A method for additive manufacturing of high-throughput sample arrays using oscillating laser wire-powder co-deposition

Abstract

This invention discloses a high-throughput additive manufacturing method for sample arrays using oscillating laser co-deposition of wire and powder, belonging to the field of laser directional energy deposition technology. The method includes: planning and numbering the array on the same substrate; establishing corresponding process parameters, composition design, and material configuration matrices; sequentially performing co-deposition of wire and powder using lasers on each unit according to the numbering and scheduling parameters under a thermal management strategy. This process includes dual-laser collaborative control, wire / powder co-deposition, and configuration realization control; and finally outputting a table relating the numbering to the parameters. This invention achieves independent or grouped setting of parameters such as dual lasers, defocusing amount, wire / powder feed amount, and supply timing at the unit level through matrix scheduling, thereby obtaining discrete combinations or gradient changes in composition, microstructure, and configuration. It rapidly constructs a multi-parameter, multi-component, and multi-configuration sample library with comparable thermal history and traceable data in a single forming process, significantly improving material and process screening efficiency and reducing sample preparation costs.

Description

Technical Field

[0001] This invention belongs to the field of metal additive manufacturing technology, specifically relating to a laser additive manufacturing method based on directional energy deposition (DED). Background Technology

[0002] With the deepening of new material development and advanced manufacturing process research, how to efficiently and systematically screen and optimize material composition, process parameters, and microstructure within a limited R&D cycle has become a key bottleneck restricting material innovation and application. Traditional material R&D typically requires reverse sampling and performance testing under different process windows, different composition systems, and different microstructure / configuration strategies, resulting in long R&D cycles, high costs, and low efficiency. To improve R&D efficiency, the concepts of "materials genome engineering" and "high-throughput experiments" have emerged. Their core is to rapidly build sample libraries on a unified platform and establish traceable data links to accelerate material discovery and process optimization. Although existing technologies have developed various solutions in certain aspects, they still fall short of meeting the overall system requirements of DED (Design for Manufacturing) R&D scenarios.

[0003] First, existing multi-component powder feeding and mixing schemes (such as CN112831781A, CN109207995A, etc.) can achieve rapid switching of powder ratios, but they are still centered on the "powder system" and do not cover the process control of the co-entry of wire and powder into the molten pool in DED. It is difficult to systematically regulate the dilution behavior, interfacial metallurgical bonding and microstructure / reinforcing phase distribution when wire and powder are co-fed, thus making it difficult to support the stable preparation and comparison of multi-configuration materials on the same platform.

[0004] Second, existing solutions for powder feeding nozzles, powder spot shaping, and light spot-powder spot matching (such as CN203999818U, CN113909504A, CN114032541A, etc.) focus on issues of "process feasibility / stability" such as powder feeding uniformity, light powder alignment, and powder spot shaping. However, they mostly remain at the optimization of a single material system or a fixed process window, lacking a systematic combination with the unit-level independent parameter scheduling, numbering and calibration, correlation table output, and interval deposition thermal management required for arrayed high-throughput preparation. This makes it difficult to engineer and implement a "traceable sample library".

[0005] Third, while existing filament additive or filament-powder composite additive solutions (such as US20210060861A1, WO2011082582A1, etc.) can balance deposition efficiency and material flexibility, they are mostly geared towards single-piece forming or repair applications. They lack a process-oriented definition and standardized implementation path for simultaneously developing multi-parameter, multi-component, and multi-configuration combinations on the same substrate in the material research and development scenario, and forming a process that can compare thermal history and data mapping.

[0006] Fourth, existing oscillation / trajectory programmable laser control solutions (such as US20200101566A1, US20160368089A1, CN103495803A, etc.) mainly serve the stability of welding / cladding forming and defect suppression. They have not yet formed an integrated process scheduling framework with wire / powder feeding ratio, height direction adjustment amount Δz control, and dilution rate control in wire and powder co-feeding. At the same time, existing high-throughput array-related research focuses more on beam spot amplification or composition step, and still lacks systematic support for unit-level parameter setting, configuration programming, thermal management and traceable data links, which makes it difficult to meet the overall needs of DED high-throughput screening.

[0007] Therefore, there is an urgent need for a high-throughput sample array preparation method for directional energy deposition (DED) that enables rapid combination of multiple parameters, multiple compositions and multiple configurations on the same substrate, and has the data mapping capability of comparable thermal history and traceable parameters, so as to significantly improve the efficiency of material and process development and reduce sample preparation costs. Summary of the Invention

[0008] To address the problems of low sample preparation efficiency, poor comparability of sample thermal histories, and limited dimensions of composition and configuration control in existing material and process development, this invention proposes a high-throughput additive manufacturing method for sample arrays using oscillating laser wire-powder co-deposition. This method enables the batch preparation of multiple sample units on the same substrate in a single process, and allows for the combination design and rapid switching of multiple parameters, compositions, and configurations at the unit scale. Simultaneously, it outputs traceable sample number-coordinate-parameter mapping data, providing a high-throughput sample library foundation for subsequent screening of multiple properties such as hardness, toughness, high-temperature wear resistance, and corrosion resistance.

[0009] To achieve the above objectives, the present invention adopts the following technical solution:

[0010] A method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder, characterized by comprising the following steps:

[0011] S1. Array planning and path generation: Plan the array layout of multiple sample units on the same substrate, generate the processing path corresponding to each sample unit according to the array layout and deposition sequence strategy, and assign a unique number to each unit.

[0012] S2. Parameter Matrix Establishment: Establish the process parameters, composition design, and material configuration matrix corresponding to each number;

[0013] S3. Parameter Loading and Deposition Execution: Based on the number, the parameters in the process parameter matrix, composition design matrix, and material configuration matrix corresponding to the number established in step S2 are scheduled, and under the control of the thermal management strategy, the wire-powder co-delivery laser deposition process is executed sequentially on each sample unit; the deposition process includes dual-laser collaborative control, wire-powder co-delivery control, and material configuration realization control.

[0014] S4. Data Output: After preparation, output the association table.

[0015] Further: In step S2,

[0016] The process parameter matrix includes at least: main laser power, scanning speed, main laser spot position; oscillating laser power, oscillating laser oscillation mode and oscillation parameters; the angle θ between the wire feeding direction and the main laser beam axis; and the set value of the height adjustment amount Δz; wherein: main laser power specifically refers to the laser output power used to melt the powder; oscillating laser power specifically refers to the laser output power used to perform oscillating scanning, which mainly affects the melting of the wire and the stirring of the molten pool; Δz is defined as: under the condition that the position of the main laser focus is predetermined, the axial height offset of the planned powder beam convergence point relative to the focus is used to control the powder capture efficiency, molten pool dilution rate and melting depth during the deposition process;

[0017] The composition design matrix should include at least: filament type, powder type, filament feed rate or powder feed rate, and the ratio or range of filament feed rate to powder feed rate;

[0018] The material configuration matrix includes at least: the timing relationship of wire / powder supply (such as synchronous or segmented), interlayer / pass switching rules, in-plane regionalization rules, and remelting strategy.

[0019] Furthermore, the oscillation pattern is selected from at least one of the following: linear, linear reciprocating, triangular, triangular waveform, sine curve, circular, elliptical, figure-eight, ∞, and Lissajous figure, and the oscillation pattern can be switched between different sample units or between different layers or different passes of the same sample unit.

[0020] Further: The specific process of step S3 is as follows:

[0021] S3.1. Parameter Scheduling and Instruction Generation

[0022] Using the unit number (UnitID) as an index, the corresponding parameters are read from the parameter matrix described in step S2 and written into the device control command, supporting independent or grouped parameter settings at the unit level;

[0023] S3.2. Implement deposition control under thermal management strategy

[0024] Based on the established thermal management strategy, the following integrated control is sequentially executed on each sample unit to form a preset material configuration and ensure the comparability of the thermal history conditions of each sample unit; the integrated control includes:

[0025] a) Dual-laser coordinated control

[0026] The main laser beam is controlled to move along the main scanning trajectory to form a molten pool; at the same time, the oscillating laser beam is controlled to oscillate and scan in the molten pool area in a preset oscillation mode to form an oscillation energy field to enhance the stirring and mixing of the molten pool.

[0027] b) Co-feeding control of silk powder

[0028] Based on the composition design matrix, the types and supply quantities of filaments and powders are set independently or in groups for different sample units; and under coaxial powder feeding conditions, the powder beam convergence point is controlled according to the set value of Δz in the process parameter matrix, so that its actual height position relative to the laser focus reaches and is maintained at the set value, in order to regulate the powder capture efficiency, dilution rate, melting depth and forming stability.

[0029] c) Material configuration realization control

[0030] By programming and controlling the supply timing, interlayer switching, and remelting strategy, extended configurations such as dispersion composite, layered heterogeneity, inter-fusion alloying, or their composites can be achieved.

[0031] Further: The equipment control instructions in step S3.1 include at least laser power, scanning speed, oscillation mode and parameters, Δz, wire feed speed, powder feed amount and deposition sequence.

[0032] Further: The thermal management strategy in step S3.2 is achieved through at least one of the following methods: deposition sequence control, process regulation, substrate temperature control, and sample temperature control.

[0033] Further: The aforementioned deposition sequence control refers to using one of the following scanning sequences for deposition to disperse heat accumulation: checkerboard sequence, diagonal jump sequence, or row-column alternation sequence; the aforementioned process control refers to managing heat input and cooling processes through one or more of the following methods: adding controllable pauses between cells, using local preheating or controlled cooling, setting up isolation zones or sacrificial transition channels; the aforementioned substrate temperature control refers to stabilizing the overall temperature of the substrate by circulating cooling water; the aforementioned sample temperature control refers to controlling the temperature of the sample cells by introducing high-speed cooling gas during the deposition process.

[0034] Further: The methods for achieving the dispersed composite configuration, layered heterogeneous configuration, intermetallic alloying configuration, and extended configuration in step S3.2 are as follows:

[0035] Dispersed composite configuration: The ceramic phase is dispersed in the alloy matrix by synchronously supplying wire and ceramic phase powder and forming the molten pool by scanning and stirring with an oscillating laser.

[0036] Layered heterogeneous configuration: formed by alternating layers or passes with different wire and powder feeding ratios; for example, by alternating "wire-only deposition", "powder-only deposition" or setting different wire and powder deposition ratios in the same sample unit to form a layered structure with alternating wire / powder layers.

[0037] Intermelting alloying configuration: formed by supplying wire and alloy powder and remelting the deposited layer; for example, by supplying wire and alloy powder simultaneously or in segments, and performing one or more remelting passes on the deposited layer to fully mix the powder and wire melt to form an alloyed deposited layer. Note: The remelting pass refers to the pass for remelting, homogenizing and shaping the deposited layer. During remelting, wire feeding and powder feeding are turned off, and laser process parameters that are the same as those in the deposition pass or adjusted according to preset rules are used to achieve complete or near-complete remelting of the deposited layer, thereby improving the intermelting uniformity and reducing surface undulations.

[0038] Extended configurations: formed by a combination of at least two of the above-mentioned dispersed composites, layered heterogeneous structures and intermetallic alloys; for example, these combinations are achieved by regional switching of deposition parameters between layers, between channels or in-plane.

[0039] Furthermore, the extended configurations described can be manifested as sandwich structures, gradient structures, island-like or strip-like locally reinforced structures, periodic modulation structures, etc.

[0040] Further: The specific process of step S4 is as follows:

[0041] S4.1. After completing the array preparation, number and label each sample unit (e.g., UnitID_xxx).

[0042] S4.2. Output a correlation table, which should include at least: sample number, location coordinates, corresponding key process parameters, composition parameters and material configuration parameters. This table is used to correlate subsequent performance test results to form a traceable process-performance dataset.

[0043] It should be understood that the composition design matrix described in this invention is used to define the material category and supply quantity of the sample unit, and its applicable material range is broad, without limitation on the specific type of filament or powder. The materials listed below are only some examples:

[0044] The wire material includes metal wires such as stainless steel, titanium alloy, aluminum alloy, nickel-based alloy, cobalt-based alloy, copper alloy and iron-based alloy.

[0045] The powders include ceramic phase powders, alloy powders, and composite powders coated with nanoparticles. By setting different wire feeding speeds and powder feeding amounts for different sample units, or by adjusting the supply ratio between the two, discrete variations or gradient variations in nominal composition and reinforcing phase content of each sample unit can be achieved. The ceramic phase powders include TiC, WC, TiN, TiB2, VN, VC, CrN, BN, etc.; the nanoparticles include carbide, nitride, boride, or oxide nanoparticles, etc.

[0046] Compared with the prior art, the present invention has at least the following beneficial effects:

[0047] 1. High-throughput preparation, significantly improving efficiency: By batch-preparing multi-unit sample arrays in one forming process on the same substrate, the mode of "sample-by-sample experiment" has been transformed into "array-based parallel experiment", which significantly improves the efficiency of material and process screening and greatly reduces the preparation cost and time cost of a single sample.

[0048] 2. Multidimensional programmable control: With process parameter matrix, composition design matrix and material configuration matrix as the core, it realizes independent setting or group setting at the unit level, covering the combined design space of "process-composition-configuration"; it breaks through the bottleneck of traditional methods that make it difficult to coordinate and quickly traverse the multi-variable "process-composition-structure" and realizes the systematic and efficient exploration of the material performance space.

[0049] 3. Scalable configuration: It can not only obtain three typical configurations: dispersion composite, layered heterogeneous and inter-fusion alloy, but also expand to sandwich, gradient, island and periodic modulation structures through interlayer / inter-channel / in-plane regional switching. This expands the material system and performance control dimensions that additive manufacturing can achieve, and provides a new approach for customized functional material design.

[0050] 4. Comparable thermal histories and traceable data: Through unit-interval thermal management, numbering and calibration, and associated table output, the thermal histories of samples are more consistent, and parameter mappings are traceable, which is conducive to establishing reliable performance mappings and databases. This fundamentally solves the common problems of mixed data and poor comparability in high-throughput experiments, laying a solid foundation for establishing a high-confidence material "process-microstructure-property" database. Attached Figure Description

[0051] To more clearly illustrate the technical solution of the present invention, a brief description of the present invention is provided below in conjunction with the accompanying drawings. The drawings are merely illustrative, used to explain the method flow and key variable relationships of the present invention, and do not constitute a limitation on the device structure, size proportions, or specific implementation.

[0052] Figure 1 This is a flowchart of the method of the present invention.

[0053] Figure 2 This is a schematic diagram of an embodiment of the sample array layout and numbering of the present invention.

[0054] Figure 3 A schematic diagram of an embodiment of the swing mode of the present invention.

[0055] Figure 4 This is a schematic diagram showing the positional relationship between light, powder, and filament in this invention.

[0056] Figure 5 The diagram shows the material configuration in the preparation method of the present invention, wherein (a) is a schematic diagram of a dispersed composite configuration; (b) is a schematic diagram of a layered heterostructure configuration; (c) is a schematic diagram of a fused alloy configuration; and (d) is a schematic diagram of an extended configuration.

[0057] Figure 6 Example diagram of the associated table fields in the preparation method of this invention.

[0058] Figure 7 This is a schematic diagram of the cross-section of the layered heterogeneous sample prepared according to the present invention.

[0059] Figure 8 This is a sample image of the high-throughput array prepared according to the present invention. Detailed Implementation

[0060] The following embodiments are used to illustrate the feasibility of the present invention and do not constitute a limitation on the scope of protection. In the embodiments, "sample unit" refers to an arrayed sample preparation area arranged on the same substrate, which can be a single-pass single-layer, single-pass multi-layer, multi-pass single-layer, or multi-pass multi-layer structure. Unless otherwise stated, the parameters can be set independently at the unit level or grouped in the process parameter matrix for different sample units.

[0061] The following is based on Figure 1 Briefly describe the general implementation process of this invention. From Figure 1 As can be seen, the overall method for high-throughput sample array additive manufacturing of the present invention by oscillating laser wire powder co-deposition includes four main steps, specifically:

[0062] S1: Array Planning and Path Generation

[0063] On the same substrate, according to a preset array (such as...) Figure 2 The m×n arrangement shown is used to plan the numbering (UnitID) and coordinates of multiple sample units; based on the array layout and deposition sequence strategy, the processing path corresponding to each sample unit is generated;

[0064] S2: Establishing the parameter matrix

[0065] Establish process parameter matrices, composition design matrices, and material configuration matrices corresponding to each sample unit number, and complete the association between parameters and sample units;

[0066] The process parameter matrix includes at least: main laser power, scanning speed, and main laser spot position; oscillating laser power, oscillating laser oscillation mode, and oscillation parameters such as amplitude, frequency, and power; the angle θ between the wire feeding direction and the main laser beam axis; and the set value of the height adjustment amount Δz; the oscillation mode of this invention includes... Figure 3 The oscillation pattern is at least one of the following: linear, linear reciprocating, triangular, triangular waveform, sine curve, circular, elliptical, figure-eight, and Lissajous figure, and the oscillation pattern can be switched between different sample units or between different layers or different passes of the same sample unit.

[0067] The composition design matrix includes at least: filament type, powder type, filament feed rate or powder feed rate, and the ratio or range between the two;

[0068] The material configuration matrix includes at least: the timing relationship of wire / powder supply (synchronous or segmented), interlayer / pass switching rules, in-plane regionalization rules, and remelting strategy;

[0069] S3: Parameter Loading and Deposition Execution

[0070] Using UnitID as an index, the parameter record corresponding to UnitID is read from the parameter matrix described in step S2 and written into the device control command; then, under the control of the thermal management strategy, the interval deposition method is used, and deposition control is performed on each sample unit sequentially according to the processing path generated in S1, so as to form the preset material configuration and complete the preparation of the entire array. The prepared high-throughput array sample is shown in [link to sample description]. Figure 8 ;

[0071] The equipment control commands include at least laser power, scanning speed, oscillation mode and parameters, Δz, wire feed speed, powder feed amount, and deposition sequence;

[0072] The material configuration preset in this invention is referenced. Figure 5 Specifically, these include: (a) the dispersed composite configuration; (b) the layered heterostructure configuration; (c) the intermetallic alloy configuration; and (d) the extended configuration. From (d), it can also be seen that the extended configuration exhibits sandwich structures, gradient structures, island-like or strip-like locally reinforced structures, or periodically modulated structures.

[0073] This invention records parameters into equipment control commands, aiming to convert relevant parameters defined in the process parameter matrix, composition design matrix, and material configuration matrix into precise control signals for the laser (such as power, scanning speed, oscillation mode and parameters), powder feeder (such as powder amount, powder spot position and height direction adjustment Δz), wire feeder (such as wire feed speed), and deposition sequence (such as material configuration switching rules and remelting settings) in real time, thereby driving the equipment to perform the deposition process according to the preset requirements of each sample unit.

[0074] The thermal management strategy mentioned in this invention is generally achieved through at least one of the following methods: deposition sequence control, process regulation, substrate temperature control, and sample temperature control; wherein:

[0075] The aforementioned deposition sequence control refers to using one of the following scanning sequences for deposition to disperse heat accumulation: checkerboard sequence, diagonal jump sequence, or row-column alternation sequence;

[0076] The process control mentioned above refers to managing the heat input and cooling process through one or more of the following methods: adding controllable pauses between units, using local preheating or controlled cooling, setting up isolation zones or sacrificial transition channels;

[0077] The aforementioned substrate temperature control refers to stabilizing the overall temperature of the substrate by circulating cooling water.

[0078] The aforementioned sample temperature control refers to controlling the temperature of the sample unit by introducing high-speed cooling gas during the deposition process;

[0079] S4: Data Output

[0080] After the array is prepared, each sample unit is numbered and labeled (e.g., UnitID_xxx); and the data is output in the form of an association table; the association table information includes at least: sample number, location coordinates, corresponding key process parameters, composition parameters and material configuration parameters.

[0081] The specific implementation process of the present invention will be described in detail below through four embodiments.

[0082] Example 1: Intermetallic alloy configuration (see Figure 5 Preparation of (c)

[0083] This embodiment is used to illustrate the feasibility of the present invention under the intermetallic alloy configuration.

[0084] S1: Array Planning and Path Generation

[0085] First, according to Figure 1The method flow shown completes the array planning. In Example 1, the prepared object is a single sample unit with 24 channels and 5 layers. For ease of backtracking, this parameter combination is defined as a parameter combination number (e.g., UnitID_A01). This number only serves as an index for the parameter record and does not represent its actual coordinates in the array. The preset position coordinates of this unit in the overall array are (1,1), according to... Figure 1 The m×n index coordinates shown indicate that this unit occupies a 1×1 position in m×n, denoted as (1,1). Based on the "24 channels and 5 layers" structure setting, the corresponding processing path for this unit is generated.

[0086] S2: Establishing the parameter matrix

[0087] Create the following matrix record for this unit (UnitID_A01) and associate it with the number:

[0088] 1. Process parameter matrix:

[0089] The main laser power P1 = 3600 W, the scanning speed v = 10 mm / s, and the main laser spot is focused on the substrate surface (defocusing amount = 0).

[0090] The oscillating laser power P2 = 800W, and the oscillation mode is a triangle mode (see [reference]). Figure 3 The oscillation frequency is f = 10 Hz, and the oscillation amplitude is A = 3 mm.

[0091] Height adjustment amount Δz = 2mm;

[0092] The angle θ between the wire feeding direction and the axis of the main laser beam is 45°.

[0093] 2. Ingredient Design Matrix:

[0094] Wire type: 316L stainless steel wire;

[0095] Powder type: Martensitic stainless steel powder;

[0096] Wire feeding / powder feeding ratio: 1:1, and wire feeding rate: 10g / min;

[0097] 3. Material configuration matrix:

[0098] Material configuration type: intermetallic alloy;

[0099] Silk / Powder Supply Sequence: Synchronous Supply

[0100] Remelting strategy: Remelt once.

[0101] S3: Parameter Loading and Deposition Execution

[0102] S3.1. Using UnitID_A01 as the index, read the corresponding parameters from the process parameter matrix, composition design matrix, and material configuration matrix described in step S2, and integrate them into equipment control instructions;

[0103] S3.2. Guided by the processing path generated in step S1, perform the following deposition controls on UnitID_A01 to form a preset material configuration:

[0104] a) Dual-laser coordinated control: The main laser beam is controlled to run along a preset main scanning path to form a stable molten pool; at the same time, the oscillating laser beam is controlled to oscillate periodically in the molten pool area with a triangular trajectory, and the oscillation energy field is used to stir and redistribute energy in the molten pool to promote the mixing of the melt, stabilize the morphology and improve the alloying uniformity.

[0105] b) Co-feeding control of silk powder (see Figure 4 According to the composition design matrix, coaxial powder feeding and lateral 45° wire feeding are simultaneously activated so that 316L wire and martensitic stainless steel powder are fed into the molten pool at a set flow rate (10 g / min); according to the set value of Δz (2 mm) in the process parameter matrix, the height of the powder beam convergence point is adjusted in real time to accurately control the powder capture efficiency, melting depth and forming stability.

[0106] c) Material configuration implementation control: Based on the material configuration matrix, perform intermetallic alloying configuration programming; specifically including:

[0107] ① Supply sequence: A simultaneous supply mode for silk and powder is adopted;

[0108] ② Remelting strategy: After the main deposition layer is completed, a remelting channel is executed;

[0109] d) Implementation of thermal management strategy: To ensure the comparability of thermal histories between units, the following controls are implemented simultaneously:

[0110] Substrate temperature control: Cooling water is circulated through the substrate to stabilize the overall heat sink;

[0111] Sample temperature control: Cooling gas is blown into the deposition area to actively manage the cooling process;

[0112] e) Deposition and remelting execution: After the main deposition is completed according to the path, a remelting process is executed immediately; during remelting, wire feeding and powder feeding are turned off, and the laser process parameters are set according to the principle of "ensuring complete remelting of the deposited layer without introducing additional component segregation" to achieve further homogenization of alloy composition and surface shaping.

[0113] S4: Data Output

[0114] S4.1. Numbering and labeling: After the preparation of this unit is completed, the sample unit is numbered and labeled (e.g., UnitID_A01).

[0115] S4.2. Correlation Table Output: Output the correlation table, including: sample number, position coordinates, Ws=316L, Pw=martensitic stainless steel powder, P1, v, P2, oscillation mode, A, f, Δz, wire feed rate, powder feed rate, material configuration sequence, and remelting settings; see the following sample example for the correlation table output. Figure 6 Ws and Pw represent the type of filament and the type of powder, respectively.

[0116] Example 2: Dispersed composite configuration (see...) Figure 5 Preparation of (a)

[0117] This embodiment illustrates the feasibility of the present invention in a dispersed composite material configuration. The steps of Embodiment Two are basically the same as those of Embodiment One, with the differences specifically reflected in the following aspects:

[0118] S1: Array Planning and Path Generation

[0119] In Example 2, the prepared object was a single sample unit with 10 channels and 10 layers; for easy backtracking, this parameter combination was defined as parameter combination number UnitID_A02.

[0120] S2: Establishing the parameter matrix

[0121] The following parameter matrix is ​​established for this unit (UnitID_A02):

[0122] 1. Ingredient Design Matrix:

[0123] The martensitic stainless steel powder in Example 1 was replaced with TiC ceramic powder. The wire feeding amount remained the same, but the wire feeding and powder feeding ratio was changed to 10:1, that is, 1g / min of TiC was added to a wire feeding amount of 10g / min.

[0124] 2. Process parameter matrix:

[0125] The main laser beam power P1=2400W, the scanning speed v=10 mm / s, and the main laser spot is focused on the substrate surface (defocusing amount is 0).

[0126] The oscillating laser power P2 = 800 W, and the oscillation mode is circular (see [reference]). Figure 3 The oscillation frequency is f = 20 Hz, and the oscillation amplitude is A = 3 mm.

[0127] Height adjustment Δz = 0 mm;

[0128] The angle θ between the wire feeding direction and the axis of the main laser beam is 30°.

[0129] 3. Material configuration matrix:

[0130] Material configuration type: Dispersion composite;

[0131] Silk / Powder Supply Sequence: Synchronous Supply;

[0132] Remelting strategy: None.

[0133] S3: Parameter Loading and Deposition Execution

[0134] S3.1. Using UnitID_A02 as the index, read the corresponding parameter from the parameter matrix described in step S2 and write it into the device control command;

[0135] S3.2. Guided by the processing path generated in step S1, deposition control is performed on UnitID_A02 to form a preset material configuration. The main difference between this embodiment and Embodiment 1 in terms of deposition control is:

[0136] The oscillation mode of the oscillating laser beam is controlled to be circular oscillation;

[0137] The angle θ between the wire feeding direction and the axis of the main laser beam is controlled to be 30°.

[0138] The height position of the powder beam convergence point, i.e., Δz, is controlled to be 0;

[0139] The thermal management strategy combines interlayer row and column staggered sequence control with substrate cooling water circulation control.

[0140] S4: Data Output

[0141] S4.1. Numbering and labeling: After the preparation of this unit is completed, the sample unit is numbered and labeled, for example, UnitID_A02;

[0142] S4.2. Output of the correlation table: Output the correlation table, which should include: sample number, position coordinates, Ws=316L, Pw=TiC ceramic powder, P1, v, P2, oscillation mode, A, f, Δz, wire feed amount, powder feed amount, material configuration sequence and remelting settings.

[0143] Example 3: Layered isomer configuration (see Figure 5 Preparation of (b)

[0144] This embodiment illustrates the feasibility of the present invention in a layered heterogeneous configuration. The steps of Embodiment 3 and Embodiment 1 are basically the same, with the differences specifically reflected in the following aspects:

[0145] S1: Sample Array Planning and Processing Path Generation

[0146] In Example 3, the object prepared was a single sample unit with 10 channels and 20 layers, and this parameter combination was defined as parameter combination number UnitID_A03.

[0147] S2: Establishing the parameter matrix

[0148] The following parameter matrix is ​​established for this unit (UnitID_A03):

[0149] 1. Component matrix:

[0150] The wire is pure Ti metal wire; the powder is a composite material of TC4 surface coated with TiB2 powder.

[0151] 2. Process parameter matrix:

[0152] For the filament layer, the main laser power is P1 = 3200W, the scanning speed is v = 15mm / s, and the main laser spot is focused 2mm above the substrate surface (the main laser defocusing amount is = 2mm); the oscillating laser power is P2 = 400W, the oscillation mode is figure-eight, the oscillation frequency is f = 5Hz, and the oscillation amplitude is A = 2.5 mm; the angle between the filament feeding direction and the axis of the main laser beam is θ = 30°.

[0153] For the powder layer, the main laser power is P1=2000W, the scanning speed is v=15mm / s, and the main laser spot is focused 2mm above the substrate surface (the main laser defocusing amount is =2mm); the oscillating laser power is P2=800W, the oscillation mode is triangular, the oscillation frequency is f=10 Hz, the oscillation amplitude is A=2.5mm, the height adjustment amount Δz=0mm, and the angle between the wire feeding direction and the main laser beam axis is θ=30°.

[0154] 3. Material configuration matrix:

[0155] Material configuration type: layered isomerism;

[0156] Silk / Powder Supply Sequence: In Example 3, a layered structure is formed by controlling the timing of powder / silk feeding. The set layer sequence rule for the sample unit is: within the same unit, the "silk layer" and "powder layer" are alternately executed by layer or by pass, and the silk layer only feeds silk; the powder layer only feeds powder.

[0157] Remelting strategy: Remelt once.

[0158] S3: Parameter Loading and Deposition Execution

[0159] S3.1. Using UnitID_A03 as the index, read the corresponding parameter from the parameter matrix described in step S2 and write it into the device control command;

[0160] S3.2. Guided by the processing path generated in step S1, deposition control is performed on UnitID_A03 to form a preset material configuration. The difference between the deposition control and Example 1 is as follows:

[0161] The main laser spot is controlled to be focused on the upper 2mm of the substrate surface, that is, the defocusing amount of the main laser spot is 2mm;

[0162] The oscillation pattern of the oscillating laser distinguishes between the filament layer and the powder layer; the filament layer oscillates in a figure-eight pattern, while the powder layer oscillates in a triangular pattern.

[0163] When preparing the powder layer, control Δz=0 mm; when preparing the wire layer, the wire feeding angle is 30°, and the metal wire is fed into the front edge of the molten pool from the side;

[0164] The supply timing control adopts a timing switching supply mode control for powder / filament feeding;

[0165] During deposition, the wire layer is deposited first according to the preset layer sequence (wire feeding is turned on, powder feeding is turned off), and then the powder layer is deposited (powder feeding is turned on, wire feeding is turned off). This process is repeated until the 20 layers of the unit are stacked. At the interlayer interface, the oscillating laser is used to promote the spread of the molten pool and the metallurgical bonding of the interface. When preparing the wire layer, the metal wire is fed into the front edge of the molten pool from the side.

[0166] S4: Sample calibration and data correlation output

[0167] S4.1. Numbering and labeling: After the preparation of this unit is completed, the sample unit is numbered and labeled as UnitID_A03;

[0168] S4.2. Output of Association Table: Output the association table, which should include at least: Ws, Pw, layer sequence rules (filament layer / powder layer switching mode), parameters of each layer (P1, v, P2, oscillation mode, A, f, Δz), filament feed amount, powder feed amount and remelting settings, etc.

[0169] The cross-sectional view of the sample prepared in Example 3 is shown in Figure 3. Figure 7 As can be seen from the figure, a sample unit is formed by layer-by-layer deposition. The powder layer in the sample is darker in color due to the addition of TC4, while the wire layer is pure Ti metal wire, which presents a metallic luster.

[0170] It should be noted that although in Example 3, no powder is fed into the filament layer and no filament is fed into the powder layer, the cladding equipment is fixed. Regardless of whether powder is fed or not, the filament feeding angle needs to be fixed to ensure that the parameters are correct when feeding powder into the next layer. Similarly, even though no filament is fed into the powder layer, the filament feeding angle is also preset to ensure that the parameters are correct in the filament layer.

[0171] Extended Implementation (see) Figure 5 (d) Based on the intermetallic alloy configuration of Example 1, the dispersed composite configuration of Example 2, and the layered heterogeneous configuration of Example 3, this invention allows for arbitrary combinations of the three configurations within the same single sample unit to obtain extended configurations such as sandwich, gradient, and segmented composite structures. The segmented composite structure includes island-like or strip-like locally reinforced structures or periodically modulated structures. For example:

[0172] (1) Sandwich structure obtained by interlayer combination

[0173] The material configuration type can be switched between different layers within the same sample unit. For example, the bottom layer can use intermetallic alloying (to enhance metallurgical bonding and alloying), the middle layer can use layered heterogeneity (to create interlayer differences), and the surface layer can use dispersion composite (to introduce dispersion strengthening phases), or they can be combined in any order. Interlayer switching is achieved by changing the wire / powder feeding sequence and remelting settings.

[0174] (2) Obtaining gradient structure by combining stages

[0175] Within the same layer, the material configuration type can be switched according to the number of passes. For example, the first few passes may use intermetallic alloying, while the later passes may use dispersion composite, or layered heterogeneous passes may be interspersed to achieve structural composite within the same layer. Pass switching is achieved by setting the wire / powder feeding on / off, the supply ratio, and the remelting pass insertion rules.

[0176] (3) Segmented combination (segmented along the height direction) to obtain segmented composite structure

[0177] Within the same channel or layer, the material configuration type can be switched in segments according to the processing progress. For example, first, a continuous matrix can be formed by mutual melting alloying, and then the process can be switched to dispersed composite to introduce a reinforcing phase, or a remelting segment can be inserted at the end of the segment for homogenization and shaping.

[0178] All of the above combinations employ dual-laser coordinated control: the main laser forms the molten pool, while the oscillating laser stirs the molten pool according to a preset oscillation mode; under coaxial powder feeding conditions, the height of the powder convergence point is adjusted by setting Δz, while simultaneously setting the angle between the wire feeding direction and the laser beam. After preparation is completed, the unit is numbered and calibrated, and parameter combination records are saved / output, including at least: the material configuration type corresponding to each layer / pass / segment, P1, v, P2, oscillation mode, A, f, Δz, wire feeding amount, powder feeding amount, and remelting settings, etc., for correlation with subsequent performance test results to form traceable data.

[0179] It should be noted that the above embodiments one to three and the extended embodiments respectively demonstrate the specific implementation methods for preparing sample units with single characteristics (such as intermetallic alloying, dispersion composites, layered heterogeneity) or composite characteristics using the method of the present invention. In actual high-throughput fabrication, the complete process of the method of the present invention is as follows: on the same substrate, according to the preset array plan (such as... Figure 2The system will automatically and continuously prepare a complete sample array composed of multiple such units. The core control logic is as follows: after the deposition of one unit is completed, the system uses the next unit's unit ID as an index to automatically and iteratively retrieve the corresponding complete parameter set from the established process parameter matrix, composition design matrix, and material configuration matrix, and loads the equipment control instructions. Subsequently, according to the overall path and thermal management strategy planned in step S1, the deposition of all units in the array is completed one by one, ultimately yielding... Figure 8 The sample shown is an example of this. Through this cyclical execution mode of "parameter scheduling - unit deposition", a series of sample libraries with different compositions, processes, and material configurations (including basic material configurations and their arbitrary combinations) can be automatically prepared in a single manufacturing task without human intervention, thereby achieving truly high-throughput parallel experiments and data traceability.

[0180] The above embodiments are only used to illustrate the technical solutions and implementation processes of the present invention, and do not constitute any limitation on the scope of protection of the present invention. Within the framework of the technical solutions disclosed in the present invention, any equivalent changes or modifications (including but not limited to adjustments to materials, parameters, and material configuration combinations) that can be conceived by those skilled in the art without creative effort should fall within the scope of protection of the patent rights of the present invention. The final scope of protection of the present invention shall be determined by the claims.

Claims

1. A method for additive manufacturing of high-throughput sample arrays using oscillating laser wire-powder co-deposition, characterized in that, Includes the following steps: S1. Array planning and path generation: Plan the array layout of multiple sample units on the same substrate, generate the processing path corresponding to each sample unit according to the array layout and deposition sequence strategy, and assign a unique number to each unit. S2. Parameter Matrix Establishment: Establish the process parameter matrix, composition design matrix, and material configuration matrix corresponding to each number; The process parameter matrix includes at least: main laser power, scanning speed, main laser spot position; oscillating laser power, oscillation mode and oscillation parameters; the angle θ between the wire feeding direction and the main laser beam axis; and the set value of the height direction adjustment amount Δz, where Δz is defined as: the axial height offset of the planned powder beam convergence point relative to the focal point under the condition that the main laser focal point position is predetermined. The composition design matrix includes at least: filament type, powder type, filament feed amount, powder feed amount, and the ratio or range of filament feed amount to powder feed amount; The material configuration matrix includes at least: the timing relationship of wire / powder supply, interlayer / pass switching rules, in-plane regionalization rules, and remelting strategy; S3. Parameter Loading and Deposition Execution: Based on the assigned number, the parameters in the process parameter matrix, composition design matrix, and material configuration matrix corresponding to that number, established in step S2, are sequentially used to perform co-feed laser deposition on each sample unit under the control of the thermal management strategy. The deposition process includes dual-laser collaborative control, co-feed laser control, and configuration realization control. The specific process is as follows: S3.

1. Parameter scheduling and instruction generation; Using the number as an index, the corresponding parameter is read from the parameter matrix described in step S2 and written into the device control command, supporting unit-level independent or grouped parameter setting; S3.

2. Implement deposition control under a thermal management strategy; Based on the established thermal management strategy, the following integrated control is sequentially executed on each sample unit to form a preset material configuration and ensure the comparability of the thermal history conditions of each sample unit; the integrated control includes: a) Dual-laser coordinated control; The main laser beam is controlled to move along the main scanning trajectory to form a molten pool; at the same time, the oscillating laser beam is controlled to oscillate and scan in the molten pool area in a preset oscillation mode to form an oscillation energy field to enhance the stirring and mixing of the molten pool. b) Control of co-feeding of silk powder; Based on the composition design matrix, the types and supply quantities of filaments and powders are set independently or in groups for different sample units; and under coaxial powder feeding conditions, the powder beam convergence point is controlled according to the set value of Δz in the process parameter matrix, so that its actual height position relative to the laser focus reaches and is maintained at the set value, in order to regulate the powder capture efficiency, dilution rate, melting depth and forming stability. c) Control of material configuration; By programming and controlling the supply timing, interlayer switching and remelting strategy, it is possible to achieve dispersed composite configuration, layered heterogeneous configuration, intermelting alloy configuration or extended configurations of their combination; S4. Data Output: After preparation, output the association table; the specific process is as follows: S4.

1. After completing the array preparation, each sample unit is numbered and calibrated; S4.

2. Output a correlation table, which should include at least: sample number, location coordinates, corresponding key process parameters, composition parameters and material configuration parameters. This table is used to correlate the test results of subsequent performance to form a traceable process-performance dataset.

2. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 1, characterized in that, The oscillation pattern is selected from at least one of the following: linear, linear reciprocating, triangular, triangular waveform, sine curve, circular, elliptical, figure-eight, ∞, and Lissajous figure, and the oscillation pattern can be switched between different sample units or between different layers or different channels of the same sample unit.

3. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 1, characterized in that, The equipment control instructions in step S3.1 include at least laser power, scanning speed, oscillation mode and parameters, Δz, wire feed speed, powder feed amount and deposition sequence.

4. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 1, characterized in that, The thermal management strategy in step S3.2 is achieved through at least one of the following methods: deposition sequence control, process regulation, substrate temperature control, and sample temperature control.

5. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 4, characterized in that, The aforementioned deposition sequence control refers to using one of the following scanning sequences for deposition to disperse heat accumulation: checkerboard sequence, diagonal jump sequence, or row-column alternation sequence; The process control mentioned above refers to managing the heat input and cooling process through one or more of the following methods: adding controllable pauses between units, using local preheating or controlled cooling, setting up isolation zones or sacrificial transition channels; The aforementioned substrate temperature control refers to stabilizing the overall temperature of the substrate by circulating cooling water. The aforementioned sample temperature control refers to controlling the temperature of the sample unit by introducing high-speed cooling gas during the deposition process.

6. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 1, characterized in that, The methods for achieving the dispersed composite configuration, layered heterogeneous configuration, intermetallic alloying configuration, and extended configuration in step S3.2 are as follows: Dispersed composite configuration: The ceramic phase is dispersed in the alloy matrix by synchronously supplying wire and ceramic phase powder and forming the molten pool by scanning and stirring with an oscillating laser. Layered heterogeneous configuration: formed by alternating layers or passes with different wire and powder feeding ratios; Intermetallic alloy configuration: formed by supplying wire and alloy powder, and remelting the deposited layer; Extended configuration: formed by a combination of at least two of the above-mentioned dispersed composite, layered heterogeneous and intermetallic alloying configurations.

7. The method for additive manufacturing of high-throughput sample arrays by co-deposition of oscillating laser wire and powder as described in claim 6, characterized in that, The extended configurations described above are at least sandwich structures, gradient structures, island-like or strip-like locally reinforced structures, or periodic modulation structures.

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