Glue joint verification device and method based on contact array

Abstract

The invention belongs to the technical field of aviation industry, and discloses a cementing verification device and method based on a contact array. The device comprises a contact working system, wherein the contact working system comprises a contact unit, a contact grid, a contact locking device and a contact support; the contact locking device comprises a locking mechanism and a locking knob; the base supporting system comprises a contact base, a pin and a device supporting leg; the contact unit penetrates through the contact grid and penetrates through the contact support, the tail end of the contact unit is in contact with the gluing piece, the contact grid is further provided with a locking mechanism used for limiting movement of the contact unit, and the locking mechanism is provided with a locking knob used for driving the locking mechanism to limit movement of the contact unit; and the locking knob is arranged on the side wall of the contact support. According to the invention, rigid contact displacement acquisition and three-dimensional data modeling are used for replacing flexible verification film physical imprinting, and accurate detection of gaps and quantitative filling of adhesive films are realized through a digital means.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of the aviation industry, and particularly relates to a bonding verification device and method based on a contact array. BACKGROUND

[0002] In the field of aviation industry, composite metal bonded sandwich structure (composed of metal panels, back plates and foam / honeycomb sandwich) becomes the core choice of core load-bearing components such as wings, tail, fuselage, etc. due to its weight reduction, high strength and fatigue resistance.

[0003] However, because the metal panel and the sandwich material have a certain rigidity, the contact between them is rigid contact, and there is no elastic buffer space, so that the bonding scene has the characteristics of hard collision. At the same time, different structures have different processing processes, and accordingly various deviations will occur. These deviations will eventually form irregular gaps on the bonding surface. If direct bonding operation is performed, it will cause uneven thickness of the adhesive layer, incomplete curing, and even stress cracking, which will threaten the flight safety of the aviation parts and become the core contradiction affecting the bonding quality.

[0004] To solve the problem of bonding gap caused by mismatched profile, the industry now uses the only feasible solution of verification film experiment, that is, using the same type of glue film as the part, making a verification film according to the same curing process, and marking the gap after pasting to guide the glue filling. This scheme has two core functions: first, as a flexible intermediate to bond the rigid bonding surface, it converts the abstract profile form into a physical mark on the film body, and directly presents the position and approximate range of the gap; second, it guides the glue film filling to avoid the problem of excessive weight of the part caused by excessive filling and the problem of local no glue caused by insufficient filling, which is the key link to ensure the bonding quality in the traditional process. It is also essential for the verification film experiment in metal sandwich bonding.

[0005] However, with the increasing requirements of aviation manufacturing industry on efficiency, cost and precision, the pain points of the verification film process are becoming more and more prominent: first, the cost of consumables is high, the verification film needs to be customized for different types and different curvature parts, and it is disposable, so the cost of consumables accounts for a significant proportion in multiple batch production; second, the production efficiency is low, from the preparation of verification film, high-temperature curing, to manual pasting and marking, the cycle of single process is usually 8 hours, which easily causes the production line to stop; third, the detection precision is poor, which depends on the workers' naked eye observation to judge the gap size, and the subjective error is large (the upper limit of precision is only 0.1mm), which is difficult to meet the strict requirements of aviation parts on bonding precision, and becomes the bottleneck of process upgrading. SUMMARY

[0006] To overcome the problems in the related art, the present application discloses a bonding verification device and method based on a contact array.

[0007] The technical solution is as follows: a bonding verification device based on a contact array, which comprises a contact working system and a base support system; The contact working system comprises a contact unit, a contact grid, a contact locking device, and a contact support; The base support system comprises a contact base, a pin, and a device support leg; The contact unit penetrates the contact grid and the contact support, and the end of the contact unit is in contact with the bonding member. The contact grid is also provided with a locking mechanism for limiting the movement of the contact unit, and the locking mechanism is provided with a locking knob for driving the locking mechanism to limit the movement of the contact unit. The locking knob is installed on the side wall of the contact support; The contact grid is installed on the upper surface of the contact support, the contact support is fixed on the contact base through the pin, and the contact base is provided with a device support leg supported on the ground.

[0008] Further, the contact grid is provided with a through hole for accommodating the penetration of the contact unit.

[0009] The contact unit has round heads at both ends for installing sensors, and a boss region in the middle for clamping on the through hole of the contact grid.

[0010] In production, different lengths of contact units are selected according to different configurations of the bonding member, and different hard alloy materials are selected for the contact unit according to the hardness requirement.

[0011] The diameter of the through hole is the same as the diameter of the contact unit, and the distance between the through holes is a fixed value. The contact unit is placed in the through hole to form a contact array.

[0012] The locking mechanism is used to limit the movement of the contact unit, so that the contact unit is no longer in a free state. The locking mechanism has a groove corresponding to the contact unit, and two vertical blocks on the upper side connected to the locking knob. In the locked state, the groove is tightly combined with the contact unit to limit the movement of the contact unit.

[0013] The bonding member is a variable curvature profile part; The contact support is used to support the entire contact working system, and the side surface is provided with a side circular hole for inserting the locking knob. The contact support has uniform support circular holes consistent with the contact grid, so that the contact unit passes through the support circular holes. The upper side of the contact support is connected with the contact grid to be locked, and the bottom of the contact support is connected with the contact base through the four support pin holes and the pins to form an integral whole; The contact base is used to support the entire contact working system, and the upper surface is provided with a base pin hole for connecting with the contact support to form an integral whole; The device support leg is used for adjusting the height of the contact base, and a plurality of support leg pin holes are provided on one side.

[0014] Another object of the present invention is to provide a bonding verification method based on a contact array bonding verification device, comprising: S1, Contact Array Layout and Inspection: Based on the profile drawing of the parts to be bonded, determine the contact unit density and different lengths of the contact units to form a contact array; fix the contact units constituting the contact array and the contact grid to the contact support using magnetic fixtures; assemble the contact working system and the base support system together; check whether the connection status between the contact units and the contact grid is qualified, ensuring that each through hole of the contact grid is filled with contact units and there are no obvious gaps between the through holes and the contact units. In addition, the contact units can slide up and down in the through holes in a free state, and when the contact units are locked by the contact locking device, they can withstand a local pressure of at least 135N at a minimum interval of 300mm without slippage. S2, Surface Fitting Simulation; The adhesive component to be tested is precisely placed below the contact array, and the pressure module is activated to make the adhesive component completely fit the contact array; S3, compare gaps; after pressurization, turn off the pressurization module, remove the adhesive bonding verification device based on the contact array in sequence, check the indentations remaining on the adhesive film on the adhesive parts, and use the presence of clear contact marks on the adhesive film as the judgment standard. If there are clear indentations, it is qualified; otherwise, it is unqualified. Use a square with the contact as the center and the contact spacing as the side length to divide the area and mark each unqualified area. S4, Precise Adhesive Application and Re-inspection; Based on the adhesive application list, apply adhesive film with a thickness matching the gap in the corresponding area of ​​the core, controlling the area filled in a single application to ≤20cm². 2 After the glue application is completed, place the glued parts and the core with the glue film back on the contact array, repeat the pressure application in step S2 and the data acquisition and evaluation process in step S3 to confirm the elimination of gaps. When all contacts have clear indentations, they are considered qualified. No additional calibration film or curing treatment is required, and the process can proceed directly to the gluing stage.

[0015] Combining all the above technical solutions, the beneficial effects of this invention are as follows: This invention overcomes the limitations of traditional processes by proposing a contact array alternative. Its core logic is to replace the physical imprint of the flexible calibration membrane with rigid contact displacement acquisition and 3D data modeling, achieving precise gap detection and quantitative filling of the adhesive film through digital means. This invention achieves triple cost savings, primarily reflected in three aspects based on practical application data: First, it saves on consumable costs; the contact array device can be reused for more than 3 years, adapts to multiple parts models, completely replaces disposable calibration membranes, and reduces consumable expenditure by 50% during multi-batch production. Second, it saves on time costs; the entire process of detection and adhesive filling is compressed to within 30 minutes, improving efficiency by 80% and effectively reducing production line downtime. Third, it saves on material waste; by using quantitative gap data to guide precise adhesive filling, the adhesive film loss rate is reduced from 15%-20% in traditional processes to less than 3%, while avoiding rework costs due to improper adhesive filling, resulting in significant overall cost advantages.

[0016] This invention breaks through traditional misconceptions. First, it dispels the notion that rigid structural surface inspection must rely on flexible membranes, proving that by using rigid contacts with a diameter of 0.8-1.2mm and displacement data modeling, higher inspection accuracy (0.05mm vs 0.1mm) can be achieved than calibration membranes, while avoiding deviations caused by the stretching of flexible membranes. Second, it dispels the notion that multi-model part inspection must rely on customized consumables. Through adjustable density and magnetic fixation, a single array device can adapt to multiple models of parts, from simple planes to complex curved surfaces, eliminating the need for separate consumables for each part. Third, it dispels the notion that adhesive filling accuracy must rely on human experience, transforming adhesive filling from subjective estimation to data-driven processes. System quantitative output ensures consistency in adhesive filling, significantly reducing human error and providing a feasible path for the digital upgrade of aerospace adhesive bonding processes.

[0017] In terms of cost reduction, this device can be reused for more than 3 years, is compatible with multiple parts models, and replaces disposable calibration membranes, reducing consumable costs by 50%, achieving low-cost manufacturing for similar products in the industry. In terms of efficiency improvement, the entire calibration and adhesive replenishment process is reduced from 2 hours to 30 minutes, increasing efficiency by 80% and alleviating production line downtime. It eliminates the dependence on high-investment autoclaves for calibration membranes, lowers the operational threshold for calibration membranes, and releases equipment capacity. In terms of product quality, it reduces potential bonding quality issues. It achieves a triple benefit of cost reduction, efficiency improvement, and quality enhancement.

[0018] This invention enables precise detection of adhesive gaps in rigid structural surfaces. It utilizes replaceable contacts and magnetic fixation, and a single device is adaptable to parts ranging from flat surfaces to complex variable curvatures, eliminating the need for customized consumables. It achieves a closed-loop process and eliminates the need for additional autoclave equipment for membrane curing.

[0019] This invention solves the problem of relying on flexible calibration films for testing rigid adhesive surfaces, eliminating dependence on disposable consumables and achieving higher testing accuracy; it also solves the problem of requiring customized calibration consumables for multiple parts models, with one device adaptable to all types of parts, breaking model limitations; it solves the problem of relying on manual experience for adhesive patching, using contact indentations to accurately mark areas and achieve data-driven standardized patching; and it solves the problem of time-consuming calibration processes, eliminating the calibration film manufacturing and curing steps, significantly improving production efficiency. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure; Figure 1 This is a schematic diagram of an adhesive bonding verification device based on a contact array provided in an embodiment of the present invention; Figure 2 This is an exploded view of the contact unit, contact grid, and locking mechanism provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the contact unit provided in an embodiment of the present invention; Figure 4 These are schematic diagrams of contact units of different lengths provided in embodiments of the present invention; Figure 5 This is a schematic diagram of the contact grid provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the locking mechanism provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the locking knob provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of the contact locking device provided in an embodiment of the present invention; Figure 9 yes Figure 8 Enlarged view of the center locking knob; Figure 10 This is a schematic diagram of the locking state of the contact locking device provided in an embodiment of the present invention; Figure 11 yes Figure 10 Enlarged schematic diagram of the locking process of the contact locking device; Figure 12 A schematic diagram of a contact support provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of the contact base provided in an embodiment of the present invention; Figure 14 A schematic diagram of a pin provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of the base support legs provided in an embodiment of the present invention; In the diagram: 01, contact unit; 01-1, round head; 01-2, boss area; 02, contact grid; 02-1, through hole; 03, locking mechanism; 03-1, groove; 03-2, upright block; 04, locking knob; 05, adhesive joint; 06, contact support; 06-1, side round hole; 06-2, support round hole; 07, contact base; 07-1, base pin hole; 08, pin; 09, device leg; 09-1, leg pin hole. Detailed Implementation

[0021] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] The innovation of this invention lies in its use of a rigid contact array to replace the traditional disposable flexible calibration membrane, integrating a replaceable contact unit 01 and a locking anti-slip structure to adapt to multi-configuration variable curvature adhesive joints 05. This constructs an integrated closed-loop process of deployment, bonding, comparison, and adhesive replenishment, eliminating the calibration membrane manufacturing and curing steps. This enables precise detection and quantitative adhesive replenishment of adhesive gaps, improving detection accuracy while significantly reducing costs and increasing efficiency, providing a completely new technical approach for rigid adhesive joint gap calibration.

[0023] Example 1, such as Figures 1-13 As shown, the adhesive bonding verification device based on contact array provided in this embodiment of the invention includes a contact working system and a base support system.

[0024] The contact working system can be further divided into contact unit 01, contact grid 02, contact locking device, and contact support 06; the contact locking device includes: locking mechanism 03 and locking knob 04, such as Figure 2 ; The base support system includes contact base 07, pin 08, and device support leg 09; The contact unit 01 extends through the contact grid 02 and through the contact support 06. The end of the contact unit 01 contacts the adhesive joint 05. The contact grid 02 is also provided with a locking mechanism 03 for restricting the movement of the contact unit 01. A locking knob 04 is installed on the locking mechanism 03 to drive the locking mechanism 03 to restrict the movement of the contact unit 01. The locking knob 04 is installed on the side wall of the contact support 06.

[0025] The contact grid 02 is installed on the contact support 06, which is fixed to the contact base 07 by a pin 08. The contact base 07 is equipped with a support leg 09 that is supported on the ground.

[0026] The contact grille 02 has a through hole 02-1 to accommodate the contact unit 01 passing through it; like Figure 3 As shown, the contact unit 01, the core component of the device, is made of aerospace-grade hard alloy (hardness HRC60+), which has the characteristics of wear resistance, deformation resistance and long service life. Both ends are designed with round heads 01-1, which can be used to install sensors. There is a boss area 01-2 in the middle, which is snapped onto the through hole 02-1 opened on the contact grid 02. This prevents the contact unit 01 from slipping out in its free state. Furthermore, in actual production, different lengths of contact units 01 can be selected for adhesive bonding parts 05 with different configurations, such as... Figure 4 As shown; since contact points of different lengths have different hardness requirements, different aerospace-grade cemented carbide materials (such as steels of different hardness, cobalt alloys, titanium alloys, etc.) can be selected based on the needs of hardness and production costs.

[0027] like Figure 5 As shown, the contact grid 02 is used to assemble the contact unit 01. It is a square plate with regular through holes 02-1 inside. The size of the through holes 02-1 is the same as that of the contact unit 01, and the spacing of the through holes 02-1 is a fixed value (which can be adjusted according to the actual accuracy requirements). The contact unit 01 can be placed in the through holes 02-1 to form an array.

[0028] like Figure 6 As shown, the locking mechanism 03 is used to restrict the movement of the contact unit 01, preventing it from being in a free state and ensuring it remains stably positioned on the actual part surface. The locking mechanism 03 has grooves 03-1 that correspond one-to-one with the contact units 01, and two upright blocks 03-2 on its upper side that can connect to the locking knob 04. In the locked state, the grooves 03-1 are tightly fitted with the contact units 01, thus restricting their movement.

[0029] like Figure 7 The locking knob 04 can be rotated and twisted, and is connected to the locking mechanism 03 to form a locking device, such as... Figure 8 Locking device connection diagram; Figure 9 yes Figure 8 Enlarged view of the locking knob; as the locking knob 04 is turned, it causes the locking mechanism 03 to slide forward. This allows the locking mechanism 03 to lock the contact unit 01, such as Figure 10 Schematic diagram of the contact locking device in the locking state. Figure 11 yes Figure 10 A magnified schematic diagram of the locking process of the contact locking device. Figure 11 The left-middle image shows a schematic diagram of the locking device in its free state. Figure 11The middle image shows a schematic diagram of the locking device rotating the locking knob 04. Figure 11 The right figure shows the locking state of the locking device; For example, adhesive component 05 is a typical specific part with a variable curvature surface.

[0030] like Figure 12 As shown, the contact support 06 is used to support the entire contact working system. It has a side circular hole 06-1, into which the locking knob 04 can be inserted. The contact support 06 has uniform support circular holes 06-2 that are the same as those of the contact grid 02, so that the contact unit 01 can pass through the support circular holes 06-2. The upper side of the contact support 06 can be connected and locked to the contact grid 02. The bottom of the contact support 06 is connected to the contact base 07 as a whole through four support pin holes through which pins 08 pass.

[0031] like Figure 13 The contact base 07 is used to support the entire contact working system. The upper surface has four base pin holes 07-1, which can be connected to the contact support 06 as a whole by pins 08. The four legs of the contact base 07 are fixed to the device support legs 09 by several table leg pin holes.

[0032] like Figure 14 Pin 08 is used to connect contact support 06 and contact base 07.

[0033] like Figure 15 The support leg 09 is used to adjust the height of the contact base 07. Several support leg pin holes 09-1 are provided on one side. During production, different height holes can be selected to match and position the contact base 07 according to actual needs, so as to achieve the best matching degree between the contact working system and the part surface.

[0034] For example, contact unit 01 balances accuracy and workpiece protection; Contact unit 01 is the core sensing element, made of aerospace-grade hard alloy material (hardness HRC60+) to ensure wear resistance and deformation resistance, with a service life of over 5000 cycles. The design features rounded ends (01-1) with a diameter controlled between 0.8-1.2mm. This size ensures clear indentation while avoiding the loss of fine gaps due to excessively thick contacts and bending damage due to excessively thin contacts. Each contact is equipped with a high-precision displacement sensor (resolution 0.001mm) that can record X / Y / Z axis displacement data in real time after extrusion, providing accurate data for surface modeling.

[0035] Contact unit 01 is a contact array layout: adaptable to surface complexity; The contact array layout of contact unit 01 follows the principle of densification as needed, and the contact density is adjusted according to the curvature of the surface of the adhesive component 05 (such as skin): for complex areas with curvature > 15° (such as the leading edge of the wing, the transition section of the corner of the part), the contact density is set to 5~9 contacts / cm. 2 The spacing is 3-8mm to ensure the capture of subtle surface undulations; for gentle areas with curvature <5° (such as the mid-plane of the wing), the density is increased to 2-4 per square centimeter with a spacing of 9-14mm to avoid data redundancy while ensuring accuracy; the contact array of contact unit 01 is fixed by magnetic fixtures, which is convenient to install and can be quickly disassembled, and the calibration error is strictly controlled within 0.02mm to ensure the consistency of the benchmark for each test.

[0036] For example, the pressurization module simulates the stress experienced during actual assembly; The pressure module uses a water-ball-like design, its core function being to simulate the assembly force during the actual bonding of component 05, ensuring full contact between the contact array and the bonding surface of component 05. The pressure module is placed above the contact array, and its pressure can freely adjust according to the actual state of the contact array, ensuring that it provides uniform and sufficient assembly force (simulated force) to the contact array. Regarding process parameters, the applied force should not exceed 45N of local pressure within a minimum 300mm interval: for rigid workpieces such as aluminum alloy skins, the local pressure can be up to 45N; for easily deformable workpieces such as composite material skins, it should be adjusted to around 30N. This avoids both insufficient contact contact due to excessively low local pressure and damage to the workpiece due to excessively high local pressure, ensuring that the test results are consistent with the actual bonding scenario.

[0037] Example 2: The adhesive bonding verification method of the adhesive bonding verification device based on contact array consists of four steps. The device is simple to operate and can be seamlessly integrated with the production line, as detailed below: S1, Contact array layout and inspection; Based on the profile drawing of the adhesive part 05 to be bonded, determine the density of the through holes 02-1 of the contact grid 02 and the support round holes 06-2 of the contact support 06; based on the density of the through holes 02-1 of the contact grid 02 and the support round holes 06-2 of the contact support 06, determine the density of the contact unit 01 (e.g., 9 units / square centimeter for the leading edge of the wing and 3 units / square centimeter for the middle of the wing); and based on the profile drawing of the adhesive part 05 to be bonded, determine the different lengths of the contact unit 01; and construct a contact array based on the multiple determined contact unit 01 densities and the determined contact unit 01 of different lengths. The contact unit 01, constituting the contact array, and the contact grid 02 are fixed to the contact support 06 using magnetic fixtures; the contact working system and the base support system are then assembled. The connection between the contact unit 01 and the contact grid 02 is checked to ensure it is acceptable, guaranteeing that each through hole 02-1 of the contact grid 02 is filled with the contact unit 01, and that there are no obvious gaps between the through hole 02-1 and the contact unit 01. Furthermore, the contact unit 01 can slide up and down within the through hole 02-1 in its free state, and when locked by the contact locking device, it can withstand a local pressure of at least 135N at a minimum interval of 300mm without slippage.

[0038] S2, Surface Fitting Simulation: The adhesive component 05 to be tested (such as skin) is precisely placed below the contact array. The entire device is adjusted to a suitable height using the contact base 07 and the device support leg 09. The through hole 02-1 of the contact grid 02 and the support round hole 06-2 of the contact support 06 are aligned. The pressure module is activated to make the adhesive component 05 (such as skin) completely fit the contact array and maintain it for at least 30 minutes.

[0039] S3, compare the gap; after the pressurization is completed, turn off the pressurization module, remove the adhesive bonding verification device based on the contact array in sequence, check the residual indentation on the adhesive film on the adhesive part 05 (such as the skin), and use the presence of clear contact marks on the adhesive film as the judgment standard. If there are clear indentations, it is qualified; otherwise, it is unqualified. Use a square with the contact as the center and the contact spacing as the side length to divide the area, mark each unqualified area, and provide clear guidance for subsequent operations.

[0040] S4, Precise glue application and re-inspection; According to the glue application list, apply glue film matching the gap thickness to the corresponding area of ​​the core (e.g., apply 0.8mm thick glue film for a 0.8mm gap), strictly controlling the single filling area to ≤20 square centimeters; After the glue application is completed, place the glued part 05 (e.g., skin) and the core with glue film on the contact array again, repeat the pressure application in step S2 and the data acquisition and evaluation process in step S3 to confirm the gap elimination. When all contacts can form clear indentations, it is qualified. There is no need to make an additional verification film or perform curing treatment, and you can directly enter the formal gluing stage.

[0041] To further illustrate the effects of the embodiments of the present invention, the following experiments were conducted. The same parts were bonded using both a traditional calibration film method and the method described in this invention. The differences between the two methods are shown in Table 1 below.

[0042] Table 1. Differences in bonding between traditional calibration films and the present invention.

[0043] This invention is significantly superior to traditional calibration membrane solutions in terms of material usage, bonding efficiency, equipment utilization, and bonding quality.

[0044] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the scope of the technology disclosed in the present invention and within the spirit and principles of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A contact array based bond verification apparatus, comprising: The device comprises a contact working system and a base support system; The contact working system comprises a contact unit (01), a contact grid (02), a contact locking device, and a contact support (06); the contact locking device comprises a locking mechanism (03) and a locking knob (04); The base support system comprises a contact base (07), a pin (08), and a device support leg (09); The contact unit (01) penetrates the contact grid (02) and the contact support (06), and the end of the contact unit (01) is in contact with a cementing member (05); the contact grid (02) is further provided with a locking mechanism (03) for limiting the movement of the contact unit (01); the locking mechanism (03) is provided with a locking knob (04) for driving the locking mechanism (03) to limit the movement of the contact unit (01); the locking knob (04) is installed on the side wall of the contact support (06); The contact grid (02) is installed on the upper surface of the contact support (06), the contact support (06) is fixed on the contact base (07) through the pin (08), and the contact base (07) is provided with the device support leg (09) supported on the ground.

2. The contact array based bond verification device of claim 1, wherein, The contact grid (02) is provided with a through hole (02-1) for accommodating the contact unit (01).

3. The contact array based bond verification device of claim 1, wherein, The contact unit (01) has round heads (01-1) at both ends for installing sensors, and a boss region (01-2) in the middle for being clamped on the upper surface of the through hole (02-1) of the contact grid (02).

4. The contact array based bond verification device of claim 1, wherein, The cementing member (05) is selected according to different configurations and lengths of the contact unit (01) in production, and different hard alloy materials are selected according to the hardness requirements of the contact unit (01).

5. The contact array based bond verification device of claim 1, wherein, The diameter of the through hole (02-1) is the same as that of the contact unit (01), and the spacing of the through hole (02-1) is a fixed value; the contact unit (01) is placed in the through hole (02-1) to form a contact array.

6. The contact array based bond verification device of claim 1, wherein, The locking mechanism (03) is used for limiting the movement of the contact unit (01) so that the contact unit (01) is not in a free state; the locking mechanism (03) has a groove (03-1) corresponding to the contact unit (01), and two vertical blocks (03-2) on the upper side are connected with the locking knob (04); in the locked state, the groove (03-1) is tightly combined with the contact unit (01) to limit the movement of the contact unit (01).

7. The contact array based bond verification device of claim 1, wherein, The cementing member (05) is a variable-curvature profile part; The contact support (06) is used for supporting the entire contact working system, and has a side round hole (06-1) on the side surface for extending the locking knob (04) into the side round hole (06-1); the contact support (06) has uniform support round holes (06-2) consistent with the contact grid (02) so that the contact unit (01) penetrates the support round holes (06-2); the upper side of the contact support (06) is connected with the contact grid (02) to be locked, and the bottom of the contact support (06) is connected with the contact base (07) to form an integral whole through the four support pin holes and the penetration of the pin (08). The contact base (07) is used to support the whole contact working system, and the upper surface is provided with base pin holes (07-1), which are connected with the contact support (06) through pins (08) to form an integral whole. The device support leg (09) is used to adjust the height of the contact base (07), and a plurality of support leg pin holes (09-1) are provided on one side.

8. A method of verifying bonding of a bonding verification device based on a contact array, the method comprising: applying a voltage to a first contact of the contact array; measuring a current flowing through the first contact; and determining whether the current is within a predetermined range of values. The method is implemented in the contact array-based adhesive verification device according to any one of claims 1-7, and the method comprises: S1, contact array arrangement and inspection; S2, profile fitting simulation; S3, gap comparison; S4, precise adhesive filling and re-inspection.

9. The method of claim 8, wherein the method further comprises: In step S1, the contact array arrangement and inspection comprises: determining the density of the contact units (01) and the different lengths of the contact units (01) according to the profile drawing of the adhesive member (05) to be glued, and forming a contact array; fixing the contact units (01) forming the contact array and the contact grid (02) on the contact support (06) through magnetic attraction tooling; combining the contact working system and the base support system together; checking whether the connection state of the contact units (01) and the contact grid (02) is qualified, ensuring that each through hole (02-1) of the contact grid (02) is filled with the contact units (01) and there is no obvious gap between the through hole (02-1) and the contact unit (01), in addition, the contact unit (01) can slide up and down in the through hole (02-1) in a free state, and the contact unit (01) can withstand at least 135N of local pressure without slipping in a minimum interval of 300mm in a locked state through the contact locking device; Step S2, profile fitting simulation comprises: accurately placing the adhesive member (05) to be detected under the contact array, starting the pressure module, and making the adhesive member (05) completely fit the contact array.

10. The method of claim 8, wherein the method further comprises: Step S3, gap comparison comprises: turning off the pressure module after the pressure is finished, sequentially removing the contact array-based adhesive verification device, checking the residual pressure marks on the adhesive film on the adhesive member (05), and taking whether the adhesive film has clear contact marks as the judgment criterion, if there are clear pressure marks, it is qualified, otherwise it is unqualified; using a square with the contact as the center and the contact spacing as the side length to divide the area, and marking each unqualified area; Step S4, accurate glue filling and re-inspection, including: according to the glue filling list, laying the glue film with matching gap thickness in the corresponding area of the sandwich, controlling the single filling area ≤20 cm 2 After the glue filling is completed, the glued part (05) and the sandwich with glue film are placed on the contact array again, and the process of pressure and data collection and judgment is repeated to confirm the gap elimination. When all the contacts form clear pressure marks, no additional verification film needs to be made or curing treatment is needed, and the glued part can be directly used.

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