photoresist 300 onto the substrate sacrificial layer 200. Figure 7 The image represents the exposed area in the center and the non-exposed areas at both ends of the first photoresist 300. After the first photoresist 300 is coated, it is cured by exposing the exposed areas. Figure 6 The first photoresist 300, consisting only of the first photoresist 300, is as follows: Figure 7 The image shows a first photoresist 300 in the center and a first sacrificial layer 310 on both sides.

[0061] At this point, a method can be used to coat multiple layers of the first photoresist 300 to form the desired thickness by repeating the coating step at least once, or a method of coating a single layer of photoresist can be used. However, the multilayer coating method can effectively form the first photoresist 300 at various thicknesses, and is therefore advantageous.

[0062] On the other hand, various types of photoresists can be used as the aforementioned photoresist, but in one embodiment of the present invention, SU-8, which is an epoxy-negative photoresist, will be used as an example. When a positive photoresist is used, the same result can be obtained by reversing the exposure area and the non-exposure area and performing the above steps.

[0063] As described above, if the first photoresist 300 is formed through the first photoresist formation step (S10), the first probe pin 500 to be superimposed can be protected, and the thickness of the first photoresist 300 can be effectively adjusted. Finally, by removing the non-exposed portion, the two ends of the first probe pin 500 protrude.

[0064] The first elastic layer formation step (S20) is the step of depositing an elastic layer 400 on the substrate 100.

[0065] The first elastic layer formation step (S20) is divided into an elastic sacrificial layer 410 preparation step and a deposition step. The elastic sacrificial layer 410 preparation step is the step of preparing the elastic sacrificial layer 410 as the basis for subsequent elastic sacrificial layer formation steps. The elastic sacrificial layer 410 preparation step is illustrated with reference to... Figures 8 to 9 , Figure 8 A diagram illustrating the state of the deposited elastic sacrificial layer 410, Figure 9This illustrates a state where only the elastic sacrificial layer 410 in the non-exposed area is left after etching the elastic sacrificial layer 410 in the exposed area.

[0066] Then, the first elastic layer 400 is deposited by performing a deposition step. Figure 10 The state of the first elastic layer 400 is shown. Referring to this, when the first elastic layer 400 is deposited by the deposition step, the first elastic layer 400 covers the upper part of the elastic sacrificial layer 410 and the first photoresist 300. On the other hand, in the first elastic layer forming step (S20), the first elastic layer 400 may be deposited on the substrate 100, or only the first elastic layer 400 may be provided. When the substrate sacrificial layer forming step is performed before the first elastic layer forming step (S20), the first elastic layer 400 may be deposited on the substrate sacrificial layer 200. When other steps have been performed in advance, the first elastic layer 400 may be deposited on the structure formed on the substrate 100 after the relevant steps are completed.

[0067] The elastic sacrificial layer forming step involves forming one end of the first elastic layer 400 as the sacrificial layer. However, in the elastic sacrificial layer forming step, a sacrificial layer is formed not only at one end of the first elastic layer 400 but also at the other end, thereby enabling the provision of elastic sacrificial layers 410 at both ends. Figures 10 to 13 The description is based on the formation of sacrificial layers at both ends; the following explanation will be based on the formation of sacrificial layers at the end.

[0068] Figure 10 A diagram showing the state after the first elastic layer formation step (S20) is completed. Figures 11 to 13 A diagram illustrating the sequential steps of forming the elastic sacrificial layer. Figure 11 The diagram shows the state in which the elastic layer photoresist 420 is deposited on the exposed area of ​​the first elastic layer 400. Subsequently, during dry etching, the elastic layer photoresist 420 and the first elastic layer 400 are etched together. When the first elastic layer 400 in the non-exposed area is completely etched, exposing the elastic sacrificial layer 410, the etching stops, thus forming a state as shown. Figure 12 The shape shown. Next, an elastic sacrificial layer 410 is deposited until the heights of the first elastic layer 400 and the elastic sacrificial layer 410 are the same, and then lift-off is performed to remove the elastic layer photoresist 420, as shown. Figure 13 As shown, the first elastic layer 400 and the elastic sacrificial layer 410 have the same height.

[0069] On the other hand, the elastic sacrificial layer 410 can be made of various materials or substances capable of forming a sacrificial layer, but in one embodiment of the present invention, it is described based on a layer made of aluminum. As described above, when the elastic sacrificial layer 410 is formed in the non-exposed area, the probe pins can eventually be made to protrude at both ends by removing the non-exposed area.

[0070] As described above, by performing the elastic sacrificial layer forming step, a probe characterized by the formation of an elastic sacrificial layer 410 at both ends of the first probe pin 500 by the first elastic layer 400 and the second elastic layer 600 can be manufactured.

[0071] The first pin forming step (S40) is a step of forming a pin layer by depositing a plurality of first probe pins 500 on a plane of the upper surface of the first elastic layer 400. (Refer to...) Figure 14 It can be confirmed that multiple pins are formed on the plane of the upper surface of the first elastic layer 400. Specifically, the multiple first probe pins 500 are arranged parallel to each other along the y-axis with the x-axis as the length direction, forming a layer called the probe pin layer. In the first pin forming step (S40) of arranging the probe pins, the pin layer composed of multiple first probe pins 500 can be formed by etching or stripping processes.

[0072] On the other hand, refer to Figure 19 and Figure 20 When the first probe pin 500 is viewed from top to bottom on the z-axis, its shape can have various patterns such as bending or arc. As described above, multiple first probe pins 500 are deposited in a manner that allows them to lie flat along the length of a plane, thus making it easy to change the shape of the first probe pins 500. Furthermore, since the pins are formed on a plane, the spacing between the pins can be freely adjusted, making it easy to achieve fine spacing.

[0073] at this time, Figure 19 Examples are shown of various ways the pin shape can be formed in the first pin forming step. A probe can be manufactured with a shape such that the gap between the other ends, i.e., the second gap 520, is larger than the first gap 510 between the first ends of the first probe pin 500, and the one end and the other end of the first probe pin 500 are connected to each other. In this case, one end and the other end of the first probe pin 500 can have a partially straight section so that when in contact with the testing equipment or the object to be tested, if in perpendicular contact, it is subjected to force in the vertical direction and absorbs impact. Impact absorption can be achieved by changing the structure between one end and the other end. Referring to... Figure 19 One end and the other end form a cantilever beam-like structure, connected diagonally, thereby dispersing the force when subjected to vertical force. However, the invention is not limited to this. Figure 19The example provided can also have one end and the other end of the first probe pin 500 having various shapes and different connection spacings. Furthermore, as described above, if the spacing between the first probe pins 500 is narrower at one end and wider at the other end, even if a narrow spacing is provided at one end for contacting the object to be tested, the wider spacing at the other end allows the probe pins to be easily connected to inspection equipment, etc.

[0074] As described above, a probe can be manufactured, characterized in that the gap between the other ends of the first probe pin 500, i.e., the second gap 520, is larger than the first gap 510 between the first ends of the first probe pin 500, and the first probe pin 500 is formed in a shape in which one end is connected to the other end.

[0075] Additionally, refer to Figure 20 The first probe pin 500 can be formed as a rod-shaped structure at one and the other ends, with an impact-absorbing structure 540 in the center. The impact-absorbing structure 540 utilizes various shapes to absorb the impact received when the first probe pin 500 contacts the object under test. Since the first probe pin 500 is formed on a plane, it can have various shapes. (Refer to...) Figure 20 Examples of various shapes of the impact-absorbing structure 540 are given, but the invention is not limited thereto, and various shapes that can effectively absorb impacts can also be formed in the first probe pin 500.

[0076] As described above, the probe is characterized in that, as a method of utilizing the shape of the first probe pin 500, one end and the other end of the first probe pin 500 are rod-shaped, and its central portion has an impact absorption structure 540 for absorbing impact.

[0077] Figure 15 The diagram illustrates a step (S50) of performing a second elastic layer stacking on a pin layer according to an embodiment of the present invention. The second elastic layer stacking step (S50) is a step of stacking a second elastic layer 600 by repeating the same method as the first elastic layer forming step (S20) described above, wherein a first probe pin 500 is arranged on the first elastic layer, and a second elastic layer is stacked thereon, so that the first elastic layer 400 and the second elastic layer 600 form an elastic layer surrounding the first probe pin 500.

[0078] When the second elastic layer 600 is arranged in this way, the pin layer is not exposed to the outside because it surrounds the first probe pin 500, and the first probe pin 500 can be protected and insulated from the outside because the elastic layer surrounds the first probe pin 500. When the first probe pin 500 surrounded by the elastic layer is subjected to external force, the force can be dispersed to prevent damage to the first probe pin 500.

[0079] On the other hand, after the aforementioned first elastic layer forming step (S20), first pin forming step (S40), and second elastic layer stacking step (S50), a probe can be manufactured, characterized in that it includes: a first elastic layer 400; one or more first probe pins 500 formed on the upper surface of the first elastic layer 400; and a second elastic layer formed on the first elastic layer 400 on which the first probe pins 500 are formed. Furthermore, a probe can be manufactured, characterized in that it is formed by arranging the first probe pins 500 in parallel on a plane of the upper surface of the first elastic layer 400.

[0080] However, refer to Figure 1 and Figure 2 It can be confirmed that the second pin forming step, which involves forming one or more second probe pins 550 on the upper surface of the second elastic layer 600, is performed after the second elastic layer 600 is stacked. This differs from the layer stacking step (S60) described below, showing a form where the step is completed after the formation of the second probe pin 550. If the second elastic layer stacking step (S50) is repeated after the second probe pin forming step, layers can be stacked in the same manner as in the layer stacking step (S60). However, when the second probe pin 550 is formed in this manner, various methods can be used, such as stacking a new layer on the second probe pin 550 or combining connectable components. Alternatively, the second probe pin 550 can be formed after the layer stacking step (S60), thus ending the step in a state where probe pins are formed on multiple layers.

[0081] On the other hand, by performing the above-described second probe pin forming step, a probe can be manufactured, characterized in that it includes one or more second probe pins 550 formed on the upper surface of the second elastic layer 600.

[0082] Figure 16 A diagram illustrating the layer stacking step (S60) according to an embodiment of the present invention. (Refer to...) Figure 16 An embodiment of the present invention further includes a layer stacking step (S60) in which the layer consisting of the pin layer and the elastic layer is stacked repeatedly by repeating the first pin forming step (S40) and the second elastic layer stacking step (S50) a predetermined number of times. Figure 16The diagram shows that after the second elastic layer stacking step (S50), the first pin forming step (S40) and the second elastic layer stacking step (S50) are repeated twice, thereby adding two extra layers to the original one-layer structure, forming a total three-layer structure. On the other hand, when observing the arrangement of the probe pins provided on the probe 10, if the number of pins arranged parallel in the x-axis direction is the number of rows, then the total number of pin layers formed by repeating the layer stacking step (S60) a predetermined number of times in the z-axis direction is the number of columns. That is, the predetermined number of repetitions in the layer stacking step (S60) determines the number of rows or columns of the probe (10), and should be determined according to the number of rows or columns of the probe 10 to be manufactured.

[0083] On the other hand, when performing the above-described layer stacking step (S60), a probe can be manufactured, characterized in that the layers consisting of the first probe pin 500 and the second elastic layer 600 are repeatedly stacked a predetermined number of times.

[0084] As described above, when the second elastic layer stacking step (S50) is performed after the first pin forming step (S40), the elastic layer surrounds the pin. At this time, when the pin layer is stacked along the z-axis direction through the first pin forming step (S40) and the second elastic layer stacking step (S50), the thickness of the second elastic layer 600 deposited between the pins determines the spacing between the pins. Therefore, the spacing between the pins can be adjusted by adjusting the thickness of the second elastic layer 600, thereby forming a fine spacing.

[0085] On the other hand, refer to Figure 17 When multiple pin layers are stacked as described above, a second photoresist forming step (S70) may be further included, which is a step of coating a second photoresist 700 on an elastic layer. Figure 17 A diagram showing the state after the second photoresist formation step (S70) has been performed, wherein a second photoresist 700 and a second sacrificial layer 710 are superimposed on the elastic layer.

[0086] The second photoresist formation step (S70) is formed by the same process as the first photoresist formation step (S10) described above. The probe 10 may include both the first photoresist 300 and the second photoresist 700, or it may not include either photoresist, or it may include only one of the first photoresist 300 and the second photoresist 700.

[0087] As described above, when the second photoresist 700 is formed by further including a second photoresist forming step (S70), the probe pin can be protected from external impacts. When the first photoresist 300 and the second photoresist 700 are included simultaneously, the first photoresist and the second photoresist 700 are formed on both ends of the probe 10 along the z-axis direction, thereby effectively protecting the probe pin from external impacts, etc.

[0088] As described above, by performing the first photoresist formation step (S10) and the second photoresist formation step (S70), a probe can be manufactured, characterized in that it includes: a first photoresist 300, including a first sacrificial layer 310 formed at both ends of the first probe pin 500 on the lower surface of the first elastic layer 400; and a second photoresist 700, including a second sacrificial layer 710 formed at both ends of the first probe pin 500 on the upper surface of the second elastic layer 600.

[0089] The sacrificial layer removal step (S80) is the step of removing the elastic sacrificial layer 410. However, referring to... Figure 18 This is a step to remove all sacrificial layers except for the elastic sacrificial layer 410. However, if only the elastic sacrificial layer 410 exists as a sacrificial layer, then only the elastic sacrificial layer 410 can be removed. Therefore, the sacrificial layer removal step (S80) is a step to remove all elastic sacrificial layers 410, substrate sacrificial layer 200, first sacrificial layer 310, and second sacrificial layer 710. The sacrificial layer removal step (S80) can employ various methods capable of removing sacrificial layers, such as etching.

[0090] As described above, by performing the sacrificial layer removal step (S80), a probe characterized by removing the elastic sacrificial layer 410 can be manufactured, and a probe characterized by removing the first sacrificial layer 310 and the second sacrificial layer 710 can also be manufactured.

[0091] On the other hand, refer to Figure 21 and Figure 22 The hollowing step may be performed before or after the first elastic layer forming step (S20), which involves forming one or more hollows 110 on the lower surface of the substrate. However, it is preferable to perform the hollowing step (S30) after the substrate sacrificial layer forming step, but if the substrate sacrificial layer or elastic layer can be formed on the substrate after the hollows 110 are formed in the substrate 100, the hollowing step (S30) may be performed first. Figure 21 This is a cross-sectional view showing the hollow space 110 formed in the substrate 100. Figure 22This is a perspective view of the substrate 100 with hollow 110 formed, viewed from bottom to top. As described above, one or more hollow 110s can be formed, and in addition to a grid shape, hollow 110s can be arranged in various ways. The hollow 110s can be formed using a laser hole-making method or a physical drilling method. However, the physical method has the problem of generating foreign matter, so the laser hole-making method is preferred.

[0092] On the other hand, the hollow 110 formed in this way can be used to remove the substrate sacrificial layer 200 in the sacrificial layer removal step (S80). If the substrate sacrificial layer 200 is removed by injecting a solution or the like that capable of removing the substrate sacrificial layer 200 into the hollow 110 to melt the substrate sacrificial layer 200, the substrate 100 can be separated, thereby ensuring that the probe 10 formed on the substrate 100 is stacked.

[0093] Even without the formation of the hollow 110, the solution of the substrate sacrificial layer 200 can be removed by partially exposing the substrate sacrificial layer 200 on the side, or the substrate can be peeled off by physical means. However, if the hollow 110 is formed, the contact area for removing the solution of the substrate sacrificial layer 200 can be maximized, and damage to the probe 10 that may be caused when physically peeling off the substrate 100 can be prevented.

[0094] As described above, a probe can be manufactured by performing a hollow forming step, characterized in that a first elastic layer 400 is formed on the upper surface of the substrate 100, and one or more hollows 110 are formed on the lower surface of the substrate 100.

[0095] On the other hand, the above steps include forming a sacrificial layer at one or both ends, where one end and the other end are the parts where the probe pin is connected to the inspection equipment or the object to be tested. The above steps are used for one part to protrude or both ends to protrude. The form where both ends protrude is conducive to contacting the inspection equipment or the object to be tested. However, depending on the situation, it is also possible to manufacture the probe 10 in a way that does not protrude at one end in order to avoid interference or contact between the pins. It is even possible to choose to make both ends not protrude.

[0096] The preferred embodiments of the present invention described above are disclosed for illustrative purposes. Those skilled in the art can make various modifications, alterations, and additions within the spirit and scope of the present invention, and these modifications, alterations, and additions should be considered to be included within the scope of the appended claims. Those skilled in the art can make various substitutions, modifications, and alterations without departing from the technical spirit of the present invention. Therefore, the present invention is not limited to the above embodiments and drawings.

[0097] Although the foregoing exemplary system has been described based on a flowchart listing steps or blocks in sequence, the steps of the present invention are not limited to a specific order. Therefore, specific steps may be performed in different steps, in a different order, or simultaneously with the steps described above. Furthermore, those skilled in the art will understand that the steps in the flowchart are not exclusive. Instead, another step may be included therein, or one or more steps of the flowchart may be omitted within the scope of the present invention.

[0098] Industrial applicability According to the present invention, a probe with a fine pitch can be manufactured.

[0099] Alternatively, a probe capable of simultaneously inspecting multiple devices can be provided.

[0100] Alternatively, a method for manufacturing a probe that allows for easy and free shaping of the probe pin can be provided.

Claims

1. A method for manufacturing a probe, characterized in that, include: First elastic layer forming step (S20), forming the first elastic layer (400); In the first pin forming step (S40), one or more first probe pins (500) are formed on the upper surface of the first elastic layer (400); and In the second elastic layer stacking step (S50), a second elastic layer (600) is formed on the first elastic layer (400) on which the first probe pin (500) is formed.

2. The method for manufacturing the probe according to claim 1, characterized in that, The second pin forming step includes forming one or more second probe pins (550) on the upper surface of the second elastic layer (600).

3. The method for manufacturing the probe according to claim 1, characterized in that, It also includes a layer stacking step (S60) in which the layers consisting of the pin layer and the elastic layer are stacked repeatedly by repeating the first pin forming step (S40) and the second elastic layer stacking step (S50) a predetermined number of times.

4. The method for manufacturing the probe according to claim 1, characterized in that, The first pin forming step (S40) is achieved by arranging the first probe pins (500) in parallel on the plane of the upper surface of the first elastic layer (400).

5. The method for manufacturing the probe according to claim 1, characterized in that, In the first pin forming step (S40) described above, the gap between the other ends of the first probe pin (500), i.e. the second gap (520), is larger than the first gap (510) between the first ends of the first probe pin (500), and the first probe pin (500) is formed in a shape in which one end is connected to the other end.

6. The method for manufacturing the probe according to claim 1, characterized in that, In the first pin forming step (S40) described above, the first probe pin (500) is formed such that one end and the other end are rod-shaped, and its center has an impact absorption structure (540) for absorbing impact.

7. The method for manufacturing the probe according to claim 1, characterized in that, In the first elastic layer forming step (S20) and the second elastic layer superposition step (S50) described above, elastic sacrificial layers (410) are formed at both ends of the first probe pin (500).

8. The method for manufacturing the probe according to claim 1, characterized in that, Before the first elastic layer forming step (S20), a first photoresist forming step (S10) is further included, in which a first photoresist (300) including a first sacrificial layer (310) is formed at both ends of the first probe pin (500). Furthermore, after the second elastic layer stacking step (S50), a second photoresist forming step (S70) is included, in which a second photoresist (700) including a second sacrificial layer (710) is formed at both ends of the first probe pin (500).

9. The method for manufacturing the probe according to claim 7, characterized in that, It also includes a sacrificial layer removal step (S80) to remove the above-mentioned elastic sacrificial layer (410).

10. The method for manufacturing the probe according to claim 8, characterized in that, It also includes a sacrificial layer removal step (S80) to remove the first sacrificial layer (310) and the second sacrificial layer (710) mentioned above.

11. The method for manufacturing the probe according to claim 1, characterized in that, The first elastic layer forming step (S20) is performed on the upper surface of the substrate (100), and before or after the first elastic layer forming step (S20), a hollow forming step (S30) is performed to form one or more hollows (110) on the lower surface of the substrate (100).

12. A probe, characterized in that, include: First elastic layer (400); One or more first probe pins (500) are formed on the upper surface of the first elastic layer (400); and The second elastic layer (600) is formed on the first elastic layer (400) on which the first probe pin (500) is formed.

13. The probe according to claim 12, characterized in that, This includes one or more second probe pins (550) formed on the upper surface of the second elastic layer (600).

14. The probe according to claim 12, characterized in that, The layers consisting of the first probe pin (500) and the second elastic layer (600) are repeatedly stacked a predetermined number of times.

15. The probe according to claim 12, characterized in that, It is formed by arranging the first probe pins (500) in parallel on the plane of the upper surface of the first elastic layer (400).

16. The probe according to claim 12, characterized in that, Compared with the first gap (510) between one end of the first probe pin (500), the gap between the other end of the first probe pin (500), namely the second gap (520), is larger. The first probe pin (500) is formed in a shape in which one end is connected to the other end.

17. The probe according to claim 12, characterized in that, The aforementioned first probe pin (500) is formed such that one end and the other end are rod-shaped, and its center has an impact absorption structure (540) for absorbing impact.

18. The probe according to claim 12, characterized in that, In the first elastic layer (400) and the second elastic layer (600) mentioned above, an elastic sacrificial layer (410) is formed at both ends of the first probe pin (500).

19. The probe according to claim 12, characterized in that, Also includes: The first photoresist (300) includes a first sacrificial layer (310) formed at both ends of the first probe pin (500) on the lower surface of the first elastic layer (400); and The second photoresist (700) includes a second sacrificial layer (710) formed on the upper surface of the second elastic layer (600) at both ends of the first probe pin (500).

20. The probe according to claim 18, characterized in that, Remove the aforementioned elastic sacrificial layer (410).

21. The probe according to claim 19, characterized in that, Remove the first sacrificial layer (310) and the second sacrificial layer (710) mentioned above.

22. The probe according to claim 12, characterized in that, The first elastic layer (400) is formed on the upper surface of the substrate (100), and one or more hollows (110) are formed on the lower surface of the substrate (100).

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