Multi-chip packaging electric field sensor device

Abstract

A multi-chip packaging electric field sensor device comprises a sealing cap arranged at the top, a bottom plate arranged at the bottom and a supporting shell arranged between the sealing cap and the bottom plate, the shell is arranged in a surrounding mode and forms a cylindrical structure, a cavity is formed among the sealing cap, the bottom plate and the shell, and a cross shielding layer is arranged in the cavity and is perpendicular to the upper surface of the bottom plate. The cross section of the cross shielding layer is cross-shaped; and the bottom of the cross shielding layer is connected with the upper surface of the bottom plate so as to divide the internal space of the cavity into four equal spaces. The device can still stably and sensitively detect the electric field intensity of the target electric field under the condition of charge interference.

Description

Technical Field

[0001] This invention relates to the field of power safety technology, and in particular to an electric field early warning technology that can still stably and accurately detect the target electric field under complex conditions; this invention is a divisional application of the invention patent entitled "An Electric Field Early Warning Device and Method" with application number 2024118112113. Background Technology

[0002] In complex power work sites, the presence of high-voltage electrical equipment, exposed conductors, and various challenging working environments increases the risk of electric shock, posing a threat to the lives of power workers. In such environments, detecting the three-dimensional dynamic electric field distributed in space is difficult, and effective real-time early warning mechanisms are lacking to alert power workers.

[0003] Existing technology, patent application publication number CN116311782A, discloses an electric field-inducing wireless proximity alarm device and its operating method, relating to the field of proximity alarm technology. This electric field-inducing wireless proximity alarm device includes an electric field signal acquisition module, an electric field signal acquisition module, an electric field signal transmission module, an electric field signal judgment module, a signal alarm prompting module, an electric field signal processing module, and an electric field signal storage module. The electric field signal acquisition module is connected to the electric field signal acquisition module, the electric field signal acquisition module is connected to the electric field signal transmission module, and the electric field signal transmission module is connected to the electric field signal judgment module. The signal alarm prompting module enables rapid and accurate identification of the electric field.

[0004] However, the aforementioned existing technologies still have the following technical shortcomings: 1) Existing electric field early warning devices cannot solve the problems of zero-point drift and sensor failure. Especially in multi-sensor unit systems, any abnormal behavior of any sensor unit, such as outliers, permanent faults, temporary failures, or zero-point drift, will lead to inaccurate data acquisition of the entire system, affecting the correct assessment of electric field strength and the timeliness of early warning.

[0005] 2) Existing electric field early warning devices have significant shortcomings in processing and analyzing real-time data. They cannot effectively cope with rapidly changing environmental conditions, nor can they improve the accuracy and reliability of data according to the specific application needs of users, thus failing to provide timely and accurate early warnings.

[0006] 3) The alarm threshold settings of existing electric field early warning devices lack flexibility and are usually fixed single values ​​that cannot be adjusted according to specific application environments. This limitation results in poor adaptability of the early warning system and an inability to meet diverse monitoring needs.

[0007] 4) Existing electric field early warning devices often face problems of spatial induced charge accumulation and background noise during long-term operation. This charge accumulation and noise can interfere with the electric field detection results.

[0008] 5) Most of the electric field sensors integrated in existing electric field early warning devices are modular designs. Due to the accumulation of tolerances during the assembly process, the mismatch between components and mutual interference, the measurement error is large and the size is large, which is not conducive to deployment in space-constrained environments. Summary of the Invention

[0009] The purpose of this invention is to solve the technical problem that when power workers accidentally enter a strong electric field area in complex power operation sites with charge interference, they cannot receive real-time and accurate early warnings, which can easily lead to safety accidents. The invention proposes an electric field detection and early warning technology.

[0010] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: An electric field early warning device includes a multi-chip packaged electric field sensor, a signal conditioning circuit, a microcontroller, and an early warning execution module; The output of the multi-chip packaged electric field sensor is connected to the input of the signal conditioning circuit. The output of the signal conditioning circuit is connected to the input of the microcontroller. The output of the microcontroller is connected to the micro-electro-acoustic converter and the input of the vibrator drive circuit in the early warning execution module. The output of the micro-electro-acoustic converter is connected to the input of the micro-electro-acoustic device. The output of the vibrator drive circuit is connected to the input of the flat vibrator. A multi-chip packaged electric field sensor is used to detect spatial electric fields and converts the detected electric field signal into an induced voltage signal. A signal conditioning circuit is used to process the induced voltage signal and generate an induced voltage processing signal that meets the requirements. A microcontroller is used to receive the signal processed by the signal conditioning circuit, convert and analyze the signal, and output multiple warning drive signals to the warning execution module according to the set near-electricity warning threshold. The warning execution module is used to receive multiple warning drive signals and generate corresponding warning prompts.

[0011] The early warning execution module includes a micro-electroacoustic converter, micro-electroacoustic devices, a vibrator drive circuit, and a flat vibrator; The micro-electro-acoustic converter is used to receive the first warning drive signal output by the microcontroller and convert it into the electrical signal required by the micro-electro-acoustic device according to the first warning drive signal; the micro-electro-acoustic device is used to receive the electrical signal sent by the micro-electro-acoustic converter and convert it into a corresponding audio signal to push the warning to the power workers; the vibrator drive circuit is used to receive the second warning drive signal and output the flat vibrator drive signal according to the second warning drive signal; the flat vibrator is used to receive the vibrator drive signal and generate a corresponding vibration prompt.

[0012] It also includes a touch sensing module and a Bluetooth transmission module. The input port of the microcontroller is connected to the output of the touch sensing module, which can be used to reset vibration and sound prompts. The I / O of the microcontroller is connected to the Bluetooth transmission module, which is used to realize wireless data transmission and connection between the microcontroller and the mobile phone.

[0013] The multi-chip packaged electric field sensor includes a cap at the top and a base plate at the bottom. A supporting shell is provided between the cap and the base plate. The shell is arranged around the cap to form a cylindrical structure. A cavity is formed between the cap, the base plate, and the shell. A cross-shaped shielding layer is provided in the cavity and perpendicular to the upper surface of the base plate. The cross-shaped shielding layer has a cross-shaped cross-section. The bottom of the cross-shaped shielding layer is connected to the upper surface of the base plate to divide the internal space of the cavity into four equal blocks.

[0014] The cavity is divided into four equal-sized spaces in a clockwise or counterclockwise direction along its cross-section: a first sensing unit space, a second sensing unit space, a third sensing unit space, and a fourth sensing unit space. The bottom heights of the first, second, third, and fourth sensing unit spaces increase sequentially at equal intervals according to their numbers. The height is the distance between the plane at the bottom of each sensing unit space and the plane at the top surface of the base plate. Each of the four equal-sized spaces has a sensing unit at the center of its bottom surface, which is used to sense the external electric field to be measured.

[0015] When the device is in operation, it employs the following steps: Step 1) Place the device at the target location. Under the influence of the external electric field to be measured, the output value of each sensing unit will be continuously acquired, which can be expressed as: ; In the formula, V i It is the output of the sensing unit. k i It is the inductance coefficient of the sensing unit. E im It is the electric field generated at the induction unit by the external electric field to be measured. E in It is the interference electric field generated by the accumulation of space charge at the sensing unit or the additional electric field caused by the base noise, V im It is the zero-point output of the sensing unit, V in It is the zero-point drift of the sensing unit; Step 2) The signal conditioning circuit processes the induced voltage signal, including signal amplification and filtering functions, to improve its strength and reliability in order to meet the processing requirements of the microcontroller. Step 3) The microcontroller receives the signal processed by the signal conditioning circuit and, according to the signal instructions from the monitoring platform, calibrates the coupling inductance coefficients of each sensing unit in the X, Y, and Z directions of the electric field, thus obtaining the coupling inductance coefficient matrix. Furthermore, optimal autoregression is used to perform zero-point correction and outlier detection on the output of each sensing unit, eliminating V An V Bn V Cn V Dn Impact (V) An V Bn V Cn V Dn It is the zero-point drift V of sensing units A, B, C, and D. in This improves robustness against zero-point drift and sensor failure. Step 4) After processing, the actual output voltages of sensing units A, B, C, and D are obtained. V A , V B , V C , V D According to the formula for calculating the relative position coefficient , , The positional relationships of the three sensing units A, B, and C relative to sensing unit D are respectively determined by coefficients. α A , α B , α C In the formula, r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit at the bottom of the space where the first sensing unit is located, and h is the height of each layer rising from the bottom of the space where the sensing unit is located. A spatial denoising algorithm is used to eliminate the influence of interfering electric fields and substrate noise, thereby obtaining the sensor's true response to the external electric field. E x , E y , E z .

[0016] In step 4), the specific calculation formula of the spatial denoising algorithm used is as follows: ; In the formula, V A , V B , V C , V DThese are the outputs of sensing units A, B, C, and D. k Ax , k Ay , k Az These are the coupling induction coefficients of the electric field in the X, Y, and Z directions of sensing unit A, respectively; k Bx , k By , k Bz These are the coupling induction coefficients of the electric field in sensing unit B in the X, Y, and Z directions, respectively. k Cx , k Cy , k Cz These are the coupling induction coefficients of the electric field of the sensing unit C in the X, Y, and Z directions, respectively. E x , E y , E z These represent the components of the external electric field in the X, Y, and Z directions, respectively. α A , α B , α C These are the relative position coefficients of sensing units A, B, and C relative to sensing unit D. V Am , V Bm , V Cm , V Dm These are the zero-point outputs of sensing units A, B, C, and D, respectively.

[0017] A multi-chip packaged electric field sensor device includes a cap on top, a base plate on the bottom, and a supporting shell between the cap and the base plate. The shell is arranged around the cap to form a cylindrical structure. A cavity is formed between the cap, the base plate, and the shell. A cross-shaped shielding layer is provided in the cavity and perpendicular to the upper surface of the base plate. The cross-shaped shielding layer has a cross-shaped cross-section. The bottom of the cross-shaped shielding layer is connected to the upper surface of the base plate to divide the internal space of the cavity into four equal blocks.

[0018] The cavity is divided into four equal-sized spaces in a clockwise or counterclockwise direction along its cross-section: a first sensing unit space, a second sensing unit space, a third sensing unit space, and a fourth sensing unit space. The bottom heights of the first, second, third, and fourth sensing unit spaces increase sequentially at equal intervals according to their numbers. The height is the distance between the plane at the bottom of each sensing unit space and the plane at the top surface of the base plate. Each of the four equal-sized spaces has a sensing unit at the center of its bottom surface, which is used to sense the external electric field to be measured.

[0019] When the device is in operation, it employs the following steps: Step 1) Place the device at the target location. Under the influence of the external electric field to be measured, the output value of each sensing unit will be continuously acquired, which can be expressed as: ; In the formula, V i It is the output of the sensing unit. k i It is the inductance coefficient of the sensing unit. E im It is the electric field generated at the induction unit by the external electric field to be measured. E in It is the interference electric field generated by the accumulation of space charge at the sensing unit or the additional electric field caused by the base noise, V im It is the zero-point output of the sensing unit, V in It is the zero-point drift of the sensing unit; Step 2) Process the induced voltage signal, including signal amplification and filtering, to improve its strength and reliability to meet the processing requirements of the microcontroller; Step 3) Receive the signal processed in Step 2) via the controller, calibrate the coupling inductance coefficients of the electric field in the X, Y, and Z directions for each sensing unit, and obtain the coupling inductance coefficient matrix. The optimal autoregression method is used to perform zero-point correction and outlier detection on the output of each sensing unit, eliminating V An V Bn V Cn V Dn Impact (V) An V Bn V Cn V Dn It is the zero-point drift V of sensing units A, B, C, and D. in This improves robustness against zero-point drift and sensor failure. Step 4) After processing, the actual output voltages of sensing units A, B, C, and D are obtained. V A ,V B , V C , V D According to the formula for calculating the relative position coefficient , , The positional relationships of the three sensing units A, B, and C relative to sensing unit D are respectively determined by coefficients. α A , α B , α C In the formula, r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit at the bottom of the space where the first sensing unit is located, and h is the height of each layer rising from the bottom of the space where the sensing unit is located. A spatial denoising algorithm is used to eliminate the influence of interfering electric fields and substrate noise, thereby obtaining the sensor's true response to the external electric field. E x , E y , E z .

[0020] In step 4), the specific calculation formula of the spatial denoising algorithm used is as follows: ; In the formula, V A , V B , V C , V D These are the outputs of sensing units A, B, C, and D. k Ax , k Ay , k Az These are the coupling induction coefficients of the electric field in the X, Y, and Z directions of the sensing unit A, respectively. k Bx , k By , k Bz These are the coupling induction coefficients of the electric field in sensing unit B in the X, Y, and Z directions, respectively. k Cx , k Cy , k Cz These are the coupling induction coefficients of the electric field of the sensing unit C in the X, Y, and Z directions, respectively. E x ,E y , E z These represent the components of the external electric field in the X, Y, and Z directions, respectively. α A , α B , α C These are the relative position coefficients of sensing units A, B, and C relative to sensing unit D. V Am , V Bm , V Cm , V Dm These are the zero-point outputs of sensing units A, B, C, and D, respectively.

[0021] Compared with the prior art, the present invention has the following technical effects: 1) This invention adopts a multi-chip integrated packaging design, which realizes a high degree of integration of sensor components, thereby reducing the sources of error in the assembly process and reducing the size of the sensor. This packaging can improve the consistency of interference signals and substrate noise caused by space charge accumulation, and is more conducive to space denoising algorithms to eliminate errors. 2) This invention significantly improves data processing capabilities by combining a multi-chip packaged electric field sensor with a microcontroller, and can complete complex calculations at high speed. The microcontroller provides a configurable data processing flow, allowing users to adjust algorithm parameters according to specific application requirements to achieve optimal performance. 3) This invention improves robustness against zero-point drift and sensor failure. Optimal autoregression enables zero-point correction and outlier detection for the output of each sensing unit, eliminating the impact of abnormal data from the sensing units. 4) This invention utilizes a spatial denoising algorithm to significantly eliminate the influence of interference electric fields and floor noise caused by space charge accumulation, thereby obtaining the sensor's true response to external electric fields; 5) This invention can adjust the warning threshold or warning prompts through wireless data transmission using a monitoring platform APP according to different application environments and user needs, which greatly enhances the adaptability and flexibility of the electric field warning device, enabling it to operate effectively in a variety of different monitoring environments. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a system block diagram of the electric field early warning device provided in the embodiments of this application; Figure 2This is a schematic diagram of the structure of the multi-chip packaged electric field sensor provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the circular four-equal-block layered base plate provided in the embodiments of this application; Figure 4 This is a flowchart illustrating the operation of the electric field early warning device provided in the embodiments of this application. Detailed Implementation

[0023] An electric field early warning device includes a multi-chip packaged electric field sensor 1, a signal conditioning circuit 2, a microcontroller 3, and an early warning execution module 4; The output terminal of the multi-chip packaged electric field sensor 1 is connected to the input terminal of the signal conditioning circuit 2. The output terminal of the signal conditioning circuit 2 is connected to the input terminal of the microcontroller 3. The output terminal of the microcontroller 3 is connected to the input terminal of the micro-electro-acoustic converter 5 in the early warning execution module 4 and the vibrator drive circuit 7. The output terminal of the micro-electro-acoustic converter 5 is connected to the input terminal of the micro-electro-acoustic device 6. The output terminal of the vibrator drive circuit 7 is connected to the input terminal of the flat vibrator 8. The multi-chip packaged electric field sensor 1 is used to detect the spatial electric field and convert the detected electric field signal into an induced voltage signal; the signal conditioning circuit 2 is used to process the induced voltage signal and generate an induced voltage processing signal that meets the requirements; the microcontroller 3 is used to receive the signal processed by the signal conditioning circuit, convert and analyze the signal, and output multiple warning drive signals to the warning execution module according to the set near-electricity warning threshold; the warning execution module 4 is used to receive multiple warning drive signals and generate corresponding warning prompts.

[0024] The early warning execution module 4 includes a micro-electroacoustic converter 5, a micro-electroacoustic device 6, a vibrator drive circuit 7, and a flat vibrator 8; The micro-electro-acoustic converter 5 is used to receive the first warning drive signal output by the microcontroller 3, and convert the electrical signal required by the micro-electro-acoustic device 6 according to the first warning drive signal; the micro-electro-acoustic device 6 is used to receive the electrical signal sent by the micro-electro-acoustic converter 5, convert the electrical signal into a corresponding audio signal, and push the warning to the power workers; the vibrator drive circuit 7 is used to receive the second warning drive signal, and output the flat vibrator 8 drive signal according to the second warning drive signal; the flat vibrator 8 is used to receive the vibrator drive signal and generate a corresponding vibration prompt.

[0025] It also includes a touch sensing module 9 and a Bluetooth transmission module 10. The input port of the microcontroller 3 is connected to the output terminal of the touch sensing module 9. The touch sensing module 9 can be used to reset vibration and sound prompts. The I / O of the microcontroller 3 is connected to the Bluetooth transmission module 10. The Bluetooth transmission module 10 is used to realize wireless data transmission and connection between the microcontroller 3 and the mobile phone.

[0026] The multi-chip packaged electric field sensor 1 includes a cap 14 disposed at the top and a base plate 11 disposed at the bottom. A supporting shell 12 is provided between the cap 14 and the base plate 11. The shell 12 is arranged around and forms a cylindrical structure. A cavity is formed between the cap 14, the base plate 11, and the shell 12. A cross-shaped shielding layer 13 is provided in the cavity and perpendicular to the upper surface of the base plate 11. The cross-shaped shielding layer 13 has a cross-shaped cross-section. The bottom of the cross-shaped shielding layer 13 is connected to the upper surface of the base plate 11 to divide the internal space of the cavity into four equal blocks.

[0027] The four equal-block spaces are sequentially divided into a first sensing unit setting space, a second sensing unit setting space, a third sensing unit setting space, and a fourth sensing unit setting space along the clockwise or counterclockwise direction of the cavity cross-section. The bottom heights of the first sensing unit setting space, the second sensing unit setting space, the third sensing unit setting space, and the fourth sensing unit setting space increase at equal intervals according to their numbering order. The height is the distance between the plane where the bottom of each sensing unit setting space is located and the plane where the upper surface of the base plate 11 is located. A sensing unit 15 is provided at the center of the bottom surface of each of the four equal-block spaces. The sensing unit 15 is used to sense the external electric field to be measured.

[0028] When the device is in operation, it employs the following steps: Step 1) Place the device at the target location. Under the action of the external electric field to be measured, the output value of each sensing unit (15) will be continuously acquired, which can be expressed as: ; In the formula, V i It is the output of the sensing unit. k i It is the inductance coefficient of the sensing unit. E im It is the electric field generated at the induction unit by the external electric field to be measured. E in It is the interference electric field generated by the accumulation of space charge at the sensing unit or the additional electric field caused by the base noise, V im It is the zero-point output of the sensing unit, V in It is the zero-point drift of the sensing unit; Step 2) The signal conditioning circuit processes the induced voltage signal, including signal amplification and filtering functions, to improve its strength and reliability in order to meet the processing requirements of the microcontroller. Step 3) The microcontroller receives the signal processed by the signal conditioning circuit and, according to the signal instructions from the monitoring platform, calibrates the coupling inductance coefficients of each sensing unit in the X, Y, and Z directions of the electric field, thus obtaining the coupling inductance coefficient matrix. Furthermore, optimal autoregression is used to perform zero-point correction and outlier detection on the output of each sensing unit, eliminating V An VBn V Cn V Dn Impact (V) An V Bn V Cn V Dn It is the zero-point drift V of sensing units A, B, C, and D. in This improves robustness against zero-point drift and sensor failure. Step 4) After processing, the actual output voltages of sensing units A, B, C, and D are obtained. V A , V B , V C , V D According to the formula for calculating the relative position coefficient , , The positional relationships of the three sensing units A, B, and C relative to sensing unit D are respectively determined by coefficients. α A , α B , α C In the formula, r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit at the bottom of the space where the first sensing unit is located, and h is the height of each layer rising from the bottom of the space where the sensing unit is located. A spatial denoising algorithm is used to eliminate the influence of interfering electric fields and substrate noise, thereby obtaining the sensor's true response to the external electric field. E x , E y , E z .

[0029] In step 4), the specific calculation formula of the spatial denoising algorithm used is as follows: ; In the formula, V A , V B , V C , V D These are the outputs of sensing units A, B, C, and D. k Ax , k Ay , k Az These are the coupling induction coefficients of the electric field in the X, Y, and Z directions of sensing unit A, respectively; k Bx, k By , k Bz These are the coupling induction coefficients of the electric field in sensing unit B in the X, Y, and Z directions, respectively. k Cx , k Cy , k Cz These are the coupling induction coefficients of the electric field of the sensing unit C in the X, Y, and Z directions, respectively. E x , E y , E z These represent the components of the external electric field in the X, Y, and Z directions, respectively. α A , α B , α C These are the relative position coefficients of sensing units A, B, and C relative to sensing unit D. V Am , V Bm , V Cm , V Dm These are the zero-point outputs of sensing units A, B, C, and D, respectively.

[0030] The present invention also provides a multi-chip packaged electric field sensor device, which can still stably and sensitively detect the electric field strength of a target electric field under charge interference. It includes a cap 14 disposed at the top, a base plate 11 disposed at the bottom, and a supporting shell 12 disposed between the cap 14 and the base plate 11. The shell 12 is arranged around and forms a cylindrical structure. A cavity is formed between the cap 14, the base plate 11, and the shell 12. A cross-shaped shielding layer 13 is disposed in the cavity and perpendicular to the upper surface of the base plate 11. The cross-shaped shielding layer 13 has a cross-shaped cross ...

[0031] The four equal-block spaces are sequentially divided into a first sensing unit setting space, a second sensing unit setting space, a third sensing unit setting space, and a fourth sensing unit setting space along the clockwise or counterclockwise direction of the cavity cross-section. The bottom heights of the first sensing unit setting space, the second sensing unit setting space, the third sensing unit setting space, and the fourth sensing unit setting space increase at equal intervals according to their numbering order. The height is the distance between the plane where the bottom of each sensing unit setting space is located and the plane where the upper surface of the base plate 11 is located. A sensing unit 15 is provided at the center of the bottom surface of each of the four equal-block spaces. The sensing unit 15 is used to sense the external electric field to be measured.

[0032] When the device is in operation, it employs the following steps: Step 1) Place the device at the target location. Under the action of the external electric field to be measured, the output value of each sensing unit (15) will be continuously acquired, which can be expressed as: ; In the formula, V i It is the output of the sensing unit. k i It is the inductance coefficient of the sensing unit. E im It is the electric field generated at the induction unit by the external electric field to be measured. E in It is the interference electric field generated by the accumulation of space charge at the sensing unit or the additional electric field caused by the base noise, V im It is the zero-point output of the sensing unit, V in It is the zero-point drift of the sensing unit; Step 2) Process the induced voltage signal, including signal amplification and filtering, to improve its strength and reliability to meet the processing requirements of the microcontroller; Step 3) Receive the signal processed in Step 2) via the controller, calibrate the coupling inductance coefficients of the electric field in the X, Y, and Z directions for each sensing unit, and obtain the coupling inductance coefficient matrix. The optimal autoregression method is used to perform zero-point correction and outlier detection on the output of each sensing unit, eliminating V An V Bn V Cn V Dn Impact (V) An V Bn V Cn V Dn It is the zero-point drift V of sensing units A, B, C, and D. in This improves robustness against zero-point drift and sensor failure. Step 4) After processing, the actual output voltages of sensing units A, B, C, and D are obtained. V A, V B , V C , V D According to the formula for calculating the relative position coefficient , , The positional relationships of the three sensing units A, B, and C relative to sensing unit D are respectively determined by coefficients. α A , α B , α C In the formula, r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit at the bottom of the space where the first sensing unit is located, and h is the height of each layer rising from the bottom of the space where the sensing unit is located. A spatial denoising algorithm is used to eliminate the influence of interfering electric fields and substrate noise, thereby obtaining the sensor's true response to the external electric field. E x , E y , E z .

[0033] In step 4), the specific calculation formula of the spatial denoising algorithm used is as follows: ; In the formula, V A , V B , V C , V D These are the outputs of sensing units A, B, C, and D. k Ax , k Ay , k Az These are the coupling induction coefficients of the electric field in the X, Y, and Z directions of the sensing unit A, respectively. k Bx , k By , k Bz These are the coupling induction coefficients of the electric field in sensing unit B in the X, Y, and Z directions, respectively. k Cx , k Cy , k Cz These are the coupling induction coefficients of the electric field of the sensing unit C in the X, Y, and Z directions, respectively. E x ,E y , E z These represent the components of the external electric field in the X, Y, and Z directions, respectively. α A , α B , α C These are the relative position coefficients of sensing units A, B, and C relative to sensing unit D. V Am , V Bm , V Cm , V Dm These are the zero-point outputs of sensing units A, B, C, and D, respectively.

[0034] Example: like Figure 1 As shown, the embodiment provides an electric field early warning device, which includes a multi-chip packaged electric field sensor 1, a signal conditioning circuit 2, a microcontroller 3, an early warning execution module 4, a micro-electro-acoustic converter 5, a micro-electro-acoustic device 6, a vibrator drive circuit 7, a flat vibrator 8, a touch sensing module 9, and a Bluetooth transmission module 10.

[0035] Among them, the multi-chip packaged electric field sensor 1 is used to detect the spatial electric field and convert it into an induced voltage signal after detecting the electric field.

[0036] Signal conditioning circuit 2 is used to process the induced voltage signal and generate an induced voltage processing signal that meets the requirements.

[0037] The microcontroller 3 is used to receive the signal after it has been processed by the signal conditioning circuit, and to convert and analyze the signal. It provides a configurable data processing flow, allowing users to adjust parameters according to specific application requirements to achieve optimal performance. It outputs two warning drive signals to the warning execution module according to the set near-electricity warning threshold.

[0038] The early warning execution module 4 is used to receive two early warning drive signals and generate corresponding early warning prompts.

[0039] The micro-electroacoustic converter 5 is used to receive the first warning drive signal output by the microcontroller 3 and convert the electrical signal required by the micro-electroacoustic device according to the first warning drive signal.

[0040] The micro-electroacoustic device 6 is used to receive the electrical signal sent by the micro-electroacoustic converter 5, convert the electrical signal into a corresponding audio signal, and push a warning to the power workers.

[0041] The vibrator drive circuit 7 is used to receive the second warning drive signal and output the flat vibrator drive signal according to the second warning drive signal.

[0042] The flat vibrator 8 is used to receive the vibrator drive signal and generate corresponding vibration prompts.

[0043] Optionally, in addition to outputting warning information through the micro-electroacoustic device 6 and the flat vibrator 8, warning information can also be pushed to power workers by flashing lights.

[0044] In practical applications, when the electric field warning device approaches a strong electric field area, it will issue a warning. If the worker is working in that area, the warning device will continue to issue warnings, which will interfere with the worker's normal work.

[0045] Therefore, a touch sensing module 9 is also installed on the electric field early warning device.

[0046] The touch sensing module 9 can be used to reset vibration and sound prompts.

[0047] To facilitate adjustments to the warning thresholds and warning prompts, a Bluetooth transmission module 10 for wireless data transmission is added in the specific embodiments of this application.

[0048] Specifically, the Bluetooth transmission module 10 is used to realize wireless data transmission and connection between the microcontroller 3 and the mobile phone.

[0049] The mobile phone is used to install the monitoring platform APP. Through the monitoring platform APP, the warning threshold or warning prompts can be adjusted to meet different application environments and user needs, greatly enhancing the adaptability and flexibility of the warning device.

[0050] like Figure 2 As shown in the schematic diagram of the multi-chip packaged electric field sensor provided in the embodiment, it includes a circular four-block layered base plate 11, a supporting shell 12, a cross-shaped shielding layer 13, and a cap 14 as the main structure of the sensor; the circular four-block layered base plate 11 and the cross-shaped shielding layer 13 divide the main body into four equal blocks; the lower end of the supporting shell 12 is connected to the circumference of the circular four-block layered base plate 11, and the upper end of the supporting shell 12 is connected to the cap 14, thereby forming a rotating layered closed space structure; a sensing unit 15 is provided at the center of the surface of each block base plate, and the sensing unit 15 is used to sense the external electric field to be measured; like Figure 3As shown in the schematic diagram of the circular four-block layered base plate provided in the embodiment, the four blocks of the base plate are raised layer by layer in a counterclockwise direction, and the height of each layer is consistent. The upper surface of the circular four-block layered base plate is connected to the cross shielding layer 13, and the circumference of the circular four-block layered base plate is connected to the supporting shell 12. This allows the sensing units to share the same encapsulation shell, which not only protects them from the influence of surrounding environmental factors and effectively reduces mismatch errors and mutual interference between components, improving the accuracy and reliability of data, but also greatly reduces the sensor size and lowers product costs. More importantly, it improves the consistency of interference signals and floor noise caused by space charge accumulation, which is more conducive to the spatial denoising algorithm to eliminate errors.

[0051] like Figure 4 The diagram shown is a flowchart of the electric field early warning device provided in this application embodiment. Specifically, it includes the following steps: Step 1) Under the influence of the external electric field to be measured, the output value of each sensing unit will be continuously acquired, which can be expressed as: ; In the formula, V i It is the output of the sensing unit. k i It is the inductance coefficient of the sensing unit. E im It is the electric field generated at the induction unit by the external electric field to be measured. E in It is the interference electric field generated by charge accumulation at the sensing unit or the additional electric field caused by the base noise, V im It is the zero-point output of the sensing unit, V in It is the zero-point drift of the sensing unit; Step 2) The signal conditioning circuit processes the induced voltage signal, including signal amplification and filtering functions, to improve its strength and reliability in order to meet the processing requirements of the microcontroller. Step 3) The microcontroller receives the signal processed by the signal conditioning circuit and, according to the signal instructions from the monitoring platform, calibrates the coupling inductance coefficients of each sensing unit in the X, Y, and Z directions of the electric field, thus obtaining the coupling inductance coefficient matrix. Furthermore, optimal autoregression is used to perform zero-point correction and outlier detection on the output of each sensing unit, eliminating V An V Bn V Cn V Dn Impact (V) An V Bn V Cn V Dn It is the zero-point drift V of sensing units A, B, C, and D. in This improves robustness against zero-point drift and sensor failure. Step 4) After processing, the actual outputs of sensing units A, B, C, and D are obtained. V A , V B , V C , V D According to the formula for calculating the relative position coefficient , , The positional relationships of the three sensing units A, B, and C relative to sensing unit D are respectively determined by coefficients. α A , α B , α C In the formula, r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit at the bottom of the space where the first sensing unit is located, and h is the height of each layer rising from the bottom of the space where the sensing unit is located. A spatial denoising algorithm is used to eliminate the influence of interfering electric fields and substrate noise, thereby obtaining the sensor's true response to the external electric field. E x , E y , E z ; In step 4, the specific calculation formula of the spatial denoising algorithm used is as follows: ; In the formula, V A , V B , V C , V D These are the outputs of sensing units A, B, C, and D. k Ax , k Ay , k Az These are the coupling induction coefficients of the electric field in the X, Y, and Z directions of the sensing unit A, respectively. k Bx , k By , k Bz These are the coupling induction coefficients of the electric field in sensing unit B in the X, Y, and Z directions, respectively. k Cx , k Cy , k CzThese are the coupling induction coefficients of the electric field of the sensing unit C in the X, Y, and Z directions, respectively. E x , E y , E z These represent the components of the external electric field in the X, Y, and Z directions, respectively. α A , α B , α C These are the relative position coefficients of sensing units A, B, and C relative to sensing unit D. V Am , V Bm , V Cm , V Dm These are the zero-point outputs of sensing units A, B, C, and D, respectively.

Claims

1. A multi-chip package electric field sensor device, comprising: The device comprises a cap (14) arranged on the top, a bottom plate (11) arranged on the bottom, and a supporting shell (12) arranged between the cap (14) and the bottom plate (11), the shell (12) is arranged around and forms a cylindrical structure, the cap (14), the bottom plate (11) and the shell (12) form a cavity, a cross-shaped shielding layer (13) is arranged in the cavity and perpendicular to the upper surface of the bottom plate (11), the cross section of the cross-shaped shielding layer (13) is cross-shaped; the bottom of the cross-shaped shielding layer (13) is connected with the upper surface of the bottom plate (11), so as to divide the internal space of the cavity into four equal spaces.

2. The apparatus of claim 1, wherein, The four equal spaces are sequentially divided into a first induction unit arrangement space, a second induction unit arrangement space, a third induction unit arrangement space and a fourth induction unit arrangement space along the clockwise direction or the counterclockwise direction of the cross section of the cavity; the heights of the bottoms of the first induction unit arrangement space, the second induction unit arrangement space, the third induction unit arrangement space and the fourth induction unit arrangement space are equal and increase layer by layer according to the numbering order.

3. The apparatus of claim 2, wherein, The height is the distance between the plane where the bottom of each induction unit arrangement space is located and the plane where the upper surface of the bottom plate (11) is located, and an induction unit (15) is arranged at the center of the bottom surface of each of the four equal spaces, and the induction unit (15) is used to sense an external electric field to be measured.

4. The apparatus of claim 2 or 3, wherein, When the device works, the following steps are adopted: Step 1) placing the device at a target position, under the action of an external electric field to be measured, the output value of each induction unit (15) is continuously acquired; Step 2) processing the induction voltage signal, including signal amplification and filtering functions, to improve its strength and reliability to meet the processing requirements of the microcontroller; Step 3) receiving the signal processed by step 2) by the controller, calibrating the coupling inductance coefficient of each sensing unit in X, Y, Z direction electric field, and obtaining the coupling inductance coefficient matrix , using optimal autoregression to correct zero point and detect outliers of the output of each sensing unit, eliminating the influence of V An , V Bn , V Cn , V Dn , V An , V Bn , V Cn , V Dn is the zero point drift V in of the sensing units A, B, C, D, and improving the robustness to zero point drift and sensor failure; Step 4) The real output voltage of the sensing unit A, B, C, D is obtained after processing V A , V B , V C , V D .

5. The apparatus of claim 4, wherein, In step 1), the output value of each induction unit (15) is represented as: ； where V i is the output of the sensing unit, k i is the induction coefficient of the sensing unit, E im is the electric field generated by the external electric field to be measured at the sensing unit, E in is the interference electric field generated by the accumulation of space charges at the sensing unit or the additional electric field caused by the substrate noise, V im is the zero-point output of the sensing unit, V in is the zero-point drift of the sensing unit.

6. The apparatus of claim 4, wherein, In step 4), the real output voltage is obtained V A , V B , V C , V D After that, according to the relative position coefficient calculation formula , , , the position relationship of A, B, C three sensing units relative to sensing unit D is described by coefficients α A , α B , α C , where r is the radius of the base plate, d is the distance between the lower surface of the cap and the upper surface of the sensing unit arranged at the bottom of the sensing unit arrangement space, h is the height of the bottom of the sensing unit arrangement space rising layer by layer, and the influence of the interference electric field and the substrate noise is eliminated by using the spatial denoising algorithm, so as to obtain the real response of the sensor to the external electric field E x , E y , E z .

7. The apparatus of claim 6, wherein, In step 4), the specific calculation formula of the spatial denoising algorithm is as follows: ； wherein V A , V B , V C , V D are the outputs of the sensing units A, B, C, D, k Ax , k Ay , k Az are the coupling induction coefficients of the sensing unit A in the X, Y, Z direction electric field, respectively, k Bx , k By , k Bz are the coupling induction coefficients of the sensing unit B in the X, Y, Z direction electric field, respectively, k Cx , k Cy , k Cz are the coupling induction coefficients of the sensing unit C in the X, Y, Z direction electric field, respectively, E x , E y , E z are the components of the external electric field in the X, Y, Z direction, respectively, α A , α B , α C are the relative position coefficients of the three sensing units A, B, C relative to the sensing unit D, respectively, V Am , V Bm , V Cm , V Dm are the zero point outputs of the sensing units A, B, C, D, respectively.

8. The apparatus of claim 6 or 7, wherein, The spatial denoising algorithm can significantly eliminate the influence of the interference electric field and the base noise caused by the accumulation of space charges, and can obtain the real response of the sensor to the external electric field.

9. The apparatus of one of claims 1 to 7, characterized by The multi-chip package electric field sensor device is used for detecting a spatial electric field and converting an electric field signal into an induction voltage signal after detecting the electric field signal.

10. The apparatus of one of claims 1 to 7, characterized by The multi-chip package electric field sensor device can still stably and sensitively detect the electric field intensity of a target electric field under the condition of charge interference.

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