Method for facilitating online maintenance and debugging of EMMC particle, EMMC particle and electronic equipment

Abstract

The embodiment of the invention provides a method for facilitating online maintenance and debugging of EMMC particles, the EMMC particles and electronic equipment, the EMMC particles comprise a substrate, an EMMC main control chip, a debugging PIN and a plastic package body, a golden finger on the substrate is conductively connected with a debugging wire, the EMMC main control chip is installed on the upper surface of the substrate, the EMMC main control chip is provided with a chip interface bonding pad, and the chip interface bonding pad is electrically connected with the debugging PIN. The chip interface bonding pad is conductively connected to the golden finger through a bonding wire; the debugging PIN is arranged at the edge position of the substrate and is connected to the debugging wire, and the copper sheet on the side surface is exposed; the plastic package body is arranged on the surface of the substrate and covers the EMMC main control chip; the method comprises the steps that the installation position of a debugging PIN is acquired through a specific mark position of a substrate, and solder paste is added to a copper sheet on the side face of the debugging PIN; the solder paste is heated, so that the solder paste is molten to infiltrate the side copper sheet of the debugging PIN; a conductive material is adhered to a side copper sheet of the debugging PIN, a lead is added to the conductive material, the conductive material is connected to debugging equipment, and the EMMC main control chip is repaired and debugged on line through the debugging equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, in particular to a method for easy online maintenance and debugging of EMMC particles, an EMMC particle and an electronic device. BACKGROUND

[0002] In the related art, under the background of rapid development of current information technology, the debugging tools and methods of hardware devices become more and more important. As an embedded storage solution widely used in smart phones, tablet computers and other consumer electronics, the optimization of the performance of EMMC (Embedded Multi-Media Card) and the troubleshooting of customer problems are a challenge to the storage module factory.

[0003] EMMC module chips are generally provided with debug interfaces such as JTAG universal interface and serial communication interface, through which chip internal testing and debugging can be performed. The pins of the debugging interface are arranged on the useless pins of the EMMC, and the background running and debugging can be performed through the test pins on the self-designed test board. However, the production board of the customer does not set these interfaces, and when problems are encountered in terminal testing, the following methods are usually used for debugging: The first debugging method: the common method is to disassemble the chip by using a hot air gun, and reattach it to the test board to reproduce and verify the problem. The disassembly process is relatively cumbersome, and the disassembly process can easily damage the chip and introduce other abnormal problems. The change of the test system makes the problem not easy to reproduce. For this chip disassembly scheme: the disadvantages are that the disassembly process is relatively cumbersome, the disassembly process can easily damage the chip, and if the bottom of the chip is reinforced with glue, the disassembly cannot be completed. And it is easy to introduce other abnormal problems, and the change of the test system makes the problem not easy to reproduce.

[0004] The second debugging method: test pads are arranged on the upper surface of the EMMC module chip, and when problems need to be debugged and analyzed, the surface of the plastic package is damaged by using sharp tools or laser equipment to expose the pads, and the debugging and analysis is performed through the copper wire soldering interface. For this debugging method of damaging the surface of the plastic package to expose the pads, the disadvantages are that the pads are small, the positioning is difficult, and the damage to the chip can easily introduce other abnormalities. SUMMARY

[0005] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, the present application provides a method for easy online maintenance and debugging of EMMC particles, an EMMC particle and an electronic device, which aims to output the test interface in a non-destructive way on the customer board without disassembling the chip and damaging the chip, to facilitate online debugging and analysis, not to damage the first problem site, and to easily reproduce the problem.

[0006] In a first aspect, the embodiments of the present application provide a method for facilitating online maintenance and debugging of an EMMC particle, applied to an EMMC particle, the EMMC particle comprising: a substrate provided with a golden finger and a debugging trace, the golden finger and the debugging trace being conductively connected; an EMMC master chip mounted on an upper surface of the substrate, the EMMC master chip being provided with a chip interface pad, the chip interface pad being conductively connected to the golden finger through a bonding wire; a debugging PIN provided at an edge position of the substrate and exposed with a side copper skin, the debugging PIN being connected to the debugging trace; a plastic package provided on a surface of the substrate and covering the EMMC master chip; In addition, the method comprises: obtaining the installation position of the debugging PIN through a specific mark of the substrate, and adding a tin paste on the side copper skin of the debugging PIN; heating the tin paste to make the tin paste melt and soak the side copper skin of the debugging PIN; adhering a conductive material to the side copper skin of the debugging PIN, adding a lead wire on the conductive material, and connecting the lead wire to a debugging device, so as to perform online maintenance and debugging on the EMMC master chip through the debugging device.

[0007] According to some embodiments of the present application, the adhering of the conductive material to the side copper skin of the debugging PIN comprises: increasing a copper foil at the position of the side copper skin during the melting and soaking of the tin paste on the side copper skin, and extending the copper foil to an upper surface of the plastic package, and adhering the conductive material to the copper foil on the upper surface of the plastic package.

[0008] According to some embodiments of the present application, the thickness of the copper foil is between 30 um and 50 um.

[0009] According to some embodiments of the present application, the heating of the tin paste comprises: heating the tin paste through a heat gun, wherein the heating temperature of the heat gun is less than 350 DEG C, and the heating time of the heat gun is less than 10 seconds.

[0010] According to some embodiments of the present application, the debugging PIN is provided at a board edge position of the substrate, or the debugging PIN is provided at a board corner position of the substrate.

[0011] According to some embodiments of the present application, the size of the debug PIN is between 500um and 1500um, and before the package is cut, the debug PIN extends 50um-100um to the edge area of the substrate.

[0012] According to some embodiments of the present application, the method comprises one of the following: The debug PIN is mounted on the upper surface of the substrate, and the debug trace on the upper surface of the substrate is directly connected to the debug PIN. The debug PIN is mounted on the lower surface of the substrate, and the debug trace on the upper surface of the substrate is connected to the debug PIN through the via and the lower surface debug trace of the substrate in sequence.

[0013] According to some embodiments of the present application, the number of debug PINs is multiple and less than or equal to 5.

[0014] In a second aspect, the embodiments of the present application provide an EMMC particle, comprising: A substrate is provided with a golden finger and a debug trace, and the golden finger and the debug trace are conductively connected; An EMMC master chip is mounted on the surface of the substrate, and the EMMC master chip is provided with a chip interface pad, and the chip interface pad is conductively connected to the golden finger through a bonding wire; A debug PIN is provided at the edge position of the substrate and exposes a side copper skin; A plastic package is provided on the surface of the substrate and covers the EMMC master chip.

[0015] In a third aspect, the embodiments of the present application provide an electronic device comprising the EMMC particle of the above-mentioned second aspect.

[0016] According to the technical scheme of the embodiment of the application, at least the following beneficial effects are achieved: the EMMC particle of the embodiment of the application comprises a substrate, an EMMC master chip, a debugging PIN and a plastic package, wherein the substrate is provided with a golden finger and a debugging trace, the golden finger and the debugging trace are conductively connected, the EMMC master chip is mounted on the upper surface of the substrate, the EMMC master chip is provided with a chip interface pad, the chip interface pad is conductively connected to the golden finger through a solder wire; the debugging PIN is arranged at the edge position of the substrate and exposes a side copper sheet, the debugging PIN is connected to the debugging trace; the plastic package is arranged on the surface of the substrate and covers the EMMC master chip; in addition, the method for easily performing online maintenance and debugging on the EMMC particle comprises the following steps: obtaining the mounting position of the debugging PIN through a specific mark of the substrate, and adding a tin paste to the side copper sheet of the debugging PIN; heating the tin paste to melt and infiltrate the side copper sheet of the debugging PIN; adhering a conductive material to the side copper sheet of the debugging PIN, adding a lead wire to the conductive material and connecting the lead wire to a debugging device, and performing online maintenance and debugging on the EMMC master chip through the debugging device. According to the embodiment of the application, the chip interface pad of the debug interface is arranged on the upper surface of the substrate, the chip interface pad is connected to the debugging PIN at the edge of the board through the debugging trace, the side copper sheet of the debugging PIN is exposed after the chip package is cut, when online debugging of the EMMC master chip is needed, a small amount of tin is added to the side of the abnormal EMMC particle of the customer board, the tin is infiltrated to the side copper sheet, the conductive material is adhered, the conductive material has adhesion and is attached to the surface of the chip, and the lead wire is led out on the conductive material, so that online debugging can be performed. The method is simple to operate, the running state of the chip can be known without damaging the first site, and the problem can be quickly and timely solved.

[0017] Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description, or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are included to provide a further understanding of the technical scheme of the application, and constitute a part of the specification, and are used together with the embodiments of the application to explain the technical scheme of the application, and do not constitute a limitation on the technical scheme of the application.

[0019] Figure 1 is a structural side view of the substrate, the EMMC master chip and the debugging PIN before packaging and cutting provided by an embodiment of the application; Figure 2 is a structural top view of the substrate, the EMMC master chip and the debugging PIN before packaging and cutting provided by an embodiment of the application; Figure 3is a structure side view of a substrate, an EMMC master chip and a debugging PIN after package cutting provided by an embodiment of the present application; Figure 4 is a flow chart of a method for easy online maintenance and debugging of an EMMC particle provided by an embodiment of the present application; Figure 5 is a flow chart of a method for easy online maintenance and debugging of an EMMC particle provided by an embodiment of the present application; Figure 6 is a structure side view of a customer PCB with an EMMC particle before debugging provided by an embodiment of the present application; Figure 7 is a structure side view of adding a tin paste on a side copper skin of a debugging PIN during debugging provided by an embodiment of the present application; Figure 8 is a structure side view of adding a copper foil during debugging provided by an embodiment of the present application; Figure 9 is a structure side view of adding a conductive material and a lead during debugging provided by an embodiment of the present application. DETAILED DESCRIPTION

[0020] The embodiments of the present application are described below in detail, examples of which are shown in the drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are examples only, which are used to explain the present application, and cannot be understood as a limitation of the present application.

[0021] In the description of the present application, it is understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0022] In the description of the present application, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, etc., it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of indicated technical features.

[0023] In the description of the present application, unless otherwise explicitly defined, the words setting, installing, connecting and the like should be understood broadly, and the skilled in the art can determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0024] In some cases, in the context of the rapid development of current information technology, the debugging tools and methods of hardware devices become more and more important. As an embedded storage solution widely used in smart phones, tablet computers and other consumer electronics, the optimization of the performance of EMMC (Embedded Multi-Media Card) and the troubleshooting of customer problems are a challenge to the storage module factory.

[0025] EMMC module chips are generally provided with debug interfaces, such as JTAG universal interface and serial communication interface, through which chip internal testing and debugging can be performed. The pins of the debug interface are arranged on the useless pins of the EMMC, and the background running and debugging can be performed through the test pins on the self-designed test board. However, the production board of the client does not set these interfaces, and when problems are encountered in terminal testing, the following methods are usually used for debugging: The first debugging method: the common method is to disassemble the chip by using a hot air gun, and reattach it to the test board to reproduce and verify the problem. The disassembly process is relatively cumbersome, and the disassembly process can easily damage the chip and introduce other abnormal problems. The change of the test system makes the problem not easy to reproduce. For this chip disassembly scheme: the disadvantages are that the disassembly process is relatively cumbersome, the disassembly process can easily damage the chip, and if the bottom of the chip is reinforced with glue, the disassembly cannot be completed. And it is easy to introduce other abnormal problems, and the change of the test system makes the problem not easy to reproduce.

[0026] The second debugging method: test pads are arranged on the upper surface of the EMMC module chip, and when problems need to be debugged and analyzed, the surface of the plastic package is damaged by using a sharp tool or a laser device to expose the pads, and the interface is led out by soldering a copper wire. For this debugging method of damaging the surface of the plastic package to expose the pads, the disadvantages are that the pads are small, the positioning is difficult, and the damage to the chip can easily introduce other abnormalities.

[0027] Based on the above situation, the embodiments of the present application propose a method, an EMMC particle and equipment for easy online maintenance and debugging of EMMC particles, which aims to lead out the test interface in a non-destructive way on the customer board without disassembling the chip and damaging the chip, to facilitate online debugging and analysis, not to damage the first problem site, and to easily reproduce the problem.

[0028] The various embodiments of the EMMC particle of the present application will be further described below in combination with the drawings.

[0029] As shown in Figures 1 to 3 Figure 1 is a structure side view of a substrate, an EMMC master chip and a debug PIN before package cutting provided by an embodiment of the present application; Figure 2 is a structure top view of a substrate, an EMMC master chip and a debug PIN before package cutting provided by an embodiment of the present application; Figure 3 is a structure side view of a substrate, an EMMC master chip and a debug PIN after package cutting provided by an embodiment of the present application.

[0030] In an embodiment, the EMMC particle comprises a substrate 100, an EMMC master chip 200, a debug PIN 300 and a plastic package 600, wherein the substrate 100 is provided with a gold finger and a debug trace, and the gold finger and the debug trace are electrically connected; the EMMC master chip 200 is mounted on the upper surface of the substrate 100, and the EMMC master chip 200 is provided with a chip interface pad 210 which is electrically connected to the gold finger through a solder wire 220; the debug PIN 300 is arranged at the edge position of the substrate 100 and exposes the copper skin on the side surface, and the debug PIN 300 is connected to the debug trace; and the plastic package 600 is arranged on the surface of the substrate 100 and covers the EMMC master chip 200.

[0031] In an embodiment, the debug PIN 300 can be arranged at the edge position of the substrate 100, i.e. the debug PIN 300 is arranged at the edge position of one side of the substrate 100, thus in this arrangement, after package cutting, the debug PIN 300 only exposes the copper skin on one side.

[0032] Alternatively, in an embodiment, the debug PIN 300 can be arranged at the corner position of the substrate 100, i.e. the debug PIN 300 is arranged at the corner position of two sides of the substrate 100, thus in this arrangement, after package cutting, the debug PIN 300 only exposes the copper skin on two sides at the same time, thereby improving the contact area.

[0033] It should be noted that the debug PIN 300 described above can be rectangular, triangular or other shapes, and the embodiments of the present application do not make specific limitations thereon.

[0034] In addition, it should be noted that the debug PIN 300 described above can be made of copper or other conductive materials, and the embodiments of the present application do not make specific limitations thereon.

[0035] In an embodiment, within a predetermined range of the debug PIN 300, the substrate 100 is not provided with electroplated leads 740 other than the debug trace, so as to avoid the problem of bridge short circuit. ​

[0036] In an embodiment, the size of the debug PIN 300 is between 500um and 1500um. Specifically, through experiments, it is found that when the size of the debug PIN 300 is between 500um and 1500um, it is mainly considered to set a larger size to facilitate soldering and easy maintenance operation; at the same time, if the size is greater than this range, it is easy to cause extrusion of other substrate 100 wiring space.

[0037] In an embodiment, and before the package is cut, the debug PIN 300 extends to the edge area of the substrate 100 by 50um-100um. Specifically, extending the debug PIN 300 to the edge area of the substrate 100 by 50um-100um can make the side surface of the debug PIN 300 flush with the side surface of the substrate 100 after the package is cut, which facilitates subsequent soldering.

[0038] In addition, regarding the installation position of the debug PIN 300, two installation methods can be included as follows: The first installation method: the debug PIN 300 is installed on the upper surface of the substrate 100, and the upper surface debug trace 510 of the substrate 100 is directly connected to the debug PIN 300. That is, the EMMC master chip 200 and the debug PIN 300 are both installed on the upper surface of the substrate 100, and the EMMC master chip 200 only needs to be connected to the debug PIN 300 through the chip interface pad 210, the solder wire 220, the gold finger, and the upper surface debug trace 510.

[0039] The second installation method: the debug PIN 300 is installed on the lower surface of the substrate 100, and the upper surface debug trace 510 of the substrate 100 is connected to the debug PIN 300 through the via 520 and the lower surface debug trace 530 of the substrate 100 in sequence. That is, the EMMC master chip 200 and the debug PIN 300 are respectively installed on the upper surface and the lower surface of the substrate 100, and the EMMC master chip 200 needs to be connected to the debug PIN 300 through the chip interface pad 210, the solder wire 220, the gold finger, the upper surface debug trace 510, the via 520, and the lower surface debug trace 530.

[0040] In an embodiment, the number of debug PINs 300 is multiple and less than or equal to 5. Specifically, the number of debug PINs 300 is multiple and does not exceed 5, and more than 5 occupies a larger area of the substrate 100 and occupies other wiring space.

[0041] Based on the EMMC particles of the above embodiments, the following embodiments of the method for easy online maintenance and debugging of the EMMC particles of the present application are proposed.

[0042] As shown in Figure 4 , the method for easy online maintenance and debugging of the EMMC particles of the present application includes the following steps. Figure 4is a flowchart of a method for easy EMMC particle online maintenance debugging provided by an embodiment of the present application; the method for easy EMMC particle online maintenance debugging includes but is not limited to steps S410, S420 and S430.

[0043] Step S410, the installation position of the debugging PIN is obtained through a specific mark bit of the substrate, and tin paste is added to the side copper skin of the debugging PIN; Step S420, the tin paste is heated to melt and infiltrate the side copper skin of the debugging PIN; Step S430, the side copper skin of the debugging PIN is adhered with conductive material, a lead is added on the conductive material and connected to the debugging device, and the EMMC master chip is subjected to online maintenance debugging through the debugging device.

[0044] Notably, in the embodiment of the present application, the chip interface pad of the debug interface is arranged on the upper surface of the substrate, the chip interface pad is connected to the debugging PIN at the edge of the board through the debugging trace, the side copper skin of the debugging PIN is exposed after the chip packaging is cut, a small amount of tin is added to the side of the abnormal EMMC particle of the customer board when online debugging of the EMMC master chip is needed, the tin infiltrates the side copper skin, adheres to the conductive material, the conductive material has adhesion and is attached to the surface of the chip, and the online debugging can be performed by leading out the lead on the conductive material. The method is simple to operate, the running state of the chip can be understood without damaging the first site, and the problem can be quickly and timely debugged and solved.

[0045] In an embodiment, during the process of melting and infiltrating the side copper skin of the debugging PIN with the tin paste, the embodiment of the present application can increase a copper foil at the position of the side copper skin, extend the copper foil to the upper surface of the plastic package, and adhere the conductive material to the copper foil on the upper surface of the plastic package.

[0046] In an embodiment, the thickness of the copper foil is between 30um and 50um.

[0047] In an embodiment, the embodiment of the present application can heat the tin paste by a hot air gun, wherein the heating temperature of the hot air gun is less than 350℃, and the heating time of the hot air gun is less than 10 seconds.

[0048] Based on the EMMC particles and the method for easy EMMC particle online maintenance debugging of the above various embodiments, the overall embodiments of the EMMC particles and the method for easy EMMC particle online maintenance debugging of the present application are proposed respectively as follows.

[0049] As Figures 1 to 3As shown, in an embodiment, the debugging interface comes from the EMMC master chip 200, which is attached to the upper surface of the substrate 100 and realizes electrical communication through the solder wire 220 and the gold finger on the substrate 100. The gold finger on the substrate 100 is connected through the debugging trace designed on the substrate 100. The debugging trace 510 on the upper surface of the substrate 100 is connected to the debugging PIN 300 through the trace on the upper surface of the substrate 100. The debugging PIN 300 is arranged on the corner of the substrate 100. The area of the debugging PIN 300 is large, and the arrangement on the corner does not affect other signal traces of the substrate 100. The exposed area of the copper skin on the side of the substrate 100 is large, facilitating subsequent tin soldering and bonding of the conductive material 730. In addition, the arrangement on the corner of the substrate 100 provides large operation space and facilitates operation and maintenance. Of course, the debugging PIN 300 can also be arranged at other positions on the board edge. The shape of the debugging PIN 300 is a square or a triangle, which can be completely flush with the edge of the substrate 100. The size of the debugging PIN 300 is 500um-1500um, which is large enough for tin soldering and easy maintenance. If the size is larger than this range, it is easy to squeeze other substrate 100 trace spaces. The debugging PIN 300 needs to extend 50um-100um to the board edge area, so that the copper skin on the side is fully exposed after the packaging and cutting are completed. There should be no other electroplated leads 740 around the debugging PIN 300 to avoid bridge short circuit. The number of debugging PIN 300 is more than 5, and the area of the substrate 100 is large when more than 5. The debugging PIN 300 can also be arranged on the lower surface of the substrate 100. The upper surface debugging trace 510 can also be connected to the lower surface of the substrate 100 through the via 520 on the substrate 100, and the lower surface debugging trace 530 of the substrate 100 is connected to the tin ball 400 on the lower surface.

[0050] As shown, Figures 5 to 9 As shown, Figure 5 is the overall flowchart of the method for easy online maintenance and debugging of EMMC particles provided in an embodiment of the present application; Figure 6 is a structural side view of a customer PCB 800 with EMMC particles before debugging provided in an embodiment of the present application; Figure 7 is a structural side view of the addition of tin paste 710 to the copper skin on the side of the debugging PIN 300 during the debugging process provided in an embodiment of the present application; Figure 8 is a structural side view of the addition of copper foil 720 during the debugging process provided in an embodiment of the present application; Figure 9 is a structural side view of the addition of conductive material 730 and lead 740 during the debugging process provided in an embodiment of the present application.

[0051] Specifically, first, as shown, Figure 6As shown, the customer PCB board 800 with the abnormal EMMC particle acquires the specific location of the debug PIN 300 through the specific mark bit of the substrate 100. Then, as shown, Figure 7 As shown, tin paste 710 is added to the side of the debug PIN 300 of the abnormal EMMC particle, and the tin paste 710 is melted and infiltrated into the side copper skin of the side debug PIN 300 through a hot air gun. The temperature of the hot air gun should not be too high, and the temperature should not exceed 350 degrees. The heating time should not exceed 10 seconds to prevent the EMMC data from being lost due to too high temperature and too long heating time. The purpose of the tin paste 710 infiltration is to make the copper skin thin and flat, and directly adhere to the conductive material 730, which may affect the test results due to poor conduction. In addition, as shown, Figure 8 As shown, in order to make the copper skin of the side debug pad fully contact and conduct with the conductive material 730, a copper foil 720 can be added during the tin paste 710 infiltration. The copper foil 720 and the tin paste 710 are infiltrated to increase the contact area. The thickness of the copper foil 720 is between 30 um and 50 um. As shown, Figure 9 As shown, the conductive material 730 is adhered. The adhesive layer of the conductive material 730 has conductivity and is adhered to the upper surface of the plastic package 600. A lead 740 is welded on the upper surface of the plastic package 600, and the lead 740 is connected to the equipment to confirm whether there is signal output. If there is signal output, online maintenance and debugging can be performed. If there is no signal output, it is necessary to check whether the above operations are correct.

[0052] Based on the above various embodiments of the EMMC particle online maintenance and debugging method, the following embodiments of the controller, computer readable storage medium and computer program product of the present application are proposed.

[0053] In an embodiment, the controller implemented by the present application includes a processor, a memory, and a computer program stored on the memory and executable on the processor. The processor and the memory can be connected by a bus or other means.

[0054] The memory as a non-transitory computer readable storage medium can be used to store non-transitory software programs and non-transitory computer executable programs. In addition, the memory can include a high-speed random access memory and can also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory can optionally include a memory remotely arranged relative to the processor, and these remote memories can be connected to the controller through a network. Examples of the above network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0055] The processor can be configured to invoke a control program stored in the memory, thereby implementing the method for facilitating online maintenance and debugging of the EMMC particle as described above. Specifically, the non-transitory software program and instructions required to implement the method for facilitating online maintenance and debugging of the EMMC particle of the above embodiments are stored in the memory, and when executed by the processor, the method for facilitating online maintenance and debugging of the EMMC particle of the above embodiments is performed.

[0056] It is worth noting that since the controller of the embodiments of the present application can perform the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments, the specific implementation and technical effects of the controller of the embodiments of the present application can be referred to the specific implementation and technical effects of the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments.

[0057] In addition, one embodiment of the present application also provides a computer readable storage medium storing computer executable instructions for executing the method for facilitating online maintenance and debugging of the EMMC particle as described above. Illustratively, the method steps in the above description Figures 4 to 5 are executed.

[0058] It is worth noting that since the computer readable storage medium of the embodiments of the present application can perform the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments, the specific implementation and technical effects of the computer readable storage medium of the embodiments of the present application can be referred to the specific implementation and technical effects of the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments.

[0059] In addition, one embodiment of the present application also provides a computer program product including a computer program or computer instructions stored in a computer readable storage medium, a processor of a computer device reads the computer program or computer instructions from the computer readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the method for facilitating online maintenance and debugging of the EMMC particle as described above. Illustratively, the method steps in the above description Figures 4 to 5 are executed.

[0060] It is worth noting that since the computer program product of the embodiments of the present application can perform the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments, the specific implementation and technical effects of the computer program product of the embodiments of the present application can be referred to the specific implementation and technical effects of the method for facilitating online maintenance and debugging of the EMMC particle of any of the above embodiments.

[0061] Those of ordinary skill in the art will appreciate that all or some steps, systems of the above-disclosed methods can be implemented as software, firmware, hardware, or suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application- specific integrated circuit. Such software can be distributed on computer readable media, which can comprise computer storage media (or non-transitory media) and communication media (or transitory media). As is well known to those of ordinary skill in the art, computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Further, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.

[0062] It should be understood that in this application, "at least one" means one or more, "multiple" means two or more. "And / or" is used to describe the association relationship of the associated objects, which means that there can be three relationships, for example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally represents that the associated objects before and after are in an "or" relationship. "At least one of the following" or the like means any combination of these items, including any combination of single or multiple items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0063] In several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method can be implemented in other manners. For example, the apparatus embodiments described above are merely schematic. For example, the division of the units is only a logical function division. For another example, there can be another division manner for the actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between the units can be indirect couplings or communication connections through some interfaces, apparatuses or units, and can be in electrical, mechanical or other forms.

[0064] It should also be understood that the various embodiments provided by the embodiments of the present application can be combined in any manner to achieve different technical effects.

[0065] The above is a specific description of the preferred embodiments of the present application, but the present application is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the present application, and these equivalent modifications or replacements are included in the scope defined by the claims of the present application.

Claims

1. A method for easy online maintenance and debugging of EMMC particles, characterized in that, Applied to EMMC particles, the EMMC particles comprising: The substrate is provided with gold fingers and debugging traces, and the gold fingers and debugging traces are electrically connected; An EMMC main control chip is mounted on the upper surface of the substrate. The EMMC main control chip is provided with chip interface pads, which are electrically connected to the gold fingers via bonding wires. A debugging PIN is positioned at the edge of the substrate and exposes the side copper layer; the debugging PIN is connected to the debugging trace. A molding compound is disposed on the surface of the substrate and covers the EMMC main control chip; Additionally, the method includes: The mounting position of the debugging PIN is obtained by using a specific mark on the substrate, and solder paste is added to the copper foil on the side of the debugging PIN. The solder paste is heated to melt and wet the side copper of the test PIN; Conductive material is adhered to the copper foil on the side of the debugging PIN, and leads are added to the conductive material and connected to the debugging equipment. The debugging equipment is used to perform online maintenance and debugging of the EMMC main control chip.

2. The method according to claim 1, characterized in that, The conductive material adhered to the copper foil on the side of the debugging PIN includes: During the process of the solder paste melting and wetting the side copper foil of the test PIN, copper foil is added at the location of the side copper foil and the copper foil extends to the upper surface of the molding compound, and conductive material is adhered to the copper foil on the upper surface of the molding compound.

3. The method according to claim 2, characterized in that, The thickness of the copper foil is between 30um and 50um.

4. The method according to claim 1, characterized in that, The heating of the solder paste includes: The solder paste is heated by a hot air gun, wherein the heating temperature of the hot air gun is less than 350°C and the heating time of the hot air gun is less than 10 seconds.

5. The method according to claim 1, characterized in that, The debugging PIN is located at the edge of the substrate, or at a corner of the substrate.

6. The method according to claim 1, characterized in that, The debugging PIN has a side length between 500um and 1500um, and before packaging and cutting, the debugging PIN extends 50um to 100um towards the edge area of ​​the substrate.

7. The method according to claim 1, characterized in that, Including one of the following: The debugging PIN is mounted on the upper surface of the substrate, and the debugging traces on the upper surface of the substrate are directly connected to the debugging PIN. The debugging PIN is mounted on the lower surface of the substrate, and the debugging traces on the upper surface of the substrate are connected to the debugging PIN in sequence through the vias of the substrate and the debugging traces on the lower surface.

8. The method according to claim 1, characterized in that, The number of debugging PINs is multiple and less than or equal to 5.

9. An EMMC particle, characterized in that, include: The substrate is provided with gold fingers and debugging traces, and the gold fingers and debugging traces are electrically connected; An EMMC main control chip is mounted on the surface of the substrate. The EMMC main control chip is provided with chip interface pads, which are electrically connected to the gold fingers via bonding wires. The debugging pin is positioned at the edge of the substrate, exposing the side copper foil; A molding compound is disposed on the surface of the substrate and covers the EMMC main control chip.

10. An electronic device, characterized in that, Includes the EMMC particles as described in claim 9.

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