Capillary device and method of forming same

Abstract

Capillary devices and methods of forming the same are provided. The capillary device comprises a first element, a second element and a connecting element. The first element comprises a first bearing layer and a first capillary structure. The first capillary structure is arranged on the first bearing layer and comprises a first metal material. The second element comprises a second bearing layer and a second capillary structure. The second capillary structure is arranged on the second bearing layer and comprises a second metal material. The connecting structure is arranged on the interface of the first capillary structure and the second capillary structure, is connected with the first capillary structure and the second capillary structure, and comprises a connecting material. Wherein the connecting material is different from the first metal material and the second metal material.

Description

Technical Field

[0001] This invention relates to a capillary device and a method for forming the same, and more particularly to a capillary device including a connecting structure and a method for forming the same. Background Technology

[0002] To adjust the flow direction of capillary channels, the capillary structures in different components need to be interconnected. Generally, this can be achieved by applying a strong external force to make the capillary structures in different components come into direct contact, press tightly together, or engage.

[0003] However, since capillary structures are rigid, they are difficult to directly bond effectively. For example, in capillary devices formed by direct bonding, the contact interfaces between different capillary structures may have pores, discontinuities, deformation, or even be difficult to bond, resulting in the inability of the working fluid to be effectively conducted, thus leading to poor overall performance of the capillary device.

[0004] Therefore, although existing capillary devices and their formation methods have gradually met their intended uses, they still do not completely meet the requirements in all aspects. Thus, there are still some problems to be overcome regarding capillary devices and their formation methods. Summary of the Invention

[0005] This disclosure avoids problems such as porosity, discontinuities, and deformation at the interface between the first and second capillary structures by setting a connecting structure at the interface. Therefore, the working fluid in the capillary device disclosed in this disclosure can be effectively conducted, thereby improving the overall efficiency of the capillary device.

[0006] In some embodiments, a capillary device is provided. The capillary device includes a first element, a second element, and a connecting element. The first element includes a first carrier layer and a first capillary structure. The first capillary structure is disposed on the first carrier layer and includes a first metallic material. The second element includes a second carrier layer and a second capillary structure. The second capillary structure is disposed on the second carrier layer and includes a second metallic material. A connecting structure is disposed at the interface between the first capillary structure and the second capillary structure, connecting the first capillary structure and the second capillary structure, and includes a connecting material. The connecting material is different from the first metallic material and the second metallic material.

[0007] In some embodiments, a method for forming a capillary device is provided. The method includes providing a first element, wherein the first element includes a first carrier layer and a first capillary structure. The first capillary structure is disposed on the first carrier layer and includes a first metallic material. A second element is provided, wherein the second element includes a second carrier layer and a second capillary structure. The second capillary structure is disposed on the second carrier layer and includes a second metallic material. A connecting element is disposed at the interface between the first capillary structure and the second capillary structure. A thermal process is performed on the connecting element to form a connecting structure connecting the first capillary structure and the second capillary structure. The connecting structure includes a connecting material, and the connecting material is different from the first metallic material and the second metallic material.

[0008] The capillary device and its formation method disclosed herein can be applied to various types of capillary devices. To make the components and advantages of this disclosure more apparent and understandable, various embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0009] When with attachment Figure 1 This disclosure will be more fully understood from the following detailed description. It is important to note that, as is standard industry practice, the components are not shown to scale. In fact, for clarity, the dimensions of the components may be arbitrarily enlarged or reduced.

[0010] Figure 1 and Figure 2 Schematic cross-sectional views are shown at different stages of a method for forming a capillary device according to an embodiment of the present disclosure;

[0011] Figure 3 This shows a cross-sectional schematic diagram of a capillary device according to an embodiment of the present disclosure;

[0012] Figure 4 and Figure 5 Schematic cross-sectional views are shown at different stages of a method for forming a capillary device according to an embodiment of the present disclosure;

[0013] Figure 6 This shows a cross-sectional schematic diagram of a capillary device according to an embodiment of the present disclosure;

[0014] Figure 7 This shows a cross-sectional schematic diagram of a capillary device according to an embodiment of the present disclosure.

[0015] Explanation of icon numbers

[0016] 1,2,3,4,5: Capillary apparatus

[0017] 10: First Component

[0018] 11: First load-bearing layer

[0019] 12: First capillary structure

[0020] 20: Second Component

[0021] 21: Second load-bearing layer

[0022] 22: Second capillary structure

[0023] 30: Connecting elements

[0024] 32: Connection Structure

[0025] CL: Central axis

[0026] COR1: Corner

[0027] P1: Thermal Process

[0028] T12, T22, T30: Thickness Detailed Implementation

[0029] The capillary devices of various embodiments in this disclosure are described in detail below. It should be understood that the following description provides many different embodiments for implementing various forms of some embodiments of this disclosure. The specific elements and arrangements described below are merely for simple and clear description of some embodiments of this disclosure. Of course, these are only examples and not limitations of this disclosure. Furthermore, similar and / or corresponding element symbols may be used in different embodiments to identify similar and / or corresponding elements for clear description of this disclosure. However, the use of these similar and / or corresponding element symbols is only for simple and clear description of some embodiments of this disclosure and does not represent any relationship between the different embodiments and / or structures discussed.

[0030] Furthermore, it should be understood that the ordinal numbers used in the specification and claims, such as "first," "second," etc., to modify elements, are not intended to imply any prior ordinal number for that element (or those elements), nor to indicate the order of one element with another, or the order of manufacture. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; for example, a first element in the specification may be a second element in the claims.

[0031] In the following text, the terms "approximately," "about," and "substantially" generally indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantities are approximate, meaning that the terms "approximately," "about," or "substantially" are implied even without specific mention. The phrases "range between the first and second values" or "first value to second value" indicate that the range includes the first value, the second value, and other values ​​in between. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error.

[0032] In the following text, words such as “comprise,” “containing,” and “having” are open-ended terms and should therefore be interpreted as “containing but not limited to…”. Thus, when the terms “comprise,” “containing,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding component, area, step, operation, and / or element, but do not exclude the presence of one or more of the corresponding component, area, step, operation, and / or element. Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the prior art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this disclosure. In this document, the term “capillary function” represents the performance capable of exhibiting capillary phenomena, such as the flow rate of the working fluid, the return effect of the working fluid, etc.

[0033] In some embodiments, additional components may be added to the capillary device disclosed herein. In some embodiments, certain components of the capillary device disclosed herein may be replaced or omitted. In some embodiments, additional steps may be provided before, during, and / or after the method of forming the capillary device. In some embodiments, some steps may be replaced or omitted, and the order of some steps is interchangeable. Furthermore, it should be understood that some steps may be replaced or removed for other embodiments of the method. Moreover, in this disclosure, the number and dimensions of the elements in the drawings are merely illustrative and not intended to limit the scope of this disclosure.

[0034] Reference Figure 1This diagram shows cross-sectional views of different stages of a method for forming a capillary device 1 according to an embodiment of the present disclosure. In some embodiments, a first element 10 may be provided. The first element 10 may be a capillary element with capillary function. In some embodiments, the first element 10 may include a first support layer 11 and a first capillary structure 12. In some embodiments, the first support layer 11 may include glass, metal, ceramic, polymer, the like, or a combination thereof, but the present disclosure is not limited thereto. In some embodiments, the metal may include copper (Cu), tin (Sn), gold (Au), silver (Ag), nickel (Ni), indium (In), platinum (Pt), palladium (Pd), iridium (Ir), titanium (Ti), chromium (Cr), tungsten (W), aluminum (Al), molybdenum (Mo), titanium (Ti), magnesium (Mg), zinc (Zn), alloys thereof, compounds thereof, the like, or combinations thereof.

[0035] like Figure 1 As shown, in some embodiments, the first capillary structure 12 may be disposed on the first support layer 11. In some embodiments, the first capillary structure 12 may be disposed on at least a portion or all of the bottom surface of the first support layer 11. In some embodiments, the first capillary structure 12 may expose the bottom surface of the first support layer 11 or may not expose the bottom surface of the first support layer 11. In some embodiments, the first capillary structure 12 may include or may be a first metallic material M1. In some embodiments, the first metallic material M1 may be a material comprising metals. In some embodiments, the first metallic material M1 may include copper, tin, gold, silver, nickel, indium, platinum, palladium, iridium, titanium, chromium, tungsten, aluminum, molybdenum, titanium, magnesium, zinc, alloys thereof, or compounds thereof, analogs thereof, or combinations thereof. In some embodiments, the first metallic material M1 may also include non-metallic elements, for example, phosphorus, silicon, etc.

[0036] like Figure 1 As shown, in some embodiments, a second element 20 may be provided. The second element 20 may be a capillary element with capillary function. In some embodiments, the first element 10 and the second element 20 may be the same or different. In some embodiments, the second element 20 may include a second carrier layer 21 and a second capillary structure 22. In some embodiments, the material of the second carrier layer 21 may be the same as or different from the material of the first carrier layer 11. In some embodiments, the second carrier layer 21 may include glass, metal, ceramic, polymer, the like, or a combination thereof, but this disclosure is not limited thereto. In some embodiments, the metal may include copper, tin, gold, silver, nickel, indium, platinum, palladium, iridium, titanium, chromium, tungsten, aluminum, molybdenum, titanium, magnesium, zinc, alloys thereof, compounds thereof, the like, or combinations thereof.

[0037] like Figure 1As shown, in some embodiments, the second capillary structure 22 may be disposed on the second support layer 21. In some embodiments, the second capillary structure 22 may be disposed on at least a portion or all of the top surface of the second support layer 21. In some embodiments, the second capillary structure 22 may expose the top surface of the second support layer 21 or may not expose the top surface of the second support layer 21. In some embodiments, the second capillary structure 22 may include or may be a second metal material M2, and the second metal material M2 may be the same as or different from the first metal material M1. In some embodiments, the second metal material M2 may be a material comprising metals. In some embodiments, the second metal material M2 may include copper, tin, gold, silver, nickel, indium, platinum, palladium, iridium, titanium, chromium, tungsten, aluminum, molybdenum, titanium, magnesium, zinc, alloys thereof or compounds thereof, analogs thereof, or combinations thereof. In some embodiments, the second metal material M2 may also include non-metallic elements, for example, phosphorus, silicon, etc. In some embodiments, the first capillary structure 12 of the first element 10 may be disposed toward the second capillary structure 22 of the second element 20. In some embodiments, the first capillary structure 12 may be located between the first support layer 11 and the second capillary structure 22. In some embodiments, the second capillary structure 22 may be located between the first capillary structure 12 and the second support layer 21.

[0038] like Figure 1 As shown, in some embodiments, the connecting element 30 may be disposed on the interface between the first capillary structure 12 of the first element 10 and the second capillary structure 22 of the second element 20, and the connecting element 30 may contact the first capillary structure 12 and the second capillary structure 22 respectively. In some embodiments, the first capillary structure 12 and the second capillary structure 22 may be disposed on opposite surfaces of the connecting element 30 respectively. In some embodiments, the connecting element 30 may be disposed on the first capillary structure 12 by coating, insertion, electroplating, sputtering, application, surface modification, or a combination thereof. Then, the connecting element 30 is brought into contact with the second capillary structure 22. Thus, the connecting element 30 may be located on the interface between the first capillary structure 12 and the second capillary structure 22. In other embodiments, the connecting element 30 may be disposed on the second capillary structure 22 first, and then brought into contact with the first capillary structure 12.

[0039] like Figure 1As shown, in some embodiments, the connecting element 30 may include or may be a third metal material M3. In some embodiments, the third metal material M3 may be a material comprising metal. In some embodiments, the third metal material M3 may be different from the first metal material M1, and the third metal material M3 may be different from the second metal material M2. In some embodiments, the third metal material M3 may include copper, tin, gold, silver, nickel, indium, platinum, palladium, iridium, titanium, chromium, tungsten, aluminum, molybdenum, titanium, magnesium, zinc, alloys thereof, or compounds thereof, or similar substances thereof, or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the third metal material M3 may also include non-metallic elements, for example, phosphorus, silicon, etc. In some embodiments, the third metal material M3 may include copper, tin, silver, zinc, alloys thereof, or compounds thereof, or similar substances thereof, or combinations thereof.

[0040] like Figure 1 As shown, in some embodiments, the melting point of the third metal material M3 may be lower than the melting point of the first metal material M1, and the melting point of the third metal material M3 may be lower than the melting point of the second metal material M2. In some embodiments, the melting point of the third metal material M3 of the connecting element 30 may be greater than or equal to 600°C, greater than or equal to 650°C, or greater than or equal to 700°C. In some embodiments, the melting point of the third metal material M3 may be less than or equal to 850°C, less than or equal to 800°C, or less than or equal to 750°C. For example, the melting point of the third metal material M3 may be greater than or equal to 600°C and less than or equal to 850°C, greater than or equal to 650°C and less than or equal to 800°C, or greater than or equal to 700°C and less than or equal to 750°C. Accordingly, during the subsequent thermal process (e.g., thermal process P1), the connecting structure (such as...) can be formed without substantially damaging the first capillary structure 12 and the second capillary structure 22. Figure 2 The connection structure 32 shown improves the overall efficiency of the capillary device.

[0041] like Figure 1 As shown, in some embodiments, the thickness T30 of the connecting element 30 in the normal direction of the first bearing layer 11 or the second bearing layer 21 can be 1mm to 0.0001mm, 0.05mm to 0.005mm, 0.02mm to 0.008mm, or 1mm to 0.001mm, but this disclosure is not limited thereto. For example, the thickness T30 of the connecting element 30 can be 1mm, 0.5mm, 0.1mm, 0.05mm, 0.02mm, 0.01mm, 0.008mm, 0.005mm, 0.001mm, 0.0005mm, 0.0001mm, or any value or a range of values ​​between the aforementioned values, but this disclosure is not limited thereto. Accordingly, the thickness T30 of the connecting element 30 can be adjusted to adjust the subsequently formed connection structure (such as...). Figure 2The thickness of the connecting structure 32 shown is increased to improve the overall efficiency of the capillary device.

[0042] like Figure 1 As shown, in some embodiments, the ratio of the thickness T30 of the connecting element 30 to the thickness T12 of the first capillary structure 12 (thickness T30 of the connecting element 30 / thickness T12 of the first capillary structure 12) in the normal direction of the first carrier layer 11 or the second carrier layer 21 is 0.01 to 0.1, but this disclosure is not limited thereto. For example, the ratio of the thickness T30 of the connecting element 30 to the thickness T12 of the first capillary structure 12 can be 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, or any value or a range of values ​​between the aforementioned values, but this disclosure is not limited thereto. In some embodiments, in the normal direction of the first support layer 11 or the second support layer 21, the ratio of the thickness T30 of the connecting element 30 to the thickness T22 of the second capillary structure 22 (thickness T30 of the connecting element 30 / thickness T22 of the second capillary structure 22) can be 0.01 to 0.1, but this disclosure is not limited thereto. For example, the ratio of the thickness T30 of the connecting element 30 to the thickness T22 of the second capillary structure 22 can be 0.01, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, or any value or a range of values ​​between the aforementioned values, but this disclosure is not limited thereto. Accordingly, the ratio of the thickness T30 of the connecting element 30 to the thickness T12 of the first capillary structure 12, or the ratio of the thickness T30 of the connecting element 30 to the thickness T22 of the second capillary structure 22, in the capillary device can be adjusted to adjust the first capillary structure 12, the second capillary structure 22, and the connecting structure (such as...) Figure 2 The thickness ratio between the connecting structures 32 shown is used to improve the overall efficiency of the capillary device.

[0043] like Figure 1 As shown, in some embodiments, the connecting element 30 may be a flux, solder paste, solder, filler, coating, plating, solder sheet, foil, powder, surface treatment agent or a combination thereof, but this disclosure is not limited thereto.

[0044] In some embodiments, when the connecting element 30 is flux, solder paste, solder, or filler, the thickness T30 of the connecting element 30 can be 0.1 mm to 0.001 mm. For example, the thickness T30 of the connecting element 30 can be 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, 0.009 mm, 0.008 mm, 0.007 mm, 0.006 mm, 0.005 mm, 0.004 mm, 0.003 mm, 0.002 mm, 0.001 mm, or any value or range of values ​​between the foregoing values, but this disclosure is not limited thereto. In these embodiments, the connecting element 30 may also include a matrix, and the third metal material M3 may be uniformly dispersed in the matrix. In some embodiments, the matrix may include a solvent, such as alcohols, ketones, alkanes, etc. In some embodiments, a subsequent thermal process (e.g., thermal process P1) may vaporize the solvent, thereby removing the solvent. In some embodiments, the matrix may include a resin, such as a pyrolytic resin. In some embodiments, a subsequent thermal process (e.g., thermal process P1) may vaporize or burn the resin, thereby removing the resin.

[0045] In some embodiments, when the connecting element 30 is a coating or plating, the thickness T30 of the connecting element 30 can be 0.01 mm to 0.0001 mm. For example, the thickness T30 of the connecting element 30 can be 0.01 mm, 0.009 mm, 0.008 mm, 0.007 mm, 0.006 mm, 0.005 mm, 0.004 mm, 0.003 mm, 0.002 mm, 0.001 mm, 0.0009 mm, 0.0008 mm, 0.0007 mm, 0.0006 mm, 0.0005 mm, 0.0004 mm, 0.0003 mm, 0.0002 mm, 0.0001 mm, or any value or range of values ​​between the foregoing values, but this disclosure is not limited thereto. In these embodiments, the connecting element 30 can be composed of a third metal material M3. In other words, the connecting element 30 may substantially not include a matrix, adjuvant, or auxiliaries. For example, the connecting element 30 may be composed of metal. In these embodiments, the connecting element 30 may also include the aforementioned matrix, and the third metal material M3 may be uniformly dispersed in the matrix.

[0046] In some embodiments, when the connecting element 30 is a solder sheet, foil, or powder, the thickness T30 of the connecting element 30 can be 0.1 mm to 0.001 mm. For example, the thickness T30 of the connecting element 30 can be 0.1 mm, 0.09 mm, 0.08 mm, 0.07 mm, 0.06 mm, 0.05 mm, 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, 0.009 mm, 0.008 mm, 0.007 mm, 0.006 mm, 0.005 mm, 0.004 mm, 0.003 mm, 0.002 mm, 0.001 mm, or any value or range of values ​​between the foregoing values, but this disclosure is not limited thereto. In these embodiments, the connecting element 30 can be composed of a third metallic material M3. In other words, the connecting element 30 may substantially not contain a matrix, adjuvant, or additive.

[0047] In some embodiments, when the connecting element 30 is a surface treatment agent, the thickness T30 of the connecting element 30 may be 0.01 mm to 0.0001 mm. For example, the thickness T30 of the connecting element 30 may be 0.01 mm, 0.009 mm, 0.008 mm, 0.007 mm, 0.006 mm, 0.005 mm, 0.004 mm, 0.003 mm, 0.002 mm, 0.001 mm, 0.0009 mm, 0.0008 mm, 0.0007 mm, 0.0006 mm, 0.0005 mm, 0.0004 mm, 0.0003 mm, 0.0002 mm, 0.0001 mm, or any value or range of values ​​between the aforementioned values, but this disclosure is not limited thereto. In these embodiments, the connecting element 30 may also include a matrix, and the third metal material M3 may be uniformly dispersed in the matrix. For example, the connecting element 30 may be made of metal.

[0048] like Figure 1As shown, in some embodiments, after the connecting element 30 is disposed at the interface of the first capillary structure 12 and the second capillary structure 22, a thermal process P1 is performed on the connecting element 30 to form a connecting structure 32 connecting the first capillary structure 12 and the second capillary structure 22. In some embodiments, the thermal process P1 may be heating, sintering, baking, other suitable thermal processes or combinations thereof, but this disclosure is not limited thereto. In some embodiments, the temperature of the thermal process P1 may correspond to the melting point of the third metal material M3. In some embodiments, the temperature of the thermal process P1 may be greater than or equal to the melting point of the third metal material M3. In some embodiments, the temperature of the thermal process P1 may be less than the melting point of the first metal material M1, and the temperature of the thermal process P1 may be less than the melting point of the second metal material M2. In some embodiments, the temperature of the thermal process P1 may be greater than or equal to 600°C and less than or equal to 850°C, greater than or equal to 650°C and less than or equal to 800°C, or greater than or equal to 700°C and less than or equal to 750°C. Accordingly, during the thermal process P1, the first capillary structure 12 and the second capillary structure 22 can be substantially preserved, thereby improving the overall performance of the capillary device.

[0049] Reference Figure 2 This diagram shows cross-sectional views of different stages of a method for forming a capillary device 1 according to an embodiment of the present disclosure. In some embodiments, the capillary device 1 is obtained after performing a thermal process P1 within a first time period and a first temperature range. In some embodiments, a connecting structure 32 may be disposed at the interface between the first capillary structure 12 and the second capillary structure 22. In some embodiments, the connecting structure 32 may connect the first capillary structure 12 and the second capillary structure 22, and may include a connecting material M3'. Since the connecting structure 32 is formed by performing a thermal process P1 on a connecting element 30 including a third metal material M3, the connecting structure 32 may include a connecting material M3', and the connecting material M3' is different from the first metal material M1 and the second metal material M2.

[0050] In some embodiments, the connecting material M3' of the connecting structure 32 may be substantially the same as the third metal material M3. In other words, it can be considered that the third metal material M3 does not substantially diffuse into the first metal material M1 and the second metal material M2, and the first metal material M1 and the second metal material M2 do not diffuse into the third metal material M3. In some embodiments, when the execution time of the thermal process P1 is shorter and / or the execution temperature range is lower, the atoms in the first metal material M1, the second metal material M2 and the third metal material M3 are less likely to diffuse into each other (for example, the first metal material M1 is less likely to diffuse downward into the third metal material M3, and the third metal material M3 is less likely to diffuse upward into the first metal material M1; and the second metal material M2 is less likely to diffuse upward into the third metal material M3, and the third metal material M3 is less likely to diffuse downward into the second metal material M2), thus making the connecting material M3' the third metal material M3.

[0051] Reference Figure 3 The diagram shows a cross-sectional schematic of a capillary device 2 according to an embodiment of the present disclosure. In some embodiments, the capillary device 2 is obtained after performing a thermal process P1 at a second time period longer than the first time period and / or at a second temperature range higher than the first temperature range. In some embodiments, the connecting material M3' may be an alloy composed of a first metal material M1, a second metal material M2, and a third metal material M3. In other words, it can be considered that atoms in the first metal material M1, the second metal material M2, and the third metal material M3 diffuse into each other. In some embodiments, the higher the execution time period and / or the execution temperature range of the thermal process P1, the easier it is for atoms in the first metal material M1, the second metal material M2, and the third metal material M3 to diffuse into each other, thus making the connecting material M3' an alloy composed of the first metal material M1, the second metal material M2, and the third metal material M3. In some embodiments, the concentration of the third metal material M3 is higher closer to the central axis CL of the connecting structure 32.

[0052] like Figure 2 and Figure 3 As shown, in some embodiments, each of the first capillary structure 12, the second capillary structure 22, and the connecting structure 32 may have capillary functionality. For example, the working fluid may be transported via each of the first capillary structure 12, the second capillary structure 22, and the connecting structure 32. In some embodiments, the first capillary structure 12 and the second capillary structure 22 may include porous structures, and the connecting structure 32 may be a point-like structure similar to a connection point. In other embodiments, each of the first capillary structure 12, the second capillary structure 22, and the connecting structure 32 may include a porous structure. In some embodiments, the working fluid of the capillary device may include water, an organic solvent, a polymer, or a combination thereof. For example, the working fluid may be water.

[0053] Accordingly, since the disclosed capillary device includes a connecting structure 32 connecting the first capillary structure 12 and the second capillary structure 22, the first capillary structure 12 and the second capillary structure 22 can be effectively connected while maintaining their capillary function. For example, since the connecting structure 32 itself is a point structure or also has a capillary function, discontinuous regions between the first capillary structure 12 and the second capillary structure 22 can be avoided. For example, since the connecting structure 32 can physically and tightly connect (e.g., form an alloy) the first capillary structure 12 and the second capillary structure 22, the bonding effect between the first capillary structure 12 and the second capillary structure 22 can be improved. For example, since the connecting structure 32 can connect the first capillary structure 12 and the second capillary structure 22 by performing a thermal process P1, the problem of deformation and loss of capillary function caused by external force when directly joining the first capillary structure 12 and the second capillary structure 22 by means of assembly can be avoided.

[0054] Reference Figure 4 This diagram shows cross-sectional views of different stages of a method for forming a capillary device 3 according to an embodiment of the present disclosure. In some embodiments, a first capillary structure 12 may be disposed at a corner (COR1) of a first support layer 11 to enhance capillary function at the corner (COR1). In some embodiments, the first capillary structure 12 may be disposed on the side and bottom surfaces of the first support layer 11, but the present disclosure is not limited thereto. In some embodiments, the first support layer 11 may be in direct contact with a second support layer 21. In some embodiments, the extension direction of the first support layer 11 may be perpendicular to the extension direction of the second support layer 21. In some embodiments, the first capillary structure 12 may be a vertical capillary structure, and the second capillary structure 22 may be a horizontal capillary structure. In some embodiments, a connecting element 30 may be disposed at the interface between the first capillary structure 12 and the second capillary structure 22. In some embodiments, the connecting element 30 may be disposed below the interface between the first support layer 11 and the second support layer 21. In some embodiments, the aforementioned thermal process P1 may be performed.

[0055] Reference Figure 5The diagram shows cross-sectional schematics of different stages of a method for forming a capillary device 3 according to an embodiment of the present disclosure. In some embodiments, the capillary device 3 may be obtained after performing a thermal process P1 at a third time period and a third temperature range. In some embodiments, the capillary device 3 may include capillary structures with different extension directions. Accordingly, since the connecting structure 32 can physically and tightly connect (e.g., form an alloy) the first capillary structure 12 and the second capillary structure 22, and the first capillary structure 12 may be disposed at the corner COR1 of the first support layer 11, the bonding effect between the vertical first capillary structure 12 and the horizontal second capillary structure 22 can be improved.

[0056] Reference Figure 6 The diagram shows a cross-sectional view of a capillary device 4 according to an embodiment of the present disclosure. In some embodiments, the capillary device 4 is obtained after performing a thermal process P1 at a fourth time period longer than the third time period and / or at a fourth temperature range higher than the third temperature range. In some embodiments, a connecting structure 32 may be disposed at the interface between the first support layer 11 and the second support layer 21, and the connecting structure 32 may be further disposed on the first support layer 11 and the second support layer 21. In some embodiments, the connecting structure 32 may be disposed on the first support layer 11, spanning the interface between the first support layer 11 and the second support layer 21, and extending to the second support layer 21. In other words, the total area of ​​the first support layer 11 and the second support layer 21 covered by the connecting structure 32 of the capillary device 4 may be greater than the total area of ​​the first support layer 11 and the second support layer 21 covered by the connecting structure 32 of the capillary device 3. In some embodiments, the connecting structure 32 may cover at least 40%, 50%, 60%, or more of the bottom surface of the first support layer 11. Accordingly, the bonding effect can be improved.

[0057] Reference Figure 7The figure shows a cross-sectional schematic diagram of a capillary device 5 according to an embodiment of the present disclosure. In some embodiments, the first support layer 11 may be in direct contact with the second support layer 21. In some embodiments, the extending direction of the first support layer 11 may be the same as the extending direction of the second support layer 21. In some embodiments, the first capillary structure 12 and the second capillary structure 22 may both be vertical capillary structures, but the present disclosure is not limited thereto. In other embodiments (not shown), the first capillary structure 12 and the second capillary structure 22 may both be horizontal capillary structures. In some embodiments, the capillary device 3 may include capillary structures with the same extending direction. For example, the first capillary structure 12 and the second capillary structure 22 may be capillary structures with the same extending direction but different diameters. In some embodiments, the connecting structure 32 and the second capillary structure 22 may be disposed on the same side of the second support layer 21. Accordingly, since the connecting structure 32 can physically and tightly connect (e.g., form an alloy) the first capillary structure 12 and the second capillary structure 22, and the first capillary structure 12 can be disposed at the corner COR1 of the first bearing layer 11, the bonding effect can be improved.

[0058] In the following sections, different examples of this disclosure are shown in Tables 1 through 4.

[0059] Table 1

[0060]

[0061] In Table 1, "Not Applicable" indicates that the first metallic material M1, the second metallic material M2, and the third metallic material M3 are considered to be substantially non-diffused to each other. The concentration gradient of the connecting material M3' can be from the edge of the connecting structure 32 to the central axis CL. The copper-tin alloy can be bronze powder.

[0062] In Examples 1 and 2, the third metal material M3 (silver) exhibits good compatibility with both the first metal material M1 (copper) and the second metal material M2 (copper), resulting in a good connection effect. Furthermore, since the third metal material M3 is silver, which has excellent thermal conductivity, it is advantageous for use in heat dissipation devices. Additionally, silver's good hydrophilicity helps improve the mobility of working fluids such as water in capillary devices. In Examples 3 and 4, the third metal material M3 is tin, thus exhibiting excellent thermal conductivity. Moreover, in Examples 1 to 4, the thermal conductivity is ranked as follows: Example 1 is superior to Example 2; Example 2 is superior to Example 4; and Example 4 is superior to Example 3. In Examples 5 and 6, since the third metal material M3 is zinc, it possesses corrosion resistance similar to brass.

[0063] Table 2

[0064]

[0065] In some embodiments, the third metallic material M3 in Example 7 may be a copper alloy. In some embodiments, the copper alloy may include copper and further include nickel, iron, silicon, phosphorus, tin, silver, zinc, magnesium, or combinations thereof. The copper content in the copper alloy may be greater than or equal to 51, 55, 60, or 65 atom%, and the total content of the remaining elements may be less than or equal to 49, 45, 40, or 35 atom%. The copper alloy may be represented as CuX, and X may include Ni, Fe, Si, P, Sn, Ag, Zn, Mg, or combinations thereof.

[0066] In Example 7, the remaining elements in the third metallic material M3 can be selected according to the application, thereby improving the versatility of the capillary device. For example, when the copper alloy includes silver, it has good thermal conductivity and hydrophilicity. For example, when the copper alloy includes zinc, it has corrosion resistance. In Examples 8 and 9, silver and copper have good compatibility, resulting in good bonding, thermal conductivity, and hydrophilicity. In Example 10, since the third metallic material M3 is tin, it has good thermal conductivity.

[0067] Table 3

[0068]

[0069] In Example 11, the connecting material M3' is copper, which can be considered as the third metal material M3 not substantially diffusing into the first metal material M1 and the second metal material M2. In Example 12, the connecting material M3' is a copper alloy, which can be considered as metal X in the second metal material M2 diffusing into the third metal material M3. In Examples 11 and 12, the third metal material M3 (copper) has good compatibility with the first metal material M1 (copper) and the second metal material M2 (copper in the copper alloy), achieving a good connection effect. Furthermore, the remaining elements in the second metal material M2 can be selected according to the application, thereby improving the versatility of the capillary device. For example, when the copper alloy includes silver, it has good thermal conductivity and hydrophilicity. For example, when the copper alloy includes zinc, it has corrosion resistance.

[0070] Table 4

[0071]

[0072] In Examples 14, 16, and 18, metal X in the second metallic material M2 is considered to diffuse into the third metallic material M3. In Examples 13 and 14, silver and copper have good compatibility, resulting in good bonding, thermal conductivity, and hydrophilicity. In Examples 15 and 16, since the third metallic material M3 is tin, it has good thermal conductivity. In Examples 17 and 18, since the third metallic material M3 is zinc, it has corrosion resistance similar to brass.

[0073] In some embodiments, the connecting element may be solder, and the melting point of the solder may be greater than or equal to 700°C. In some embodiments, the solder may include the following products: Silvaloy 051, 071, 202, 252, 299, 300, 351, 380, 401, 402, 403, 450, 502, 505, 541, 559, 580, 600, 604, 630, 650, 700, 716, 721, 750, 852; Premabraze 051, 127, 131, 180, 265, 399, 402, 407, 408, 409, 500, 540, 580, 616, 680, 700; Lithobraze 720, 925; LM 721 Grade 1; Fine Silver (BR999); Sil-Fos 15, 5, 2, 2M; HandyFlo 6; Handy Flo 100 series, 200 series, 600 series; Fos Flo, Fos Flo 6; Hi-Temp 095, 080, 548, 720, 820, 910, 930, 932, 933; Easy-Flo 30, 35; OFHC certified copper; CDA 102, 110, 510, 521, 681; or Trimet 245, 259, 299.

[0074] In some embodiments, one or more of the capillary devices 1 to 5 may be used in a heat dissipation device, and the heat dissipation device may be such as a vapor chamber, a heat-conducting plate, a heat dissipation module, the like, or a combination thereof. For example, the heat-conducting plate may include a three-dimensional vapor chamber.

[0075] Accordingly, since the capillary device disclosed herein may include a connecting structure, it can effectively join the first capillary structure and the second capillary structure to conduct the working fluid in the capillary device. Specifically, since the connecting material of the connecting structure is different from the first metal material of the first capillary structure and the second metal material of the second capillary structure, it is advantageous to form the connecting structure. For example, the melting point of the third metal material or the connecting material can be lower than that of the first metal material and the second metal material. For example, since the connecting structure is formed through a thermal process, problems such as porosity, discontinuities, and deformation at the interface between the capillary structures can be avoided. For example, since the setting position, material composition, and other parameters of the connecting structure can be adjusted according to usage requirements, the applicability of the capillary device can be improved. Furthermore, since the capillary device disclosed herein may include a thermal process on the connecting elements, connecting structures comprising different components can be formed based on the diffusion principle, depending on the parameters of the thermal process. Therefore, the capillary device and its forming method disclosed herein can improve the overall performance of the capillary device, such as improving the transmission efficiency of the working fluid, the reliability of the capillary device, and / or its applicability.

[0076] The scope of protection of this disclosure is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any process, machine, manufacturing method, material composition, apparatus, method, and step that is currently or will be developed can be understood from the content of this disclosure, and can be used according to this disclosure as long as it can perform substantially the same function or obtain substantially the same result in the embodiments described herein. Therefore, the scope of protection of this disclosure includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. No embodiment or claim of this disclosure is required to achieve all the purposes, advantages, and / or features disclosed in this disclosure.

[0077] Several embodiments have been summarized above to enable those skilled in the art to better understand the viewpoints of the embodiments disclosed herein. Those skilled in the art should understand that they can design or modify other processes and structures based on the embodiments disclosed herein to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this disclosure, and that they can make various changes, substitutions, and replacements without departing from the spirit and scope of this disclosure.

Claims

1. A capillary device, comprising: a first element, comprising: a first carrier layer; and a first capillary structure disposed on the first carrier layer and comprising a first metallic material; a second element, comprising: a second carrier layer; and a second capillary structure disposed on the second carrier layer and comprising a second metallic material; and a connecting structure disposed on an interface of the first capillary structure and the second capillary structure, connecting the first capillary structure and the second capillary structure, and comprising a connecting material, wherein the connecting material is different from the first metallic material and the second metallic material.

2. The capillary device of claim 1, wherein the connecting material is an alloy comprising the first metallic material and the second metallic material.

3. The capillary device of claim 2, wherein the connecting material is an alloy consisting of the first metallic material, the second metallic material, and a third metallic material, and the concentration of the third metallic material is higher closer to a central axis of the connecting structure.

4. The capillary device of claim 1, wherein the first carrier layer is in direct contact with the second carrier layer.

5. The capillary device of claim 1, wherein the first capillary structure is disposed at a corner of the first carrier layer.

6. A method of forming a capillary device, comprising: providing a first element, wherein the first element comprises: a first carrier layer; and a first capillary structure disposed on the first carrier layer and comprising a first metallic material; providing a second element, wherein the second element comprises: a second carrier layer; and a second capillary structure disposed on the second carrier layer and comprising a second metallic material; disposing a connecting element on an interface of the first capillary structure and the second capillary structure; and performing a thermal process on the connecting element to form a connecting structure connecting the first capillary structure and the second capillary structure, wherein the connecting structure comprises a connecting material, and the connecting material is different from the first metallic material and the second metallic material.

7. The method of forming a capillary device of claim 6, wherein the connecting element comprises a third metallic material, and the connecting material is the third metallic material or an alloy consisting of the first metallic material, the second metallic material, and the third metallic material.

8. The method of forming a capillary device of claim 7, wherein the third metallic material has a lower melting point than the first metallic material and the second metallic material.

9. The method of forming a capillary device of claim 7, wherein: the connecting element further comprises a matrix, and the third metallic material is dispersed in the matrix, and the thermal process is performed on the connecting element to vaporize the matrix.

10. The method of forming a capillary device of claim 6, wherein disposing the connecting element on the interface of the first capillary structure and the second capillary structure further comprises: disposing the connecting element on the first capillary structure by painting, inserting, electroplating, sputtering, coating, surface modification, or a combination thereof; and contacting the connecting element with the second capillary structure.

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