An integrated power supply device

Abstract

The application relates to the technical field of power supplies, in particular to an integrated power supply device which comprises a self-adjusting vertical heat dissipation mechanism and a heat-conducting element combined installation mechanism; the self-adjusting vertical heat dissipation mechanism comprises a four-pyramid surface cylinder, and a four-pyramid vertical flow guide cylinder is vertically arranged at the upper end of the four-pyramid surface cylinder; the heat-conducting element combined installation mechanism comprises a positioning installation column which is vertically arranged on the four-pyramid surface cylinder, and a plurality of right-angle element installation covers are arranged above the four-pyramid surface cylinder. Through the combination of passive flow guiding and active adjustment based on pressure feedback of a phase change medium, dynamic matching of heat dissipation efficiency and power load is realized, and the heat dissipation capacity and operation reliability are remarkably improved; the unique three-dimensional modular layout realizes vertical multi-layer stacking of elements through the positioning installation column and the right-angle element installation cover, and the structure is compact and convenient to maintain; an efficient heat conduction channel from elements to a heat dissipation core is constructed in the device, and heat is quickly conducted out.

Description

Technical Field

[0001] This invention relates to the field of power supply technology, and in particular to an integrated power supply device. Background Technology

[0002] With the rapid development of power electronic equipment, integrated power supply devices, as the core power supply unit of various electronic systems, have attracted much attention for their performance stability, space adaptability, and service life. However, traditional power supply devices still face many technical bottlenecks in practical applications, making it difficult to meet the needs of high power density and complex operating conditions.

[0003] Most existing power supply devices use passive heat sinks or active fans for heat dissipation. Passive cooling is adequate for low loads, but its cooling capacity is fixed and cannot increase with power, which can easily lead to overheating, frequency reduction, or even damage to the equipment. Active fan cooling, on the other hand, has risks of energy consumption, noise, dust accumulation, and single point of failure. More importantly, both of these methods lack the ability to self-regulate based on the actual internal temperature and heat dissipation pressure, resulting in a disconnect between the working state of the cooling system and the actual needs of the power supply.

[0004] Traditional power supply devices often employ a planar, board-like layout for their internal components. This two-dimensional structure limits space utilization and hinders the miniaturization and high power density of the equipment. Furthermore, the fixed installation and connection methods for components result in low modularity. When a single component fails or requires an upgrade, the entire device often needs to be disassembled, leading to cumbersome, time-consuming, and costly maintenance processes.

[0005] In many existing designs, the mounting structure of components only serves a mechanical fixing function, and its heat conduction path is not effectively planned. The heat transfer path from the heat-generating component to the external heat sink is long and has high thermal resistance, which easily forms local hot spots inside, accelerating component aging. The structural frame and heat dissipation system are often independent components, failing to form a unified and efficient thermal management network, resulting in low heat dissipation efficiency.

[0006] Furthermore, when power supply units are transported or operated in vibrating environments, traditional rigid mounting methods can easily transfer stress directly to electronic components, posing risks such as pin breakage and solder joint detachment, thus affecting the mechanical reliability of the equipment.

[0007] The present invention aims to solve the technical problems existing in the prior art, and to this end, proposes an integrated power supply device. Summary of the Invention

[0008] The purpose of this invention is to provide an integrated power supply device to solve the technical problems existing in the prior art.

[0009] By adopting the above technical solution, the present invention has the following beneficial effects:

[0010] The present invention provides an integrated power supply device, comprising a self-adjusting vertical heat dissipation mechanism and a heat-conducting component assembly mechanism;

[0011] As a further embodiment of the present invention: the self-adjusting vertical heat dissipation mechanism includes a four-sided pyramidal cylinder, a four-sided vertical flow guide cylinder is vertically arranged at the upper end of the four-sided pyramidal cylinder, and a flow guide mounting cylinder is vertically arranged at each of the four edges of the four-sided vertical flow guide cylinder.

[0012] As a further aspect of the present invention: a plurality of connecting guide holes are vertically and equally spaced inside the walls of the four-sided vertical guide cylinders between adjacent guide installation cylinders. The connecting guide holes are all horizontally arranged, and both ends of the connecting guide holes are connected to the guide installation cylinder.

[0013] As a further embodiment of the present invention: heat-conducting guide columns are vertically arranged at equal angles on the outer wall of the guide installation cylinder on the outer side of the quadrangular vertical guide cylinder.

[0014] As a further aspect of the present invention: the inner wall of the quadrangular vertical guide tube is provided with a number of horizontally arranged heat dissipation fins that connect to the guide holes, and the heat dissipation fins are all inclined upwards.

[0015] As a further aspect of the present invention: the lower end of the four sides of the quadrangular pyramidal cylinder is provided with a swing support plate through an elastic rubber column, and a number of passive guide holes are provided on the side of the swing support plate away from the elastic rubber column.

[0016] As a further embodiment of the present invention: an annular pressure equalizing cylinder is semi-embedded at the connection between the quadrangular vertical guide cylinder and the quadrangular pyramidal cylinder, the lower end of the guide cylinder is connected to the annular pressure equalizing cylinder, a pressure-relieving cylinder is provided on the wall of the quadrangular pyramidal cylinder on one side of the elastic rubber column, an arc-shaped telescopic column is provided on the pressure-relieving cylinder, and the end of the arc-shaped telescopic column is movably mounted on the swing support plate.

[0017] As a further aspect of the present invention: the pressure-relieving cylinder is connected to the annular pressure-equalizing cylinder through a synchronous connecting pipe, and an electrically controlled valve body is connected in series on the synchronous connecting pipe;

[0018] As a further embodiment of the present invention: the thermally conductive element assembly mounting mechanism includes positioning and mounting posts vertically arranged on the four sides of the four-sided pyramidal cylinder, and several right-angle element mounting covers are provided above the four sides of the four-sided pyramidal cylinder;

[0019] As a further embodiment of the present invention: a reinforcing rod is provided at the upper end of the positioning mounting post and the flow guiding mounting cylinder above the same edge of the four-sided pyramidal cylinder;

[0020] As a further embodiment of the present invention: the right-angle element mounting cover is provided with a positioning mounting cylinder on the outer right-angle end in conjunction with the positioning mounting post; a fixed mounting cover is provided on the side of the positioning mounting cylinder away from the right-angle element mounting cover; one end of the fixed mounting cover is connected to the positioning mounting cylinder; a supporting fixing plate is provided inside the fixed mounting cover; a threaded cylinder is horizontally provided through the other end of the fixed mounting cover; a threaded post is provided in conjunction with the threaded cylinder; a turntable is provided at one end of the threaded post extending out of the fixed mounting cover; and the other end of the threaded post is rotatably mounted on the supporting fixing plate; two conductive sliders are symmetrically provided on the inner side of the positioning mounting cylinder; and conductive grooves are provided on the outer side of the positioning mounting post in conjunction with the conductive sliders.

[0021] As a further aspect of the present invention: the right-angle ends of the right-angle element mounting cover are all provided with guide mounting sleeves in conjunction with the flow guiding mounting cylinders, and the inner side of the guide mounting sleeves is provided with heat-conducting guide grooves in conjunction with the heat-conducting guide columns.

[0022] As a further aspect of the present invention: two sets of elastic arc panels are symmetrically arranged on the outer side of the guide mounting sleeve, and several clamping plates are arranged at equal angles on the edge of the elastic arc panels. The deformation of the elastic arc panels can realize the lifting and pressing of all the clamping plates thereon.

[0023] As a further aspect of the present invention: several V-shaped elastic support frames are provided on the square pyramidal surface cylinder directly opposite the right-angle element mounting cover;

[0024] As a further embodiment of the present invention: a top cover plate is horizontally arranged above the four-sided pyramidal cylinder, and a directional mounting cylinder is arranged in the middle position of the top cover plate in conjunction with the gap of the inner wall of the four-sided vertical guide cylinder. A cover mounting cylinder is connected downward to the edge of the top cover plate, and the lower end of the cover mounting cylinder is installed on the four-sided pyramidal cylinder. The lower end of the cover mounting cylinder is provided with a fixing mounting groove in conjunction with the arc-shaped telescopic column. A connecting plate is provided at the upper end of the top cover plate, and several insertion holes are provided on the connecting plate. A terminal post for connecting the connecting plate is provided on the lower side of the top cover plate.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] 1. High-efficiency adaptive heat dissipation

[0027] This device achieves dynamic matching between heat dissipation efficiency and power load through an innovative self-adjusting vertical heat dissipation mechanism. The core four-sided pyramidal cylindrical structure, combined with guide fins, effectively utilizes the principle of hot air rising to form a continuous passive airflow channel, achieving basic high-efficiency heat dissipation. Furthermore, it integrates an active adjustment mechanism based on pressure feedback: when the internal heat generation increases, the phase change medium is heated, vaporized, and pressurized, which pushes the arc-shaped telescopic column to automatically raise the main body of the device, increasing the bottom air intake area and thus significantly improving the heat dissipation airflow; when the heat generation decreases, it automatically recovers, keeping the device always within the optimal operating temperature range. This "passive + active" adaptive heat dissipation mode effectively improves the power density and operational reliability of the power supply.

[0028] 2. Modular and highly integrated component layout

[0029] The device adopts a unique three-dimensional modular installation architecture. Through the cooperation of positioning mounting columns and right-angle component mounting covers, it realizes the vertical and multi-layer stacking installation of electronic components. This layout greatly optimizes the utilization of internal space, making the device compact and with a high power-to-volume ratio. At the same time, the modular design facilitates the pre-installation of components, mass production and rapid maintenance, effectively improving production and maintenance efficiency.

[0030] 3. Excellent thermal conductivity and thermal management performance

[0031] The thermally conductive component assembly mechanism is not only a structural carrier but also an efficient thermal management pathway. The right-angle component mounting cover quickly conducts the heat generated by the component to the guide mounting sleeve through the elastic arc panel and clamping plate. Then, through the tight cooperation between the thermally conductive guide column and the flow-guiding mounting cylinder, the heat is quickly transferred to the core channel of the entire heat dissipation system. This design ensures that heat is quickly dissipated from the source, avoids local overheating, and extends the component life.

[0032] 4. Robust and reliable structure, flexible installation adaptability, and cushioning protection.

[0033] The overall structure, consisting of positioning mounting columns, flow guiding mounting cylinders, and reinforcing rods, forms a robust three-dimensional frame, ensuring the mechanical strength and stability of the device. The V-shaped elastic support frame at the bottom of the device provides elastic support for the stacked modules, effectively buffering vibration and impact. The clamping plates used to fix the modules are also elastic, achieving flexible clamping of the components. This multi-layered elastic design not only ensures the stability of the installation but also protects the precision electronic components from damage caused by mechanical stress. Attached Figure Description

[0034] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0035] Figure 1 This is a three-dimensional structural diagram of an integrated power supply device.

[0036] Figure 2 This is a schematic diagram of the internal three-dimensional structure of an integrated power supply device.

[0037] Figure 3 This is a partial cross-sectional schematic diagram of the top cover plate, directional mounting cylinder, and cover mounting cylinder in an integrated power supply device.

[0038] Figure 4 This is a schematic diagram of a self-adjusting vertical heat dissipation mechanism in an integrated power supply device.

[0039] Figure 5 This is a partial cross-sectional schematic diagram of a self-adjusting vertical heat dissipation mechanism in an integrated power supply device.

[0040] Figure 6 for Figure 5 A diagram from another perspective.

[0041] Figure 7 for Figure 6 An enlarged schematic diagram of point a in the middle.

[0042] Figure 8 This is a partial three-dimensional structural diagram of a thermally conductive component assembly mechanism in an integrated power supply device.

[0043] Figure 9 This is a half-sectional schematic diagram of an integrated power supply device at the positioning and mounting cylinder.

[0044] Figure 10 This is a three-dimensional structural diagram of an integrated power supply device at the guide mounting sleeve.

[0045] Figure 11 for Figure 8 Enlarged diagram of point b in the middle.

[0046] Figure 12 for Figure 9 An enlarged view of point c in the middle.

[0047] 1-Cover mounting cylinder, 2-Connecting plate, 3-Directional mounting cylinder, 4-Elastic rubber column, 5-Swing support plate, 6-Arc-shaped telescopic column, 7-Passive flow guide hole, 8-Four-sided pyramidal cylinder, 9-Right-angle component mounting cover, 10-Positioning mounting column, 11-Positioning mounting cylinder, 12-V-shaped elastic support frame, 13-Reinforcing rod, 14-Four-sided vertical flow guide cylinder, 15-Flow guide mounting cylinder, 16-Flow guide heat dissipation fins, 17-Annular pressure equalizing cylinder, 18- 19-Synchronous connecting pipe, 20-Electrically controlled valve body, 21-Pressure-relieving cylinder, 22-Supporting fixing plate, 23-Connecting guide hole, 24-Top cover plate, 25-Fixed mounting groove, 26-Heat-conducting guide column, 27-Heat-conducting guide groove, 28-Guide mounting sleeve, 29-Elastic arc panel, 30-Clamping plate, 31-Conductive slide groove, 32-Fixed mounting cover, 33-Turntable, 34-Conductive slider, 35-Threaded cylinder, 36-Threaded column. Detailed Implementation

[0048] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0049] The following disclosure provides numerous different embodiments or examples for implementing various structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0050] Example 1, please refer to Figures 1-3 In this embodiment of the invention, an integrated power supply device includes a self-adjusting vertical heat dissipation mechanism and a thermally conductive component assembly mechanism.

[0051] The self-adjusting vertical heat dissipation mechanism includes a four-sided pyramidal cylinder 8, with a four-sided vertical flow guide cylinder 14 vertically arranged at the upper end of the four-sided pyramidal cylinder 8; the heat-conducting element assembly and installation mechanism includes positioning and installation columns 10 vertically arranged on the four sides of the four-sided pyramidal cylinder 8, and several right-angle element installation covers 9 arranged above each of the four sides of the four-sided pyramidal cylinder 8; a top cover plate 24 is horizontally arranged above the four-sided pyramidal cylinder 8, and an directional installation cylinder 3 is arranged in the middle position of the top cover plate 24 in cooperation with the gap of the inner wall of the four-sided vertical flow guide cylinder 14; the edge of the top cover plate 24 is connected downward to the cover installation cylinder 1, and the lower end of the cover installation cylinder 1 is installed on the four-sided pyramidal cylinder 8;

[0052] A connecting plate 2 is provided at the upper end of the top cover plate 24. The connecting plate 2 has several holes. A terminal block 23 for connecting the connecting plate 2 is provided on the lower side of the top cover plate 24.

[0053] First, the power supply components are pre-installed inside the right-angle component mounting cover 9. The pre-installed right-angle component mounting cover 9 is then guided and installed in conjunction with the positioning mounting post 10 and the four-sided vertical guide tube 14 to achieve vertical, multi-layer, and stacked installation of the right-angle component mounting cover 9. After stacking, the cover mounting tube 1 and its top cover plate 24 are installed. After the directional mounting tube 3 is inserted into the four-sided vertical guide tube 14, the bottom of the cover mounting tube 1 is fixed on the four-sided pyramidal tube 8 to complete the assembly. At this time, the terminal block 23 is electrically connected to the inside right-angle component mounting cover 9 through the cable, and connected to the external equipment through the connecting plate 2 and its socket.

[0054] The generated heat is transferred to the four-sided vertical guide tube 14 through the self-adjusting vertical heat dissipation mechanism and the heat-conducting element combination installation mechanism. An upward airflow is generated in the vertical guide structure composed of the four-sided vertical guide tube 14 and the four-sided pyramidal tube 8, which continuously draws the airflow below the four-sided pyramidal tube 8 into the four-sided vertical guide tube 14 and discharges it, continuously dissipating the heat conducted into the four-sided vertical guide tube 14, thus completing the passive guide.

[0055] Example 2, based on Example 1, please refer to... Figures 4-7 In this embodiment of the invention, the self-adjusting vertical heat dissipation mechanism further includes a quadrangular vertical flow guide cylinder 14, with flow guide mounting cylinders 15 vertically arranged at all four edges. A plurality of connecting flow guide holes 22 are vertically and equally spaced within the walls of the quadrangular vertical flow guide cylinders 14 between adjacent flow guide mounting cylinders 15. All connecting flow guide holes 22 are horizontally arranged, and both ends of each connecting flow guide hole 22 are connected to the flow guide mounting cylinder 15. Heat-conducting guide columns 26 are vertically arranged at equal angles on the outer wall of the flow guide mounting cylinder 15 outside the quadrangular vertical flow guide cylinder 14. A plurality of flow guide heat dissipation fins 16 are horizontally arranged on the inner wall of the quadrangular vertical flow guide cylinder 14 in conjunction with the connecting flow guide holes 22. All flow guide heat dissipation fins 16 are inclined upwards.

[0056] The lower end of the four sides of the quadrangular pyramidal cylinder 8 is provided with swing support plates 5 through elastic rubber columns 4. Several passive flow guide holes 7 are provided on the side of the swing support plate 5 away from the flow guide heat dissipation fins 16.

[0057] An annular pressure equalizing cylinder 17 is semi-embedded at the connection between the four-sided vertical guide cylinder 14 and the four-sided pyramidal cylinder 8. The lower end of the guide installation cylinder 15 is connected to the annular pressure equalizing cylinder 17. A pressure-relieving cylinder 20 is provided on the wall of the four-sided pyramidal cylinder 8 on one side of the elastic rubber column 4. An arc-shaped telescopic column 6 is provided on the pressure-relieving cylinder 20. The end of the arc-shaped telescopic column 6 is movably installed on the swing support plate 5. The pressure-relieving cylinder 20 is connected to the annular pressure equalizing cylinder 17 through a synchronous connecting pipe 18. An electrically controlled valve body 19 is connected in series on the synchronous connecting pipe 18.

[0058] Phase change medium is pre-added in the flow guide installation cylinder 15, the connecting flow guide hole 22, the annular pressure equalization cylinder 17, and the synchronous connecting pipe 18. The heat generated by the operation of the component is introduced into the flow guide installation cylinder 15 through the heat-conducting guide column 26, which raises the temperature inside the flow guide installation cylinder 15 and changes the state of the phase change medium inside it, so that the heat is transferred to the connecting flow guide hole 22 and evenly transferred to the cylinder wall of the four-sided vertical flow guide cylinder 14. At the same time, the heat is quickly transferred to the flow guide heat dissipation fins 16 on one side of the connecting flow guide hole 22, and the flow guide heat dissipation fins 16 are all inclined upwards, which, together with the rising airflow inside the four-sided vertical flow guide cylinder 14, accelerates the efficiency of passive flow heat dissipation.

[0059] While heat dissipation is in progress, the air pressure in the space connected by the flow guide cylinder 15, the connecting flow guide hole 22, the annular pressure equalizing cylinder 17, and the synchronous connecting pipe 18 increases. The more heat is absorbed, the greater the pressure, and the greater the heat dissipation pressure. At this time, the phase change medium enters the pressure relief cylinder 20 through the electronically controlled valve body 19 and squeezes the arc-shaped telescopic column 6, causing the swing support plate 5 to rotate around the elastic rubber column 4, widening the gap between the square pyramidal cylinder 8 and the lower support surface, increasing the air flow rate entering the square pyramidal cylinder 8 through the passive flow guide hole 7, increasing the air throughput of passive flow heat dissipation, thereby improving heat dissipation efficiency to alleviate internal heat dissipation pressure, so that the internal components are always in the best working state.

[0060] As the heat dissipation pressure decreases, the pressure in the space connected by the flow guide installation cylinder 15, the connecting flow guide hole 22, the annular pressure equalizing cylinder 17, and the synchronous connecting pipe 18 gradually decreases. At this time, the arc-shaped telescopic column 6 gradually contracts, and the height of the four-sided pyramidal cylinder 8 gradually decreases until a state of equilibrium is reached.

[0061] Example 3, based on Examples 1 and 2, please refer to... Figures 8-12In this embodiment of the invention, the thermally conductive element assembly mounting mechanism further includes a positioning mounting cylinder 11 whose outer right-angle end of the right-angle element mounting cover 9 is fitted with a positioning mounting post 10. A fixed mounting cover 32 is provided on the side of the positioning mounting cylinder 11 away from the right-angle element mounting cover 9. One end of the fixed mounting cover 32 is connected to the positioning mounting cylinder 11. A supporting fixing plate 21 is provided inside the fixed mounting cover 32. A threaded cylinder 35 is horizontally provided through the other end of the fixed mounting cover 32. A threaded post 36 is provided in conjunction with the threaded cylinder 35. A turntable 33 is provided at one end of the threaded post 36 extending out of the fixed mounting cover 32. The other end of the threaded post 36 is rotatably mounted on the supporting fixing plate 21. Two conductive sliders 34 are symmetrically provided on the inner side of the positioning mounting cylinder 11. A conductive groove 31 is provided on the outer side of the positioning mounting post 10 in conjunction with the conductive sliders 34.

[0062] The right-angle end of the right-angle element mounting cover 9 is provided with a guide mounting sleeve 28 in conjunction with the flow guide mounting cylinder 15. The inner side of the guide mounting sleeve 28 is provided with a heat-conducting guide groove 27 in conjunction with the heat-conducting guide column 26. Two sets of elastic arc panels 29 are symmetrically arranged on the outer side of the guide mounting sleeve 28. Several clamping plates 30 are provided at equal angles on the edge of the elastic arc panel 29. The deformation of the elastic arc panel 29 can realize the lifting and pressing of all the clamping plates 30 on it.

[0063] Several V-shaped elastic support frames 12 are provided on the square pyramidal cylinder 8 facing the right-angle element mounting cover 9. The upper end of the positioning mounting post 10 and the flow guiding mounting cylinder 15 above the same edge of the square pyramidal cylinder 8 are connected with a reinforcing rod 13. The lower end of the cover mounting cylinder 1 is provided with a fixed mounting groove 25 in conjunction with the arc-shaped telescopic post 6.

[0064] Based on the thickness of the right-angle component mounting cover 9, the elastic arc panel 29 on one or both sides is deformed. The deformation can be achieved by bending or by using external equipment, so that the elastic arc panel 29 on both sides moves away. At this time, the clamping plate 30 on it also moves away. Then, the right-angle component mounting cover 9 is placed between the elastic arc panel 29 on both sides, so that the elastic arc panel 29 on one or both sides returns to its original shape. The clamping plates 30 on both sides clamp the right-angle component mounting cover 9, which can transfer the heat generated on it to the elastic arc panel 29 and the guide mounting sleeve 28 in a timely manner. Since the guide mounting sleeve 28 and the flow guiding mounting cylinder 15 are installed in cooperation through the heat-conducting guide column 26 and the heat-conducting guide groove 27, the heat can be introduced into the flow guiding mounting cylinder 15 through the heat-conducting guide column 26 and the heat-conducting guide groove 27, and passive flow guiding heat dissipation is completed in conjunction with the self-adjusting vertical heat dissipation mechanism.

[0065] The positioning mounting post 10 and the positioning mounting cylinder 11 cooperate to achieve guided displacement. When the guided displacement reaches the target installation position, the rotating turntable 33 causes the threaded post 36 to rotate, so that it cooperates with the threaded cylinder 35 to move axially within it, pushing the holding fixing plate 21 to move within the fixed installation cover 32 until the holding fixing plate 21 squeezes the positioning mounting post 10 and restricts the positioning mounting cylinder 11 from sliding on the positioning mounting post 10, thus completing the installation of the right-angle component mounting cover 9. During the installation process, the conductive slider 34 is always in contact with the conductive groove 31 to ensure continuous power supply to the component.

[0066] The reinforcing rod 13 forms a frame with the positioning mounting post 10, the flow guiding mounting cylinder 15, and the four-sided pyramidal cylinder 8, thereby increasing the strength of the device.

[0067] The V-shaped elastic support frame 12 can provide elastic support for the right-angle component mounting cover 9 on it from the bottom.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0069] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated power supply device, characterized in that, Including self-adjusting vertical heat dissipation mechanisms and thermally conductive component assembly mechanisms; The self-adjusting vertical heat dissipation mechanism includes a four-sided pyramidal cylinder, with a four-sided vertical flow guide cylinder vertically arranged at the upper end of the four-sided pyramidal cylinder, and a flow guide mounting cylinder vertically arranged at each of the four edges of the four-sided vertical flow guide cylinder. The lower end of the four sides of the square pyramidal cylinder is provided with swing support plates through elastic rubber columns, and the side of the swing support plate away from the elastic rubber columns is provided with several passive flow guide holes. Several connecting guide holes are vertically and equally spaced inside the walls of the four-sided vertical guide cylinders between adjacent guide cylinders. All connecting guide holes are horizontally arranged, and both ends of the connecting guide holes are connected to the guide cylinders. Heat-conducting guide columns are vertically arranged at equal angles on the outer wall of the guide cylinder outside the four-sided vertical guide cylinder. An annular pressure equalizing cylinder is semi-embedded at the connection between the four-sided vertical guide tube and the four-sided pyramidal tube. The lower end of the guide tube is connected to the annular pressure equalizing cylinder. A pressure-relieving cylinder is provided on the wall of the four-sided pyramidal tube on one side of the elastic rubber column. An arc-shaped telescopic column is provided on the pressure-relieving cylinder. The thermally conductive element assembly mounting mechanism includes positioning and mounting posts vertically arranged on the four sides of a four-sided pyramidal cylinder, and several right-angle element mounting covers are provided above the four sides of the four-sided pyramidal cylinder. The right-angled element mounting covers are all provided with positioning and mounting cylinders that cooperate with the positioning and mounting posts on their outer right-angled ends. The right-angle end inside the right-angle element mounting cover is equipped with a guide mounting sleeve that matches the flow guide mounting cylinder, and the inner side of the guide mounting sleeve is equipped with a heat-conducting guide groove that matches the heat-conducting guide column. The outer side of the guide mounting sleeve is symmetrically provided with two sets of elastic arc panels. Several clamping plates are provided at equal angles on the edge of the elastic arc panels. The deformation of the elastic arc panels can realize the lifting and pressing of all the clamping plates on them. A top cover plate is horizontally arranged above the four-sided pyramidal tube, and a directional installation cylinder is arranged in the middle position of the top cover plate in accordance with the gap between the inner wall of the four-sided vertical guide tube.

2. The integrated power supply device according to claim 1, characterized in that, The inner wall of the quadrangular vertical guide tube is equipped with several horizontally arranged heat dissipation fins that connect to the guide holes, and the heat dissipation fins are all inclined upwards.

3. The integrated power supply device according to claim 1, characterized in that, The end of the arc-shaped telescopic column is movably mounted on the swing support plate.

4. The integrated power supply device according to claim 3, characterized in that, The pressure-relieving cylinder is connected to the annular pressure-equalizing cylinder through a synchronous connecting pipe, and each synchronous connecting pipe is equipped with an electrically controlled valve body connected in series.

5. An integrated power supply device according to claim 1, characterized in that, A reinforcing rod is provided at the upper end of the positioning mounting post and the flow guiding mounting cylinder on the same edge of the four-sided pyramidal cylinder.

6. The integrated power supply device according to claim 1, characterized in that, A fixed mounting cover is provided on the side of the positioning mounting cylinder away from the right-angle element mounting cover. One end of the fixed mounting cover is connected to the positioning mounting cylinder. A supporting and fixing plate is provided inside the fixed mounting cover. A threaded cylinder is horizontally inserted through the other end of the fixed mounting cover. A threaded post is provided in cooperation with the threaded cylinder. A turntable is provided at one end of the threaded post that extends out of the fixed mounting cover. The other end of the threaded post is rotatably mounted on the supporting and fixing plate.

7. An integrated power supply device according to claim 6, characterized in that, Two conductive sliders are symmetrically arranged on the inner side of the positioning and mounting cylinder, and conductive grooves are provided on the outer side of the positioning and mounting column to cooperate with the conductive sliders.

8. An integrated power supply device according to claim 1, characterized in that, Several V-shaped elastic support frames are provided on the four-sided pyramidal cylinder directly opposite the right-angle element mounting cover.

9. An integrated power supply device according to claim 1, characterized in that, The top cover plate has a cover mounting cylinder connected downwards at its edge. The lower end of the cover mounting cylinder is mounted on the four-sided pyramidal cylinder, and the lower end of the cover mounting cylinder and the arc-shaped telescopic column are both provided with a fixing mounting groove.

10. An integrated power supply device according to claim 9, characterized in that, A connecting plate is provided at the upper end of the top cover plate, and several insertion holes are provided on the connecting plate. A terminal block for connecting the connecting plate is provided on the lower side of the top cover plate.

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