Component for semiconductor technology and device for semiconductor technology

Abstract

The invention relates to an assembly (30) for semiconductor technology, comprising a module (32) and a module frame (33). The module (32) is connected to the module frame (33) by means of a support element (34) and is positioned relative to the module frame (33) by means of the support element (34). The connecting piece (35) comprises a clamping device (56, 58) which prevents the module (32) from being lifted from the module frame (33). According to the invention, the support element (34) has a clamping force element (50) for transmitting a clamping force generated by the clamping device (56, 58) and a positioning element (60) for positioning the module (32) relative to the module frame (33). Furthermore, the invention relates to a projection exposure system (1, 101) and a mask inspection device comprising the assembly according to the invention.

Description

[0001] This application claims priority to German patent application DE 10 2023 207 631.4, filed on August 9, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present invention relates to components and apparatuses for semiconductor technology, such as mask inspection apparatus or projection exposure equipment. Background Technology

[0003] Semiconductor lithography projection exposure equipment is used to fabricate extremely fine structures, particularly on semiconductor components or other microstructures. The working principle of this equipment is based on producing extremely fine structures down to the nanometer scale by imaging a structure on a conventional mask (so-called a mask plate) at a reduced scale onto the element to be structured (e.g., a wafer with a photosensitive material). The minimum size of the resulting structure depends directly on the wavelength of the light used (so-called the applied light). In the emission wavelength range known as the DUV range, light sources with wavelengths from 100 nm to 300 nm are used, while increasingly, light sources with emission wavelengths on the order of nanometers (e.g., between 1 nm and 120 nm, particularly on the order of 13.5 nm) are now being used. This described emission wavelength range is also known as the EUV range.

[0004] Optical elements, such as lenses, and (especially in the field of EUV lithography) mirrors, are used to illuminate structures, particularly to image them, and during the routine operation of the related equipment, their so-called optically effective surfaces are illuminated by the light used. Deviations between the optically effective surface and the optimal target position and shape have a significant impact on image quality, and thus a significant impact on the quality of the manufactured parts.

[0005] This problem is typically solved by designing the optical elements used to be movable or deformable, so that the aforementioned imaging aberrations can be corrected during the operation of the projection exposure equipment. The optical elements are usually arranged in a housing of an optical module, which is mounted on a module frame. The module frame can be movably mounted on the optical element frame by an actuator, as described above, so that it can be positioned in a predetermined location.

[0006] For precise alignment of the optical module on the module holder, a static or quasi-static mounting is preferred, which, for example, consists of three so-called bipods (i.e., double-leg supports), each bipod having a connection point at the optical module and two mounting points on the module holder. The bipod with the optical module is typically located only at the mounting points on the module holder, necessitating that the optical module be secured, for example, by clamping elements to prevent it from lifting off the mounting points. However, in solutions known in the prior art, the force flow exerted by the clamping elements passes through the bipod, thereby allowing the bipod to deform. The mechanical stress generated in the bipod can be transmitted to the optical module and subsequently to the optical elements. This has the disadvantage that the position of the optical module relative to the module holder may change and / or the optical elements and their optically effective surfaces may deform, which can negatively impact the imaging quality of the associated projection exposure equipment.

[0007] Another drawback of the solutions known in the prior art is that after the optical module may be replaced during operation, the position of the new optical module and the deformation of the corresponding optically effective surface may often deviate significantly from the values ​​of the original module. Therefore, after replacement, it can no longer adequately ensure the ever-increasing requirements for imaging quality from generation to generation. Summary of the Invention

[0008] The purpose of this invention is to provide an apparatus that eliminates the aforementioned disadvantages of the prior art.

[0009] This objective is achieved by means having the features of the independent claim. The dependent claims relate to advantageous improvements and variations of the invention.

[0010] The component for semiconductor technology according to the invention includes a module and a module frame, wherein the module is connected to and positioned relative to the module frame via a support element. The connection includes a clamping device that prevents the module from being lifted off the module frame.

[0011] According to the invention, the support element has a clamping force element for transmitting the clamping force generated by the clamping device and a positioning element for positioning the module relative to the module frame. This has the advantage that the high clamping force generated for the purpose has little or no effect on the positioning of the module. The clamping force is designed in such a way that lifting of the module from the module frame under a predetermined load can be reliably prevented. The load refers not only to the load occurring during operation, but also, in particular, to a significantly higher load compared to normal operation during transport, assembly, or even during earthquakes.

[0012] The high clamping force is transmitted through a clamping force element to the connector between the support element and the module frame, which includes a leg portion. The module is positioned by a positioning element fixedly connected to the leg portion. Therefore, the flow of the high clamping force only passes through the support element in the very rigid leg portion region, which also determines the module's position relative to the module frame. Thus, the deformation caused by the high clamping force when the module is connected to the module frame is minimized to the deformation of the very rigid leg portion, thereby also advantageously minimizing the deformation of the optical elements mounted in the module. The high clamping force has the advantage that the connection of the leg portion, which contacts the module frame via only one contact point, is also very rigid; therefore, in the case where the module is an optical module for a projection exposure device, the module can be excited only in a frequency range that has almost no impact on the imaging quality of the projection exposure device.

[0013] Furthermore, the force flow propagating in the support element is divided into a force flow related to the clamping force and a force flow propagating through the positioning element and related to the proportion of the module's weight. This module is supported by corresponding support elements for a typically statically determined module installation, which improves the repeatability of module installation. This is particularly advantageous when replacing modules at the customer site, because even with the same module, the positioning of the new module may have different dimensions than the replacement module due to manufacturing and installation tolerances. This positioning is facilitated by minimizing non-reproducible deformation caused by the clamping force.

[0014] Furthermore, the clamping force element may have a receiving portion for the clamping element of the clamping device. The clamping element may support itself on a base frame decoupled from the module frame, so that the reaction force of the clamping force cannot act on the module frame, and undesirable deformation of the module can be advantageously avoided.

[0015] Furthermore, the positioning element may have a receiving portion for the module, which in turn may have a connecting surface for the module. The receiving portion can be positioned independently of the receiving portion for the clamping force element by the positioning element. The module may be threaded and / or bonded to the receiving portion, but other connection techniques are also conceivable.

[0016] In another embodiment, the support element may have at least one first spacer, i.e., a spacer manufactured to a predetermined thickness, such as a washer, for providing a connecting surface for the module relative to the module frame. This can be arranged between the leg portion and the housing of the positioning element. For example, the leg portion can be threaded to one end of the housing, and the spacer can be designed in the form of a washer. The length of the positioning element, and therefore the position of the module relative to the module frame in the longitudinal direction of the positioning element, can be set by the thickness of the spacer. A clamping force element can be arranged in the housing of the positioning element, the housing being formed to be at least partially hollow, and can be connected to the leg portion on its opposite side relative to the module frame. Thus, the thickness of the spacer does not affect the position of the receiving portion for clamping the element.

[0017] Specifically, the clamping element may have at least one second spacer for positioning the receiving portion of the clamping element relative to the connecting surface of the module receiving portion. During the installation of the support element, the distance between the receiving portions can be easily set so that a predetermined minimum distance is maintained even when the connecting surface of the module is later positioned relative to the module frame, and contact between the receiving portions is avoided.

[0018] Furthermore, the clamping force element may have a rod between the receiving portion for clamping the element and the connection to the module. The rod is particularly suitable for transmitting force along its longitudinal axis and is very rigid in that direction. Spacers for setting the distance between the receiving portions may, for example, be arranged between the rod and the receiving portion for clamping the element.

[0019] In another embodiment, the clamping force element can be formed to be rigid only in its longitudinal direction, i.e., it can be decoupled or flexible in all other degrees of freedom. In this document, rigidity means that the stiffness of the clamping force element is designed to be as high as possible within the context of the design and technical properties (e.g., yield strength or bending fatigue strength) of the materials used. In contrast, flexibility should be understood to mean the lowest possible stiffness within the context of the design and technical properties of the materials used.

[0020] Furthermore, the clamping force element and / or positioning element can have at least one decoupling element. This can be formed, for example, as an integral joint, which can be manufactured by etching and / or milling and / or other suitable manufacturing methods. The advantage of decoupling is that only the force is transmitted in the longitudinal direction of the support element, and all other degrees of freedom are decoupled. As a result, the constraint forces on the support element that may be caused by manufacturing tolerances and / or assembly tolerances are minimized.

[0021] Specifically, the support element may have at least one end stop for protecting at least one decoupling element among the clamping force element and / or positioning element. This prevents damage to the decoupling element, for example, formed as a joint, which could be caused, for example, by plastic deformation due to excessive deflection.

[0022] In another embodiment, the contact surface of the support leg portion can be formed as a convex shape. As a result, in the case of a module frame with a planar contact surface, the contact can be reduced to a well-defined contact point, which can be advantageous for reproducibility.

[0023] Specifically, the radius of the convex contact surface can correspond to the distance between the contact surface and the decoupling between the rod and the receiving portion for the clamping force element. As a result, parasitic constraint forces on the support element and therefore on the module caused by manufacturing and assembly tolerances can be advantageously avoided.

[0024] In another embodiment, the clamping force element may be prestressed relative to the foot portion. This prestress may be achieved, for example, by a compression spring arranged between the clamping force element and the positioning element. The prestress ensures that the rod of the clamping force element remains in constant contact with the foot portion.

[0025] Furthermore, the positioning element can be rigidly connected only in its longitudinal direction to the receiving portion for the module and the connecting element to the module. Other degrees of freedom can be decoupled, thereby, as further explained above, advantageously minimizing or almost completely avoiding parasitic forces on the module.

[0026] In another embodiment, the support element may have a spring for aligning the clamping force element relative to the positioning element perpendicular to the clamping force. The spring may be formed in at least one direction perpendicular to the clamping force, which has the advantage that positioning and clamping function in at least one plane, thereby minimizing the possible parasitic forces between the two elements of the support element.

[0027] Specifically, the assembly may include a bipod with two support elements, i.e., a double-leg support. In this case, the spring can prevent the clamping force from deviating from the plane spanned by the longitudinal direction of the two support elements aligned at an angle to each other, thereby advantageously minimizing or almost completely avoiding parasitic forces on the module.

[0028] Furthermore, the bipod may include a decoupling element for decoupling the torque about an axis perpendicular to the longitudinal direction of the clamping force element from the clamping force. The decoupling element can be configured, for example, as a joint, thereby advantageously minimizing the torque in the leg portions caused by manufacturing and installation tolerances when the bipod is mounted on the mounting frame. Therefore, the positioning element, which is crucial for the positioning and deformation of the module, is subjected to only minimized torque, and this torque can be further reduced by the decoupling formed in the positioning element.

[0029] An apparatus for semiconductor technology according to the present invention, such as a projection exposure device or a mask inspection device, includes components according to any of the embodiments further described above. Attached Figure Description

[0030] Exemplary embodiments and variations of the invention are explained in more detail below with reference to the accompanying drawings, in which:

[0031] Figure 1 The diagram schematically shows a meridional section of the projection exposure equipment for EUV projection lithography.

[0032] Figure 2 The diagram schematically shows a meridional section of the projection exposure equipment for DUV projection lithography.

[0033] Figure 3 A schematic diagram of the present invention is shown.

[0034] Figure 4 An embodiment of the present invention is shown, and

[0035] Figure 5 A view showing details of the invention. Detailed Implementation

[0036] In the following text, the basic components of the microlithography projection exposure apparatus 1 will be described first by way of example. Figure 1 The description of the basic setup and components of the projection exposure apparatus 1 is to be understood here as non-limiting.

[0037] One embodiment of the illumination system 2 of the projection exposure apparatus 1 includes, in addition to the radiation source 3, an illumination optical unit 4 for illuminating the object field 5 in the object plane 6. In an alternative embodiment, the light source 3 may also be provided as a module separate from the rest of the illumination system. In this case, the illumination system does not include the light source 3.

[0038] The mask master 7, arranged in the object field 5, is illuminated. The mask master 7 is held by the mask master holder 8. The mask master holder 8 can be moved, particularly in the scanning direction, by the mask master displacement driver 9.

[0039] For the purpose of explanation, Figure 1 The figure depicts a Cartesian xyz coordinate system. The x-direction extends perpendicularly to the plane in the figure. The y-direction extends horizontally, and the z-direction extends vertically. The scan direction is along... Figure 1 It extends in the y-direction. The z-direction extends perpendicular to the object plane.

[0040] The projection exposure apparatus 1 includes a projection optics unit 10. The projection optics unit 10 is used to image the object field 5 onto an image field 11 in an image plane 12. The image plane 12 extends parallel to the object plane 6. Alternatively, an angle other than 0° between the object plane 6 and the image plane 12 is also possible.

[0041] The structure on the mask master 7 is imaged onto the photosensitive layer of the wafer 13, which is arranged in the image field 11 region of the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be moved by a wafer displacement driver 15, particularly along the y-direction. The displacement of the mask master 7 first by the mask master displacement driver 9 and the displacement of the wafer 13 secondarily by the wafer displacement driver 15 can be synchronized with each other.

[0042] Radiation source 3 is an EUV radiation source. Radiation source 3 specifically emits EUV radiation 16, which is also referred to below as working radiation, illumination radiation, or illumination light. Working radiation particularly has wavelengths in the range of 5 nm to 30 nm. Radiation source 3 can be a plasma source, such as an LPP (laser-generated plasma) source or a GDPP (gas discharge-generated plasma) source. It can also be a synchrotron-based radiation source. Radiation source 3 can be a free-electron laser (FEL).

[0043] Illumination radiation 16 emitted from radiation source 3 is focused by concentrator 17. Concentrator 17 may be a concentrator having one or more elliptical and / or hyperboloidal reflective surfaces. Illumination radiation 16 may be incident on at least one reflective surface of concentrator 17 at either grazing incidence (GI) (i.e., at an angle of incidence greater than 45° relative to the normal direction of the reflector surface) or normal incidence (NI) (i.e., at an angle of incidence less than 45°). Concentrator 17 may be structured and / or coated, on the one hand to optimize its reflectivity to the radiation used, and on the other hand to suppress intrusive light.

[0044] Downstream of the light collector 17, the illumination radiation 16 propagates through the intermediate focal point in the intermediate focal plane 18. The intermediate focal plane 18 can form a separation between the radiation source module, which includes the radiation source 3 and the light collector 17, and the illumination optical unit 4.

[0045] The illumination optical unit 4 includes a deflecting mirror 19 and a first faceted mirror 20 disposed downstream of it in the beam path. The deflecting mirror 19 may be a planar deflecting mirror, or alternatively, a mirror with beam-affecting effects beyond pure deflection. Additionally or alternatively, the deflecting mirror 19 may be implemented as a spectral filter that separates the wavelength of the illumination radiation 16 from that of incoming light with a different wavelength. If the first faceted mirror 20 is arranged in a plane of the illumination optical unit 4 that is optically conjugate to the object plane 6 as a field plane, it is also referred to as a field faceted mirror. The first faceted mirror 20 includes a plurality of individual first facets 21, which are also referred to hereinafter as field facets. Figure 1 Some of these facets 21 are shown only as examples.

[0046] The first facet 21 can be implemented as a macroscopic facet, particularly as a rectangular facet or as a facet with an arcuate or partially circular edge profile. The first facet 21 can be implemented as a planar facet or alternatively as a convex or concave curved facet.

[0047] As is known from DE 10 2008 009 600 A1, for example, the first facet 21 itself may also be composed of multiple individual mirrors, particularly multiple micromirrors. The first facet mirror 20 may be specifically implemented as a microelectromechanical system (MEMS system). For details, refer to DE 10 2008 009 600 A1.

[0048] Between the light collector 17 and the deflector 19, the illumination radiation 16 travels horizontally (i.e., along the y-direction).

[0049] In the beam path of the illumination optical unit 4, the second faceted mirror 22 is positioned downstream of the first faceted mirror 20. If the second faceted mirror 22 is arranged in the pupil plane of the illumination optical unit 4, it is also called a pupil faceted mirror. The second faceted mirror 22 can also be arranged at a certain distance from the pupil plane of the illumination optical unit 4. In this case, the combination of the first faceted mirror 20 and the second faceted mirror 22 is also called a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1, and US 6,573,978.

[0050] The second faceted reflector 22 includes multiple second facets 23. In the case of a pupil faceted reflector, the second facet 23 is also called the pupil facet.

[0051] The second facet 23 can also be a macroscopic facet, which may, for example, have circular, rectangular, or hexagonal boundaries, or alternatively, a facet composed of micromirrors. In this regard, see also DE 10 2008 009 600 A1.

[0052] The second facet 23 may have a planar, convex, or concave curved reflective surface.

[0053] The illumination optics unit 4 thus forms a two-sided split-plane system. This basic principle is also known as a fly-eye condenser (fly-eye integrator).

[0054] It is advantageous to arrange the second faceted mirror 22 imprecisely in a plane that is optically conjugate to the pupil plane of the projection optics unit 10. In particular, the pupil faceted mirror 22 may be arranged tilted relative to the pupil plane of the projection optics unit 10, as described in DE 10 2017 220 586 A1.

[0055] The first facet 21 is imaged into the object field 5 by means of the second facet mirror 22. The second facet mirror 22 is the final beam-shaping mirror, or in fact the final mirror of the illumination radiation 16 in the beam path upstream of the object field 5.

[0056] In another embodiment (not shown) of the illumination optics unit 4, a transmission optics unit may be arranged in the beam path between the second facet mirror 22 and the object field 5. This transmission optics unit is particularly helpful in imaging the first facet 21 into the object field 5. The transmission optics unit may have exactly one mirror, or alternatively, two or more mirrors arranged front and back in the beam path of the illumination optics unit 4. The transmission optics unit may specifically include one or two normal incident mirrors (NI mirrors) and / or one or two grazing incident mirrors (GI mirrors).

[0057] exist Figure 1 In the embodiment shown, the illumination optical unit 4 has three mirrors downstream of the light collector 17, specifically a deflecting mirror 19, a field plane mirror 20, and a pupil plane mirror 22.

[0058] In another embodiment of the illumination optical unit 4, the deflecting mirror 19 may be omitted. In this case, the illumination optical unit 4 may have two mirrors downstream of the light collector 17, specifically a first faceted mirror 20 and a second faceted mirror 22.

[0059] Imaging the first plane 21 onto the object plane 6 via the second plane 23 or using the second plane 23 and the transmission optical unit is typically only an approximate imaging.

[0060] The projection optical unit 10 includes a plurality of mirrors Mi, which are numbered sequentially according to their arrangement in the beam path of the projection exposure device 1.

[0061] exist Figure 1In the example shown, the projection optics unit 10 comprises six mirrors M1 to M6. Alternatives with four, eight, ten, twelve, or any other number of mirrors M1 are also possible. The penultimate mirror M5 and the last mirror M6 each have a channel opening for illumination radiation 16. The projection optics unit 10 is a double-shielded optics unit. The projection optics unit 10 has an image-side numerical aperture greater than 0.5, but may also be greater than 0.6, for example, 0.7 or 0.75.

[0062] The reflective surface of mirror Mi can be implemented as a freeform surface without a rotational axis of symmetry. Alternatively, the reflective surface of mirror Mi can be designed as a non-spherical surface with exactly one rotational axis of symmetry of the reflective surface shape. Just like the mirror of illumination optics unit 4, mirror Mi can have a highly reflective coating for illumination radiation 16. These coatings can be designed as multilayer coatings, particularly with alternating layers of molybdenum and silicon.

[0063] The projection optical unit 10 has a large object-image offset in the y-direction between the y-coordinate of the center of the object field 5 and the y-coordinate of the center of the image field 11. This object-image offset in the y-direction can have a value approximately the same as the z-distance between the object plane 6 and the image plane 12.

[0064] The projection optical unit 10 can be implemented in a modified manner. Specifically, it has different imaging ratios βx and βy in the x and y directions. The two imaging ratios βx and βy of the projection optical unit 10 are preferably (βx, βy) = (+ / -0.25, + / -0.125). A positive imaging ratio β refers to imaging without image inversion. A negative sign for the imaging ratio β indicates imaging with image inversion.

[0065] The projection optical unit 10 thus results in a 4:1 size reduction in the x-direction (i.e., in the direction perpendicular to the scanning direction).

[0066] The projection optical unit 10 results in an 8:1 size reduction in the y-direction (i.e., in the scanning direction).

[0067] Other imaging scales are also possible. Imaging scales with the same sign and the same absolute value (e.g., absolute values ​​of 0.125 or 0.25) in both the x and y directions are also possible.

[0068] The number of intermediate image planes in the x and y directions of the beam path between object field 5 and image field 11 may be the same or different, depending on the embodiment of the projection optics unit 10. Examples of projection optics units with different numbers of such intermediate images in the x and y directions are known from US 2018 / 0074303 A1.

[0069] In each case, one of the pupil planes 23 is assigned to exactly one of the field planes 21 to form a corresponding illumination channel for illuminating the object field 5. In particular, this can result in illumination according to Köhler's principle. The far field is decomposed into multiple object fields 5 by means of the field planes 21. The field planes 21 produce multiple images with intermediate focal points on the pupil planes 23 to which they are respectively assigned.

[0070] Field planes 21 are imaged onto the master mask 7 by overlapping pupil planes 23 to illuminate the object field 5. The illumination of the object field 5 is particularly uniform, preferably having a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.

[0071] The illumination of the entrance pupil of the projection optical unit 10 can be geometrically defined by the arrangement of the pupil facets. The intensity distribution in the entrance pupil of the projection optical unit 10 can be set by selecting the illumination channel, in particular a subset of the pupil facets guiding the light. This intensity distribution is also referred to as the illumination setting.

[0072] By reallocating the illumination channels, the same preferred pupil uniformity can be achieved in the portion of the illumination pupil of the illumination optical unit 4 that is illuminated in a defined manner.

[0073] Other aspects and details of the illumination of the object field 5 (especially the entrance pupil of the projection optical unit 10) are described below.

[0074] The projection optical unit 10 may specifically have a concentric entrance pupil. The latter may be accessible or inaccessible.

[0075] The entrance pupil of the projection optics unit 10 is typically not accurately illuminated using the pupil facet mirror 22. When the projection optics unit 10 is imaged telecentrically onto the wafer 13 by the center of the pupil facet mirror 22, the aperture rays typically do not intersect at a single point. However, it is possible to find a region where the spacing between pairs of defined aperture rays becomes minimal. This region constitutes the entrance pupil or its conjugate region in real space. In particular, this region exhibits a finite curvature.

[0076] It is possible that the projection optics unit 10 has different entrance pupil orientations for the tangential beam path and the sagittal beam path. In this case, an imaging element, specifically an optical component of the transmission optics unit, should be provided between the second faceted mirror 22 and the mask mother 7. This optical element allows for the consideration of different orientations for the tangential and sagittal entrance pupils.

[0077] exist Figure 1In the arrangement of components of the illumination optical unit 4 shown, the pupil plane mirror 22 is arranged in the region conjugate with the entrance pupil of the projection optical unit 10. The field plane mirror 20 is arranged to be tilted relative to the object plane 6. The first plane mirror 20 is arranged to be tilted relative to the configuration plane defined by the deflecting mirror 19.

[0078] The first faceted mirror 20 is arranged to be inclined relative to the arrangement plane defined by the second faceted mirror 22.

[0079] Figure 2 The diagram schematically shows a meridional section passing through another projection exposure device 101 for DUV projection lithography, in which the invention can also be used.

[0080] The setup and imaging principle of the projection exposure device 101 can be compared with... Figure 1 The setup and process described herein are equivalent. The same components are derived from... Figure 1 The addition of the reference numeral 100 indicates that... Figure 2 The reference numerals in the figures begin with 101.

[0081] and Figure 1 Compared to the EUV projection exposure apparatus 1, refractive, diffractive, and / or reflective optical elements 117 (e.g., lens elements, mirrors, prisms, end plates, etc.) can be used for imaging or illumination in the DUV projection exposure apparatus 101 because the wavelength of the DUV radiation 116 used as the light source is relatively large, in the range of 100 nm to 300 nm, particularly 193 nm. In this case, the projection exposure apparatus 101 mainly includes an illumination system 102, a mask master holder 108 for receiving and precisely positioning a mask master 107 (the mask master has a structure and is used to determine subsequent structures on the wafer 113), a wafer holder 114 for holding, moving, and precisely positioning the wafer 113, and a projection lens 110, wherein a plurality of optical elements 117 are held in the lens housing 119 of the projection lens 110 by a mounting member 118.

[0082] The illumination system 102 provides the DUV radiation 116 required to image the mask master 107 onto the wafer 113. Lasers, plasma sources, etc., can be used as sources for this radiation 116. The radiation 116 is shaped in the illumination system 102 by optical elements such that the DUV radiation 116 has desired characteristics regarding diameter, polarization, wavefront shape, etc., when incident on the mask master 107.

[0083] In addition to the additional use of refractive optical elements 117 (such as lens elements, prisms, terminal plates), the downstream projection optical unit 101 with lens housing 119 is, in principle, similar to... Figure 1 The settings described in [the document] are no different, so they will not be described in further detail.

[0084] Figure 3 A schematic diagram of a component 30 according to the invention is shown, illustrated in cross-section. Component 30 includes a module 32 containing optical elements, for example, formed as a mirror Mx 117, for example for... Figure 1 and Figure 2 One of the projection exposure devices 1 and 101 described herein. Module 32 (which is shown as transparent and therefore in...) Figure 3 (shown in dashed lines) is connected to the module frame 33 via connector 31.

[0085] The connector 31 includes a support element 34 and a clamping element 56. The module 32 is mounted on the module frame 33 via the support element 34 and the clamping element 56 clamps the support element 34 between the base frame 58 and the module frame 33, thereby reliably preventing the lifting of the support element 34 and thus the module 32 in the event of impact loads, for example, during transport.

[0086] The basic frame 58 is decoupled from the module frame 33, so that the reaction force of the clamping force does not act on the module frame 33. The clamping force caused by the clamping element 56 is... Figure 3 The force is indicated by an arrow and acts on the clamping force element 50. The clamping force element 50 includes a receiving portion 52 through which the clamping element 56 transmits the clamping force. The receiving portion 52 is connected to the leg portion 36 of the support element 34 via a rod 51, wherein the rod 51 is only erected at the interface 57 between the rod 51 and the leg portion 36, i.e., it is not fixedly connected.

[0087] A spacer 53 is arranged between the rod 51 and the receiving portion 52, allowing the length of the clamping force element 50 to be set via the spacer 53. The support element 34 also includes a positioning element 60 having a housing 61 with a connecting surface 62 for the module 32. A leg portion 36 is screwed onto the housing 61 via threads 43, wherein a spacer 63 is arranged between the head surface 42 of the leg portion 36 and the lower side of the housing 61. The thickness of the spacer 63 determines the position of the connecting surface 62, thereby allowing the module 32 to be positioned in the longitudinal direction of the support element 34. Therefore, in the case of a conventional static installation of the module 32, this is employed... Figure 3 The six support elements 34 described herein can each be configured with one degree of freedom. Optionally, another spacer (not shown) and / or a contact surface (not shown) separate from the support surface 41 of the module frame 33 may also be arranged between the support element 34 and the module frame 33.

[0088] By means of a spring 55 supported on a protrusion 64 in the housing 61 of the positioning element 60 and pressing against the shoulder 54 of the rod 51, the clamping force element 50 is prestressed relative to the leg portion 36 connected to the positioning element 60, thereby ensuring contact at the interface 57 between the rod 51 and the leg portion 36, especially when the assembly 30 is installed, i.e., when the clamping element 56 is not yet installed. The force flow 39 of the clamping force travels through the clamping element 56, the receiving portion 52, the spacer 53, and the rod 51 into the leg portion 36, i.e., without passing through the housing 61 of the positioning element 60 used for positioning and receiving the module 32. This has the advantage that the high clamping force required only for load conditions caused by transportation or earthquakes acts only on the leg portion 36, which is also related to positioning, wherein the possible deformation of the common leg portion 36 is minimized due to its high stiffness.

[0089] The clamping force also has a defined connection via a contact point 38 between the contact surface 37 of the leg portion 36 and the support surface 41 of the module frame 33, which therefore also exerts a negligible effect on the positioning of the module 32. The force flow 40 through the positioning element 60 includes only a portion of the weight of the module 32 acting on the support element 34, which travels through the housing 61, spacer 63, and leg portion 36 into the module frame 33, and... Figure 3 The two force flows 39 and 40 share only the smallest portion of the support portion 36, meaning they are almost independent of each other.

[0090] Figure 4 Details of one embodiment of the component 30 according to the invention are shown, wherein a bipod 70 having two support elements 34 is illustrated. The configuration of the support elements 34 corresponds to... Figure 3 The structure of the support element 34 is explained below. Two clamping force elements 50 of the support element 34 are connected to each other in the receiving portion 52 via a decoupling element formed as a joint 59. Thus, during assembly, the clamping force elements 50 in the drawing plane can be aligned relative to each other independently of manufacturing and / or assembly tolerances without introducing parasitic torques into the leg portion 36 of the support element 34 and thereby into the module 32 via the positioning element 60. The contact surface 37 of the leg portion 36 is formed convexly, such that the leg portion 36 and the support surface 41 of the module frame 33 are connected to each other via contact point 38, regardless of manufacturing and / or assembly tolerances. The radius R of the contact surface 37 corresponds to the distance between the joint 59 and the contact surface 37, thereby ensuring connection at contact point 38 and advantageously avoiding parasitic constraint forces caused by manufacturing and assembly tolerances. The housing 61 of the positioning element 60 also includes a decoupling element formed as a connector 66, wherein the connector 66 is formed as a universal joint having two axes that are perpendicular to each other and perpendicular to the longitudinal axis of the housing 61.

[0091] The connector 66 decouples all manufacturing and assembly-related tolerances of the connecting surface 62 of the receiving portion 65 of module 32, the support element 34 itself, and the support surface 41 of the module frame 33. Furthermore, the support element 34 has an end stop 71 that protects the connector 66 from damage, such as plastic deformation caused by excessive deflection. The receiving portion 52 of the clamping force element 50 is centered relative to the receiving portion 65 of the positioning element 50 in a direction perpendicular to the drawing plane by a spring formed as a pin 72, which is mounted in the receiving portion 73 connected to the receiving portion 65 of the module 32 of the positioning element 60. This ensures that the force flow 39 of the clamping force element 50 and the force flow 40 of the positioning element 60 always travel at least in the drawing plane and ideally parallel to each other. As a result, parasitic forces and moments on the module 32 are advantageously minimized.

[0092] In the areas of the receiving portions 52 and 65, pin 72 is the only connection between the positioning element 60 and the clamping force element 50, which are arranged spaced apart from each other in all other degrees of freedom. The distance s between the receiving portions 52 and 65 is affected by the thickness of the spacer 63 and is used to set the position of the module 32 relative to the module frame 33. Therefore, the distance s is adjusted during the installation of the bipod 70. Figure 3 The spacer 53 described herein is conveniently set between the receiving portion 52 and the rod 51 of the clamping force element 50, such that the distance s does not fall below the minimum distance due to the usual length variations of the positioning element 60 required to position the module 32 in the predetermined position. The distance s is suitably set such that the pin 72 never transmits force in the direction of the clamping force, which is due to… Figure 4 The arrows in the diagram indicate that the force is only used to center the two receiving parts 52 and 65.

[0093] Figure 5 A plan view showing details of component 30 according to the invention is provided, illustrating the bipod 70. Module 32 is... Figure 4 The portion shown is transparent and therefore indicated by dashed lines. Two connection points 67 for the module are arranged in the area of ​​the receiving portion 65 of the positioning element 60. Figure 5 The housing 61 of the positioning element 60 conceals the receiving portion 52 of the clamping force element 50, which is arranged in the cutout 76 of the receiving portion 65. This allows the receiving portion 52 to rotate about the axis of the pin 72, thus centering the receiving portion 52 relative to the receiving portion 65. Figure 4 As explained in the text, it is caused by Figure 5 The arrow in the diagram indicates this. The receiving portion 52 can also move freely along the guide 74 of the pin 72 in the longitudinal projection direction of the support element 34. The edge of the cutout 76 in the receiving portion 65 is formed as an end stop 75 for the receiving portion 52 to prevent plastic deformation of the joint 59. Figure 4 ).

[0094] List of reference numerals

[0095] 1. Projection Exposure Equipment

[0096] 2 Lighting System

[0097] 3 radiation sources

[0098] 4 Illumination Optical Units

[0099] 5 objects

[0100] 6 object plane

[0101] 7 Mask Master

[0102] 8 Mask Master Retainer

[0103] 9 Mask Master Displacement Driver

[0104] 10 Projection Optical Units

[0105] 11 Image Field

[0106] 12 Image plane

[0107] 13 chips

[0108] 14. Chip Holder

[0109] 15. Wafer displacement driver

[0110] 16 EUV radiation

[0111] 17 light collector

[0112] 18. Intermediate focal plane

[0113] 19 Deflecting mirrors

[0114] 20-faceted reflector

[0115] 21 facets

[0116] 22-faceted mirror

[0117] 23-part face

[0118] 30 components

[0119] 31 Connector

[0120] 32 modules

[0121] 33 Module Framework

[0122] 34 Support elements

[0123] 35 Connecting parts for support elements

[0124] 36 Support Legs

[0125] 37. Contact surfaces of the support legs

[0126] 38 Contact points of the support legs

[0127] 39. Force flow of clamping force

[0128] 40 Positioning of force flow

[0129] 41 Supporting surfaces of the module frame

[0130] 42. Head surface of the leg section

[0131] 43. Threads on the support legs / housing

[0132] 50 Clamping force element

[0133] 51 strokes

[0134] 52 Receiving part of clamping force element

[0135] 53. Spacers for clamping force elements

[0136] 54 Shoulders

[0137] 55 Prestressed Spring

[0138] 56 Clamping elements

[0139] 57. Interface between the rod and the support leg.

[0140] 58 Basic Framework

[0141] 59. Joints of the poles connected to the bipod

[0142] 60 Positioning elements

[0143] 61. Shell

[0144] 62. Connecting surface of positioning element

[0145] 63 Spacer

[0146] 64. Protrusion

[0147] 65. Reception area for modules

[0148] 66. Connector to the housing

[0149] 67. Connection points of components

[0150] 70 Bipod

[0151] 71 End stop of the housing

[0152] 72 sales

[0153] 73. Receiving part of the pin

[0154] 74. Guide component for pins

[0155] 75. End stop of the connecting part of the clamping element

[0156] 76 Incisions

[0157] 101 Projection Exposure Equipment

[0158] 102 Lighting System

[0159] 107 Mask Master

[0160] 108 Mask Master Holder

[0161] 110 projection optical unit

[0162] 113 chip

[0163] 114-chip holder

[0164] 116DUV radiation

[0165] 117 Optical Components

[0166] 118 installation parts

[0167] 119 Lens Housing

[0168] M1-M6 reflectors

[0169] R is the radius of the connector of the clamping force element.

[0170] s The distance between the housing of the positioning element and the connecting part of the clamping force element

Claims

1. An assembly (30) for semiconductor technology, comprising a module (32) and a module frame (33), wherein, The module (32) is connected to the module frame (33) via a support element (34) and is positioned relative to the module frame (33) by the support element (34), and the connection (35) comprises clamping means (56, 58) which prevent the module (32) from being lifted off the module frame (33), characterized in that the support element (34) has a clamping force element (50) for transmitting the clamping force caused by the clamping means (56, 58) and a positioning element (60) for positioning the module (32) relative to the module frame (33), wherein the clamping force element (50) is arranged within the positioning element (60).

2. Assembly (30) according to claim 1, characterized in that the clamping force element (50) has at least one receiving portion (52) for a clamping element (56) of the clamping means (56, 58).

3. Assembly (30) according to one of claims 1 and 2, characterized in that the positioning element (60) has at least one receiving portion (65) for the module (32).

4. Assembly (30) according to one of the preceding claims, characterized in that the support element (34) has at least one first spacer (63) for setting the alignment of the module (32) relative to the module frame (33).

5. Assembly (30) according to one of the preceding claims, characterized in that the support element (34) has at least one second spacer (53) for setting the position of the receiving portion (52) for the clamping element (56) relative to a joining surface (62) of the receiving portion (65) for the module (32).

6. Assembly (30) according to one of claims 2 to 5, characterized in that the clamping force element (50) has a lever (51) between the receiving portion (52) for the clamping element (56) and the connection (35) to the module frame (33).

7. Assembly (30) according to one of the preceding claims, characterized in that the clamping force element (50) is formed to be rigid only in its longitudinal direction.

8. Assembly (30) according to one of the preceding claims, characterized in that the clamping force element (50) and / or the positioning element (60) have at least one decoupling element (59, 66).

9. Assembly (30) according to claim 8, characterized in that the support element (34) has at least one end stop (71, 75) for protecting the at least one decoupling element (59, 66) in the clamping force element (50) and / or the positioning element (60).

10. Assembly (30) according to one of claims 6 to 9, characterized in that the connection (35) of the support element (34) and the contact surface (37) of the module frame (33) are formed as convex.

11. Assembly (30) according to claim 10, characterized in that the radius (R) of the convex contact surface (37) corresponds to the distance between the contact surface (37) and the decoupling (59) between the lever (51) and the receiving portion (52) of the clamping force element (50).

12. Assembly (30) according to any one of claims 6 to 11, characterized in that the clamping force element (50) is prestressed relative to the link (35) to the module frame (33).

13. Assembly (30) according to any one of claims 6 to 12, characterized in that the positioning element (60) is rigidly connected only in its longitudinal direction to the receiving portion (65) for the module (32) and rigidly connects the link (35) to the module frame (33).

14. Assembly (30) according to any one of the preceding claims, characterized in that the support element (34) has a spring (72) for aligning the clamping force element (50) perpendicularly to the clamping force relative to the positioning element (60).

15. Assembly (30) according to any one of the preceding claims, characterized in that the assembly (30) comprises a bipod (70) having two bearing elements (34).

16. Assembly (30) according to claim 15, characterized in that the bipod (70) comprises a decoupling element (59) for decoupling a moment about an axis perpendicular to the longitudinal direction of the clamping force element (50) and perpendicular to the clamping force.

17. Device for semiconductor technology, comprising an assembly according to any one of claims 1 to 16.

18. Device according to claim 17, characterized in that the device is a projection exposure apparatus (1, 101).

19. Device according to claim 17, characterized in that the device is a mask inspection device.

20. Method for manufacturing a device according to any one of claims 17 to 19, comprising the assembly according to any one of claims 1 to 16.

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